NLX2G66FCTAG - ON SEMICONDUCTOR

May, 2016 − Rev. 5 1Publication Order Number:

NLX2G66/D

NLX2G66

Dual Bilateral Analog

Switch / Digital Multiplexer

The NLX2G66 is a dual single pole, single throw (SPST) analog

switch / digital multiplexer. This single supply voltage IC is designed

with a sub−micron CMOS technology to provide low propagation

delays (tpd) and ON resistance (RON), while maintaining low power

dissipation. This bi−lateral switch can be used with either analog or

digital signals that may vary across the full power supply range from

VCC to GND.

Features

•Wide VCC Operating Range: 1.65 V to 5.5 V

•OVT up to +5.5 V for Control Pin

•RON: Typically 5.5 W at VCC = 4.5 V and IS = 32 mA

•Rail−to−Rail Input/Output

•High On−Off Output Voltage Ratio

•High Degree of Linearity

•Ultra−Small Pb−Free, Halide−Free, RoHS−Compliant Packages

•ESD Performance: > 5000 V HBM, > 400 V MM

Typical Applications

•Cell Phones, PDAs, MP3 and other Portable Media Players

1B1A

2B2A

Figure 1. Analog Symbol

PIN ASSIGNMENTS

UDFN8 WLCSP8 Description

1 A1 1A

2 B1 1B

3 C1 2C

4 D1 GND

5 D2 2A

6 C2 2B

7 B2 1C

8 A2 VCC

This document contains information on some products that are still under development.

ON Semiconductor reserves the right to change or discontinue these products without

notice.

www.onsemi.com

See detailed ordering and shipping information in the package

dimensions section on page 5 of this data sheet.

ORDERING INFORMATION

MARKING

DIAGRAMS

XX = Specific Device Code

M = Date Code

G= Pb−Free Package

UDFN8

MU SUFFIX

CASE 517BZ

UDFN8

MU SUFFIX

CASE 517CA

XXM

PIN ASSIGNMENTS

UDFN8

(Top View)

VCC

GND

Control Input (C) Switch

UNCTION TABLE

L OFF

HON

8WLCSP8

FC SUFFIX

CASE 567MR

XXXX

AYWW

A = Assembly Location

Y = Year

WW = Work Week

WLCSP8

VCC

GND

(Bottom View)

NLX2G66

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Table 1. MAXIMUM RATINGS

Symbol Rating Value Unit

VCC Positive DC Supply Voltage −0.5 to +7.0 V

VSSwitch Input / Output Voltage (Pins 1A, 1B, 2A and 2B) −0.5 to + VCC + 0.5 V

VIDigital Control Input Voltage (Pins 1C and 2C) −0.5 to +7.0 V

IOK I/O port diode current ±50 mA

IIK Control input diode current −50 mA

II/O Continuous DC Current Through Analog Switch ±100 mA

ILLatch−up Current, (Above VCC and below GND at 125°C) ±100 mA

TsStorage Temperature −65 to +150 °C

VESD ESD Withstand Voltage: Human Body Model (HBM)

Machine Model (MM)

≥ 5000

> 400 V

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be af fected.

Table 2. RECOMMENDED OPERATING CONDITIONS

Symbol Parameter Min Max Unit

VCC Positive DC Supply Voltage 1.65 5.5 V

VSSwitch Input / Output Voltage (Pins 1A, 2A, 1B and 2B) GND VCC V

VIDigital Control Input Voltage (Pins 1C and 2C) GND 5.5 V

TAOperating Temperature Range −55 +125 °C

tr, tfInput Transition Rise or Fall Time

(ON/OFF Control Input) VCC = < 3.0 V 0 20 ns/V

VCC = ≥ 3.0 V 0 10

Table 3. ELECTRICAL CHARACTERISTICS

Symbo

Parameter Condition VCC

Guaranteed Limit

Unit

255C−555 to 1255C

Min Max Min Max

VIH High−Level Input Voltage, Control

Input 1.65 to

1.95 VCC x

0.65 V

2.3 to

5.5 VCC x

0.7

VIL Low−Level Input Voltage, Control

Input 1.65 to

1.95 VCC x

0.35 V

2.3 to

5.5 VCC x

0.30

IIInput Leakage Current, Control Input VI = VCC or GND 5.5 ±0.1 ±1mA

IS(ON) ON−State Switch Leakage Current VIS = VCC or GND,

VI = VIH, VOS = Open 5.5 ±0.1 ±1mA

IS(OFF) OFF−State Switch

Leakage Current VIS = VCC and VOS =

GND, or VIS = GND and

VOS = VCC GND, VI = VIL,

5.5 ±0.1 ±1mA

ICC Quiescent Supply Current VI = VCC or GND 5.5 1.0 10 mA

ΔICC Supply Current Change VI = VCC – 0.6 5.5 500 mA

CIControl Input Capacitance 5 3.0 pF

CI/O(Off) Switch OFF Input / Output Capacitance See Figure 3 5 6.0 pF

CI/O(On) Switch ON Input / Output Capacitance See Figure 4 5 13 pF

NLX2G66

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Table 4. SWITCHING CHARACTERISTICS

Symbol Parameter Condition VCC

Guaranteed Limit

Unit

−555 to 1255C

Min Max

tPLH, tPHL Propagation Delay,

A to B, B to A CL = 30 pF, RL = 1 kΩ1.8 6.5 ns

2.5 3.3

CL = 50 pF, RL = 500 Ω3.3 2.5

5.0 2.2

tEN

(tPZL, tPZH)Enable Time,

C to Analog Output (A or B) CL = 50 pF, RL = 500 Ω

See Figure 6 1.8 10 ns

2.5 6.5

3.3 5.5

5.0 4.9

tDIS

(tPLZl, tPHZ)Disable Time,

C to Analog Output (A or B) CL = 50 pF, RL = 500 Ω

See Figure 6 1.8 9.0 ns

2.5 7.2

3.3 6.5

5.0 6.0

Table 5. ANALOG SWITCH CHARACTERISTICS

Symbol Parameter Conditions VCC

255C−555 to 1255C

Unit

Typ Min Max

RON On−Resistance VIS = VCC or GND,

VI = VIH, See Figure 2 IS = 4 ma 1.65 12 30 W

IS = 8 ma 2.3 9 20

IS = 24 ma 3.0 7.5 15

IS = 32 ma 4.5 5.5 13

RON(peak) Peak On−Resistance VIS = GND to VCC; VI = VIH,

See Figure 2 IS = 4 ma 1.65 74.5 220 W

IS = 8 ma 2.3 20 75

IS = 24 ma 3.0 11.5 25

IS = 32 ma 4.5 7.5 17

DRON On−Resistance

Mismatch between

Switches

VIS = GND to VCC; VI = VIH,

See Figure 2 IS = 4 ma 1.65 8.0 W

IS = 8 ma 2.3 5.0

IS = 24 ma 3.0 3.0

IS = 32 ma 4.5 2.0

BW Bandwidth (f−3dB)RL = 50 W, CL = 5 pF,

fIN = Sine Wave

See Figure 8

1.65 > 270 MHz

2.3 > 270

3.0 > 270

4.5 > 270

NLX2G66

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Table 5. ANALOG SWITCH CHARACTERISTICS (continued)

Symbol Parameter Conditions VCC

255C

Unit

Typ

ISOOff Off−Channel

Feedthrough

Isolation

RL = 600 Ω, CL = 50 pF,

fIN = 1 MHz Sine Wave

See Figure 9

1.65 −70 dB

2.3 −70

3.0 −70

4.5 −70

RL = 50 Ω, CL = 5 pF,

fIN = 1 MHz Sine Wave

See Figure 9

1.65 −60

2.3 −60

3.0 −60

4.5 −60

XTalk Crosstalk

Between Switches RL = 600 Ω, CL = 50 pF,

fIN = 1 MHz Sine Wave

See Figure 10

1.65 −100 dB

2.3 −100

3.0 −100

4.5 −100

RL = 50 Ω, CL = 5 pF,

fIN = 1 MHz Sine Wave

See Figure 10

1.65 −90

2.3 −90

3.0 −90

4.5 −90

Feedthrough Noise,

Control to Switch RL = 600 Ω, CL = 50 pF,

fIN = 1 MHz Square Wave, tr = tf = 2 ns,

See Figure 11

1.65 10 mVpp

2.3 10

3.0 10

4.5 15

THD Total Harmonic

Distortion CL = 50 pF, RL = 50 Ω,

fIN = 600 Hz to 20 KHz Sine Wave,

See Figure 12

2.3 0.025 %

3.0 0.015

4.5 0.01

Table 6. POWER DISSIPATION CHARACTERISTICS

Symbol Parameter Conditions VCC

255C

Unit

Typ

CPD Power Dissipation

Capacitance f = 10 MHz 1.65 8.0 pF

2.3 8.9

3.0 9.6

4.5 10.9

NLX2G66

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Table 7. DEVICE ORDERING INFORMATION

Device Order Number Package Shipping†

NLX2G66DMUTAG UDFN8−0.5P, 1.95 mm x 1.0 mm

(Pb−Free) 3000 / Tape & Reel

NLX2G66DMUTCG UDFN8−0.5P, 1.95 mm x 1.0 mm

(Pb−Free) 3000 / Tape & Reel

NLX2G66MU3TCG

(In Development) UDFN8−0.35P, 1.45 mm x 1.0 mm

(Pb−Free) 3000 / Tape & Reel

NLX2G66FCTAG WLCSP8, 1.888 mm x 0.888 mm

(Pb−Free) 3000 / Tape & Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

NLX2G66

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Figure 2. On Resistance Test Set−Up Figure 3. Maximum Off−Channel Leakage

Current Test Set−Up

Figure 4. Maximum On−Channel Leakage

Current Test Set−Up Figure 5. Propagation Delay Test Set−Up

Figure 6. Propagation Delay Output

Enable/Disable Test Set−Up Figure 7. Power Dissipation Capacitance Test

Set−Up

POWER

SUPPLY COMPUTER

DC PARAMETER

ANALYZER

VCC

PLOTTER

VCC

VIL

VCC

VCC A

VCC

VIH

VCC

N/C

VCC

TEST

POINT

VCC

CL*

*Includes all probe and jig capacitance.

TEST POINT

Switch to Position 2 when testing tPLZ and tPZL

Switch to Position 1 when testing tPHZ and tPZH

VCC

N/C

GND

VCC

GND

VCC

GND

VCC

GND

VCC

GND

VCC

GND

VCC

VIH

NLX2G66

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Figure 8. Maximum On−Channel Bandwidth

Test Set−Up Figure 9. Off−Channel Feedthrough Isolation

Test Set−Up

Figure 10. Crosstalk (between Switches)

Figure 11. Feedthrough Noise, ON/OFF Control

to Analog Out, Test Set−Up

VCC

*Includes all probe and jig capacitance.

Meter

0.1 mF

VOS

fin

VCC

*Includes all probe and jig capacitance.

Meter

0.1 mF

VOS

fin

VIS

VCC

*Includes all probe and jig capacitance.

VOS

(VCC)/2

GND

VCC

VIN v1MHz

tr+tf+2ns

GND

VCC

GND

VCC

GND

VCC

NLX2G66

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Figure 12. Total Harmonic Distortion Test

Set−Up

Figure 13. Propagation Delay, Analog In to

Analog Out Waveforms

Figure 14. Propagation Delay, ON/OFF Control

VCC

*Includes all probe and jig capacitance.

0.1 mF

VIS

fin

VOS

To Distortion

Meter

(VCC)/2

VCC

VOH

50%

50% VCC

tPHL

tPLH

50% VCC

VOL

VCC

10%

50% VCC

Control

Analog Out

tPLZ

tPZL

50% VCC

tPHZ

tPZH

VOL

VOH

High

Impedance

High

Impedance

90%

trtf

90%

10%

GND

VCC

NLX2G66

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PACKAGE DIMENSIONS

UDFN8 1.45x1.0, 0.35P

CASE 517BZ

ISSUE O

ÉÉ

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED

TERMINAL AND IS MEASURED BETWEEN

0.15 AND 0.20 MM FROM TERMINAL TIP.

4. PACKAGE DIMENSIONS EXCLUSIVE OF

BURRS AND MOLD FLASH.

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

RECOMMENDED

DIM MIN MAX

MILLIMETERS

A0.45 0.55

A1 0.00 0.05

A3 0.13 REF

b0.15 0.25

D1.45 BSC

E1.00 BSC

e0.35 BSC

L0.25 0.35

L1 0.30 0.40

A B

0.10 C

PIN ONE

REFERENCE

TOP VIEW

0.10 C

0.05 C

CSEATING

PLANE

SIDE VIEW

BOTTOM VIEW

L7X

e/2

DIMENSIONS: MILLIMETERS

0.22

0.48 8X

1.18

0.53 PITCH

0.35

PKG

OUTLINE

0.10 B

0.05

CNOTE 3

NLX2G66

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PACKAGE DIMENSIONS

UDFN8 1.95x1.0, 0.5P

CASE 517CA

ISSUE O

ÉÉÉ

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED

TERMINAL AND IS MEASURED BETWEEN

0.15 AND 0.20 MM FROM TERMINAL TIP.

4. PACKAGE DIMENSIONS EXCLUSIVE OF

BURRS AND MOLD FLASH.

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

RECOMMENDED

DIM MIN MAX

MILLIMETERS

A0.45 0.55

A1 0.00 0.05

A3 0.13 REF

b0.15 0.25

D1.95 BSC

E1.00 BSC

e0.50 BSC

L0.25 0.35

L1 0.30 0.40

A B

0.10 C

PIN ONE

REFERENCE

TOP VIEW

0.10 C

0.05 C

CSEATING

PLANE

SIDE VIEW

BOTTOM VIEW

L7X

e/2

DIMENSIONS: MILLIMETERS

0.30

0.49 8X

1.24

0.54 PITCH

0.50

PKG

OUTLINE

0.10 B

0.05

CNOTE 3

NLX2G66

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PACKAGE DIMENSIONS

WLCSP8, 1.888x0.888

CASE 567MR

ISSUE O

SEATING

PLANE

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. COPLANARITY APPLIES TO SPHERICAL

CROWNS OF SOLDER BALLS.

DIM

AMIN MAX

−−−

MILLIMETERS

e0.50 BSC

b0.21 0.25

0.50

ÈÈ

PIN A1

REFERENCE

A0.15 BC

0.03 C

0.05 C

8X b

A1 C

0.15 0.19

PITCH 0.20

DIMENSIONS: MILLIMETERS

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

0.50

TOP VIEW

SIDE VIEW

BOTTOM VIEW

NOTE 3

RECOMMENDED

PACKAGE

OUTLINE

PITCH

e/2

D1.858 1.918

E0.858 0.918

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Phone: 81−3−5817−1050

NLX2G66/D

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