Features
l Low Reverse Recovery Time
l Low Reverse Capacitance
l Low Forward Voltage Drop
l Guard Ring Construction for Transient Protection
Mechanical Data
l Case: MiniMELF, Glass
l Terminals: Solderable per MIL -STD-202, Method 208
l Polarity: Indicated by Cathode Band
l Weight: 0.05 grams ( approx.)
Maximum Ratings @ 25oC Unless Otherwise Specified
Characteristic Symbol LLSD101A LLSD101B LLSD101C
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
RRM
VRWM
R
60V 50V 40V
RMS Reverse Voltage VR(RMS) 42V 35V 28V
Forward Continuous Current(Note 1) IFM 15mA
Non-Repetitive Peak @ t<=1.0s
Forward Surge Current @ t=10us IFSM 50mA
2.0A
Power Dissipation(Note 1) Pd 400mW
Thermal Resistance(Note 1) R375K/W
Operation & Storage Temp. Range Tj, TSTG -55 to 150oC
Electrical Characteristics @ 25oC Unless Otherwise Specified
Charateristic Symbol Min Max Unit Test Cond.
Peak LLSD101A VR=50V
Reverse LLSD101B IRM
200 nA VR=40V
Current LLSD101C VR=30V
LLSD101A 0.41 IF=1.0mA
LLSD101B 0.40 IF=1.0mA
Forward LLSD101C VFM
0.39 VIF=1.0mA
Volt. Drop LLSD101A 1.00 IF=15mA
LLSD101B 0.95 IF=15mA
LLSD101C 0.90 IF=15mA
Junction LLSD101A 2.0
Capacitance LLSD101B Cj
2.1 pF VR=0V, f=1.0MHz
LLSD101C 2.2
Reverse Recovery Time trr ----- 1.0 ns
F
R
recover to 0.1 I R
Note: 1. Valid provided that electrodes are kept at ambient temperature
LLSD101A
THRU
LLSD101C
Schottky Barrier
Switching Diode
www.mccsemi.com
DIMENSION
INCHES MM DIM
MIN MAX MIN MAX
NOTE
A .134 .142 3.40 3.60
B .008 .016 .20 .40
C .055 .059 1.40 1.50
MINIMELF
B
0.075”
SUGGESTED SOLDER
omponents
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Revision: 3 2003/04/30