AT RFRDIO Ay _59.1840.25 AX21.35+0.25 @13.97X3=41.9 2.0(REF) NOTES: ELECTRICAL: 1. VOLTAGE RAT|NG 2. CURRENT RATING 3. CONTACT RESISTANCE MECHANICAL: HOUSING MATERIAL : CONTACT MATERIAL : PLATING OPERATING LIFE MOR AN > ENVIRONMENTAL: 1. STORAGE 4. INSULATION RESISTANCE: 9. DIELECTRIC STRENGTH: IK AX 3.3040.51 7 Z 4.57 | 2.54 8.89+t0.2 125 VAC RMS. > 1.5 AMP. > 35 MILLIOHMS MAX. 1000 MEGORMS MIN 500 VDC. 1000 VAC RMS 60Hz, 71MIN. GLASS FILLED POLYESTER UL94V0. PHOSPHOR BRONZE 40.46mm. > GOLD PLATING OVER NICKEL. > 730 CYCLES MIN. PCB RETENTION PRE-SOLDER : 1 PCB RETENTION POSTSOLDER: LB MIN. 10 LBS MIN. : 40C TO +85C. 2. OPERATION: O'C TO 70C. MATES WITH MODULAR PLUG CONFORMING TO FCC PART 68, SUBPART F. UL & CUL FILE NO. 163191 PART NUMBER: ES9O0X2XCX2X S-NICKEL Ay 1- 10C _t | | Loy 3u 2 6u 3-15u AX D-NICKEL PLATE 8- 8C 4-30u 5-50u 6Pd20u STIN W/ TINNED GROUNDING PEG 1-FRONT PEG 4.57 2FRONT PEG 4.57 .W/ 3 GROUNDING TABS S3-FRONT PEG 4.57 ,W/ 5 GROUNDING TABS 0.2 0.15 0,075 MODIFY NOTE aAgveg 3.3040.51 wos 2,800.51] 4 Apos MODIFY DIMENSION |;2 60799" ADD P/N OPTION | afayor ADD P/N OPTION | s//or PPP SP MODIFY DIMENSION | 1495870 11.43 8.89 10.16 PC Board Thickness=1.60mm PC Board Layout Component Side Shown BASS 9/12/'98 20.57 PCB JACK 10P 5-0178-4 SEE NOTE A3 5:1 1 8 7 6 | | Cay. i) !