HLMP-AG64/65, HLMP-AM64/65, HLMP-AB64/65 Precision Optical Performance Red Green and Blue New 5mm Mini Oval LEDs Data Sheet Description Features These Precision Optical Performance Oval LEDs are specifically designed for full color/video and passenger information signs. The oval shaped radiation pattern and high luminous intensity ensure that these devices are excellent for wide field of view outdoor applications where a wide viewing angle and readability in sunlight are essential. The package epoxy contains both UV-A and UV-B inhibitors to reduce the effects of long term exposure to direct sunlight. Well defined spatial radiation pattern High brightness material Available in red, green and blue color Red AlInGaP 626 nm Green InGaN 525nm Blue InGaN 470nm Superior resistance to moisture Standoff Package Tinted and diffused Typical viewing angle 30 x 70 Package Dimensions Applications Package drawing A Full color signs 0.8 max. 0.032 8.70 0.20 0.342 0.008 3.80 0.200 0.150 0.008 0.50 0.10 sq. typ. 0.020 0.004 0.70 max. 0.028 5.20 0.200 0.205 0.008 2.54 0.3 0.100 0.012 cathode lead 1.00 min. 0.038 24.00 min. 0.945 Package drawing B 11.70 0.50 0.4606 0.020 1.50 0.15 0.0591 0.006 0.70 max. 0.028 0.50 0.10 sq. typ. 0.020 0.004 5.20 0.20 0.205 0.008 3.80 0.200 0.150 0.008 2.54 0.3 0.100 0.012 8.70 0.20 0.342 0.008 0.8 max. 0.032 cathode lead 24.00 min. 0.945 1.00 min. 0.038 Notes: All dimensions in millimeters (inches). Caution: INGaN devices are Class 1C HBM ESD sensitive per JEDEC Standard. Please observe appropriate precautions during handling and processing. Refer to Application Note AN - 1142 for additional details. Device Selection Guide Part Number Color and Dominant Luminous Intensity Iv Wavelength d (nm) Typ (mcd) at 20 mA-Min Luminous Intensity Iv (mcd) at 20 mA-Max Standoff Package Drawing HLMP-AG64-X10xx Red 626 1660 3500 No A HLMP-AG65-X10xx Red 626 1660 3500 Yes B HLMP-AM64-140xx Green 525 2900 6050 No A HLMP-AM65-140xx Green 525 2900 6050 Yes B HLMP-AB64-TW0xx Blue 470 800 1660 No A HLMP-AB65-TW0xx Blue 470 800 1660 Yes B Tolerance for each intensity limit is 15%. Notes: 1. The luminous intensity is measured on the mechanical axis of the lamp package. Part Numbering System HL M P-A x 6 x - x x x xx Packaging Option DD: Ammopack ZZ: Flexi Ammopack Color Bin Selection 0: Open distribution Maximum Intensity Bin 0: No maximum intensity limit Minimum Intensity Bin Refer to Device Selection Guide. Standoff/ Non Standoff 4: Non Standoff 5: Standoff Color G: Red 626 M: Green 525 B: Blue 470 Package A: 5mm Mini Oval 30 x 70 Note: Please refer to AB 5337 for complete information about part numbering system. 2 Absolute Maximum Ratings TA = 25C Parameter Red Green and Blue Unit DC Forward Current [1] 50 30 mA Peak Forward Current 100 [2] 100 [3] mA Power Dissipation 120 116 mW Reverse Voltage 5 (IR = 100 A) 5 (IR = 10 A) V LED Junction Temperature 130 110 C Operating Temperature Range -40 to +100 -40 to +85 C Storage Temperature Range -40 to +100 -40 to +100 C Notes: 1. Derate linearly as shown in Figure 4 and Figure 8 2. Duty Factor 30%, frequency 1KHz. 3. Duty Factor 10%, frequency 1KHz. Electrical / Optical Characteristics TA = 25C Parameter Symbol Forward Voltage Red Green Blue VF Reverse Voltage Red Green & blue VR Dominant Wavelength [1] Red Green Blue Peak Wavelength Red Green Blue Thermal Resistance Luminous Efficacy [2] Red Green Blue Min. Typ. Max. 1.8 2.8 2.8 2.1 3.2 3.2 2.4 3.8 3.8 Units Test Conditions V IF = 20 mA V 5 5 d 618 520 460 IF = 100 A IF = 10 A 626 525 470 630 540 480 nm IF = 20 mA PEAK 634 516 464 nm Peak of Wavelength of Spectral Distribution at IF = 20 mA RJ-PIN 240 C/W LED Junction-to-Pin V 150 530 65 lm/W Emitted Luminous Power/ Emitted Radiant Power Notes: 1. The dominant wavelength is derived from the chromaticity Diagram and represents the color of the lamp 2. The radiant intensity, Ie in watts per steradian, may be found from the equation Ie = IV/V where IV is the luminous intensity in candelas and V is the luminous efficacy in lumens/watt. 3 1 50 0.8 40 FORWARD CURRENT - mA RELATIVE INTENSITY AlInGaP Red 0.6 0.4 0.2 0 550 10 700 I F MAX . - MAXIMUM FORWARD CURRENT - mA 2 1.5 1 0.5 0 0 10 20 30 40 DC FORWARD CURRENT - mA Figure 3. Relative Intensity vs Forward Current 0 0.5 1 1.5 FORWARD VOLTAGE - V 2 2.5 80 100 Figure 2. Forward Current vs Forward Voltage 2.5 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 20 0 600 650 WAVELENGTH - nm Figure 1. Relative Intensity vs Wavelength 4 30 50 60 50 40 30 20 10 0 0 20 40 60 TA- AMBIENT TEMPERATURE - CFigure 4. Maximum Forward Current vs Ambient Temperature InGaN Blue and Green 30 1.0 0.9 25 0.7 BLUE 0.6 FORWARD CURRENT - mA RELATIVE INTENSITY 0.8 GREEN 0.5 0.4 0.3 20 15 10 0.2 5 0.1 0.0 380 430 480 530 WAVELENGTH - nm 580 1.6 35 1.4 30 1.2 1 GREEN 0.8 0.6 0.4 1 2 FORWARD VOLTAGE -V 3 4 Figure 6. Forward Current vs Forward Voltage BLUE 25 20 15 10 5 0.2 0 0 5 10 15 20 25 30 35 Figure 7. Relative Intensity vs Forward Current 14 12 10 8 GREEN 4 2 BLUE 0 -2 -4 0 5 10 15 20 25 FORWARD CURRENT - mA Figure 9. Relative dominant wavelength vs Forward Current 0 20 40 60 80 Figure 8. Maximum Forward Current vs Ambient Temperature 16 6 0 T A - AMBIENTTEMPERATURE - C DC FORWARD CURRENT - mA DOMINANT WAVELENGHT SHIFT - nm 0 IF max - MAXIMUM FORWARD CURRENT - mA RELATIVE LUMINOUS INTENSITY (NORMALIZE AT 20 mA) Figure 5. Relative Intensity vs Wavelength 5 0 630 30 35 100 1.0 1.0 Green Blue Red 0.9 0.7 0.6 0.5 0.4 0.3 0.2 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.1 0.0 0.0 -90 -60 -30 0 30 ANGULAR DISPLACEMENT-DEGREE Figure 10. Radiation Pattern-Major Axis 6 Green Blue Red 0.8 NORMALIZED INTENSITY NORMALIZED INTENSITY 0.9 0.8 60 90 -90 -60 -30 0 30 ANGULAR DISPLACEMENT - DEGREE Figure 11. Radiation Pattern-Minor Axis 60 90 Intensity Bin Limit Table (1.2: 1 Iv Bin Ratio) Green Color Bin Table Intensity (mcd) at 20 mA Bin Min Max Bin T 800 960 1 U 960 1150 V 1150 1380 W 1380 1660 X 1660 1990 Y 1990 2400 Z 2400 2900 1 2900 3500 2 3500 4200 3 4200 5040 4 5040 6050 Min Dom Max Dom 520.0 524.0 2 524.0 528.0 3 528.0 532.0 4 5 532.0 536.0 536.0 540.0 Xmin Ymin Xmax Ymax 0.0743 0.8338 0.1856 0.6556 0.1650 0.6586 0.1060 0.8292 0.1060 0.8292 0.2068 0.6463 0.1856 0.6556 0.1387 0.8148 0.1387 0.8148 0.2273 0.6344 0.2068 0.6463 0.1702 0.7965 0.1702 0.7965 0.2469 0.6213 0.2273 0.6344 0.2003 0.7764 0.2003 0.7764 0.2659 0.6070 0.2469 0.6213 0.2296 0.7543 Tolerance for each bin limit is 0.5nm. Tolerance for each bin limit is 15% Blue Color Bin Table VF Bin Table (V at 20mA) Bin ID Min Max VD 1.8 2.0 VA 2.0 2.2 VB 2.2 2.4 Notes: 1. Tolerance for each bin limit is 0.05V 2. VF binning only applicable to Red color. Bin Min Dom Max Dom Xmin Ymin Xmax Ymax 1 460.0 464.0 0.1440 0.0297 0.1766 0.0966 0.1818 0.0904 0.1374 0.0374 2 464.0 468.0 0.1374 0.0374 0.1699 0.1062 0.1766 0.0966 0.1291 0.0495 3 468.0 472.0 4 472.0 476.0 5 476.0 480.0 Red Color Range Max Min Dom Dom 618 630 Xmin Ymin Ymax 0.6872 0.3126 0.6890 0.2943 0.6690 0.3149 0.7080 0.2920 Tolerance for each bin limit is 0.5nm 7 Xmax 0.1291 0.0495 0.1616 0.1209 0.1699 0.1062 0.1187 0.0671 0.1187 0.0671 0.1517 0.1423 0.1616 0.1209 0.1063 0.0945 0.1063 0.0945 0.1397 0.1728 0.1517 0.1423 0.0913 0.1327 Tolerance for each bin limit is 0.5nm Note: 1. All bin categories are established for classification of products. Products may not be available in all bin categories. Please contact your Avago representative for further information. Relative Light Output vs Junction Temperature RELATIVE LIGHT OUTPUT (NORMALIZED AT TJ = 25C) 10 1 Red Blue Green 0.1 -40 -20 0 20 40 60 80 100 120 140 TJ - JUNCTION TEMPERATURE - C Avago Color Bin on CIE 1931 Chromaticity Diagram 1.000 0.800 Green 1 2 3 4 5 Y 0.600 0.400 Red 0.200 Blue 5 4 3 21 0.000 0.000 0.100 0.200 0.300 0.400 X 8 0.500 0.600 0.700 0.800 Precautions: Lead Forming: The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering on PC board. For better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. If manual lead cutting is necessary, cut the leads after the soldering process. The solder connection forms a mechanical ground which prevents mechanical stress due to lead cutting from traveling into LED package. This is highly recommended for hand solder operation, as the excess lead length also acts as small heat sink. Note: 1. PCB with different size and design (component density) will have different heat mass (heat capacity). This might cause a change in temperature experienced by the board if same wave soldering setting is used. So, it is recommended to re-calibrate the soldering profile again before loading a new type of PCB. 2. Avago Technologies' AllnGaP high brightness LED are using high efficiency LED die with single wire bond as shown below. Customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature does not exceed 260C and the solder contact time does not exceeding 5sec. Over-stressing the LED during soldering process might cause premature failure to the LED due to delamination. Avago Technologies LED configuration Soldering and Handling: Care must be taken during PCB assembly and soldering process to prevent damage to the LED component. LED component may be effectively hand soldered to PCB. However, it is only recommended under unavoidable circumstances such as rework. The closest manual soldering distance of the soldering heat source (soldering iron's tip) to the body is 1.59mm. Soldering the LED using soldering iron tip closer than 1.59mm might damage the LED. 1.59mm ESD precaution must be properly applied on the soldering station and personnel to prevent ESD damage to the LED component that is ESD sensitive. Do refer to Avago application note AN 1142 for details. The soldering iron used should have grounded tip to ensure electrostatic charge is properly grounded. Recommended soldering condition: Wave Soldering [1, 2] Manual Solder Dipping Pre-heat temperature 105 C Max. - Preheat time 60 sec Max - Peak temperature 260 C Max. 260 C Max. Dwell time 5 sec Max. 5 sec Max Note: 1. Above conditions refers to measurement with thermocouple mounted at the bottom of PCB. 2. It is recommended to use only bottom preheaters in order to reduce thermal stress experienced by LED. Wave soldering parameters must be set and maintained according to the recommended temperature and dwell time. Customer is advised to perform daily check on the soldering profile to ensure that it is always conforming to recommended soldering conditions. 9 CATHODE ANDOE AlInGaP Device InGaN Device Note: Electrical connection between bottom surface of LED die and the lead frame is achieved through conductive paste. Any alignment fixture that is being applied during wave soldering should be loosely fitted and should not apply weight or force on LED. Non metal material is recommended as it will absorb less heat during wave soldering process. At elevated temperature, LED is more susceptible to mechanical stress. Therefore, PCB must allowed to cool down to room temperature prior to handling, which includes removal of alignment fixture or pallet. If PCB board contains both through hole (TH) LED and other surface mount components, it is recommended that surface mount components be soldered on the top side of the PCB. If surface mount need to be on the bottom side, these components should be soldered using reflow soldering prior to insertion the TH LED. Recommended PC board plated through holes (PTH) size for LED component leads. LED component lead size Diagonal Plated through hole diameter 0.45 x 0.45 mm (0.018x 0.018 inch) 0.636 mm (0.025 inch) 0.98 to 1.08 mm (0.039 to 0.043 inch) 0.50 x 0.50 mm (0.020x 0.020 inch) 0.707 mm (0.028 inch) 1.05 to 1.15 mm (0.041 to 0.045 inch) Over-sizing the PTH can lead to twisted LED after clinching. On the other hand under sizing the PTH can cause difficulty inserting the TH LED. Refer to Application Note 5334 for more information about soldering and handling of high brightness TH LED lamps. Example of Wave Soldering Temperature Profile for TH LED 260C Max TEMPERATURE (C) Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) Flux: Rosin flux Solder bath temperature: 255C 5C (maximum peak temperature = 260C) 105C Max Dwell time: 3.0 sec - 5.0 sec (maximum = 5sec) 60 sec Max Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force. TIME (sec) Ammo Packs Drawing 6.35 1.30 0.250 0.051 12.70 1.00 0.500 0.039 CATHODE 20.5 1.00 0.8070 0.0394 18.00 0.50 0.7085 0.0195 9.125 0.625 0.3595 0.0245 12.70 0.30 0.500 0.012 4.00 0.20 TYP. 0.1575 0.0075 0.70 0.20 0.276 0.0075 VIEW A - A Note: All dimensions in millimeters (inches) 10 Packaging Box for Ammo Packs FROM LEFT SIDE OF BOX ADHESIVE TAPE MUST BE FACING UPWARDS. LABEL ON THIS SIDE OF BOX ANODE LEAD LEAVES THE BOX FIRST. Note: For InGaN device, the ammo pack packaging box contain ESD logo Packaging Label (i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box) (1P) Item: Part Number STANDARD LABEL LS0002 RoHS Compliant e3 max temp 260C (1T) Lot: Lot Number (Q) QTY: Quantity LPN: CAT: Intensity Bin (9D)MFG Date: Manufacturing Date BIN: Refer to below information (P) Customer Item: 11 (V) Vendor ID: (9D) Date Code: Date Code DeptID: Made In: Country of Origin (ii) Avago Baby Label (Only available on bulk packaging) Lamps Baby Label (1P) PART #: Part Number RoHS Compliant e3 max temp 260C (1T) LOT #: Lot Number (9D)MFG DATE: Manufacturing Date QUANTITY: Packing Quantity C/O: Country of Origin Customer P/N: CAT: Intensity Bin Supplier Code: BIN: Refer to below information DATECODE: Date Code Acronyms and Definition: BIN: Example: (i) Color bin only or VF bin only (Applicable for part number with color bins but without VF bin OR part number with VF bins and no color bin) OR (ii) Color bin incorporated with VF Bin (Applicable for part number that have both color bin and VF bin) (i) Color bin only or VF bin only BIN: 2 (represent color bin 2 only) BIN: VB (represent VF bin "VB" only) (ii) Color bin incorporate with VF Bin BIN: 2VB VB: VF bin "VB" 2: Color bin 2 only DISCLAIMER: AVAGO'S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright (c) 2005-2011 Avago Technologies. All rights reserved. AV02-1510EN - April 18, 2011