ICS40638 HighAOPAnalogMEMSMicrophonewithDifferentialOutput GENERALDESCRIPTION APPLICATIONS TheICS40638isananalogMEMSmicrophonewithveryhigh dynamicrangeandcapableofoperationupto105C.TheICS 40638includesaMEMSmicrophoneelement,animpedance converter,andadifferentialoutputamplifier. Otherhighperformancespecificationsinclude138dBSPL acousticoverloadpoint,tight1dBsensitivitytoleranceand enhancedimmunitytobothradiatedandconductedRF interference. TheICS40638isavailableinasmall3.50mmx2.65mmx 0.98mmbottomportsurfacemountpackage. Automotive Stillandvideocameras IoTdevices FEATURES SPEC PERFORMANCE SNR Current AOP 63dBA 170A 138SPL Differentialnoninvertinganalogoutput -43dBVsensitivity(differential) 1dBsensitivitytolerance Extendedfrequencyresponsefrom35Hzto20kHz EnhancedRFimmunity -81dBPSRR 3.50x2.65x0.98mmsurfacemountpackage CompatiblewithSn/PbandPbfreesolderprocesses RoHS/WEEEcompliant FUNCTIONALBLOCKDIAGRAM ORDERINGINFORMATION PART ICS40638 EV_ICS40638FX TEMPRANGE PACKAGING -40Cto+105C -- 13"TapeandReel InvenSense,Inc.reservestherighttochangethe detailspecificationsasmayberequiredtopermit improvementsinthedesignofitsproducts. InvenSenseInc. 1745TechnologyDrive,SanJose,CA95110U.S.A +1(408)988-7339 www.invensense.com DocumentNumber:DS000281 Revision:1.1 RevDate:4/15/2020 ICS40638 TABLEOFCONTENTS GeneralDescription.....................................................................................................................................................................1 Applications.................................................................................................................................................................................1 Features.......................................................................................................................................................................................1 FunctionalBlockDiagram............................................................................................................................................................1 OrderingInformation...................................................................................................................................................................1 TableofContents....................................................................................................................................................................................2 Specifications..........................................................................................................................................................................................3 Table1.ElectricalCharacteristics................................................................................................................................................3 AbsoluteMaximumRatings....................................................................................................................................................................4 Table2.AbsoluteMaximumRatings...........................................................................................................................................4 ESDCaution.................................................................................................................................................................................4 SolderingProfile...........................................................................................................................................................................5 Table3.RecommendedSolderingProfile*..................................................................................................................................5 PinConfigurationsAndFunctionDescriptions.......................................................................................................................................6 Table4.PinFunctionDescriptions...............................................................................................................................................6 TypicalPerformanceCharacteristics.......................................................................................................................................................7 ApplicationsInformation........................................................................................................................................................................8 CodecConnection........................................................................................................................................................................8 SupportingDocuments...........................................................................................................................................................................9 EvaluationBoardUserGuide.......................................................................................................................................................9 ApplicationNotes........................................................................................................................................................................9 PCBDesignAndLandPatternLayout...................................................................................................................................................10 PCBMaterialAndThickness......................................................................................................................................................10 HandlingInstructions............................................................................................................................................................................11 PickAndPlaceEquipment.........................................................................................................................................................11 ReflowSolder.............................................................................................................................................................................11 BoardWash...............................................................................................................................................................................11 OutlineDimensions...............................................................................................................................................................................12 OrderingGuide..........................................................................................................................................................................12 RevisionHistory.........................................................................................................................................................................13 ComplianceDeclarationDisclaimer......................................................................................................................................................14 Page2of14 DocumentNumber:DS000281 Revision:1.1 ICS40638 SPECIFICATIONS TABLE1.ELECTRICALCHARACTERISTICS TA=25C,VDD=1.52to3.63V,unlessotherwisenoted.Typicalspecificationsarenotguaranteed. PARAMETER CONDITIONS MIN TYP MAX PERFORMANCE Directionality Omni OutputPolarity NonInverted Sensitivity 1kHz,94dBSPL,differential -44 -43 -42 SignaltoNoiseRatio(SNR) 20kHzbandwidth,Aweighted 63 EquivalentInputNoise(EIN) 20kHzbandwidth,Aweighted 31 DerivedfromEINandacoustic DynamicRange 107 overloadpoint TotalHarmonicDistortion(THD) 105dBSPL 0.2 1kHz,100mVppsinewave 81 PowerSupplyRejectionRatio(PSRR) superimposedonVDD=2.75V 217Hz,100mVppsquarewave -111 PowerSupplyRejection(PSR) superimposedonVDD=2.75V AcousticOverloadPoint 10%THD 138 POWERSUPPLY SupplyVoltage(VDD) Standardmode 1.52 3.63 SupplyCurrent(IS) VDD=1.8V 170 190 OUTPUTCHARACTERISTICS DifferentialOutputImpedance 355 OutputCommonModeVoltage OUTPUT+andOUTPUT 1.0 BetweenOUTPUT+andOUTPUT- 10 OutputDifferentialOffset StartupTime MaximumOutputVoltage NoiseFloor Outputtowithin0.5dBofstable sensitivity 138dBSPLinput 20Hzto20kHz,Aweighted,rms Page3of14 DocumentNumber:DS000281 Revision:1.1 15 1.0 -106 20 UNITS dBV dBA dBASPL dB NOTES % dB dBV dBSPL V A V mV ms V rms dBV ICS40638 ABSOLUTEMAXIMUMRATINGS StressabovethoselistedasAbsoluteMaximumRatingsmaycausepermanentdamagetothedevice.Thesearestressratingsonly andfunctionaloperationofthedeviceattheseconditionsisnotimplied.Exposuretotheabsolutemaximumratingsconditionsfor extendedperiodsmayaffectdevicereliability. TABLE2.ABSOLUTEMAXIMUMRATINGS PARAMETER RATING SupplyVoltage(VDD) -0.3Vto+3.63V MechanicalShock 10,000g Vibration PerMILSTD883Method2007,TestConditionB TemperatureRange Operating -40Cto+105C* Storage -55Cto+150C *Operatingrangeguaranteesmicfunctionality.Someperformancemaybereducedneartemperaturelimits. ESDCAUTION ESD(electrostaticdischarge)sensitivedevice. Chargeddevicesandcircuitboardscan dischargewithoutdetection.Althoughthis productfeaturespatentedorproprietary protectioncircuitry,damagemayoccuron devicessubjectedtohighenergyESD. ThereforeproperESDprecautionsshouldbe takentoavoidperformancedegradationor lossoffunctionality. Page4of14 DocumentNumber:DS000281 Revision:1.1 ICS40638 SOLDERINGPROFILE CRITICAL ZONE TL TO TP tP TP TEMPERATURE RAMP-UP TL tL TSMAX TSMIN tS RAMP-DOWN PREHEAT t25C TO PEAK TEMPERATURE TIME Figure1.RecommendedSolderingProfileLimits TABLE3.RECOMMENDEDSOLDERINGPROFILE* PROFILEFEATURE AverageRampRate(TLtoTP) Sn63/Pb37 1.25C/secmax PbFree 1.25C/secmax 100C 100C 150C 200C 60secto75sec 1.25C/sec 45secto75sec 183C 60secto75sec 1.25C/sec ~50sec 217C 215C+3C/-3C 260C+0C/-5C TimeWithin+5CofActualPeak Temperature(tP) 20secto30sec 20secto30sec RampDownRate 3C/secmax 3C/secmax Time+25C(t25C)toPeakTemperature 5minmax 5minmax MinimumTemperature (TSMIN) MaximumTemperature Preheat (TSMAX) Time(TSMINtoTSMAX),tS RampUpRate(TSMAXtoTL) TimeMaintainedAboveLiquidous(tL) LiquidousTemperature(TL) PeakTemperature(TP) *Note:ThereflowprofileinTable3isrecommendedforboardmanufacturingwithInvenSenseMEMSmicrophones.Allmicrophones arealsocompatiblewiththeJSTD020profile Page5of14 DocumentNumber:DS000281 Revision:1.1 ICS40638 PINCONFIGURATIONSANDFUNCTIONDESCRIPTIONS 3 4 OUTPUT- GND GND 2 OUTPUT+ 5 1 VDD Figure2.PinConfiguration(TopView,TerminalSideDown) TABLE4.PINFUNCTIONDESCRIPTIONS PIN NAME FUNCTION 1 2 OUTPUT+ OUTPUT- AnalogOutputSignal+ AnalogOutputSignal- 3 4 5 GND GND VDD Ground Ground PowerSupply Page6of14 DocumentNumber:DS000281 Revision:1.1 ICS40638 TYPICALPERFORMANCECHARACTERISTICS 20 THD+N(%) NORMALIZEDAMPLITUDE(dB) 10.0 10 0 1.0 0.1 10 20 0.0 10 100 1000 FREQUENCY(Hz) 10000 90 Figure3.TypicalFrequencyResponse(Measured) 130 140 40.0 0 20 41.0 SENSITIVITY(dBV) 40 PSRR(dB) 110 120 INPUTAMPLITUDE(dBSPL) Figure4.THD+Nvs.InputAmplitude 60 80 42.0 43.0 44.0 100 45.0 120 100 1000 FREQUENCY(Hz) 40 10000 20 0 20 40 TEMPERATURE(C) 10.0 1.0 0.1 0.0 40 20 0 20 40 TEMPERATURE(C) 60 80 100 Figure7.THDvs.Temperature Page7of14 DocumentNumber:DS000281 Revision:1.1 60 Figure6.Sensitivityvs.Temperature Figure5.PowerSupplyRejectionRatio(PSRR)vs.Frequency THD@105dBSPL(%) 100 80 100 ICS40638 APPLICATIONSINFORMATION CODECCONNECTION TheICS40638outputcanbeconnectedtoadedicatedcodecmicrophoneinput(seeFigure8)ortoahighinputimpedancegain stage.A0.1FceramiccapacitorplacedclosetotheICS40638supplypinisusedfortestingandisrecommendedtoadequately decouplethemicrophonefromnoiseonthepowersupply.Adcblockingcapacitorisrequiredattheoutputofthemicrophone.This capacitorcreatesahighpassfilterwithacornerfrequencyat fC=1/(2xCxR) whereRistheinputimpedanceofthecodec. Aminimumvalueof2.2FisrecommendedinFigure8forcodecs,whichmayhaveaverylowinputimpedanceatsomePGAgain settings. Figure8.ICS40638ConnectedtoaDifferentialInputCodec Page8of14 DocumentNumber:DS000281 Revision:1.1 ICS40638 SUPPORTINGDOCUMENTS Foradditionalinformation,seethefollowingdocuments. EVALUATIONBOARDUSERGUIDE AN000012,DifferentialAnalogOutputMEMSMicrophoneFlexEvaluationBoard APPLICATIONNOTES AN100,MEMSMicrophoneHandlingandAssemblyGuide AN1003,RecommendationsforMountingandConnectingtheInvenSenseBottomPortedMEMSMicrophones AN1112,MicrophoneSpecificationsExplained AN1124,RecommendationsforSealingInvenSenseBottomPortMEMSMicrophonesfromDustandLiquidIngress AN1140,MicrophoneArrayBeamforming AN1165,OpAmpsforMicrophonePreampCircuits AN000161,ESDDesignandTestGuidelinesforMEMSMicrophones Page9of14 DocumentNumber:DS000281 Revision:1.1 ICS40638 PCBDESIGNANDLANDPATTERNLAYOUT LayoutthePCBlandpatternfortheICS40638ata1:1ratiotothesolderpadsonthemicrophonepackage(seeFigure9.)Takecare toavoidapplyingsolderpastetothesoundholeinthePCB.Figure10showsasuggestedsolderpastestencilpatternlayout. TheresponseoftheICS40638isnotaffectedbythePCBholesize,aslongastheholeisnotsmallerthanthesoundportofthemicro phone(0.375mmindiameter).A0.5mmto1mmdiameterfortheholeisrecommended. AligntheholeinthemicrophonepackagewiththeholeinthePCB.Theexactdegreeofthealignmentdoesnotaffectthe performanceofthemicrophoneaslongastheholesarenotpartiallyorcompletelyblocked. 0.522x0.725(4X) O1.625 O1.025 1.675 0.838 0.822 1.252 Figure9.RecommendedPCBLandPatternLayout 0.422x0.625(4X) O1.625 O1.125 1.675 0.1(4x) 0.822 1.252 Figure10.RecommendedSolderPasteStencilPatternLayout PCBMATERIALANDTHICKNESS TheperformanceoftheICS40638isnotaffectedbyPCBthickness.TheICS40638canbemountedoneitherarigidorflexiblePCB. AflexiblePCBwiththemicrophonecanbeattacheddirectlytothedevicehousingwithanadhesivelayer.Thismountingmethod offersareliablesealaroundthesoundportwhileprovidingtheshortestacousticpathforgoodsoundquality. Page10of14 DocumentNumber:DS000281 Revision:1.1 ICS40638 HANDLINGINSTRUCTIONS PICKANDPLACEEQUIPMENT TheMEMSmicrophonecanbehandledusingstandardpickandplaceandchipshootingequipment.Takecaretoavoiddamagetothe MEMSmicrophonestructureasfollows: Useastandardpickuptooltohandlethemicrophone.Becausethemicrophoneholeisonthebottomofthepackage,the pickuptoolcanmakecontactwithanypartofthelidsurface. Donotpickupthemicrophonewithavacuumtoolthatmakescontactwiththebottomsideofthemicrophone. Donotpullairoutoforblowairintothemicrophoneport. DonotuseexcessiveforcetoplacethemicrophoneonthePCB. REFLOWSOLDER Forbestresults,thesolderingprofilemustbeinaccordancewiththerecommendationsofthemanufacturerofthesolderpasteusedto attachtheMEMSmicrophonetothePCB.Itisrecommendedthatthesolderreflowprofilenotexceedthelimitconditionsspecified inFigure1andTable3. BOARDWASH WhenwashingthePCB,ensurethatwaterdoesnotmakecontactwiththemicrophoneport.Donotuseblowoffproceduresor ultrasoniccleaning. Page11of14 DocumentNumber:DS000281 Revision:1.1 ICS40638 OUTLINEDIMENSIONS d 3.50 (4X) 0.10 0.522X0.725(4x) j 0.10 m C A B A PIN1 CORNER 0.125 PIN1 CORNER 0.82 O1.625 O1.025 (2.45) 2.65 2.650 1 2 5 4 O0.375 0.950 1.675 1.33 3 0.300 0.125 B (3.30) 1.040 1.513 3.500 BOTTOMVIEW TOPVIEW f 0.10 C 0.98 (0.254) SIDEVIEW C Figure11.5TerminalChipArraySmallOutlineNoLeadCavity 3.50mmx2.65mmx0.98mmBody Dimensionsshowninmillimeters Figure12.PackageMarkingSpecification(TopView,nottoscale) ORDERINGGUIDE PART ICS40638 EV_ICS40638FX TEMPRANGE -40Cto +105C -- PACKAGE 5TerminalLGA_CAV QUANTITY 10,000 PACKAGING 13"TapeandReel FlexibleEvaluationBoard -- Page12of14 DocumentNumber:DS000281 Revision:1.1 ICS40638 REVISIONHISTORY REVISIONDATE REVISION DESCRIPTION 11/1/2018 0.1 InitialPreliminaryVersion 1/29/2020 1.0 InitialRelease 4/15/2020 1.1 Correctedtypos Page13of14 DocumentNumber:DS000281 Revision:1.1 ICS40638 COMPLIANCEDECLARATIONDISCLAIMER InvenSensebelievestheenvironmentalandothercomplianceinformationgiveninthisdocumenttobecorrectbutcannot guaranteeaccuracyorcompleteness.Conformitydocumentssubstantiatingthespecificationsandcomponentcharacteristicsareon file.InvenSensesubcontractsmanufacturing,andtheinformationcontainedhereinisbasedondatareceivedfromvendorsand suppliers,whichhasnotbeenvalidatedbyInvenSense. ThisinformationfurnishedbyInvenSense,Inc.("InvenSense")isbelievedtobeaccurateandreliable.However,noresponsibilityisassumedbyInvenSenseforitsuse, orforanyinfringementsofpatentsorotherrightsofthirdpartiesthatmayresultfromitsuse.Specificationsaresubjecttochangewithoutnotice.InvenSense reservestherighttomakechangestothisproduct,includingitscircuitsandsoftware,inordertoimproveitsdesignand/orperformance,withoutpriornotice. InvenSensemakesnowarranties,neitherexpressednorimplied,regardingtheinformationandspecificationscontainedinthisdocument.InvenSenseassumesno responsibilityforanyclaimsordamagesarisingfrominformationcontainedinthisdocument,orfromtheuseofproductsandservicesdetailedtherein.Thisincludes, butisnotlimitedto,claimsordamagesbasedontheinfringementofpatents,copyrights,maskworkand/orotherintellectualpropertyrights. CertainintellectualpropertyownedbyInvenSenseanddescribedinthisdocumentispatentprotected.Nolicenseisgrantedbyimplicationorotherwiseunderany patentorpatentrightsofInvenSense.Thispublicationsupersedesandreplacesallinformationpreviouslysupplied.Trademarksthatareregisteredtrademarksare thepropertyoftheirrespectivecompanies.InvenSensesensorsshouldnotbeusedorsoldinthedevelopment,storage,productionorutilizationofanyconventional ormassdestructiveweaponsorforanyotherweaponsorlifethreateningapplications,aswellasinanyotherlifecriticalapplicationssuchasmedicalequipment, transportation,aerospaceandnuclearinstruments,underseaequipment,powerplantequipment,disasterpreventionandcrimepreventionequipment. (c)2019InvenSense.Allrightsreserved.InvenSense,MotionTracking,MotionProcessing,MotionProcessor,MotionFusion,MotionApps,DMP,AAR,andtheInvenSense logoaretrademarksofInvenSense,Inc.TheInvenSenselogoisatrademarkofInvenSenseCorporation.Othercompanyandproductnamesmaybetrademarksof therespectivecompanieswithwhichtheyareassociated. (c)2019InvenSense.Allrightsreserved. Page14of14 DocumentNumber:DS000281 Revision:1.1