2002-2012 Microchip Technology Inc. DS21710K-page 1
24AA08/24LC08B
Device Selection Table
Features:
• Single Supply with Operation down to 1.7V for
24AA08 Devices, 2.5V for 24LC08B Devices
• Low-Power CMOS Technology:
- Read current 1 mA, max.
- Standby current 1 A, max.
• 2-Wire Serial Interface, I2C™ Compatible
• Schmitt Trigger inputs for Noise Suppression
• Output Slope Control to eliminate Ground Bounce
• 100 kHz and 400 kHz Clock Compatibility
• Page Write Time 3 ms, typical
• Self-Timed Erase/Write Cycle
• 16-Byte Page Write Buffer
• Hardware Write-Protect
• ESD Protection >4,000V
• More than 1 Million Erase/Write Cycles
• Data Retention >200 Years
• Factory Programming Available
• Packages include 8-lead PDIP, SOIC, TSSOP,
DFN, TDFN, MSOP and 5-lead SOT-23, or 4-lead
Chip Scale
• Pb-Free and RoHS Compliant
• Temperature Ranges:
- Industrial (I): -40°C to +85°C
- Automotive (E): -40°C to +125°C
Description:
The Microchip Technology Inc. 24AA08/24LC08B
(24XX08*) is a 8 Kbit Electrically Erasable PROM. The
device is organized as four blocks of 256 x 8-bit
memory with a 2-wire serial interface. Low-voltage
design permits operation down to 1.7V, with standby
and active currents of only 1 A and 1 mA, respectively.
The 24XX08 also has a page write capability for up to
16 bytes of data. The 24XX08 is available in the
standard 8-pin PDIP, surface mount SOIC, TSSOP, 2x3
DFN, 2x3 TDFN and MSOP packages, and is also
available in the 5-lead SOT-23, or 4-lead Chip Scale
package. All packages are Pb-free and RoHS
compliant.
Block Diagram
Package Types
Part
Number
VCC
Range
Max. Clock
Frequency
Temp.
Ranges
24AA08 1.7-5.5 400 kHz(1) I
24LC08B 2.5-5.5 400 kHz I, E
Note 1: 100 kHz for VCC <2.5V.
HV
EEPROM
Array
Page
YDEC
XDEC
Sense Amp.
Memory
Control
Logic
I/O
Control
Logic
I/O
WP
SDA
SCL
VCC
VSS R/W Control
Latches
Generator
Note: Pins A0, A1 and A2 are not used by the 24XX08. (No
internal connections).
A0
A1
A2
VSS
VCC
WP
SCL
SDA
1
2
3
4
8
7
6
5
PDIP/MSOP/SOIC/TSSOP DFN/TDFN
A0
A1
A2
V
SS
WP
SCL
SDA
V
CC
SOT-23-5
15
4
3
SCL
Vss
SDA
WP
Vcc
2
8
7
6
5
1
2
3
4
CS (Chip Scale)2
12
34
VCC
SDA
SCL
VSS
(Top Down View,
Balls Not Visible)
8K I2C™ Serial EEPROM
24AA08/24LC08B
DS21710K-page 2 2002-2012 Microchip Technology Inc.
1.0 ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings (†)
VCC.............................................................................................................................................................................6.5V
All inputs and outputs w.r.t. VSS ......................................................................................................... -0.3V to VCC +1.0V
Storage temperature ...............................................................................................................................-65°C to +150°C
Ambient temperature with power applied................................................................................................-40°C to +125°C
ESD protection on all pins 4 kV
TABLE 1-1: DC CHARACTERISTICS
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to
the device. This is a stress rating only and functional operation of the device at those or any other conditions
above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating
conditions for extended periods may affect device reliability.
DC CHARACTERISTICS
VCC = +1.7V to +5.5V
Industrial (I): T
A = -40°C to +85°C
Automotive (E): T
A = -40°C to +125°C
Param.
No. Symbol Characteristic Min. Typ. Max. Units Conditions
—WP, SCL and SDA pins —— — — —
D1 VIH High-level input voltage 0.7 VCC — — V —
D2 VIL Low-level input voltage — — 0.3 VCC V —
D3 VHYS Hysteresis of Schmitt
Trigger inputs (SDA,
SCL pins)
0.05 VCC — — V (Note)
D4 VOL Low-level output voltage — — 0.40 V IOL = 3.0 mA, VCC = 2.5V
D5 ILI Input leakage current — — ±1 A VIN = .1V to VCC
D6 ILO Output leakage current — — ±1 A VOUT = .1V to VCC
D7 CIN,
COUT
Pin capacitance
(all inputs/outputs)
— — 10 pF VCC = 5.0V (Note)
T
A = 25°C, FCLK = 1 MHz
D8 ICC write Operating current —0.1 3mA VCC = 5.5V, SCL = 400 kHz
D9 ICC read —0.05 1mA —
D10 ICCS Standby current —
—
0.01
—
1
5
A
A
Industrial
Automotive
SDA = SCL = VCC
WP = VSS
Note: This parameter is periodically sampled and not 100% tested.
2002-2012 Microchip Technology Inc. DS21710K-page 3
24AA08/24LC08B
TABLE 1-2: AC CHARACTERISTICS
AC CHARACTERISTICS
VCC = +1.7V to +5.5V
Industrial (I): T
A = -40°C to +85°C
Automotive (E): T
A = -40°C to +125°C
Param.
No. Symbol Characteristic Min. Typ. Max. Units Conditions
1F
CLK Clock frequency —
—
—
—
400
100
kHz 2.5V VCC 5.5V
1.7V VCC 2.5V (24AA08)
2THIGH Clock high time 600
4000
—
—
—
—
ns 2.5V VCC 5.5V
1.7V VCC 2.5V (24AA08)
3TLOW Clock low time 1300
4700
—
—
—
—
ns 2.5V VCC 5.5V
1.7V VCC 2.5V (24AA08)
4T
RSDA and SCL rise time
(Note 1)
—
—
—
—
300
1000
ns 2.5V VCC 5.5V
1.7V VCC 2.5V (24AA08)
5TFSDA and SCL fall time — — 300 ns (Note 1)
6T
HD:STA Start condition hold time 600
4000
—
—
—
—
ns 2.5V VCC 5.5V
1.7V VCC 2.5V (24AA08)
7TSU:STA Start condition setup
time
600
4700
—
—
—
—
ns 2.5V VCC 5.5V
1.7V VCC 2.5V (24AA08)
8THD:DAT Data input hold time 0 — — ns (Note 2)
9TSU:DAT Data input setup time 100
250
—
—
—
—
ns 2.5V VCC 5.5V
1.7V VCC 2.5V (24AA08)
10 TSU:STO Stop condition setup
time
600
4000
—
—
—
—
ns 2.5V VCC 5.5V
1.7V VCC 2.5V (24AA08)
11 TAA Output valid from clock
(Note 2)
—
—
—
—
900
3500
ns 2.5V VCC 5.5V
1.7V VCC 2.5V (24AA08)
12 TBUF Bus free time: Time the
bus must be free before
a new transmission can
start
1300
4700
—
—
—
—
ns 2.5V VCC 5.5V
1.7V VCC 2.5V (24AA08)
13 TOF Output fall time from VIH
minimum to VIL
maximum
——
—
250
250
ns 2.5V VCC 5.5V
1.7V VCC 2.5V (24AA08)
14 TSP Input filter spike
suppression
(SDA and SCL pins)
— — 50 ns (Notes 1 and 3)
15 TWC Write cycle time (byte or
page)
——5ms—
16 — Endurance 1M — — cycles 25°C, (Note 4)
Note 1: Not 100% tested. CB = total capacitance of one bus line in pF.
2: As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region
(minimum 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions.
3: The combined TSP and VHYS specifications are due to new Schmitt Trigger inputs which provide improved
noise spike suppression. This eliminates the need for a TI specification for standard operation.
4: This parameter is not tested but ensured by characterization. For endurance estimates in a specific
application, please consult the Total Endurance™ Model which can be obtained from Microchip’s web site
at www.microchip.com.
24AA08/24LC08B
DS21710K-page 4 2002-2012 Microchip Technology Inc.
FIGURE 1-1: BUS TIMING DATA
FIGURE 1-2: BUS TIMING START/STOP
7
524
8910
12
11
14
6
SCL
SDA
IN
SDA
OUT
3
76
D3
10
Start Stop
SCL
SDA
2002-2012 Microchip Technology Inc. DS21710K-page 5
24AA08/24LC08B
2.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Tab le 2-1.
TABLE 2-1: PIN FUNCTION TABLE
2.1 Serial Address/Data Input/Output
(SDA)
SDA is a bidirectional pin used to transfer addresses
and data into and out of the device. Since it is an open-
drain terminal, the SDA bus requires a pull-up resistor
to VCC (typical 10 k for 100 kHz, 2 k for 400 kHz).
For normal data transfer, SDA is allowed to change
only during SCL low. Changes during SCL high are
reserved for indicating Start and Stop conditions.
2.2 Serial Clock (SCL)
The SCL input is used to synchronize the data transfer
to and from the device.
2.3 Write-Protect (WP)
The WP pin must be connected to either VSS or VCC.
If tied to VSS, normal memory operation is enabled
(read/write the entire memory 000-3FF).
If tied to VCC, write operations are inhibited. The entire
memory will be write-protected. Read operations are
not affected.
The Chip Scale package does not support the write-
protect feature.
2.4 A0, A1, A2
The A0, A1 and A2 pins are not used by the 24XX08.
They may be left floating or tied to either VSS or VCC.
Name PDIP SOIC TSSOP DFN TDFN MSOP SOT-23 CS Description
A0 1 1 1 1 1 1 — — Not Connected
A1 2 2 2 2 2 2 — — Not Connected
A2 3 3 3 3 3 3 — — Not Connected
VSS 4 4 4 4 4 4 2 2 Ground
SDA 5 5 5 5 5 5 3 4 Serial Address/Data I/O
SCL 6 6 6 6 6 6 1 3 Serial Clock
WP 7 7 7 7 7 7 5 — Write-Protect Input
VCC 8 8 8 8 8 8 4 1 +1.7V to 5.5V Power Supply
24AA08/24LC08B
DS21710K-page 6 2002-2012 Microchip Technology Inc.
3.0 FUNCTIONAL DESCRIPTION
The 24XX08 supports a bidirectional, 2-wire bus and
data transmission protocol. A device that sends data
onto the bus is defined as a transmitter, while a device
receiving data is defined as a receiver. The bus has to
be controlled by a master device which generates the
Serial Clock (SCL), controls the bus access and
generates the Start and Stop conditions, while the
24XX08 works as slave. Both master and slave can
operate as transmitter or receiver, but the master
device determines which mode is activated.
4.0 BUS CHARACTERISTICS
The following bus protocol has been defined:
• Data transfer may be initiated only when the bus
is not busy.
• During data transfer, the data line must remain
stable whenever the clock line is high. Changes in
the data line while the clock line is high will be
interpreted as a Start or Stop condition.
Accordingly, the following bus conditions have been
defined (Figure 4-1).
4.1 Bus Not Busy (A)
Both data and clock lines remain high.
4.2 Start Data Transfer (B)
A high-to-low transition of the SDA line while the clock
(SCL) is high determines a Start condition. All
commands must be preceded by a Start condition.
4.3 Stop Data Transfer (C)
A low-to-high transition of the SDA line while the clock
(SCL) is high determines a Stop condition. All
operations must be ended with a Stop condition.
4.4 Data Valid (D)
The state of the data line represents valid data when,
after a Start condition, the data line is stable for the
duration of the high period of the clock signal.
The data on the line must be changed during the low
period of the clock signal. There is one clock pulse per
bit of data.
Each data transfer is initiated with a Start condition and
terminated with a Stop condition. The number of the
data bytes transferred between the Start and Stop
conditions is determined by the master device and is
theoretically unlimited, although only the last sixteen
will be stored when doing a write operation. When an
overwrite does occur it will replace data in a first-in first-
out (FIFO) fashion.
4.5 Acknowledge
Each receiving device, when addressed, is obliged to
generate an acknowledge after the reception of each
byte. The master device must generate an extra clock
pulse which is associated with this Acknowledge bit.
The device that acknowledges, has to pull down the
SDA line during the acknowledge clock pulse in such a
way that the SDA line is stable low during the high
period of the acknowledge related clock pulse. Of
course, setup and hold times must be taken into
account. During reads, a master must signal an end of
data to the slave by not generating an Acknowledge bit
on the last byte that has been clocked out of the slave.
In this case, the slave (24XX08) will leave the data line
high to enable the master to generate the Stop
condition.
FIGURE 4-1: DATA TRANSFER SEQUENCE ON THE SERIAL BUS
Note: The 24XX08 does not generate any
Acknowledge bits if an internal program-
ming cycle is in progress.
SCL
SDA
(A) (B) (D) (D) (A)(C)
Start
Condition
Address or
Acknowledge
Valid
Data
Allowed
to Change
Stop
Condition
2002-2012 Microchip Technology Inc. DS21710K-page 7
24AA08/24LC08B
5.0 DEVICE ADDRESSING
A control byte is the first byte received following the
Start condition from the master device (Figure 5-1).
The control byte consists of a four-bit control code. For
the 24XX08, this is set as ‘1010’ binary for read and
write operations. The next three bits of the control byte
are the block-select bits (B2, B1, B0). B2 is a “don’t
care” for the 24XX08. They are used by the master
device to select which of the four 256 word-blocks of
memory are to be accessed. These bits are in effect the
three Most Significant bits of the word address.
The last bit of the control byte defines the operation to
be performed. When set to ‘1’ a read operation is
selected. When set to ‘0’ a write operation is selected.
Following the Start condition, the 24XX08 monitors the
SDA bus, checking the device type identifier being
transmitted and, upon receiving a ‘1010’ code, the
slave device outputs an Acknowledge signal on the
SDA line. Depending on the state of the R/W bit, the
24XX08 will select a read or write operation.
FIGURE 5-1: CONTROL BYTE
ALLOCATION
FIGURE 5-2: ADDRESS SEQUENCE BIT ASSIGNMENTS
Operation Control
Code Block Select R/W
Read 1010 Block Address 1
Write 1010 Block Address 0
10 10xB1 B0 R/W ACK
Start Bit
Read/Write Bit
x = “don’t care”
S
Slave Address
Acknowledge Bit
Control Code
Block
Select
Bits
1 010 B1 B0 R/W A
7
A
0
••••••
Control Byte Address Low Byte
Control
Code
Block
Select
bits
x = “don’t care”
X
24AA08/24LC08B
DS21710K-page 8 2002-2012 Microchip Technology Inc.
6.0 WRITE OPERATION
6.1 Byte Write
Following the Start condition from the master, the
device code (4 bits), the block address (3 bits) and the
R/W bit, which is a logic-low, is placed onto the bus by
the master transmitter. This indicates to the addressed
slave receiver that a byte with a word address will
follow once it has generated an Acknowledge bit during
the ninth clock cycle. Therefore, the next byte transmit-
ted by the master is the word address and will be
written into the Address Pointer of the 24XX08. After
receiving another Acknowledge signal from the
24XX08, the master device will transmit the data word
to be written into the addressed memory location. The
24XX08 acknowledges again and the master
generates a Stop condition. This initiates the internal
write cycle and, during this time, the 24XX08 will not
generate Acknowledge signals (Figure 6-1).
6.2 Page Write
The write control byte, word address and the first data
byte are transmitted to the 24XX08 in the same way as
in a byte write. However, instead of generating a Stop
condition, the master transmits up to 16 data bytes to
the 24XX08, which are temporarily stored in the on-
chip page buffer and will be written into memory once
the master has transmitted a Stop condition. Upon
receipt of each word, the four lower-order Address
Pointer bits are internally incremented by ‘1’. The
higher-order 7 bits of the word address remain
constant. If the master should transmit more than 16
words prior to generating the Stop condition, the
address counter will roll over and the previously
received data will be overwritten. As with the byte write
operation, once the Stop condition is received an
internal write cycle will begin (Figure 6-2).
6.3 Write Protection
The WP pin allows the user to write-protect the entire
array (000-3FF) when the pin is tied to VCC. If the pin is
tied to VSS the write protection is disabled.
The Chip Select package does not support the write-
protect feature.
FIGURE 6-1: BYTE WRITE
FIGURE 6-2: PAGE WRITE
Note: Page write operations are limited to writ-
ing bytes within a single physical page,
regardless of the number of bytes
actually being written. Physical page
boundaries start at addresses that are
integer multiples of the page buffer size
(or ‘page-size’) and end at addresses that
are integer multiples of [page size – 1]. If
a Page Write command attempts to write
across a physical page boundary, the
result is that the data wraps around to the
beginning of the current page (overwriting
data previously stored there), instead of
being written to the next page, as might be
expected. It is therefore necessary for the
application software to prevent page write
operations that would attempt to cross a
page boundary.
S P
Bus Activity
Master
SDA Line
Bus Activity
S
T
A
R
T
S
T
O
P
Control
Byte
Word
Address Data
A
C
K
A
C
K
A
C
K
x = “don’t care”
1010XB1
B0 0
Block
Select
Bits
S P
Bus Activity
Master
SDA Line
Bus Activity
S
T
A
R
T
Control
Byte
Word
Address (n) Data (n) Data (n + 15)
S
T
O
P
A
C
K
A
C
K
A
C
K
A
C
K
A
C
K
Data (n + 1)
x = “don’t care”
Block
Select
Bits
11
00X
B1B00
2002-2012 Microchip Technology Inc. DS21710K-page 9
24AA08/24LC08B
7.0 ACKNOWLEDGE POLLING
Since the device will not acknowledge during a write
cycle, this can be used to determine when the cycle is
complete (this feature can be used to maximize bus
throughput). Once the Stop condition for a Write
command has been issued from the master, the device
initiates the internally-timed write cycle and ACK polling
can then be initiated immediately. This involves the
master sending a Start condition followed by the control
byte for a Write command (R/W = 0). If the device is still
busy with the write cycle, no ACK will be returned. If the
cycle is complete, the device will return the ACK and
the master can then proceed with the next Read or
Write command. See Figure 7-1 for a flow diagram of
this operation.
FIGURE 7-1: ACKNOWLEDGE POLLING
FLOW
Send
Write Command
Send Stop
Condition to
Initiate Write Cycle
Send Start
Send Control Byte
with R/W = 0
Did Device
Acknowledge
(ACK = 0)?
Next
Operation
No
Yes
24AA08/24LC08B
DS21710K-page 10 2002-2012 Microchip Technology Inc.
8.0 READ OPERATION
Read operations are initiated in the same way as write
operations, with the exception that the R/W bit of the
slave address is set to ‘1’. There are three basic types
of read operations: current address read, random read
and sequential read.
8.1 Current Address Read
The 24XX08 contains an address counter that main-
tains the address of the last word accessed, internally
incremented by ‘1’. Therefore, if the previous access
(either a read or write operation) was to address n, the
next current address read operation would access data
from address n + 1. Upon receipt of the slave address
with R/W bit set to ‘1’, the 24XX08 issues an acknowl-
edge and transmits the 8-bit data word. The master will
not acknowledge the transfer, but does generate a Stop
condition and the 24XX08 discontinues transmission
(Figure 8-1).
8.2 Random Read
Random read operations allow the master to access
any memory location in a random manner. To perform
this type of read operation, the word address must first
be set. This is accomplished by sending the word
address to the 24XX08 as part of a write operation.
Once the word address is sent, the master generates a
Start condition following the acknowledge. This
terminates the write operation, but not before the
internal Address Pointer is set. The master then issues
the control byte again, but with the R/W bit set to a ‘1’.
The 24XX08 will then issue an acknowledge and trans-
mit the 8-bit data word. The master will not acknowl-
edge the transfer, but does generate a Stop condition
and the 24XX08 will discontinue transmission
(Figure 8-2).
8.3 Sequential Read
Sequential reads are initiated in the same way as a
random read, except that once the 24XX08 transmits
the first data byte, the master issues an acknowledge
as opposed to a Stop condition in a random read. This
directs the 24XX08 to transmit the next sequentially-
addressed 8-bit word (Figure 8-3).
To provide sequential reads, the 24XX08 contains an
internal Address Pointer that is incremented by one
upon completion of each operation. This Address
Pointer allows the entire memory contents to be serially
read during one operation.
8.4 Noise Protection
The 24XX08 employs a VCC threshold detector circuit
which disables the internal erase/write logic if the VCC
is below 1.5V at nominal conditions.
The SCL and SDA inputs have Schmitt Trigger and
filter circuits which suppress noise spikes to assure
proper device operation, even on a noisy bus.
FIGURE 8-1: CURRENT ADDRESS READ
SP
Bus Activity
Master
SDA Line
Bus Activity
S
T
O
P
Control
Byte Data (n)
A
C
K
N
o
A
C
K
S
T
A
R
T
x = “don’t care”
101 0xB1 B0 1
Block
Select
Bits
2002-2012 Microchip Technology Inc. DS21710K-page 11
24AA08/24LC08B
FIGURE 8-2: RANDOM READ
FIGURE 8-3: SEQUENTIAL READ
S P
S
Bus Activity
Master
SDA Line
Bus Activity
S
T
A
R
T
S
T
O
P
Control
Byte
A
C
K
Word
Address (n)
Control
Byte
S
T
A
R
T
Data (n)
A
C
K
A
C
K
N
o
A
C
K
x = “don’t care”
1010 B1
B001
1
00B1
B01
X
X
Block
Select
Bits
Block
Select
Bits
P
Bus Activity
Master
SDA Line
Bus Activity
S
T
O
P
Control
Byte
A
C
K
N
o
A
C
K
Data (n) Data (n + 1) Data (n + 2) Data (n + X)
A
C
K
A
C
K
A
C
K
1
24AA08/24LC08B
DS21710K-page 12 2002-2012 Microchip Technology Inc.
9.0 PACKAGING INFORMATION
9.1 Package Marking Information
8-Lead SOIC (3.90 mm) Example:
XXXXXXXX
T/XXYYWW
NNN
24LC08BI
SN 0527
13F
5-Lead SOT-23 Example:
XXNN M43F
XXXXXXXX
T/XXXNNN
YYWW
8-Lead PDIP (300 mil) Example:
24LC08B
I/P 13F
0527
8-Lead TSSOP Example:
8-Lead MSOP Example:
XXXX
TYWW
NNN
XXXXXT
YWWNNN
4L08
I527
13F
4L8BI
52713F
3
e
3
e
2002-2012 Microchip Technology Inc. DS21710K-page 13
24AA08/24LC08B
8-Lead 2x3 TDFN
XXX
YWW
NN
A44
527
13
Example:
8-Lead 2x3 DFN
XXX
YWW
NN
244
527
13
Example:
4-Lead Chip Scale
XN
Example:
43
1st Line Marking
Part No. TSSOP MSOP
SOT-23 DFN TDFN
I-Temp E-Temp I-Temp E-Temp I-Temp E-Temp
24AA08 4A08 4A08T B4NN — 241 — A41 —
24LC08B 4L08 4L8BT M4NN N4NN 244 245 A44 A45
Legend: XX...X Part number or part number code
T Temperature (I, E)
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code (2 characters for small packages)
Pb-free JEDEC designator for Matte Tin (Sn)
Note: For very small packages with no room for the Pb-free JEDEC designator
, the marking will only appear on the outer carton or reel label.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e
24AA08/24LC08B
DS21710K-page 14 2002-2012 Microchip Technology Inc.
N
E1
NOTE 1
D
123
A
A1
A2
L
b1
b
e
E
eB
c
2002-2012 Microchip Technology Inc. DS21710K-page 15
24AA08/24LC08B
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
24AA08/24LC08B
DS21710K-page 16 2002-2012 Microchip Technology Inc.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2002-2012 Microchip Technology Inc. DS21710K-page 17
24AA08/24LC08B
! ""#$%& !'
24AA08/24LC08B
DS21710K-page 18 2002-2012 Microchip Technology Inc.
() )"* ! (+%+( !
D
N
E
E1
NOTE 1
12
b
e
c
A
A1
A2
L1 L
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2002-2012 Microchip Technology Inc. DS21710K-page 19
24AA08/24LC08B
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
24AA08/24LC08B
DS21710K-page 20 2002-2012 Microchip Technology Inc.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2002-2012 Microchip Technology Inc. DS21710K-page 21
24AA08/24LC08B
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
24AA08/24LC08B
DS21710K-page 22 2002-2012 Microchip Technology Inc.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2002-2012 Microchip Technology Inc. DS21710K-page 23
24AA08/24LC08B
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DS21710K-page 24 2002-2012 Microchip Technology Inc.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2002-2012 Microchip Technology Inc. DS21710K-page 25
24AA08/24LC08B
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24AA08/24LC08B
DS21710K-page 26 2002-2012 Microchip Technology Inc.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2002-2012 Microchip Technology Inc. DS21710K-page 27
24AA08/24LC08B
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
24AA08/24LC08B
DS21710K-page 28 2002-2012 Microchip Technology Inc.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2002-2012 Microchip Technology Inc. DS21710K-page 29
24AA08/24LC08B
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DS21710K-page 30 2002-2012 Microchip Technology Inc.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2002-2012 Microchip Technology Inc. DS21710K-page 31
24AA08/24LC08B
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
24AA08/24LC08B
DS21710K-page 32 2002-2012 Microchip Technology Inc.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2002-2012 Microchip Technology Inc. DS21710K-page 33
24AA08/24LC08B
APPENDIX A: REVISION HISTORY
Revision C (12/2003)
Corrections to Section 1.0, Electrical Characteristics.
Section 9.1, 24LC08B standard marking code.
Revision D (02/2005)
Added DFN package.
Revision E (09/2005)
Revised Figure 3-1: Control Byte Allocation; Figure 4-1
Byte Write; Figure 4-2 Page Write; Section 6.0 Write
Protection; Figure 7-1 Current Address Read; Figure 7-
2 Random Read; Figure 7-3 Sequential Read; 8.3
Write-Protect (000-3FF).
Revision F (02/2007)
Updated Device Selection Table; Features section;
Changed 1.8V to 1.7V throughout document; Revised
Electrical Characteristics Ambient Temperature;
Replaced Package Drawings; Revised Product ID
System.
Revison G (02/2007)
Replaced Package Drawings.
Revision H (03/2008)
Added TDFN package.
Revision J (02/2009)
Moved Pin Descriptions to Section 2.0, renumbered
remaining sections. Added Figure 5-2.
Revision K (03/2012)
Added Chip Scale package; Revised Table 1-1, Table
2-1; Product ID System.
24AA08/24LC08B
DS21710K-page 34 2002-2012 Microchip Technology Inc.
NOTES:
2002-2012 Microchip Technology Inc. DS21710K-page 35
24AA08/24LC08B
THE MICROCHIP WEB SITE
Microchip provides online support via our WWW site at
www.microchip.com. This web site is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the web site contains the following
information:
•Product Support – Data sheets and errata,
application notes and sample programs, design
resources, user’s guides and hardware support
documents, latest software releases and archived
software
•General Technical Support – Frequently Asked
Questions (FAQ), technical support requests,
online discussion groups, Microchip consultant
program member listing
•Business of Microchip – Product selector and
ordering guides, latest Microchip press releases,
listing of seminars and events, listings of
Microchip sales offices, distributors and factory
representatives
CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.
To register, access the Microchip web site at
www.microchip.com. Under “Support”, click on
“Customer Change Notification” and follow the
registration instructions.
CUSTOMER SUPPORT
Users of Microchip products can receive assistance
through several channels:
• Distributor or Representative
• Local Sales Office
• Field Application Engineer (FAE)
• Technical Support
• Development Systems Information Line
Customers should contact their distributor,
representative or field application engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
Technical support is available through the web site
at: http://microchip.com/support
24AA08/24LC08B
DS21710K-page 36 2002-2012 Microchip Technology Inc.
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip
product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our
documentation can better serve you, please FAX your comments to the Technical Publications Manager at
(480) 792-4150.
Please list the following information, and use this outline to provide us with your comments about this document.
TO: Technical Publications Manager
RE: Reader Response
Total Pages Sent ________
From: Name
Company
Address
City / State / ZIP / Country
Telephone: (_______) _________ - _________
Application (optional):
Would you like a reply? Y N
Device: Literature Number:
Questions:
FAX: (______) _________ - _________
DS21710K24AA08/24LC08B
1. What are the best features of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
2002-2012 Microchip Technology Inc. DS21710K-page 37
24AA08/24LC08B
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO. X/XX
PackageTemperature
Range
Device
Device: 24AA08: = 1.7V, 8 Kbit I2C Serial EEPROM
24AA08T: = 1.7V, 8 Kbit I2C Serial EEPROM
(Tape and Reel)
24LC08B: = 2.5V, 8 Kbit I2C Serial EEPROM
24LC08BT: = 2.5V, 8 Kbit I2C Serial EEPROM
(Tape and Reel)
Temperature
Range:
I = -40°C to +85°C
E = -40°C to +125°C
Package: P = Plastic DIP (300 mil body), 8-lead
SN = Plastic SOIC (3.90 mm body), 8-lead
ST = Plastic TSSOP (4.4 mm), 8-lead
MC = Plastic DFN (2x3x0.90mm body), 8-lead
MS = Plastic MSOP (Micro Small Outline), 8-lead
OT = Plastic SOT-23, 5-lead (Tape and Reel only)
MNY(1)= Plastic Dual Flat (TDFN), No lead package,
2x3 mm body, 8-lead
CS16K(2)= Chip Scale (CS), 4-lead (I-temp, “AA”, Tape
and Reel only)
Examples:
a) 24AA08-I/P: Industrial Temperature,1.7V,
PDIP package
b) 24AA08-I/SN: Industrial Temperature,1.7V,
SOIC package
c) 24AA08T-I/OT: Industrial Temperature,
1.7V, SOT-23 package, Tape and Reel
d) 24AA08T-I/CS16K: Industrial Temperature,
1.7V, CS package, Tape and Reel
e) 24LC08B-I/P: Industrial Temperature, 2.5V,
PDIP package
f) 24LC08B-E/SN: Automotive Temp.,2.5V
SOIC package
g) 24LC08BT-I/OT: Industrial Temperature,
2.5V, SOT-23 package, Tape and Reel
Note 1: “Y” indicates a Nickel, Palladium, Gold (NiPdAu) finish.
24AA08/24LC08B
DS21710K-page 38 2002-2012 Microchip Technology Inc.
NOTES:
2002-2012 Microchip Technology Inc. DS21710K-page 39
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART,
PIC32 logo, rfPIC and UNI/O are registered trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MXDEV, MXLAB, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip
Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, chipKIT,
chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net,
dsPICworks, dsSPEAK, ECAN, ECONOMONITOR,
FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP,
Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB,
MPLINK, mTouch, Omniscient Code Generation, PICC,
PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE,
rfLAB, Select Mode, Total Endurance, TSHARC,
UniWinDriver, WiperLock and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2002-2012, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 9781620761007
Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITY MANAGEMENT S
YSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
DS21710K-page 40 2002-2012 Microchip Technology Inc.
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11/29/11
