9352 120 00118 - Philips Semiconductors / NXP Semiconductors

DATA SH EET

Product speciﬁcation

Supersedes data of 1997 Aug 12

File under Integrated Circuits, IC01

1998 May 07

INTEGRATED CIRCUITS

TDA3606A

Multiple voltage regulator with

battery detection

1998 May 07 2

Philips Semiconductors Product speciﬁcation

Multiple voltage regulator with battery

detection TDA3606A

FEATURES

•One VP-state controlled regulator

•Regulator and reset outputs operate during load dump

•Supply voltage range of −18 to +50 V

•Low quiescent current (battery detection switched off)

•High ripple rejection

•Dual reset output.

PROTECTIONS

•Reverse polarity safe (down to −18 V without high

reverse current)

•Able to withstand voltages up to 18 V at the output

(supply line may be short-circuited)

•ESD protected on all pins

•Load dump protection

•Foldback current limit protection for regulator

•DC short-circuit safe to ground and VP of regulator

output.

GENERAL DESCRIPTION

The TDA3606A is a low power voltage regulator.

It contains:

1. One fixed voltage regulator with a foldback current

protection, intended to supply a microprocessor, that

also operates during load dump

2. A reset-signal can be used to interface with the

microprocessor

3. Supply pin can withstand load dump pulses and

negative supply voltages

4. Defined start-up behaviour; regulator will be switched

on at a supply voltage higher than 7.6 V and off when

the output voltage of the regulator drops below 2.4 V.

QUICK REFERENCE DATA

ORDERING INFORMATION

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supplies

VPsupply voltage

operating regulator on 5.6 14.4 25 V

jump start t ≤10 minutes −−30 V

load dump protection t ≤50 ms; tr≥2.5 ms −−50 V

Iq(tot) total quiescent supply current standby mode −95 120 µA

Voltage regulator

VREG output voltage regulator 7 V ≤VP≤18 V 4.85 5.0 5.15 V

0.5 mA ≤IREG ≤150 mA 4.8 5.0 5.2 V

VREGd drop-out voltage IREG = 150 mA −−0.5 V

TYPE

NUMBER PACKAGE

NAME DESCRIPTION VERSION

TDA3606AT SO20 plastic small outline package; 20 leads; body width 7.5 mm SOT163-1

1998 May 07 3

Philips Semiconductors Product speciﬁcation

Multiple voltage regulator with battery

detection TDA3606A

BLOCK DIAGRAM

Fig.1 Block diagram.

handbook, full pagewidth

MGK597

REGULATOR

LOAD DUMP

PROTECTION

REFERENCE

GND 1 to 3, 8 to 13, 18 to 20

n.c.

TDA3606A

REG

RES2

RES1

(14.4 V) (5 V/150 mA)

BATTERY

BUFFER VO(bat)

VI(bat)

4.7

kΩ

4.7

kΩ

PINNING

SYMBOL PIN DESCRIPTION

n.c. 1 to 3 not connected; heat spreader

VI(bat) 4 battery input voltage

VO(bat) 5 battery detection output voltage

VC6 reset delay capacitor

GND 7 ground (0 V)

n.c. 8 to 13 not connected; heat spreader

RES2 14 reset 2 output

RES1 15 reset 1 output

REG 16 regulator output

VP17 supply voltage

n.c. 18 to 20 not connected; heat spreader

Fig.2 Pin configuration.

handbook, halfpage

n.c.

VI(bat)

VO(bat)

GND

n.c.

RES1

RES2

REG

n.c.

10 11

TDA3606AT

MGK600

1998 May 07 4

Philips Semiconductors Product speciﬁcation

Multiple voltage regulator with battery

detection TDA3606A

FUNCTIONAL DESCRIPTION

The TDA3606A is a voltage regulator intended to supply a

microprocessor (e.g. in car radio applications). Because of

low voltage operation of the application, a low-voltage drop

regulator is used in the TDA3606A.

This regulator will switch on when the supply voltage

exceeds 7.6 V for the first time and will switch off again

when the output voltage of the regulator drops below

2.4 V. When the regulator is switched on, the RES1 and

RES2 outputs (RES2 can only be HIGH when RES1 is

HIGH) will go HIGH after a fixed delay time (fixed by an

external delay capacitor) to generate a reset to the

microprocessor.

RES1 will go HIGH by an internal pull-up resistor of 4.7 kΩ,

and is used to initialize the microprocessor. RES2 is used

to indicate that the regulator output voltage is within its

voltage range. This start-up feature is built-in to secure a

smooth start-up of the microprocessor at first connection,

without uncontrolled switching of the regulator during the

start-up sequence.

All output pins are fully protected. The regulator is

protected against load dump and short-circuit (foldback

current protection).

Interfacing with the microprocessor can be accomplished

by means of a battery Schmitt-trigger and output buffer

(simple full/semi on/off logic applications). The battery

output will go HIGH when the battery input voltage

exceeds the HIGH threshold level.

Fig.3 Timing diagrams.

handbook, full pagewidth

2.1 V

regulator

reset 1

50 V

4.35 V 4.35 V

2.4 V

2 V 2 V

2 V

reset 2

on/off switch

battery input

battery output

reset delay

capacitor

MGB857

1998 May 07 5

Philips Semiconductors Product speciﬁcation

Multiple voltage regulator with battery

detection TDA3606A

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

THERMAL CHARACTERISTICS

Notes

1. On IMS board.

2. On standard board with double sided copper area connected to pins.

QUALITY SPECIFICATION

In accordance with

“SNW-FQ-611E”

. The number of the quality specification can be found in the

“Quality Reference

Handbook”

. The handbook can be ordered using the code 9397 750 00192.

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

VPsupply voltage

operating regulator on −25 V

jump start t ≤10 minutes −30 V

load dump protection t ≤50 ms; tr≥2.5 ms −50 V

VPreverse battery voltage non-operating −−18 V

VI(bat)p positive pulse voltage at battery input VP= 14.4 V; RI=5kΩ− 50 V

VI(bat)n negative pulse voltage at battery input VP= 14.4 V; RI=5kΩ− −100 V

Ptot total power dissipation Tamb =25°C−2.5 W

Tstg storage temperature non-operating −55 +150 °C

Tamb operating ambient temperature −40 +85 °C

Tjjunction temperature operating −40 +150 °C

SYMBOL PARAMETER CONDITIONS VALUE UNIT

Rth (j-p) thermal resistance from junction to pins 20 K/W

Rth (j-a) thermal resistance from junction to

ambient in free air; note 1 50 K/W

in free air; note 2 60 K/W

1998 May 07 6

Philips Semiconductors Product speciﬁcation

Multiple voltage regulator with battery

detection TDA3606A

CHARACTERISTICS

VP= 14.4 V; Tamb =25°C; see Fig.5; unless otherwise speciﬁed.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supplies

VPsupply voltage

operating regulator on; note 1 5.6 14.4 25 V

jump start t ≤10 minutes −−30 V

load dump protection t ≤50 ms, tr≥2.5 ms −−50 V

Iqquiescent current VP= 12.4 V; note 2 −95 120 µA

VP= 14.4 V; note 2 −100 −µA

load dump; VP=50V −520mA

Schmitt-trigger for regulator and reset 1

Vthr rising supply voltage threshold 6.2 7.5 8.2 V

Vthf falling voltage of regulator

threshold IREG = 5 mA 2.1 2.4 2.7 V

IREG =30mA −2.25 −V

Vhys hysteresis −5.1 −V

Schmitt-trigger for battery detection

Vthr rising voltage threshold 1.9 2.05 2.2 V

Vthf falling voltage threshold 1.8 1.95 2.1 V

Vhys hysteresis −0.1 −V

Schmitt-trigger for reset 2

Vthr rising voltage of regulator note 3 4.25 4.45 4.65 V

Vthf falling voltage of regulator note 3 4.15 4.35 4.55 V

Vhys hysteresis −0.1 −V

Reset 1 and reset 2 buffers

Isink LOW-level sink current VRES ≤0.8 V; note 3 2 −−mA

Rpu internal pull-up resistor 3.7 4.7 5.7 kΩ

Reset delay

Iooutput current −0.75 −µA

thr rising voltage threshold 1.4 2.0 2.8 V

tddelay time Cd= 47 nF; note 4 40 125 −ms

Battery buffer

VOL LOW-level output voltage II= 0 mA 0 0.05 0.8 V

VOH HIGH-level output voltage Io=5µA; note 5 −5.0 5.2 V

IOL LOW-level output current VOL ≤0.8 V 0.2 0.5 −mA

IOH HIGH-level output current VOH ≥3 V 0.3 1.0 −mA

1998 May 07 7

Philips Semiconductors Product speciﬁcation

Multiple voltage regulator with battery

detection TDA3606A

Notes

1. Minimum operating voltage, only if VP has exceeded 7.6 V.

2. The quiescent current is measured in standby mode. So, the battery input is connected to a low voltage source and

RL=∞.

3. The voltage of regulator sinks as a result of a supply voltage drop.

4. The delay time can be calculated with the following formula:

5. Battery output voltage will be equal or less than the output voltage of regulator.

6. The drop-out voltage of regulator is measured between VP and VREG.

7. At current limit, Iclr is held constant (behaviour according to dashed line in Fig.4).

8. The foldback current protection limits the dissipated power at short-circuit (see Fig.4).

Regulator (IREG = 5 mA)

Vooutput voltage 0.5 mA ≤IREG ≤150 mA;

7V≤V

P≤18 V 4.8 5.0 5.2 V

18V≤VP≤50 V; load dump;

IREG =30mA 4.75 5.0 5.25 V

Iooutput current load dump; VP>25V −−100 mA

∆VREG line regulation 7 V ≤VP≤18 V −350mV

∆V

REGL load regulation 0.5 mA ≤IREG ≤150 mA −−70 mV

SVRR supply voltage ripple rejection fi= 200 Hz; Vi(p-p) =2V;

o=5mA 55 60 −dB

VREGd drop-out voltage IREG = 150 mA; VP= 5.5 V;

note 6 −0.9 1 V

Iclr current limit VREG > 4.5 V; note 7 0.2 0.27 0.6 A

Iscr short-circuit current RL≤0.5 Ω; note 8 50 80 −mA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

tdCd

Ich

------- dVthr

∫CdVthr

Ich

----------------------- (ms)==

Fig.4 Foldback current protection.

handbook, halfpage

≥50 mA

MGB853

5.0 V

1 V

VREG

Iscr IREG

Iclr

1998 May 07 8

Philips Semiconductors Product speciﬁcation

Multiple voltage regulator with battery

detection TDA3606A

TEST AND APPLICATION INFORMATION

Test information

Fig.5 Test circuit.

(1) Capacitor not required for stability.

handbook, full pagewidth

MGK598

reset 1 output

reset 2 output 1 kΩ

battery output voltage

RL(RES1)

1 kΩ

RL(RES2)

1 kΩ

RL(bat)

TDA3606A

GND

battery input voltage 4

VI(bat)

(1)

regulator output

10 µF

1 kΩ .. 0.5 Ω

RL(REG)

Application information

NOISE

The noise at the output of the regulator depends on the

bandwidth of the regulator, which can be adjusted by

means of the output capacitor. In Table 1 the noise figures

are given.

Table 1 Noise ﬁgures

Note

1. Measured at a bandwidth of 10 Hz to 100 kHz.

The noise on the supply line depends on the value of the

supply capacitor and is caused by a current noise (output

noise of the regulator is translated into a current noise by

means of the output capacitor). When a high frequency

capacitor of 220 nF in parallel with an electrolytic capacitor

OUTPUT

CURRENT

IO(mA)

NOISE FIGURE (µV)(1)

AT OUTPUT CAPACITOR CL(µF)

10 47 100

0.5 58 50 45

50 250 200 180

of 100 µF is connected directly to pins 17 and 7 (supply

and ground) the noise is minimized.

STABILITY

The regulator is stabilized by means of the output

capacitor. The value of the output capacitor can be

selected using the diagram shown in Fig.6. The following

two examples show the effects of the stabilization circuit

using different values for the output capacitor.

Example 1

The regulator is stabilized using an electrolytic output

capacitor of 68 µF (ESR = 0.5 Ω). At −40 °C the capacitor

value is decreased to 22 µF and the ESR is increased to

3.5 Ω. The regulator will remain stable at a temperature of

−40 °C.

Example 2

The regulator is stabilized using an electrolytic output

capacitor of 10 µF (ESR = 3.3 Ω). At −40 °C the capacitor

value is decreased to 3 µF and the ESR is increased to

23.1 Ω. The regulator will be instable at a temperature of

−40 °C. This can be solved using a tantalum capacitor of

10 µF.

1998 May 07 9

Philips Semiconductors Product speciﬁcation

Multiple voltage regulator with battery

detection TDA3606A

Fig.6 Curve for selecting the value of the output capacitor.

(1) Maximum ESR.

(2) Minimum ESR.

handbook, full pagewidth

0.68

(1)

(2)

10 output capacitor (µF)

MBK118

stable region

100 1000

ESR

(Ω)

APPLICATION CIRCUITS

In Fig.7 the quiescent current equals Iq+I

Rdivider.

The specified quiescent current equals Iq. When the

supply voltage is connected, the regulator will switch on

when the supply voltage exceeds 7.6 V. With the aid of a

timing capacitor at pin 6 the reset can be delayed (the

timer starts at the same moment as the regulator is

switched on).

Forced reset can be accomplished by short-circuiting the

timer capacitor by using the push button switch. When the

push button is released again, the timer restarts (only

when the regulator is on) causing a second reset on both

RES1 and RES2.

The maximum output current of the regulator equals:

When Tamb =85°C, the maximum output current equals

138 mA. At lower ambient (Tamb < 0) temperature the

maximum output current equals 320 mA.

Imax 150 Tamb

–

Rth j-a VPVREG

–()×

------------------------------------------------------- 150 Tamb

–

50 VP5–()×

------------------------------------ (mA)==

1998 May 07 10

Philips Semiconductors Product speciﬁcation

Multiple voltage regulator with battery

detection TDA3606A

Fig.7 Typical application.

handbook, full pagewidth

MGK599

TDA3606A

REG

RES1

RES2

VO(bat)

VI(bat)

forced reset used for

8 V detector

on/off

(closed = on)

360 kΩ

100 kΩ

10 µF

2200

µF

choke

coil

1998 May 07 11

Philips Semiconductors Product speciﬁcation

Multiple voltage regulator with battery

detection TDA3606A

PACKAGE OUTLINE

UNIT A

max. A1A2A3bpcD

(1) E(1) (1)

ELL

pQZ

ywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC EIAJ

inches

2.65 0.30

0.10 2.45

2.25 0.49

0.36 0.32

0.23 13.0

12.6 7.6

7.4 1.27 10.65

10.00 1.1

1.0 0.9

0.4 8

0.25 0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

1.1

0.4

SOT163-1

detail X

0.25

075E04 MS-013AC

pin 1 index

0.10 0.012

0.004 0.096

0.089 0.019

0.014 0.013

0.009 0.51

0.49 0.30

0.29 0.050

1.4

0.055

0.419

0.394 0.043

0.039 0.035

0.016

0.01

0.25

0.01 0.004

0.043

0.016

0.01

0 5 10 mm

scale

vMA

(A )

SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1

95-01-24

97-05-22

1998 May 07 12

Philips Semiconductors Product speciﬁcation

Multiple voltage regulator with battery

detection TDA3606A

SOLDERING

Introduction

There is no soldering method that is ideal for all IC

packages. Wave soldering is often preferred when

through-hole and surface mounted components are mixed

on one printed-circuit board. However, wave soldering is

not always suitable for surface mounted ICs, or for

printed-circuits with high population densities. In these

situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.

A more in-depth account of soldering ICs can be found in

our

“Data Handbook IC26; Integrated Circuit Packages”

(order code 9398 652 90011).

Reﬂow soldering

Reflow soldering techniques are suitable for all SO

packages.

Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied

to the printed-circuit board by screen printing, stencilling or

pressure-syringe dispensing before package placement.

Several techniques exist for reflowing; for example,

thermal conduction by heated belt. Dwell times vary

between 50 and 300 seconds depending on heating

method. Typical reflow temperatures range from

215 to 250 °C.

Preheating is necessary to dry the paste and evaporate

the binding agent. Preheating duration: 45 minutes at

45 °C.

Wave soldering

Wave soldering techniques can be used for all SO

packages if the following conditions are observed:

•A double-wave (a turbulent wave with high upward

pressure followed by a smooth laminar wave) soldering

technique should be used.

•The longitudinal axis of the package footprint must be

parallel to the solder flow.

•The package footprint must incorporate solder thieves at

the downstream end.

During placement and before soldering, the package must

be fixed with a droplet of adhesive. The adhesive can be

applied by screen printing, pin transfer or syringe

dispensing. The package can be soldered after the

adhesive is cured.

Maximum permissible solder temperature is 260 °C, and

maximum duration of package immersion in solder is

10 seconds, if cooled to less than 150 °C within

6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal

of corrosive residues in most applications.

Repairing soldered joints

Fix the component by first soldering two diagonally-

opposite end leads. Use only a low voltage soldering iron

(less than 24 V) applied to the flat part of the lead. Contact

time must be limited to 10 seconds at up to 300 °C. When

using a dedicated tool, all other leads can be soldered in

one operation within 2 to 5 seconds between

270 and 320 °C.

1998 May 07 13

Philips Semiconductors Product speciﬁcation

Multiple voltage regulator with battery

detection TDA3606A

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these

products can reasonably be expected to result in personal injury. Philips customers using or selling these products for

use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such

improper use or sale.

Data sheet status

Objective speciﬁcation This data sheet contains target or goal speciﬁcations for product development.

Preliminary speciﬁcation This data sheet contains preliminary data; supplementary data may be published later.

Product speciﬁcation This data sheet contains ﬁnal product speciﬁcations.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or

more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation

of the device at these or at any other conditions above those given in the Characteristics sections of the speciﬁcation

is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the speciﬁcation.

1998 May 07 14

Philips Semiconductors Product speciﬁcation

Multiple voltage regulator with battery

detection TDA3606A

NOTES

1998 May 07 15

Philips Semiconductors Product speciﬁcation

Multiple voltage regulator with battery

detection TDA3606A

NOTES

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Printed in The Netherlands 545102/1200/02/pp16 Date of release: 1998 May 07 Document order number: 9397 750 03768