CO LO & MP LI GE AN N T FR EE Features n Compact, space-saving 1206 footprint Applications n Thermal protection for USB-C 2.0, 3.0 and 3.1 cables and ports n Low profile and symmetrical design *R oH S n Small size promotes fast response time n Mobile device fast charging port protection ** HA to thermal runaway events PL IA N T n Ultra-low resistance n RoHS compliant* n Agency recognition: *R oH S CO M P-TCO-N Series - Polymeric Thermal Cutoff Device Electrical Characteristics P-TCO-N400/12 P-TCO-N450/12 Volts Amps Ihold at 23 C Amps 12 50 4.0 12 12 50 50 Thermal Cutoff Max. Time To Trip at 3 A C at 2 A C at 23 C Amps Seconds 80 15 95 15 FR EE Imax 3.5 4.5 Environmental Characteristics 75 20 85 15 90 15 100 10 8.0 10.0 22.5 5.0 5.0 2.0 Resistance Ohms at 23 C RMin. R1Max. 0.002 0.002 0.002 0.022 0.018 0.014 Certifications cUL E174545 TUV R50405491 3 3 3 3 3 3 Ro VE LEA HS RS D CO ION FRE M SA E PL R IA E NT * P-TCO-N350/12 Vmax LE AD Model Operating Temperature.......................................... -40 C to +85 C Storage Condition Before Opening................................................ +40 C max. / 70 % RH max. After Opening................................................... +40 C max. / 10 % RH max. Floor Condition After Opening............................... Consumption within 4 weeks at floor condition +30 C max. / 60 % RH max. Passive Aging........................................................ +85 C, 1000 hours................................................ 10 % typical resistance change Humidity Aging...................................................... +85 C, 85 % R.H. 100 hours................................ 15 % typical resistance change Thermal Shock...................................................... +85 C to -40 C, 20 times..................................... 30 % typical resistance change Solvent Resistance................................................ MIL-STD-202, Method 215.................................... No change (marking still legible) Vibration................................................................ MIL-STD-883C, Method 2007.1,............................ No change (Rmin<R<R1max) Condition A Moisture Sensitivity Level (MSL)........................... See Note ESD Classification - HBM...................................... 6 Test Procedures and Requirements Test Test Conditions Accept/Reject Criteria Visual/Mech........................................................... Verify dimensions and materials............................ Per MF physical description Resistance............................................................. In still air @ 23 C.................................................. Rmin R R1max Time to Trip............................................................ At specified current, Vmax, 23 C.......................... T max. time to trip (seconds) Hold Current.......................................................... 30 min. at Ihold....................................................... No trip Trip Cycle Life........................................................ Vmax, Imax, 100 cycles.......................................... No arcing or burning Trip Endurance...................................................... Vmax, 48 hours...................................................... No arcing or burning Solderability........................................................... 245 C 5 C, 5 seconds....................................... 95 % min. coverage Asia-Pacific: Tel: +886-2 2562-4117 * Email: asiacus@bourns.com EMEA: Tel: +36 88 885 877 * Email: eurocus@bourns.com The Americas: Tel: +1-951 781-5500 * Email: americus@bourns.com www.bourns.com WARNING Cancer and Reproductive Harm - www.P65Warnings.ca.gov * RoHS Directive 2015/863, Mar 31, 2015 and Annex. ** Bourns considers a product to be "halogen free" if (a) the Bromine (Br) content is 900 ppm or less; (b) the Chlorine (Cl) content is 900 ppm or less; and (c) the total Bromine (Br) and Chlorine (Cl) content is 1500 ppm or less. Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. P-TCO-N Series ThermalFuses Cutoff Device MF-NSMF Series- -Polymeric PTC Resettable Product Dimensions A Model B C D E Min. Max. Min. Max. Min. Max. Min. Min. Max. 3.00 (0.118) 3.50 (0.138) 1.40 (0.055) 1.80 (0.071) 0.60 (0.024) 1.10 (0.043) 0.25 (0.010) 0.05 (0.002) 0.45 (0.018) P-TCO-N350/12 P-TCO-N400/12 P-TCO-N450/12 DIMENSIONS: MM (INCHES) Side View Top View A C Terminal material: ENIG-plated terminals Bottom View D E Recommended Pad Layout 1.0 0.05 (.039 .002) 1.0 0.05 (.039 .002) 1.6 0.1 (.063 .004) B 2.0 0.1 (.079 .004) Packaging Quantity 3500 pcs. per reel Thermal Derating Table - Ihold (Amps) Ambient Operating Temperature Model -40 C -20 C 0 C 23 C 40 C 50 C 60 C 70 C 85 C P-TCO-N350/12 5.15 4.66 4.13 3.50 2.98 2.71 2.49 2.00 1.65 P-TCO-N400/12 5.80 5.25 4.65 4.00 3.40 3.10 2.65 2.20 1.80 P-TCO-N450/12 6.10 5.40 4.70 4.50 3.60 3.15 2.70 2.25 1.85 How to Order Typical Part Marking P-TCO - N 350 / 12 - 2 Represents total content. Layout may vary. Polymeric Thermal Cutoff Device N = 1206 footprint Surface Mount Component Hold Current, Ihold 350 - 450 (3.50 Amps - 4.50 Amps) PART IDENTIFICATION: P-TCO-N350/12 = S12 P-TCO-N400/12 = U12 P-TCO-N450/12 = X12 S12 MANUFACTURING DATE CODE IS LOCATED ON PACKING LABEL. Maximum Voltage, Vmax 12 = 12 Volts Packaging -2 = Tape and Reel Packaged per EIA 481 Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. P-TCO-N Series - Polymeric Thermal Cutoff Device 3312 - 2 mm SMD Trimming Potentiometer Solder Reflow Recommendations Notes: tp TP * CRITICAL ZONE T L TO TP RAMP-UP * TL Temperature tL * Ts max RAMP-DOWN Ts min * * ts PREHEAT P-TCO-N models cannot be wave soldered or hand soldered. Please contact Bourns for soldering recommendations. All temperatures refer to topside of the package, measured on the package body surface. If reflow temperatures exceed the recommended profile, devices may not meet the published specifications. Compatible with Pb and Pb-free solder reflow profiles. Excess solder may cause a short circuit, especially during hand soldering. Please refer to the Polymeric Thermal Cutoff Soldering Recommendation guidelines. 25 t 25 C TO PEAK Time Profile Feature Pb-Free Assembly Average Ramp-Up Rate (Ts max to Tp) 3 C / second max. PREHEAT: Temperature Min. (Tsmin) Temperature Max. (Tsmax) Process Time (Tsmin to Tsmax) (ts) Materials Description MAINTAINED ABOVE: 1. TIME Apply solder paste to * Sn 96.5 / Ag 3.0 / Cu 0.5 test Temperature board (8 - 10 mil(T thick) Alloy water soluble or no L) clean solder paste Time (tL) 150 C 200 C Inspect solder joint to determine if solder joint is Time 60~180 seconds Temperature acceptable (i.e. exhibits wetting of joint's surface). Use the following criteria (ref. acceptability of printed board assemblies, IPC-A-610): Interval Room temperature 217 C A) Acceptable (see Figure 1) 60~150 seconds (see note 1) (1) The solder connection wetting angle (solder to component and solder to PCB termination) does not exceed 90 . Peak Temperature (Tp) * single sided epoxy glass 260 C * PCPeak boardTemperature approx. 4x4x.06 in. Time within 5 C of Actual (tp) 20~40 seconds (2) Solder balls that do not violate minimum (G10) (UL approved) 2. Place test units onto board 6 units/board 3. Ramp up Convection oven Ramp-Down Rate 4. Time Preheat25 (TSC ) to Peak Temperature 220 C P-TCO-N Series per EIA 481 0.6 MAX. (.024) Unacceptable (see Figure 2) max. 90 30 s8 ec.minutes B) (1) Solder connection wetting angle exceeding 60-90 sec. 90 . 250 C +0 /-5 (2) Incomplete reflow of solder paste. 10-20 sec. within 5 C of peak (3) Dewetting. Room temperature 3 C 0.5 C/sec. If unacceptable, determine cause and correct prior to 2.0 0.05 1.75 0.10 185 15.4* note 2) next run. MAX. MAX. 1.50 +0.1 / -0 DIA. (.059 +.004 / -0) 8. Cleaning water clean profile 2.5 C 0.5 /sec. 150 C to 190 C 5. Time above liquidus (TL) 6. Peak temperature Specifications (TP) Packaging 7. Ramp down electrical clearances and are attached 6 C / second max. (soldered) to a metal surface. (see note 2) 4.0 0.10(see (.157 .004) High pressure deionized water 65 PSI max. (.079 .002) 72 F to 160 F (22 C to 71 C) As required (.069 .004) NOTES: (7.283) (.606) 1. Water soluble solder paste only above 100K. 2. Refer to ref. temperature profile. Temperature at junction with "K" type thermocouple. 5.50 lead/pad 0.05 (.216 .002) that are board mounted for environmental 3. Units Temperature of Lead/Pad Junction 12.0 0.30 (.472 .012) testing must see a peak temperature in the reflow zone, as specified. This is to ensure that all test units will see "worst case conditions". (Derived using 6-zone Convection Oven) 4.5 MAX. (.177) 1.10 0.10 (.043 .004) COVER TAPE 0.10 down rate to be measured from 245 C to 4.3.50Ramp (.138150 .004) C. 0.1 MAX. (.004) 4.0 0.10 (.157 .004) LEADER MIN. 390 (15.35) P-TCO-N SERIES, REV. A, 02/19 50 MIN. (1.97) HUB DIA. 5. Process Description 8 does not apply to open 10.25 12.4 +1 / -0* TYP. frame trimmers. (.404) (.488 +.039 / -0) 1.90 0.10 (.075 .004) TRAILER MIN. 160 (6.30) *MEASURED AT HUB DIMENSIONS: MM (INCHES) Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. Thermal Cutoff Devices Bourns Polymeric MF-NSMF Series - PTC Resettable Fuses (P-TCO) (R) Application Notice Users are responsible for independent and adequate evaluation of Bourns(R) Polymeric Thermal Cutoff (P-TCO) devices in the user's application, including the P-TCO device characteristics stated in the applicable data sheet. * Polymeric Thermal Cutoff devices must not be allowed to operate beyond their stated maximum ratings. Inadequate adherence to such maximum ratings could result in damage to the P-TCO device and lead to electrical arcing and/or fire. Circuits with inductance may generate a voltage above the rated voltage of the P-TCO devices and should be thoroughly evaluated within the user's application during the P-TCO selection and qualification process. * Polymeric Thermal Cutoff devices are intended to protect against adverse effects of temporary overtemperature conditions and are not intended to serve as protective devices where such conditions are expected to be repetitive or prolonged. * As a normal function of operation, Polymeric Thermal Cutoff devices experience thermal expansion under fault conditions. Thus, a P-TCO device must be protected against mechanical stress, and must be given adequate clearance within the user's application to accommodate such thermal expansion. Rigid potting materials or fixed housings or coverings that do not provide adequate clearance should be thoroughly examined and tested by the user, and may result in the malfunction of P-TCO devices if the thermal expansion is inhibited. * Exposure to lubricants, silicon-based oils, solvents, gels, electrolytes, acids, and other related or similar materials may adversely affect the performance of Polymeric Thermal Cutoff devices. * Aggressive solvents may adversely affect the performance of Polymeric Thermal Cutoff devices. Conformal coating, encapsulating, potting, molding, and sealing materials may contain aggressive solvents including but not limited to xylene and toluene, which are known to cause adverse effects on the performance of P-TCO devices. Such aggressive solvents must be thoroughly cured or baked to ensure complete removal from P-TCO devices to minimize the possible adverse effect on the device. * Recommended storage conditions should be followed at all times. Such conditions can be found on the applicable data sheet and on the Polymeric Thermal Cutoff Device Moisture/Reflow Sensitivity Classification (MSL) note: https://www.bourns.com/ docs/RoHS-MSL/msl_ptco.pdf Asia-Pacific: Tel: +886-2 2562-4117 * Email: asiacus@bourns.com EMEA: Tel: +36 88 885 877 * Email: eurocus@bourns.com The Americas: Tel: +1-951 781-5500 * Email: americus@bourns.com www.bourns.com Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. Legal Disclaimer Notice This legal disclaimer applies to purchasers and users of Bourns(R) products manufactured by or on behalf of Bourns, Inc. and P[ZHSPH[LZJVSSLJ[P]LS)V\YUZ Unless otherwise expressly indicated in writing, Bourns(R) products and data sheets relating thereto are subject to change ^P[OV\[UV[PJL<ZLYZZOV\SKJOLJRMVYHUKVI[HPU[OLSH[LZ[YLSL]HU[PUMVYTH[PVUHUK]LYPM[OH[Z\JOPUMVYTH[PVUPZJ\YYLU[ and complete before placing orders for Bourns(R) products. The characteristics and parameters of a Bourns(R) product set forth in its data sheet are based on laboratory conditions, and statements regarding the suitability of products for certain types of applications are based on Bourns' knowledge of typical requirements in generic applications. 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