250 kSPS,
10-/12-Bit ADCs in 6-Lead SC70
AD7910/AD7920
Rev. C
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
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Tel: 781.329.4700 www.analog.com
Fax: 781.461.3113 © 2005 Analog Devices, Inc. All rights reserved.
FEATURES
Throughput rate: 250 kSPS
Specified for VDD of 2.35 V to 5.25 V
Low power
3.6 mW typ at 250 kSPS with 3 V supplies
12.5 mW typ at 250 kSPS with 5 V supplies
Wide input bandwidth
71 dB SNR at 100 kHz input frequency
Flexible power/serial clock speed management
No pipeline delays
High speed serial interface
SPI®-/QSPI™-/MICROWIRE™-/DSP-compatible
Standby mode: 1 μA max
6-lead SC70 package
8-lead MSOP package
APPLICATIONS
Battery-powered systems
Personal digital assistants
Medical instruments
Mobile communications
Instrumentation and control systems
Data acquisition systems
High speed modems
Optical sensors
FUNCTIONAL BLOCK DIAGRAM
T/H
CONTROL LOGIC
10-/12-BIT
SUCCESSIVE
APPROXIMATION
ADC
GND
V
DD
AD7910/AD7920
SDATA
SCLK
CS
V
IN
02976-001
Figure 1.
GENERAL DESCRIPTION
The AD7910/AD79201 are, respectively, 10-bit and 12-bit, high
speed, low power, successive approximation ADCs. The parts
operate from a single 2.35 V to 5.25 V power supply and feature
throughput rates up to 250 kSPS. The parts contain a low noise,
wide bandwidth track-and-hold amplifier that can handle input
frequencies in excess of 13 MHz.
The conversion process and data acquisition are controlled
using CS and the serial clock, allowing the devices to interface
with microprocessors or DSPs. The input signal is sampled on
the falling edge of CS and the conversion is initiated at this
point. There are no pipeline delays associated with the part.
The AD7910/AD7920 use advanced design techniques to
achieve very low power dissipation at high throughput rates.
The reference for the part is taken internally from VDD. This
allows the widest dynamic input range to the ADC. Thus, the
analog input range for the part is 0 to VDD. The conversion rate
is determined by the SCLK.
PRODUCT HIGHLIGHTS
1. 10-/12-bit ADCs in SC70 and MSOP packages.
2. Low power consumption.
3. Flexible power/serial clock speed management. The
conversion rate is determined by the serial clock, allowing
the conversion time to be reduced through the serial clock
speed increase. This allows the average power consumption
to be reduced when power-down mode is used while not
converting. The part also features a power-down mode to
maximize power efficiency at lower throughput rates.
Current consumption is 1 μA maximum and 50 nA typically
when in power-down mode.
4. Reference derived from the power supply.
5. No pipeline delay. The parts feature a standard successive
approximation ADC with accurate control of the sampling
instant via a CS input and once-off conversion control.
1 Protected by U.S. Patent No. 6,681,332.
AD7910/AD7920
Rev. C | Page 2 of 24
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description ......................................................................... 1
Product Highlights ........................................................................... 1
Specifications..................................................................................... 3
AD7910.......................................................................................... 3
AD7920.......................................................................................... 4
Timing Specifications .................................................................. 6
Timing Examples .............................................................................. 7
Timing Example 1 ........................................................................ 7
Timing Example 2 ........................................................................ 7
Absolute Maximum Ratings............................................................ 8
ESD Caution.................................................................................. 8
Pin Configurations and Function Descriptions ........................... 9
Typical Performance Characteristics ........................................... 10
Term i nol og y .................................................................................... 12
Circuit Information........................................................................ 13
Converter Operation...................................................................... 14
ADC Transfer Function............................................................. 14
Typical Connection Diagram ................................................... 14
Analog Input ............................................................................... 15
Digital Inputs .............................................................................. 15
Modes of Operation ....................................................................... 16
Normal Mode.............................................................................. 16
Power-Down Mode .................................................................... 16
Power-Up Time .......................................................................... 16
Power vs. Throughput Rate........................................................... 18
Serial Interface ................................................................................ 19
Microprocessor Interfacing........................................................... 20
AD7910/AD7920 to TMS320C541 Interface ......................... 20
AD7910/AD7920 to ADSP-218x.............................................. 20
AD7910/AD7920 to DSP563xx Interface ............................... 21
Application Hints ........................................................................... 22
Grounding and Layout .............................................................. 22
Evaluating Performance ............................................................ 22
Outline Dimensions ....................................................................... 23
Ordering Guide .......................................................................... 24
REVISION HISTORY
9/05—Rev. B to Rev. C
Updated Formatting ..........................................................Universal
Updated Outline Dimensions....................................................... 23
Changes to Ordering Guide.......................................................... 24
3/04—Rev. A to Rev. B
Added U.S. Patent Number ............................................................ 1
Changes to Note 5 ............................................................................ 2
Changes to Note 6 of AD7920 Specifications............................... 4
Changes to Note 1 of Timing Specifications ................................ 4
Changes to Absolute Maximum Ratings ...................................... 6
Changes to Ordering Guide............................................................ 6
8/03—Rev. 0 to Rev. A
Changes to Ordering Guide.............................................................6
Changes to Evaluating the AD7910/AD7920 Performance
Section.............................................................................................. 18
Updated Outline Dimensions ...................................................... 19
AD7910/AD7920
Rev. C | Page 3 of 24
SPECIFICATIONS
AD7910
VDD = 2.35 V to 5.25 V, fSCLK = 5 MHz, fSAMPLE = 250 kSPS, TA = TMIN to TMAX, unless otherwise noted.
Table 1.
Parameter1 A Grade1, 2Unit Test Conditions/Comments
DYNAMIC PERFORMANCE fIN = 100 kHz sine wave
Signal-to-Noise + Distortion (SINAD)3 61 dB min
Total Harmonic Distortion (THD)3 −72 dB max
Peak Harmonic or Spurious Noise (SFDR)3 −73 dB max
Intermodulation Distortion (IMD)3
Second-Order Terms −82 dB typ fa = 100.73 kHz, fb = 90.7 kHz
Third-Order Terms −82 dB typ fa = 100.73 kHz, fb = 90.7 kHz
Aperture Delay 10 ns typ
Aperture Jitter 30 ps typ
Full Power Bandwidth 13.5 MHz typ @ 3 dB
2 MHz typ @ 0.1 dB
DC ACCURACY
Resolution 10 Bits
Integral Nonlinearity ±0.5 LSB max
Differential Nonlinearity ±0.5 LSB max Guaranteed no missed codes to 10 bits
Offset Error3, 4 ±1 LSB max
Gain Error3, 4±1 LSB max
Total Unadjusted Error (TUE)3, 4±1.2 LSB max
ANALOG INPUT
Input Voltage Ranges 0 to VDD V
DC Leakage Current ±0.5 A max
Input Capacitance 20 pF typ Track-and-hold in track, 6 pF typ when in hold
LOGIC INPUTS
Input High Voltage, VINH 2.4 V min
Input Low Voltage, VINL 0.8 V max VDD = 5 V
0.4 V max VDD = 3 V
Input Current, IIN, SCLK Pin ± 0.5 A max Typically 10 nA, VIN = 0 V or VDD
Input Current, IIN, CS Pin ± 10 nA typ
Input Capacitance, CIN5 5 pF max
LOGIC OUTPUTS
Output High Voltage, VOH VDD − 0.2 V min ISOURCE = 200 A, VDD = 2.35 V to 5.25 V
Output Low Voltage, VOL 0.4 V max ISINK = 200 A
Floating-State Leakage Current ±1 A max
Floating-State Output Capacitance5 5 pF max
Output Coding Straight (natural) binary
CONVERSION RATE
Conversion Time 2.8 s max 14 SCLK cycles with SCLK at 5 MHz
Track-and-Hold Acquisition Time3 250 ns max
Throughput Rate 250 kSPS max
POWER REQUIREMENTS
VDD 2.35/5.25 V min/max
IDD Digital I/Ps = 0 V or VDD
Normal Mode (Static) 2.5 mA typ VDD = 4.75 V to 5.25 V, SCLK on or off
1.2 mA typ VDD = 2.35 V to 3.6 V, SCLK on or off
Normal Mode (Operational) 3 mA max VDD = 4.75 V to 5.25 V, fSAMPLE = 250 kSPS
1.4 mA max VDD = 2.35 V to 3.6 V, fSAMPLE = 250 kSPS
Full Power-Down Mode 1 A max Typically 50 nA
AD7910/AD7920
Rev. C | Page 4 of 24
Parameter1 A Grade1, 2Unit Test Conditions/Comments
Power Dissipation6
Normal Mode (Operational) 15 mW max VDD = 5 V, fSAMPLE = 250 kSPS
4.2 mW max VDD = 3 V, fSAMPLE = 250 kSPS
Full Power-Down 5 W max VDD = 5 V
3 W max VDD = 3 V
1 Temperature range from −40°C to +85°C.
2 Operational from VDD = 2.0 V, with input high voltage (VINH) 1.8 V min.
3 See the Terminology section.
4 SC70 values guaranteed by characterization.
5 Guaranteed by characterization.
6 See the Power vs. Throughput Rate section.
AD7920
VDD = 2.35 V to 5.25 V, fSCLK = 5 MHz, fSAMPLE = 250 kSPS, TA = TMIN to TMAX, unless otherwise noted.
Table 2.
Parameter1 A Grade , 1 2 B Grade1, 2Unit Test Conditions/Comments
DYNAMIC PERFORMANCE fIN = 100 kHz sine wave
Signal-to-Noise + Distortion (SINAD)3 70 70 dB min VDD = 2.35 V to 3.6 V, TA = 25°C
69 69 dB min VDD = 2.4 V to 3.6 V
71.5 71.5 dB typ VDD = 2.35 V to 3.6 V
69 69 dB min VDD = 4.75 V to 5.25 V, TA = 25°C
68 68 dB min VDD = 4.75 V to 5.25 V
Signal-to-Noise Ratio (SNR)3 71 71 dB min VDD = 2.35 V to 3.6 V, TA = 25°C
70 70 dB min VDD = 2.4 V to 3.6 V
70 70 dB min VDD = 4.75 V to 5.25 V, TA = 25°C
69 69 dB min VDD = 4.75 V to 5.25 V
Total Harmonic Distortion (THD)3 −80 −80 dB typ
Peak Harmonic or Spurious Noise (SFDR)3 −82 −82 dB typ
Intermodulation Distortion (IMD)3
Second-Order Terms −84 −84 dB typ fa = 100.73 kHz, fb = 90.72 kHz
Third-Order Terms −84 −84 dB typ fa = 100.73 kHz, fb = 90.72 kHz
Aperture Delay 10 10 ns typ
Aperture Jitter 30 30 ps typ
Full Power Bandwidth 13.5 13.5 MHz typ @ 3 dB
2 2 MHz typ @ 0.1 dB
DC ACCURACY B Grade4
Resolution 12 12 Bits
Integral Nonlinearity3 ±1.5 LSB max
± 0.75 LSB typ
Differential Nonlinearity −0.9/+1.5 LSB max Guaranteed no missed codes to 12 bits
±0.75 LSB typ
Offset Error3, 5 ±1.5 LSB max
±1.5 ±0.2 LSB typ
Gain Error3, 5 ±1.5 LSB max
±1.5 ±0.5 LSB typ
Total Unadjusted Error (TUE)3, 5 ±2 LSB max
ANALOG INPUT
Input Voltage Ranges 0 to VDD 0 to VDD V
DC Leakage Current ±0.5 ±0.5 A max
Input Capacitance 20 20 pF typ Track-and-hold in track, 6 pF typ when in hold
AD7910/AD7920
Rev. C | Page 5 of 24
Parameter1 A Grade , 1 2 B Grade1, 2Unit Test Conditions/Comments
LOGIC INPUTS
Input High Voltage, VINH 2.4 2.4 V min
1.8 1.8 V min VDD = 2.35 V
Input Low Voltage, VINL 0.8 0.8 V max VDD = 3.6 V to 5.25 V
0.4 0.4 V max VDD = 2.35 V to 3.6 V
Input Current, IIN, SCLK Pin ±0.5 ±0.5 A max Typically 10 nA, VIN = 0 V or VDD
Input Current, IIN, CS Pin ±10 ±10 nA typ
Input Capacitance, CIN6 5 5 pF max
LOGIC OUTPUTS
Output High Voltage, VOH VDD − 0.2 VDD − 0.2 V min ISOURCE = 200 µA, VDD = 2.35 V to 5.25 V
Output Low Voltage, VOL 0.4 0.4 V max ISINK = 200 µA
Floating-State Leakage Current ±1 ±1 A max
Floating-State Output Capacitance6 5 5 pF max
Output Coding Straight (natural) binary
CONVERSION RATE
Conversion Time 3.2 3.2 s max 16 SCLK cycles with SCLK at 5 MHz
Track-and-Hold Acquisition Time3 250 250 ns max
Throughput Rate 250 250 kSPS max See the Serial Interface section
POWER REQUIREMENTS
VDD 2.35/5.25 2.35/5.25 V min/max
IDD Digital I/Ps = 0 V or VDD
Normal Mode (Static) 2.5 2.5 mA typ VDD = 4.75 V to 5.25 V, SCLK on or off
1.2 1.2 mA typ VDD = 2.35 V to 3.6 V, SCLK on or off
Normal Mode (Operational) 3 3 mA max VDD = 4.75 V to 5.25 V, fSAMPLE = 250 kSPS
1.4 1.4 mA max VDD = 2.35 V to 3.6 V, fSAMPLE = 250 kSPS
Full Power-Down Mode 1 1 A max Typically 50 nA
Power Dissipation7
Normal Mode (Operational) 15 15 mW max VDD = 5 V, fSAMPLE = 250 kSPS
4.2 4.2 mW max VDD = 3 V, fSAMPLE = 250 kSPS
Full Power-Down 5 5 W max VDD = 5 V
3 3 W max VDD = 3 V
1 Temperature range from −40°C to +85°C.
2 Operational from VDD = 2.0 V, with input low voltage (VINL) 0.35 V max.
3 See the Terminology section.
4 B Grade, maximum specifications apply as typical figures when VDD = 4.75 V to 5.25 V.
5 SC70 values guaranteed by characterization.
6 Guaranteed by characterization.
7 See the Power vs. Throughput Rate section.
AD7910/AD7920
Rev. C | Page 6 of 24
TIMING SPECIFICATIONS
VDD = 2.35 V to 5.25 V, TA = TMIN to TMAX, unless otherwise noted.
Table 3.
Parameter1
AD7910/AD7920
Limit at TMIN, TMAX Unit Description
fSCLK2 10 kHz min3
5 MHz max
tCONVERT 14 × tSCLK AD7910
16 × tSCLK AD7920
tQUIET 50 ns min Minimum quiet time required between bus relinquish and start of next
conversion
t1 10 ns min Minimum CS pulse width
t2 10 ns min CS to SCLK setup time
t34 22 ns max Delay from CS until SDATA three-state disabled
t4 40 ns max Data access time after SCLK falling edge
t5 0.4 × tSCLK ns min SCLK low pulse width
t6 0.4 × tSCLK ns min SCLK high pulse width
t75, 6 SCLK to data valid hold time
10 ns min VDD ≤ 3.3 V
9.5 ns min 3.3 V < VDD ≤ 3.6 V
7 ns min VDD > 3.6 V
t86, 736 ns max SCLK falling edge to SDATA three-state
See Note 7 ns min SCLK falling edge to SDATA three-state
tPOWER-UP81 s max Power-up time from full power-down
1 Guaranteed by characterization. All input signals are specified with tr = tf = 5 ns (10% to 90% of VDD) and timed from a voltage level of 1.6 V.
2 Mark/Space ratio for the SCLK input is 40/60 to 60/40.
3 Minimum fSCLK at which specifications are guaranteed.
4 Measured with the load circuit of Figure 2 and defined as the time required for the output to cross 0.8 V or 1.8 V when VDD = 2.35 V and 0.8 V or 2.0 V for VDD > 2.35 V.
5 Measured with a 50 pF load capacitor.
6 t8 is derived from the measured time taken by the data outputs to change 0.5 V when loaded with the circuit of Figure 2. The measured number is then extrapolated
back to remove the effects of charging or discharging the 50 pF capacitor. This means that the time, t8, shown in the Timing Specifications is the true bus relinquish
time of the part and is independent of the bus loading.
7 T7 values apply to t8 minimum values also.
8 See Power-Up Time section.
200μAI
OL
200μAI
OH
1.6V
TO OUTPUT
PIN C
L
50pF
02976-002
Figure 2. Load Circuit for Digital Output Timing Specifications
AD7910/AD7920
Rev. C | Page 7 of 24
TIMING EXAMPLES
Figure 3 and Figure 4 show some of the timing parameters from
Table 3 .
TIMING EXAMPLE 1
From Figure 4, having fSCLK = 5 MHz and a throughput rate of
250 kSPS gives a cycle time of t2 + 12.5(1/fSCLK) + tACQ = 4 μs.
With t2 = 10 ns min, this leaves tACQ to be 1.49 μs. This 1.49 μs
satisfies the requirement of 250 ns for tACQ. From Figure 4, tACQ
comprises 2.5(1/fSCLK) + t8 + tQUIET, where t8 = 36 ns max. This
allows a value of 954 ns for tQUIET, satisfying the minimum
requirement of 50 ns.
TIMING EXAMPLE 2
The AD7920 can also operate with slower clock frequencies.
From Figure 4, having fSCLK = 3.4 MHz and a throughput rate of
150 kSPS gives a cycle time of t2 + 12.5(1/fSCLK) + tACQ = 6.66 μs.
With t2 = 10 ns min, this leaves tACQ to be 2.97 μs. This 2.97 μs
satisfies the requirement of 250 ns for tACQ. From Figure 4, tACQ
comprises 2.5(1/fSCLK) + t8 + tQUIET, t8 = 36 ns max. This allows a
value of 2.19 μs for tQUIET, satisfying the minimum requirement
of 50 ns. As in this example and with other slower clock values,
the signal may already be acquired before the conversion is
complete, but it is still necessary to leave 50 ns minimum tQUIET
between conversions. In this example, the signal should be fully
acquired at approximately Point C in Figure 4.
CS
SCLK
SDATA
t
2
t
6
t
3
t
4
t
7
t
5
t
8
t
CONVERT
t
QUIET
ZERO ZERO ZERO DB11 DB10 DB2 DB1 DB0
B
THREE-STATETHREE-
STATE
Z
4 LEADING ZEROS
12345 13141516
t
1
02976-003
Figure 3. AD7920 Serial Interface Timing Diagram
CS
S
CLK
t
2
t
CONVERT
B
12345 13141516
C
t
8
t
QUIET
t
ACQ
12.5(1/f
SCLK
)
1/THROUGHPUT
02976-004
Figure 4. Serial Interface Timing Example
AD7910/AD7920
Rev. C | Page 8 of 24
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 4.
Parameter Rating
VDD to GND −0.3 V to +7 V
Analog Input Voltage to GND −0.3 V to VDD + 0.3 V
Digital Input Voltage to GND −0.3 V to +7 V
Digital Output Voltage to GND −0.3 V to VDD + 0.3 V
Input Current to Any Pin Except Supplies1± 10 mA
Operating Temperature Range
Commercial (A, B Grade) −40°C to +85°C
Storage Temperature Range −65°C to +150°C
Junction Temperature 150°C
MSOP Package
θJA Thermal Impedance 205.9°C/W
θJC Thermal Impedance 43.74°C/W
SC70 Package
θJA Thermal Impedance 340.2°C/W
θJC Thermal Impedance 228.9°C/W
Lead Temperature, Soldering
Reflow (10 sec to 30 sec) 235 (0/+5)°C
ESD 3.5 kV
1 Transient currents of up to 100 mA will not cause SCR latch-up.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
AD7910/AD7920
Rev. C | Page 9 of 24
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
V
DD 1
GND
2
V
IN 3
CS
6
SDATA
5
SCLK
4
AD7910/
AD7920
TOP VIEW
(Not to Scale)
02976-005
Figure 5. 6-Lead SC70 Pin Configuration
VDD 1
SDATA 2
CS 3
NC 4
VIN
8
GND7
SCLK
6
NC5
NC = NO CONNECT
AD7910/
AD7920
TOP VIEW
(Not to Scale)
02976-006
Figure 6. 8-Lead MSOP Pin Configuration
Table 5. Pin Function Descriptions
Pin No.
6-Lead
SC70
Pin No.
8-Lead
MSOP Mnemonic Description
6 3 CS Chip Select. Active low logic input. This input provides the dual function of initiating conversions on the
AD7910/AD7920 and framing the serial data transfer.
1 1 VDD Power Supply Input. The VDD range for the AD7910/AD7920 is from 2.35 V to 5.25 V.
2 7 GND
Analog Ground. Ground reference point for all circuitry on the AD7910/AD7920. All analog input signals
should be referred to this GND voltage.
3 8 VIN Analog Input. Single-ended analog input channel. The input range is 0 to VDD.
5 2 SDATA
Data Out. Logic output. The conversion result from the AD7910/AD7920 is provided on this output as a
serial data stream. The bits are clocked out on the falling edge of the SCLK input. The data stream from
the AD7920 consists of four leading zeros followed by the 12 bits of conversion data, which is provided
MSB first. The data stream from the AD7910 consists of four leading zeros followed by the 10 bits of
conversion data followed by two trailing zeros, which is also provided MSB first.
4 6 SCLK
Serial Clock. Logic input. SCLK provides the serial clock for accessing data from the part. This clock input
is also used as the clock source for the AD7910/AD7920 conversion process.
N/A 4, 5 NC No Connect.
AD7910/AD7920
Rev. C | Page 10 of 24
TYPICAL PERFORMANCE CHARACTERISTICS
Figure 7 and Figure 8 show a typical FFT plot for the AD7920 and
AD7910, respectively, at a 250 kSPS sampling rate and a 100 kHz
input frequency.
Figure 9 shows the signal-to-(noise + distortion) ratio performance
vs. input frequency for various supply voltages while sampling at
250 kSPS with an SCLK frequency of 5 MHz for the AD7920.
Figure 10 and Figure 11 show typical INL and DNL performance
for the AD7920.
Figure 12 shows a graph of the total harmonic distortion vs. analog
input frequency for different source impedances when using a
supply voltage of 3.6 V and sampling at a rate of 250 kSPS. See the
Analog Input section.
Figure 13 shows a graph of the total harmonic distortion vs.
analog input signal frequency for various supply voltages while
sampling at 250 kSPS with an SCLK frequency of 5 MHz.
FREQUENCY (kHz)
–5
–55
–115 0 12525
SNR (dB)
50 75 100
–15
–35
–75
–95
8192 POINT FFT
V
DD
= 2.7V
f
SAMPLE
= 250kSPS
f
IN
= 100kHz
SINAD = 72.05dB
THD = –82.87dB
SFDR = –87.24dB
02976-007
Figure 7. AD7920 Dynamic Performance at 250 kSPS
FREQUENCY (kHz)
–45
–105
SNR (dB)
–5
15
–25
–65
–85
0 12525 50 75 100
02976-008
8192 POINT FFT
V
DD
= 2.35V
f
SAMPLE
= 250kSPS
f
IN
= 100kHz
SINAD = 61.67dB
THD = –79.59dB
SFDR = –82.93dB
Figure 8. AD7910 Dynamic Performance at 250 kSPS
FREQUENCY (kHz)
–72.0
10 1000
SINAD (dB)
100
–73.0
–73.5
V
DD
= 5.25V
V
DD
= 2.35V
V
DD
= 2.7V
V
DD
= 4.75V V
DD
= 3.6V
–72.5
–71.0
–71.5
02976-009
Figure 9. AD7920 SINAD vs. Input Frequency at 250 kSPS
CODE
1.0
0.4
–0.2
0 1024
INL ERROR (LSB)
512
0.8
0.6
0.2
0
–0.4
–0.6
–0.8
–1.0 1536 2048 2560 3072 3584 4096
V
DD
= 2.35V
TEMP = 25°C
f
SAMPLE
= 250kSPS
02976-010
Figure 10. AD7920 INL Performance
AD7910/AD7920
Rev. C | Page 11 of 24
CODE
1.0
0.4
–0.2
0 1024
DNL ERROR (LSB)
512
0.8
0.6
0.2
0
–0.4
–0.6
–0.8
–1.0 1536 2048 2560 3072 3584 4096
V
DD
= 2.35V
TEMP = 25°C
f
SAMPLE
= 250kSPS
02976-011
Figure 11. AD7920 DNL Performance
INPUT FREQUENCY (kHz)
–30
–60
10 1000
THD (dB)
100
–10
–20
–40
–50
–70
–80
–90
V
DD
= 3.6V
R
IN
= 10kΩ
R
IN
= 1kΩ
R
IN
= 130ΩR
IN
= 13Ω
R
IN
= 0Ω
02976-012
Figure 12. THD vs. Analog Input Frequency for Various Source Impedances
INPUT FREQUENCY (kHz)
–75
–9010 1000
THD (dB)
100
–65
–70
–80
–85
V
DD
= 5.25V
V
DD
= 2.35V
V
DD
= 2.7V
V
DD
= 4.75V
V
DD
= 3.6V
02976-013
Figure 13. THD vs. Analog Input Frequency for Various Supply Voltages
AD7910/AD7920
Rev. C | Page 12 of 24
TERMINOLOGY
Integral Nonlinearity
The maximum deviation from a straight line passing through
the endpoints of the ADC transfer function. For the AD7920
and AD7910, the endpoints of the transfer function are zero
scale, a point 1 LSB below the first code transition, and full
scale, a point 1 LSB above the last code transition.
Differential Nonlinearity
The difference between the measured and the ideal 1 LSB
change between any two adjacent codes in the ADC.
Offset Error
The deviation of the first code transition (00 . . . 000) to (00 . . . 001)
from the ideal, that is, GND + 1 LSB.
Gain Error
The deviation of the last code transition (111 . . . 110) to
(111 . . . 111) from the ideal, that is, VREF − 1 LSB after the offset
error has been adjusted out.
Track-and-Hold Acquisition Time
The track-and-hold amplifier returns to track mode at the end
of conversion. Track-and-hold acquisition time is the time
required for the output of the track-and-hold amplifier to reach
its final value, within ±0.5 LSB, after the end of conversion. See
the Serial Interface section for more details.
Signal-to-(Noise + Distortion) Ratio
The measured ratio of signal-to-(noise + distortion) at the output
of the A/D converter. The signal is the rms amplitude of the
fundamental. Noise is the sum of all nonfundamental signals up
to half the sampling frequency (fS/2), excluding dc. The ratio is
dependent on the number of quantization levels in the digiti-
zation process. The more levels, the smaller the quantization
noise. The theoretical signal-to-(noise + distortion) ratio for an
ideal N-bit converter with a sine wave input is given by:
Signal-to-(Noise + Distortion) = (6.02N + 1.76) dB
Thus, for a 12-bit converter this is 74 dB, and for a 10-bit
converter this is 62 dB.
Tota l Una djuste d Error
A comprehensive specification that includes gain error, linearity
error, and offset error.
Total Harmonic Distortion (THD)
Total harmonic distortion is the ratio of the rms sum of
harmonics to the fundamental. It is defined as:
1
2
6
2
5
2
4
2
3
2
2
log20)( V
VVVVV
dBTHD ++++
=
where:
V1 is the rms amplitude of the fundamental.
V2, V3, V4, V5, and V6 are the rms amplitudes of the second
through the sixth harmonics.
Peak Harmonic or Spurious Noise
Peak harmonic or spurious noise is the ratio of the rms value of
the next largest component in the ADC output spectrum (up to
fS/2 and excluding dc) to the rms value of the fundamental.
Normally, the value of this specification is determined by the
largest harmonic in the spectrum, but for ADCs whose
harmonics are buried in the noise floor, it is a noise peak.
Intermodulation Distortion
With inputs consisting of sine waves at two frequencies, fa and fb,
any active device with nonlinearities creates distortion products
at sum and difference frequencies of mfa ± nfb where m, n = 0, 1,
2, 3, and so on. Intermodulation distortion terms are those for
which neither m nor n are equal to zero. For example, the second-
order terms include (fa + fb) and (fa − fb), while the third-order
terms include (2fa + fb), (2fa − fb), (fa + 2fb), and (fa − 2fb).
The AD7910/AD7920 are tested using the CCIF standard, where
two input frequencies are used (see fa and fb in the Specifications
page). In this case, the second-order terms are usually distanced in
frequency from the original sine waves, while the third-order terms
are usually at a frequency close to the input frequencies. As a result,
the second- and third-order terms are specified separately. The
calculation of the intermodulation distortion is as per the THD
specification, the ratio of the rms sum of the individual distortion
products to the rms amplitude of the sum of the fundamentals,
expressed in dB.
AD7910/AD7920
Rev. C | Page 13 of 24
CIRCUIT INFORMATION
The AD7910/AD7920 are fast, micropower, 10-bit/12-bit,
single-supply A/D converters, respectively. The parts can be
operated from a 2.35 V to 5.25 V supply. When operated from
either a 5 V supply or a 3 V supply, the AD7910/AD7920 are
capable of throughput rates of 250 kSPS when provided with a
5 MHz clock.
The AD7910/AD7920 provide the user with an on-chip track-
and-hold, A/D converter, and a serial interface housed in a tiny
6-lead SC70 package or 8-lead MSOP package, which offers the
user considerable space saving advantages over alternative
solutions.
The serial clock input accesses data from the part but also
provides the clock source for the successive approximation A/D
converter. The analog input range is 0 V to VDD. An external
reference is not required for the ADC and there is no reference
on-chip. The reference for the AD7910/AD7920 is derived from
the power supply and thus gives the widest dynamic input
range.
The AD7910/AD7920 also feature a power-down option to
allow power saving between conversions. The power-down
feature is implemented across the standard serial interface, as
described in the Modes of Operation section.
AD7910/AD7920
Rev. C | Page 14 of 24
CONVERTER OPERATION
The AD7910/AD7920 are successive approximation analog-to-
digital converters based around a charge redistribution DAC.
Figure 14 and Figure 15 show simplified schematics of the
ADC. Figure 14 shows the ADC during its acquisition phase.
When SW2 is closed and SW1 is in Position A, the comparator
is held in a balanced condition, and the sampling capacitor
acquires the signal on VIN.
CHARGE
REDISTRIBUTION
DAC
CONTROL
LOGIC
COMPARATOR
SW2
SAMPLING
CAPACITOR
ACQUISITION
PHASE
SW1
A
B
AGND V
DD
/2
V
IN
02976-014
Figure 14. ADC Acquisition Phase
When the ADC starts a conversion (see Figure 15), SW2 opens
and SW1 moves to Position B, causing the comparator to become
unbalanced. The control logic and charge redistribution DAC are
used to add and subtract fixed amounts of charge from the
sampling capacitor to bring the comparator back into a balanced
condition. When the comparator is rebalanced, the conversion is
complete. The control logic generates the ADC output code.
Figure 16 shows the ADC transfer function.
CHARGE
REDISTRIBUTION
DAC
CONTROL
LOGIC
COMPARATOR
SW2
SAMPLING
CAPACITOR
CONVERSION
PHASE
SW1
A
B
AGND V
DD
/2
V
IN
02976-015
Figure 15. ADC Conversion Phase
ADC TRANSFER FUNCTION
The output coding of the AD7910/AD7920 is straight binary.
The designed code transitions occur at the successive integer
LSB values, that is, 1 LSB, 2 LSBs, and so on. The LSB size is
VDD/4096 for the AD7920 and VDD/1024 for the AD7910. The
ideal transfer characteristic for the AD7910/AD7920 is shown
in Figure 16.
000...000
0V
ADC CODE
ANALOG INPUT
111...111
000...001
000...010
111...110
111...000
011...111
1LSB +V
DD
– 1LSB
1LSB = V
DD
/1024 (AD7910)
1LSB = V
DD
/4096 (AD7920)
02976-016
Figure 16. Transfer Characteristic
TYPICAL CONNECTION DIAGRAM
Figure 17 shows a typical connection diagram for the AD7910/
AD7920. VREF is taken internally from VDD and, as such, VDD
should be well decoupled. This provides an analog input range of
0 V to VDD. The conversion result is output in a 16-bit word with
four leading zeros followed by the MSB of the 12-bit or 10-bit
result. Two trailing zeros follow the 10-bit result from the
AD7910.
Alternatively, because the supply current required by the
AD7910/AD7920 is so low, a precision reference can be used as
the supply source to the AD7910/AD7920. An REF19x voltage
reference (REF195 for 5 V or REF193 for 3 V) can be used to
supply the required voltage to the ADC (see Figure 17). This
configuration is especially useful if the power supply is quite
noisy or if the system supply voltages are at a value other than
5 V or 3 V (for example, 15 V). The REF19x outputs a steady
voltage to the AD7910/AD7920. If the low dropout REF193 is
used, the current it needs to supply to the AD7910/AD7920 is
typically 1.2 mA. When the ADC is converting at a rate of
250 kSPS, the REF193 needs to supply a maximum of 1.4 mA to
the AD7910/AD7920. The load regulation of the REF193 is
typically 10 ppm/mA (REF193, VS = 5 V), which results in an
error of 14 ppm (42 μV) for the 1.4 mA drawn from it. This
corresponds to a 0.057 LSB error for the AD7920 with VDD =
3 V from the REF193 and a 0.014 LSB error for the AD7910.
For applications where power consumption is of concern, the
power-down mode of the ADC and the sleep mode of the
REF19x reference should be used to improve power
performance. See the Modes of Operation section.
AD7910/AD7920
Rev. C | Page 15 of 24
AD7910/
AD7920
V
DD
V
IN
SERIAL
INTERFACE
0V TO V
DD
INPUT
μ
C/
μ
P
GND
SCLK
SDATA
CS
0.1
μ
F10
μ
F
1
μ
F
TANT
0.1
μ
F
680nF
3V 5V
SUPPLY
1.2mA REF193
02976-017
Figure 17. REF193 as Power Supply
Table 6 provides typical performance data with various
references used as a VDD source for a 100 kHz input tone at
room temperature, under the same setup conditions.
Table 6. AD7920 Typical Performance for Various Voltage
References IC
Reference Tied to VDD AD7920 SNR Performance (dB)
AD780 @ 3 V 72.65
REF193 72.35
AD780 @ 2.5 V 72.5
REF192 72.2
REF43 72.6
ANALOG INPUT
Figure 18 shows an equivalent circuit of the analog input
structure of the AD7910/AD7920. The two diodes, D1 and D2,
provide ESD protection for the analog input. Care must be
taken to ensure that the analog input signal never exceeds the
supply rails by more than 300 mV. This causes these diodes to
become forward biased and start conducting current into the
substrate. The maximum current these diodes can conduct
without causing irreversible damage to the parties is 10 mA.
Capacitor C1 in Figure 18 is typically about 6 pF and can be
attributed primarily to pin capacitance. Resistor R1 is a lumped
component made up of the on resistance of a switch. This
resistor is typically about 100 Ω. Capacitor C2 is the ADC
sampling capacitor and has a capacitance of 20 pF typically. For
ac applications, removing high frequency components from the
analog input signal is recommended by use of a band-pass filter
on the relevant analog input pin. In applications where
harmonic distortion and signal-to-noise ratio are critical, the
analog input should be driven from a low impedance source.
Large source impedances significantly affect the ac performance
of the ADC. This can necessitate the use of an input buffer
amplifier. The choice of the op amp is a function of the
particular application.
C1
6pF
C2
20pF
R1
D1
D2
CONVERSION PHASE—SWITCH OPEN
TRACK PHASE—SWITCH CLOSED
VDD
V
IN
02976-018
Figure 18. Equivalent Analog Input Circuit
Table 7 provides some typical performance data with various op
amps used as the input buffer for a 100 kHz input tone at room
temperature, under the same setup conditions.
Table 7. AD7920 Typical Performance for Various Input
Buffers, VDD = 3 V
Op Amp in the Input Buffer AD7920 SNR Performance (dB)
AD711 72.3
AD797 72.5
AD845 71.4
When no amplifier is used to drive the analog input, the source
impedance should be limited to low values. The maximum
source impedance depends on the amount of total harmonic
distortion (THD) that can be tolerated. The THD increases as
the source impedance increases, and performance degrades (see
Figure 12).
DIGITAL INPUTS
The digital inputs applied to the AD7910/AD7920 are not limited
by the maximum ratings that limit the analog input. Instead, the
digital inputs applied can go to 7 V and are not restricted by the
VDD + 0.3 V limit as on the analog input. For example, if the
AD7910/AD7920 were operated with a VDD of 3 V, then 5 V logic
levels could be used on the digital inputs. However, it is important
to note that the data output on SDATA still have 3 V logic levels
when VDD = 3 V. Another advantage of SCLK and CS not being
restricted by the VDD + 0.3 V limit is that power supply
sequencing issues are avoided. If CS or SCLK is applied before
VDD, there is no risk of latch-up as there would be on the analog
inputs if a signal greater than 0.3 V were applied prior to VDD.
AD7910/AD7920
Rev. C | Page 16 of 24
MODES OF OPERATION
The mode of operation of the AD7910/AD7920 is selected by
controlling the logic state of the CS signal during a conversion.
There are two possible modes of operation, normal mode and
power-down mode. The point at which CS is pulled high after
the conversion is initiated determines whether the
AD7910/AD7920 enters power-down mode. Similarly, if the
device is already in power-down mode, CS can control whether
it returns to normal operation or remains in power-down
mode. These modes of operation are designed to provide
flexible power management options. These options can be
chosen to optimize the power dissipation/throughput rate ratio
for different application requirements.
NORMAL MODE
This mode is intended for fastest throughput rate performance
because the user does not have to worry about any power-up
times; the AD7910/AD7920 remains fully powered all the time.
Figure 19 shows the general diagram of the operation of the
AD7910/AD7920 in this mode.
The conversion is initiated on the falling edge of CS as
described in the Serial Interface section. To ensure that the part
remains fully powered up at all times, CS must remain low until
at least 10 SCLK falling edges have elapsed after the falling edge
of CS. If CS is brought high any time after the tenth SCLK
falling edge but before the end of the tCONVERT, then the part
remains powered up but the conversion is terminated and
SDATA goes back into three-state.
For the AD7920, 16 serial clock cycles are required to complete
the conversion and access the complete conversion result. For
the AD7910, a minimum of 14 serial clock cycles is required to
complete the conversion and access the complete conversion
result.
CS can idle high until the next conversion or can idle low until
CS returns high sometime prior to the next conversion,
effectively idling CS low.
Once a data transfer is complete (SDATA has returned to three-
state), another conversion can be initiated after the quiet time,
tQUIET, has elapsed by bringing CS low again.
POWER-DOWN MODE
This mode is intended for use in applications where slower
throughput rates are required; either the ADC is powered down
between conversions, or a series of conversions can be
performed at a high throughput rate and the ADC is powered
down for a relatively long duration between these bursts of
several conversions. When the AD7910/AD7920 is in power-
down mode, all analog circuitry is powered down.
To enter power-down mode, the conversion process must be
interrupted by bringing CS high anywhere after the second
falling edge of SCLK, and before the tenth falling edge of SCLK,
as shown in Figure 20. Once CS is brought high in this window
of SCLKs, the part enters power-down mode, the conversion
that was initiated by the falling edge of CS is terminated, and
SDATA goes back into three-state. If CS is brought high before
the second SCLK falling edge, the part remains in normal mode
and does not power down. This avoids accidental power-down
due to glitches on the CS line.
To exit this mode of operation and power up the AD7910/
AD7920 again, a dummy conversion is performed. On the falling
edge of CS, the device begins to power up, and continues to
power up as long as CS is held low until after the falling edge of
the tenth SCLK. The device is fully powered up once 16 SCLKs
have elapsed and valid data results from the next conversion, as
shown in Figure 21. If CS is brought high before the tenth SCLK
falling edge, the AD7910/AD7920 goes back into power-down
mode again. This avoids accidental power-up due to glitches on
the CS line or an inadvertent burst of eight SCLK cycles while CS
is low. Although the device can begin to power up on the falling
edge of CS, it powers down again on the rising edge of CS as long
as it occurs before the tenth SCLK falling edge.
POWER-UP TIME
The power-up time of the AD7910/AD7920 is 1 μs, which
means that one dummy cycle is always sufficient to allow the
device to power up. Once the dummy cycle is complete, the
ADC fully powered up and the input signal acquired properly.
The quiet time, tQUIET, must still be allowed from the point
where the bus goes back into three-state after the dummy
conversion, to the next falling edge of CS.
When powering up from the power-down mode with a dummy
cycle, as in Figure 21, the track-and-hold that was in hold mode
while the part was powered down returns to track mode after
the first SCLK edge the part receives after the falling edge of CS.
This is shown as Point A in Figure 21. Although at any SCLK
frequency one dummy cycle is sufficient to power up the device
and acquire VIN, it does not necessarily mean that a full dummy
cycle of 16 SCLKs must always elapse to power up the device
and fully acquire VIN; 1 μs is sufficient to power the device up
and acquire the input signal. Therefore, if a 5 MHz SCLK
frequency is applied to the ADC, the cycle time is 3.2 μs. In one
dummy cycle, 3.2 μs, the part powers up and VIN is fully
acquired. However, after 1 μs with a 5 MHz SCLK, only five
SCLK cycles have elapsed. At this stage, the ADC is fully
powered up and the signal is acquired. In this case, the CS can
be brought high after the tenth SCLK falling edge and brought
low again after a time, tQUIET, to initiate the conversion.
AD7910/AD7920
Rev. C | Page 17 of 24
VALID DATA
CS
SCLK
S
DAT
A
110121416
AD7910/AD7920
02976-019
Figure 19. Normal Mode Operation
THREE-STATE
SDATA
SCLK
CS
110121416
2
02976-020
Figure 20. Entering Power-Down Mode
SCLK
CS
SDAT
A
THE PART
BEGINS TO
POWER UP
THE PART IS FULLY
POWERED UP WITH
V
IN
FULLY ACQUIRED
A10 12 14 16 116
VALID DATA
INVALID DATA
02976-021
1
Figure 21. Exiting Power-Down Mode
When power supplies are first applied to the AD7910/AD7920, the
ADC can power up in either power-down mode or in normal
mode. Because of this, it is best to allow a dummy cycle to elapse to
ensure the part is fully powered up before attempting a valid
conversion. Likewise, if the intention is to keep the part in power-
down mode while not in use and the user wishes the part to power
up in power-down mode, the dummy cycle can be used to ensure
the device is in power-down mode by executing a cycle such as that
shown in Figure 20. Once supplies are applied to the
AD7910/AD7920, the power-up time is the same as that when
powering up from power-down mode. It takes approximately 1 μs
to power up fully if the part powers up in normal mode. It is not
necessary to wait 1 μs before executing a dummy cycle to ensure
the desired mode of operation.
Instead, the dummy cycle can occur directly after power is
supplied to the ADC. If the first valid conversion is performed
directly after the dummy conversion, care must be taken to
ensure that adequate acquisition time is allowed. As mentioned
earlier, when powering up from the power-down mode, the part
returns to track upon the first SCLK edge applied after the
falling edge of CS. However, when the ADC powers up initially
after supplies are applied, the track-and-hold is in track. This
means, assuming the user has the facility to monitor the ADC
supply current, if the ADC powers up in the desired mode of
operation and thus a dummy cycle is not required to change
mode then a dummy cycle is required to place the track-and-
hold into track.
AD7910/AD7920
Rev. C | Page 18 of 24
POWER VS. THROUGHPUT RATE
By using the power-down mode on the AD7910/AD7920 when
not converting, the average power consumption of the ADC
decreases at lower throughput rates. Figure 22 shows how, as the
throughput rate is reduced, the device remains in its power-
down state longer and the average power consumption over
time drops accordingly.
For example, if the AD7910/AD7920 is operated in a
continuous sampling mode with a throughput rate of 100 kSPS
and an SCLK of 5 MHz (VDD = 5 V), and the device is placed in
the power-down mode between conversions, the power
consumption is calculated as follows.
The power dissipation during normal mode is 15 mW (VDD = 5 V).
The power dissipation includes the power dissipated while the part
is entering power-down mode, the power dissipated during the
dummy conversion (when the part is exiting power-down mode
and powering up), and the power dissipated during conversion.
As mentioned in the power-down mode section, to enter
power-down mode, CS has to be brought high anywhere
between the second and tenth SCLK falling edge. Therefore, the
power consumption when entering power-down mode varies
depending on the number of SCLK cycles used. In this example,
five SCLK cycles are used to enter power-down mode. This
gives a time period of 5 × (1/fSCLK) = 1 μs.
The power-up time is 1 μs, which implies that only five SCLK
cycles are required to power up the part. However, CS has to
remain low until at least the tenth SCLK falling edge when
exiting power-down mode. This means that a minimum of nine
SCLK cycles have to be used to exit power-down mode and
power up the part.
So, if nine SCLK cycles are used, the time to power up the part
and exit power-down mode is 9 × (1/fSCLK) = 1.8 μs.
Finally, the conversion time is 16 × (1/fSCLK) = 3.2 μs.
Therefore, the AD7910/AD7920 can be said to dissipate 15 mW
for 3.2 μs + 1.8 μs + 1 μs = 6 μs during each conversion cycle. If
the throughput rate is 100 kSPS, the cycle time is 10 μs and the
average power dissipated during each cycle is (6/10) × (15 mW)
= 9 mW. The power dissipation when the part is in power-down
has not been taken into account because the shutdown current
is so low and it does not have any effect on the overall power
dissipation value.
If VDD = 3 V, SCLK = 5 MHz, and the device is again in power-
down mode between conversions, the power dissipation during
normal operation is 4.2 mW. Assuming the same timing
conditions as before, the AD7910/AD7920 can now be said to
dissipate 4.2 mW for 6 μs during each conversion cycle. With a
throughput rate of 100 kSPS, the average power dissipated
during each cycle is (6/10) × (4.2 mW) = 2.52 mW. Figure 22
shows the power vs. throughput rate when using the power-
down mode between conversions with both 5 V and 3 V
supplies.
Power-down mode is intended for use with throughput rates of
approximately 160 kSPS and under because at higher sampling
rates there is no power saving made by using the power-down
mode.
THROUGHPUT RATE (kSPS)
100
0.1
0
POWER (mW)
10
1
0.01 20
V
DD
= 5V, SCLK = 5MHz
V
DD
= 3V, SCLK = 5MHz
40 60 80 100 120 140 160 180
02976-022
Figure 22. Power vs. Throughput Rate
AD7910/AD7920
Rev. C | Page 19 of 24
SERIAL INTERFACE
Figure 23 and Figure 24 show the detailed timing diagram for
serial interfacing to the AD7920 and AD7910, respectively. The
serial clock provides the conversion clock and also controls the
transfer of information from the AD7910/AD7920 during
conversion.
The CS signal initiates the data transfer and conversion process.
The falling edge of CS puts the track-and-hold into hold mode
and takes the bus out of three-state; the analog input is sampled
at that point. The conversion is also initiated at this point.
For the AD7920, the conversion requires 16 SCLK cycles to
complete. Once 13 SCLK falling edges have elapsed, track-and-
hold goes back into track on the next SCLK rising edge, as
shown in Figure 23 at Point B. On the 16th SCLK falling edge,
the SDATA line goes back into three-state. If the rising edge of
CS occurs before 16 SCLKs have elapsed then the conversion is
terminated and the SDATA line goes back into three-state;
otherwise, SDATA returns to three-state on the 16th SCLK
falling edge, as shown in Figure 23. Sixteen serial clock cycles
are required to perform the conversion process and to access
data from the AD7920.
For the AD7910, the conversion requires 14 SCLK cycles to
complete. Once 13 SCLK falling edges have elapsed, track-and-
hold goes back into track on the next SCLK rising edge, as
shown in Figure 24 at Point B.
If the rising edge of CS occurs before 14 SCLKs have elapsed, the
conversion is terminated and the SDATA line goes back into
three-state. If 16 SCLKs are used in the cycle, SDATA returns to
three-state on the 16th SCLK falling edge, as shown in Figure 24.
CS going low clocks out the first leading zero to be read in by
the microcontroller or DSP. The remaining data is then clocked
out by subsequent SCLK falling edges beginning with the
second leading zero. Thus, the first falling clock edge on the
serial clock has the first leading zero provided and also clocks
out the second leading zero. The final bit in the data transfer is
valid on the 16th falling edge, having been clocked out on the
previous (15th) falling edge.
In applications with a slower SCLK, it is possible to read in data on
each SCLK rising edge. In this case, the first falling edge of SCLK
clocks out the second leading zero, which could be read in the first
rising edge. However, the first leading zero that was clocked out
when CS went low is missed unless it was not read in the first
falling edge. The 15th falling edge of SCLK clocks out the last bit
and it could be read in the 15th rising SCLK edge.
If CS goes low just after the SCLK falling edge has elapsed, CS
clocks out the first leading zero as before, and it can be read on the
SCLK rising edge. The next SCLK falling edge clocks out the sec-
ond leading zero and it could be read on the following rising edge.
CS
SCLK
S
DAT
A
t
2
t
6
t
3
t
4
t
7
t
5
t
8
t
CONVERT
t
QUIET
ZERO ZERO ZERO DB11 DB10 DB2 DB1 DB0
B
THREE-STATETHREE-
STATE
Z
4 LEADING ZEROS
15141354321 16
t
1
1/THROUGHPUT
02976-023
Figure 23. AD7920 Serial Interface Timing Diagram
CS
SCLK
S
DAT
A
t
2
t
6
t
3
t
4
t
7
t
5
t
8
t
CONVERT
t
QUIET
ZERO ZERO ZERO DB9 DB8 DB0 ZERO ZERO
B
THREE-STATETHREE-
STATE
Z
4 LEADING ZEROS 2 TRAILING ZEROS
15141354321 16
t
1
1/THROUGHPUT
02976-024
Figure 24. AD7910 Serial Interface Timing Diagram
AD7910/AD7920
Rev. C | Page 20 of 24
MICROPROCESSOR INTERFACING
The serial interface on the AD7910/AD7920 allows the parts to
be directly connected to a range of different microprocessors.
This section explains how to interface the AD7910/AD7920
with some of the more common microcontroller and DSP serial
interface protocols.
AD7910/AD7920 TO TMS320C541 INTERFACE
The serial interface on the TMS320C541 uses a continuous serial
clock and frame synchronization signals to synchronize the data
transfer operations with peripheral devices like the
AD7910/AD7920. The CS input allows easy interfacing between
the TMS320C541 and the AD7910/AD7920 without any glue logic
required. The serial port of the TMS320C541 is set up to operate in
burst mode (FSM = 1 in the serial port control register, SPC) with
internal serial clock CLKX (MCM = 1 in SPC register) and internal
frame signal (TXM = 1 in the SPC), so both pins are configured as
outputs. For the AD7920, the word length should be set to 16 bits
(FO = 0 in the SPC register). This DSP allows frames with a word
length of 16 bits or 8 bits. Therefore, in the case of the AD7910
where just 14 bits could be required, the FO bit would be set up to
16 bits also. This means that to obtain the conversion result, 16
SCLKs are needed and two trailing zeros are clocked out in the two
last clock cycles.
To summarize, the values in the SPC register are:
FO = 0
FSM = 1
MCM = 1
TXM = 1
The format bit, FO, can be set to 1 to set the word length to
eight bits to implement the power-down mode on the
AD7910/AD7920.
Figure 25 shows the connection diagram. It should be noted
that for signal processing applications, it is imperative that the
frame synchronization signal from the TMS320C541 provides
equidistant sampling.
AD7910/AD7920*
SCLK
SDATA
CS
CLKX
CLKR
FSX
FSR
TMS320C541*
*ADDITIONAL PINS OMITTED FOR CLARITY
DR
02976-025
Figure 25. Interfacing to the TMS320C541
AD7910/AD7920 TO ADSP-218x
The ADSP-218x family of DSPs is interfaced directly to the
AD7910/AD7920 without any glue logic required. The SPORT
control register should be set up as follows:
TFSW = RFSW = 1, Alternate Framing
INVRFS = INVTFS = 1, Active Low Frame Signal
DTYPE = 00, Right Justify Data
ISCLK = 1, Internal Serial Clock
TFSR = RFSR = 1, Frame Every Word
IRFS = 0, Sets up RFS as an Input
ITFS = 1, Sets up TFS as an Output
SLEN = 1111, 16 Bits for the AD7920
SLEN = 1101, 14 Bits for the AD7910
To implement power-down mode, SLEN should be set to 0111
to issue an 8-bit SCLK burst. The connection diagram is shown
in Figure 26. The ADSP-218x has the TFS and RFS of the
SPORT tied together, with TFS set as an output and RFS set as
an input. The DSP operates in alternate framing mode and the
SPORT control register is set up as described. The frame
synchronization signal generated on the TFS is tied to CS and,
as with all signal processing applications, equidistant sampling
is necessary. However, in this example, the timer interrupt is
used to control the sampling rate of the ADC and, under certain
conditions, equidistant sampling can not be achieved.
AD7910/AD7920
*
SCLK
SDATA
CS
SCLK
DR
RFS
TFS
ADSP-218x*
02976-026
*ADDITIONAL PINS OMITTED FOR CLARITY
Figure 26. Interfacing to the ADSP-218x
The timer registers are loaded with a value that provides an
interrupt at the required sample interval. When an interrupt is
received, a value is transmitted with TFS/DT (ADC control
word). The TFS is used to control the RFS and thus the reading
of data. The frequency of the serial clock is set in the SCLKDIV
register. When the instruction to transmit with TFS is given,
that is, TX0 = AX0, the state of the SCLK is checked. The DSP
waits until the SCLK has gone high, low, and high before
transmission starts. If the timer and SCLK values are chosen
such that the instruction to transmit occurs on or near the
rising edge of SCLK, the data can be transmitted or it can wait
until the next clock edge.
AD7910/AD7920
Rev. C | Page 21 of 24
For example, the ADSP-2111 has a master clock frequency of
16 MHz. If the SCLKDIV register is loaded with the value 3, an
SCLK of 2 MHz is obtained and eight master clock periods
elapse for every one SCLK period. If the timer registers are
loaded with the value 803, 100.5 SCLKs occur between
interrupts and subsequently between transmit instructions. This
situation results in nonequidistant sampling as the transmit
instruction is occurring on an SCLK edge. If the number of
SCLKs between interrupts is a whole integer figure of N,
equidistant sampling is implemented by the DSP.
AD7910/AD7920 TO DSP563xx INTERFACE
The diagram in Figure 27 shows how the AD7910/AD7920 can
be connected to the synchronous serial interface (SSI)
(synchronous serial interface) of the DSP563xx family of DSPs
from Motorola. The SSI is operated in synchronous and normal
mode (SYN = 1 and MOD = 0 in Control Register B, CRB) with
internally generated word frame sync for both Tx and Rx (Bit
FSL1 = 0 and Bit FSL0 = 0 in the CRB). Set the word length in
the Control Register A (CRA) to 16 by setting Bits WL2 = 0,
WL1 = 1, and WL0 = 0 for the AD7920. This DSP does not
offer the option for a 14-bit word length, so the AD7910 word
length is set to 16 bits like the AD7920. For the AD7910, the
conversion process uses 16 SCLK cycles, with the last two clock
periods clocking out two trailing zeros to fill the 16-bit word.
To implement the power-down mode on the AD7910/AD7920,
the word length can be changed to eight bits by setting Bits
WL2 = 0, WL1 = 0, and WL0 = 0 in CRA. The FSP bit in the
CRB register can be set to 1, which means the frame goes low
and a conversion starts. Likewise, by means of Bits SCD2,
SCKD, and SHFD in the CRB register, it is established that Pin
SC2 (the frame sync signal) and SCK in the serial port is
configured as outputs and the MSB is shifted first.
To summarize:
MOD = 0
SYN = 1
WL2, WL1, WL0 Depend on the Word Length
FSL1 = 0, FSL0 = 0
FSP = 1, Negative Frame Sync
SCD2 = 1
SCKD = 1
SHFD = 0
It should be noted that for signal processing applications, it is
imperative that the frame synchronization signal from the
DSP563xx provides equidistant sampling.
AD7910/AD7920*
SDATA
SCLK
CS
DSP563xx*
SCK
SRD
SC2
*ADDITIONAL PINS OMITTED FOR CLARITY
02976-027
Figure 27. Interfacing to the DSP563xx
AD7910/AD7920
Rev. C | Page 22 of 24
APPLICATION HINTS
GROUNDING AND LAYOUT
The printed circuit board that houses the AD7910/AD7920
should be designed such that the analog and digital sections are
separated and confined to certain areas of the board. This
facilitates the use of ground planes that can be easily separated.
A minimum etch technique is generally best for ground planes
as it gives the best shielding. Digital and analog ground planes
should be joined at only one place. If the AD7910/AD7920 is in
a system where multiple devices require an AGND to DGND
connection then the connection should still be made at one
point only, a star ground point that should be established as
close to the AD7910/AD7920 as possible.
Avoid running digital lines under the device as these couple
noise onto the die. The analog ground plane should be allowed
to run under the AD7910/AD7920 to avoid noise coupling. The
power supply lines to the AD7910/AD7920 should use as large a
trace as possible to provide low impedance paths and reduce the
effects of glitches on the power supply line. Fast switching
signals like clocks should be shielded with digital ground to
avoid radiating noise to other sections of the board, and clock
signals should never be run near the analog inputs. Avoid
crossover of digital and analog signals. Traces on opposite sides
of the board should run at right angles to each other. This
reduces the effects of feedthrough through the board. A micro-
strip technique is by far the best but is not always possible with
a double-sided board. In this technique, the component side of
the board is dedicated to ground planes while signals are placed
on the solder side.
Good decoupling is also very important. The supply should be
decoupled with, for example, a 680 nF 0805 to GND. When
using the SC70 package in applications where the size of the
components is of concern, a 220 nF 0603 capacitor, for example,
could be used instead. However, in that case, the decoupling can
not be as effective and can result in an approximate SINAD
degradation of 0.3 dB. To achieve the best performance from
these decoupling components, the user should endeavor to keep
the distance between the decoupling capacitor and the VDD and
GND pins to a minimum with short track lengths connecting
the respective pins. Figure 28 and Figure 29 show the
recommended positions of the decoupling capacitor for the
MSOP and SC70 packages, respectively.
As can be seen in Figure 28, for the MSOP package, the
decoupling capacitor is placed as close as possible to the IC,
with short track lengths to VDD and GND pins. The decoupling
capacitor could also be placed on the underside of the PCB
directly underneath the IC, between the VDD and GND pins
attached by vias. This method would not be recommended on
PCBs above a standard 1.6 mm thickness. The best performance
is seen with the decoupling capacitor on the top of the PCB next
to the IC.
02976-028
Figure 28. Recommended Supply Decoupling Scheme for the
AD7910/AD7920 MSOP Package
Similarly, for the SC70 package, the decoupling capacitor should
be located as close as possible to the VDD and GND pins.
Because of its pinout, that is, VDD being next to GND, the
decoupling capacitor can be placed extremely close to the IC.
The decoupling capacitor could be placed on the underside of
the PCB directly under the VDD and GND pins, but, as before,
the best performance is seen with the decoupling capacitor on
the same side as the IC.
02976-029
Figure 29. Recommended Supply Decoupling Scheme for the
AD7910/AD7920 SC70 Package
EVALUATING PERFORMANCE
The evaluation board package includes a fully assembled and
tested evaluation board, documentation, and software for
controlling the board from the PC via the Eval-Board
Controller. To demonstrate/evaluate the ac and dc performance
of the AD7910/AD7920, the evaluation board controller can be
used in conjunction with the AD7910/AD7920CB evaluation
boards as well as many other Analog Devices’ evaluation boards
ending in the CB designator.
The software allows the user to perform ac (fast Fourier
transform) and dc (histogram of codes) tests on the
AD7910/AD7920. See the evaluation board technical note for
more information.
AD7910/AD7920
Rev. C | Page 23 of 24
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-203-AB
0.22
0.08
0.30
0.15
1.00
0.90
0.70
SEATING
PLANE
4 5 6
3 2 1
PIN 1 0.65 BSC
1.30 BSC
0.10 MAX
0.10 COPLANARITY
0.40
0.10
1.10
0.80
2.20
2.00
1.80
2.40
2.10
1.80
1.35
1.25
1.15
0.46
0.36
0.26
Figure 30. 6-Lead Thin Shrink Small Outline Transistor Package [SC70]
(KS-6)
Dimensions shown in millimeters
COMPLIANT TO JEDEC STANDARDS MO-187-AA
0.80
0.60
0.40
4
8
1
5
PIN 1 0.65 BSC
SEATING
PLANE
0.38
0.22
1.10 MAX
3.20
3.00
2.80
COPLANARITY
0.10
0.23
0.08
3.20
3.00
2.80
5.15
4.90
4.65
0.15
0.00
0.95
0.85
0.75
Figure 31. 8-Lead Mini Small Outline Package [MSOP]
(RM-8)
Dimensions shown in millimeters
AD7910/AD7920
Rev. C | Page 24 of 24
© 2005 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
C02976-0-9/05(C)
ORDERING GUIDE
Model Temperature Range Linearity Error (LSB)1 Package Description Package Option Branding
AD7910AKS-500RL7 −40°C to +85°C ±0.5 max 6-Lead SC70 KS-6 CVA
AD7910AKS-REEL −40°C to +85°C ±0.5 max 6-Lead SC70 KS-6 CVA
AD7910AKS-REEL7 −40°C to +85°C ±0.5 max 6-Lead SC70 KS-6 CVA
AD7910AKSZ-500RL72−40°C to +85°C ±0.5 max 6-Lead SC70 KS-6 C49
AD7910AKSZ-REEL2−40°C to +85°C ±0.5 max 6-Lead SC70 KS-6 C49
AD7910AKSZ-REEL72−40°C to +85°C ±0.5 max 6-Lead SC70 KS-6 C49
AD7910ARM −40°C to +85°C ±0.5 max 8-Lead MSOP RM-8 CVA
AD7910ARM-REEL −40°C to +85°C ±0.5 max 8-Lead MSOP RM-8 CVA
AD7910ARM-REEL7 −40°C to +85°C ±0.5 max 8-Lead MSOP RM-8 CVA
AD7910ARMZ2 −40°C to +85°C ±0.5 max 8-Lead MSOP RM-8 C49
AD7920AKS-500RL7 −40°C to +85°C ±0.75 typ 6-Lead SC70 KS-6 CUA
AD7920AKS-REEL −40°C to +85°C ±0.75 typ 6-Lead SC70 KS-6 CUA
AD7920AKS-REEL7 −40°C to +85°C ±0.75 typ 6-Lead SC70 KS-6 CUA
AD7920AKSZ-500RL72−40°C to +85°C ±0.75 typ 6-Lead SC70 KS-6 C47
AD7920AKSZ-REEL72−40°C to +85°C ±0.75 typ 6-Lead SC70 KS-6 C47
AD7920BKS-500RL7 −40°C to +85°C ±1.5 max 6-Lead SC70 KS-6 CUB
AD7920BKS-REEL −40°C to +85°C ±1.5 max 6-Lead SC70 KS-6 CUB
AD7920BKS-REEL7 −40°C to +85°C ±1.5 max 6-Lead SC70 KS-6 CUB
AD7920BKSZ-500RL72−40°C to +85°C ±1.5 max 6-Lead SC70 KS-6 C4B
AD7920BKSZ-REEL2−40°C to +85°C ±1.5 max 6-Lead SC70 KS-6 C4B
AD7920BKSZ-REEL72−40°C to +85°C ±1.5 max 6-Lead SC70 KS-6 C4B
AD7920BRM −40°C to +85°C ±1.5 max 8-Lead MSOP RM-8 CUB
AD7920BRM-REEL −40°C to +85°C ±1.5 max 8-Lead MSOP RM-8 CUB
AD7920BRM-REEL7 −40°C to +85°C ±1.5 max 8-Lead MSOP RM-8 CUB
AD7920BRMZ2−40°C to +85°C ±1.5 max 8-Lead MSOP RM-8 C4B
AD7920BRMZ-REEL2−40°C to +85°C ±1.5 max 8-Lead MSOP RM-8 C4B
AD7920BRMZ-REEL72−40°C to +85°C ±1.5 max 8-Lead MSOP RM-8 C4B
EVAL-AD7910CB3 Evaluation Board
EVAL-AD7920CB3 Evaluation Board
EVAL-CONTROL BRD24 Controller Board
1 Linearity error refers to integral nonlinearity.
2 Z = Pb-free part.
3 This can be used as a standalone evaluation board or in conjunction with the EVAL-CONTROL BRD2 for evaluation/demonstration purposes.
4 This board is a complete unit that allows a PC to control and communicate with all Analog Devices evaluation boards ending in the CB designator. To order a
complete evaluation kit, a particular ADC evaluation board must be ordered, for example., EVAL-AD7920CB, the EVAL-CONTROL BRD2, and a 12 V ac transformer. See
relevant evaluation board technical note for more information.