MCL4148.MCL4448 Silicon Epitaxial Planar Diodes Features D D D D Saving space Hermetic sealed parts Fits onto SOD 323 / SOT 23 footprints Electrical data identical with the devices 1N4148 and 1N4448 respectively D Micro Melf package Applications 96 12315 Extreme fast switches Absolute Maximum Ratings Tj = 25_C Parameter Repetitive peak reverse voltage Reverse voltage Peak forward surge current Repetitive peak forward current Forward current Average forward current Power dissipation Junction temperature Storage temperature range Test Conditions Type tp=1ms VR=0 Symbol VRRM VR IFSM IFRM IF IFAV PV Tj Tstg Value 100 75 2 450 200 150 500 175 -65...+175 Unit V V A mA mA mA mW C C Symbol RthJA Value 500 Unit K/W Maximum Thermal Resistance Tj = 25_C Parameter Junction ambient Test Conditions mounted on epoxy-glass hard issue, Fig. 1, 35mm copper clad, 0.9 mm2 copper area per electrode TELEFUNKEN Semiconductors Rev. A2, 24-Jun-96 1 (5) MCL4148.MCL4448 Characteristics Tj = 25_C Parameter Forward voltage g Reverse current Breakdown voltage Diode capacitance Rectification efficiency Reverse recovery y time Test Conditions IF=5mA IF=50mA IF=100mA VR=20V VR=20V, Tj=150C VR=75V IR=100mA, tp/T=0.01, tp=0.3ms VR=0, f=1MHz, VHF=50mV VHF=2V, f=100MHz IF=IR=10mA, iR=1mA IF=10mA, VR=6V, iR=0.1xIR, RL=100W Type MCL4448 MCL4148 MCL4448 Symbol VF VF VF IR IR IR V(BR) Min 0.62 Typ 0.86 0.93 Max 0.72 1 1 25 50 5 Unit V V V nA mA mA V 4 pF 8 4 % ns ns 100 CD hr 45 trr trr Typical Characteristics (Tj = 25_C unless otherwise specified) 0.71 1.3 Reflow Soldering 1.27 95 10330 1.2 0.152 9.9 0.6 0.355 25 1.2 0.6 2.4 Figure 2. Recommended foot pads (in mm) 10 Wave Soldering 95 10331 2.5 1.4 95 10329 24 0.7 1.4 0.7 2.8 Figure 1. Board for RthJA definition (in mm) 2 (5) Figure 3. Recommended foot pads (in mm) TELEFUNKEN Semiconductors Rev. A2, 24-Jun-96 MCL4148.MCL4448 1000 LL 4148 IR - Reverse Current ( nA ) IF - Forward Current ( mA ) 1000 100 Scattering Limit 10 1 Tj = 25C 100 Scattering Limit 10 Tj = 25C 0.1 0 0.4 0.8 1.2 1.6 1 VF - Forward Voltage ( V ) 94 9096 1 2.0 Figure 6. Reverse Current vs. Reverse Voltage 3.0 LL 4448 CD - Diode Capacitance ( pF ) IF - Forward Current ( mA ) 1000 100 Scattering Limit 10 1 0 0.4 0.8 1.2 1.6 2.0 1.5 1.0 0.5 0 2.0 VF - Forward Voltage ( V ) Figure 5. Forward Current vs. Forward Voltage TELEFUNKEN Semiconductors Rev. A2, 24-Jun-96 f = 1 MHz Tj = 25C 2.5 Tj = 25C 0.1 94 9097 VR - Reverse Voltage ( V ) 94 9098 Figure 4. Forward Current vs. Forward Voltage 100 10 0.1 94 9099 1 10 100 VR - Reverse Voltage ( V ) Figure 7. Diode Capacitance vs. Reverse Voltage 3 (5) MCL4148.MCL4448 Dimensions in mm 96 12072 4 (5) TELEFUNKEN Semiconductors Rev. A2, 24-Jun-96 MCL4148.MCL4448 Ozone Depleting Substances Policy Statement It is the policy of TEMIC TELEFUNKEN microelectronic GmbH to 1. Meet all present and future national and international statutory requirements. 2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment. It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances ( ODSs). The Montreal Protocol ( 1987) and its London Amendments ( 1990) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances. TEMIC TELEFUNKEN microelectronic GmbH semiconductor division has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents. 1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively 2 . Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental Protection Agency ( EPA) in the USA 3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C ( transitional substances ) respectively. TEMIC can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances. We reserve the right to make changes to improve technical design and may do so without further notice. Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use TEMIC products for any unintended or unauthorized application, the buyer shall indemnify TEMIC against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use. TEMIC TELEFUNKEN microelectronic GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany Telephone: 49 ( 0 ) 7131 67 2831, Fax number: 49 ( 0 ) 7131 67 2423 TELEFUNKEN Semiconductors Rev. A2, 24-Jun-96 5 (5)