General Information How to Use This Standard Part Catalog.................................................................................................................................................................................................................... 2 Index by Part Number..................................................................................................................................................................................................................................................... 3 Index by Device and Thermal Resistance............................................................................................................................................................................................................ 4-5 Index by Style and Thermal Resistance................................................................................................................................................................................................................6-8 How to Select a Heat Sink...................................................................................................................................................................................................................................... 9-10 How to Read a Thermal Graph...................................................................................................................................................................................................................................11 Board Mounted Heat Sinks Heat Sinks for IC Packages BGA......................................................................................................................................................................................................................................................... 12-19 DIP........................................................................................................................................................................................................................................................... 21-23 Surface Mount Discrete Semiconductor Packages D-PAK..................................................................................................................................................................................................................................................... 24-25 SO................................................................................................................................................................................................................................................................... 24 SMT Footprints.......................................................................................................................................................................................................................................... 26 Thru-Hole Discrete Semiconductor Packages TO-220.................................................................................................................................................................................................................................................. 27-50 TO-220 and TO-262.......................................................................................................................................................................................................................... 51-53 TO-220, TO-218, and TO-247......................................................................................................................................................................................................... 53-58 TO-220 and TO-202.................................................................................................................................................................................................................................. 59 TO-220, TO-218, TO-247, and Multiwatt.................................................................................................................................................................................... 60-61 TO-218.......................................................................................................................................................................................................................................................... 62 TO-202................................................................................................................................................................................................................................................... 63-64 TO-126.......................................................................................................................................................................................................................................................... 65 SIP............................................................................................................................................................................................................................................................ 66-67 TO-92............................................................................................................................................................................................................................................................. 68 TO-3........................................................................................................................................................................................................................................................ 69-73 TO-66............................................................................................................................................................................................................................................................. 74 TO-5........................................................................................................................................................................................................................................................ 75-76 Axial Lead Devices.................................................................................................................................................................................................................................... 77 Bridge Rectifiers........................................................................................................................................................................................................................................ 77 Options Table of Contents.................................................................................................................................................................................................................................................... 78-79 How to Decipher an Aavid 13 Digit Part Number.............................................................................................................................................................................................. 80 How to Decipher a "Thermalloy" Origin Part Number...................................................................................................................................................................................... 81 Index A, B, C = Aavid Standard Parts w/Options.......................................................................................................................................................................................... 82-84 Index D = "Thermalloy" Origin Parts w/Options................................................................................................................................................................................................. 85 Interface Materials In-SilTM, KonduxTM, Grafoil(R) Pads.............................................................................................................................................................................................................................. 86 Hi-Flow(R), Alignment Pads.......................................................................................................................................................................................................................................... 87 Double Sided Tape Options (Factory Applied).................................................................................................................................................................................................... 88 Labor Saving Heat Sink to Board and Semiconductor Mounts Wave-OnTM Mounts, Semiconductor Mounts, Shur-LockTM Tabs, Solderable Tabs, Solderable Pins......................................................................................... 89-94 Solderable Nuts, Clinch Nuts, Solderable Studs, Device Mounting Studs.......................................................................................................................................... 94-96 Clips Kool-KlipsTM....................................................................................................................................................................................................................................................................... 97 Thermal Clips....................................................................................................................................................................................................................................................................98 Accessories Mounting Kits........................................................................................................................................................................................................................................................................................ 99 Insulating Shoulder Washers......................................................................................................................................................................................................................................................... 100 Insulators-ThermalfilmTM and ThermalfilmTM MT......................................................................................................................................................................................................... 101-102 Insulators-Mica and ThermasilTM III............................................................................................................................................................................................................................................. 103 Insulating Washers/Aluminum Oxide......................................................................................................................................................................................................................................... 104 Insulating Stanchion Pads.............................................................................................................................................................................................................................................................. 105 Insulating Covers................................................................................................................................................................................................................................................................................106 Mounting Pads.......................................................................................................................................................................................................................................................................... 107-109 Finishes.................................................................................................................................................................................................................................................................................................. 110 Card Ejectors & Guides.................................................................................................................................................................................................................................................................... 111 Thermal Greases and Epoxies..............................................................................................................................................................................................................................................112-115 sales.na@aavid.com www.shopaavid.com TABLE OF CONTENTS Table of Contents 1 How to Use This Catalog Base part number Semiconductor device Icons indicate that a mounting kit, grease or epoxy can be used with the heat sink Style description for heat sink TO-220 Heat Sinks Grease & Epoxy page112 Channel style heat sink with folded back fins Semiconductor devices have been included in photos to assist in determining mounting position. Thermal graphs show natural and forced convection based on black anodize finish. For information on how to use a thermal graph, please refer to page 11. Detailed description illustrates the heat sink's differentiating features. 5 80 4 60 3 40 2 20 1 0 0 0 Channel style heat sink with folded back fins for increased cooling surface area. Available with tin plated solderable tabs for easy attachment to the printed circuit card. 4 8 12 16 Heat Dissipated--Watts Part Number Finish 7022BG Channel heat sink with folded back fins Black anodize 7022PBG Channel heat sink with folded back fins Pre-black anodize* With solderable tabs Black anodize 2.90 (0.114) 7022PB-MTG With solderable tabs Pre-black anodize* 2.90 (0.114) Base part no. A TC11-MT 2 G A RoHS Compliant Description Insulated device mounting clip for T0-220 and solderable tabs For additional options see page xx 4.83 (0.190) 14.48 (0.570) 2x 3.81 (0.150) 3.18 (0.125) 2.29 (0.090) 2.67 (0.105) Material and finish information is shown for each part * Edges cut during the manufacturing process will be unfinished. See page XX for more information Code 49.99 (1.968) 21.03 (0.828) TAB 2.02 (0.080) 2x 2.03 (0.080) 24.16 (0.951) Material: 1.27 (0.050) Thick Aluminum Finish: See Table Dia of PCB Plated Thru Hole for Tabs 7022B-MTG Position "X" 20 Ordering information will specify the base heat sink with available accessories. Description POPULAR OPTIONS: 7022B- 2x o 3.81 (0.150) 4.44 (0.175) ORDERING INFORMATION 23.01 (0.906) 50.44 (1.986) 1000 Thermal Resistance From MTG Surface to Ambient--C/Watt 0 Mounting Kits page 99 Mechanical drawing dimensions as shown are mm (inches) 9.52 (0.375) Air Velocity--Feet Per Minute 400 200 600 800 100 Mounting Surface Temp Rise Above Ambient--C GENERAL INFORMATION 7022 Location Details Hole X Page Aavid has a large selection of popular options to enhance your heat sink selection. This section will indicate the most popular options available. Detailed indexes are available to select additional options. sales.na@aavid.com www.shopaavid.com Part Number Page 10-5597-02G 14 10-5597-22G 14 10-5597-33G 14 10-5607-04G 14 10-5607-05G 14 10-5634-01G 12 10-6326-27G 14 10-6326-28G 14 10-6327-01G 14 10-BRD1-01G 12 10-BRD1-03G 12 10-BRD1-04G 12 10-BRD1-05G 12 10-BRD1-07G 12 10-BRD2-01G 12 10-CLS1-01G 12 10-CLS2-01G 12 10-L4LB-03G 14 10-L4LB-05G 14 10-L4LB-11G 14 10-THMA-01G 12 10-TNT2-01G 14 2317B-EP11-BGS1G 18 2319B-TACHG 17 2321B-TACHG 17 2327B-CP50G 16 2327B-TACHG 16 2332B-TACHG 17 2338B-TACHG 17 2342B-TACHG 17 2518B-EP11-BGS2G 18 2519B-EP11-BGS5G 18 2520B-EP04-BGS5G 18 2522B-EP04-BGS5G 18 320105B00000G 76 320205B00000G 76 323005B00000G 76 325705B00000G 76 326005B00000G 76 335114B00032G 19 335211B00000G 19 335211B00032G 19 335214B00000G 19 335214B00032G 19 335214B00034G 19 335224B00032G 17 335224B00034G 16 335314B00000G 19 335314B00032G 19 335314B00035G 19 335324B00032G 16 335714B00000G 19 335714B00032G 19 335724B00032G 17 335814B00000G 19 335814B00032G 19 335824B00032G 17 335824B00034G 16 336314B00000G 19 336624B00032G 17 364424B00032G 17 364424B00034G 16 371824B00032G 17 371824B00034G 16 372024B00032G 17 372024B00034G 16 372924M02000G 14 373024B00032G 17 373024B00034G 16 373224M00032G 17 373324M00032G 17 374024B00032G 17 374024B00035G 16 374024B60023G 12 374124B00032G 17 374124B00035G 16 374124B60023G 12 374224B00032G 17 374224B00035G 16 374224B60023G 12 374324B00032G 17 374324B00035G 16 374324B60023G 12 Part Number 374424B00032G 374424B00035G 374424B60023G 374524B00032G 374524B00035G 374524B60023G 374624B00032G 374624B00035G 374624B60024G 374724B00032G 374724B00035G 374724B60024G 374824B00032G 374824B00035G 374824B60024G 374924B00032G 374924B00035G 374924B60024G 375024B00032G 375024B00035G 375024B60024G 375124B00032G 375124B00035G 375124B60024G 375224B00032G 375324B00035G 375424B00034G 500103B00000G 500203B00000G 500303B00000G 500403B00000G 501000B00000G 501000J00000G 501100B00000G 501200B00000G 501303B00000G 501403B00000G 501503B00000G 501603B00000G 501706B00000G 501806B00000G 501906B00000G 502006B00000G 504102B00000G 504222B00000G 505103B00000G 505303B00000G 505403B00000G 506003B00000G 506304B00000G 506902B00000G 507002B00000G 507102B00000G 507222B00000G 507302B00000G 507302J00000G 508500B00000G 508600B00000G 508700B00000G 513001B02500G 513002B02500G 513101B02500G 513102B02500G 513201B02500G 513202B02500G 513301B02500G 513302B02500G 519703B00000G 519803B00000G 519903B00000G 520103B00000G 520327B00000G 520328B00000G 520329B00000G 529701B02500G 529702B02500G 529801B02500G 529802B02500G 529901B02500G 529902B02500G 530001B02500G 530002B02500G 530101B00100G Page 17 16 12 17 16 12 17 16 12 17 16 12 17 16 12 17 16 12 17 16 12 17 16 12 17 16 16 72 72 72 72 20 20 23 23 70 70 70 70 74 74 74 74 38 38 72 72 72 69 63 41 41 41 41 38 38 23 23 23 58 58 58 58 58 58 58 58 71 71 71 71 69 69 69 56 56 56 56 56 56 56 56 54 Part Number 530101B00150G 530102B00100G 530102B00150G 530161B00162G 530162B00162G 530401B00100G 530401B00150G 530402B00100G 530402B00150G 530510B00000G 530510U00000G 530613B00000G 530614B00000G 530714B00000G 530801B05100G 530801B05150G 530802B05100G 530802B05150G 530861B05162G 530862B05162G 531002B02500G 531002V02500G 531102B02500G 531102V02500G 531202B02500G 531202V02500G 531302B02500G 531302V02500G 532602B02500G 532702B02500G 532802B02500G 533001B02551G 533002B02551G 533101B02551G 533102B02551G 533201B02551G 533202B02551G 533301B02551G 533302B02551G 533401B02552G 533402B02552G 533421B02552G 533422B02552G 533501B02552G 533502B02552G 533521B02552G 533522B02552G 533601B02552G 533602B02552G 533621B02552G 533622B02552G 533701B02552G 533702B02552G 533721B02552G 533722B02552G 533802B02554G 533902B02554G 534002B02554G 534202B02853G 534202B03453G 542502B00000G 542502D00000G 551002B00000G 560200B00000G 560200W00000G 563002B00000G 563002D00000G 566010B00000G 566010B03100G 566010B03400G 566902B00000G 566902B03100G 566902B04000G 569003B00000G 569022B00000G 573100D00000G 573100D00010G 573300D00000G 573300D00010G 573400D00000G 573400D00010G 574004B00000G 574004U00000G Page 54 54 54 54 54 55 55 55 55 66 66 40 40 40 54 54 54 54 54 54 59 59 59 59 59 59 59 59 50 50 50 55 55 55 55 55 55 55 55 57 57 57 57 57 57 57 57 57 57 57 57 57 57 57 57 50 50 50 37 37 49 49 29 20 20 33 33 66 66 66 53 53 53 71 42 24 24 24 24 25 25 63 63 Part Number 574102B00000G 574102B03300G 574204B00000G 574204B03300G 574402B00000G 574402B03200G 574502B00000G 574502B03300G 574602B00000G 574602B03300G 574802B00000G 574802B03300G 574902B00000G 574902B03300G 575002B00000G 575002D00000G 575102B00000G 575200B00000G 575300B00000G 575400B00000G 575603B00000G 575703B00000G 575803B00000G 575903B00000G 576012B00000G 576014B00000G 576103B00000G 576203B00000G 576303B00000G 576403B00000G 576602B00000G 576602D00000G 576802B00000G 576802B03100G 576802B04000G 576802V00000G 576802V03100G 576802V04000G 576802U00000G 576802U03100G 576802U04000G 576904B00000G 577002B00000G 577002B04000G 577102B00000G 577102B04000G 577202B00000G 577202B04000G 577304B00000G 577404B00000G 577500B00000G 577500U00000G 577922B00000G 578105B00000G 578205B00000G 578305B00000G 578405B00000G 578505B00000G 578622B03200G 579003B00000G 579103B00000G 579103V00000G 579206B00000G 579206V00000G 579302B00000G 579402B00000G 579604B00000G 579604B03300G 579704B00000G 579704B03300G 579802B00000G 579802B03300G 579902B00000G 579902B03300G 580100B00000G 580100W00000G 580200B00000G 580200W00000G 580300B00000G 580400B00000G 580500B00000G 580600B00000G 581001B02500G Page 45 45 63 63 45 45 45 45 45 45 43 43 45 45 33 33 46 68 68 68 70 70 70 70 40 40 73 73 73 73 33 33 52 52 52 52 52 52 52 52 52 64 34 34 34 34 34 34 64 64 65 65 40 75 75 75 75 75 40 71 69 69 74 74 46 46 63 63 63 63 43 43 43 43 20 20 20 20 21 22 22 21 61 Part Number 581002B02500G 581101B02500G 581102B02500G 581201B02500G 581202B02500G 584000B00000G 584000B03500G 5900PBG 590102B03600G 590302B03600G 591202B00000G 591202B03100G 591202B04000G 591302B00000G 591302B02800G 591302B04000G 592201B03400G 592502B03400G 592502U03400G 592902B03400G 593002B03400G 593101B03600G 593202B03500G 5FG 6000DG 6000UG 6021BG 6021PBG 6022BG 6022PBG 6025DG 6032DG 6038BG 6043PBG 6046PBG 6047PBG 6049PBG 6094PBG 6109PBG 6110PBG 615653B00250G 6201PBG 6202PBG 6203PBG 6221PBG 6222BG 6223BG 6224BG 6225B-MTG 6230DG 6232B-MTG 6232PB-MTG 6236BG 6236PBG 6237BG 6237PBG 6238BG 6238B-MTG 6239B-MTG 6284BG 6374BG 6380BG 6381BG 6382BG 6396BG 6396B-P2G 6398BG 6398B-P2G 6399BG 6399B-P2G 6400BG 6400B-P2G 700353U01100G 7019BG 7019B-MTG 7019PBG 7020BG 7020B-MTG 7021BG 7021B-MTG 7022BG 7022B-MTG 7022PBG Page 61 61 61 61 61 67 67 32 34 34 51 51 51 51 51 51 62 49 49 33 33 62 48 75 77 77 30 30 47 47 48 47 36 43 64 64 43 43 35 35 19 75 75 75 30 77 77 77 47 30 48 48 39 39 42 42 37 37 37 23 61 60 60 60 60 60 60 60 60 60 60 60 19 27 27 27 27 27 28 28 29 29 29 Part Number 7022PB-MTG 7023BG 7023B-MTG 7025BG 7025B-MTG 7038BG 709203B00400G 7106DG 7106D/TRG 7109DG 7109D/TRG 7128DG 7130DG 7136DG 7137DG 7139DG 7140DG 7141DG 7142DG 7148DG 7173DG 7178DG 799403B01500G 92FG BW38-2G BW38-4G BW50-2G BW50-4G BW63-2G BW63-4G ML26AAG PF432G PF433G PF434G PF435G PF436G PF523G PF526G PF527G PF720G PF723G PF730G PF732G PF750G PF752G PF758G SW25-2G SW25-4G SW25-6G SW38-2G SW38-4G SW38-6G SW50-2G SW50-4G SW63-2G SW63-4G TV1500G TV1505G TV265G TV35G TV4G TV40G TV46G TV47G TV58G TV96G TV97G YB32-4G Page 29 28 28 27 27 67 19 24 24 25 25 36 62 35 42 35 42 38 36 67 39 35 19 68 58 58 58 58 58 58 50 52 52 52 52 52 73 73 73 44 44 65 65 44 44 44 56 56 59 56 56 59 56 56 56 56 32 32 32 31 65 39 31 31 31 53 53 61 sales.na@aavid.com www.shopaavid.com INDEX Index by Part Number 3 Index by Device Cooled and Thermal Resistance Part Number n Board Mounting Page AXIAL LEAD 6000UG 6000DG 15.0 15.0 V V 77 77 BRIDGE RECTIFIERS INDEX 6222BG 6223BG 6224BG 9.4 9.4 9.4 V V V 77 77 77 DIPS 501200B00000G 501100B00000G 501000J00000G 501000B00000G 580300B00000G 580400B00000G 508500B00000G 508600B00000G 580100B00000G 580100W00000G 508700B00000G 6284BG 560200B00000G 560200W00000G 580200B00000G 580200W00000G 580500B00000G 580600B00000G Part Number D2PAK TO-263 573300D00010G 16.0 573300D00000G 16.0 7109D/TRG 9.0 7109DG 9.0 2 D PAK TO-263 SO-10 7106D/TRG 14.0 7106DG 14.0 3 D PAK TO-268 573400D00010G 11.0 573400D00000G 11.0 68.0 67.0 60.0 60.0 39.0 39.0 34.0 32.0 30.0 30.0 27.2 25.0 20.0 20.0 20.0 20.0 20.0 20.0 Bi Directional Air Flow Solder Anchor Push Pin Clip Attachment Tape Attachment H H H H H H H H H H H H H H H H H H 23 23 20 20 21 22 23 23 20 20 23 23 20 20 20 20 22 21 H H H H H 19 12 14 18 16 V V V V V V V V V V V V V 61 60 60 60 60 61 60 60 60 60 60 60 60 MULTIWATT 8.4 6.8 5.8 5.6 5.6 5.0 4.4 4.4 4.2 3.3 3.3 2.7 2.7 SIPS 530510U00000G 530510B00000G 7038BG 7148DG 566010B00000G 566010B03400G 566010B03100G 584000B00000G 584000B03500G 6380BG 6381BG 6382BG 20.6 20.6 16.0 16.0 11.5 11.5 11.5 10.0 10.0 6.8 5.8 4.2 V V V V H-V V H V V V V V 66 66 67 67 66 66 66 67 67 60 60 60 25.0 25.0 H H 24 24 SMT D-PAK TO-252 573100D00010G 573100D00000G 4 Board Mounting Page 575603B00000G 575703B00000G 579103B00000G 579103V00000G 501303B00000G 519803B00000G 575803B00000G PF523G 501403B00000G 505103B00000G 575903B00000G PF526G 15.6 13.4 12.5 12.5 12.0 11.4 11.0 10.1 10.0 10.0 9.8 8.9 Part Number n Board Mounting Page TO-66 H H H H 24 24 25 25 H H 24 24 H H 25 25 TO-3 H H H H H H H H H H H H 70 70 69 69 70 71 70 73 70 72 70 73 579206B00000G 579206V00000G 501706B00000G 501806B00000G 501906B00000G 502006B00000G 22.0 22.0 12.0 9.6 8.0 8.0 H H H H H H 74 74 74 74 74 74 60.0 50.0 40.0 36.1 V V V V 68 68 68 68 35.8 35.8 26.0 26.0 21.6 H-V H-V V V H 65 65 65 65 65 TO-92 575200B00000G 575300B00000G 575400B00000G 92FG TO-126 PF730G PF732G 577500B00000G 577500U00000G TV4G KEY H = Horizontal mount V = Vertical mount IC PACKAGES, BGA, PGA, QFP, LCC YB32-4G 6380BG 6381BG 6396BG 6396B-P2G 6374BG 6398BG 6398B-P2G 6382BG 6399BG 6399B-P2G 6400BG 6400B-P2G n H-V = Either horizontal or vertical depending on device leads n = Natural convection thermal resistance based on a 75C heat sink temperature rise 501503B00000G 501603B00000G 505303B00000G PF527G 500103B00000G 576103B00000G 506003B00000G 500203B00000G 576203B00000G 579003B00000G 505403B00000G 576303B00000G 500303B00000G 569003B00000G 520103B00000G 576403B00000G 500403B00000G 519703B00000G 520329B00000G 520328B00000G 520327B00000G 519903B00000G 8.4 7.8 7.8 7.4 7.2 7.2 7.0 6.2 6.2 6.0 6.0 6.0 5.8 5.5 5.4 5.1 5.0 4.8 4.7 4.7 4.7 4.2 H H H H H H H H H H H H H H H H H H H H H H 70 70 72 73 72 73 69 72 73 71 72 73 72 71 71 73 72 71 69 69 69 71 63.0 63.0 60.0 57.0 56.0 54.0 45.2 43.0 40.0 38.0 38.0 35.0 31.0 28.0 V V V V V V V V V V V V V V 76 76 76 76 76 75 75 75 75 75 75 75 75 75 TO-5 320105B00000G 320205B00000G 325705B00000G 326005B00000G 323005B00000G 6201PBG 5FG 6202PBG 578105B00000G 578205B00000G 6203PBG 578305B00000G 578405B00000G 578505B00000G TO-202 576904B00000G 574004B00000G 574004U00000G 577304B00000G 6046PBG 6047PBG 579604B00000G 579604B03300G 579704B00000G 579704B03300G 577404B00000G 574204B00000G 574204B03300G 506304B00000G 531002B02500G 531002V02500G SW25-6G 531102B02500G 531102V02500G SW38-6G 531302B02500G 531302V02500G 531202V02500G 531202B02500G 32.0 28.0 28.0 27.2 25.0 25.0 24.0 24.0 24.0 24.0 24.0 16.8 16.8 14.4 13.4 13.4 13.0 10.4 10.4 10.0 8.0 8.0 7.5 7.5 H-V V V H-V V V V V V V H-V V V H-V V V V V V V V V V V 64 63 63 64 64 64 63 63 63 63 64 63 63 63 59 59 59 59 59 59 59 59 59 59 24.0 23.1 20.0 19.6 16.8 12.8 13.4 13.0 11.4 11.4 H V H V V V V V V V 53 62 53 61 61 61 58 55 56 56 TO-218 TV96G 7130DG TV97G 581001B02500G 581101B02500G 581201B02500G 513001B02500G 533001B02551G SW25-2G SW25-4G Part Number 533101B02551G 513101B02500G SW38-2G SW38-4G 533201B02551G 513201B02500G SW50-2G SW50-4G 593101B03600G YB32-4G 513301B02500G 533301B02551G 530001B02500G BW63-4G BW38-2G BW38-4G SW63-2G SW63-4G 6380BG 592201B03400G 530101B00100G 530101B00150G 530801B05100G 530801B05150G 530401B00100G 530401B00150G 6381BG BW50-2G BW50-4G 533701B02552G 533721B02552G 6396BG 6396B-P2G 529701B02500G 6374BG 533401B02552G 533421B02552G 529801B02500G BW63-2G 529901B02500G 533501B02552G 533521B02552G 530161B00162G 530861B05162G 6398BG 6398B-P2G 6382BG 533601B02552G 533621B02552G 6399BG 6399B-P2G 6400BG 6400B-P2G n Board Mounting Page 11.0 11.0 10.2 10.2 9.0 9.0 8.8 8.8 8.6 8.4 8.0 8.0 8.0 7.4 7.2 7.2 7.0 7.0 6.8 6.8 6.3 6.3 6.3 6.3 6.3 6.3 5.8 5.8 5.8 5.7 5.7 5.6 5.6 5.5 5.0 5.0 5.0 5.0 4.7 4.5 4.5 4.5 4.4 4.4 4.4 4.4 4.2 3.8 3.8 3.3 3.3 2.7 2.7 V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V 55 58 56 56 55 58 56 56 62 61 58 55 56 58 58 58 56 56 60 62 54 54 54 54 55 55 60 58 58 57 57 60 60 56 61 57 57 56 58 56 57 57 54 54 60 60 60 57 57 60 60 60 60 40.5 35.8 35.8 35.7 34.1 32.6 32.6 32.6 32.6 32.6 32.6 32.0 32.0 29.9 28.9 28.9 28.3 27.3 27.3 27.3 27.1 27.1 26.8 26.8 H V V V V V V H H V V H-V V H-V V V H V H V H-V H-V H-V H 43 65 65 35 43 52 52 52 52 52 52 34 34 31 44 44 35 52 52 52 31 31 51 51 TO-220 6094PBG PF730G PF732G 7178DG 6049PBG 576802V00000G 576802U00000G 576802V03100G 576802U03100G 576802V04000G 576802U04000G 577002B00000G 577002B04000G TV58G PF720G PF723G 7139DG 576802B00000G 576802B03100G 576802B04000G TV46G TV47G 591202B00000G 591202B03100G sales.na@aavid.com www.shopaavid.com Index by Device Cooled and Thermal Resistance 591202B04000G 591302B00000G 591302B02800G 591302B04000G 579802B00000G 579802B03300G 579902B00000G 579902B03300G 577102B00000G 577102B04000G 7173DG 6236BG 6236PBG 6237BG 6237PBG 577202B00000G 577202B04000G 507302B00000G 507302J00000G 542502B00000G 542502D00000G TV96G PF752G 576014B00000G 574402B00000G 574402B03200G 574102B00000G 574102B03300G 6043PBG 592502B03400G 592502U03400G 574602B00000G 574602B03300G 574502B00000G 574502B03300G 6110PBG 576012B00000G 7137DG 7140DG 574802B00000G 574802B03300G PF750G 7142DG 7141DG 530714B00000G PF432G PF433G PF434G PF435G PF436G 506902B00000G TV97G 7136DG 7128DG 566902B00000G 566902B03100G 566902B04000G 6038BG 592902B03400G 6025DG 6025B-TTG ML26AAG 581002B02500G PF758G TV1505G 6109PBG 575102B00000G 579302B00000G 579402B00000G 581102B02500G 530614B00000G 530613B00000G 6022PBG 6022BG 576602B00000G 576602D00000G 574902B00000G 574902B03300G 504102B00000G 507002B00000G n 26.8 26.8 26.8 26.8 26.4 26.4 26.4 26.4 25.9 25.9 25.8 25.0 25.0 25.0 25.0 24.4 24.4 24.0 24.0 24.0 24.0 24.0 23.7 23.2 23.2 23.2 23.2 23.2 23.0 22.0 22.0 21.6 21.6 21.2 21.2 21.0 20.8 20.8 20.8 20.4 20.4 20.3 20.3 20.3 20.3 20.3 20.3 20.3 20.3 20.3 20.0 20.0 19.7 19.2 18.8 18.8 18.8 18.0 17.9 17.9 17.9 17.9 17.4 17.3 17.0 17.0 16.8 16.8 16.8 16.8 16.7 16.7 16.7 16.7 16.6 16.6 16.0 16.0 15.6 15.6 Board Mounting Page V H-V V H V V V V H-V V V V V H H H-V V H-V H-V H H H V H-V H-V H H-V V V V V H-V V H-V V H-V H-V V H H-V V V H V H-V V V H V H V H-V V V H-V H V V V V V H V V V H-V H-V V V V H-V H-V V V V V H-V V H-V H-V 51 51 51 51 43 43 43 43 34 34 39 39 39 42 42 34 34 38 38 49 49 53 44 40 45 45 45 45 43 49 49 45 45 45 45 35 40 42 42 43 43 44 36 38 40 52 52 52 52 52 41 53 35 36 53 53 53 36 33 48 48 50 61 44 32 35 46 46 46 61 40 40 47 47 33 33 45 45 38 41 Part Number 507102B00000G 6225B-MTG TV1500G 575002B00000G 575002D00000G 6238BG 6238B-MTG 6239B-MTG 593002B03400G 534202B02853G 534202B03453G 513002B02500G 531002B02500G 531002V02500G 577922B00000G 578622B03200G TV265G 5900PBG 563002B00000G 563002D00000G 533802B02554G 533002B02551G SW25-6G 581202B02500G 6021BG 6021PBG n 15.6 15.0 14.2 13.6 13.6 13.6 13.6 13.6 13.4 13.4 13.4 13.4 13.4 13.4 13.2 13.2 13.0 13.0 13.0 13.0 13.0 13.0 13.0 12.8 12.5 12.5 Board Mounting Page H-V V V V V H-V V V V V V V V V V V V V V V V V V V V V 41 47 32 33 33 37 37 37 33 37 37 58 59 59 40 40 32 32 33 33 50 55 59 61 30 30 Board Mounting Page Part Number n TV35G BW38-2G BW38-4G SW63-2G SW63-4G 7025BG 7025B-MTG 7021BG 7021B-MTG 6380BG 7022BG 7022PBG 7022B-MTG 7022PB-MTG 504222B00000G 530102B00100G 530102B00150G 530802B05100G 530802B05150G 530402B00100G 530402B00150G 6381BG BW50-2G BW50-4G 533702B02552G 533722B02552G 7.2 7.2 7.2 7.0 7.0 6.8 6.8 6.8 6.8 6.8 6.5 6.5 6.5 6.5 6.4 6.3 6.3 6.3 6.3 6.3 6.3 5.8 5.8 5.8 5.7 5.7 H V V V V V V V V V V V V V H V V V V V V V V V V V 31 58 58 56 56 27 27 28 28 60 29 29 29 29 38 54 54 54 54 55 55 60 58 58 57 57 5.6 5.6 5.5 5.5 5.5 5.0 5.0 5.0 4.8 4.7 4.7 4.5 4.5 4.4 4.4 4.4 4.4 4.4 4.4 4.2 4.2 3.8 5.0 5.0 3.7 3.3 2.7 2.7 2.7 2.6 V V H V V V V V V V V V V V V V V V V V V V V V V V V V V V 60 60 42 50 56 61 57 57 50 58 58 56 57 28 28 54 54 60 60 50 60 57 57 60 56 60 60 60 57 56 H H-V V V 53 53 58 55 NEED HIGHER PERFORMANCE? Aavid also offers the Max Clip SystemTM for discrete power semiconductors featuring simple assembly and high reliability. 6221PBG 6230DG 551002B00000G SW25-2G SW25-4G 590302B03600G 7019BG 7019PBG 7019B-MTG 533902B02554G 513102B02500G 533102B02551G 593202B03500G 531102B02500G 531102V02500G SW38-2G SW38-4G 590102B03600G 6232B-MTG 6232PB-MTG SW38-6G TV40G 507222B00000G 534002B02554G 533202B02551G 513202B02500G SW50-2G SW50-4G 7020BG 7020B-MTG YB32-4G 6032DG 533302B02551G 513302B02500G 531302B02500G 531302V02500G 531202V02500G 531202B02500G 12.5 12.5 12.4 11.4 11.4 11.2 11.0 11.0 11.0 11.0 11.0 11.0 10.4 10.4 10.4 10.2 10.2 10.0 10.0 10.0 10.0 9.9 9.6 9.0 9.0 9.0 8.8 8.8 8.7 8.7 8.4 8.3 8.0 8.0 8.0 8.0 7.5 7.5 V V H V V V V V V V V V V V V V V V V V V H H V V V V V V V V V V V V V V V 30 30 29 56 56 34 27 27 27 50 58 55 48 59 59 56 56 34 48 48 59 39 41 50 55 58 56 56 27 27 61 47 55 58 59 59 59 59 6396BG 6396B-P2G 569022B00000G 532602B02500G 529702B02500G 6374BG 533402B02552G 533422B02552G 532702B02500G BW63-2G BW63-4G 529902B02500G 533502B02552G 7023BG 7023B-MTG 530162B00162G 530862B05162G 6398BG 6398B-P2G 532802B02500G 6382BG 533602B02552G 533622B02552G 6399BG 529802B02500G 6399B-P2G 6400BG 6400B-P2G 533522B02552G 530002B02500G TO-247 TV96G TV97G 513001B02500G 533001B02551G 24.0 20.0 13.4 13.0 Part Number SW25-2G SW25-4G 533101B02551G 513101B02500G SW38-2G SW38-4G 533201B02551G 513201B02500G SW50-2G SW50-4G YB32-4G 533301B02551G 530001B02500G 513301B02500G BW38-2G BW38-4G SW63-2G SW63-4G 6380BG 530101B00100G 530101B00150G 530801B05100G 530801B05150G 530401B00100G 530401B00150G 6381BG BW50-2G BW50-4G 533701B02552G 533721B02552G 6396BBG 6396B-P2G 529701B02500G 6374BG 533401B02552G 533421B02552G 529801B02500G BW63-2G BW63-4G 529901B02500G 533501B02552G 533521B02552G 6398BG 6398B-P2G 530161B00162G 530861B05162G 6382BG 533601B02552G 533621B02552G 6399BG 6399B-P2G 6400BG 6400B-P2G n Board Mounting Page 11.4 11.4 11.0 11.0 10.2 10.2 9.0 9.0 8.8 8.8 8.4 8.0 2.6 8.0 7.2 7.2 7.0 7.0 6.8 6.3 6.3 6.3 6.3 6.3 6.3 5.8 5.8 5.8 5.7 5.7 5.6 5.6 5.5 5.0 5.0 5.0 5.0 4.7 4.7 4.5 4.5 4.5 4.4 4.4 4.4 4.4 4.2 3.8 3.8 3.3 3.3 2.7 2.7 V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V 56 56 55 58 56 56 55 58 56 56 61 55 56 58 58 58 56 56 60 54 54 54 54 55 55 60 58 58 57 57 60 60 56 61 57 57 56 58 58 56 57 57 60 60 54 54 60 57 57 60 60 60 60 27.3 32.6 32.6 27.3 32.6 32.6 27.3 32.6 32.6 26.8 26.8 26.8 26.8 26.8 26.8 20.3 20.3 20.3 20.3 20.3 18.8 18.8 18.8 H-V H-V H-V H H H V V V H-V H V H-V V H V V H V H H-V H V 52 52 52 52 52 52 52 52 52 51 51 51 51 51 51 52 52 52 52 52 53 53 53 INDEX Part Number TO-262 576802B00000G 576802V00000G 576802U00000G 576802B03100G 576802V03100G 576802U03100G 576802B04000G 576802V04000G 576802U04000G 591202B00000G 591202B03100G 591202B04000G 591302B00000G 591302B02800G 591302B04000G PF432G PF433G PF434G PF435G PF436G 566902B00000G 566902B03100G 566902B04000G sales.na@aavid.com www.shopaavid.com 5 Index by Device Cooled, Heat Sink Style, and Thermal Resistance Part Number n Board Mounting Page AXIAL LEAD INDEX Board Mounting Page SMT 6000UG 15.0 V 77 6000DG 15.0 V 77 6222BG 9.4 V 77 6223BG 9.4 V 77 6224BG 9.4 V 77 DIPS Extruded Heat Sinks 501200B00000G 68.0 H 23 501100B00000G 67.0 H 23 508700B00000G 27.2 H 23 6284BG 25.0 H 23 580500B00000G 20.0 H 22 580600B00000G 20.0 H 21 573400D00010G 573400D00000G 14.0 14.0 H H 24 24 24 24 25 25 24 24 25 25 TO-3 Diamond Shaped Basket Heat Sinks Slide On Heat Sinks 501000J00000G 60.0 H 20 575603B00000G 15.6 H 70 501000B00000G 60.0 H 20 575703B00000G 13.4 H 70 580300B00000G 39.0 H 21 501303B00000G 12.0 H 70 580400B00000G 39.0 H 22 508500B00000G 34.0 H 23 508600B00000G 32.0 H 23 580100B00000G 30.0 H 20 580100W00000G 30.0 H 20 560200B00000G 20.0 H 20 560200W00000G 20.0 H 20 580200B00000G 20.0 H 20 580200W00000G 20.0 H 20 H = Horizontal mount V = Vertical mount IC PACKAGES, BGA, PGA, QFP, LCC Bi Directional Air Flow Solder Anchor Push Pin Clip Attachment Tape Attachment H H H H H 19 12 14 18 16 MULTI-WATT Extruded Heat Sinks YB32-4G 8.4 6380BG 6.8 6381BG 5.8 6396BG 5.6 6396B-P2G 5.6 6374BG 5.0 6398BG 4.4 6398B-P2G 4.4 6382BG 4.2 6399BG 3.3 6399B-P2G 3.3 6400BG 2.7 6400B-P2G 2.7 V V V V V V V V V V V V V 61 60 60 60 60 61 60 60 60 60 60 60 60 V V 66 66 V V 67 67 V V V 60 60 60 H-V V H 66 66 66 V V 67 67 SIPS Channel Style Heat Sinks 530510U00000G 20.6 530510B00000G 20.6 Clip On Style Heat Sinks 584000B00000G 10.0 584000B03500G 10.0 Extruded Heat Sinks 6380BG 6.8 6381BG 5.8 6382BG 4.2 Plug In Style Heat Sinks 566010B00000G 11.5 566010B03400G 11.5 566010B03100G 11.5 Slide On Style Heat Sinks 7038BG 16.0 7148DG 16.0 n = n Board Mounting Page 76 76 76 76 76 75 75 75 75 75 75 75 75 75 TO-66 502006B00000G 8.0 H Space Saving Collar Heat Sinks 579206B00000G 22.0 H 579206V00000G 22.0 H Either horizontal or vertical depending on device leads 74 74 74 74 74 74 TO-92 Natural convection thermal resistance based on a 75C heat sink temperature rise 575803B00000G 11.0 H PF523G 10.1 H 501403B00000G 10.0 H 575903B00000G 9.8 H PF526G 8.9 H 501503B00000G 8.4 H 501603B00000G 7.8 H PF527G 7.4 H Hat Section Heat Sink 506003B00000G 7.0 H Space Saving Collar Heat Sinks 579103B00000G 12.5 H 579103V00000G 12.5 H Square Basket Heat Sinks 519803B00000G 11.4 H 505103B00000G 10.0 H 505303B00000G 7.8 H 500103B00000G 7.2 H 576103B00000G 7.2 H 500203B00000G 6.2 H 576203B00000G 6.2 H 579003B00000G 6.0 H 505403B00000G 6.0 H 576303B00000G 6.0 H 500303B00000G 5.8 H 569003B00000G 5.5 H 520103B00000G 5.4 H 576403B00000G 5.1 H 500403B00000G 5.0 H 519703B00000G 4.8 H 519903B00000G 4.2 H Two Piece Heat Sinks 520329B00000G 4.7 H 520328B00000G 4.7 H 520327B00000G 4.7 H Extruded Collar Heat Sinks 320105B00000G 63.0 V 320205B00000G 63.0 V 325705B00000G 60.0 V 326005B00000G 57.0 V 323005B00000G 56.0 V Low Cost Push On Heat Sink 5FG 45.2 V Snap On Cooler Heat Sinks 578105B00000G 40.0 V 578205B00000G 38.0 V 578305B00000G 35.0 V 578405B00000G 31.0 V 578505B00000G 28.0 V Space Saving Collar Heat Sinks 6201PBG 54.0 V 6202PBG 43.0 V 6203PBG 38.0 V Diamond Shaped Basket Heat Sinks 501706B00000G 12.0 H 501806B00000G 9.6 H 501906B00000G 8.0 H KEY H-V = Part Number TO-5 D-Pak TO-252 573100D00010G 15.0 H 573100D00000G 15.0 H D2 Pak TO-263 573300D00010G 18.0 H 573300D00000G 18.0 H 7109D/TRG 11.0 H 7109DG 11.0 H D2 Pak TO-263 SO10 (MO-184) 7106D/TRG 15.0 H 7106DG 15.0 H D3 Pak TO-268 BRIDGE RECTIFIERS 6 n Part Number 70 73 70 70 73 70 70 73 69 69 69 71 72 72 72 73 72 73 71 72 73 72 71 71 73 72 71 71 69 69 69 Clip On Style Heat Sink 92FG 36.1 Slip On Style Heat Sinks 575200B00000G 60.0 575300B00000G 50.0 575400B00000G 40.0 V 68 V V V 68 68 68 H 65 H-V H-V V V 65 65 65 65 TO-126 Channel Style Heat Sink TV4G 21.6 Slip On Style Heat Sinks PF730G 35.8 PF732G 35.8 577500B00000G 26.0 577500U00000G 26.0 TO-202 Channel Style Heat Sinks 576904B00000G 32.0 H-V 577304B00000G 27.2 H-V 577404B00000G 24.0 H-V Compact Slide On Heat Sinks 6046PBG 25.0 V 6047PBG 25.0 V Extruded Heat Sinks 531002B02500G 13.4 V 531002V02500G 13.4 V SW25-6G 13.0 V 531102B02500G 10.4 V 531102V02500G 10.4 V SW38-6G 10.0 V 531302B02500G 8.0 V 531302V02500G 8.0 V 531202V02500G 7.5 V 531202B02500G 7.5 V Low Cost Slide On Heat Sinks 574004B00000G 28.0 V 574004U00000G 28.0 V 64 64 64 64 64 59 59 59 59 59 59 59 59 59 59 63 63 sales.na@aavid.com www.shopaavid.com Index by Device Cooled, Heat Sink Style, and Thermal Resistance n Board Mounting Page TO-202 CONTINUED Low Cost Slide On Cooler Heat Sinks 579604B00000G 24.0 V 579604B03300G 24.0 V 579704B00000G 24.0 V 579704B03300G 24.0 V 574204B00000G 16.8 V 574204B03300G 16.8 V Low Profile Hat Section Heat Sink 506304B00000G 14.4 H-V Space Saving Staggered Heat Sink 6034DG 8.3 V 63 63 63 63 63 63 63 64 TO-218 Channel Style Heat Sink 593101B03600G 8.6 V Dual Extruded Heat Sinks 533721B02552G 5.7 V 533421B02552G 5.0 V 533521B02552G 4.5 V 533621B02552G 3.8 V Dual High Rise Style Heat Sinks 530161B00162G 4.4 V 530861B05162G 4.4 V Extruded Heat Sinks 581001B02500G 19.6 V 581101B02500G 16.8 V 513001B02500G 13.4 V 533001B02551G 13.0 V 581201B02500G 12.8 V SW25-2G 11.4 V SW25-4G 11.4 V 533101B02551G 11.0 V 513101B02500G 11.0 V SW38-2G 10.2 V SW38-4G 10.2 V 533201B02551G 9.0 V 513201B02500G 9.0 V SW50-2G 8.8 V SW50-4G 8.8 V YB32-4G 8.4 V 533301B02551G 8.0 V 530001B02500G 8.0 V 513301B02500G 8.0 V BW63-4G 7.4 V BW38-2G 7.2 V BW38-4G 7.2 V SW63-2G 7.0 V SW63-4G 7.0 V 6380BG 6.8 V BW50-2G 5.8 V BW50-4G 5.8 V 6381BG 5.8 V 533701B02552G 5.7 V 6396BG 5.6 V 6396B-P2G 5.6 V 529701B02500G 5.5 V 533401B02552G 5.0 V 529801B02500G 5.0 V BW63-2G 4.7 V 529901B02500G 4.5 V 533501B02552G 4.5 V 6398BG 4.4 V 6398B-P2G 4.4 V 6382BG 4.2 V 533601B02552G 3.8 V 6399BG 3.3 V 6399B-P2G 3.3 V 6400BG 2.7 V 6400B-P2G 2.7 V 6374BG 5.0 V Part Number n Board Mounting Page Hat Section Heat Sinks TV96G 24.0 TV97G 20.0 High Rise Style Heat Sinks 530101B00100G 6.3 530101B00150G 6.3 530801B05100G 6.3 530801B05150G 6.3 530401B00100G 6.3 530401B00150G 6.3 Plug In Style Heat Sink 592201B03400G 6.8 Slide On Heat Sink 7130DG 23.1 H H-V 53 53 V V V V V V 54 54 54 54 55 55 V 62 V 62 TO-220 62 57 57 57 57 54 54 61 61 58 55 61 56 56 55 58 56 56 55 58 56 56 61 55 56 58 58 58 58 56 56 60 58 58 60 57 60 60 56 57 56 58 56 57 60 60 60 57 60 60 60 60 61 Channel Style Heat Sinks 7178DG 35.7 V 35 577002B04000G 32.0 V 35 577002B00000G 32.0 H-V 35 TV58G 29.9 H-V 31 7139DG 28.3 H 35 NEED HIGHER PERFORMANCE? Aavid also offers the Max Clip SystemTM for discrete power semiconductors featuring simple assembly and high reliability. TV46G TV47G 577102B00000G 577102B04000G 7173DG 6236BG 6236PBG 577202B00000G 577202B04000G 507302B00000G 507302J00000G 576014B00000G 6110PBG 576012B00000G 7142DG 7141DG 530714B00000G 7136DG 7128DG 6038BG 592902B03400G 6109PBG TV1505G 530614B00000G 530613B00000G 576602B00000G 576602D00000G 504102B00000G TV1500G 575002B00000G 575002D00000G 6238BG 6238B-MTG 6239B-MTG 593002B03400G 27.1 27.1 25.9 25.9 25.8 25.0 25.0 24.4 24.4 24.0 24.0 23.2 21.0 20.8 20.3 20.3 20.3 19.7 19.2 18.0 17.9 17.0 17.0 16.7 16.7 16.6 16.6 15.6 14.2 13.6 13.6 13.6 13.6 13.6 13.4 H-V H-V H-V V V V V H-V V H-V H-V H-V H-V H-V H V H-V V V V V H-V V H-V H-V V V H-V V V V H-V V V V 31 31 35 35 39 39 39 35 35 39 39 41 35 41 36 38 41 35 36 36 33 35 32 41 41 34 34 39 32 34 34 37 37 37 33 Part Number n Board Mounting Page 534202B02853G 13.4 V 534202B03453G 13.4 V 577922B00000G 13.2 V 578622B03200G 13.2 V 563002B00000G 13.0 V 563002D00000G 13.0 V TV265G 13.0 V 5900PBG 13.0 V 6021BG 12.5 V 6021PBG 12.5 V 6221PBG 12.5 V 6230DG 12.5 V 551002B00000G 12.4 H 590302B03600G 11.2 V 7019BG 11.0 V 7019PBG 11.0 V 7019B-MTG 11.0 V 590102B03600G 10.0 V TV40G 9.9 H 7020BG 8.7 V 7020B-MTG 8.7 V TV35G 7.2 H 7025BG 6.8 V 7025B-MTG 6.8 V 7021BG 6.8 V 7021B-MTG 6.8 V 7022BG 6.5 V 7022PBG 6.5 V 7022B-MTG 6.5 V 7022PB-MTG 6.5 V 504222B00000G 6.4 H 7023BG 4.4 V 7023B-MTG 4.4 V Clip On Style Heat Sinks 6094PBG 40.5 H 6049PBG 34.1 V 579802B00000G 26.4 V 579802B03300G 26.4 V 579902B00000G 26.4 V 579902B03300G 26.4 V 6043PBG 23.0 V 574802B00000G 20.4 H-V 574802B03300G 20.4 V Dual Extruded Heat Sinks 6380BG 6.8 V 6381BG 5.8 V 533722B02552G 5.7 V 533422B02552G 5.0 V 6374BG 5.0 V 6382BG 4.2 V 533622B02552G 3.8 V 533522B02552G 2.7 V Dual High Rise Style Heat Sinks 530162B00162G 4.4 V 530862B05162G 4.4 V Extruded Heat Sinks ML26AAG 17.9 H 581002B02500G 17.4 V 581102B02500G 16.8 V 513002B02500G 13.4 V 531002B02500G 13.4 V 531002V02500G 13.4 V 533802B02554G 13.0 V 533002B02551G 13.0 V SW25-6G 13.0 V 581202B02500G 12.8 V SW25-2G 11.4 V SW25-4G 11.4 V 533902B02554G 11.0 V 533102B02551G 11.0 V 513102B02500G 11.0 V 531102B02500G 10.4 V 531102V02500G 10.4 V 38 38 41 41 34 34 32 32 30 30 30 30 30 34 27 27 27 34 39 27 27 31 27 27 28 28 29 29 29 29 39 28 28 INDEX Part Number 43 43 44 44 44 44 43 44 44 60 60 57 57 61 60 57 57 54 54 50 61 61 58 59 59 50 55 59 61 56 56 50 55 58 59 59 sales.na@aavid.com www.shopaavid.com 7 Index by Device Cooled, Heat Sink Style, and Thermal Resistance Part Number n Board Mounting Page INDEX 8 V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V 56 56 59 50 55 58 56 56 61 55 56 58 59 59 59 59 58 58 56 56 58 58 57 60 60 50 56 57 50 58 58 56 57 60 60 50 57 56 60 60 60 60 H H H V H V H-V H-V H-V H 42 42 53 42 42 42 53 42 42 42 V V V V V V 54 54 54 54 55 55 V V V H H H V V V H-V H V H-V V 52 52 52 52 52 52 52 52 52 51 51 51 51 51 Board Mounting Page 591302B04000G 26.8 PF432G 20.3 PF433G 20.3 PF434G 20.3 PF435G 20.3 PF436G 20.3 566902B00000G 18.8 566902B03100G 18.8 566902B04000G 18.8 Slide On Heat Sinks PF730G 35.8 PF732G 35.8 PF720G 28.9 PF723G 28.9 PF752G 23.7 574402B00000G 23.2 574402B03200G 23.2 574102B00000G 23.2 574102B03300G 23.2 574602B00000G 21.6 574602B03300G 21.6 574502B00000G 21.2 574502B03300G 21.2 PF750G 20.3 PF758G 17.3 574902B00000G 16.0 574902B03300G 16.0 TO-220 CONTINUED SW38-2G 10.2 SW38-4G 10.2 SW38-6G 10.0 534002B02554G 9.0 533202B02551G 9.0 513202B02500G 9.0 SW50-2G 8.8 SW50-4G 8.8 YB32-4G 8.4 533302B02551G 8.0 530002B02500G 2.6 513302B02500G 8.0 531302B02500G 8.0 531302V02500G 8.0 531202V02500G 7.5 531202B02500G 7.5 BW38-2G 7.2 BW38-4G 7.2 SW63-2G 7.0 SW63-4G 7.0 BW50-2G 5.8 BW50-4G 5.8 533702B02552G 5.7 6396BG 5.6 6396B-P2G 5.6 532602B02500G 5.5 529702B02500G 5.5 533402B02552G 5.0 532702B02500G 4.8 BW63-2G 4.7 BW63-4G 4.7 529902B02500G 4.5 533502B02552G 4.5 6398BG 4.4 6398B-P2G 4.4 532802B02500G 4.2 533602B02552G 3.8 529802B02500G 3.7 6399BG 3.3 6399B-P2G 3.3 6400BG 2.7 6400B-P2G 2.7 Hat Section Heat Sinks 6237BG 25.0 6237PBG 25.0 TV96G 24.0 7137DG 20.8 7140DG 20.8 506902B00000G 20.0 TV97G 20.0 507002B00000G 15.6 507102B00000G 15.6 507222B00000G 9.6 High Rise Style Heat Sinks 530102B00100G 6.3 530102B00150G 6.3 530802B05100G 6.3 530802B05150G 6.3 530402B00100G 6.3 530402B00150G 6.3 Plug In Style Heat Sinks 576802B00000G 27.3 576802V00000G 32.6 576802U00000G 32.6 576802B03100G 27.3 576802V03100G 32.6 576802U03100G 32.6 576802B04000G 27.3 576802V04000G 32.6 576802U04000G 32.6 591202B00000G 26.8 591202B03100G 26.8 591202B04000G 26.8 591302B00000G 26.8 591302B02800G 26.8 n Part Number H V V H V H H-V H V 51 52 52 52 52 52 53 53 53 V V V V V H-V H H-V V H-V V H-V V V V H-V V 65 65 44 44 44 45 45 45 45 45 45 45 45 44 44 45 45 KEY H = Horizontal mount V = Vertical mount H-V = n = Either horizontal or vertical depending on device leads Natural convection thermal resistance based on a 75C heat sink temperature rise Snap Down Style Heat Sinks 575102B00000G 16.8 H-V 46 579302B00000G 16.8 V 46 579402B00000G 16.8 V 46 49 Space Saving Heat Sinks 542502B00000G 24.0 H 542502D00000G 24.0 H 49 592502B03400G 22.0 V 49 592502U03400G 22.0 V 49 6025DG 17.9 V 48 6022PBG 16.7 V 47 6022BG 16.7 V 47 6225B-MTG 15.0 V 47 593202B03500G 10.4 V 48 6232B-MTG 10.0 V 48 6232PB-MTG 10.0 V 48 8.3 V 47 H 42 6032DG Square Basket Heat Sink 569022B00000G 5.5 TO-247 Dual Extruded Heat Sinks 533721B02552G 5.7 V 533421B02552G 5.0 V 533521B02552G 4.5 V 533621B02552G 3.8 V Dual High Rise Style Heat Sinks 530161B00162G 4.4 V 530861B05162G 4.4 V Extruded Heat Sinks 513001B02500G 13.4 V 533001B02551G 13.0 V SW25-2G 11.4 V SW25-4G 11.4 V 57 57 57 57 54 54 58 55 56 56 Part Number n Board Mounting Page 533101B02551G 11.0 513101B02500G 11.0 SW38-2G 10.2 SW38-4G 10.2 533201B02551G 9.0 513201B02500G 9.0 SW50-2G 8.8 SW50-4G 8.8 YB32-4G 8.4 533301B02551G 8.0 530001B02500G 8.0 513301B02500G 8.0 BW38-2G 7.2 BW38-4G 7.2 SW63-2G 7.0 SW63-4G 7.0 6380BG 6.8 BW50-2G 5.8 BW50-4G 5.8 6381BG 5.8 533701B02552G 5.7 6396BG 5.6 6396B-P2G 5.6 529701B02500G 5.5 533401B02552G 5.0 6374BG 5.0 529801B02500G 5.0 BW63-2G 4.7 BW63-4G 4.7 529901B02500G 4.5 533501B02552G 4.5 6398BG 4.4 6398B-P2G 4.4 6382BG 4.2 533601B02552G 3.8 6399BG 3.3 6399B-P2G 3.3 6400BG 2.7 6400B-P2G 2.7 Hat Section Heat Sinks TV96G 24.0 TV97G 20.0 High Rise Style Heat Sinks 530101B00100G 6.3 530101B00150G 6.3 530801B05100G 6.3 530801B05150G 6.3 530401B00100G 6.3 530401B00150G 6.3 V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V 55 58 56 56 55 58 56 56 61 55 56 58 58 58 56 56 60 58 58 60 57 60 60 56 57 61 56 58 58 56 57 60 60 60 57 60 60 60 60 H H-V 53 53 V V V V V V 54 54 54 54 55 55 H-V H-V H-V H H H V V V H-V H V H-V V H H-V H V V V H V H 52 52 52 52 52 52 52 52 52 51 51 51 51 51 51 53 53 53 52 52 52 52 52 TO-262 Plug In Style Heat Sinks 576802B00000G 27.3 576802V00000G 32.6 576802U00000G 32.6 576802B03100G 27.3 576802V03100G 32.6 576802U03100G 32.6 576802B04000G 27.3 576802V04000G 32.6 576802U04000G 32.6 591202B00000G 26.8 591202B03100G 26.8 591202B04000G 26.8 591302B00000G 26.8 591302B02800G 26.8 591302B04000G 26.8 566902B00000G 18.8 566902B03100G 18.8 566902B04000G 18.8 PF432G 20.3 PF433G 20.3 PF434G 20.3 PF435G 20.3 PF436G 20.3 sales.na@aavid.com www.shopaavid.com How To Select a Heat Sink How to select a heat sink The basic equation for heat transfer or power dissipation may be stated as follows: HOW TO SELECT A HEAT SINK T PD = R Where: PD = the power dissipated by the semiconductor device in watts. T = the temperature difference of driving potential which causes the flow of heat. R= the sum of the thermal resistances of the heat flow path across which T exists. The above relationship may be stated in the following forms: TC-TA TJ-TA PD = PD = RCS + RSA RJC + RCS + RSA PD = TS-TA RSA Where: TJ = the junction temperature in C (maximum is usually stated by the manufacturer of the semiconductor device). TC = case temperature of the semiconductor device in C. TS = temperature of the heat sink mounting surface in thermal contact with the semiconductor device in C. TA = ambient air temperature in C. RJC = thermal resistance from junction to case of the semiconductor device in C per watt (usually stated by manufacturer of semiconductor device). RCS = thermal resistance through the interface between the semiconductor device and the surface on which it is mounted in C per watt. RSA = thermal resistance from mounting surface to ambient or thermal resistance of heat sink in C per watt. The above equations are generally used to determine the required thermal resistance of the heat sink (RSA), since the heat dissipation, maximum junction and/or case temperature, and ambient temperature are known or set. The common practice is to represent the system with a network of resistances in series as shown in Figure 2. Figure 1 indicates the location of the various heat flow paths, temperatures and thermal resistances. FIGURE 1 FIGURE 2 Mounting surface (cooler/dissipator) Atmosphere or ambient Interface T Junction (heat source) A TC TJ P P D TS TA D Semiconductor case RJC R R CS RCS RSA SA Heat flow path mounting surface to ambient, equation (3) R T JC T T J C S Heat flow path case to ambient equation (2) Heat flow path junction to ambient, equation (1) T A sales.na@aavid.com www.shopaavid.com 9 Example A Example B Find a space saving heat sink to keep a TO-220 device below the maximum 150C junction temperature in natural convection. Device will be screw mounted with an electrically conductive interface. Find a heat sink to keep a TO-220 device below the maximum 150 C junction temperature in forced convection at 400 ft/min. Device must be electrically insulated and mounted with a labor saving clip. Given: PD = 6 watts RJC = 3C/W (from semiconductor manufacturer) TJ max = 150C (from semiconductor manufacturer) TA max = 65C A KonduxTM pad is a good choice for electrically conductive applications. Thermal resistance for KonduxTM can be determined from the following graph. Typical TO-220 Performance 0.60 R Given: PD = 12 watts RJC = 2.5C/W (from semiconductor manufacturer) TJ max = 140C (from semiconductor manufacturer) TA max = 50C A Hi-Flow(R) pad works great with clip mounting and provides the necessary electrical insulation. Thermal resistance for Hi-Flow(R) at low pressure is 1.15C/W (from page 87). Using equation 1, solve for RSA RSA = 140 - 50 - (2.5 + 1.15) = 3.85C/W 12 0.40 0.30 0.20 0.10 0.00 0 1 2 3 4 Screw Torque (in-lb) 5 6 Many styles are available. If board space is a concern, 533202B02551G (pg 55) meets the requirements. 0 At 2 in-lb of torque the thermal resistance is approximately RCS = 0.5C/W Mounting Surface Temp Rise Above Ambient--C RSA = 150 - 65 - ( 3 + 0.5) = 10.7C/W 6 The Index by Heat Sink Style on page 8 lists space saving heat sinks. Several models are in the 10 C/W range. Choose the one that best fits the application and verify thermal resistance from graph. 200 Air Velocity--Feet Per Minute 400 600 800 Mounting Surface Temp Rise Above Ambient--C 1000 10 80 8 60 6 40 4 20 2 0 0 0 2 4 6 Heat Dissipated--Watts 8 Thermal Resistance From MTG Surface to Ambient--C/Watt Part number 593202B03500G shows a 60 C temperature rise at 6 watts. 1000 10 80 8 60 6 40 4 20 2 0 0 0 53320X 53330X 0 Air Velocity--Feet Per Minute 400 600 800 100 Using equation 1, solve for RSA 100 200 2 4 6 Heat Dissipated--Watts 8 Thermal Resistance From MTG Surface to Ambient--C/Watt (C/W) 0.50 CS HOW TO SELECT A HEAT SINK How To Select a Heat Sink 10 According to the above graph, an airflow of 400 ft/min results in a thermal resistance of 3C/W. This is less than the required thermal resistance of 3.85C/W and is therefore acceptable under these airflow conditions. If height is a concern, 533702B02552G would meet the requirements and is only 1.0" tall Hi-Flow(R) is a trademark of the Bergquist Company 10 RSA = 60 = 10.0C/W 6 Which meets the above requirement in natural convection. 10 sales.na@aavid.com www.shopaavid.com 200 Air Velocity--Feet Per Minute 400 600 800 1000 20 80 16 60 12 40 8 20 4 0 0 0 1 2 3 4 Heat Dissipated--Watts EXAMPLE: The output air volume of a fan is given as 80 CFM. The output area is 6 inches by 6 inches or 36 in2 or 25 ft2. To find velocity: 1000 20 80 16 60 12 40 8 20 4 0 0 1 2 3 Heat Dissipated--Watts 4 Thermal Resistance From MTG Surface to Ambient--C/Watt Air Velocity--Feet Per Minute 400 600 800 100 200 5 GRAPH A is used to show heat sink performance when used in a natural convection environment (i.e. without forced air). This graph starts in the lower left hand corner with the horizontal axis representing the heat dissipation (watts) and the vertical left hand axis representing the rise in heat sink mounting surface temperature above ambient (C). By knowing the power to be dissipated, the temperature rise of the mounting surface can be predicted. Thermal resistance in natural convection is determined by dividing this temperature rise by the power input (C/W). EXAMPLE A: Aavid part number 579802 is to be used to dissipate 3 watts of power in natural convection. Because we are dealing with natural convection, we refer to graph "A". Knowing that 3 watts are to be dissipated, follow the grid line to the curve and find that at 3 watts there is a temperature rise of 75C. To get the thermal resistance, divide the temperature rise by the power dissipated, which yields 25C/W. Although most fans are normally rated and compared at their free air delivery at zero back pressure, this is rarely the case in most applications. For accuracy, the volume of output must be derated 60%-80% for the anticipation of back pressure. 5 GRAPH B 0 0 Thermal Resistance From MTG Surface to Ambient--C/Watt 0 100 GRAPH A Mounting Surface Temp Rise Above Ambient--C CONVERTING VOLUME TO VELOCITY 579802 Mounting Surface Temp Rise Above Ambient--C The performance graphs you will see in this catalog (see graph 579802) are actually a composite of two separate graphs which have been combined to save space. The small arrows on each curve indicate to which axis the curve corresponds. Thermal graphs are published assuming the device to be cooled is properly mounted and the heat sink is in its recommended mounting position. GRAPH B is used to show heat sink performance when used in a forced convection environment (i.e. with forced air flow through the heat sink). This graph has its origin in the top right hand corner with the horizontal axis representing air velocity over the heat sink LFM* and the vertical axis representing the thermal resistance of the heat sink (C/W). Air velocity is calculated by dividing the output volumetric flow rate of the fan by the cross-sectional area of the outflow air passage. Velocity (LFM) = Volume (CFM) area (ft2) Velocity = 80 = 320 0.25 Velocity is 320 LFM, which at 80%, derates to 256 LFM. READING A THERMAL PERFORMANCE GRAPH Reading a Thermal Performance Graph DESIGN ASSISTANCE Aavid can assist in the design of heat sinks for both forced and natural convection applications. Contact us for help with your next thermal challenge. For more information, visit our web site at: www.shopaavid.com Velocity (LFM)* = Volume (CFM)** area (ft2) EXAMPLE B: For the same application we add a fan which blows air over the heat sink at a velocity of 400 LFM. The addition of a fan indicates the use of forced convection and therefore we refer to graph "B". This resistance of 9.50C/W is then multiplied by the power to be dissipated, 3 watts. This yields a temperature rise of 28.5C. * Linear feet per minute ** Cubic feet per minute sales.na@aavid.com www.shopaavid.com 11 BGA-Solder Anchor HEAT SINKS FOR IC PACKAGES Solder anchor attachment Aavid's unique Solder anchor attachment method uses two or four small Solder anchors attached to the circuit card and a wire spring clip to securely fasten the heat sink to the device. This method is rugged, compact and allows for easy removal in case of rework. All products include a phase change pad suitable for most IC package styles to optimize thermal performance. Models are available with a single or dual spring clips for additional thermal interface pressure. Solder anchors are ordered separately. ORDERING INFORMATION IC Pkg Style Part Number "W" (mm) n1 f 2 Finish Fig. 4 PCB Fig. 4 #Anchors 3 23 x 23 All 374024B60023G 23.00 23.00 10.00 49.70 40.00 11.69 Black anodize 1 A 2 23 x 23 All 374124B60023G 23.00 23.00 18.00 49.70 23.40 7.39 Black anodize 1 A 2 23 x 23 All 374224B60023G 23.00 23.00 25.00 49.70 19.70 6.37 Black anodize 1 A 2 27 x 27 All 374324B60023G 27.00 27.00 10.00 49.70 30.60 9.35 Black anodize 1 A 2 27 x 27 All 374424B60023G 27.00 27.00 18.00 49.70 20.30 6.46 Black anodize 1 A 2 27 x 27 All 374524B60023G 27.00 27.00 25.00 49.70 16.50 5.47 Black anodize 1 A 2 35 x 35 Flip chip 10-5634-01G 31.00 34.90 23.00 11.50 4.20 Black anodize 2 C 2 35 x 35 Flip chip 10-THMA-01G 31.00 34.90 35.00 10.70 3.95 Black anodize 2 C 2 35 x 35 All 374624B60024G 35.00 35.00 10.00 62.30 23.40 7.55 Black anodize 1 B 2 35 x 35 All 374724B60024G 35.00 35.00 18.00 62.30 15.30 5.15 Black anodize 1 B 2 35 x 35 All 374824B60024G 35.00 35.00 25.00 62.30 12.00 4.27 Black anodize 1 B 2 37.5 x 37.5 Flip chip 10-BRD2-01G 35.70 37.30 23.00 11.50 4.20 Clear anodize 2 B 2 37.5 x 37.5 Flip chip 10-BRD1-01G 37.50 37.50 23.00 10.10 3.83 Black anodize 2 B 2 37.5 x 37.5 Flip chip 10-BRD1-03G 37.50 37.50 23.00 10.10 3.83 Black anodize 3 D 4 37.5 x 37.5 Flip chip 10-BRD1-04G 37.50 37.50 23.00 10.10 3.83 Black anodize 2 B 2 37.5 x 37.5 Flip chip 10-BRD1-05G 37.50 37.50 23.00 10.10 3.83 Clear anodize 3 D 4 37.5 x 37.5 Flip chip 10-BRD1-07G 37.50 37.50 23.00 10.10 3.83 Clear anodize 2 B 2 40 x 40 All 374924B60024G 40.00 40.00 10.00 62.30 20.30 6.46 Black anodize 1 B 2 40 x 40 All 375024B60024G 40.00 40.00 18.00 62.30 12.20 4.34 Black anodize 1 B 2 42 x 40 All 375124B60024G 40.00 40.00 25.00 62.30 10.30 3.83 Black anodize 1 B 2 42.5 x 42.5 Flip chip 10-CLS1-01G 42.30 42.30 23.00 8.80 3.51 Black anodize 2 E 2 42.5 x 42.5 Flip chip 10-CLS2-01G 42.30 42.30 35.00 8.30 3.44 Black anodize 2 E 2 IC Pkg Size (mm) "L" (mm) "H" (mm) "A" (mm) SOLDER ANCHOR Part Number PCB Thickness (mm) "A" Dim (mm) 125700D00000G 1.60 3.61 125800D00000G 2.54-2.79 4.70 2.49 (0.098) 7.19 (0.283) "A" 0.64 (0.025) 5.08 (0.200) 7.62 (0.300) 1. Natural convection thermal resistance based on a 75 C heat sink temperature rise. 2. Force convection thermal resistance based on an entering 1.0 m/s (200LFM) airflow. 3. Solder anchors are sold separately refer to drawing above. 4. Solder anchor mechanical drawings and board mounting drawings see page 13. 12 sales.na@aavid.com www.shopaavid.com BGA-Solder Anchor Solder anchor heat sinks mechanical drawings FIGURE 1 FIGURE 2 12.70 (0.500) "W" "L" 54.74 (2.155) "W" 12.70 (0.500) "A" "L" "H" FIGURE 3 HEAT SINKS FOR IC PACKAGES "H" 15.00 (0.591) 45.88 "W" (1.806) 15.00 (0.591) "H" "L" Board mounting pattern information for solder anchor heat sinks FIGURE A FIGURE B 48.26 (1.900) 35.56 (1.400) o 0.97 0.03 (0.038 0.001) PLATED THROUGH HOLES 4 X O 0.97 0.03 (0.038 0.001) PLATED THROUGH HOLES 4X 26.67 (1.050) 53.34 (2.100) 66.04 (2.600) 33.02 (1.300) 17.78 (0.700) 24.13 (0.950) 5.08 (0.200) 2X FIGURE D FIGURE C FIGURE E O0.97 0.03 (0.038 0.001) PLATED THROUGH HOLES 2X 45.72 (1.800) O 0.97 0.03 (0.038 0.001) PLATED THROUGH HOLES 4X 48.26 (1.900) 2X 24.13 (0.950) 58.42 (2.300) 29.21 (1.150) 22.86 (0.900) 5.08 (0.200)2X 5.08 (0.200) 2x 55.88 (2.200) O 0.97 0.03 (0.038 0.001) PLATED THROUGH HOLES 4X 66.04 (2.600) 33.02 (1.300) 5.08 (0.200) 4X 33.02 (1.300) 66.04 (2.600) 2X 27.94 (1.100) 5.08 (0.200) 2X sales.na@aavid.com www.shopaavid.com 13 BGA-Push Pin Attachment HEAT SINKS FOR IC PACKAGES Push pin attachment Push pin heat sinks require two 3.10mm holes in the circuit card to quickly attach the heat sink over the device. The one piece design makes assembly a snap. Pressure is maintained by the tension of the push pin coil springs to ensure even pressure across the device. Push pins provide a greater margin of reliability in applications where gravity or vibration may cause tapes or adhesives to fail. The addition of a phase change pad optimizes thermal performance. ORDERING INFORMATION IC Pkg. Size (mm) Part Number "W" (mm) "L" (mm) "H" (mm) "S" (mm) "T" (mm) n2 f 3 Finish Fig. PCB Fig. 1 Pin Style 28 x 28 10-6326-27G 28.00 28.00 6.00 46.60 6.50 44.10 13.13 Black anodize 1 A Plastic Yes 28 x 28 10-6326-28G 28.00 28.00 6.00 46.60 6.50 44.10 13.13 Black anodize 1 A Brass Yes 28 x 28 10-6327-01G 28.50 28.50 10.00 46.60 7.00 30.60 9.26 Black anodize 2 A Plastic No 35 x 35 10-TNT2-01G 36.10 48.00 11.60 6.50 18.80 6.13 Black anodize 3 D Plastic No 37.5 x 37.5 10-5597-02G 37.40 37.40 6.00 59.00 6.50 33.30 9.91 Green anodize 5 B Plastic No 37.5 x 37.5 10-5597-22G 37.40 37.40 6.00 59.00 6.50 33.30 9.91 Gold anodize 5 B Plastic Yes 37.5 x 37.5 10-5597-33G 37.40 37.40 6.00 59.00 6.50 33.30 9.91 Gold anodize 5 B Brass Yes 37.5 x 37.5 10-5607-04G 37.40 37.40 10.00 59.00 7.00 22.10 6.99 Black anodize 5 B Plastic Yes 37.5 x 37.5 10-5607-05G 37.40 37.40 10.00 59.00 7.00 22.10 6.99 Black anodize 5 B Brass Yes 37.5 x 37.5 Pad 372924M02000G 37.40 37.40 6.00 59.00 6.50 32.60 9.91 Green anodize 5 B Plastic No 45 x 45 10-L4LB-03G 45.20 41.40 11.89 58.80 8.00 16.70 5.60 Black anodize 4 C Plastic Yes 45 x 45 10-L4LB-05G 45.20 41.40 11.89 58.80 8.00 16.70 5.60 Black anodize 4 C Brass Yes 45 x 45 10-L4LB-11G 45.20 41.40 11.70 58.80 8.00 14.20 4.91 Black anodize 4 C Plastic No 1. Push pin mechanical drawings and board mounting drawings see page 15 2. Natural convection thermal resistance based on a 75 C heat sink temperature rise. 3. Forced convection thermal resistance based on an entering 1.0 m/s (200LFM) airflow. 14 sales.na@aavid.com www.shopaavid.com BGA-Push Pin Attachment Mechanical drawings FIGURE 2 "T" "H" FIGURE 3 "T" 46.60 (1.835) 41.70 (1.642) "H" "S" 41.50 (1.634) "L" "L" "L" "W" "W" "T" "H" "W" FIGURE 5 FIGURE 4 "T" "S" "H" HEAT SINKS FOR IC PACKAGES FIGURE 1 "S" "L" 20.02 "L" (0.788) "T" "W" 10.69 (0.421) "H" "W" Board mounting pattern information FIGURE A FIGURE B o 3.10 0.030 (0.122 0.001) THROUGH HOLES (UNPLATED) 2X 46.60 (1.830) REF 32.95 (1.297) 59.00 (2.320)REF O 3.10 0.03 (0.122 0.001) THROUGH HOLES 16.48 (UNPLATED) 2X (0.649) 16.48 (0.649) 41.74 (1.643) 20.87 (0.822) 32.95 (1.297) 20.87 (0.822) 41.74 (1.643) FIGURE D FIGURE C O 3.10 0.03 ( O 0.122 0.001) THROUGH HOLES (UNPLATED) 2X 20.02 (0.788) O 3.10 0.03 (O 0.122 0.001) THROUGH HOLES (UNPLA TED) 2X 41.50 (1.634) 25.40 (1.000) 10.01 (0.394) 50.80 (2.000) 20.85 (0.821) 20.75 (0.817) 41.70 (1.642) sales.na@aavid.com www.shopaavid.com 15 BGA-Tape Attachment HEAT SINKS FOR IC PACKAGES Heat sinks for plastic BGA packages "H" "L" "W" Pressure sensitive, thermally conductive adhesive tape easily and reliably bonds a heat sink to an integrated circuit package. Tapes provide high thermal conductivity and exceptional bonding properties. Adhesives are formulated for plastic and metal/ceramic packages. Material: Aluminum ORDERING INFORMATION Part Number "W" (mm) "L" (mm) "H" (mm) n2 f 3 Finish Tape code1 10 x 10 Plastic 375324B00035G 10.20 10.20 10.20 71.40 21.20 Black anodize 35 15 x 15 Plastic 375424B00034G 15.20 15.20 6.40 62.50 17.60 Black anodize 34 23 x 23 Plastic 374024B00035G 23.00 23.00 10.00 40.00 11.69 Black anodize 35 23 x 23 Plastic 374124B00035G 23.00 23.00 18.00 23.40 7.39 Black anodize 35 23 x 23 Plastic 374224B00035G 23.00 23.00 25.00 19.70 6.370 Black anodize 35 25 x 25 Plastic 335224B00034G 25.00 25.00 9.90 34.00 10.39 Black anodize 34 27 x 27 Plastic 374324B00035G 27.00 27.00 10.00 30.60 9.35 Black anodize 35 27 x 27 Plastic 374424B00035G 27.00 27.00 18.00 20.30 6.46 Black anodize 35 27 x 27 Plastic 374524B00035G 27.00 27.00 25.00 16.50 5.47 Black anodize 35 28 x 28 Plastic 373024B00034G 27.90 27.90 8.90 33.30 10.00 Black anodize 34 28 x 28 Plastic 2327B-CP50G 27.90 28.10 15.20 23.40 7.43 Black anodize 34 31 x 31 Plastic 335824B00034G 30.00 30.00 9.40 29.40 9.11 Black anodize 34 35 x 35 Plastic 371824B00034G 35.00 35.00 7.00 31.90 9.67 Black anodize 34 35 x 35 Plastic 374624B00035G 35.00 35.00 10.00 23.40 7.55 Black anodize 35 35 x 35 Plastic 374724B00035G 35.00 35.00 18.00 15.30 5.15 Black anodize 35 35 x 35 Plastic 374824B00035G 35.00 35.00 25.00 12.00 4.27 Black anodize 35 35 x 35 Plastic 372024B00034G 35.00 35.00 27.90 11.90 4.28 Black anodize 34 40 x 40 Plastic 374924B00035G 40.00 40.00 10.00 20.30 6.46 Black anodize 35 40 x 40 Plastic 364424B00034G 40.10 40.00 11.40 18.40 6.02 Black anodize 34 40 x 40 Plastic 375024B00035G 40.00 40.00 18.00 12.20 4.34 Black anodize 35 40 x 40 Plastic 375124B00035G 40.00 40.00 25.00 10.30 3.83 Black anodize 35 IC Pkg. Size (mm) IC Pkg. Style 1. For tape specifications see page 88 2. Natural convection thermal resistance based on a 75 C heat sink temperature rise. 3. Forced convection thermal resistance based on an entering 1.0 m/s (200LFM) airflow. 16 sales.na@aavid.com www.shopaavid.com BGA-Tape Attachment HEAT SINKS FOR IC PACKAGES Heat sinks for metal/ceramic BGA packages "H" "L" "W" Material: Aluminum ORDERING INFORMATION Part Number "W" (mm) "L" (mm) "H" (mm) n 2 f 3 Finish Tape Code1 10 x 10 Metal / Ceramic 375224B00032G 10.20 11.10 10.20 71.40 21.20 Black anodize 32 23 x 23 Metal / Ceramic 374024B00032G 23.00 23.00 10.00 40.00 11.69 Black anodize 32 23 x 23 Metal / Ceramic 374124B00032G 23.00 23.00 18.00 23.40 7.39 Black anodize 32 23 x 23 Metal / Ceramic 374224B00032G 23.00 23.00 25.00 19.70 6.370 Black anodize 32 25 x 25 Metal / Ceramic 335224B00032G 25.00 25.00 9.90 34.00 10.39 Black anodize 32 27 x 27 Metal / Ceramic 335324B00032G 26.90 26.90 11.40 27.70 8.71 Black anodize 32 27 x 27 Metal / Ceramic 374324B00032G 27.00 27.00 10.00 30.60 9.35 Black anodize 32 27 x 27 Metal / Ceramic 374424B00032G 27.00 27.00 18.00 20.30 6.46 Black anodize 32 27 x 27 Metal / Ceramic 374524B00032G 27.00 27.00 25.00 16.50 5.47 Black anodize 32 28 x 28 Metal / Ceramic 373024B00032G 27.90 27.90 8.89 33.30 10.00 Black anodize 32 28 x 28 Metal / Ceramic 373224M00032G 28.00 28.00 6.00 44.10 13.13 Green anodize 32 28 x 28 Metal / Ceramic 2327B-TACHG 27.90 28.10 15.20 23.40 7.43 Black anodize 32 31 x 31 Metal / Ceramic 335724B00032G 30.10 30.10 6.60 35.70 10.84 Black anodize 32 31 x 31 Metal / Ceramic 335824B00032G 30.00 30.00 9.40 29.40 9.11 Black anodize 32 32.5 x 32.5 Metal / Ceramic 2338B-TACHG 33.00 31.40 12.50 23.10 7.23 Black anodize 32 35 x 35 Metal / Ceramic 371824B00032G 35.00 35.00 7.00 31.90 9.67 Black anodize 32 35 x 35 Metal / Ceramic 374624B00032G 35.00 35.00 10.00 23.40 7.55 Black anodize 32 35 x 35 Metal / Ceramic 374724B00032G 35.00 35.00 18.00 15.30 5.15 Black anodize 32 35 x 35 Metal / Ceramic 374824B00032G 35.00 35.00 25.00 12.00 4.27 Black anodize 32 35 x 35 Metal / Ceramic 372024B00032G 35.00 35.00 27.90 11.90 4.28 Black anodize 32 37.5 x 37.5 Metal / Ceramic 373324M00032G 37.40 37.40 6.00 32.60 9.91 Green anodize 32 37.5 x 37.5 Metal / Ceramic 2319B-TACHG 38.10 38.10 10.16 12.50 3.50 Black anodize 32 IC Pkg. Size (mm) IC Pkg. Style 37.5 x 37.5 Metal / Ceramic 336624B00032G 38.10 38.10 16.00 15.30 5.15 Black anodize 32 40 x 40 Metal / Ceramic 374924B00032G 40.00 40.00 10.00 20.30 6.46 Black anodize 32 40 x 40 Metal / Ceramic 364424B00032G 40.10 40.00 11.40 18.40 6.02 Black anodize 32 40 x 40 Metal / Ceramic 375024B00032G 40.00 40.00 18.00 12.20 4.34 Black anodize 32 40 x 40 Metal / Ceramic 375124B00032G 40.00 40.00 25.00 10.30 3.83 Black anodize 32 42.5 x 42.5 Metal / Ceramic 2321B-TACHG 43.20 41.30 8.90 22.10 6.93 Black anodize 32 42.5 x 42.5 Metal / Ceramic 2332B-TACHG 43.20 41.30 16.50 12.90 4.53 Black anodize 32 45 x 45 Metal / Ceramic 2342B-TACHG 45.70 44.60 7.00 23.10 7.26 Black anodize 32 50 + Metal / Ceramic 3334B-TACHG 50.50 50.20 16.50 6.0 3.3 Black anodize 32 1. For tape specifications see page 88 2. Natural convection thermal resistance based on a 75 C heat sink temperature rise. 3. Forced convection thermal resistance based on an entering 1.0 m/s (200LFM) airflow. sales.na@aavid.com www.shopaavid.com 17 BGA-Clip Attachment HEAT SINKS FOR IC PACKAGES Clip attachment "L" "H" Aavid's BGS Clip heat sinks provide a mechanical attachment alternative to tape applications where it is desirable to attach the heat sink directly to the device. The unique clip uses spring pressure to ensure even contact across the device while the end plates firmly engage the edge of the package, locking the heat sink in place. Each heat sink uses pre-applied thermal grease for optimum thermal performance. "W" Material: Aluminum Finish: Black Anodize ORDERING INFORMATION IC Pkg. Size (mm) 27 x 27 Part Number "W" (mm) "L" (mm) "H" (mm) IC Pkg. Style n1 f 2 Interface Clip 2317B-EP11-BGS1G 26.14 20.47 15.24 All 32.60 9.94 EP11 BGS1 35 x 35 2518B-EP11-BGS2G 30.50 28.10 15.60 All 22.70 7.05 EP11 BGS2 42.5 x 42.5 2519B-EP11-BGS5G 34.50 31.40 15.60 All 19.70 6.30 EP11 BGS5 42.5 x 42.5 2520B-EP04-BGS5G 38.10 38.00 15.60 All 15.60 5.17 EP04 BGS5 42.5 x 42.5 2522B-EP04-BGS5G 38.10 38.00 10.16 All 22.10 6.94 EP04 BGS5 1. Natural convection thermal resistance based on a 75 C heat sink temperature rise. 2. Forced convection thermal resistance based on an entering 1.0 m/s (200LFM) airflow. THERMALCOTETM GREASE "E" PULL TAB "D" TAPE TYPE AND INTERFACE MATERIAL INFORMATION Material Description Adhesive Thermal Resistance Color Carrier "D" Dim "E" Dim EP11 ThermalcoteTM grease with release liner None 0.18 White None 13.34 (0.525) 13.34 (0.525) EP04 ThermalcoteTM grease with release liner None 0.03 White None 31.75 (1.250) 31.75 (1.250) For more information on Thermalcote see page 113. TM 18 sales.na@aavid.com www.shopaavid.com BGA - Bi Directional HEAT SINKS FOR IC PACKAGES Bi Directional "W" "L" "H" Designed for applications with airflow traveling in a single direction, these heat sinks are suitable for a variety of standard square IC packages. Models are available with pre-applied thermal tape for easy attachment to the IC. Epoxy attach models are also available. Material: Aluminum ORDERING INFORMATION IC Pkg Style Part Number "W" (mm) "L" (mm) "H" (mm) n3 f 4 Finish Attachment Tape Code 2 10 X 10 All 615653B00250G 6.00 6.00 5.00 142.58 76.26 Black anodize Epoxy1 N/A 10 X 10 All 709203B00400G 10.00 10.00 10.00 55.98 29.94 Black anodize Epoxy1 N/A 24 X 24 Metal 335114B00032G 24.00 24.00 24.00 13.60 7.27 Black anodize Tape 32 25 X 25 Metal 335214B00032G 25.00 25.00 10.00 10.00 5.35 Black anodize Tape 32 25 X 25 Metal 335211B00032G 25.00 25.00 10.00 10.00 5.35 Black anodize Tape 32 25 X 25 All 335214B00000G 25.00 25.00 10.00 10.00 5.35 Black anodize Epoxy1 N/A 25 X 25 All 335211B00000G 25.00 25.00 10.00 10.00 5.35 Black anodize Epoxy1 N/A 25 X 25 Plastic 335214B00034G 25.00 25.00 10.00 10.00 5.35 Black anodize Tape 34 27 X 27 Plastic 335314B00035G 27.00 27.00 11.00 10.00 5.35 Black anodize Tape 35 27 X 27 Metal 335314B00032G 27.00 27.00 11.00 10.00 5.35 Black anodize Tape 32 27 X 27 All 335314B00000G 27.00 27.00 11.00 10.00 5.35 Black anodize Epoxy1 N/A 28 X 28 All 700353U01100G 28.00 28.00 9.00 18.49 9.89 Unfinished Epoxy1 N/A 30 X 30 All 335814B00000G 30.00 30.00 9.00 10.50 5.61 Black anodize Epoxy1 N/A 30 X 30 All 335714B00000G 30.00 30.00 7.00 15.20 8.13 Black anodize Epoxy1 N/A 30 X 30 Metal 335814B00032G 30.00 30.00 9.00 9.20 4.92 Black anodize Tape 32 30 X 30 Metal 335714B00032G 30.00 30.00 7.00 15.20 8.13 Black anodize Tape 32 37.5 X 37.5 All 799403B01500G 38.00 38.00 10.00 12.21 6.53 Black anodize Epoxy1 N/A 37.5 X 37.5 All 336314B00000G 36.00 36.00 17.00 11.00 5.88 Black anodize Epoxy1 N/A IC Pkg Size 1. Epoxy ordered separately for information on Epoxy see page 114,115. 2. For tape specifications see page 88. 3. Natural convection thermal resistance based on a 75C heat sink temperature rise. 4. Forced convection thermal resistance based on an entering 1.0 m/s (200LFM) airflow. sales.na@aavid.com www.shopaavid.com 19 DIPS 0 200 Air Velocity--Feet Per Minute 400 600 800 1000 20 Mounting Surface Temp Rise Above Ambient--C 100 Slide on heat sink with staggered fins attaches to 8 pin DIP packages quickly and easily. The heat sink features double spring action and locking catch to firmly attach the device creating a thermal conduction path on both the top and bottom surfaces. Available in two finishes. 80 16 60 12 40 8 20 4 0 0 0 0.4 0.8 1.2 1.6 Heat Dissipated--Watts Thermal Resistance From MTG Surface to Ambient--C/Watt Slide on heat sink with staggered fins 14.27 (0.562) 15.24 (0.600) 2.0 11.43 (0.450) LOCKING CATCH ORDERING INFORMATION Finish 580100B00000G Black anodize 580100W00000G Black anodize with black paint on bottom side 5010 6.35 (0.250) Grease & Epoxy page112 Angle fin heat sink 0 Air Velocity--Feet Per Minute 400 200 600 800 100 Angle fin heat sink is a simple low cost solution for cooling DIP devices. Suitable for 14 and 16 pin packages and available in two finish options. Easily attaches using thermal epoxy. 1000 100 80 80 60 60 40 40 20 20 0 0 0 0.4 0.8 1.2 1.6 Heat Dissipated--Watts 19.05 (0.750) 2.0 15.34 (0.604) REF 5.39 (0.212) ORDERING INFORMATION Part Number Finish 501000J00000G Pre black anodize* 501000B00000G Black anodize 5.33 (0.210) Material: 0.63 (0.025) Thick Aluminum Finish: See Table Thermal Resistance From MTG Surface to Ambient--C/Watt Part Number 10.54 (0.415) Mounting Surface Temp Rise Above Ambient--C THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES 5801 6.35 (0.250) Material: 1.27 (0.050) Thick Aluminum Finish: See Table * Edges cut during the manufacturing process will be unfinished. See page 110 for more information. Slide on heat sink with angled fins 0 200 Air Velocity--Feet Per Minute 400 600 800 Slide on heat sink with angled fins attaches to 14 and 16 pin DIP packages quickly and easily. The heat sink features double spring action and locking catch to firmly attach the device creating a thermal conduction path on both the top and bottom surfaces. Available in two finishes. Mounting Surface Temp Rise Above Ambient--C 100 1000 20 80 16 60 12 40 8 20 4 0 0 0 0.4 0.8 1.2 1.6 Heat Dissipated--Watts Thermal Resistance From MTG Surface to Ambient--C/Watt 5602, 5802 22.61 (0.890) 15.24 (0.600) 2.0 10.42 (0.410) 21.34 (0.840) LOCKING CATCH 5.08 (0.200) "A" ORDERING INFORMATION Part Number 20 Device Pkg Style Finish "A" Dim 560200B00000G Ceramic Black anodize 7.87 (0.310) 560200W00000G Ceramic Black anodize with black paint on bottom side 7.87 (0.310) 580200B00000G Plastic Black anodize 6.35 (0.250) 580200W00000G Plastic Black anodize with black paint on bottom side 6.35 (0.250) Material: 0.63 (0.025) Thick Aluminum Finish: See Table sales.na@aavid.com www.shopaavid.com Slide on heat sink with staggered fins 0 200 Air Velocity--Feet Per Minute 400 600 800 Mounting Surface Temp Rise Above Ambient--C 100 1000 10 80 8 60 6 40 4 20 2 0 0 Slide on heat sink with staggered fins attaches to 28 pin DIP packages quickly and easily. The heat sink features double spring action and locking catch to firmly attach the device creating a thermal conduction path on both the top and bottom surfaces. 0 0.4 0.8 1.2 1.6 Heat Dissipated--Watts Thermal Resistance From MTG Surface to Ambient--C/Watt 5806 42.67 (1.680) 2.0 14.86 (0.585) 37.47 (1.475) LOCKING CATCH 12.70 (0.500) 13.72 (0.540) Material: 0.81 (0.032) Thick Aluminum Finish: Black Anodize ORDERING INFORMATION Part Number Description 580600B00000G Slide on heat sink with staggered fins Slide on heat sink with staggered fins 0 Air Velocity--Feet Per Minute 400 200 600 800 Mounting Surface Temp Rise Above Ambient--C 100 ORDERING INFORMATION Part Number Description 580300B00000G Slide on heat sink with staggered fins 1000 20 80 16 60 12 40 8 20 4 0 0 0 Slide on heat sink with staggered fins attaches to 18 pin DIP packages quickly and easily. The heat sink features double spring action and locking catch to firmly attach the device creating a thermal conduction path on both the top and bottom surfaces. 28.58 (1.125) 0.4 0.8 1.2 1.6 Heat Dissipated--Watts 2.0 Thermal Resistance From MTG Surface to Ambient--C/Watt 5803 25.40 (1.000) THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES DIPS 23.62 (0.930) 17.78 (0.700) 14.12 (0.556) LOCKING CATCH 5.33 (0.210) 6.35 (0.250) Material: 0.63 (0.025) Thick Aluminum Finish: Black Anodize sales.na@aavid.com www.shopaavid.com 21 DIPS Slide on heat sink with staggered fins Air Velocity--Feet Per Minute 400 200 600 800 100 1000 20 80 16 60 12 40 8 20 4 0 0 Slide on heat sink with staggered fins attaches to 20 pin DIP packages quickly and easily. The heat sink features double spring action and locking catch to firmly attach the device creating a thermal conduction path on both the top and bottom surfaces. 0 0.4 0.8 1.2 1.6 Heat Dissipated--Watts 28.58 (1.125) Thermal Resistance From MTG Surface to Ambient--C/Watt 0 Mounting Surface Temp Rise Above Ambient--C 26.80 (1.055) 14.12 (0.556) LOCKING CATCH Description 580400B00000G Slide on heat sink with staggered fins 5805 5.33 (0.210) 6.35 (0.250) Material: 0.63 (0.025) Thick Aluminum Finish: Black Anodize ORDERING INFORMATION Part Number 17.78 (0.700) 2.0 Slide on heat sink with staggered fins 0 Air Velocity--Feet Per Minute 400 200 600 800 Mounting Surface Temp Rise Above Ambient--C 100 80 8 60 6 40 4 20 2 0 0 0 Slide on heat sink with staggered fins attaches to 24 pin DIP packages quickly and easily. The heat sink features double spring action and locking catch to firmly attach the device creating a thermal conduction path on both the top and bottom surfaces. 1000 10 0.4 0.8 1.2 1.6 Heat Dissipated--Watts Thermal Resistance From MTG Surface to Ambient--C/Watt THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES 5804 37.08 (1.460) 2.0 25.60 (1.008) 14.73 (0.580) LOCKING CATCH 32.51 (1.280) 12.19 (0.480) 13.72 (0.540) ORDERING INFORMATION 22 Part Number Description 580500B00000G Slide on heat sink with staggered fins Material: 0.81 (0.032) Thick Aluminum Finish: Black Anodize sales.na@aavid.com www.shopaavid.com Grease & Epoxy page112 Extruded epoxy attach on heat sink with straight fins 0 200 Air Velocity--Feet Per Minute 400 600 800 Mounting Surface Temp Rise Above Ambient--C 100 Extruded epoxy attach on heat sink with straight fins attaches to 24, 28, and 40 pin DIP packages quickly and easily. May be added before or after final board assembly. No additional board space is required. 1000 20 80 16 60 12 40 8 20 4 0 0 0 1 508700 508600 508500 2 3 Heat Dissipated--Watts 4 Thermal Resistance From MTG Surface to Ambient--C/Watt 5085, 5086, 5087 13.46 (0.530) "A" 4.83 (0.190) 5 Material: Aluminum Finish: Black Anodize ORDERING INFORMATION Part Number DIP Package "A" Dim 508500B00000G 24 pin 31.75 (1.250) 508600B00000G 28 pin 36.83 (1.450) 508700B00000G 40 pin 50.80 (2.000) For epoxy information see pages 114-115. Grease & Epoxy page112 Extruded epoxy attach heat sink 0 Air Velocity--Feet Per Minute 400 200 600 800 Mounting Surface Temp Rise Above Ambient--C 100 Extruded epoxy attach heat sink which requires no additional board space is suitable for narrow DIP packages. May be added before or after final board assembly. No additional board space is required. Attaches to 28 pin DIP. 25 80 20 60 15 40 10 20 5 0 0 0 1 2 3 4 Heat Dissipated--Watts 12.06 (0.475) REF 1000 Thermal Resistance From MTG Surface to Ambient--C/Watt 6284 THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES DIPS 36.83 REF (1.450) 5 13.46 (0.530) ORDERING INFORMATION Material: Aluminum Finish: Black Anodize Part Number Description 6284BG Extruded epoxy attach heat sink for 28 pin DIP For epoxy information see pages 114-115. 5011, 5012 Grease & Epoxy page112 Extruded epoxy attach heat sink with straight fins FIGURE B FIGURE A 4.83 (0.190) 6.35 REF (0.250) 19.05 (0.750) 6.35 (0.250) 0 Air Velocity--Feet Per Minute 400 200 600 800 1000 100 ORDERING INFORMATION Part Number Description 501100B00000G Extruded epoxy attach heat sink with straight fins Figure A 501200B00000G Extruded epoxy attach heat sink with straight fins B Mounting Surface Temp Rise Above Ambient--C 100 80 1 501 60 -5 80 012 60 40 40 20 20 0 0 0.0 501100 501200 0.4 0.8 1.2 1.6 Heat Dissipated--Watts Thermal Resistance From MTG Surface to Ambient--C/Watt Material: Aluminum Finish: Black Anodize Extruded epoxy attach heat sink with straight fins attaches to 14 and 16 pin DIP packages quickly and easily. May be added before or after final board assembly. No additional board space is required. Available in two fin directions. For epoxy information see pages 114-115. 18.57 (0.730) 4.82 REF (0.190) 2.0 sales.na@aavid.com www.shopaavid.com 23 SMT Surface mount heat sink for D-PAK (TO-252) package semiconductors Air Velocity--Feet Per Minute 400 200 600 800 Case Temp Rise Rise Above Ambient--C Surface mount heat sink for D-PAK (TO-252) package semiconductors remove the heat indirectly without contacting the device like traditional through hole heat sinks. The device and the heat sink are soldered directly to a modified drain pad creating a thermal transfer path from package tab to the heat sink. 1000 25 80 20 60 15 40 10 20 5 0 0 0.0 0.5 1.0 1.5 2.0 Heat Dissipated--Watts 8.00 (0.315) Thermal Resistance From MTG Surface to Ambient--C/Watt 0 100 22.86 (0.900) 10.16 (0.400) 2.5 1.3 (0.05) 8.13 (0.320) 10.41 (0.410) Material: 0.63 (0.025) Thick Copper Finish: Tin Plated Refer to Figure A and B on page 26 for board footprint information ORDERING INFORMATION Part Number Packaging 573100D00010G 13" Reel, 250 per reel 573100D00000G Bulk, 500 per bag See page 25 for tape and reel information Surface mount heat sink for D 2 PAK (TO-263) package semiconductors Surface mount heat sink for D2 PAK (TO-263) package semiconductors remove the heat indirectly without contacting the device like traditional through hole heat sinks. The device and the heat sink are soldered directly to a modified drain pad creating a thermal transfer path from package tab to the heat sink. Air Velocity--Feet Per Minute 400 200 600 800 50 1000 20 40 16 30 12 20 8 10 4 0 0 0 0.0 0.5 1.0 1.5 2.0 Heat Dissipated--Watts Thermal Resistance From MTG Surface to Ambient--C/Watt 5733 Case Temp Rise Rise Above Ambient--C THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES 5731 12.70 (0.500) 26.16 (1.030) 10.16 (0.400) 7.37 (0.290) 2.5 12.70 (0.500) 1.3 (0.05) Material: 0.63 (0.025) Thick Copper Finish: Tin Plated Refer to Figure A and B on page 26 for board footprint information ORDERING INFORMATION Part Number Packaging 573300D00010G 13" Reel, 250 per reel 573300D00000G Bulk, 500 per bag See page 25 for tape and reel information Surface mount heat sink for D 2 PAK (TO-263), power SO-10 (MO-184) and SO-10 package semiconductors ORDERING INFORMATION Part Number Packaging 7106D/TRG 13" Reel, 200 per reel 7106DG Bulk, 500 per bag Mounting Surface Temp Rise Above Ambient--C Surface mount heat sink for D2 PAK (TO-263), power SO-10 (MO-184) and SO-10 package semiconductors remove the heat indirectly without contacting the device like traditional through hole heat sinks. The device and the heat sink are soldered directly to a modified drain pad creating a thermal transfer path from package tab to the heat sink. Air Velocity--Feet Per Minute 400 200 600 800 5.33 (0.210) 100 1000 10 80 8 60 6 40 4 20 2 0 0 0 0 1 2 3 Heat Dissipated--Watts 4 Thermal Resistance From MTG Surface to Ambient--C/Watt 7106 10.92 14.99 (0.430) (0.590) 14.99 (0.590) 25.91 (1.020) 10.16 (0.400) 5 9.52 (0.375) 7.62 (0.300) Material: 0.63 (0.025) Thick Copper Finish: Tin Plated Refer to Figure C on page 26 for board footprint information See page 25 for tape and reel information 24 sales.na@aavid.com www.shopaavid.com Surface mount heat sink for D 2 PAK (TO-263) package semiconductors Air Velocity--Feet Per Minute 400 200 600 800 0 1000 Surface mount heat sink for D2 PAK (TO-263) package semiconductors remove the heat indirectly without contacting the device like traditional through hole heat sinks. The device and the heat sink are soldered directly to a modified drain pad creating a thermal transfer path from package tab to the heat sink. Mounting Surface Temp Rise Above Ambient--C 100 5 80 4 60 3 40 2 20 1 0 0 0 1 2 3 Heat Dissipated--Watts 4 19.38 (0.763) Thermal Resistance From MTG Surface to Ambient--C/Watt 7109 25.40 (1.000) 15.24 (0.600) 5 11.43 (0.450) 11.43 (0.450) Refer to Figure D on page 26 for board footprint information ORDERING INFORMATION Part Number Packaging 7109D/TRG 13" Reel, 125 per reel 7109DG Bulk, 500 per bag Material: 0.63 (0.025) Thick Copper Finish: Tin Plated See below for tape and reel information Surface mount heat sink for D 3 PAK (TO-268) package semiconductors 1000 20 40 16 30 12 20 8 Case Temp Rise Rise Above Ambient--C 0 Surface mount heat sink for D3 PAK (TO-268) package semiconductors remove the heat indirectly without contacting the device like traditional through hole heat sinks. The device and the heat sink are soldered directly to a modified drain pad creating a thermal transfer path from package tab to the heat sink. Air Velocity--Feet Per Minute 400 200 600 800 50 10 4 0 0 0.0 0.5 1.0 1.5 2.0 Heat Dissipated--Watts 12.70 (0.500) Thermal Resistance From MTG Surface to Ambient--C/Watt 5734 30.99 (1.220) 10.16 (0.400) Packaging 573400D00010G 13" Reel, 250 per reel 573400D00000G Bulk, 500 per bag 7.37 (0.290) 2.5 1.3 (0.05) 17.53 (0.690) Refer to Figure A and B on page 26 for board footprint information ORDERING INFORMATION Part Number THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES SMT Material: 0.63 (0.025) Thick Copper Finish: Tin Plated See below for tape and reel information Tape and Reel information D B C A ORDERING INFORMATION Part Number "A" Dim "B" Dim "C" Dim "D" Dim 7106D/TRG 44.00 (1.730) 40.40 (1.590) 24.00 (0.940) 4.06 (0.160) 7109D/TRG 44.00 (1.730) 40.40 (1.590) 36.00 (1.420) 4.06 (0.160) 573100D00010G 44.00 (1.730) 40.40 (1.590) 16.00 (0.630) 4.06 (0.160) 573300D00010G 44.00 (1.730) 40.40 (1.590) 24.00 (0.940) 4.06 (0.160) 573400D00010G 44.00 (1.730) 40.40 (1.590) 24.00 (0.940) 4.06 (0.160) sales.na@aavid.com www.shopaavid.com 25 THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES SMT Footprints FIGURE A FIGURE B Recommended copper heat speader drain pad footprint Recommended heat sink solder mask opening W1 W W2 Note: The thickness of the drain pad is variable depending on the amount of heat generated by the SMT device, design limitations and process. L L 1.40 (0.060) 0.80 (0.030) "L" "W" "L" "W1" "W2" 573100 9.53 (0.375) 13.97 (0.550) 573100 9.02 (0.355) 13.46 (0.530) 8.89 (0.350) 573300 14.22 (0.560) 16.26 (0.640) 573300 13.72 (0.540) 15.75 (0.620) 11.18 (0.440) 573400 14.22 (0.560) 21.08 (0.830) 573400 13.72 (0.540) 20.57 (0.810) 16.00 (0.630) Part Number Part Number FIGURE C FIGURE D Recommended copper pad size for heat sink and device mounting footprint Recommended copper pad size for heat sink and device mounting footprint 10.41 (0.410) 2.29 (0.090) 10.67 (0.420) 15.49 (0.610) For D Pak (TO-263) 26 20.32 (0.800) 2.54 (0.100) 15.49 (0.610) 7.62 (0.300) 10.67 (0.420) 16.76 (0.660) 2.54 (0.100) For MO-184 and SO-10 sales.na@aavid.com www.shopaavid.com Grease & Epoxy page112 Channel style heat sink with folded back fins 0 200 Air Velocity--Feet Per Minute 400 600 800 Channel style heat sink with folded back fins for increased cooling surface area. Available with tin plated solderable tabs for easy attachment to the printed circuit card. Mounting Surface Temp Rise Above Ambient--C 100 5 80 4 60 3 40 2 20 1 0 0 0 4 6 Heat Dissipated--Watts 8 5.08 14.48 (0.200) (0.570) 28.70 23.62 (1.130) (0.930) 2.02 (0.080) 10 3.18 (0.125) 4.45 (0.175) 2.29 (0.090) 2.54 (0.100) TAB 28.03 (1.104) 19.05 (0.750) 48.26 (1.900) 26.67 (1.050) Dia of PCB Plated Thru Hole for Tabs ORDERING INFORMATION Part Number 2 Mounting Kits page 99 o 3.81 THRU (0.150) 1000 Thermal Resistance From MTG Surface to Ambient--C/Watt 7025 Description 7025BG Channel heat sink with no solderable tabs 7025B-MTG With solderable mounting tabs 24.13 (0.950) Material: 1.27 (0.050) Thick Aluminum Finish: Black Anodize 2.90 ( 0.114) For additional options see page 85 Grease & Epoxy page112 Narrow channel style heat sink with folded back fins 0 200 Air Velocity--Feet Per Minute 400 600 800 Narrow channel style heat sink with folded back fins for increased cooling surface area. Available with tin plated solderable tabs for easy attachment to the printed circuit card. Mounting Surface Temp Rise Above Ambient--C 100 1000 10 80 8 60 6 40 4 20 2 0 0 0 2 4 6 8 Heat Dissipated--Watts 11.94 (0.470) Thermal Resistance From MTG Surface to Ambient--C/Watt 7019 25.40 (1.000) Part Number Description Finish 7019BG Channel heat sink with no solderable tabs Black anodize 7019PBG Channel heat sink with no solderable tabs Pre black anodize* 7019B-MTG With solderable tabs Black anodize o 3.81 (0.150) THRU 14.48 (0.570) 4.83 (0.190) TAB 38.23 (1.505) 39.37 (1.550) 10 2.03 (0.080) 3.18 5.08 (0.125) (0.200) 9.52 (0.375) Dia of PCB Plated Thru Hole for Tabs ORDERING INFORMATION Mounting Kits page 99 THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES TO-220 Heat Sinks 2.28 (0.090) Material: 1.02 (0.040) Thick Aluminum Finish: See Table 2.90 ( 0.114) *Edges cut during the manufacturing process will be unfinished. See page 110 for more information For additional options see page 85 Mounting Surface Temp Rise Above Ambient--C Narrow channel style heat sink with folded back fins for increased cooling surface area. Available with tin plated solderable tabs for easy attachment to the printed circuit card. 100 80 8 60 6 40 4 2 0 0 0 2 4 6 8 Heat Dissipated--Watts Dia of PCB Plated Thru Hole for Tabs Description 7020BG Narrow channel heat sink with no solderable tabs 7020B-MTG With solderable tabs Mounting Kits page 99 33.02 (1.300) o 3.81 2x (0.150) "x" 7.87 (0.310) 36.83 (1.450) CL 14.48 (0.570) 4.83 (0.190) 10 TAB Part Number 11.94 (0.470) 2.02 (0.080) 31.88 (1.255) 17.78 (0.700) 6.10 (0.240) 3.18 (0.125) Material: 1.27 (0.050) Thick Aluminum Finish: Black Anodize 2.90 (0.114) POPULAR OPTIONS: 7020B- A 200 20 ORDERING INFORMATION Base part no. Air Velocity--Feet Per Minute 400 600 800 1000 10 0 Position Grease & Epoxy page112 Narrow channel style heat sink with folded back fins Thermal Resistance From MTG Surface to Ambient--C/Watt 7020 G A Code Description TC10-MT Insulating device mounting clip and solderable tabs Location Details Hole X Page 93, 98 For additional options see page 85 sales.na@aavid.com www.shopaavid.com 27 TO-220 Heat Sinks Grease & Epoxy page112 Channel style heat sink with folded back fins Air Velocity--Feet Per Minute 400 200 600 800 44.45 (1.750) 100 5 80 4 60 3 40 2 20 1 0 0 0 Channel style heat sink with folded back fins for increased cooling surface area. Available with tin plated solderable tabs for easy attachment to the printed circuit card. 2 4 6 8 Heat Dissipated--Watts Mounting Kits page 99 2x o 3.81 (0.150) 1000 Thermal Resistance From MTG Surface to Ambient--C/Watt 0 Mounting Surface Temp Rise Above Ambient--C THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES 7021 7.87 (0.310) "X" 36.83 (1.450) 4.83 (0.190) 3.18 (0.125) 14.48 (0.570) 10 TAB 2.02 (0.080) 43.05 (1.695) 2.67 (0.105) 5.58 (0.220) 17.78 (0.700) 9.65 (0.380) 2.28 (0.090) Dia of PCB Plated Thru Hole for Tabs ORDERING INFORMATION Part Number Description 7021BG Channel heat sink with no solderable tabs 7021B-MTG With solderable tabs 2.90 ( 0.114) POPULAR OPTIONS: 7021BBase part no. Material: 1.27 (0.050) Thick Aluminum Finish: Black Anodize G A Position Code A TC10-MT Description A MT5 Bifurcated tabs with 0.205 stand off A MT6 Bifurcated tabs with 0.115 stand off A TC10-MT5 Locking device mounting clip and solderable tabs Location Details Hole X Page 93, 98 Page 93 Page 93 Locking device mounting clip and bifurcated tabs Hole X Page 93, 98 For additional options see page 85 Grease & Epoxy page112 Channel style heat sink with folded back fins Mounting Surface Temp Rise Above Ambient--C 0 200 Air Velocity--Feet Per Minute 400 600 800 2x o 3.81 THRU (0.150) 100 5 80 4 60 3 40 2 20 1 0 0 0 Channel style heat sink with folded back fins for increased cooling surface area. Available with tin plated solderable tabs for easy attachment to the printed circuit card. 4 6 Heat Dissipated--Watts 8 10 15.49 (0.610) 49.53 (1.950) "X" 5.08 (0.200) A 2.54 (0.100) 14.48 (0.570) TAB 28.03 (1.104) 4.83 (0.190) A 4.45 (0.175) 19.05 (0.750) 3.18 SECTION A-A (0.125) 2.29 (0.090) 48.26 (1.900) 26.67 (1.050) Dia of PCB Plated Thru Hole for Tabs ORDERING INFORMATION Part Number Description 7023BG Channel heat sink with no solderable tabs 7023B-MTG With solderable tabs 24.13 (0.950) Material: 1.27 (0.050) Thick Aluminum Finish: Black Anodize 2.90 ( 0.114) POPULAR OPTIONS: 7023BBase part no. 2 Mounting Kits page 99 1000 Thermal Resistance From MTG Surface to Ambient--C/Watt 7023 G A Position Code A TC6-MT Locking device mounting clip and solderable tabs Description Location Hole X Page 93, 98 Details A TC7-MT Insulating device mounting clip and solderable tabs Hole X Page93, 98 For additional options see page 85 28 sales.na@aavid.com www.shopaavid.com Grease & Epoxy page112 Channel style heat sink with folded back fins 0 200 Air Velocity--Feet Per Minute 400 600 800 Mounting Surface Temp Rise Above Ambient--C 5 80 4 60 3 40 2 20 1 0 0 0 4 Channel style heat sink with folded back fins for increased cooling surface area. Available with tin plated solderable tabs for easy attachment to the printed circuit card. 8 12 16 Heat Dissipated--Watts 9.52 (0.375) 1000 100 Thermal Resistance From MTG Surface to Ambient--C/Watt 7022 "X" Description 7022BG Channel heat sink with no solderable tabs Black anodize 7022PBG Channel heat sink with no solderable tabs Pre black anodize* 7022B-MTG With solderable tabs Black anodize 2.90 ( 0.114) 7022PB-MTG With solderable tabs Pre black anodize* 2.90 ( 0.114) 14.48 (0.570) 2x 3.81 (0.150) 2.02 (0.080) TAB 2.67 (0.105) 3.18 (0.125) 2.29 (0.090) Dia of PCB Plated Thru Hole for Tabs Finish 49.99 (1.968) 21.03 (0.828) 20 4.44 (0.175) Part Number 23.01 (0.906) 50.44 (1.986) 2x o 3.81 (0.150) 4.83 (0.190) ORDERING INFORMATION Mounting Kits page 99 2x 2.03 (0.080) 24.16 (0.951) Material: 1.27 (0.050) Thick Aluminum Finish: See Table * Edges cut during the manufacturing process will be unfinished. See page 110 for more information POPULAR OPTIONS: 7022BBase part no. Position Code A TC11-MT THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES TO-220 Heat Sinks G A Description Insulated device mounting clip for T0-220 and solderable tabs Location Details Hole X Page 93, 98 For additional options see page 85 Grease & Epoxy page112 High performance channel style heat sink with folded back fins Air Velocity--Feet Per Minute 400 200 600 800 100 1000 10 80 8 60 6 40 4 20 2 Mounting Surface Temp Rise Above Ambient--C 0 0 High performance channel style heat sink with folded back fins for greater cooling capacity in a minimum of space when mounted horizontally. Folded back fin design maximizes surface area without increasing the vertical space required by the heat sink. 0 0 1 2 3 4 Heat Dissipated--Watts Mounting Kits page 99 o 3.68 THRU (0.145) Thermal Resistance From MTG Surface to Ambient--C/Watt 5510 12.78 25.55 (0.503) (1.006) CL 9.91 (0.390) 13.21 (0.520) 13.46 (0.530) 13.46 (0.530) 5 19.99 (0.787) 36.83 (1.450) Material: 1.27 (0.050) Thick Aluminum Finish: Black Anodize ORDERING INFORMATION Part Number Description 551002B00000G High performance channel style heat sink with folded back fins POPULAR OPTIONS: 551002B0 00 00G Base part no. Position A A Code Description Details 01 6-32 Wave On threaded insert 0.100 stand off Page 89 For additional options see page 82 sales.na@aavid.com www.shopaavid.com 29 TO-220 Heat Sinks Grease & Epoxy page112 Channel style heat sink with straight fins Mounting Kits page 99 FIGURE B FIGURE A 25.40 (1.000) 1.02 (0.040) o 3.38 (0.133) 3.81 WIDE X (0.150) 9.52 LONG SLOT (0.375) 12.70 (0.500) 25.40 (1.000) 12.70 (0.500) 1.02 (0.040) "X" 29.97 (1.180) 29.97 (1.180) 17.78 (0.700) 17.78 (0.700) 3.81 (0.150) 0.80 (0.032) 24.38 (0.960) "B" Channel style heat sink with straight fins features integrated solderable tabs for easy mounting to the printed circuit card. Available with a single device mounting hole or slotted hole to accomodate varying device lead lengths. 0.80 (0.032) 24.59 (0.968) 3.80 (0.150) "A" "B" "A" 0 200 Air Velocity--Feet Per Minute 400 600 800 1000 10 100 80 8 60 6 40 4 20 2 0 0 0 2 4 6 Heat Dissipated--Watts Part Number Description Finish Figure Dia of PCB Plated Thru Hole for Tabs "A" Dim "B" Dim 6021BG Channel heat sink with straight fins and integrated tabs Black anodize A 2.21 (0.087) 10.16 (0.400) 1.78 (0.070) 6021PBG Channel heat sink with straight fins and integrated tabs Pre-black anodize* A 2.21 (0.087) 10.16 (0.400) 1.78 (0.070) 6221PBG With slotted device mounting hole Pre-black anodize* B 3.18 (0.125) 6.99 (0.275) 2.54 (0.100) ORDERING INFORMATION 8 Thermal Resistance From MTG Surface to Ambient--C/Watt Material: 1.02 (0.040) Thick Aluminum Finish: See Table Mounting Surface Temp Rise Above Ambient--C THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES 6021, 6221 10 * Edges cut during the manufacturing process will be unfinished. See page 110 for more information 6021- POPULAR OPTIONS: Available on the 6021 only Base part no. Position Code Description A B Black anodize A G B A PB Pre-black anodize* B SF1 4-40 UNC-2A device mounting stud Location Details Hole X Page 96 For additional options for part 6021 see page 85 0 Air Velocity--Feet Per Minute 400 200 600 800 Mounting Surface Temp Rise Above Ambient--C 100 Copper channel style heat sink with straight fins features integrated tabs which can be twisted to attach the heat sink to the board prior to wave solder. 1000 10 8 60 6 40 4 20 2 0 0 0 Part Number Description 6230DG Channel heat sink with straight fins and integrated tabs 2 4 6 8 Heat Dissipated--Watts Dia of PCB Plated Thru Hole for Tabs Mounting Kits page 99 3.81 (0.150) 80 ORDERING INFORMATION 30 Grease & Epoxy page112 Copper channel style heat sink with straight fins Thermal Resistance From MTG Surface to Ambient--C/Watt 6230 29.97 (1.180) 9.53 (0.375) 17.78 (0.700) 3.81 (0.150) 2.54 (0.100) 25.40 (1.000) 10 12.70 (0.500) 6.98 (0.275) Material: 0.63 (0.025) Thick Copper Finish: Tin Plated 3.00 (0.118) sales.na@aavid.com www.shopaavid.com Grease & Epoxy page112 Narrow channel style heat sink features twisted fins 0 Air Velocity--Feet Per Minute 400 200 600 800 Mounting Surface Temp Rise Above Ambient--C 100 1000 10 80 8 60 6 40 4 20 2 0 0 0 2 4 6 Heat Dissipated--Watts 8 Mounting Kits page 99 2X 4.00 o THRU (0.158) Thermal Resistance From MTG Surface to Ambient--C/Watt TV35 CL 10 14.00 (0.552) 10.00 (0.394) Narrow channel style heat sink features twisted fins for increased air turbulence and better cooling. Mounts horizontally to accommodate two TO-220 devices. 42.00 (1.655) 25.00 (0.985) ORDERING INFORMATION Part Number Description TV35G Channel style heat sink with twisted fins 35.00 (1.380) 38.00 (1.497) Material: 0.81 (0.032) Thick Aluminum Finish: Black Anodize 0 Air Velocity --Feet Per Minute 400 200 600 800 Mounting Surface Temp Rise Above Ambient--C 100 Narrow channel style heat sink features twisted fins for increased air turbulence and better cooling. Can be mounted vertically or horizontally. 1000 20 80 16 60 12 40 8 20 4 0 0 0 TV58 TV46, TV47 1 2 3 4 Heat Dissipated --Watts Mounting Kits page 99 19.00 (0.749) 4.00 o THRU (0.157) CL "B" 5 22.00 (0.887) MAX "A" 11.00 (0.433) MIN ORDERING INFORMATION Part Number Grease & Epoxy page112 Narrow channel style heat sink features twisted fins Thermal Resistance From MTG Surface to Ambient--C/Watt TV46, TV47, TV58 THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES TO-220 Heat Sinks "A" Dim "B" Dim TV46G 13.00 (0.512) 9.50 (0.374) TV47G 13.00 (0.512) 6.30 (0.248) TV58G 11.00 (0.433) 6.30 (0.248) Material: 0.81 (0.032) Thick Aluminum Finish: Black Anodize sales.na@aavid.com www.shopaavid.com 31 TO-220 Heat Sinks Grease & Epoxy page112 Channel style heat sink features twisted fins Mounting Surface Temp Rise Above Ambient--C 100 80 16 60 12 40 8 20 4 0 0 0 2 TV1500 TV1505 0 4 6 Heat Dissipated--Watts 8 Air Velocity--Feet Per Minute 400 200 600 800 1000 20 16 12 40 8 20 4 0 0 TV 265 2 3 Heat Dissipated--Watts Part Number Description TV265G Channel style heat sink with twisted fins and solderable tabs 4 A 2.39 (0.094) Channel style heat sink with twisted fins B TV1505G With integrated twist tabs B 0.75 (0.030) 25.40 (1.000) 10.15 (0.400) FIGURE B 30.00 (1.181) 12.70 (0.500) 5.08 (0.200) R 1.90 (0.075) CL 30.20 (1.187) Figure TV1500G 1.90 (0.075) 5 Dia of PCB Plated Thru Hole for Tabs ORDERING INFORMATION 5.08 (0.200) CL 45.00 (1.772) 4.50 (0.177) 60 1 R 1.90 (0.075) 10 80 0 30.00 (1.181) 22.10 (0.870) 12.70 (0.500) 15.24 (0.600) 100 Channel style heat sink features twisted fins for increased air turbulence and better cooling. Can be mounted vertically or horizontally. Models are available with integrated twist tabs or mounting solderable tabs. Mounting Kits page 99 FIGURE A 1000 20 Thermal Resistance From MTG Surface to Ambient--C/Watt Air Velocity--Feet Per Minute 400 200 600 800 Thermal Resistance From MTG Surface to Ambient--C/Watt 0 Mounting Surface Temp Rise Above Ambient--C THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES TV265, TV1500, TV1505 15.24 (0.600) TAB TV1505 ONLY 3.80 (0.150) 1.20 (0.047) 2.54 (0.100) 24.13 (0.950) 5.80 (0.228) 3.30 (0.130) Material: 1.27 (0.050) Thick Aluminum Finish: Black Anodize Grease & Epoxy page112 Channel style heat sink features solderable tabs and twisted fins 1000 10 80 8 60 6 40 4 0 Mounting Surface Temp Rise Above Ambient--C Air Velocity--Feet Per Minute 400 200 600 800 100 2 20 0 0 0 2 4 6 Heat Dissipated--Watts Channel style heat sink features solderable tabs and twisted fins for increased air turbulence for better cooling. For ease of assembly use with clip 7701 (sold separately) to attach device. See page 97 for clip information. ORDERING INFORMATION Part Number Description 5900PBG Channel style heat sink with twisted fins and solderable tabs 8 3.81 (0.150) 12.50 (0.492) 5.10 (0.201) CL Slots for clip attach 31.20 (1.228) 15.20 5.00 (0.598) (0.197) 10 11.10 (0.437) Dia of PCB Plated Thru Hole for Tabs Mounting Kits page 99 30.40 (1.197) Thermal Resistance From MTG Surface to Ambient--C/Watt 5900 1.90 (0.075) 24.20 (0.953) 0.80 (0.031) 25.00 (0.984) Material: 1.19 (0.047) Thick Aluminum Finish: Pre Black Anodize* 2.40 (0.094) * Edges cut during the manufacturing process will be unfinished. See page 110 for more information. 32 sales.na@aavid.com www.shopaavid.com 0 200 Air Velocity--Feet Per Minute 400 600 800 Channel style heat sink features twisted fins for increased air turbulence for better cooling. Two heights are available and include wave solderable tin plated tabs for easy attachment to the PC board. "A" Dim Dia of PCB Plated Thru Hole for Tabs 592902B03400G 24.89 (0.980) 2.36 (0.093) 593002B03400G 29.97 (1.180) 2.36 (0.093) ORDERING INFORMATION Mounting Surface Temp Rise Above Ambient--C 100 Part Number Grease & Epoxy page112 Channel style heat sink featuring twisted fins 1000 20 80 16 60 12 40 8 20 4 0 0 0 2 593002 592902 4 6 Heat Dissipated--Watts 8 Thermal Resistance From MTG Surface to Ambient--C/Watt 5929, 5930 Mounting Kits page 99 o 3.18 (0.125) THRU "X" "A" 17.78 (0.700) 10 0.81 (0.032) 1.90 (0.075) 4.27 (0.170) 10.16 (0.400) 23.93 (0.942) 12.70 (0.500) Material: 1.27 (0.050) Thick Aluminum Finish: Black Anodize POPULAR OPTIONS: 59 _ _ 02B034 00G Base part no. Position Code A 05 A Description Location Details 4-40 male semiconductor mount 0.380 LG Hole X Page 90 For additional options see page 82 0 Air Velocity--Feet Per Minute 400 200 600 800 Channel style heat sink features three integrated tabs for greater stability and slotted mounting hole to accommodate a variety of device lead lengths. Available in two heights. Mounting tabs are designed for either soldering (tin finish) or twisted. ORDERING INFORMATION 29.97 (1.180) Finish Black anodize 80 8 60 6 40 4 20 2 0 0 0 2 563002 576602 4 6 Heat Dissipated--Watts 8 12.70 (0.500) 9.52 (0.375) "A" CL 17.78 (0.700) 10 29.97 (1.180) Tin plated 3.10 (0.122) Black anodize 3.10 (0.122) 576602D00000G 24.13 (0.950) Tin plated 3.10 (0.122) Material: 1.27 (0.050) Thick Aluminum Finish: See Table Grease & Epoxy page112 Channel style heat sink with two integrated tabs 0 Air Velocity--Feet Per Minute 400 200 600 800 Finish Dia of PCB Plated Thru Hole for Tabs 575002B00000G Black anodize 3.10 (0.122) 575002D00000G Tin plated 3.10 (0.122) Mounting Surface Temp Rise Above Ambient--C 100 ORDERING INFORMATION 8.89 (0.350) 2.54 TYP (0.100) 3.10 (0.122) 24.13 (0.950) Part Number 3.81 (0.150) Dia of PCB Plated Thru Hole for Tabs 576602B00000G Channel style heat sink features two integrated tabs and slotted mounting hole to accommodate a variety of device lead lengths. Mounting tabs are designed for either soldering (tin finish) or twisted. Mounting Kits page 99 5.08 (0.200) 563002D00000G 5750 25.40 (1.000) 1000 10 80 8 60 6 40 4 20 2 0 0 0 2 4 6 Heat Dissipated--Watts 8 9.52 (0.375) Mounting Kits page 99 12.70 (0.500) 25.40 (1.000) 1000 10 Thermal Resistance From MTG Surface to Ambient--C/Watt 563002B00000G "A" Dim Mounting Surface Temp Rise Above Ambient--C 100 Part Number Grease & Epoxy page112 Channel style heat sink featuring three integrated tabs Thermal Resistance From MTG Surface to Ambient--C/Watt 5630, 5766 THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES TO-220 Heat Sinks 29.97 (1.180) CL 10 3.81 (0.150) 17.78 (0.700) 5.08 (0.200) 10.16 (0.400) 2.54 (0.100) Material: 1.27 (0.050) Thick Aluminum Finish: See Table sales.na@aavid.com www.shopaavid.com 33 TO-220 Heat Sinks Grease & Epoxy page112 Channel style heat sink featuring recessed lower fins Air Velocity--Feet Per Minute 400 200 600 800 Channel style heat sink features recessed lower fins to allow closer component spacing and longer upper fins for maximum cooling. Includes two solderable tabs for easy attachment to the PC card. Mounting Surface Temp Rise Above Ambient--C 100 80 8 60 6 40 4 20 2 0 0 0 1 2 3 4 Heat Dissipated--Watts 25.40 (1.000) Description 590102B03600G High performance heat sink with recessed lower fins o 3.96 x 9.53 SLOT (0.156) (0.375) CL 42.54 (1.675) 17.78 (0.700) 5 1.27 (0.050) 2.54 (0.100) 12.70 (0.500) Dia of PCB Plated Thru Hole for Tabs Mounting Kits page 99 25.40 (1.000) 23.50 (0.925) 5.08 (0.200) ORDERING INFORMATION Part Number 1000 10 Thermal Resistance From MTG Surface to Ambient--C/Watt 0 23.98 (0.944) Material: 1.27 (0.050) Thick Aluminum Finish: Black Anodize 2.92 (0.115) For additional options see page 82 Grease & Epoxy page112 Channel style heat sink featuring slotted mounting hole 0 Air Velocity--Feet Per Minute 400 200 600 800 100 Channel style heat sink features slotted mounting hole to accommodate a variety of devices and lead lengths. Includes two solderable tabs for easy attachment to the PC card. 80 8 60 6 40 4 20 2 0 0 0 1 2 3 4 Heat Dissipated--Watts Description 590302B03600G High performance heat sink with solderable tabs o 3.96 x 9.52 (0.156) (0.375) 42.54 (1.675) 17.78 (0.700) 5 2.54 (0.100) 5.08 (0.200) Dia of PCB Plated Thru Hole for Tabs ORDERING INFORMATION Part Number 1000 10 Mounting Kits page 99 12.70 CL (0.500) Thermal Resistance From MTG Surface to Ambient--C/Watt 5903 Mounting Surface Temp Rise Above Ambient--C THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES 5901 0.81 (0.032) 11.43 (0.450) 24.89 (0.980) 2.92 (0.115) Material: 1.27 (0.050) Thick Aluminum Finish: Black Anodize For additional options see page 82 Grease & Epoxy page112 Slim low cost channel style heat sink 1000 20 80 16 60 12 40 8 Mounting Surface Temp Rise Above Ambient--C Slim low cost channel style heat sink is ideal where space and cost are limited. Available in 3 fin heights with or without solderable mounting tab. Air Velocity--Feet Per Minute 400 600 800 100 0 20 4 0 0 0 577002 577102 577202 200 1 2 3 Heat Dissipated--Watts 4 "A" Thermal Resistance From MTG Surface to Ambient--C/Watt 5770, 5771, 5772 13.21 (0.520) CL 5 6.35 (0.250) TAB Part Number Description 577002B00000G Slim, low cost channel style heat sink with no solderable tabs 6.35 (0.250) "A" Dim 577002B04000G With solderable tab 6.35 (0.250) 577102B00000G Slim, low cost channel style heat sink with no solderable tabs 9.52 (0.375) 577102B04000G With solderable tab 9.52 (0.375) 577202B00000G Slim, low cost channel style heat sink with no solderable tabs 12.70 (0.500) 577202B04000G With solderable tab 12.70 (0.500) Dia of PCB Plated Thru Hole for Tabs o 3.81 (0.150) THRU 19.05 (0.750) 13.33 (0.525) 1.27 (0.050) 0.81 (0.032) ORDERING INFORMATION Mounting Kits page 99 10.67 (0.420) 1.73 (0.068) 1.73 (0.068) Material: 1.27 (0.050) Thick Aluminum Finish: Black Anodize 1.73 (0.068) POPULAR OPTIONS: 577_ _02B 0 4000G Base part no. A Position Code Description Details A 3 In-Sil-8TM pad Page 86 For additional options see page 82 34 sales.na@aavid.com www.shopaavid.com 6109, 6110 Grease & Epoxy page112 Low cost channel style heat sink featuring integrated alignment tabs FIGURE A FIGURE B 12.70 (0.500) Mounting Kits page 99 25.40 (1.000) AT BASE o 3.81 (0.150) 12.70 (0.500) 29.97 (1.180) 18.03 (0.710) 10.92 (0.430) 25.40 (1.000) AT BASE Description Figure 6109PBG Low cost channel heat sink with device locating tabs A 6110PBG Low cost channel heat sink with device locating tabs B 0 * Edges cut during the manufacturing process will be unfinished. See page 110 for more information Code Description Details Solderable mounting tabs Page 93 40 8 20 4 0 0 0 1 2 3 Heat Dissipated--Watts Mounting Surface Temp Rise Above Ambient--C Copper narrow channel style heat sink includes a single integrated tab to allow easy attachment to the PC board. Tin plated finish ensures easy solderability. Air Velocity--Feet Per Minute 400 600 800 100 1000 10 80 8 60 6 40 4 200 20 2 0 0 0.0 0.4 0.8 1.2 1.6 Heat Dissipated--Watts Description 7178DG Narrow channel copper heat sink 13.21 (0.520) AT BASE CL o 3.81 (0.150) 19.05 (0.750) 13.34 (0.525) 5 Mounting Kits page 99 6.60 (0.260) 3.81 (0.150) 3.81 (0.150) 2.0 6.35 (0.250) 9.52 (0.375) 1.27 (0.050) Dia of PCB Plated Thru Hole for Tabs ORDERING INFORMATION Part Number 4 Grease & Epoxy page112 Copper narrow channel style heat sink with a single integrated tab 0 7136, 7139 12 Thermal Resistance From MTG Surface to Ambient--C/Watt 7178 16 60 6109 6110 For additional options see page 85 1000 20 80 A MT Air Velocity--Feet Per Minute 400 600 800 Material: 0.63 (0.025) Thick Copper Finish: Tin Plated 2.54 (0.100) Copper channel style slide on heat sink featuring integrated mounting clip FIGURE A 21.54 (0.848) 2x 2.79 (0.110) 17.78 (0.700) 19.81 (0.780) 2x 1.27 (0.050) 4.19 (0.165) 2x 1.27 (0.050) Copper channel style slide on heat sink features integrated mounting clip for easy no hardware attachment to the device. Also includes solderable mounting tabs for easy attachment to the PC board. Top is cut away to show detail FIGURE B 13.08 (0.515) 16.51 14.86 (0.650) (0.580) 13.08 (0.515) 2.79 (0.110) 2.03 (0.080) 13.21 (0.520) 13.21 (0.520) Material: 0.63 (0.025) Thick Copper Finish: Tin Plated 0 200 Air Velocity--Feet Per Minute 400 600 800 100 ORDERING INFORMATION Part Number Description Figure Dia of PCB Plated Thru Hole for Tabs 7136DG Vertical mount A 2.54 (0.100) 7139DG Horizontal mount B 2.54 (0.100) 80 16 60 12 40 8 20 4 0 0 0 7136 7139 1000 20 1 2 3 Heat Dissipated--Watts 4 Thermal Resistance From MTG Surface to Ambient--C/Watt A G Mounting Surface Temp Rise Above Ambient--C Position 200 o 3.81 (0.150) CL 100 Mounting Surface Temp Rise Above Ambient--C Part Number Base part no. 10.92 (0.430) Material: 1.27 (0.050) Thick Aluminum Finish: Pre-Black Anodize* ORDERING INFORMATION POPULAR OPTIONS: 61_ _PB - 8.89 (0.350) Thermal Resistance From MTG Surface to Ambient--C/Watt 11.68 (0.460) Low cost channel style heat sink features integrated alignment tabs to prevent the device from rotating while applying torque to the mounting hardware. Available in two lengths with a pre-black anodized finish. 5.72 (0.225) 8.89 (0.350) THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES TO-220 Heat Sinks 5 sales.na@aavid.com www.shopaavid.com 35 TO-220 Heat Sinks Copper channel style heat sink with integrated clip Copper channel style heat sink with integrated clip and locking tab for secure attachment to the device. Narrow profile uses less board space. Includes tin plated solderable tabs for easy attachment to the printed circuit card. 1000 10 80 8 60 6 40 4 20 2 0 Top is cut away to show detail Thermal Resistance From Case to Ambient--C/Watt Air Velocity--Feet Per Minute 400 200 600 800 100 0 Case Temp Rise Rise Above Ambient--C 27.94 (1.100) 1 2 3 4 Heat Dissipated--Watts 1.27 (0.050) 2.79-3.43 (0.110-0.135) 20.32 (0.800) 0 0 6.12 (0.241) 10.80 1.68 (0.425) (0.066) 1.07 (0.042) 1.27 (0.050) 5 22.00 (0.866) 4.47 (0.176) 5.31 (0.209) 9.52 (0.375) Material: 0.63 (0.025) Thick Copper Finish: Tin Plated Dia of PCB Plated Thru Hole for Tabs ORDERING INFORMATION Part Number Description 7128DG Slide on channel heat sink with integrated clip and locking tabs 6038 Channel style heat sink with integrated clip 0 2.92 (0.115) Air Velocity--Feet Per Minute 400 200 600 800 Mounting Surface Temp Rise Above Ambient--C 100 Channel style heat sink with integrated clip and locking tab for secure attachment to the device. Tabs can be bent for mounting. 2.54 (0.100) 1000 10 80 8 60 6 40 4 20 2 0 0 0 1 2 3 4 Heat Dissipated--Watts Thermal Resistance From MTG Surface to Ambient--C/Watt THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES 7128 5 29.97 (1.180) 31.24 (1.230) 18.29 (0.720) 6.35 (0.250) 16.51 (0.650) 2.54 (0.100) 8.26 (0.325) 5.89 (0.232) 10.16 (0.400) 12.70 (0.500) ORDERING INFORMATION Part Number Description 6038BG Slide on channel heat sink with integrated clip and locking tabs 3.81 (0.150) 0 Air Velocity--Feet Per Minute 400 200 600 800 Case Temp Rise Above Ambient--C 100 Narrow channel style heat sink with integrated clip and locking tab for secure attachment to the device. Device can be mounted horizontally using a single center tab that can be soldered directly to the PC board. Top is cut away to show detail 1000 10 80 8 60 6 40 4 20 2 0 0 0 1 2 3 Heat Dissipated--Watts ORDERING INFORMATION 36 Material: 0.81(0.032) Thick Aluminum Finish: Black Anodize Narrow channel style heat sink with integrated clip Part Number Description 7142DG Slide on narrow channel heat sink with integrated clip and locking tabs 4 5 Thermal Resistance From Case to Ambient--C/Watt 7142 11.43 (0.450) 25.40 (1.000) AT BASE Dia of PCB Plated Thru Hole for Tabs 14.86 16.51 (0.585) (0.650) 19.81 (0.780) 2.54 (0.100) CL 13.08 (0.515) 0.64 (0.025) 2.79 (0.110) 13.21 (0.520) Material: 0.63 (0.025) Thick Copper Finish: Tin Plated Dia of PCB Plated Thru Hole for Tabs 3.18 (0.125) sales.na@aavid.com www.shopaavid.com TO-220 Heat Sinks Channel style heat sink with integrated clip B THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES 6238, 6239 1.90 (0.075) 5.08 (0.200) 8.00 (0.315) 2.67 (0.105) 10.80 (0.425) 2.02 (0.080) Channel style heat sink with integrated clip features strong spring tension and device locking tab to attach device securely to the heat sink. Available with solderable tabs for vertical mount or without tabs for mounting horizontally. 19.05 (0.750) TAB "A" 24.38 (0.960) SECTION B-B 3.17 (0.125) B 16.51 (0.650) 15.49 (0.610) Material: 1.02 (0.040) Thick Aluminum Finish: Black Anodize 25.53 (1.005) AT BASE 200 Air Velocity--Feet Per Minute 400 600 800 "A" Dim Dia of PCB Plated Thru Hole for Tabs With solderable mounting tabs 10.16 (0.400) 2.90 (0.114) With solderable mounting tabs 6.99 (0.275) 2.90 (0.114) ORDERING INFORMATION Part Number Description 6238BG Channel heat sink with integral clip, no solderable tab 6238B-MTG 6239B-MTG Mounting Surface Temp Rise Above Ambient--C 100 80 8 60 6 40 4 20 2 0 0 0 For additional options see page 85 1 2 3 4 Heat Dissipated--Watts FIGURE A CLIP 53 17.78 (0.700) CL 3.96 (0.156) 3.17 (0.125) 14.12 (0.556) "A" 9.78 (0.385) 29.97 (1.180) 0.762 (0.063) (0.030) 9.27 (0.365) 12.70 (0.500) Dia of PCB Plated Thru Hole for Tabs With Shur-Lock tabs and clip A Dia 3.05(0.120) x 0.64(0.025) High Dittin 2.39 (0.094) With solderable mounting tabs and clip B Dia 3.05(0.120) x 0.64(0.025) High Dittin 2.39 (0.094) 534265B02853G With Shur-Lock tabs and clip A No Dittin 2.39 (0.094) 534265B03453G With solderable mounting tabs and clip B No Dittin 2.39 (0.094) 534202B02853G 534202B03453G TM For additional options see page 82 29.97 (1.180) 9.78 (0.385) 1.90 (0.075) 10.16 (0.400) 12.70 (0.500) Material: 1.27 (0.050) Thick Aluminum Finish: Black Anodize "A" Dim TM "A" 0.81 (0.032) 23.93 (0.942) 4.27 (0.170) Figure Description CL 17.78 (0.700) 1.60 22.35 (0.880) 3.12 (0.123) ORDERING INFORMATION Part Number 25.40 (1.000) 12.06 (0.475) 0 Air Velocity--Feet Per Minute 400 200 600 800 100 1000 10 80 8 60 6 40 4 20 2 0 0 0 2 4 6 8 Heat Dissipated--Watts Thermal Resistance From MTG Surface to Ambient--C/Watt Channel style heat sink features a dittin to locate the device and a convenient clip to eliminate the need for mounting hardware. The twisted fins increase cooling efficiency. Available in two solderable mounting tab styles. Can be ordered without the ditton if electrical isolation is required or for mounting tabless packages. Mounting Kits page 99 FIGURE B 13.84 (0.545) 25.40 (1.000) 14.12 (0.556) 5 Grease & Epoxy page112 Channel style heat sink with convenient clip Mounting Surface Temp Rise Above Ambient--C 5342 1000 10 Thermal Resistance From MTG Surface to Ambient--C/Watt 0 10 sales.na@aavid.com www.shopaavid.com 37 TO-220 Heat Sinks Copper narrow channel style heat sink with integrated clip 80 8 60 6 40 4 Case Temp Rise Above Ambient--C 2 0 0 0 1 2 3 Heat Dissipated--Watts 4 16.51 (0.650) 3.05 (0.120) 5.72 (0.225) 5 Dia of PCB Plated Thru Hole for Tabs ORDERING INFORMATION Description 7141DG Narrow channel heat sink with integrated clip 13.21 (0.520) 2.77 (0.109) Material: 0.63 (0.025) Thick Copper Finish: Tin Plated Grease & Epoxy page112 Economy, narrow base, low profile channel style heat sink 100 80 16 60 12 40 8 20 4 0 0 0 1 2 3 Heat Dissipated--Watts 4 "X" 19.05 (0.750) 13.34 (0.525) 9.52 CL (0.375) 5 9.65 (0.380) Material: 1.27 (0.050) Thick Aluminum Finish: See Table ORDERING INFORMATION Part Number Mounting Kits page 99 19.05 (0.750) o 3.81 (0.150) THRU Thermal Resistance From MTG Surface to Ambient--C/Watt Air Velocity--Feet Per Minute 400 200 600 800 1000 20 0 Economy, narrow base, low profile channel style heat sink is perfect for use on printed circuit boards with 0.500 inch centering. When mounted horizontally, the total height of the heat sink is just 0.380. 2.54 (0.100) MAX 1.27 (0.050) 3.81 (0.150) 13.08 (0.515) Part Number 5073 20 19.81 (0.780) Thermal Resistance From Case to Ambient--C/Watt 1000 10 0 Copper narrow channel style heat sink with integrated clip and locking tab for secure attachment to the device. Single center tab can be soldered directly to the PC board. Top is cut away to show detail Air Velocity--Feet Per Minute 400 200 600 800 100 Mounting Surface Temp Rise Above Ambient--C THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES 7141 Finish 507302B00000G Black anodize 507302J00000G Pre-black anodize* * Edges cut during the manufacturing process will be unfinished. See page 110 for more information POPULAR OPTIONS: 507302 _ 000 00G Base part no. Position Code A 09 A Description Stud 4-40 x 0.350 LG Location Details Hole X Page 96 For additional options see page 82 5041, 5042 Grease & Epoxy page112 Economy, narrow base, low profile channel style heat sink o 3.66 THRU (0.144) FIGURE A Mounting Kits page 99 o 3.66 THRU TYP 2 (0.144) FIGURE B "X" 17.80 (0.700) "X" 13.46 (0.530) "X" 19.81 (0.780) 9.91 (0.390) A For dual devices B POPULAR OPTIONS: 504_ _2B0 00 00G A 01 6-32 Wave On threaded insert 0.100 stand off For additional options see page 82 38 A Description Air Velocity--Feet Per Minute 400 200 600 800 100 Mounting Surface Temp Rise Above Ambient--C Economy, narrow base channel style heat sink 504222B00000G Code 0 Figure 504102B00000G Position 21.59 (0.850) 36.83 (1.450) 19.80 (0.780) Description Base part no. 13.47 (0.530) Material: 1.02 (0.040) Thick Aluminum Finish: Black Anodize ORDERING INFORMATION Part Number 13.47 (0.530) 21.60 (0.850) Location Details Hole X Page 89 80 8 60 6 40 4 20 2 0 0 0 504102 504222 1000 10 2 4 6 Heat Dissipated--Watts 8 Thermal Resistance From MTG Surface to Ambient--C/Watt Economy, narrow base, low profile channel style heat sink is perfect for use on printed circuit boards with tight component spacing. Models are available for single and dual device mounting. 10 sales.na@aavid.com www.shopaavid.com Grease & Epoxy page112 Narrow channel style heat sink features twisted fins 0 Air Velocity--Feet Per Minute 400 200 600 800 Mounting Surface Temp Rise Above Ambient--C 100 1000 10 80 8 60 6 40 4 20 2 0 0 0 2 4 6 Heat Dissipated--Watts 8 Thermal Resistance From MTG Surface to Ambient--C/Watt TV40 Mounting Kits page 99 4.00 (0.158) 2X THRU CL 13.00 (0.512) 6.00 (0.236) 28.00 (1.103) 10 22.00 (0.866) Narrow channel style heat sink features twisted fins for increased air turbulence and better cooling. Mounts horizontally to accommodate two TO-220 devices. 38.00 (1.497) Material: 0.81 (0.032) Thick Aluminum Finish: Black Anodize ORDERING INFORMATION Part Number Description TV40G Narrow channel style heat sink with twisted fins Grease & Epoxy page112 Copper channel style heat sink featuring two integrated tabs 0 200 Air Velocity--Feet Per Minute 400 600 800 Copper channel style heat sink features two integrated tabs. The heat sink is tin plated and can be soldered to the PC board. 80 8 60 6 40 4 20 2 0 0 0 1 2 3 4 Heat Dissipated--Watts Description 7173DG Copper channel style heat sink Mounting Kits page 99 o 3.81 (0.150) THRU 19.05 (0.750) 3.81 6.35 (0.150) (0.250) 13.34 (0.525) 3.81 (0.150) 1.27 (0.050) 19.05 (0.750) 5 9.52 (0.375) Dia of PCB Plated Thru Hole for Tabs ORDERING INFORMATION Part Number 6236 Mounting Surface Temp Rise Above Ambient--C 100 1000 10 Thermal Resistance From MTG Surface to Ambient--C/Watt 7173 THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES TO-220 Heat Sinks 4.11 (0.162) Material: 0.63 (0.025) Thick Copper Finish: Tin Plated 2.54 (0.100) Channel style heat sink featuring an integrated device retaining clip Locking Catch 1000 20 80 16 60 12 40 8 20 4 ORDERING INFORMATION Part Number Finish 6236BG Black anodize 6236PBG Pre-black anodize* 0 0 0 2 4 6 8 Heat Dissipated--Watts 10 Mounting Surface Temp Rise Above Ambient--C Top is cut away to show detail Thermal Resistance From MTG Surface to Ambient--C/Watt 100 0 Channel style heat sink features an integrated device retaining clip that eliminates the need for attachment hardware. Available in two finish options. Air Velocity--Feet Per Minute 400 200 600 800 17.78 (0.700) 14.22 (0.560) 2.54 (0.100) CL 12.95 (0.510) 13.21 (0.520) Material: 1.02 (0.040) Thick Aluminum Finish: See Table * Edges cut during the manufacturing process will be unfinished. See page 110 for more information. sales.na@aavid.com www.shopaavid.com 39 TO-220 Heat Sinks Grease & Epoxy page112 Channel style heat sink with wide mounting surface FIGURE A 29.97 "B" (1.180) "B" "A" 12.70 (0.500) "C" 25.40 (1.000) AT BASE ORDERING INFORMATION Figure "A" Dim "B" Dim 530613B00000G B 12.19 (0.480) 10.16 (0.400) "C" Dim 530614B00000G A 29.97 (1.180) 11.68 (0.460) 12.70 (0.500) 530714B00000G A 18.03 (0.710) 12.32 (0.485) 12.70 (0.500) 25.40 (1.000) AT BASE Material: 1.27 (0.050) Thick Aluminum Finish: Black Anodize 576012B00000G A 22.86 (0.900) 11.43 (0.450) 9.65 (0.380) 576014B00000G A 22.86 (0.900) 8.13 (0.320) 9.65 (0.380) Air Velocity--Feet Per Minute 400 200 600 800 0 1000 10 100 For additional options see page 82 80 8 60 6 40 4 20 2 0 0 0 1 2 3 Heat Dissipated--Watts 4 Thermal Resistance From MTG Surface to Ambient--C/Watt Part Number o 3.81 (0.150) THRU 2X CL "A" Lightweight, low cost channel style heat sink with wide mounting surface and selection of lengths to accept a variety of packages. Models accomodate one or two devices. Mounting Kits page 99 FIGURE B o 3.81 (0.150) THRU CL Mounting Surface Temp Rise Above Ambient--C THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES 5306, 5307, 5760 5 576012, 530714 or 576014 530613 or 530614 5779, 5786 Grease & Epoxy page112 Twin channel style heat sink FIGURE A FIGURE B 9.65 (0.380) TYP 2 25.40 19.30 (1.000) (0.760) 19.30 26.16 (1.030) (0.760) 2.54 (0.100) 35.56 (1.400) 37.59 (1.480) 5.08 (0.200) 37.59 (1.480) 12.70 (0.500) o 3.81 THRU (0.150) TYP 2 o 3.81 THRU (0.150) TYP 2 30.15 (1.187) Twin channel style heat sink vertically mounts two TO-220 devices to a single heat sink. Center fins increase cooling capacity. Available with integrated twist tabs or staked on solder tabs for easy attachment to the PC board. Mounting Kits page 99 9.65 (0.380) TYP 2 1.57 (0.062) 3.43 (0.135) 5.59 (0.220) 12.70 (0.500) 12.70 (0.500) 15.49 (0.610) TYP 2 14.99 (0.590) Twin channel style heat sink with integrated tabs A 3.10 (0.122) With staked on solderable tabs B 1.91 (0.075) Part Number Description 577922B00000G 578622B03200G For additional options see page 82 0 Air Velocity--Feet Per Minute 400 600 800 1000 10 80 8 60 6 40 4 20 2 0 0 0 40 200 100 Mounting Surface Temp Rise Above Ambient--C Figure Dia of PCB Plated Thru Hole for Tabs ORDERING INFORMATION 1 2 3 4 Heat Dissipated--Watts Thermal Resistance From MTG Surface to Ambient--C/Watt Material: 1.27 (0.050) Thick Aluminum Finish: Black Anodize 5 sales.na@aavid.com www.shopaavid.com Grease & Epoxy page112 5069, 5070, 5071, 5072 Hat section style heat sink FIGURE A FIGURE B o 3.66 (0.144) THRU 17.78 (0.700) 13.46 (0.530) Mounting Kits page 99 o 3.66 (0.144) THRU TYP 2 CL 37.34 (1.470) 10.16 (0.400) CL 13.59 (0.535) "A" Hat section style heat sinks are low profile and perfect for use on printed circuit cards with 0.500 inch centering between boards. For higher power applications the 5071 hat can be added to the 5070 or 5072 for double sided cooling of a TO-220 device. 17.78 (0.700) 17.78 (0.700) 9.52 (0.375) 9.52 (0.375) 44.45 (1.750) Material: 1.02 (0.040) Thick Aluminum Finish: Black Anodize FIGURE C 44.45 (1.750) 10.67 (0.420) 10.29 (0.405) ORDERING INFORMATION Part Number Description Figure "A" Dim 506902B00000G Hat section heat sink A 31.75 (1.250) 507002B00000G Wide hat section heat sink A 44.45 (1.750) 507102B00000G Hat section heat sink with cut out C 507222B00000G Dual device hat section heat sink B 13.46 (0.530) 17.78 (0.700) o 3.66 (0.144) 12.70 (0.500) 12.70 (0.500) POPULAR OPTIONS: 50_ _ _2B 0 0000G Description Details Kon DuxTM pad Page 86 0 Air Velocity--Feet Per Minute 400 200 600 800 100 Mounting Surface Temp Rise Above Ambient--C For additional options see page 82 80 8 60 6 40 4 20 2 0 0 0 2 4 6 Heat Dissipated--Watts 507222 507222 with 507102 attached 7137, 7140 1000 10 8 0 Air Velocity--Feet Per Minute 400 200 600 800 100 Mounting Surface Temp Rise Above Ambient--C 1 Thermal Resistance From MTG Surface to Ambient--C/Watt Code A 1000 10 80 8 60 6 40 4 20 2 0 0 0 10 1 506902 507102 507002 2 3 Heat Dissipated--Watts 4 Thermal Resistance From MTG Surface to Ambient--C/Watt A Base part no. Position THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES TO-220 Heat Sinks 5 Copper, hat section, slide on heat sink FIGURE A FIGURE B Top is cut away to show detail 22.86 (0.900) Copper, hat section, slide on heat sink features integrated mounting clip for easy no hardware attachment to the device. Also included are solderable mounting tabs for easy attachment to the PC card. 17.78 (0.700) 19.05 (0.750) 22.86 (0.900) 2.54 (0.100) 9.52 (0.375) 9.52 (0.375) 13.21 (0.520) 13.21 (0.520) Material: 0.63 (0.025) Thick Copper Finish: Tin Plated Description Figure 7137DG Vertical mount A 2.54 (0.100) 7140DG Horizontal mount B 2.54 (0.100) Air Velocity--Feet Per Minute 400 200 600 800 100 Mounting Surface Temp Rise Above Ambient--C Part Number Dia of PCB Plated Thru Hole for Tabs 3.05 (0.120) 1.57 (0.062) 0 ORDERING INFORMATION 11.05 (0.435) 1000 10 80 8 60 6 40 4 20 2 0 0 0 1 2 3 4 Heat Dissipated--Watts Thermal Resistance From MTG Surface to Ambient--C/Watt 21.54 (0.848) 5 sales.na@aavid.com www.shopaavid.com 41 TO-220 Heat Sinks Hat section style heat sink featuring an integrated clip 200 Air Velocity--Feet Per Minute 400 600 800 100 Hat section style heat sink features an integrated clip for secure attachment to the device without added hardware. Available in two finishes. 1000 20 80 16 60 12 40 8 20 4 0 0 0 2 4 6 8 Heat Dissipated--Watts Top is cut away to show detail Thermal Resistance From MTG Surface to Ambient--C/Watt 0 Mounting Surface Temp Rise Above Ambient--C 17.78 (0.700) 14.22 (0.560) 10 2.54 (0.100) 22.86 (0.900) 9.52 (0.375) 13.21 (0.520) Material: 1.02 (0.040) Thick Aluminum Finish: See Table ORDERING INFORMATION Part Number Finish 6237BG Black anodize 6237PBG Pre-black anodize* * Edges cut during the manufacturing process will be unfinished. See page 110 for more information 5690 Grease & Epoxy page112 High power, square basket heat sink with folded back fins 0 200 Air Velocity--Feet Per Minute 400 600 800 1000 Mounting Surface Temp Rise Above Ambient--C 100 5 80 4 60 3 40 2 20 1 0 0 0 4 8 12 16 Heat Dissipated--Watts Thermal Resistance From MTG Surface to Ambient--C/Watt THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES 6237 33.27 (1.310) @ BASE CL 1 "X" 6.35 (0.25) REF 2.41 (0.095) 4.83 (0.190) ORDERING INFORMATION CL2 Description High power, square basket, folded back fin heat sink R 1.98 (0.078) TYP 6 Base part no. Code A 01 11.18 (0.440) 33.27 (1.31) REF 1.78 TYP 2 (0.070) o 3.56 (0.140) TYP 2 DETAIL-A Material: 1.60 (0.063) Thick Aluminum Finish: Black Anodize POPULAR OPTIONS: 569022B0 00 00G Position 46.48 SQ. (1.83) REF 15.49 (0.61) REF 4.19 TYP 2 (0.165) CL1 14.73 TYP 2 (0.580) 569022B00000G 27.69 (1.09) REF CL 2 20 High power, square basket heat sink accommodates two TO-220 devices. Features folded back fins for increased surface area for maximum cooling. Part Number o 3.66 THRU (0.144) TYP 8 SEE DETAIL "A" "X" Mounting Kits page 99 A Description 6-32 Wave On threaded insert, 0.100 stand off 0.062 Bd Location Details Hole X Page 89 For additional options see page 82 42 sales.na@aavid.com www.shopaavid.com Clip on style heat sink featuring an integrated clip FIGURE A FIGURE B o 3.18 LOCKING CATCH (0.125) o 3.18 LOCKING CATCH (0.125) 22.86 (0.900) 5.97 (0.240) 13.56 (0.530) 0.50 (0.020) 25.15 (0.990) TAB Clip on style heat sink features an integrated clip to retain the device meaning no mounting hardware is required. Models have fins on both sides, left or right side and are available with solderable tabs for easy attachment to the PC board. 25.91 (1.020) 9.52 (0.380) 10.67 (0.420) Description Figure 574802B00000G Clip on heat sink, left & right side fins, no solderable tabs A 574802B03300G Left & right side fins with solderable tabs A 579802B00000G Left side fin, no solderable tabs B 579802B03300G Left side fin with solderable tab B 579902B00000G Right side fin, no solderable tabs B 579902B03300G Right side fin with solderable tab B 1.57 (0.062) 5.08 (0.200) 10.67 (0.420) Dia of PCB Plated Thru Hole for Tabs Note: Fins on left or right. Right hand side model shown 0 200 Air Velocity--Feet Per Minute 400 600 800 100 Mounting Surface Temp Rise Above Ambient--C Part Number 9.52 (0.375) 19.05 (0.750) Material: 0.63 (0.025) Thick Aluminum Finish: Black Anodize ORDERING INFORMATION 1.91 (0.075) 1.91 (0.075) 1.91 (0.075) 1000 20 80 16 60 12 40 8 20 4 0 0 0 For additional options see page 82 1 574802 579902 579802 2 3 4 Heat Dissipated--Watts 5 Low cost, clip on style heat sink featuring a locking tab 0 200 Air Velocity--Feet Per Minute 400 600 800 Mounting Surface Temp Rise Above Ambient--C 100 Low cost, clip on style heat sink features a locking tab to prevent the device from dislodging from the heat sink. Also includes slide runners to ensure proper device alignment. Available in a pre-black anodize finish. "B" 1000 20 80 16 60 12 40 8 20 4 0 0 0 1 6094 6049 6043 2 3 Heat Dissipated--Watts 4 Thermal Resistance From MTG Surface to Ambient--C/Watt 6043, 6049, 6094 0.51 (0.020) TAB 1.57 (0.062) 5.08 (0.200) 10.67 (0.420) 22.86 (0.900) Thermal Resistance From MTG Surface to Ambient--C/Watt 5748, 5798, 5799 THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES TO-220 Heat Sinks "D" "C" "A" 5 "E" Material: 0.63 (0.025) Thick Aluminum Finish: Pre-Black Anodize* ORDERING INFORMATION Part Number "A" Dim "B" Dim "C" Dim "D" Dim "E" Dim 6043PBG 25.40 (1.000) 16.51 (0.650) 10.16 (0.400) 20.32 (0.800) 6.81 (0.268) 6049PBG 25.40 (1.000) 16.51 (0.650) 10.16 (0.400) 13.97 (0.550) 6.81 (0.268) 6094PBG 19.71 (0.776) 14.73 (0.580) 10.92 (0.430) 20.32 (0.800) 6.45 (0.254) *Edges cut during the manufacturing process will be unfinished. See page 110 for more information sales.na@aavid.com www.shopaavid.com 43 TO-220 Heat Sinks 0 Air Velocity--Feet Per Minute 400 200 600 800 Mounting Surface Temp Rise Above Ambient--C 100 Slip on heat sink is tin plated and has integrated tabs for soldering to the PC board. Locating features provide simple device alignment and spring action holds the device for good thermal contact. 1000 20 80 16 60 12 40 8 20 4 0 0 0 1 PF750 PF758 2 3 Heat Dissipated--Watts 4 Thermal Resistance From MTG Surface to Ambient--C/Watt Slip on heat sink featuring integrated tabs 22.00 (0.866) 9.50 (0.374) "B" 5 "A" 11.00 (0.433) 1.70 (0.067) 11.00 (0.433) ORDERING INFORMATION Part Number Description "A" Dim "B" Dim PF750G Slip on heat sink with tabs 19.00(0.748) 3.00(0.118) PF758G Slip on heat sink with tabs 24.00(0.945) 5.20(0.205) Material: 0.71 (0.028) Thick Aluminum Finish: Tin Plate Slip on heat sink Air Velocity--Feet Per Minute 400 200 600 800 100 1000 20 80 16 0 60 12 40 8 20 4 0 Slip on heat sink has locating features for simple device alignment. Spring action holds the device for good thermal contact. 0 0 1 2 3 Heat Dissipated--Watts 4 Thermal Resistance From MTG Surface to Ambient--C/Watt PF752 Mounting Surface Temp Rise Above Ambient--C THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES PF750, PF758 19.00 (0.748) 22.00 (0.866) 5.00 (0.197) 11.00 (0.433) 3.00 (0.118) 10.70 (0.421) 15.00 (0.590) 5 Material: 0.71 (0.028) Thick Aluminum Finish: Black Anodize ORDERING INFORMATION Part Number Description PF752G Slip on heat sink PF720, PF723 Slip on heat sink Mounting Surface Temp Rise Above Ambient--C 100 8.10 (0.319) 80 40 Part Number Description PF720G Slip on heat sink, no solderable tabs PF723G With solderable tabs 20.00 (0.787) 16.00 (0.630) 20 4.50 (0.177) 0 ORDERING INFORMATION DIA 3.00 (0.118) 60 0 Slip on heat sink has locating features for simple device alignment. Spring action holds the device for good thermal contact. Available with or without solderable mounting tabs 3.00 (0.118) 19.84 (0.781) 1 2 3 Heat Dissipated - Watts 4 5 TAB 2.10 (0.083) 10.80 (0.425) 18.30 (0.720) 1.30 (0.051) Material: 0.71 (0.028) Thick Aluminum Finish: Pre-Black Paint* * Edges cut during manufacturing process will be unfinished 44 sales.na@aavid.com www.shopaavid.com 5744, 5745, 5746, 5749 Low cost, labor saving, slide on heat sink featuring spring action FIGURE A FIGURE B HOLDING TABS 21.08 (0.830) HOLDING TABS 3.18 (0.125) 9.02 (0.355) 4.19 (0.165) 21.84 (0.860) 9.02 (0.355) 21.84 (0.860) DITTIN o 3.81 (0.150) DITTIN "A" "A" 14.99 10.03 (0.590) (0.395) 11.81 (0.465) 11.81 14.99 (0.465) (0.590) 1.57 (0.062) 9.52 (0.375) 9.52 (0.375) TAB Description Figure "A" Dim 574402B00000G 574402B03200G Low cost slide on heat sink, no solderable tabs A 19.05 (0.750) With solderable tabs for horizontal mounting A 19.05 (0.750) Low cost slide on heat sink, no solderable tabs B 19.05 (0.750) 574502B03300G With solderable tabs for vertical mounting B 19.05 (0.750) 574602B00000G Low cost slide on heat sink , no solderable tabs B 17.53 (0.690) 574602B03300G With solderable tabs for vertical mounting B 17.53 (0.690) 574902B00000G Low cost slide on heat sink , no solderable tabs B 35.05 (1.380) 574902B03300G With solderable tabs for vertical mounting B 35.05 (1.380) 1.91 (0.075) 1.91 (0.075) 1.91 (0.075) 16 60 12 40 8 20 4 0 0 0 1 0 200 2 3 4 Heat Dissipated--Watts Air Velocity--Feet Per Minute 400 600 800 16 60 12 40 8 20 4 0 0 0 1 2 3 Heat Dissipated--Watts Mounting Surface Temp Rise Above Ambient--C Low cost, labor saving, slide on heat sink features spring action to firmly hold the device tab to the heat sink providing maximum metal to metal contact and good thermal conduction. Includes a clearance hole in the top side to allow the use of optional hardware to attach device and heat sink to circuit board or other surface. Also available with solderable tabs for vertical mounting to the PC board. 80 16 60 12 40 8 20 4 0 0 0 Part Number Description 574102B00000G Low cost slide on heat sink, no solderable tabs 574102B03300G With solderable tabs 1 2 3 4 Heat Dissipated--Watts 1.91 (0.075) 5 9.02 (0.355) 21.84 (0.860) 7.62 (0.300) CLEARANCE o 3.81 (0.150) THRU 5 19.05 (0.750) 14.99 11.81 (0.590) (0.465) DITTIN TAB Dia of PCB Plated Thru Hole for Tabs ORDERING INFORMATION 1000 20 Thermal Resistance From MTG Surface to Ambient--C/Watt Air Velocity--Feet Per Minute 400 200 600 800 4 Mounting Kits page 99 Low cost, labor saving, slide on heat sink featuring spring action 0 1000 20 80 574602 574902 100 5 100 For additional options see page 82 5741 1000 20 80 574402 574502 1.91 (0.075) Mounting Surface Temp Rise Above Ambient--C 574502B00000G Dia of PCB Plated Thru Hole for Tabs Mounting Surface Temp Rise Above Ambient--C ORDERING INFORMATION Air Velocity--Feet Per Minute 400 200 600 800 100 Thermal Resistance From MTG Surface to Ambient--C/Watt Material: 0.63 (0.025) Thick Aluminum Finish: Black Anodize 0 Part Number 1.57 (0.062) 10.03 (0.400) 5.33 (0.210) 20.57 (0.810) Thermal Resistance From MTG Surface to Ambient--C/Watt Low cost, labor saving, slide on heat sink features spring action to firmly hold the device tab to the heat sink providing maximum metal to metal contact and good thermal conduction. Available with solderable tabs for horizontal or vertical mounting to the PC board. THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES TO-220 Heat Sinks 9.52 (0.375) 20.57 (0.810) 1.57 (0.062) 5.33 (0.210) 10.03 (0.395) POPULAR OPTIONS: 574102B0 00 00G Base part no. Position Code A 37 A Material: 0.63 (0.025) Thick Aluminum Finish: Black Anodize Description Details Solderable tab with step to limit insertion depth Page 92 For additional options see page 82 sales.na@aavid.com www.shopaavid.com 45 TO-220 Heat Sinks Snap down style heat sink featuring two side fins FIGURE A FIGURE B o 3.15 (0.124) LOCKING CATCH 12.32 (0.485) 14.22 (0.560) 19.05 (0.750) o 3.81 (0.150) THRU 24.89 (0.980) "A" Snap down style heat sink features two side fins that act as springs to hold the semiconductor firmly to the heat sink. Models include an integrated clip and device locking catch for more robust applications. Available for both standard and bevel edged TO-220 packages. 19.05 (0.750) "A" 28.45 (1.120) 11.18 (0.440) 11.18 (0.440) View A-A 579302 11.18 (0.440) View A-A 579402 200 Air Velocity--Feet Per Minute 400 600 800 100 ORDERING INFORMATION Part Number Description 575102B00000G Snap down heat sink A 579302B00000G With integrated clip and locking catch B 579402B00000G With integrated clip and locking catch for TO-220 with beveled edge For additional options see page 82 Figure B 80 8 60 6 40 4 20 2 0 0 0 1 0 200 579302 579402 2 3 4 Heat Dissipated--Watts Air Velocity--Feet Per Minute 400 600 800 Mounting Surface Temp Rise Above Ambient--C 100 46 5 1000 20 80 16 60 12 40 8 20 4 0 0 0 575102 1000 10 1 2 3 4 Heat Dissipated--Watts Thermal Resistance From MTG Surface to Ambient--C/Watt 0 Thermal Resistance From MTG Surface to Ambient--C/Watt Material: 0.63 (0.025) Thick Aluminum Finish: Black Anodize Mounting Surface Temp Rise Above Ambient--C THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES 5751, 5793, 5794 5 sales.na@aavid.com www.shopaavid.com Grease & Epoxy page112 Space saving staggered fin heat sink 0 200 Air Velocity--Feet Per Minute 400 600 800 Mounting Surface Temp Rise Above Ambient--C 100 Space saving staggered fin heat sink for vertical mounting TO-220 devices. Features solderable mounting tabs for easy attachment to the PC board. 1000 10 80 8 60 6 40 4 20 2 0 0 0 1 2 3 4 Heat Dissipated--Watts Thermal Resistance From MTG Surface to Ambient--C/Watt 6225 8.00 (0.315) 27.18 (1.070) o3.18 (0.125) THRU 15.16 (0.597) Part Number Description 6225B-MTG Space saving staggered fin heat sink 4.83 (0.190) 5 2.02 (0.080) 3.18 (0.125) 2.28 (0.090) 17.78 (0.700) 26.01 (1.024) Dia of PCB Plated Thru Hole for Tabs ORDERING INFORMATION Mounting Kits page 99 Material: 1.02 (0.040) Thick Aluminum Finish: Black Anodize 2.90 (0.114) For additional options see page 85 1000 10 80 8 60 6 40 4 200 20 2 0 0 0 2 4 6 8 Heat Dissipated--Watts 35.05 (1.380) o 3.18 2x (0.125) 50.80 (2.000) 10 25.40 (1.000) 4.75 (0.187) 2.46 (0.097) Dia of PCB Plated Thru Hole for Tabs ORDERING INFORMATION Part Number Description 6032DG Copper space saving staggered fin heat sink 3.10 (0.122) Mounting Surface Temp Rise Above Ambient--C Space saving staggered fin heat sink for vertical mounting TO-220 devices. Features staked on solderable mounting tabs for easy attachment to the PC board. ORDERING INFORMATION Dia of PCB Plated Thru Hole for Tabs Part Number Finish 6022PBG Pre-black anodize* 2.36 (0.093) 6022BG Black anodize 2.36 (0.093) 25.40 (1.000) Grease & Epoxy page112 Air Velocity--Feet Per Minute 400 600 800 100 1000 10 80 8 60 6 40 4 200 20 2 0 0 0 18.28 (0.720) Material: 1.27 (0.050) Thick Copper Finish: Tin Plated Space saving staggered fin heat sink 0 Mounting Kits page 99 12.70 (0.500) Thermal Resistance From MTG Surface to Ambient--C/Watt Mounting Surface Temp Rise Above Ambient--C Copper, space saving staggered fin heat sink for vertical mounting TO-220 devices. Features solderable mounting tabs for easy attachment to the PC board. Air Velocity--Feet Per Minute 400 600 800 100 0 6022 Grease & Epoxy page112 Copper, space saving staggered fin heat sink 2 4 6 8 Heat Dissipated--Watts 10 Thermal Resistance From MTG Surface to Ambient--C/Watt 6032 THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES TO-220 Heat Sinks Mounting Kits page 99 6.35 (0.250) 22.23 (0.875) o 3.18 (0.125) 30.73 (1.210) 18.54 (0.730) 1.07 (0.042) 2.79 (0.110) 1.78 (0.070) 17.78 (0.700) Material: 1.02 (0.040) Thick Aluminum Finish: See Table *Edges cut during the manufacturing process will be unfinished. See page 110 for more information For additional options see page 85 sales.na@aavid.com www.shopaavid.com 47 TO-220 Heat Sinks Grease & Epoxy page112 Space saving staggered fin heat sink Air Velocity--Feet Per Minute 400 200 600 800 1000 100 5 80 4 60 3 40 2 20 1 0 0 0 2 4 6 8 Heat Dissipated--Watts 13.00 (0.512) o 3.18 2x (0.125) 45.06 (1.774) 20.04 (0.789) 10 4.83 (0.190) 12.70 (0.500) 13.34 (0.525) Dia of PCB Plated Thru Hole for Tabs ORDERING INFORMATION Part Number Finish 6232B-MTG Black anodize 3.10 (0.122) 6232PB-MTG Pre-black anodize* 3.10 (0.122) Mounting Kits page 99 35.00 (1.378) Thermal Resistance From MTG Surface to Ambient--C/Watt Space saving staggered fin heat sink for vertical mounting TO-220 devices. Features solderable mounting tabs with triangular base for easy attachment to the PC board. Mounting Surface Temp Rise Above Ambient--C 0 25.40 (1.000) 2.29 (0.090) 2.67 (0.105) Material: 1.27 (0.050) Thick Aluminum Finish: See Table *Edges cut during the manufacturing process will be unfinished. See page 110 for more information For additional options see page 85 Grease & Epoxy page112 Copper, space saving staggered fin heat sink 0 Air Velocity--Feet Per Minute 400 200 600 800 100 Copper, space saving staggered fin heat sink for vertical mounting TO-220 devices. Features integrated solderable mounting tabs for easy attachment to the PC board. 1000 10 80 8 60 6 40 4 20 2 0 0 0 1 2 3 Heat Dissipated--Watts 4 o 3.18 (0.125) THRU 31.75 (1.250) 19.56 (0.770) 8.89 (0.350) 5 17.78 (0.700) 6.34 (0.250) Part Number Description 6025DG Copper, space saving staggered fin heat sink with solderable tabs 3.96 (0.156) 1.57 (0.062) 22.22 (0.875) Dia of PCB Plated Thru Hole for Tabs ORDERING INFORMATION Mounting Kits page 99 10.67 (0.420) Thermal Resistance From MTG Surface to Ambient--C/Watt 6025 Mounting Surface Temp Rise Above Ambient--C THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES 6232 Material: 1.27 (0.050) Thick Copper Finish: Tin Plated 2.54 (0.100) For additional options see page 85 Grease & Epoxy page112 Space saving twisted fin heat sink 1000 10 80 8 60 6 40 4 Mounting Surface Temp Rise Above Ambient--C 0 Space saving twisted fin heat sink for vertical mounting TO-220 devices. Features solderable mounting tabs for easy attachment to the PC board. Air Velocity--Feet Per Minute 400 600 800 100 200 20 2 0 0 0 2 4 6 8 Heat Dissipated--Watts 10 35.05 (1.380) 16.51 (0.650) CL 50.80 (2.000) 25.40 (1.000) Dia of PCB Plated Thru Hole for Tabs ORDERING INFORMATION Part Number Description 593202B03500G Space saving twisted fin heat sink with solderable tabs 2.84 (0.112) Mounting Kits page 99 12.20 (0.480) Thermal Resistance From MTG Surface to Ambient--C/Watt 5932 4.75 (0.187) o 3.17 (0.125) THRU TYP 2 18.30 (0.720) 2.46 (0.097) 0.81 (0.032) 25.40 (1.000) POPULAR OPTIONS: 593202B0 00 00G Base part no. Position Code A 34 A Description Details Solderable tab for 0.094 plated thru hole Page 92 Material: 1.27 (0.050) Thick Aluminum Finish: Black Anodize For additional options see page 82 48 sales.na@aavid.com www.shopaavid.com Grease & Epoxy page112 Space saving staggered fin heat sink ORDERING INFORMATION Mounting Surface Temp Rise Above Ambient--C Space saving staggered fin heat sink for vertical mounting TO-220 devices. Features integrated solderable mounting tabs that can be twisted for attachment to the PC board. Heat sink is also available with tin plating for soldering directly to the PC board. Air Velocity--Feet Per Minute 400 200 600 800 100 1000 20 80 16 60 12 40 8 20 4 0 0 0 0 1 2 3 4 Heat Dissipated--Watts o 3.17 (0.125) THRU 19.56 (0.770) Finish 542502B00000G Black anodize 2.39 (0.094) 542502D00000G Tin plated 2.39 (0.094) 1.57 (0.062) 17.78 (0.700) 22.22 (0.875) 6.35 (0.250) Material: 1.27 (0.050) Thick Aluminum Finish: See Table 1000 20 80 16 60 12 40 8 Finish Dia of PCB Plated Thru Hole for Tabs 592502B03400G Black anodize 2.39 (0.094) 592502U03400G Unfinished 2.39 (0.094) 200 20 4 0 0 0 1 2 3 4 Heat Dissipated--Watts 5 Mounting Kits page 99 22.20 (0.875) Thermal Resistance From MTG Surface to Ambient--C/Watt Mounting Surface Temp Rise Above Ambient--C Space savings twisted fin heat sink for vertical mounting TO-220 devices. Features staked on solderable mounting tabs for easy attachment to the PC board. Air Velocity--Feet Per Minute 400 600 800 100 0 Part Number Grease & Epoxy page112 Space saving twisted fin heat sink ORDERING INFORMATION 1.27 (0.050) 3.96 (0.156) 8.89 (0.350) For additional options see page 82 5925 31.75 (1.250) 5 Dia of PCB Plated Thru Hole for Tabs Part Number Mounting Kits page 99 10.67 (0.420) Thermal Resistance From MTG Surface to Ambient--C/Watt 5425 THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES TO-220 Heat Sinks o 3.17 THRU (0.125) 6.35 (0.250) CL 31.75 (1.250) 19.56 (0.770) 17.78 (0.700) 1.91 2x (0.075) 5.03 (0.198) Material: 1.27 (0.050) Thick Aluminum Finish: See Table For additional options see page 82 sales.na@aavid.com www.shopaavid.com 49 TO-220 Heat Sinks Grease & Epoxy page112 Extruded heat sink with radial fins ORDERING INFORMATION Mounting Surface Temp Rise Above Ambient--C Extruded heat sink with radial fins and channel clip attach feature make device attachment easy. Includes clip and two solderable mounting pins which permit vertical mounting and eliminate stress on device leads. Available in three heights for TO-220 devices. 1000 8 60 6 40 4 20 2 0 0 2 533802 534002 533902 "A" Dim Dia of PCB Plated Thru Hole for Pins 533802B02554G 25.40 (1.000) 2.67 (0.105) 533902B02554G 38.10 (1.500) 2.67 (0.105) 534002B02554G 50.80 (2.000) 2.67 (0.105) Part Number 10 80 0 4 6 8 Heat Dissipated--Watts 12.32 (0.485) 6.15 (0.242) Thermal Resistance From MTG Surface to Ambient--C/Watt 0 Air Velocity--Feet Per Minute 400 200 600 800 100 10 2.34 (0.092) 7.92 "A" o 1.78 x 10.19 (0.312) (0.070) (0.401) SLOT TYP 2 1.52 (0.060) 10.92 (0.430) 18.29 (0.720) 11.10 (0.437) 25.40 (1.000) 9.91 (0.390) 3.18 (0.125) 3.96 (0.156) 14.22 (0.560) 3.18 (0.125) CLIP 54 12.70 (0.500) 15.88 (0.625) 34.93 (1.375) Material: Aluminum Finish: Black Anodize For additional options see page 83 0 "A" Dim Dia of PCB Plated Thru Hole for Pins 532602B02500G 38.10 (1.500) 2.67 (0.105) 532702B02500G 50.80 (2.000) 2.67 (0.105) 532802B02500G 63.50 (2.500) 2.67 (0.105) ORDERING INFORMATION Part Number Grease & Epoxy page112 High power extruded heat sink with large radial fins Air Velocity--Feet Per Minute 400 200 600 800 1000 100 5 80 4 60 3 40 2 20 1 0 0 0 4 532602 532702 532802 8 12 16 Heat Dissipated--Watts o 3.66 (0.144) THRU "A" 19.05 (0.750) 20 12.70 25.40 (0.500) (1.000) Material: Aluminum Finish: Black Anodize 41.91 (1.650) Grease & Epoxy page112 Extruded channel style heat sink featuring serrated fins Mounting Surface Temp Rise Above Ambient--C Extruded channel style heat sink features serrated fins for increased cooling capacity. The base of the heat sink is notched to clear the device leads when mounted horizontally on the printed circuit card. Narrow channel accommodates a TO-220 device. ORDERING INFORMATION 80 16 60 12 40 8 20 4 0 0 0 2 4 6 8 Heat Dissipated--Watts 10 20.00 (0.787) 2.15 (0.085) 15.00 (0.591) o 3.15 (0.124) THRU 7.49 (0.295) 25.00 (0.984) 19.50 6.00 (0.768) (0.236) Description Extruded channel style heat sink Mounting Kits page 99 2.00 (0.079) 1000 20 Thermal Resistance From MTG Surface to Ambient--C/Watt Air Velocity--Feet Per Minute 400 200 600 800 100 ML26AAG 25.40 (1.000) 2.54 (0.100) 11.68 (0.460) 0 Part Number 3.96 (0.156) 2.36 (0.093) For additional options see page 83 ML26AA Mounting Kits page 99 20.96 (0.825) Thermal Resistance From MTG Surface to Ambient--C/Watt 5326, 5327, 5328 High power extruded heat sink with large radial fins and increased fin count for additional cooling capacity. Solderable pins allow vertical mounting without stress on the device leads. Available in three heights for TO-220 devices. 50 2.41 2x (0.095) o 3.18 x 0.63 (0.125) (0.025) HIGH DITTIN o 2.36 (0.093) Mounting Surface Temp Rise Above Ambient--C THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES 5338, 5339, 5340 10.30 (0.406) Material: Aluminum Finish: Black Anodize sales.na@aavid.com www.shopaavid.com 5912 Plug in style heat sink featuring four spring action clips FIGURE B FIGURE A TAB 1.27 (0.050) 14.48 (0.570) MAX 12.70 4.10 (0.500) (0.160) 0.81 (0.032) 1.27 (0.050) 0.81 (0.032) 3.81 (0.150) 12.70 (0.500) 15.24 (0.600) Figure Dia of PCB Plated Thru Hole for Tabs Part Number Description 591202B00000G Plug in style heat sink, no mounting tab A 591202B03100G With horizontal mounting tab A 1.73 (0.068) 591202B04000G With vertical mounting tab B 1.75 (0.069) 0 200 Air Velocity--Feet Per Minute 400 600 800 100 For additional options see page 84 1000 20 80 16 60 12 40 8 20 4 0 0 0 1 2 3 4 Heat Dissipated--Watts Thermal Resistance From MTG Surface to Ambient--C/Watt Material: 0.81 (0.032) Thick Aluminum Finish: Black Anodize ORDERING INFORMATION 5913 12.70 (0.500) 6.22 (0.245) 15.24 (0.600) 12.70 (0.500) Mounting Surface Temp Rise Above Ambient--C Plug in style heat sink features four spring action clips to firmly hold the device to the heat sink ensuring maximum metal to metal thermal contact. Available with solderable mounting tabs for both horizontal and vertical mounting to the PC board. 14.48 (0.570) MAX THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES TO-220 & TO-262 Heat Sinks 5 Plug in style heat sink featuring four spring action clips FIGURE A FIGURE B 1.27 (0.050) TAB MAX 14.48 (0.570) 1.02 (0.040) 3.15 (0.124) 12.70 (0.500) 12.70 (0.500) 2.67 (0.105) 19.05 (0.750) 0.81 (0.032) 19.05 (0.750) 12.70 (0.500) 6.22 (0.245) 12.70 (0.500) Material: 0.81 (0.032) Thick Aluminum Finish: Black Anodize 0 200 Air Velocity--Feet Per Minute 400 600 800 ORDERING INFORMATION Figure Dia of PCB Plated Thru Hole for Tabs Part Number Description 591302B00000G Plug in style heat sink with integrated standoffs, no mounting tab B 591302B02800G With Shur-LockTM tab for vertical mounting A 1.73 (0.068) 591302B04000G With tab for vertical mounting B 1.75 (0.069) Mounting Surface Temp Rise Above Ambient--C 100 For additional options see page 84 14.48 (0.570) MAX 3.15 (0.124) 1000 10 80 8 60 6 40 4 20 2 0 0 0 1 2 3 4 Heat Dissipated--Watts Thermal Resistance From MTG Surface to Ambient--C/Watt Plug in style heat sink features four spring action clips to firmly hold the device to the heat sink ensuring maximum metal to metal thermal contact. Includes 2 integrated standoffs to steady the heat sink during wave soldering. Available with solderable mounting tabs for vertical mounting to the PC board. 1.02 (0.040) 5 sales.na@aavid.com www.shopaavid.com 51 TO-220 & TO-262 Heat Sinks Plug in style heat sink featuring four spring action clips FIGURE B FIGURE A 14.48 (0.570) MAX 19.05 (0.750) Plug in style heat sink features four spring action clips to firmly hold the device to the heat sink ensuring maximum metal to metal thermal contact. Available with solderable mounting tabs for both horizontal and vertical mounting to the PC board. 14.48 (0.570) MAX 19.05 (0.750) 12.70 (0.500) 1.27 (0.050) 0.813 (0.032) 4.19 (0.165) 4.06 (0.160) 12.70 (0.500) 12.70 (0.500) 6.22 (0.245) TAB 0.81 (0.032) 1.27 (0.050) 12.70 (0.500) ORDERING INFORMATION Figure Dia of PCB Plated Thru Hole for Tabs Part Number Description Finish 576802B00000G Slim plug in heat sink, no mounting tab A 576802V00000G Slim plug in heat sink, no mounting tab A Black anodize AavSHIELD3 576802U00000G Slim plug in heat sink, no mounting tab A Unfinished 576802B03100G With single tab for horizontal mounting A 576802V03100G With single tab for horizontal mounting A Black anodize AavSHIELD3 576802U03100G With single tab for horizontal mounting A Unfinished 1.73 (0.068) 576802B04000G With single tab for vertical mounting B 1.75 (0.069) 1.75 (0.069) 576802V04000G With single tab for vertical mounting B Black anodize AavSHIELD3 576802U04000G With single tab for vertical mounting B Unfinished 0 Air Velocity--Feet Per Minute 400 200 600 800 100 1.73 (0.068) 1.73 (0.068) 80 8 60 6 40 4 20 2 0 0 0 1 2 3 Heat Dissipated--Watts 576802B 576802V 579602U 1.75 (0.069) 1000 10 4 Thermal Resistance From MTG Surface to Ambient--C/Watt Material: 0.81 (0.032) Thick Aluminum Finish: See Table Mounting Surface Temp Rise Above Ambient--C THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES 5768 5 For additional options see page 84 Plug in style heat sink features pre-blackened finish FIGURE A FIGURE C FIGURE B 4.00 (0.157) 19.50 (0.768) 19.50 (0.768) Plug in style heat sink features pre-blackened finish and two spring action clips to firmly hold the device to the heat sink ensuring maximum metal to metal thermal contact. Available with solderable mounting tabs for both horizontal and vertical mounting to the PC board. 12.70 (0.500) 0.40 (0.016) 5.00 (0.197) 0.40 (0.016) o 3.00 (0.118) 5.70 (0.224) Part Number Description Figure Dim "A" PF432G Plug in style heat sink with solderable tab, vertical mount A 6.20 (0.244) 1.60 (0.063) PF433G With vertical mount no tab A PF434G With solderable tab, horizontal mount B PF435G With solderable tab, vertical mount A With solderable tab offset from center, horizontal mount 52 o 3.00 (0.118) 7.50 (0.295) Material: 0.71 (0.028) Thick Aluminum Finish: Pre-Black Anodize* ORDERING INFORMATION PF436G 0.27 (0.010) 12.70 (0.500) Dia of PCB Plated Thru Hole for Tabs *Edges cut during the manufacturing process will be unfinished. See page 110 for more information 2.85 (0.112) 1.30 (0.051) 7.50 o 3.00 (0.295) (0.118) "A" 13.00 (0.512) 4.00 (0.157) 12.70 (0.500) 12.00 (0.472) 1.30 (0.051) 13.00 (0.512) 16.80 (0.661) C 1.60 (0.063) 9.50 (0.374) 1.60 (0.063) 1.60 (0.063) 0 200 Air Velocity--Feet Per Minute 400 600 800 100 Case Temp Rise Above Ambient--C TAB 13.00 (0.512) 19.50 (0.768) 1000 10 80 8 60 6 40 4 20 2 0 0 0 1 2 3 Heat Dissipated--Watts 4 Thermal Resistance From Case to Ambient--C/Watt PF432, PF433, PF434, PF435, PF436 5 sales.na@aavid.com www.shopaavid.com TO-220 & TO-262 Heat Sinks Plug in style heat sink with folded back fins FIGURE A FIGURE B 21.59 (0.850) 25.40 (1.000) Plug in style heat sink with folded back fins for extra cooling capacity. Features four spring action clips to firmly hold the device to the heat sink ensuring maximum metal to metal thermal contact. Available with or without solderable mounting tabs for both horizontal and vertical mounting to the PC board. 6.20 (0.245) TAB 1.27 (0.050) 25.40 (1.000) 21.59 (0.850) CL 12.70 (0.500) 4.06 (0.160) 0.81 (0.032) 12.70 (0.500) TAB 1.27 (0.050) 14.86 (0.585) 12.70 (0.500) 0.81 (0.032) 12.70 (0.500) ORDERING INFORMATION Figure Dia of PCB Plated Thru Hole for Tabs Part Number Description 566902B00000G Plug in style heat sink with no mounting tab A 566902B03100G With horizontal mounting tab A 1.73 (0.068) 566902B04000G With vertical mounting tab B 1.75 (0.069) 0 200 Air Velocity--Feet Per Minute 400 600 800 Mounting Surface Temp Rise Above Ambient--C 100 For additional options see page 82 1000 10 80 8 60 6 40 4 20 2 0 0 0 1 2 3 4 Heat Dissipated--Watts Thermal Resistance From MTG Surface to Ambient--C/Watt Material: 0.81 (0.032) Thick Aluminum Finish: Black Anodize THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES 5669 5 TO-220 & TO-218 & TO-247 Heat Sinks Grease & Epoxy page112 Hat section heat sink with twisted fins 0 Air Velocity--Feet Per Minute 400 200 600 800 Mounting Surface Temp Rise Above Ambient--C 100 1000 25 80 20 60 15 40 10 20 5 0 0 0 Hat section heat sink with twisted fins is low profile and perfect for use on circuit cards with 0.500 spacing. The twisted fins increase air turbulence for better thermal performance. TV96 TV97 1 2 3 Heat Dissipated--Watts 4 5 Mounting Kits page 99 17.80 (0.701) Thermal Resistance From MTG Surface to Ambient--C/Watt TV96, TV97 10.20 (0.402) o 3.66 (0.144) CL 17.80 (0.701) 13.50 (0.531) "A" Material: 0.99 (0.039) Thick Aluminum Finish: Black Anodize ORDERING INFORMATION Part Number "A" Dim TV96G 31.70 (1.248) TV97G 44.40 (1.748) sales.na@aavid.com www.shopaavid.com 53 TO-220 & TO-218 & TO-247 Heat Sinks Grease & Epoxy page112 High rise style heat sink features twisted fins and Wave-OnTM solderable mounts 10.16 (0.400) High rise style heat sink features twisted fins and Wave-OnTM solderable mounts for easy attachment to the PC card. Models include thru holes on one side to attach devices using standard hardware and dittins with special slots on the other for easy device attachment using a convenient spring clip. Dual models use two dittins and clips to locate and attach devices. FIGURE A FIGURE B 30.61 (1.205) 30.61 (1.205) 4.06 (0.160) TYP CLIP 50 4.06 (0.160) TYP CLIP 62 6.60 (0.260) o 2.79 x 0.76 (0.110) (0.030) HIGH DITTIN 44.45 (1.750) 2.54 (0.100) 1.57 (0.062) 2.54 (0.100) 3.00 (0.118) 2.54 (0.100) 14.99 (0.590) 14.99 (0.590) 12.45 (0.490) 12.45 (0.490) 3.48 (0.137) 4.24 (0.167) 6.60 (0.260) O 2.79 x 0.76 (0.110) (0.030) 2X HIGH DITTIN 1.57 (0.062) 7.50 (0.295) 7.62 (0.300) 12.70 (0.500) 12.70 (0.500) 24.13 (0.950) 44.45 (1.750) o 3.20 (0.126) THRU "A" Mounting Kits page 99 Material: 1.60 (0.063) Thick Aluminum Finish: Black Anodize 0 200 Air Velocity--Feet Per Minute 400 600 800 1000 100 "A" Dim Dia of PCB Plated Thru Hole for Tabs 21.08 (0.830) 4.75 (0.187) 21.08 (0.830) 4.75 (0.187) ORDERING INFORMATION Part Number Description Device Figure 530101B00100G Heat sink twisted fin TO-218, TO-247 530101B00150G With device clip #50 TO-218, TO-247 530102B00100G Heat sink twisted fin A TO-220 18.29 (0.720) 4.75 (0.187) 530102B00150G With device clip #50 TO-220 A 18.29 (0.720) 4.75 (0.187) 530161B00162G With two device clips #62 Dual TO-218, TO-247 B 21.08 (0.830) 4.75 (0.187) 530162B00162G With two device clips #62 Dual TO-220 B 18.29 (0.720) 5 80 4 60 3 40 2 20 1 0 0 0 4 8 12 Heat Dissipated--Watts 16 Thermal Resistance From MTG Surface to Ambient--C/Watt BASE PART Mounting Surface Temp Rise Above Ambient--C THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES 5301 20 530161 or 530162 530101 or 530102 4.75 (0.187) For additional options see page 82 5308 Grease & Epoxy page112 High rise style heat sink features twisted fins and solderable tabs BASE PART FIGURE B 30.61 (1.205) 30.61 (1.205) o 2.95 THRU 2x (0.116) RECOMMENDED HOLE PATTERN 43.13 (1.698) 45.72 (1.800) High rise style heat sink features twisted fins and solderable tabs for easy attachment to the PC card. Models include thru holes on one side to attach devices using standard hardware and dittins with special slots on the other for easy device attachment using a convenient spring clip. Dual models use two dittins and clips to locate and attach devices. FIGURE A CLIP 50 o 3.20 (0.126) 12.70 (0.500) 4.06 (0.160) TYP CLIP 62 6.60 (0.260) o 2.79 x 0.76 (0.110) (0.030) HIGH DITTIN 44.45 (1.750) "A" Mounting Kits page 99 12.70 (0.500) 4.06 (0.160) TYP 6.60 (0.260) o 2.79 X 0.76 (0.110) (0.030) 2X HIGH DITTIN 7.62 (0.300) 10.16 (0.400) 14.99 14.99 (0.590) (0.590) 2.54 (0.100) 3.00 (0.118) 22.90 (0.900) 12.45 (0.490) 12.45 (0.490) 3.48 (0.137) Material: 1.60 (0.063) Thick Aluminum Finish: Black Anodize 46.74 (1.841) 21.08 (0.830) 2.95 (0.116) ORDERING INFORMATION Part Number Description Device 530801B05100G Heat sink twisted fin and solderable tabs TO-218, TO-247 530801B05150G With device clip #50 TO-218, TO-247 530802B05100G Heat sink twisted fin and solderable tabs TO-220 530802B05150G With device clip #50 TO-220 530861B05162G With two device clips #62 530862B05162G With two device clips #62 For additional options see page 82 54 Figure A 21.08 (0.830) 2.95 (0.116) 18.29 (0.720) 2.95 (0.116) A 18.29 (0.720) 2.95 (0.116) Dual TO-218, TO-247 B 21.08 (0.830) 2.95 (0.116) Dual TO-220 B 18.29 (0.720) 2.95 (0.116) Air Velocity--Feet Per Minute 400 600 800 1000 100 Mounting Surface Temp Rise Above Ambient--C "A" Dim Dia of PCB Plated Thru Hole for Tabs 200 5 80 4 60 3 40 2 20 1 0 0 0 4 8 12 Heat Dissipated--Watts 16 Thermal Resistance From MTG Surface to Ambient--C/Watt 0 20 530861 or 530862 530801 or 530802 sales.na@aavid.com www.shopaavid.com Grease & Epoxy page112 High rise style heat sink features staggered fins and Wave-OnTM solderable mounts 0 200 Air Velocity--Feet Per Minute 400 600 800 5 80 4 60 3 40 2 20 1 Mounting Surface Temp Rise Above Ambient--C 100 High rise style heat sink features staggered fins and Wave-OnTM solderable mounts for easy attachment to the PC card. Models include thru holes on one side to attach devices using standard hardware and dittins with special slots on the other for easy device attachment using a convenient spring clip. 0 0 0 4 8 12 16 Heat Dissipated--Watts Mounting Kits page 99 30.61 (1.205) 1000 Thermal Resistance From MTG Surface to Ambient--C/Watt 5304 12.70 (0.500) 10.16 (0.400) CLIP 50 24.13 (0.950) 44.45 (1.750) 4.06 TYP (0.160) 19.05 (0.750) o 3.20 THRU (0.126) o 2.79 x 0.76 (0.110) (0.030) HIGH DITTIN 20 7.49 (0.295) 44.45 (1.750) 6.60 (0.260) "A" ORDERING INFORMATION "A" Dim Dia of PCB Plated Thru Hole for Tabs TO-218, TO-247 21.08 (0.830) 4.75 (0.187) TO-218, TO-247 21.08 (0.830) 4.75 (0.187) High rise style heat sink staggered fins TO-220 18.29 (0.720) 4.75 (0.187) With device clip #50 TO-220 18.29 (0.720) 4.75 (0.187) Part Number Description Device 530401B00100G High rise style heat sink staggered fins 530401B00150G With device clip #50 530402B00100G 530402B00150G 1.57 7.62 (0.300) (0.060) 2.54 (0.100) 3.00 (0.118) 4.24 (0.167) 14.99 (0.590) 3.48 (0.137) 2.54 (0.100) 12.45 (0.490) 14.99 (0.590) Material: 1.60 (0.063) Thick Aluminum Finish: Black Anodize THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES TO-220 & TO-218 & TO-247 Heat Sinks For additional options see page 82 Grease & Epoxy page112 Air Velocity--Feet Per Minute 400 200 600 800 Mounting Surface Temp Rise Above Ambient--C 1000 10 80 8 60 6 40 4 20 2 0 0 0 2 53300X 53310X 8 Air Velocity--Feet Per Minute 400 600 800 80 8 60 6 40 4 20 2 0 0 0 53320X 53330X 2 4 6 Heat Dissipated--Watts 8 "A" NOTCH FOR CLIP 2x 1000 10 200 o 3.18 X 0.64 (0.125) (0.025) HIGH DITTIN "B" 10 100 0 Mounting Surface Temp Rise Above Ambient--C Extruded heat sink with radial fins and clip attach feature makes device attachment easy. Includes two solderable mounting pins which permit vertical mounting and eliminate stress on device leads. Available in four heights for TO-220, TO-218 and TO-247 devices. 4 6 Heat Dissipated--Watts Thermal Resistance From MTG Surface to Ambient--C/Watt 0 100 Thermal Resistance From MTG Surface to Ambient--C/Watt 5330, 5331, 5332, 5333 Extruded heat sink with radial fins 3.96 2x (0.156) 2.36 2x (0.093) 25.40 (1.000) "C" 12.70 (0.500) 34.92 (1.375) 6.60 (0.260) 39.10 (1.540) 10 13.50 (0.530) CLIP 51 "A" Dim "B" Dim "C" Dim Dia of PCB Plated Thru Hole for Pins TO-218, TO-247 25.40 (1.000) 21.59 (0.850) 17.02 (0.670) 2.67 (0.105) TO-220 25.40 (1.000) 18.29 (0.720) 15.88 (0.625) 2.67 (0.105) 533101B02551G TO-218, TO-247 38.10 (1.500) 21.59 (0.850) 17.02 (0.670) 2.67 (0.105) 533102B02551G TO-220 38.10 (1.500) 18.29 (0.720) 15.88 (0.625) 2.67 (0.105) 533201B02551G TO-218, TO-247 50.80 (2.000) 21.59 (0.850) 17.02 (0.670) 2.67 (0.105) 533202B02551G TO-220 50.80 (2.000) 18.29 (0.720) 15.88 (0.625) 2.67 (0.105) 533301B02551G TO-218, TO-247 63.50 (2.500) 21.59 (0.850) 17.02 (0.670) 2.67 (0.105) 533302B02551G TO-220 63.50 (2.500) 18.29 (0.720) 15.88 (0.625) 2.67 (0.105) ORDERING INFORMATION Part Number Device 533001B02551G 533002B02551G Material: Aluminum Finish: Black Anodize For additional options see page 83 sales.na@aavid.com www.shopaavid.com 55 TO-220 & TO-218 & TO-247 Heat Sinks 80 8 60 6 40 4 20 2 0 0 0 2 SW25 SW38 0 4 6 Heat Dissipated--Watts 8 Air Velocity--Feet Per Minute 400 200 600 800 100 1000 10 8 60 6 40 4 20 2 0 0 0 2 4 6 Heat Dissipated--Watts 8 ORDERING INFORMATION "A" Dim 12.50 (0.492) 34.50 (1.358) 2.00 (0.079) SEE NOTE 1 "A" 25.00 (0.984) 19.90 (0.783) 15.00 (0.591) 4.00 (0.157) 2.50 (0.098) Dia of PCB Plated Thru Hole for Pins Description SW25-2G Extruded heat sink with unequal channel widths front and back 25.00 (0.984) No 3.00 (0.118) SW25-4G With device mounting holes 25.00 (0.984) Yes 3.00 (0.118) SW38-2G Extruded heat sink with unequal channel widths front and back 38.00 (1.496) No 3.00 (0.118) SW38-4G With device mounting holes 38.00 (1.496) Yes 3.00 (0.118) SW50-2G Extruded heat sink with unequal channel widths front and back 50.00 (1.968) No 3.00 (0.118) SW50-4G With device mounting holes 50.00 (1.968) Yes 3.00 (0.118) SW63-2G Extruded heat sink with unequal channel widths front and back 63.00 (2.480) No 3.00 (0.118) SW63-4G With device mounting holes 63.00 (2.480) Yes 3.00 (0.118) NOTE 1: This hole not present in SW25 model Material: Aluminum Finish: Black Anodize Grease & Epoxy page112 Extruded heat sink with large radial fins Mounting Surface Temp Rise Above Ambient--C 5 80 4 60 3 40 2 20 1 0 0 0 0 8 12 Heat Dissipated--Watts 16 20 Air Velocity--Feet Per Minute 400 200 600 800 1000 5 80 4 60 3 40 2 20 1 0 0 0 52990X 53000X 4 8 12 Heat Dissipated--Watts ORDERING INFORMATION Dia of PCB Plated Thru Hole for Pins Part Number Device "A" Dim "B" Dim "C" Dim 529701B02500G TO-218, TO-247 25.40 (1.000) 21.59 (0.850) 3.66 (0.144) 2.67 (0.105) 529702B02500G TO-220 25.40 (1.000) 18.29 (0.720) 3.17 (0.125) 2.67 (0.105) 529801B02500G TO-218, TO-247 38.10 (1.500) 21.59 (0.850) 3.66 (0.144) 2.67 (0.105) 529802B02500G TO-220 38.10 (1.500) 18.29 (0.720) 3.17 (0.125) 2.67 (0.105) 529901B02500G TO-218, TO-247 50.80 (2.000) 21.59 (0.850) 3.66 (0.144) 2.67 (0.105) 529902B02500G TO-220 50.80 (2.000) 18.29 (0.720) 3.17 (0.125) 2.67 (0.105) 530001B02500G TO-218, TO-247 63.50 (2.500) 21.59 (0.850) 3.66 (0.144) 2.67 (0.105) 530002B02500G TO-220 63.50 (2.500) 18.29 (0.720) 3.17 (0.125) 2.67 (0.105) 16 "C" "A" "B" 100 Mounting Surface Temp Rise Above Ambient--C Extruded heat sink with large radial fins features equal channel widths on both sides for single or dual device mounting. Includes two solderable mounting pins which permit vertical mounting and eliminate stress on device leads. Available in four heights for TO-220, TO-218, and TO-247 devices. 4 52970X 52980X Mounting Kits page 99 20.96 (0.825) 1000 100 Thermal Resistance From MTG Surface to Ambient--C/Watt Air Velocity--Feet Per Minute 400 200 600 800 Thermal Resistance From MTG Surface to Ambient--C/Watt 0 o 3.20 (0.126) TYP 25.40 (1.000) 10 Part Number 5297, 5298, 5299, 5300 Holes 6.25 (0.246) Mounting Kits page 99 10 80 SW50 SW63 Thermal Resistance From MTG Surface to Ambient--C/Watt 1000 10 Thermal Resistance From MTG Surface to Ambient--C/Watt Mounting Surface Temp Rise Above Ambient--C Air Velocity--Feet Per Minute 400 200 600 800 100 0 Extruded heat sink with unequal channel widths front and back can accommodate a TO-220, TO-218, or TO-247 devices. Includes two solderable mounting pins which permit vertical mounting and eliminate stress on device leads. Available in three heights. Version without hole uses clip 5901 (sold separately) to attach device. See page 97 for clip information. Grease & Epoxy page112 Extruded heat sink with unequal channel widths Mounting Surface Temp Rise Above Ambient--C THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES SW25, SW38, SW50, SW63 3.18 (0.125) 14.22 (0.560) 3.96 (0.156) 2x 13.72 (0.540) o 2.36 (0.093) 2x 25.40 (1.000) 20 1.57 (0.062) 25.40 (1.000) 17.02 (0.670) 41.91 (1.650) Material: Aluminum Finish: Black Anodize For additional options see page 83 56 sales.na@aavid.com www.shopaavid.com Grease & Epoxy page112 5334, 5335, 5336, 5337 Extruded heat sink with large radial fins Air Velocity--Feet Per Minute 400 200 600 800 1000 5 80 4 60 3 40 2 Mounting Surface Temp Rise Above Ambient--C 100 1 20 0 0 0 4 5335XX 5334XX 8 12 Heat Dissipated--Watts 16 "A" 3.17 (0.125) 25.40 (1.000) 6.60 (0.260) 7.62 (0.300) 2x o 2.39 (0.093) CLIP 52 A A VIEW A-A SINGLE HEAT SINK DEVICE Air Velocity--Feet Per Minute 400 200 600 800 1000 5 80 4 60 3 40 2 20 1 0 0 4 5337XX 5336XX 8 12 16 Heat Dissipated--Watts Material: Aluminum Finish: Black Anodize 25.40 (1.000) 100 0 25.65 (1.01) REF 16.51 (0.650) 13.72 (0.540) 20 17.02 (0.670) Thermal Resistance From MTG Surface to Ambient--C/Watt 0 2x 3.96 (0.156) "B" SEE NOTE 1 Mounting Surface Temp Rise Above Ambient--C Extruded heat sink with large radial fins and channel clip attach feature makes device attachment easy. Includes clip and two solderable mounting pins which permit vertical mounting and eliminate stress on device leads. Available in four heights for TO-220, TO-218, and TO-247 devices. o 3.18 (0.125) X 0.64 (0.025) HIGH DITTIN Thermal Resistance From MTG Surface to Ambient--C/Watt 0 41.91 (1.650) VIEW A-A DUAL HEAT SINK DEVICE 12.70 (0.500) 20 25.40 (1.000) 17.02 (0.670) SEE NOTE 1 THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES TO-220 & TO-218 & TO-247 Heat Sinks 41.91 (1.650) NOTE 1: Graph depicts single device models. Dual device models exhibit a 15% performance increase. Part Number Device Description "A" Dim "B" Dim Dia of PCB Plated Thru Hole for Pins 533401B02552G TO-218, TO-247 Extruded heat sink with radial fins and device clip #52 38.10 (1.500) 21.59 (0.850) 2.67 (0.105) 533402B02552G TO-220 Extruded heat sink with radial fins and device clip #52 38.10 (1.500) 18.29 (0.720) 2.67 (0.105) 533421B02552G Dual TO-218, TO-247 With 2 device clips #52 38.10 (1.500) 21.59 (0.850) 2.67 (0.105) 533422B02552G Dual TO-220 With 2 device clips #52 38.10 (1.500) 18.29 (0.720) 2.67 (0.105) 533501B02552G TO-218, TO-247 Extruded heat sink with radial fins and device clip #52 50.80 (2.000) 21.59 (0.850) 2.67 (0.105) 533502B02552G TO-220 Extruded heat sink with radial fins and device clip #52 50.80 (2.000) 18.29 (0.720) 2.67 (0.105) 533521B02552G Dual TO-218, TO-247 With 2 device clips #52 50.80 (2.000) 21.59 (0.850) 2.67 (0.105) 533522B02552G Dual TO-220 With 2 device clips #52 50.80 (2.000) 18.29 (0.720) 2.67 (0.105) 533601B02552G TO-218, TO-247 Extruded heat sink with radial fins and device clip #52 63.50 (2.500) 21.59 (0.850) 2.67 (0.105) 533602B02552G TO-220 Extruded heat sink with radial fins and device clip #52 63.50 (2.500) 18.29 (0.720) 2.67 (0.105) 533621B02552G Dual TO-218, TO-247 With 2 device clips #52 63.50 (2.500) 21.59 (0.850) 2.67 (0.105) 533622B02552G Dual TO-220 With 2 device clips #52 63.50 (2.500) 18.29 (0.720) 2.67 (0.105) 533701B02552G TO-218, TO-247 Extruded heat sink with radial fins and device clip #52 25.40 (1.000) 21.59 (0.850) 2.67 (0.105) 533702B02552G TO-220 Extruded heat sink with radial fins and device clip #52 25.40 (1.000) 18.29 (0.720) 2.67 (0.105) 533721B02552G Dual TO-218, TO-247 With 2 device clips #52 25.40 (1.000) 21.59 (0.850) 2.67 (0.105) 533722B02552G Dual TO-220 With 2 device clips #52 25.40 (1.000) 18.29 (0.720) 2.67 (0.105) ORDERING INFORMATION For additional options see page 83 sales.na@aavid.com www.shopaavid.com 57 TO-220 & TO-218 & TO-247 Heat Sinks Grease & Epoxy page112 0 Air Velocity--Feet Per Minute 400 200 600 800 100 Wide extruded heat sink with unequal channel widths on front and back can accommodate a TO-220, TO-218, or TO-247 device. Includes two solderable mounting pins which permit vertical mounting and eliminate stress on device leads. Available in three heights. Versions without hole use clip 6801 (sold separately) to attach device. See page 97 for clip information. 1000 10 80 8 60 6 40 4 20 2 0 0 0 4 8 12 16 Heat Dissipated--Watts BW38 BW50 BW63 Thermal Resistance From MTG Surface to Ambient--C/Watt Wide extruded heat sink with unequal channel Mounting Surface Temp Rise Above Ambient--C Mounting Kits page 99 o 3.6 (0.144) "A" 21.60 (0.850) 20 4.00 2.60 (0.101) (0.157) 25.40 (1.000) 34.90 (1.375) 25.40 (1.000) 12.70 (0.500) 2.00 (0.079) Part Number Description BW38-2G Extruded heat sink with unequal channel widths front and back 38.00 (1.496) No 3.00 (0.118) BW38-4G With device mounting hole 38.00 (1.496) Yes 3.00 (0.118) BW50-2G Extruded heat sink with unequal channel widths front and back 50.00 (1.968) No 3.00 (0.118) BW50-4G With device mounting hole 50.00 (1.968) Yes 3.00 (0.118) BW63-2G Extruded heat sink with unequal channel widths front and back 63.00 (2.480) No 3.00 (0.118) BW63-4G With device mounting hole 63.00 (2.480) Yes 3.00 (0.118) "A" Dim Grease & Epoxy page112 Extruded heat sink with radial fins 0 200 Air Velocity--Feet Per Minute 400 600 800 Mounting Surface Temp Rise Above Ambient--C 100 1000 10 80 8 60 6 40 4 20 2 0 0 0 2 51300X 51310X 4 6 Heat Dissipated--Watts 8 "C" "A" 10 0 200 Air Velocity--Feet Per Minute 400 600 800 5 80 4 60 3 40 2 20 1 0 0 51320X 51330X 2 4 6 Heat Dissipated--Watts 8 3.18 (0.125) 1000 0 "D" 34.92 (1.375) "B" Dim "C" Dim "D" Dim "E" Dim Dia of PCB Plated Thru Hole for Pins TO-218, TO-247 25.40 (1.000) 21.59 (0.850) 3.66 (0.144) 17.02 (0.670) 13.72 (0.540) 2.67 (0.105) TO-220 25.40 (1.000) 18.29 (0.720) 3.17 (0.125) 15.88 (0.625) 11.10 (0.437) 2.67 (0.105) 513101B02500G TO-218, TO-247 38.10 (1.500) 21.59 (0.850) 3.66 (0.144) 17.02 (0.670) 13.72 (0.540) 2.67 (0.105) 513102B02500G TO-220 38.10 (1.500) 18.29 (0.720) 3.17 (0.125) 15.88 (0.625) 11.10 (0.437) 2.67 (0.105) 513201B02500G TO-218, TO-247 50.80 (2.000) 21.59 (0.850) 3.66 (0.144) 17.02 (0.670) 13.72 (0.540) 2.67 (0.105) 513202B02500G TO-220 50.80 (2.000) 18.29 (0.720) 3.17 (0.125) 15.88 (0.625) 11.10 (0.437) 2.67 (0.105) 513301B02500G TO-218, TO-247 63.50 (2.500) 21.59 (0.850) 3.66 (0.144) 17.02 (0.670) 13.72 (0.540) 2.67 (0.105) 513302B02500G TO-220 63.50 (2.500) 18.29 (0.720) 3.17 (0.125) 15.88 (0.625) 11.10 (0.437) 2.67 (0.105) 513001B02500G 513002B02500G 2x o 2.37 (0.093) 12.70 (0.500) "A" Dim Device "E" 25.40 (1.000) 1.57 (0.062) 10 ORDERING INFORMATION Part Number 2x 3.96 (0.156) "B" 100 Mounting Surface Temp Rise Above Ambient--C Extruded heat sink with radial fins feature equal channel widths on both sides for single or dual device mounting. Includes two solderable mounting pins which permit vertical mounting and eliminate stress on device leads. Available in four heights for TO-220,TO-218, and TO-247 devices. Mounting Kits page 99 17.48 (0.688) Thermal Resistance From MTG Surface to Ambient--C/Watt 5130, 5131, 5132, 5133 Material: Aluminum Finish: Black Anodize Dia of PCB Plated Thru Holes Hole for Pins ORDERING INFORMATION Thermal Resistance From MTG Surface to Ambient--C/Watt THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES BW38, BW50, BW63 Material: Aluminum Finish: Black Anodize For additional options see page 83 58 sales.na@aavid.com www.shopaavid.com 80 8 60 6 40 4 Mounting Surface Temp Rise Above Ambient--C 200 20 2 0 0 2 531002 531102 4 6 Heat Dissipated--Watts 8 1000 10 80 8 Mounting Surface Temp Rise Above Ambient--C 60 6 40 4 20 2 0 0 0 2 531202 531302 ORDERING INFORMATION "A" Dim 531002B02500G 25.40 (1.000) 531002V02500G 25.40 (1.000) 531102B02500G 38.10 (1.500) 531102V02500G 38.10 (1.500) 531202B02500G 50.80 (2.000) 531202V02500G 50.80 (2.000) 531302B02500G 63.50 (2.500) 531302V02500G 63.50 (2.500) Finish 4 6 Heat Dissipated--Watts 8 10 2.67 (0.105) Black anodize AavSHIELD3 2.67 (0.105) Black anodize AavSHIELD3 2.67 (0.105) Black anodize AavSHIELD3 2.67 (0.105) SEE NOTE 1 3x o 3.18 (0.125) "A" 13.46 (0.530) 9.40 (0.370) 2x 3.96 (0.156) 11.10 (0.437) 25.40 (1.000) 2x o 2.37 (0.093) 1.57 (0.062) 12.70 (0.500) 15.88 (0.625) 34.92 (1.375) Dia of PCB Plated Thru Hole for Pins Black anodize AavSHIELD3 17.48 (0.688) 25.40 (1.000) 18.29 (0.720) Air Velocity--Feet Per Minute 400 200 600 800 Mounting Kits page 99 10 100 0 Thermal Resistance From MTG Surface to Ambient--C/Watt 1000 10 0 Extruded heat sink with radial fins and notched base features equal channel widths on both sides and mounting holes to accomodate TO-220 and TO-202 devices. Includes two solderable mounting pins which permit vertical mounting and eliminate stress on device leads. Available in four heights. Air Velocity--Feet Per Minute 400 600 800 100 0 Part Number Grease & Epoxy page112 Extruded heat sink with radial fins & notched base Thermal Resistance From MTG Surface to Ambient--C/Watt 5310, 5311, 5312, 5313 Material: Aluminum Finish: See Table NOTE 1: This hole not present in 5310 series 2.67 (0.105) THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES TO-220 & TO-202 Heat Sinks 2.67 (0.105) 2.67 (0.105) 2.67 (0.105) For additional options see page 83 Grease & Epoxy page112 Extruded heat sink with unequal channel widths 0 Air Velocity--Feet Per Minute 400 200 600 800 Mounting Surface Temp Rise Above Ambient--C 100 1000 10 80 8 60 6 40 4 20 2 0 0 0 Extruded heat sink with unequal channel widths front and back can accommodate a TO-220 or TO-202 device. Includes two solderable mounting pins which permit vertical mounting and eliminate stress on device leads. Clip 5901 (sold separately) can be used to attach device. See page 97 for clip information. 2 SW25 SW38 4 6 Heat Dissipated--Watts 8 6.25 (0.246) Thermal Resistance From MTG Surface to Ambient--C/Watt SW25-6, SW38-6 12.50 (0.492) Mounting Kits page 99 34.50 (1.358) 2.00 (0.079) SEE NOTE 1 10 "A" 25.00 (0.984) 19.90 (0.783) 15.00 (0.591) 4.00 (0.157) NOTCH 11mm DEEP 10.4mm WIDE o 3.20 (0.126) TYP 2.50 (0.098) 25.40 (1.000) Part Number Description "A" Dim Dia of PCB Plated Thru Hole for Pins SW25-6G Extruded heat sink with unequal channel widths front and back 25.00 (0.984) 3.00 (0.118) SW38-6G Extruded heat sink with unequal channel widths front and back. 38.00 (1.496) 3.00 (0.118) ORDERING INFORMATION NOTE 1: This hole not present in SW25 series Material: Aluminum Finish: Black Anodize sales.na@aavid.com www.shopaavid.com 59 TO-220 & TO-218 & TO-247 & Multiwatt Heat Sinks Grease & Epoxy page112 High power extruded heat sink with large radial fins Mounting Surface Temp Rise Above Ambient--C 5 80 4 60 3 40 2 20 1 0 0 0 High power extruded heat sink with large radial fins and solderable shoulder pins allows vertical mounting without stress on the device leads. Available with shoulder pins to provide fixed clearance between the bottom of the heat sink and the board. Available in four heights for TO-220, TO-218, TO-247and multiwatt devices. 4 6396 6398 0 8 12 16 Heat Dissipated--Watts Air Velocity--Feet Per Minute 400 200 600 800 20 5 80 4 60 3 40 2 20 1 0 0 0 4 8 12 16 Heat Dissipated--Watts ORDERING INFORMATION "A" Dim o 3.81 (0.150) "A" 19.05 (0.750) 1000 100 6399 6400 Mounting Kits page 99 1000 Thermal Resistance From MTG Surface to Ambient--C/Watt Air Velocity--Feet Per Minute 400 200 600 800 Thermal Resistance From MTG Surface to Ambient--C/Watt 0 100 Mounting Surface Temp Rise Above Ambient--C THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES 6396, 6398, 6399, 6400 3.96 (0.156) 2.21 (0.087) SEE DETAIL A P2 MODEL ONLY 25.40 (1.000) 41.91 (1.650) 0.78 (0.031) 25.40 (1.000) 20 1.57 (0.062) Dia of PCB Plated Thru Hole for Pins Part Number Description 6396BG Extruded heat sink with large radial fins and straight pins 25.40 (1.000) 2.89 (0.114) 6396B-P2G With solderable shoulder pins 25.40 (1.000) 3.10 (0.122) 6398BG Extruded heat sink with large radial fins and straight pins 38.10 (1.500) 2.89 (0.114) 6398B-P2G With solderable shoulder pins 38.10 (1.500) 3.10 (0.122) 6399BG Extruded heat sink with large radial fins and straight pins 50.80 (2.000) 2.89 (0.114) 6399B-P2G With solderable shoulder pins 50.80 (2.000) 3.10 (0.122) 6400BG Extruded heat sink with large radial fins and straight pins 63.50 (2.500) 2.89 (0.114) 6400B-P2G With solderable shoulder pins 63.50 (2.500) 3.10 (0.122) 1.27 (0.050) DETAIL A P2 MODEL ONLY 2.46 REF (0.097) 2.41 (0.095) 5.49 REF (0.216) Material: Aluminum Finish: Black Anodize For additional options see page 85 Grease & Epoxy page112 High power extruded heat sink 0 Air Velocity--Feet Per Minute 400 200 600 800 Mounting Surface Temp Rise Above Ambient--C 5 80 4 60 3 40 2 20 1 0 0 0 High power extruded heat sink for SIP packages. Solderable pins allow vertical mounting without stress on the device leads. Available in three heights. Can also be used for dual TO-220, TO-218, TO-247 and multiwatt devices. 4 6380 6381 6382 8 12 16 Heat Dissipated--Watts "A" 20 18.29 (0.720) 2.21 (0.087) Part Number Description "A" Dim Dia of PCB Plated Thru Hole for Pins 6380BG Extruded heat sink with solderable pins 25.40 (1.000) 2.89 (0.114) 6381BG Extruded heat sink with solderable pins 38.10 (1.500) 2.89 (0.114) 6382BG Extruded heat sink with solderable pins 50.80 (2.000) 2.89 (0.114) For additional options see page 85 o 3.81 (0.150) 3.96 (0.156) ORDERING INFORMATION Mounting Kits page 99 1000 100 Thermal Resistance From MTG Surface to Ambient--C/Watt 6380, 6381, 6382 11.91 (0.469) 9.93 (0.391) 19.86 (0.782) 33.05 (1.301) 31.74 (1.250) 1.58 (0.062) 25.40 (1.000) 2.64 (0.104) 28.70 (1.130) 41.91 (1.650) Material: Aluminum Finish: Black Anodize 60 sales.na@aavid.com www.shopaavid.com Grease & Epoxy page112 Extruded heat sink for SIP packages 0 Air Velocity--Feet Per Minute 400 200 600 800 5 80 4 Mounting Surface Temp Rise Above Ambient--C 100 Extruded heat sink for SIP packages. Solderable pins allow vertical mounting without stress on the device leads. Can also be used for dual TO-220, TO-218, TO-247, and multiwatt devices. 60 3 40 2 20 1 0 0 0 2 4 6 8 Heat Dissipated--Watts Mounting Kits page 99 o 3.81 (0.150) 2X 1000 Thermal Resistance From MTG Surface to Ambient--C/Watt 6374 DETAIL A 31.75 (1.250) 17.78 (0.700) 3.96 (0.156) 24.38 (0.960) 59.99 (2.362) 38.10 (1.500) 32.00 (1.260) 17.50 (0.689) 10 2.18 (0.086) SEE DETAIL A 16.00 (0.630) Dia of PCB Plated Thru Hole for Pins ORDERING INFORMATION Part Number Description 6374BG Extruded heat sink with solderable pins 2.92 (0.115) 8.00 (0.315) 2.89 (0.114) Material: Aluminum Finish: Black Anodize For additional options see page 85 Grease & Epoxy page112 High power flat back extruded channel style heat sink 0 Air Velocity--Feet Per Minute 400 200 600 800 Mounting Surface Temp Rise Above Ambient--C 100 High power flat back extruded channel style heat sink features a wide channel to accommodate several devices. Includes two solderable pins to allow vertical mounting without stress on the device leads. Can be used with TO-220, TO-218, TO-247, and multiwatt devices. 80 8 60 6 40 4 20 2 0 0 0 2 4 6 Heat Dissipated--Watts 8 Part Number Description YB32-4G High power flat back extruded heat sink 2X 4.00 (0.157) 10 38.30 (1.508) 8.00 (0.315) 4.70 (0.185) 60.00 (2.362) 3.48 (0.137) Material: Aluminum Finish: Black Anodize Grease & Epoxy page112 Flat back extruded heat sink featuring solderable pins Air Velocity--Feet Per Minute 400 200 600 800 1000 10 80 8 60 6 40 4 20 2 0 0 0 58100X 58110X 58120X 1 2 3 Heat Dissipated--Watts #6 - 32 UNC THRU "A" 5 "B" Part Number Device "A" Dim "B" Dim Dia of PCB Plated Thru Hole for Pins 581001B02500G TO-218 25.40 (1.000) 21.59 (0.850) 2.67 (0.105) 581002B02500G TO-220 25.40 (1.000) 18.29 (0.720) 2.67 (0.105) 581101B02500G TO-218 38.10 (1.500) 21.59 (0.850) 2.67 (0.105) 581102B02500G TO-220 38.10 (1.500) 18.29 (0.720) 2.67 (0.105) 581201B02500G TO-218 50.80 (2.000) 21.59 (0.850) 2.67 (0.105) 581202B02500G TO-220 50.80 (2.000) 18.29 (0.720) 2.67 (0.105) ORDERING INFORMATION 4 Mounting Kits page 99 8.13 (0.320) Thermal Resistance From MTG Surface to Ambient--C/Watt Mounting Surface Temp Rise Above Ambient--C Flat back extruded heat sink features solderable pins which allow vertical mounting without stess on the device leads. Available in three heights for TO-220 and TO-218 devices. 2X 3.00 (0.118) 16.00 (0.630) 100 For additional options see page 83 32.00 (1.260) 19.00 (0.748) 32.00 (1.260) 0 Mounting Kits page 99 O 3.10 THRU (0.122) Dia of PCB Plated Thru Hole for Pins ORDERING INFORMATION 5810, 5811, 5812 1000 10 Thermal Resistance From MTG Surface to Ambient--C/Watt YB32-4 THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES TO-220 & TO-218 & TO-247 & Multiwatt Heat Sinks 3.96 (0.156) 10.29 (0.405) 16.26 (0.640) 2.36 (0.093) TYP 2 3.45 (0.136) 16.26 (0.640) Material: Aluminum Finish: Black Anodize sales.na@aavid.com www.shopaavid.com 61 TO-218 Heat Sinks Mounting Kits page 99 Plug in style heat sink 200 Air Velocity--Feet Per Minute 400 600 800 Plug in style heat sink requires no hardware to attach to the device. The four spring action clips apply even pressure eliminating gaps between the heat sink and device which rob thermal performance. Mounting Surface Temp Rise Above Ambient--C 100 25.40 (1.000) 1000 2.0 80 1.6 60 1.2 40 0.8 20 0.4 0 0 0 4 8 12 16 Heat Dissipated--Watts 11.94 (0.470) Thermal Resistance From MTG Surface to Ambient--C/Watt 0 12.70 (0.500) 49.53 (1.950) 26.54 (1.045) 50.04 (1.970) 20 1.02 (0.040) 5.08 (0.200) 1.90 (0.075) 1.27 (0.050) 0.81 (0.032) 24.89 (0.980) Dia of PCB Plated Thru Hole for Tabs ORDERING INFORMATION Part Number Description 592201B03400G High power plug in heat sink with folded back fins and solderable mounting tabs Material: 1.27 (0.050) Thick Aluminum Finish: Black Anodize 2.39 (0.094) For additional options see page 82 Grease & Epoxy page112 Channel style heat sink with folded back fins Air Velocity--Feet Per Minute 400 200 600 800 100 1000 10 80 8 60 6 40 4 20 2 0 Channel style heat sink with folded back fins for extra cooling capacity. The heat sink features solderable tabs for easy attachment to the PC board. 0 0 0 2 4 6 Heat Dissipated--Watts 8 Thermal Resistance From MTG Surface to Ambient--C/Watt 5931 Mounting Surface Temp Rise Above Ambient--C THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES 5922 10 o 3.81 THRU (0.150) 41.66 (1.640) CL 6.22 (0.245) 24.77 (0.975) 20.57 (0.810) Dia of PCB Plated Thru Hole for Tabs Part Number Description 593101B03600G Channel style heat sink with folded back fins and solderable tabs 5.08 (0.200) 2.54 (0.100) 0.81 (0.032) 1.27 (0.050) 43.18 (1.700) ORDERING INFORMATION Mounting Kits page 99 1.02 (0.040) 12.70 (0.500) 8.89 (0.350) 2.92 (0.115) Material: 1.27 (0.050) Thick Aluminum Finish: Black Anodize POPULAR OPTIONS: 593101B 0 0000G Base part no. Description A Position Code Details A 1 Kon-DuxTM pad Page 86 A 3 In-Sil-8TM pad Page 86 For additional options see page 82 Copper slide on heat sink 0 Air Velocity--Feet Per Minute 400 200 600 800 Copper slide on heat sink requires no hardware to attach the device. In addition, the copper heat sink is tin/lead plated to allow easy soldering to the PC board. Mounting Surface Temp Rise Above Ambient--C 100 1000 10 80 8 60 6 40 4 20 2 0 0 0 ORDERING INFORMATION 62 Top cut away to show detail Part Number Description 7130DG Slide on, channel style heat sink with integrated tabs 1 2 3 4 Heat Dissipated--Watts Thermal Resistance From MTG Surface to Ambient--C/Watt 7130 26.04 (1.025) 17.15 (0.675) 16.51 (0.650) 5 3.81 (0.150) 1.27 (0.050) 1.27 (0.050) 2.79 (0.110) 9.52 (0.375) 15.49 (0.610) Dia of PCB Plated Thru Hole for Tabs 25.53 (1.005) Material: 0.63 (0.025) Thick Copper Finish: Tin Plated 2.54 (0.100) sales.na@aavid.com www.shopaavid.com Grease & Epoxy page112 Low profile hat section heat sink 1000 20 80 16 60 12 40 8 20 4 Mounting Surface Temp Rise Above Ambient--C 0 Low profile hat section heat sink has a total height of 0.375 making it perfect for mounting to printed circuit boards with 0.500 centering between boards. Air Velocity--Feet Per Minute 400 200 600 800 100 0 0 0 1 2 3 Heat Dissipated--Watts 4 Thermal Resistance From MTG Surface to Ambient--C/Watt 5063 10.41 (0.410) 44.45 (1.750) Description 506304B00000G Hat section heat sink o3.66 (0.144) THRU 5 7.78 (0.700) 9.52 (0.375) Material: 1.02 (0.040) Thick Aluminum Finish: Black Anodize Low cost slide on heat sink 1000 20 Mounting Surface Temp Rise Above Ambient--C Low cost slide on heat sink provides positive retention with an integral locking tab. The spring tension ensures excellent thermal contact for maximum performance. Requires no hardware to mount. 80 16 60 12 40 8 20 4 0 0 0 1 2 3 Heat Dissipated--Watts 4 Thermal Resistance From MTG Surface to Ambient--C/Watt 0 20.32 (0.800) Air Velocity--Feet Per Minute 400 200 600 800 100 o 2.36 (0.093) DITTIN 9.40 (0.370) 10.16 (0.400) 14.66 (0.577) 5 Material: 0.63 (0.025) Thick Aluminum Finish: See Table Finish 574004B00000G Black anodize 574004U00000G Unfinished 6.35 (0.250) 7.75 (0.305) ORDERING INFORMATION Part Number 5.59 (0.220) 17.78 (0.700) For additional options see page 84 5740 NOTCH IS 0.410 WIDE X 0.220 DEEP 13.46 (0.530) ORDERING INFORMATION Part Number Mounting Kits page 99 THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES TO-202 Heat Sinks 5742, 5796, 5797 Low cost slide on cooler heat sink FIGURE A FIGURE B o 2.36 (0.093) 22.86 5.97 (0.240) 15.88 (0.900) (0.630) 22.86 (0.900) 25.15 (0.990) Low cost slide on cooler heat sink is easy to assemble to the device and requires no mounting hardware. Models have fins on both sides, or the left or right. Available with or without staked on solderable tab for easy board mounting. 25.91 (1.020) 10.67 (0.420) TAB 9.52 (0.380) 1.57 (0.062) 10.67 (0.420) REF 18.54 (0.730) 0.51 (0.020) 9.52 (0.380) TAB 1.57 (0.062) 18.92 (0.750) 10.67 (0.420) 10.67 (0.420) REF Material: 0.63 (0.025) Thick Aluminum Finish: Black Anodize Description 574204B00000G Low cost slide on cooler, no solderable tabs Figure A 574204B03300G With solderable tabs A 579604B00000G With left side fin only, no solderable tabs B 579604B03300G With left side fin only and solderable tabs B 579704B00000G With right side fin only, no solderable tabs B 579704B03300G With right side fin only and solderable tabs B 1.910 (0.075) 1.910 (0.075) 0 574204 579604 579704 1000 20 80 16 60 12 40 8 20 4 0 0 0 1.910 (0.075) Air Velocity--Feet Per Minute 400 200 600 800 100 Mounting Surface Temp Rise Above Ambient--C Part Number Dia of PCB Plated Thru Hole for Tabs 1 2 3 Heat Dissipated--Watts 4 Thermal Resistance From MTG Surface to Ambient--C/Watt Note: Fins on Left or Right. Right hand fin model shown. ORDERING INFORMATION For additional options see page 84 0.51 (0.020) 5 sales.na@aavid.com www.shopaavid.com 63 TO-202 Heat Sinks Grease & Epoxy page112 16 60 12 40 8 20 4 0 0 1 576904 577304 577404 2 3 Heat Dissipated--Watts 4 Thermal Resistance From MTG Surface to Ambient--C/Watt 80 0 ORDERING INFORMATION Part Number o 3.81 THRU (0.150) 100 Mounting Surface Temp Rise Above Ambient--C Slim low profile channel style heat sink is notched to accommodate the TO-202 center tab packages. Available in 3 heights. Air Velocity--Feet Per Minute 400 200 600 800 1000 20 0 Mounting Kits page 99 3.81 (0.150) 13.21 REF (0.520) 13.34 (0.525) 19.05 (0.750) REF 5 "A" "A" Dim 576904B00000G 6.35 (0.250) 577304B00000G 9.53 (0.375) Material: 1.27 (0.050) Thick Aluminum Finish: Black Anodize 577404B00000G 12.70 (0.500) For additional options see page 84 Grease & Epoxy page112 Space saving staggered fin heat sink 0 Air Velocity--Feet Per Minute 400 200 600 800 100 Space saving heat sink features staggered fins for increased cooling efficiency. This verticle mount heat sink features integrated matte tin plated tabs to solder directly to the PC board. 1000 10 80 8 60 6 40 4 20 2 0 0 0 2 4 6 8 Heat Dissipated--Watts Mounting Kits page 99 3.15 (0.124) Thermal Resistance From MTG Surface to Ambient--C/Watt 6034 Mounting Surface Temp Rise Above Ambient--C THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES 5769, 5773, 5774 Slim low profile channel style heat sink 10 12.70 (0.500) 9.35 (0.368) 50.80 (2.000) 17.87 (0.704) 2.46 (0.097) 1.27 (0.050) 4.75 (0.187) 25.40 (1.000) 35.05 (1.380) Dia of PCB Plated Thru Hole for Tabs ORDERING INFORMATION Part Number Description 6034DG Space saving staggered fin heat sink with integrated tin plated tabs 6046, 6047 Material: 1.27 (0.050) Thick Copper Finish: Tin Plated 3.10 (0.122) Compact slide on heat sink FIGURE A 15.24 (0.600) 7.62 O.D. (0.300) FIGURE B "A" 15.24 (0.600) 21.59 (0.850) REF 7.62 O.D. (0.300) 21.59 (0.850) REF 6.35 (0.250) Compact slide on heat sink makes assembly easy. The 6046 features a positive device catch to lock the heat sink to the device. SECTION A-A "A" 6.35 (0.250) "A" SECTION A-A 10.41 (0.410) "A" 10.41 (0.410) Material: 0.63 (0.025) Thick Aluminum Finish: Pre-Black Anodize* Description Figure 6046PBG With device catch A 6047PBG Compact slide on heat sink B *Edges cut during the manufacturing process will be unfinished. See page 110 for more information. Mounting Surface Temp Rise Above Ambient--C Part Number 0 Air Velocity--Feet Per Minute 400 600 800 1000 20 80 16 60 12 40 8 20 4 0 0 0 64 200 100 1 2 3 4 Heat Dissipated--Watts Thermal Resistance From MTG Surface to Ambient--C/Watt ORDERING INFORMATION 5 sales.na@aavid.com www.shopaavid.com Slip on heat sink 1000 20 80 16 60 12 40 8 20 4 0 0 Mounting Surface Temp Rise Above Ambient--C 0 Slip on heat sink requires no hardware to attach to the device. Spring pressure ensures excellent retention. May be assembled before or after the device is attached to the board. Air Velocity--Feet Per Minute 400 200 600 800 100 0 1 2 3 Heat Dissipated--Watts 4 13.21 (0.520) Thermal Resistance From MTG Surface to Ambient--C/Watt 5775 19.81 (0.780) 0.63 (0.025) 5 8.13 (0.320) 7.87 (0.310) ORDERING INFORMATION Part Number Finish 577500B00000G Black anodize 577500U00000G Unfinished TV4 10.67 (0.420) Material: 0.63 (0.025) Thick Aluminum Finish: See Table Grease & Epoxy page112 Narrow channel style heat sink featuring twisted fins Mounting Kits page 99 CL 1000 20 Mounting Surface Temp Rise Above Ambient--C 100 80 16 60 12 40 8 20 4 0 0 0 Narrow channel style heat sink features twisted fins for increased air turbulance for better cooling. Can be mounted horizontally or vertically. 1 2 3 4 Heat Dissipated--Watts 4.00 (0.158) Thermal Resistance From MTG Surface to Ambient--C/Watt 0 Air Velocity--Feet Per Minute 400 200 600 800 THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES TO-126 Heat Sinks 22.00 (0.866) 5 19.00 (0.749) ORDERING INFORMATION Part Number Description TV4G Narrow channel style heat sink with twisted fins 19.00 (0.749) 13.40 (0.528) Material: 1.63 (0.064) Thick Aluminum Finish: Black Anodize Slip on heat sink FIGURE A FIGURE B 3.20 (0.126) 13.20 (0.520) 8.60 (0.338) 8.60 17.90 (0.338) (0.705) 3.00 (0.118) 4.00 (0.157) Slip on heat sink has locating features for simple device alignment. Spring action holds the device for good thermal contact. The tabbed version is made from tin plated copper and the no tab version is lightweight aluminum. PF730G Slip on heat sink PF732G With solderable tabs 4.00 (0.157) TAB 11.50 (0.453) 11.50 (0.453) 1.30 (0.511) 3.40 (0.139) Material Finish Figure Aluminum Black anodize B Copper Tin plated A 0 Mounting Surface Temp Rise Above Ambient --C Description 19.70 (0.775) 3.00 (0.118) ORDERING INFORMATION Part Number 8.10 (0.319) 13.20 (0.520) 8.10 (0.319) Air Velocity--Feet Per Minute 400 200 600 800 1000 100 50 80 40 60 30 40 20 20 10 0 0 0 1 2 3 Heat Dissipated--Watts 4 Thermal Resistance From MTG Surface to Ambient--C/Watt PF730, PF732 5 sales.na@aavid.com www.shopaavid.com 65 SIPS Plug in style heat sink FIGURE B FIGURE A 10.67 (0.420) TAB 22.86 (0.900) CL 0.81 (0.032) 1.91 (0.075) 12.70 (0.500) 12.70 (0.500) 8.13 (0.320) 5.03 (0.198) 30.99 (1.220) 25.40 (1.000) 15.88 CL (0.625) 30.99 (1.220) Material: 1.27 (0.050) Thick Aluminum Finish: Black Anodize ORDERING INFORMATION Dia of PCB Plated Thru Hole for Tabs Part Number Description 566010B00000G Plug in style heat sink, no solderable tabs B 566010B03100G With solderable tab for horizontal mounting B 1.73 (0.068) 566010B03400G With solderable tabs for vertical mounting A 2.39 (0.094) POPULAR OPTIONS: Figure Code A 28 200 A Description Details Solderable Shur-LockTM Tab for vertical mounting Page 91 1.27 (0.050) 12.06 (0.475) 25.40 (1.000) Air Velocity--Feet Per Minute 400 600 800 100 566010B0 00 00G Base part no. Position 0 4.06 (0.160) 1000 10 80 8 60 6 40 4 20 2 0 0 0 2 4 6 Heat Dissipated--Watts 8 Thermal Resistance From MTG Surface to Ambient--C/Watt Plug in style heat sink features four spring action clips to firmly hold the device to the heat sink ensuring maximum metal to metal contact. Available with or without solderable tabs for horizontal or vertical mounting to the PC board. Mounting Surface Temp Rise Above Ambient--C THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES 5660 10 For additional options see page 84 Channel style heat sink with integrated clip 0 200 Air Velocity--Feet Per Minute 400 600 800 Mounting Surface Temp Rise Above Ambient--C 100 80 16 60 12 40 8 20 4 0 0 0 Channel style heat sink with integrated clip features strong spring tension and device locking catch to attach device securely to the heat sink. Available in two finishes. 1000 20 1 2 3 Heat Dissipated--Watts 4 CL Thermal Resistance From MTG Surface to Ambient--C/Watt 5305 o 3.30 (0.130) LOCKING CATCH 3.73 (0.147) 15.75 (0.620) 3.81 (0.150) 12.70 (0.500) 5 9.65 (0.380) 0.64 (0.025) 21.46 (0.845) Material: 0.81 (0.032) Thick Aluminum Finish: See Table ORDERING INFORMATION 66 Part Number Finish 530510U00000G Unfinished 530510B00000G Black anodize sales.na@aavid.com www.shopaavid.com SIPS 0 Air Velocity--Feet Per Minute 400 200 600 800 Mounting Surface Temp Rise Above Ambient--C 100 A 1000 10 80 8 60 6 40 4 20 2 0 0 0 1 Channel style slide on heat sink features an integrated clip and device retaining tab to hold the heat sink to the device. Small footprint consumes less board space. 2 3 Heat Dissipated--Watts 4 1.65 (0.065) 15.75 (0.620) Description 7038BG Channel style slide on heat sink 7148 SECTION A-A 5 15.24 (0.600) 6.35 (0.250) 9.65 (0.380) 23.24 (0.915) Material: 0.81 (0.032) Thick Aluminum Finish: Black Anodize Copper channel style slide on heat sink featuring an integrated clip and solderable tabs Air Velocity--Feet Per Minute 400 200 600 800 100 1000 10 80 8 60 6 40 4 20 2 0 0 Mounting Surface Temp Rise Above Ambient--C 0 Copper channel style slide on heat sink features an integrated clip and solderable tabs. Includes a device retaining tab to securely hold the heat sink to the device. Small footprint consumes less board space. 0 1 2 3 Heat Dissipated--Watts 4 Thermal Resistance From MTG Surface to Ambient--C/Watt A 15.24 (0.600) SECTION A-A 17.78 (0.700) 20.19 (0.795) 4.06 (0.160) MAX A 5 DETAIL E 23.24 (0.915) MAX AT BASE Description 7148DG Slide on heat sink with integrated clip 5.08 (0.200) 2.79 - 3.18 (0.110) - (0.125) Dia of PCB Plated Thru Hole for Tabs Part Number E 1.90 (0.075) 9.65 (0.380) ORDERING INFORMATION 1.27 (0.050) 3.81 (0.150) 2.54 (0.100) Material: 0.81 (0.032) Thick Copper Finish: Tin Plated Clip on heat sink featuring louvers Mounting Surface Temp Rise Above Ambient--C 0 Air Velocity--Feet Per Minute 400 200 600 800 100 5 80 4 60 3 40 2 20 1 0 Clip on heat sink features louvers to provide excellent cooling in natural or forced air convection. Spring action provides strong clamping force to securely hold the heat sink to the device. Available with or without solderable tabs. ORDERING INFORMATION Part Number Description 584000B00000G Clip on heat sink. no solderable tabs 584000B03500G With solderable tabs for vertical mounting 31.75 (1.250) 1000 0 0 2 4 6 Heat Dissipated--Watts 8 Thermal Resistance From MTG Surface to Ambient--C/Watt 5840 3.95 (0.155) A ORDERING INFORMATION Part Number 13.28 (0.523) THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES Channel style slide on heat sink featuring an integrated clip and device retaining tab Thermal Resistance From MTG Surface to Ambient--C/Watt 7038 9.91 (0.390) o 3.18 (0.125) DITTIN TYP 2 43.18 (1.700) 10 5.84 (0.230) TAB 2.46 (0.097) 9.91 (0.390) 3.18 (0.125) 0.81 (0.032) 29.21 (1.150) Dia of PCB Plated Thru Hole for Tabs Material: 1.02 (0.040) Thick Aluminum Finish: Black Anodize 2.84 (0.112) For additional options see page 84 sales.na@aavid.com www.shopaavid.com 67 TO-92 Heat Sinks 80 20 60 15 40 10 20 5 0 18.29 (0.720) 575300B00000G 24.64 (0.970) 575400B00000G 30.99 (1.220) 0.2 575400 575200 0 0.4 0.6 0.8 Heat Dissipated--Watts Air Velocity--Feet Per Minute 400 200 600 800 100 "A" Dim 575200B00000G 0 0.0 ORDERING INFORMATION 1000 25 20 60 15 40 10 20 5 0 0 0.0 0.2 0.4 0.6 0.8 Heat Dissipated--Watts "A" 5.59 (0.220) 1.0 80 575300 15.29 (0.602) Material: 0.63 (0.025) Thick Aluminum Finish: Black Anodize 1.0 Low cost brass clip on heat sink Mounting Surface Temp Rise Above Ambient - C 0 Low cost brass clip on heat sink requires no hardware to attach to the device. Includes integrated tabs that can be soldered or twisted to attach the heat sink to the board reducing stress on the device leads. ORDERING INFORMATION Part Number Description 92FG Brass clip on heat sink Air Velocity - Feet Per Minute 400 200 600 800 25 80 20 60 15 40 10 20 5 0 0 0 1 2 3 Heat Dissipated - Watts 4 13.70 (0.539) 1000 100 5 Thermal Resistance From MTG Surface to Ambient - C/Watt Part Number 1000 25 Thermal Resistance From MTG Surface to Ambient--C/Watt Mounting Surface Temp Rise Above Ambient--C Low cost slip on heat sink features an expandable collar that tightly grips the device meaning no extra mounting hardware is required. Three heights to choose from. 92F 68 Air Velocity--Feet Per Minute 400 200 600 800 Thermal Resistance From MTG Surface to Ambient--C/Watt 0 100 Mounting Surface Temp Rise Above Ambient--C THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES 5752, 5753, 5754 Low cost slip on heat sink 11.40 (0.449) 8.50 (0.335) 13.80 (0.543) 2.50 (0.098) 1.00 (0.039) 10.16 (0.400) 0.40 (0.016) 4.27 (0.039) Material: 0.38 (0.015) Thick Brass Finish: Unfinished Dia of PCB Plated Thru Hole for Tabs 1.73 (0.068) sales.na@aavid.com www.shopaavid.com Grease & Epoxy page112 Two piece heat sink FIGURE A FIGURE B o 2x 5.54 (0.218) THRU o 2x 4.78 (0.188) THRU Two piece heat sink adds extra cooling in the same amount of board space as other solutions. Base and top can be ordered separately. 16.89 (0.665) 30.15 (1.187) 38.86 (1.530) 7.87 (0.310) 3.71 (0.146) THRU TYP 2 5.46 (0.215) 4.34 (0.171) 38.95 (1.534) 30.65 (1.206) 14.17 (0.558) 31.75 (1.250) 10.92 (0.430) Mounting Kits page 99 12.70 (0.500) 4.06 (0.160) THRU TYP 2 2.81 (0.110) 9.27 (0.365) 21.34 (0.840) Material: 1.60 (0.063) Thick Aluminum Finish: Black Anodize Air Velocity--Feet Per Minute 400 200 600 800 0 100 Part Number Description Mounting Surface Temp Rise Above Ambient--C ORDERING INFORMATION Figure 520327B00000G Two piece heat sink assembly, base and top 520328B00000G Top only B 520329B00000G Base only A For additional options see page 84 80 8 60 6 40 4 20 2 0 0 0 2 520327 520328 520329 4 6 Heat Dissipated--Watts 0 Air Velocity--Feet Per Minute 400 200 600 800 Space saving expandable collar heat sink has the same footprint as the device being cooled meaning no extra board space is required to fit the heat sink. The expandable collar tightly grips the device meaning no extra hardware is required. May also be used with any diamond or square basket heat sink to form a two piece heat sink for additional cooling. Available in conductive AavSHIELD3 or black anodize finish. Mounting Surface Temp Rise Above Ambient--C 100 10 Mounting Kits page 99 1000 20 80 16 60 12 40 8 20 4 0 0 0 1 2 3 4 Heat Dissipated--Watts o 4.06 x 4.83 (0.160) (0.190) SLOT 28.57 (1.125) 30.15 (1.187) 39.12 (1.540) REF 5 9.91 (0.390) Part Number Finish 579103B00000G Black anodize AavSHIELD3 579103V00000G Grease & Epoxy page112 Low profile hat section heat sink Air Velocity--Feet Per Minute 400 200 600 800 ORDERING INFORMATION Part Number Description 506003B00000G Low profile hat section heat sink For additional options see page 84 Mounting Surface Temp Rise Above Ambient--C 100 1000 10 80 8 60 6 40 4 20 2 0 0 0 4 8 12 16 Heat Dissipated--Watts Mounting Kits page 99 30.15 (1.187) CL 1 Thermal Resistance From MTG Surface to Ambient--C/Watt 0 Low profile hat section heat sink is ideal for applications where low component heights are required such as card cages with PCBs mounted on 0.500 centers. 22.10 (0.870) Material: 1.27 (0.050) Thick Aluminum Finish: See Table ORDERING INFORMATION 5060 8 Space saving expandable collar heat sink Thermal Resistance From MTG Surface to Ambient--C/Watt 5791 1000 10 Thermal Resistance From MTG Surface to Ambient--C/Watt 5203 THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES TO-3 Heat Sinks 9.52 (0.375) 10.92 (0.430) 30.48 (1.200) CL 2 44.45 (1.750) 5.46 (0.215) 20 2x o 5.54 (0.218) THRU 1.82 (0.072) 15.06 (0.593) 2x o 4.78 (0.188) THRU 50.80 (2.000) Material: 1.27 (0.050) Thick Aluminum Finish: Black Anodize sales.na@aavid.com www.shopaavid.com 69 TO-3 Heat Sinks 80 8 60 6 40 4 20 2 575803B00000G 25.40 (1.000) 575903B00000G 31.75 (1.250) 8 "X" 15.07 (0.594) 41.40 (1.630) 30.15 (1.187) CL 2 1.83 (0.072) "X" 10 5.46 (0.215) 0 Air Velocity--Feet Per Minute 400 200 600 800 80 4 60 3 40 2 20 1 0 0 0 2 575903 575803 4 6 8 Heat Dissipated--Watts 32.77 (1.290) 1000 5 Mounting Kits page 99 o 4.78 (0.188) TYP 2 CL1 5.54 (0.218) TYP 2 10.92 (0.430) Thermal Resistance From MTG Surface to Ambient--C/Watt Mounting Surface Temp Rise Above Ambient--C 19.05 (0.750) 4 6 Heat Dissipated--Watts 100 "A" Dim 575703B00000G 2 575703 575603 ORDERING INFORMATION 12.70 (0.500) 0 0 Thermal Resistance From MTG Surface to Ambient--C/Watt 1000 10 0 Space saver diamond shaped basket heat sink featuring a narrow base with slanted fins to increase air turbulence in natural and forced convection applications. Made from heavy gauge material. Four heights to choose from. 575603B00000G Air Velocity--Feet Per Minute 400 200 600 800 100 0 Part Number Grease & Epoxy page112 Space saver diamond shaped basket heat sink Mounting Surface Temp Rise Above Ambient--C THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES 5756, 5757, 5758, 5759 "A" Material: 2.29 (0.090) Thick Aluminum Finish: Black Anodize 10 POPULAR OPTIONS: 575_03B 0 00 00G Base part no. A B Position Code Description A 1 Kon-DuxTM pad Location A 3 In-Sil-8TM pad B 01 6-23 Wave-OnTM threaded insert 0.100 stand off Details Page 86 Page 86 Hole X Page 89 For additional options see page 84 Air Velocity--Feet Per Minute 400 200 600 800 Mounting Surface Temp Rise Above Ambient--C 100 501503B00000G 25.40 (1.000) 501603B00000G 31.75 (1.250) POPULAR OPTIONS: Code A 1 4 20 2 0 0 2 4 6 Heat Dissipated--Watts 8 Air Velocity--Feet Per Minute 400 200 600 800 10 80 8 60 6 40 4 20 2 0 0 501603 501503 2 4 6 Heat Dissipated--Watts 8 o 4.75 (0.187) TYP 2 CL "X" 15.07 (0.594) 30.15 (1.187) o5.54 (0.218) TYP 2 47.75 (1.880) CL AT BASE "X" 100 0 1.83 (0.072) Mounting Kits page 99 35.56 (1.400) 5.46 AT BASE (2.150) 10.92 (0.430) "A" Material: 1.60 (0.063) Thick Aluminum Finish: Black Anodize 10 501_03B 0 00 00G Base part no. A B Position 40 1000 10 Mounting Surface Temp Rise Above Ambient--C 12.70 (0.500) 19.05 (0.750) 6 0 "A" Dim 501403B00000G 8 60 501403 501303 ORDERING INFORMATION 501303B00000G 80 0 Low cost diamond shaped basket heat sink with straight fins. High fin count enhances efficiency. Four heights to choose from. 1000 10 Thermal Resistance From MTG Surface to Ambient--C/Watt 0 Part Number Grease & Epoxy page112 Low cost diamond shaped basket heat sink Thermal Resistance From MTG Surface to Ambient--C/Watt 5013, 5014, 5015, 5016 C Description Location Kon-DuxTM pad Details Page 86 B 01 6-23 Wave-OnTM threaded insert 0.100 stand off Hole X Page 89 C 08 6-32 x 0.350 Solderable stud Hole X Page 96 For additional options see page 84 70 sales.na@aavid.com www.shopaavid.com Grease & Epoxy page112 5197, 5198, 5199, 5201 Heavy gauge square basket heat sink Air Velocity--Feet Per Minute 400 600 800 4 60 3 40 2 20 1 0 0 4 8 12 16 Heat Dissipated--Watts Mounting Surface Temp Rise Above Ambient--C "A" Dim 519703B00000G 38.10 (1.500) 519803B00000G 44.45 (1.750) 519903B00000G 50.80 (2.000) 520103B00000G 31.12 (1.225) 32.02 (1.300) 200 Air Velocity--Feet Per Minute 400 600 800 5.46 (0.215) "A" Material: 3.17 (0.125) Thick Aluminum Finish: Black Anodize 5 4 60 3 40 2 20 1 0 0 0 5 10 15 20 Heat Dissipated--Watts 10.92 (0.430) 1000 80 520103 519903 39.37 (1.550) "X" 1.83 30.15 (0.072) (1.187) 20 100 Part Number "X" o 4.75 (0.187) C 2 TYP 2 L 15.09 (0.594) 48.26 (1.900) @ BASE 0 ORDERING INFORMATION 10.41 (0.410) o 5.54 (0.218) TYP 2 CL 1 Thermal Resistance From MTG Surface to Ambient--C/Watt Mounting Surface Temp Rise Above Ambient--C 80 519803 519703 12.24 (0.482) 1000 5 0 Heavy gauge square basket heat sink provides excellent performance by using 1/8 thick aluminum to maximize efficiency. Available in 4 heights. 200 Thermal Resistance From MTG Surface to Ambient--C/Watt 0 100 Mounting Kits page 99 25 POPULAR OPTIONS: 5_ _ _03B 0 00 00G Base part no. THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES TO-3 Heat Sinks A B Position Code Description A 1 Kon-DuxTM pad Location B 01 6-32 Wave-OnTM theaded insert 0.100 stand off Details Page 86 Hole X Page 89 For additional options see page 84 0 Air Velocity--Feet Per Minute 400 200 600 800 30.23 (1.190) 1000 Mounting Surface Temp Rise Above Ambient--C 100 Square basket heat sink features folded back fins to increase surface area and power dissipation. Two heights are available. 33.27 (1.310) 579003B00000G 25.40 (1.000) 80 4 60 3 40 2 20 0 1 0 4 8 12 16 Heat Dissipated--Watts 20 1.78 (0.070) o 4.83 (0.190) THRU TYP 2 10.92 (0.430) Mounting Kits page 99 15.11 (0.595) o 3.66 THRU (0.144) TYP 8 27.69 (1.090) REF CL 46.48 SQ. (1.830) REF 5.46 (0.215) CL o 5.59 THRU (0.220) TYP 2 6.35 (0.250) REF "A" Material: 1.60 (0.063) Thick Aluminum Finish: Black Anodize "A" Dim 569003B00000G 5 0 569003 579003 ORDERING INFORMATION Part Number Grease & Epoxy page112 Square basket heat sink features folded back fins Thermal Resistance From MTG Surface to Ambient--C/Watt 5690, 5790 POPULAR OPTIONS: 5_9003B 0 0000G Base part no. Position Code A A A Description Details 1 Kon-DuxTM pad Page 86 3 In-Sil-8TM pad Page 86 For additional options see page 84 sales.na@aavid.com www.shopaavid.com 71 TO-3 Heat Sinks Grease & Epoxy page112 80 4 60 3 40 2 20 1 0 0 0 4 500103 500203 0 8 12 16 Heat Dissipated--Watts Air Velocity--Feet Per Minute 400 200 600 800 Part Number "A" Dim 500103B00000G 12.70 (0.500) 500203B00000G 19.05 (0.750) 500303B00000G 25.40 (1.000) 500403B00000G 31.75 (1.250) 5 4 60 3 40 2 20 1 0 0 0 4 500303 500403 8 12 16 Heat Dissipated--Watts 45.97 SQ. (1.810) CL 2 o 5.54 (0.218) TYP 2 38.10 (1.500) 5.46 (0.215) 10.92 (0.430) 1000 80 CL 1 o 4.78 (0.188) TYP 2 20 100 ORDERING INFORMATION 30.15 (1.187) Thermal Resistance From MTG Surface to Ambient--C/Watt 5 Mounting Kits page 99 o 3.81 (0.150) THRU TYP 4 1000 100 Mounting Surface Temp Rise Above Ambient--C Square basket heat sink featuring a slanted fin design for increased air turbulence and four integrated mounting holes. Four heights to choose from. Air Velocity--Feet Per Minute 400 200 600 800 Thermal Resistance From MTG Surface to Ambient--C/Watt 0 Mounting Surface Temp Rise Above Ambient--C THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES 5001, 5002, 5003, 5004 Square basket heat sink featuring slanted fins 15.06 (0.593) 1.83 (0.072) "A" Material: 2.29 (0.090) Thick Aluminum Finish: Black Anodize 20 POPULAR OPTIONS: 500_03B 0 0000G Base part no. Position Code Description A Details A 1 Kon-DuxTM pad Page 86 A 3 In-Sil-8TM pad Page 86 For additional options see page 84 0 Air Velocity--Feet Per Minute 400 200 600 800 5 4 60 3 40 2 20 1 0 0 2 505103 505303 505403 4 6 Heat Dissipated--Watts 8 12.70 (0.500) 25.40 (1.000) 505403B00000G 31.75 (1.250) "X" o 4.78 (0.188) TYP 2 45.21 (1.780) CL 2 "X" 10 5.46 (0.215) 1.83 (0.072) 15.06 (0.593) 30.15 (1.187) "A" Material: 2.29 (0.090) Thick Aluminum Finish: Black Anodize "A" Dim 505303B00000G o 5.54 (0.218) TYP 2 10.92 (0.430) ORDERING INFORMATION 505103B00000G CL1 80 0 Mounting Kits page 99 1000 100 Mounting Surface Temp Rise Above Ambient--C Square basket heat sink features straight fins and 0.090 thick aluminum for increased cooling capacity. Three heights to choose from. Part Number Grease & Epoxy page112 Square basket heat sink featuring straight fins Thermal Resistance From MTG Surface to Ambient--C/Watt 5051, 5053, 5054 POPULAR OPTIONS: 505_03B0 00 00G Base part no. Position Code A 01 A Description 6-23 Wave-OnTM threaded insert 0.100 stand off Location Details Hole X Page 89 For additional options see page 84 72 sales.na@aavid.com www.shopaavid.com Grease & Epoxy page112 5761, 5762, 5763, 5764 Square basket heat sink featuring slanted vane fins Mounting Kits page 99 CL1 12.32 (0.485) o 4.77 (0.188) TYP 2 "X" o 5.54 (0.218) TYP 2 45.97 (1.810) REF CL 2 "X" Square basket heat sink features slanted vane fins for efficient heat dissipation. Air movement from any direction is diverted into the center of the heat sink to create turbulence and improve heat transfer. Four heights to choose from. 576303B00000G 25.40 (1.000) 576403B00000G 31.75 (1.250) 100 5 80 4 60 3 40 2 20 1 0 0 0 POPULAR OPTIONS: 576 _ 03B 0 00 00G Code Description A 1 Kon-DuxTM pad B 01 6-32 Wave-OnTM theaded insert 0.100 stand off 4 576103 576203 A B Base part no. Position Location 0 8 12 16 Heat Dissipated--Watts 200 Air Velocity--Feet Per Minute 400 600 800 1000 100 5 80 4 60 3 40 2 20 1 0 0 20 0 576303 576403 4 8 12 16 Heat Dissipated--Watts Thermal Resistance From MTG Surface to Ambient--C/Watt 19.05 (0.750) 1000 Mounting Surface Temp Rise Above Ambient--C 576203B00000G Air Velocity--Feet Per Minute 400 200 600 800 Thermal Resistance From MTG Surface to Ambient--C/Watt 0 Mounting Surface Temp Rise Above Ambient--C 12.70 (0.500) "A" Material: 2.29 (0.090) Thick Aluminum Finish: Black Anodize "A" Dim 576103B00000G 30.15 1.83 (0.072) (1.187) 5.46 (0.215) 10.92 (0.430) ORDERING INFORMATION Part Number 15.09 (0.594) 12.32 (0.485) 20 THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES TO-3 Heat Sinks Details Page 86 Hole X Page 89 For additional options see page 84 PF523, PF526, PF527 Diamond shaped heat sink DIA 22.90 (0.902) "A" 3.40 (0.134) Approx DIA 8.00(0.315) area flat around holes 30.15 (1.19) CTRS Diamond shaped heat sink is the same profile as the device which saves space on the board. This rugged design is made from cast aluminum and is available in three different heights. DIA 4.20 (0.165) 4.10 (0.161) TYP (2) 40.80 (1.606) 26.90 (1.060) Material: Cast Aluminum Finish: Black Anodize "A" Dim PF523G 12.50 (0.492) PF526G 19.00 (0.748) PF527G 25.00 (0.984) 0 200 Air Velocity--Feet Per Minute 400 600 800 100 Mounting Surface Temp Rise Above Ambient--C Part Number 80 8 60 6 40 4 20 2 0 0 0 PF523 PF526 PF527 1000 10 3 6 9 Heat Dissipated--Watts 12 Thermal Resistance From MTG Surface to Ambient--C/Watt ORDERING INFORMATION 15 sales.na@aavid.com www.shopaavid.com 73 TO-66 Heat Sinks Grease & Epoxy page112 1000 10 80 8 60 6 Mounting Surface Temp Rise Above Ambient--C 40 4 20 2 0 0 0 Low cost diamond shaped basket heat sink with straight fins. High fin count enhances efficiency. Four heights to choose from. 2 501706 501806 4 6 Heat Dissipated--Watts 8 ORDERING INFORMATION "A" Dim 501706B00000G 12.70 (0.500) 501806B00000G 19.05 (0.750) 501906B00000G 25.40 (1.000) 502006B00000G 31.75 (1.250) Air Velocity--Feet Per Minute 400 200 600 800 1000 10 80 8 60 6 40 4 20 2 0 0 0 2 501906 502006 4 6 Heat Dissipated--Watts 8 "A" 10 Mounting Surface Temp Rise Above Ambient--C Air Velocity--Feet Per Minute 400 200 600 800 100 1000 20 80 16 60 12 40 8 20 4 0 Space saving expandable collar heat sink has the same footprint as the device being cooled meaning no extra board space is required to fit the heat sink. The expandable collar tightly grips the device. ORDERING INFORMATION 74 39.37 (1.550) @ BASE CL2 Mounting Kits page 99 Space saving expandable collar heat sink 0 Part Number Finish 579206B00000G Black anodize AavSHIELD3 579206V00000G o 3.96 (0.156) TYP 4 12.19 (0.480) 24.38 (0.960) 2.54 (0.100) Material: 1.60 (0.063) Thick Aluminum Finish: Black Anodize 0 0 1 2 3 Heat Dissipated--Watts 4 Thermal Resistance From MTG Surface to Ambient--C/Watt 5792 10 2.54 (0.100) Thermal Resistance From MTG Surface to Ambient--C/Watt 0 Part Number CL1 26.42 (1.040) @ BASE 100 Mounting Kits page 99 5.08 (0.200) Thermal Resistance From MTG Surface to Ambient--C/Watt Air Velocity--Feet Per Minute 400 200 600 800 100 0 Mounting Surface Temp Rise Above Ambient--C THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES 5017, 5018, 5019, 5020 Low cost diamond shaped basket heat sink 20.62 (0.812) o 11.68 (0.460) 24.38 (0.960) 31.00 (1.220) o 3.96 x 4.95 (0.156)(0.195) SLOT 5 13.72 (0.540) 9.27 (0.365) 4.44 (0.175) Material: 1.27 (0.050) Thick Aluminum Finish: See Table sales.na@aavid.com www.shopaavid.com TO-05 Heat Sinks Mounting Surface Temp Rise Above Ambient--C 80 40 60 30 40 20 20 10 0 0 0.0 0 Mounting Surface Temp Rise Above Ambient--C "A" Dim 578105B00000G 3.96 (0.156) 578205B00000G 6.35 (0.250) 578305B00000G 12.70 (0.500) 578405B00000G 19.05 (0.750) 578505B00000G 25.40 (1.000) 200 0.8 1.2 1.6 Heat Dissipated--Watts Air Velocity--Feet Per Minute 400 600 800 100 ORDERING INFORMATION Part Number 0.4 578105 578205 Snap on cooler features easy no tools installation. Folded back fins provide maximum surface area while preserving valuable board space. 1000 50 40 30 40 20 20 10 0 0 578405 578305 0.8 1.2 1.6 Heat Dissipated--Watts 30 40 20 20 10 0 0 0.4 578505 60 0.4 40 60 0.0 1000 50 1000 50 80 2.0 80 0.0 Air Velocity--Feet Per Minute 400 200 600 800 0 100 0.8 1.2 1.6 Heat Dissipated--Watts 2.0 10.03 (0.395) o 8.03 (0.316) 21.08 (0.830) "A" 2.0 6.35 (0.250) Material: 0.63 (0.025) Thick Aluminum Finish: Black Anodize Space saving expandable heat sink 0 Air Velocity--Feet Per Minute 400 200 600 800 Space saving expandable heat sink features a collar that tightly grips the device meaning no extra hardware is required. Heat sinks are constructed of pre-black anodize material to lower cost. Mounting Surface Temp Rise Above Ambient--C 100 1000 50 80 40 60 30 40 20 20 10 0 0 0.0 0.4 6201 6202 6203 0.8 1.2 1.6 Heat Dissipated--Watts 32.51 (1.280) Thermal Resistance From MTG Surface to Ambient--C/Watt 6201, 6202, 6203 THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES Air Velocity--Feet Per Minute 400 600 800 Mounting Surface Temp Rise Above Ambient--C 200 Thermal Resistance From MTG Surface to Ambient--C/Watt 0 100 Thermal Resistance From MTG Surface to Ambient--C/Watt Snap on cooler heat sink Thermal Resistance From MTG Surface to Ambient--C/Watt 5781, 5782, 5783, 5784, 5785 2.0 "A" 6.35 (0.250) ORDERING INFORMATION Part Number "A" Dim # Fins 6201PBG 6.35 (0.250) 1 6202PBG 12.70 (0.500) 2 6203PBG 19.56 (0.770) 3 o 8.03 I.D. (0.316) Material: 0.63 (0.025) Thick Aluminum Finish: Pre Black Anodize* * Edges cut during the manufacturing process will be unfinished. See page 110 more more information Low cost push on heat sink 0 Air Velocity--Feet Per Minute 400 200 600 800 Low cost push on heat sink uses spring pressure to firmly grip the device case creating a good thermal interface. Mounting Surface Temp Rise Above Ambient --C 100 1000 50 80 40 60 30 40 20 20 10 0 0 0 0.5 1 1.5 Heat Dissipated--Watts 2 Thermal Resistance From MTG Surface to Ambient--C/Watt 5F o 16.00 (0.630) 12.70 (0.500) o 7.90 (0.311) 2.5 Material: Aluminum Finish: Black Anodize ORDERING INFORMATION Part Number Description 5FG Low cost push on heat sink sales.na@aavid.com www.shopaavid.com 75 TO-5 Heat Sinks 1000 50 80 40 60 30 40 20 20 10 Mounting Surface Temp Rise Above Ambient--C Extruded collar style heat sink with radial fins. The split collar design provides a press fit between the transistor and the heat sink creating an excellent thermal conduction path. Available in two heights. Air Velocity--Feet Per Minute 400 600 800 100 0 200 0 0 0.0 0.4 326005 325705 0.8 1.2 1.6 Heat Dissipated--Watts Thermal Resistance From MTG Surface to Ambient--C/Watt Extruded collar style heat sink with radial fins 12.70 (0.500) o 8.07 (0.318) THRU 2.0 "A" Material: Aluminum Finish: Black Anodize ORDERING INFORMATION "A" Dim 325705B00000G 6.35 (0.250) 326005B00000G 9.53 (0.375) 3201, 3202 Extruded collar style heat sink with swept back fins 0 200 Air Velocity--Feet Per Minute 400 600 800 100 Extruded collar style heat sink with swept back fins for increased surface area in a small volume. The split collar design provides a press fit between the transistor and the heat sink creating an excellent thermal conduction path. Available in two inside diameters. "A" 1000 50 80 40 60 30 40 20 20 10 0 0 0.0 0.4 0.8 1.2 1.6 Heat Dissipated--Watts Thermal Resistance From MTG Surface to Ambient--C/Watt Part Number Mounting Surface Temp Rise Above Ambient--C THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES 3257, 3260 12.70 (0.500) 6.35 (0.250) 2.0 Material: Aluminum Finish: Black Anodize ORDERING INFORMATION "A" Dim 320105B00000G 8.07 (0.318) 320205B00000G 7.75 (0.305) 3230 Extruded collar style heat sink with mounting hole 0 Air Velocity--Feet Per Minute 400 200 600 800 Extruded collar style heat sink with mounting hole for hardware attachment to the circuit card. The heat sink includes a mount boss that will accept a 4-40 screw for secure mounting in high vibration environments. The split collar design provides a press fit between the transistor and the heat sink creating an excellent thermal conduction path. Mounting Surface Temp Rise Above Ambient--C 100 1000 50 80 40 60 30 40 20 20 10 0 0 0.0 0.4 0.8 1.2 1.6 Heat Dissipated--Watts 2.0 Thermal Resistance From MTG Surface to Ambient--C/Watt Part Number o 8.08 (0.318) R 7.62 (0.300) o 3.17 (0.125) 19.05 (0.750) 6.35 (0.250) Material: Aluminum Finish: Black Anodize ORDERING INFORMATION 76 Part Number Description 323005B00000G Extruded collar style heat sink with mounting boss sales.na@aavid.com www.shopaavid.com Copper heat sink for axial lead devices 0 200 Air Velocity--Feet Per Minute 400 600 800 Mounting Surface Temp Rise Above Ambient--C 100 1000 10 80 8 60 6 40 4 20 2 0 0 0 2 4 6 Heat Dissipated--Watts 8 25.40 (1.000) Thermal Resistance From MTG Surface to Ambient--C/Watt 6000 6.35 (0.250) @ BASE CL SYM 15.24 REF (0.600) 25.40 (1.000) 30.48 (1.200) REF 27.30 (1.075) 10 Copper heat sink for axial lead device requires no extra board space to mount. One lead of the heat sink is soldered to the device while the other solders to the PC board. Available in two finishes. 1.90 (0.075) 14.20 (0.559) 1.27 (0.050) FIGURE A 20.32 (0.800) 15.24 (0.600) DIA as required for lead size 2.36 (0.093) ORDERING INFORMATION Dia of PCB Plated Thru Hole for Tabs Part Number Description Finish 6000UG Heat sink for axial lead device Unfinished See figure A 6000DG Heat sink for axial lead device Tin plated* See figure A Material: 0.53 (0.021) Thick Copper Finish: See Table * See page 110 for more information THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES Axial Lead Devices Bridge Rectifiers 6222, 6223, 6224 Square basket style heat sink for bridge rectifiers 200 Air Velocity--Feet Per Minute 400 600 800 Mounting Surface Temp Rise Above Ambient--C 80 8 60 6 40 4 20 2 0 0 0 Square basket style heat sink for bridge rectifiers uses no additional board space. Available with three different mounting hole diameters. 1000 10 2 4 6 Heat Dissipated--Watts 8 "A" Thermal Resistance From MTG Surface to Ambient--C/Watt 0 100 31.75 (1.250) 15.24 (0.600) 10 26.92 SQ (1.060) Material: 1.27 (0.050) Thick Aluminum Finish: Black Anodize ORDERING INFORMATION Part Number "A" Dim 6222BG 3.61 (0.142) Dia Thru 6223BG 4.14 (0.163) Dia Thru 6224BG 4.77 (0.188) Dia Thru sales.na@aavid.com www.shopaavid.com 77 OPTIONS & ACCESSORIES CONTENTS Thermal solutions go beyond the heat dissipator itself. Aavid offers a total solution package, which includes a number of options and accessory items described in this section of the catalog. A total thermal solution includes an efficient thermal interface and means of mechanical attachment. Aavid has a full-line of interface materials that can be preapplied or supplied as an accessory item. Mechanical assembly options include attachment of semiconductors to heat sinks, heat sinks to printed circuit boards, and heat sinks to sockets of CPUs. Aavid offers the most complete line of value added options of any supplier in the industry. Our full line of accessories includes mounting kits, shoulder washers, insulators, mounting pads, and various grease products and epoxies, which are sold separately, and can be used with a variety of Aavid heat sinks. This section will provide the most complete solution to your thermal requirement. CONTENTS How to decipher or construct an Aavid 12 digit part number....................... 80 How to decipher or construct a "Thermalloy" origin part number............... 81 Indexes................................................................................................................................. 82 Interface Materials Pads In-Sil-8TM Pads.................................................................................................................... Kon-DuxTM/Grafoil(R) Pads.............................................................................................. Hi-Flow(R) Pads................................................................................................................... Alignment Pads................................................................................................................ 86 86 87 87 Double Sided Tape Options (factory applied) T414...................................................................................................................................... 88 T405R.................................................................................................................................... 88 T412...................................................................................................................................... 88 T411...................................................................................................................................... 88 T410R.................................................................................................................................... 88 Labor Saving Heat Sink to Board and Device to Heat Sink Mounts Wave-OnTM Mounts.......................................................................................................... 89 Semiconductor Mounts................................................................................................. 90 Shur-LockTM Tabs............................................................................................................... 91 Solderable Staked on Tabs........................................................................................... 91 Solderable Mounting Tabs............................................................................................ 93 Solderable Pins................................................................................................................. 94 Solderable Nuts................................................................................................................. 94 Clinch Nuts.......................................................................................................................... 95 Solderable Studs............................................................................................................... 96 Device Mounting Studs.................................................................................................. 96 Clips Aavid Kool-KlipsTM............................................................................................................ 97 Thermal Clips..................................................................................................................... 98 78 sales.na@aavid.com www.shopaavid.com CONTENTS Accessories Mounting Kits TO-220/TO-3 Mounting Kits......................................................................................................................... 99 OPTIONS & ACCESSORIES CONTENTS Insulating Shoulder Washers Polyphenylene Sulfide (PPS) Shoulder Washers................................................................................... 100 Nylon Shoulder Washers................................................................................................................................100 Insulators ThermalfilmTM Polymide Plastic Films........................................................................................................101 ThermalfilmTM/ ThermalfilmTM MT................................................................................................................ 102 Mica, ThermalsilTMlll.......................................................................................................................................... 103 Aluminum Oxide Ceramic Insulators........................................................................................................ 104 Stanchion Pads..................................................................................................................................................105 Insulating Covers TO-3 Insulating Covers................................................................................................................................... 106 Teflon-Filled Acetal Insulators..................................................................................................................... 106 Teflon-Filled Acetal Bushings.......................................................................................................................106 Mounting Pads (TO-5, TO-18, IC, Universal, TO-18 Lead Conversion, Epoxy Lead Conversion)................ 107 Finishes .............................................................................................................................................................. 110 Card Ejectors Snap-On Ejectors..............................................................................................................................................111 Standard Ejectors............................................................................................................................................. 111 Thermal Greases and Epoxies Sil-FreeTM.............................................................................................................................................................. 112 Ther-O-LinkTM..................................................................................................................................................... 112 UltrastickTM.......................................................................................................................................................... 112 ThermalCoteTM................................................................................................................................................... 113 ThermalCoteTM II............................................................................................................................................... 113 Ther-O-BondTM 1500........................................................................................................................................ 114 Ther-O-BondTM 1600........................................................................................................................................ 114 Ther-O-BondTM 2000........................................................................................................................................ 114 ThermalbondTM.................................................................................................................................................. 115 sales.na@aavid.com www.shopaavid.com 79 HOW TO DECIPHER A 12 DIGIT PART NUMBER How to decipher an Aavid standard 12 digit part number Aavid standard product line in most cases consists of a 12-digit part number sequence. In most standard offerings, Digits 1 through 4, define the model basic part number. Digits 5 and 6 designate the package style that a particular heat sink is designed to cool. The 7th digit deter-mines the finish, and the 8th identifies the interface material, if one can be used for that particular style heat sink. The 9th and 10th digits define the PC board mounting method, and the 11th and 12th digits define the method of attachment of the package to the heat sink. For digits 8,9,10,11 and 12, the absence of any of those options is always designated by a zero in those positions. Important NOTE: The 12 digit part number sequence is a general format. Due to the different variations and styles of heat sinks, we have included an Option Index on pages 82-84 to show available options and accessories for the products covered in this catalog. Standard board level: A = Base Part Number B = Package Style C = Finish D = Interface Material E = PC Board Mounting F = Package Mounting G = RoHS Compliant 5748 02 B 0 37 00 G A B C D E F G To order most Aavid heat sinks, you must use a 12 digit part number using the following options: Digits 5-6: Package style Digit 7: Finish Digit 8: Interface material CODE 00 01 02 03 04 05 06 08 10 21 22 CODE B D J M U V W CODE 0 1 2 3 4 7 8 DEVICE Blank TO-218 TO-220, TO-216, TO-217 TO-3 TO-202 TO-5, TO-39 TO-66 TO-247 Multiwatt/SIP Dual TO-218 Dual TO-220 DESCRIPTION Black Anodize Solderable 100% Tin Finish Pre-Black Anodize Green Anodize Unfinished AavSHIELD3 Black Anodize w/Black Paint For additional information see page 110 Digits 9-10: PC Board mounting Solderable Wave-OnTM mounts CODE 01 02 03 04* 05 07 09 13 STAND-OFF 0.100" 0.100" 0.045" 0.100" 0.045" 0.100" 0.200" 0.129" THREAD #6-32 #4-40 #4-40 #6-32 #6-32 3.5mm #6-32 #6-32 * 0.090 PCB (others 0.062") For additional information see page 89 Solderable pins for board mounted extrusions CODE DESCRIPTION 21 Solid Pin with Stand Off Shoulder 0.050" 25 Solid Solderable Pin For additional information see page 94 Solderable nut CODE DESCRIPTION 13 SNE-2 6-32 UNC-2B 14 SNE-1 4-40 UNC-2B LENGTH 0.305" 0.305" For additional information see page 94 DESCRIPTION None One Kon-DuxTM Pad Two Kon-DuxTM Pads One In-Sil-8TM Pad Two In-Sil-8TM Pad One Hi-Flow(R) Pad Two Hi-Flow(R) Pads For additional information see pages 86 and 87 Solderable staked on **tabs CODE DESCRIPTION 28 Shur-LockTM Tab (0.130 for 0.062" PC Boards) 31 Centered Horizontal (0.050 W x 0.130 L) 32 Centered Horizontal (0.050 W x 0.130 L) 33 Centered Vertical (0.062 W x 0.340 L) 34 Vertical Pair L & R (0.075 W x 0.170 L) 35 Vertical Pair L & R (0.097 W x 0.200 L) 36 Centered Vertical (0.100 W x 0.150 L) 37 Centered Step (0.062 W x 0.250 L with 0.125 wide step) 39 Centered Vertical (0.050 W x 0.375 L) 40 Centered Vertical (0.050 W x 0.245 L) 43 Centered Step (0.050 W x 0.375 L) 48 Centered Vertical (0.062 W x 0.280 L) 53 MT Tab Vertical Pair (0.090 W x 0.125 L) 54 MT2 Tab Vertical Pair (0.090 W x 0.125 L) 55 MT3 Tab Vertical Pair (0.090 W x 0.125 L) 56 Bifurcated Tab Vertical Pair (0.110 W x 0.125 with 0.190 step) 57 Bifurcated Tab Vertical Pair (0.110 W x 0.125 with 0.100 step) For additional information see pages 91-93 ** For additional tab options, please contact Application Engineering at (603) 224-9988 Digits 11-12: Package mounting Semiconductor mounts CODE DESCRIPTION LENGTH 01 #6-32 Female 02 #4-40 Female 03 M-3 Female 04 #6-32 Male 0.380" 05 #4-40 Male 0.380" For additional information see page 90 Standard clips Kool-KlipsTM Sold separately CODE PART# 50 115000 51 115100 52 115200 53 115300 54 115400 62 116200 For additional information see page 97 Thermal clips Factory applied to heat sink CODE PART# 32 TC-1 33 TC-10 34 TC-11 35 TC-12 For additional information see page 98 80 Studs CODE DESCRIPTION 06 SE-2 Stud #6-32 07 SM-3 M-3 Male 08 SE-1 Stud #6-32 09 SE-3 Stud #4-40 11 SF-1 M3 x 0.5 14 SE-4 Stud #6-32 17 SM-1M-3 Male For additional information see page 96 LENGTH 0.485" 0.350" 0.350" 0.350" 0.302" 0.350" 0.350" Clinch nuts CODE DESCRIPTION 12 CNE-42 4-40 Clinch nut 13 CNM-1 M3 X 0.5 Clinch nut For additional information see page 95 sales.na@aavid.com www.shopaavid.com How to decipher a Thermalloy origin part number? HOW TO DECIPHER A THERMALLOY ORIGIN PART NUMBER Aavid features a variety of Thermalloy origin standard products that consist of a different part number sequence than the standard Aavid 12 digit part numbering system. In most cases, digits 1 through 4, designate the basic model number of the heat sink. Digits 5-6, designate the finish of the heat sink. Digits 6-13 can designate any number of different options that come with a specific model number. (Please refer to Option Index D on page 85 to see Aavid`s offerings per base number.) To order most Thermalloy origin heat sinks you must use the basic part numbering system below: Standard board level: 6021 A - B C G D Popular finishes* (followed after base number in location B above) B=Black Anodize PB= Pre-Black Anodized D=Tin Plated U=Clean, No Finish V=AavSHIELD3 *For additional information see page 110 E A = Model Number B = Finish C = Productivity Enhancement (if applicable) D = Second Productivity Enhancement (if applicable) E = RoHS Compliant Suffix Popular productivity enhancing options: Digits (Figure C-D above) P_= Solderable Roll Pins (see page 94) TC_ _ = Thermal Clip (see page 98) CNE_ _ = Clinch Nuts (see page 95) CNM_= Clinch Nuts Metric (see page 95) MT= Mounting Tabs (see page 93) 8223-CL03,8241-CL11 = Alignment Pad (see page 87) SE-_= Solderable Studs (see page 96) SF_= Mounting Studs (see page 96) G_= Grafoil(R) Pad (see page 86) SNM_= Solderable Nuts Metric (see page 94) SNE= Solderable Nuts (see page 94) BGS_= BGS Clip (page 18) Note: For a wide range of part number specific options, please see our Aavid Option Index D on page 85 sales.na@aavid.com www.shopaavid.com 81 Option Index A Available option codes for Aavid 12 digit part numbers. For additional information on option codes see "How to decipher an Aavid 12 digit part number" on page 80. To find the appropriate Option Index for a selected part number please refer to the main product section in the front of the catalog or "How to use this catalog" on page 2. Ordering Codes OPTION INDEX Base part 82 504102 504222 506902 507002 507102 507222 507302 530101 530102 530161 530162 530401 530402 530613 530614 530714 530801 530802 530861 530862 534202 534265 542502 551002 563002 569022 574102 574402 574502 574602 574802 574902 575002 575102 576012 576014 576602 577002 577102 577202 577922 578622 579302 579402 579802 579902 590102 590302 592201 592502 592902 593002 593101 593202 Finishes (page 110) B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U Solderable tabs (page 91-93) 53 J J J J J J V V V V V J 56 57 53 54 55 56 57 53 33 54 55 36 39 56 40 57 50 50 62 62 50 50 53 53 53 28 28 J 54 55 Clips (page 97) 54 55 54 55 54 55 56 56 56 Wave-OnTM mounts (page 89) KonduxTM pads In-Sil-8TM pads Hi-Flow(R) pads (page 86) (page 86) (page 87) 01 01 01 01 02 02 02 02 03 03 03 03 05 05 05 05 1 2 1 1 01 01 01 01 01 01 01 01 02 02 04 04 04 04 04 04 03 03 05 05 05 05 05 05 05 05 07 07 07 07 07 07 1 1 1 1 1 1 1 1 01 01 01 01 04 04 04 04 05 05 05 05 07 07 07 07 1 1 1 1 1 01 02 05 03 05 1 1 01 02 03 05 57 57 57 50 50 62 62 53 53 34 35 34 35 D V 33 33 33 33 37 33 37 37 37 37 48 43 37 43 D V V V 4 3 3 2 2 2 2 2 2 2 1 1 1 2 2 2 2 1 1 1 J V V 28 28 33 33 36 33 36 36 38 39 39 39 28 32 34 35 33 33 36 36 34 28 28 28 36 28 40 40 40 01 02 01 02 01 02 03 05 03 05 03 05 3 3 3 3 3 3 3 3 3 3 3 3 3 1 1 1 37 34 35 34 34 35 01 02 03 05 34 35 01 02 03 05 3 1 1 1 1 1 3 3 3 3 3 02 03 05 07 08 01 02 03 05 07 08 01 01 02 03 05 07 08 02 03 05 07 08 01 01 02 03 05 07 08 02 03 05 07 08 01 02 03 05 07 08 01 01 01 02 03 05 07 08 02 03 05 07 08 02 03 05 07 08 01 02 03 05 07 08 7 7 7 7 7 4 4 1 1 1 01 7 7 3 3 3 3 3 3 3 2 2 02 4 3 3 3 3 D V V V V V Studs (page 96) 3 D 32 32 32 32 33 28 Semiconductor mnts (page 90) 05 01 01 01 01 01 02 03 05 07 08 02 03 05 07 08 02 03 05 07 08 02 03 05 07 08 sales.na@aavid.com www.shopaavid.com Option Index B Available Option codes for Aavid 12 digit part numbers. For additional information on option codes see "How to decipher an Aavid 12 digit part number" on page 80. To find the appropriate Option Index for a selected part number please refer to the main product section in the front of the catalog or "How to use this catalog" on page 2. 513001 513002 513101 513102 513201 513202 513301 513302 529701 529702 529801 529802 529901 529902 530001 530002 531002 531102 531202 531302 532602 532702 532802 533001 533002 533101 533102 533201 533202 533301 533302 533401 533402 533421 533422 533501 533502 533521 533522 533601 533602 533621 533622 533701 533702 533721 533722 533802 533902 534002 581001 581002 581101 581102 581201 581202 Finishes (page 110) B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B U U U U U U U U U U U U U U V V 33 34 33 34 33 V V V V U U U U U U U U U U U U U U U U U Clips (page 97-98) 51 51 51 51 51 51 51 51 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 54 54 54 V KonduxTM pads (page 86) 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 In-Sil-8TM pads (page 86) 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 Hi-Flow(R) pads Semiconductor mounts Solderable pins (page 87) (page 90) (page 94) 4 4 4 4 4 4 4 4 4 4 4 4 4 4 01 7 7 7 7 7 7 7 7 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 7 7 7 03 01 01 01 02 01 02 05 02 01 01 01 01 01 02 02 02 02 02 02 01 02 01 01 02 03 02 03 03 02 02 05 05 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 Studs (page 96) Clinch nuts (page 95) 11 11 11 12 12 13 sales.na@aavid.com www.shopaavid.com OPTION INDEX Ordering Codes Base part 83 Option Index C Available option codes for Aavid 12 digit part numbers. For additional information on option codes see "How to decipher an Aavid 12 digit part number" on page 80. To find the appropriate Option Index for a selected part number please refer to the main product section in the front of the catalog or "How to use this catalog" on page 2. Ordering Codes Base part Finishes (page 110) Wave-OnTM mounts OPTION INDEX (page 89) 84 500103 500203 500303 500403 501303 501403 501503 501603 505103 505303 505403 506003 506304 519703 519803 519903 520103 520328 520329 566010 566902 569003 574204 575603 575703 575803 575903 576103 576203 576303 576403 576802 576904 577304 577404 579003 579604 579704 584000 591202 591302 B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U V V 01 01 01 01 01 01 01 01 01 01 01 02 02 02 02 03 02 03 02 02 02 02 04 04 03 03 04 03 05 04 03 03 03 05 05 04 04 05 05 07 05 04 04 04 07 09 05 05 07 07 09 07 05 05 05 KonduxTM pads (page 86) In-Sil-8TM pads (page 86) 1 1 1 1 1 1 1 1 1 1 1 3 3 3 3 3 3 3 3 3 3 3 Semiconductor mounts (page 90) Solderable tabs (page 91-93) Solderable nuts (page 94) 13 13 04 13 13 V V V V 01 01 01 01 01 53 03 03 03 04 04 04 04 05 05 05 05 07 07 07 09 09 1 1 1 1 13 14 Solderable studs (page 96) 06 06 06 06 06 06 06 08 08 08 08 07 08 08 08 09 09 09 09 08 09 17 17 17 14 14 3 3 3 3 08 28 31 34 37 31 37 39 40 V 01 02 04 05 1 3 06 08 17 09 11 32 33 V V V V V V 01 01 01 01 01 01 01 01 03 03 04 03 02 02 02 02 04 04 05 04 03 03 04 04 05 05 07 05 04 04 05 05 01 01 01 02 02 02 05 03 05 03 05 03 05 09 07 05 05 1 1 1 1 1 1 1 1 3 3 3 3 3 3 3 3 31 32 33 37 39 40 01 05 32 32 33 31 28 33 33 35 33 37 38 39 40 40 sales.na@aavid.com www.shopaavid.com Option Index D Available option codes for Thermalloy origin part numbers. For additional information on option codes see "How to decipher a Thermalloy Origin part number" on page 81. To find the appropriate Option Index for a selected part number, refer to the main product section in the front of the catalog or "How to use this catalog" on page 2. Ordering Codes Finishes (page 110) 6021 6022 6025 6109 6110 6225 6230 6232 6238 6239 6374 6380 6396 6398 6399 6400 7019 7020 7021 7022 7023 7025 B U B U PB B U B U B U B U B U B U B U B B B B B B B U B U B U B U B U B U Mounting tabs (page 93) Clips (page 98) PB PB D PB PB PB PB D PB PB MT MT5 MT MT MT MT3 MT5 MT MT5 MT6 MT TC-10 TC-1 TC-10 TC-1 PB MT MT6 MT MT2 MT5 MT6 TC-10 MT MT5 MT6 TC-10 MT MT5 TC-1 MT MT5 TC-1 TC-6 MT MT3 MT6 TC-12 Device mtg. studs (page 96) SF1 SF1 SF2 SF1 SF3 SE3 SE1 SF1 SE1 SM3 SF1 Clinch nuts (page 95) Solderable nuts (page 94) CNM1 CNM1 CNE42 CNE42 CNE42 TC-11 TC-11 TC-11 TC-7 P2 P2 P2 P2 P2 P2 SE3 TC-12 SE3 TC-12 TC-12 SE3 TC-12 SE3 Grafoil(R) pads (page 86) G5 G5 G5 G5 G5 CNE42 CNM1 CNM2 CNE42 CNE43 CNM2 P3 Alignment pads (page 87) G5 SF1 TC-6 TC-6 PB Solderable studs & pins (page 94-96) SF1 OPTION INDEX Base part G7 G7 SNM1 CNM1 CNE42 CNE42 SF1 SNE2 8223-CL03 G5 G4 8223-CL03 G5 8241-CL11 8223-CL03 G4 8223-CL03 sales.na@aavid.com www.shopaavid.com 85 Interface Material/Pads In-Sil-8TM TO-3 INTERFACE MATERIALS These silicone based pads provide both thermal conductivity and electrical isolation. In-Sil-8TM pads have a fiberglass carrier that withstands the rigors of assembly, harsh environments and aging under continuous use. In-Sil-8TM pads install faster than traditional mica and grease and will not contaminate solder baths. Screw mounting is recommended to achieve the best thermal performance. TO-218 TO-220 2X o 3.56 (0.140) 12.70 (0.500) 41.91 (1.650) 19.05 (0.750) 2X o 2.36 (0.093) 18.80 (0.740) 3.73 DIA (0.147) 14.30 (0.563) 21.84 (0.860) 16.76 (0.660) 28.96 (1.140) ORDERING INFORMATION example 12 digit part 507222B _ 0000G MATERIAL PROPERTIES Color Ordering code Grey Thickness 0.18 (0.007) Breakdown voltage 3500 Dielectric constant 5.5 The shape and hole pattern of the heat sink will determine the shape and hole pattern of the pad. If you are ordering a heat sink which mounts to a semiconductor on both sides, the ordering code for two pads should be used. To order additional In-SilTM pads separate, or factory applied variations please contact an Aavid sales rep for inquiries. TO-3 TO-220 Thermal resistance (approx.) 0.33 1.25 0.77 Ordering code Screw size 6-32 4-40 4-40 Torque in-lbs 6-8 4-6 4-6 Description 0 No pads 3 One In-Sil-8TM pad 4 Two In-Sil-8TM pads 2.69 DIA (0.160) TO-218 KonDuxTM / Grafoil(R) Conducta-Pad** KonduxTM interface pads are a cost effective alternative to thermally conductive grease compounds. KonduxTM pads are electrically conductive and ideal for use with small, discrete semiconductors. Aavid pre-applies KonduxTM to your heatsink to enhance heat conductance from the semiconductor case and speed your manufacturing process. Figure A Figure B 2X o 3.56 (0.140) "C" "B" 41.91 (1.650) "A" ORDERING INFORMATION example 12 digit part 575703B _ 0000G Ordering code The shape and hole pattern of the heat sink will determine the shape and hole pattern of the pad. If you are ordering a heat sink which mounts to a semiconductor on both sides, the ordering code for two pads should be used. Ordering code Device Figure 1 or 2* TO-3 A 1 or 2* TO-218 1 or 2* TO-220 2X o 2.36 (0.093) "A" Dim "B" Dim "C" Dim B 19.05 (0.750) 4.57 (0.180) 15.24 (0.600) B 15.88 (0.625) 2.68 (0.105) 10.67 (0.420) MATERIAL PROPERTIES *Factory applied only One KonDuxTM pad Color Thickness example Thermalloy origin part 6109B A Suffix G1 Device Figure TO-3 A A = Model number B = Grafoil(R) pad C = RoHS compliant G B C "A" Dim "B" Dim "C" Dim TO-218 B 19.30 (0.760) 4.83 (0.190) 15.75 (0.620) G5 TO-220 B 16.51 (0.650) 3.43 (0.135) 10.67 (0.420) Multiwatt B 17.53 (0.690) 2.92 (0.115) 20.07 (0.790) Black (metallic) 0.13 (0.005) Thermal resistance See Graph pg 10 Electrical resistivity 15 x 10-6 Ohms Compression strength: for 10% reduction in thickness Tensile strength G4 G7 28.96 (1.140) Ultimate compression strength Service temperature Liner 580 psi 650 psi 12500 psi -240C to +300C None ** The Grafoil(R) name was originally marketed by Thermalloy and is the same material as KonduxTM Grafoil(R) is a registered trademark of the Union Carbide Company 86 sales.na@aavid.com www.shopaavid.com Interface Material/Pads Hi-Flow(R) * TO-3 Aavid has added a phase change pad to its line-up. These pads provide low thermal resistance and electrical isolation for low pressure spring mount applications. Above the phase change temperature the material flows to fill in surface irregularities and maximize the heat conduction path. 41.91 (1.650) 19.05 (0.750) 18.80 (0.740) 3.73 DIA (0.147) 2.69 DIA (0.160) 21.84 (0.860) 14.30 (0.563) 16.76 (0.660) INTERFACE MATERIALS 12.70 (0.500) 2X o 2.36 (0.093) 28.96 (1.140) MATERIAL PROPERTIES ORDERING INFORMATION example 12 digit part 530101B _ 5150G Reinforcement carrier Ordering code Polymide Thickness The shape and hole pattern of the heat sink will determine the shape and hole pattern of the pad. If you are ordering a heat sink which mounts to a semiconductor on both sides, the ordering code for two pads should be used. To order additional Hi-Flow(R) pads separate, or factory applied variations please contact an Aavid sales rep for inquiries. Ordering code TO-218 TO-220 2X o 3.56 (0.140) 0.127 (0.005) Continuous use temp (C) 150 Phase change temp(C) 55 Dielectric breakdown voltage (Vac) 5000 Dielectric constant (1000 Hz) 4.5 Volume resistivity (Ohm-meter) Description 1012 0 No pads 7 One Hi-Flow(R) pad Pressure 8 Two Hi-Flow(R) pads TO-220 Thermal performance (C/W) Thermal impedance vs. pressure 10 25 50 200 1.15 1.14 1.12 1.1 * Hi-Flow(R) is a registered trademark of the Bergquist Company Alignment Pads Solderable alignment pads are an innovative way to attach the heat sink to your transistor that could cut your assembly time by more than half. Alignment pads provide cost effective solderability, while providing numerous additional benefits. Alignment pads are factory applied and can be bought separately as well. Please refer to accessory Index D on page 85. ORDERING INFORMATION example Thermalloy origin part 7022B-8223-CL03 G A Suffix Device Figure 8223-CL03G TO-220 B 8241-CL11G TO-218 A B C Figure A Figure B 30.48 (1.200) 7.62 (0.300) 13.21 (0.520) 25.02 (0.985) 11.68 (0.460) 3.25 (0.128) 9.40 (0.370) 3.10 (0.122) 25.40 (1.000) A = Model number B = Alignment pad C = RoHS compliant 20.07 (0.790) 17.02 (0.670) 5.08 21.84 (0.200) (0.860) 0.76 (0.030) 21.84 (0.860) 0.76 (0.030) 14.22 (0.560) 0.51 (0.020) 3.18 TYP THK (0.125) 5.08 (0.200) Typical installation Shown with part number 8241-CL11 Recommended hole pattern for 8223-CL03G PLATED THRU HOLE PER DEVICE MANUFACTURERS RECOMMENDATION 2.54 (0.100) CL1 CLIP ASSEMBLY 2.95 DIA PLATED (0.116) THRU HOLE 2.54 (0.100) 7.37 (0.290) 14.73 (0.580) Recommended hole pattern for 8241-CL11G 2.95 DIA PLATED (0.116) THRU HOLE TYP(2) 1.60 DIA PLATED (0.063) THRU HOLE TYP(3) 5.46 (0.215) 5.46 (0.215) 12.70 (0.500) 25.40 (1.000) sales.na@aavid.com www.shopaavid.com 87 Interface Material / Double Sided Tape INTERFACE MATERIALS Double-sided thermal tapes adhere the heat sink to the device and offer good thermal characteristics. They are easy to apply, require no curing time, can be electrically conductive or isolating, and need no mechanical support to provide thermal or physical contact between the device and the heat sink. Aavid can apply one side to a heat sink. ORDERING INFORMATION example 12 digit part 375224B000 _ _G Ordering code Ordering code Tape option 31 T414 32 T405R 33 T412 34 T410R 35 T411 T414 for ceramic or metal packages T405R for ceramic or metal packages Uses a 0.001 inch (0.03 mm) Kapton MTTM filled polymide film coated on both sides with high-bond strength, pressuresensitive acrylic adhesive that is loaded with aluminum oxide particles. This provides both good thermal performance and excellent electrical isolation. Uses a 0.002 inch (0.05 mm) aluminum foil core coated on both sides with high-bond strength, pressure-sensitive acrylic adhesive that is loaded with aluminum oxide particles. The aluminum foil provides added thermal conductivity for applications where electrical isolation is not required. The combination of filter, expanded metal and embossed surface enhances both tape conformability and thermal performance. Color Beige Color White Electrical function Insulating Electrical function Conductive Thickness 0.127 mm (0.005) Thickness 0.006 (0.015) Carrier Kapton MTTM Carrier Aluminum Thermal impedance 0.60 C-in2/w Thermal impedance 0.54 C-in2/w Thermal conductivity 0.37 w/m-k Thermal conductivity 0.50 w/m-k Breakdown voltage 5000 VAC Breakdown voltage N/A Volume resistivity 5 x 1015 Ohm-cm Volume resistivity 3 x 10-2 Ohm-cm Lap shear adhesion 125 (0.862) psi UL flammability 94V-0 Rating U.L.94 Lap shear adhesion 134 psi Die shear adhesion Aluminum 25C Aluminum 150C Alum.oxide 25C Alum.oxide 150C 125 psi 55 psi 145 psi 60 psi Creep adhesion 25C @ 12 psi 150C @ 12 psi >50 days >50 days Die shear adhesion Aluminum 25C Aluminum 150C 150 psi 15 psi Creep adhesion 25C @ 12psi 150C @ 12psi >50 days >10 days T412 for ceramic or metal packages T410R / T411 for plastic packages Uses an expanded foil carrier coated on both sides with high-bond strength, pressure sensitive acrylic that is loaded with titanium diboride particles. The combination of filter, expanded metal and embossed surface enhances both tape conformability and thermal performance. T410R thermally conductive tape consists of a high bond strength, pressure sensitive acrylic adhesive loaded with aluminum oxide and coated onto a 0.002 inch (0.05mm) aluminum foil carrier. The other side of the foil carrier has a silicone pressure sensitive adhesive which provides excellent adhesion to silicone-contaminated plastics and other low energy surfaces. T411 thermally conductive tape consists of a high bond strength, pressure sensitive adhesive with an aluminum mesh carrier layer. The mesh carrier allows the tape to conform to curved surfaces of plastic molded IC packages, providing a high adhesive strength attachment for heat sinks. The high performance silicone PSA allows adhesion to silicone-contaminated plastics and other low energy surfaces. Color Grey Electrical function Conductive Thickness 0.009 (0.23 ) Carrier Expanded aluminum Thermal impedance 0.25 C-in2/w Thermal conductivity 1.40 w/m-k Breakdown voltage N/A Typical properties T410R T411 Volume resistivity N/A Acrylic Silicone UL flammability N/A Construction Adhesive (to heat sink side) Lap shear adhesion 70 psi Color White Clear (silver) Carrier Aluminum foil Aluminum mesh Adhesive (onto component side) Silicone Silicone Color (to component side) Clear (Silver) Clear (Silver) Die shear adhesion Aluminum 25C Aluminum 150C Alum.oxide 25C Alum.oxide 150C Creep adhesion 25C @ 12 psi 150C @ 12 psi 135 psi 25 psi 125 psi 40 psi >50 days >10 days Thickness, mm (inch) 0.18 (0.007) 0.28 (0.011) Thermal impedance @<1 psi C-cm2/w (C-in2/w) Operating temperature range, C 7.1 (1.1) -50 to + 150 6.5 (1.0) -50 to + 150 Lap shear adhesion, psi (MPa) Die shear adhesion, psi (MPa) steel/FR4 25C 125 C 60 (0.414) 14 (0.094) 170 (1.172) 40 (0.276) 80 (0.552) 20 (0.138) Note: Double Sided Tapes are factory applied only. 88 sales.na@aavid.com www.shopaavid.com LABOR SAVING HEAT SINK TO BOARD & DEVICE TO HEAT SINK MOUNTS Wave-OnTM Mounts Wave-OnTM Mounts Solderable mounts can be factory installed to practically every board-mountable heat sink and flat sided extrusion. The female threaded through holes permit pre-assembly to the semiconductor via machine screws , allowing the heat sink/semiconductor package to be treated as one unit when fitted in PC board through holes for wave soldering. Typical Wave-OnTM mount installation HEAT SINK DIM "C" STAND-OFF LENGTH FEATURES Saves production time and cost * Cuts production steps by half DIM "T" PC BOARD * Factory installation eliminates steps * Permits soldering in one step * All the benefits of female threaded mount * Automated fastening 7.92 (0.312) * Excellent solderability "D" Better thermal performance * Built in stand-off adds air space between PCB and heat sink for improved air flow and easier cleaning "C" * No lockwashers, nuts or separate mounts with various thread lengths "B" "A" ORDERING INFORMATION example part 574802B0 _ _ 00G Ordering code Model "A" Dim "B" Dim "C" Dim "D" Dim Threaded thru holes 01 E 4.32 (0.170) 2.54 (0.100) 2.54 (0.100) 0.96 (0.038) #6-32 02 EA 3.43 (0.135) 2.54 (0.100) 2.54 (0.100) 0.96 (0.038) #4-40 03 EG 3.43 (0.135) 2.54 (0.100) 1.14 (0.045) 0.96 (0.038) #4-40 04 EH 4.32 (0.170) 3.43 (0.135) 2.54 (0.100) 0.96 (0.038) #6-32 05 EK 4.32 (0.170) 2.54 (0.100) 1.14 (0.045) 0.96 (0.038) #6-32 07 EM 4.32 (0.170) 2.54 (0.100) 2.54 (0.100) 0.96 (0.038) 3.5MM 09 ER 4.32 (0.170) 2.54 (0.100) 5.08 (0.200) 0.96 (0.038) #6-32 Ordering code Model Dia of PCB plated thru hole PCB thickness "T" EA, EG 3.68 (0.145) 1.57 (0.062) E, EK, EM, ER 4.75 (0.187) 1.57 (0.062) EH 4.75 (0.187) 2.29 (0.090) sales.na@aavid.com www.shopaavid.com 89 LABOR SAVING HEAT SINK TO BOARD & DEVICE TO HEAT SINK MOUNTS Semiconductor Mounts Female Semiconductor Mounts "A" * Fastens semiconductor to heat sink fast and efficiently "C" * Up to 10 times faster than fastening with standard nuts and bolts * Used with most JEDEC case sizes, factory installed "A" "B" INSTALL MOUNT ORDERING INFORMATION example 12 digit part 542502B000 _ _G "C" "D" Ordering code Ordering code Thread "A" Dim "B" Dim "C" Dim "D" Dim #6-32 7.11 (0.280) 4.75 (0.187) 1.78 (0.070) 2.74 (0.108) 02 #4-40 6.35 (0.250) 4.19 (0.165) 1.78 (0.070) 2.74 (0.108) 03 3.00 (0.118) 6.35 (0.250) 4.22 (0.166) 1.50 (0.059) 2.47 (0.097) 01 Male Semiconductor Mounts * Captive male studs for semiconductor attachments * Used with most JEDEC case sizes, factory installed MALE SEMICONDUCTOR MOUNT 9.65 (0.380) 0.63 (0.025) ORDERING INFORMATION example 12 digit part 507302B000 _ _G Ordering code Ordering code 90 Thread 04 #6-32 05 #4-40 sales.na@aavid.com www.shopaavid.com TM Shur-Lock TM LABOR SAVING HEAT SINK TO BOARD & DEVICE TO HEAT SINK MOUNTS Tabs Tabs Aavid's Shur-LockTM self locking stand-off tab (U.S. Patent #5,437,561) positively secures any heat sink to the printed circuit board. This Shur-LockTM tab exhibits many unique design features. The rounded and bifurcated tip of the Shur-LockTM solderable tab has been designed to easily snap into any 0.093" diameter hole. Once through the hole, the tab provides a positive resistance to backing or falling out of the hole. In addition, the spring action between the tab and the plated through hole prevents leaning or lift-off of the heat sink prior to or during the soldering process. The tip extension of the Shur-LockTM tab has been designed to protrude less than 0.060" beyond the back of a standard 0.0625" PC board, which is below the normal lead trimming allowance for assembled PCBs. Shur-Lock'sTM stand-off design facilitates the cleaning of assembled PCBs and permits electrical traces to be routed under the heat sink. The wide base supports of the tab further improve the stability of the heat sink assembly. FEATURES * Positive PCB engagement * Integrated PCB stand-off * Quick "snap-in" assembly design * Reduces installed assembly cost * Designed for rugged shock and vibration environments * Can be installed on a variety of stamped and extruded board level heat sinks Factory applied only Tab ordering code 28 1.58 (0.062) ORDERING INFORMATION example 12 digit part 574802B0 _ _ 00G Ordering code PRODUCT INFORMATION Material Spring steel Finish Tin plating over a copper flash Pull-out force* 70 lbs/tab minimum Recommended PCB hole diameter PCB thickness 0.092" - 0.096" 0.065" - 0.068" 0.76 (0.030) 6.35 (0.250) 2.67 (0.105) 6.35 (0.250) Variations of the above specifications are possible. Contact Aavid for additional details for use with thicker PCB sizes, such as 0.093" or other hole diameters. *Vertical force applied to the sink-tab joint. 10.41 (0.410) TM Solderable Staked on Tabs Aavid solderable tabs stake onto heat sinks for solder mounting into the PC board. The tabs are available in a variety of lengths, widths and thicknesses. Tabs are factory applied for both vertical and horizontal mountings including: step tabs, which keep the heat sink elevated above the board, and tabs with a triangular base for extra stability. Many of Aavid's tabs are customized. Below are examples of standard tabs. Please consult Aavid's customer service department for information about other tab options. ORDERING INFORMATION example 12 digit part 574802B0 _ _ 00G Ordering code Tab ordering code 31 Tab ordering code 32 3.56 (0.140) 1.27 (0.050) 1.57 (0.062) 6.10 (0.240) 6.35 (0.250) 0.51 (0.020) 6.10 (0.240) 0.76 (0.030) 4.37 (0.172) 9.53 (0.375) 1.02 (0.040) 2.79 (0.110) 4.06 (0.160) sales.na@aavid.com www.shopaavid.com 91 LABOR SAVING HEAT SINK TO BOARD & DEVICE TO HEAT SINK MOUNTS Tabs Tab ordering code 33 Tab ordering code 34 7.87 (0.310) 0.76 (0.030) 1.57 (0.062) 1.90 (0.075) 6.10 (0.240) 6.10 C (0.240) L 0.64 (0.025) 0.76 R (0.030) 5.03 (0.198) 7.11 (0.280) 8.89 (0.350) 0.51 (0.020) 15.62 (0.615) 1.75 (0.069) 0.81 (0.032) 12.14 (0.478) Note: The drawing above shows the right hand of a matched pair which are supplied mounted to the heat sink. Tab ordering code 36 Tab ordering code 35 5.08 (0.200) 7.11 (0.280) 5.08 (0.200) 6.10 (0.240) 2.41 (0.095) 2.46 (0.097) 8.89 (0.350) 12.95 (0.510) 0.81 (0.032) 1.63 (0.064) 1.78 (0.070) 0.81 (0.032) Tab ordering code 37 Tab ordering code 39 9.53 (0.375) 6.35 (0.250) 3.18 1.60 (0.125) (0.063) 6.35 (0.250) 1.27 (0.050) 6.35 (0.250) 0.51 (0.020) 15.88 (0.625) 9.53 (0.375) 15.88 (0.625) 1.02 (0.040) 0.81 (0.032) 92 1.63 (0.064) sales.na@aavid.com www.shopaavid.com Tab ordering code 40 Tab ordering code 43 6.32 (0.245) 6.35 (0.250) 3.18 (0.125) 6.35 C (0.250) L 3.18 1.27 (0.125) (0.050) 6.35 (0.250) 1.27 (0.050) 15.88 (0.625) 12.57 (0.495) 1.63 (0.064) 0.51 (0.020) 1.02 (0.040) 0.81 (0.032) Solderable Mounting Tabs FIGURE A Heat sinks ordered with solderable mounting tabs have tin-plated spring steel tabs permanently locked onto the heat sink to provide wave solderability. The solderable tabs are mounted on the heat sink after anodizing, thus eliminating any special coating or handling. The result is a wave solderable heat sink with black anodized performance. FIGURE B 7.62 (0.300) 7.62 (0.300) "A" "A" "B" "B" 3.18 (0.125) 2.79 (0.110) 3.18 (0.125) ORDERING INFORMATION example 12 digit part 574802B0 _ _ 00G Ordering code example Thermalloy origin part 6070B- A G B C A = Model number B = Mounting tab suffix C = RoHS compliant 7.87 (0.310) 2.03 (0.080) 2.28 (0.090) 4.83 (0.190) MT3 ONLY 7.87 (0.310) LABOR SAVING HEAT SINK TO BOARD & DEVICE TO HEAT SINK MOUNTS Tabs SEE DETAIL B BEVELED CORNERS MT3 ONLY 3.09 (0.122) DETAIL B Typical Installation ADD TO HEIGHT OF PART "A" REF TRIANGULAR TAB Suffix Features Recommended PCB plated thru hole: Ordering code Stand-off height "A" Dim "B" Dim Figure MT 53 5.21 (0.205) Solderable mounting tab 15.88 (0.625) 4.83 (0.190) A MT2 54 8.51 (0.335) Solderable mounting tab 19.18 (0.755) 8.13 (0.320) A 2.90 0.10 (0.114 0.004) MT3 55 5.21 (0.205) 50 degree beveled corners on stand-off portion reducing board footprint from 7.87 (0.310) to 4.83 (0.190) width. Only tab with this feature. 15.88 (0.625) 4.83 (0.190) A 2.90 0.10 (0.114 0.004) MT5 56 5.21 (0.205) Bifurcated tabs in lieu of triangular shape 15.88 (0.625) 4.83 (0.190) B 2.95 0.05 (0.116 0.002) MT6 57 2.92 (0.115) Bifurcated tabs in lieu of triangular shape 13.59 (0.535) 2.54 (0.100) B 2.95 0.05 (0.116 0.002) 2.90 0.10 (0.114 0.004) Notes: Mounting tabs have unique locking features built into their design. Aavid adds to standard and custom heat sinks. For this reason, the tabs are factory applied, and cannot be sold separately. Please see page 85 for additional tab options. sales.na@aavid.com www.shopaavid.com 93 LABOR SAVING HEAT SINK TO BOARD & DEVICE TO HEAT SINK MOUNTS Solderable Pins / Solderable Nuts Solderable Pins FIGURE A Vertically mounted, extruded heat sinks are converted to wave solderable with the addition of solderable roll pins. Roll pins are available with stand-off shoulders in different heights for easier cleaning after wave soldering. 2.34 (0.092) o 5.49 o 2.46 (0.216) (0.097) 4.45 (0.175) 2.41 (0.095) Pin P2-P3 B C Suffix Ordering code 1.27 (0.500) 2.41 (0.095) REF 5.49 (0.216) REF Ordering code A Typical installation P2-P3 3.96 (0.156) ORDERING INFORMATION example 12 digit part 529902B0 _ _ 00G G 2.46 (0.097) REF A = Model number B = Solid pin suffix C = RoHS compliant Description 12.70 (0.500) "A" Pin 25 example Thermalloy origin part 6396B- FIGURE B 12.70 (0.500) Heat sink "A" "A" Dim Figure P2 21 Solid pin w/stand-off shoulder 0.050" 0.050 A P3 N/A Solid pin w/stand-off shoulder 0.125" 0.125 A N/A 25 Solid solderable pin PC Board Stand-Off Shoulder B Solderable Nuts Solderable nuts are permanently swaged into the heat sink for quick pre-assembly with the transistor. Screws are used to mount to the heat sink and are installed from the top. Solderable nuts feature a closed end that prevents solder from wicking into threads and trapping contaminants or flux. Heat sink and transistor are then handled as a single component and dropped into plated-thru holes in the PC board for wave soldering. (Solderable nuts require slightly larger printed circuit board hole sizes) FEATURES * Pre-mounted to heat sink at factory * Ease of pre-assembly in production * Mechanical and electrical integrity * Wave solderability ORDERING INFORMATION example 12 digit part 506003B0 _ _ 00G 3.56 (0.140) 3.28 (0.129) Ordering code example Thermalloy origin part 7019B- A G B A = Model number B = Solderable nut suffix C = RoHS compliant C Suffix Ordering code Dia of PCB thru hole SNM-1 N/A 4.95 (0.195) M3X0.5 SNE-1 14 4.95 (0.195) 4-40 UNC-2B SNE-2 13 4.95 (0.195) 6-32 UNC-2B o 7.62 (0.300) 4.32 (0.170) Thread 7.75 (0.305) Note: If a part number requires 2 solderable nuts, simply add a "/2" after the solderable nut character suffix on Thermalloy origin parts. THREAD Mechanical drawings showing heat sinks with solderable nuts 1.27 (0.050) 3.28 (0.129) o 4.32 (0.170) 3.56 (0.140) CL SOLDERABLE NUT 3.56 (0.140) o 4.32 (0.170) 1.65 (0.065) 3.28 (0.129) SOLDERABLE NUT 94 sales.na@aavid.com www.shopaavid.com Clinch Nuts Clinch nuts are threaded nuts that allow quick assembly of the transistor to the heat sink. A single screw mounts the transistor to the heat sink, reducing your hardware requirements. Clinch nuts are permanently pressed into the heat sink, and come in a variety of English and Metric threads-CNE designates an English thread, and CNM designates a Metric thread. FIGURE A FIGURE B SECTION A-A 1.50 (0.059) 1.78 (0.070) "A" "A" "A" "B" "A" 6.35 (0.250 6.30 (0.248) Mechanical drawing showing heat sink with clinch nut ORDERING INFORMATION example 12 digit part 529801B000 _ _ G example Thermalloy origin part 7019B- A CLINCH NUT Ordering code G B C A = Model number B = Clinch nut suffix C = RoHS compliant Suffix Ordering code Thread "A" Dim CNE42 12 4-40 UNC-2B 0.96 (0.038) "B" Dim A CNE43 N/A 4-40 UNC-2B 1.37 (0.054) A CNM1 13 M3 X 0.5 0.76 (0.030) 4.06 (0.160) B CNM2 N/A M3 X 0.5 0.96 (0.038) 4.22 (0.166) B CLINCH NUT INSTALLED Figure sales.na@aavid.com www.shopaavid.com LABOR SAVING HEAT SINK TO BOARD & DEVICE TO HEAT SINK MOUNTS Clinch Nuts 95 LABOR SAVING HEAT SINK TO BOARD & DEVICE TO HEAT SINK MOUNTS Studs Solderable Studs Threaded solderable studs are permanently swaged in place for quick pre-assembly with the transistor. The device is placed over the stud (s) followed by the lock washer and nut. This entire component is then dropped into plated-thru holes in the printed circuit board for wave soldering. The end of the stud is tin-plated for excellent solderability and extends only 0.040" below a 0.062" PC board to clear lead trimming saws. "A" o 5.49 (0.216) "B" "C" ORDERING INFORMATION example 12 digit part 501303B000 _ _ G example Thermalloy origin part FIGURE A Ordering code 7022B- A Suffix Typical installation A = Model number B = Stud suffix C = RoHS compliant G B FIGURE B C Ordering code Dia of PCB thru hole "A" Dim "B" Dim "C" Dim Figure SE-1 08 3.68 (0.145) 8.89 (0.350) 6-32 1.13-1.26 (0.045-0.050) A SE-2 06 3.68 (0.145) 12.32 (0.485) 6-32 1.14-1.27 (0.045-0.050) A SE-3 09 3.68 (0.145) 8.89 (0.350) 4-40 1.14-1.26 (0.045-0.050) A SE-4 14 3.68 (0.145) 8.89 (0.350) 6-32 3.05 (0.120) B SM-1 17 3.68 (0.145) 8.89 (0.350) M3 x 0.5 3.05 (0.120) B SM-3 07 3.68 (0.145) 8.89 (0.350) M3 x 0.5 1.13-1.26 (0.045-0.050) A HEAT SINK HEAT SINK "C" "C" PC BOARD PC BOARD Note: Factory installed only Device Mounting Studs Device mounting studs for "Thermalloy-origin" items are available as options on certain vertical and board mount heat sinks as a labor-saving aid for mounting semiconductors. This optional feature speeds production assembly time and reduces hardware requirements. "A" "D" "B" "C" ORDERING INFORMATION example 12 digit part 529801B000 _ _G Mechanical drawing showing heat sink with device mounting studs Ordering code example Thermalloy origin part 7019B- A Suffix B C A = Model number B = Stud suffix C = RoHS compliant Ordering code "A" Dim "B" Dim "C" Dim "D" Dim SF1 11 7.92 (0.312) 4-40 UNC-2A 0.25 (0.010) 4.75 (0.187) SF2 N/A 8.00 (0.315) M3 x 0.5 0.25 (0.010) 4.60 (0.181) SF3 N/A 7.92 (0.312) 6-32 UNC-2A 0.25 (0.010) 5.23 (0.206) Note: Factory installed only 96 G CL Device Mounting Stud sales.na@aavid.com www.shopaavid.com Aavid Kool-KlipsTM These one piece stainless steel clips eliminate the need for screws, lock washers and nuts in the assembly process, therefore reducing assembly time and cost. These can be bought separately, or found in the 11th or 12th position when deciphering an Aavid Standard product. Please reference Indexes to see which clips are popular with which product offering. 6801G 14.25 (0.561) 37.10 (1.461) ORDERING INFORMATION To order clips seperately use part number below. To order a clip as an option use ordering code. example 12 digit part 530101B000 _ _ G 7.54 (0.297) 5901G Ordering code Part number Transistor case style 115000F00000G TO-220, TO-218 50 115100F00000G TO-220, TO-218 51 115200F00000G TO-220, TO-218 52 115300F00000G TO-220, TO-218 53 115400F00000G TO-220 54 7.24 (0.285) Ordering code 3.99 (0.157) 37.08 (1.460) 7701G 116200F00000G TO-220, TO-218 5901G TO-220, TO-218, TO-247 Sold separately only 62 6801G TO-220, TO-218, TO-247 Sold separately only 7701G TO-220 Sold separately only 6.60 (0.260) 16.00 (0.630) 11.00 (0.433) 4.75 (0.187) 115000F00000G Code 50 115100F00000G Code 51 30.60 (1.205) 6.60 (0.260) 39.10 (1.540) 8.70 (0.342) 12.70 (0.500) 13.50 (0.530) LABOR SAVING HEAT SINK TO BOARD & DEVICE TO HEAT SINK MOUNTS Clips 6.60 (0.260) 115200F00000G Code 52 115300F00000G Code 53 3.18 (0.125) 13.84 (0.545) 6.60 (0.260) 25.65 (1.010) 12.06 (0.475) 7.62 (0.300) 115400F00000G Code 54 116200F00000G Code 62 7.92 (0.312) 6.60 (0.260) 30.61 (1.205) 8.69 (0.342) 10.92 (0.430) 12.70 (0.500) 5.97 (0.235) 14.22 (0.560) sales.na@aavid.com www.shopaavid.com 97 LABOR SAVING HEAT SINK TO BOARD & DEVICE TO HEAT SINK MOUNTS Clips Thermal Clips Factory-Installed ONLY thermal clips, available on many standard heat sinks (shown below) eliminate the use of screws and nuts in assembling the heat sink and transistor. Plastic case transistors slip into place for easy assembly. Thermal clips are available in a variety of configurations. Locking clips have an internal tab to lock the transistor permanently in place. ORDERING INFORMATION example 12 digit part 530600B000 _ _ G example Thermalloy origin part 7023B- A Suffix Ordering code Transistor case style Ordering code G B C A = Model number B = Clip suffix C = RoHS compliant Clip/Cover features TC1 32 TO-220 TC6 36 TO-218, TO-220, Multiwatt Locking Locking TC7 N/A TO-218, TO-220, Multiwatt Insulated TC10 33 TO-220, TO-218 Locking TC11 34 TO-220 Insulated TC12 35 TO-218, TO-220 Locking TC-1 Code 32 TC-6 Code 36 17.78 (0.700) 17.78 (0.700) 6.35 (0.250) 3.94 (0.155) 11.82 (0.465) 19.90 (0.783) 28.88 (1.137) TC-7 Code N/A 10.16 (0.400) 11.82 (0.465) 5.13 (0.202) 28.90 (1.138) TC-10 Code 33 17.78 (0.700) 10.16 (0.400) 12.70 (0.500) 19.05 (0.750) 28.91 (1.138) 6.35 (0.250) 10.16 (0.400) 5.26 (0.207) 11.81 (0.465) 28.91 (1.138) TC-11 Code 34 TC-12 Code 35 6.35 (0.250) 6.35 (0.250) 10.16 (0.400) 6.98 (0.275) 10.16 (0.400) 12.70 (0.500) 19.05 (0.750) 28.91 (1.138) 98 12.70 (0.500) 28.90 (1.138) sales.na@aavid.com www.shopaavid.com Mounting Kits Mounting Kits FEATURES * Pre-packaged in heat-sealed plastic bags for use on assembly line. * Stock mounting hardware using one number for better control and identification. * Three different insulating materials available: Low cost ThermalfilmTM High temperature Mica High performance ThermalsilTM lll ACCESSORIES * Other insulator materials available for special order include: hard anodized aluminum and aluminum oxide. * Individually packaged for convenient stocking and handling of mounting hardware. Kits contain all hardware necessary to electrically isolate the transistor from the heat sink. TO-220 Mounting kit part number 4880 ORDERING INFORMATION Part number Description 4880G Kit with ThermalfilmTM 4880MG Kit with Mica Insulator 4880SG Kit with Thermalsil III TRANSISTOR NOT INCLUDED 5 TM 2 EACH KIT INCLUDES: Part number Item Qty 1 1 Insulator ThermalfilmTM (see page 101) Mica (see page 103) ThermalsilTM III (see page 103) 3 7721-7PPS 2 1 Shoulder washer 6 MS15795-804 3 1 Flat washer #4 No. 4-40 UNC-2B 4 MS35649-244 4 1 Hex nut No. 4-40 UNC-2A X 43-77-9 (56-77-9) (53-77-9) Description MS51957-17 5 1 1/2 Long phillips pan head screw MS35338-135 6 1 Lock washer, No. 4 1 Note: Smooth side of flat washer should be placed against insulator when using the kit. TO-3 Mounting kit part number 4804 ORDERING INFORMATION Part number Description 4804G Kit with ThermalfilmTM 4804MG Kit with Mica Insulator 4804SG Kit with ThermalsilTM III TRANSISTOR NOT INCLUDED 5 EACH KIT INCLUDES: Part number Item Qty 1 1 43-03-2 (56-03-2) (53-03-2) Description Insulator ThermalfilmTM (see page 101) Mica (see page 103) ThermalsilTM III (see page 103) 7721-5PPS 2 2 Shoulder washer MS15795-805 3 2 Flat washer #6 MS35649-264 4 2 No. 6-32 UNC-2B Hex nut MS 51957-30 5 2 No. 6-32 UNC-2A X 1/2 Long phillips pan head screw MS35338-136 6 2 Lock washer, No. 6 322-156 7 1 Solder lug 1 2 3 7 6 4 Note: Smooth side of flat washer should be placed against insulator when using the kit. sales.na@aavid.com www.shopaavid.com 99 Insulating Shoulder Washers FEATURES * Available in nylon or polyphenylene sulfide * Chemically inert [no known solvents under 200C (392F)] * Maximum recommended service temperature of 260C (500F) * Recommended torque is 0.565Nm to 0.678Nm (5 to 6 inch-pounds) on all shoulder washers except -7, which has recommended torque of 0.452Nm (4 inch-pounds) Polyphenylene Sulfide PPS Shoulder Washers FIGURE B ACCESSORIES FIGURE A "B" "A" "A" "D" DIA 5.59 (0.220) "E" DIA "C" "E" Note: This figure is common to figures A and B Part number "A" Dim "B" Dim "C" Dim "D" Dim "E" Dim Screw size Figure 7721-1PPSG 7.11 (0.280) 3.18 (0.125) 1.07 (0.042) 2.84 (0.112) 3.81 (0.150) 4 A 7721-2PPSG 7.11 (0.280) 4.70 (0.185) 1.07 (0.042) 2.84 (0.112) 3.81 (0.150) 4 A 7721-3PPSG 7.11 (0.280) 3.18 (0.125) 1.07 (0.042) 2.84 (0.112) 3.56 (0.140) 4 A 7721-5PPSG 7.92 (0.312) 0.79 (0.031) 1.19 (0.047) 3.66 (0.144) 4.50 (0.177) 6 A 7721-6PPSG 7.11 (0.280) 0.79 (0.031) 1.19 (0.047) 3.00 (0.118) 3.68 (0.145) 4 A 7721-7PPSG* 5.46 (0.215) 0.81 (0.032) 1.02 (0.040) 2.95 (0.116) 3.43 (0.135) 4 A 7721-10PPSG 7.62 (0.300) 2.41 (0.095) 1.40 (0.055) 2.97 (0.117) 3.56 (0.140) 4 ** B Note: A single gate extension, not to exceed 0.64 (0.025) in length, is allowable on the outside of all shoulder washers. * Design allows insertion in the tab of a TO-220. ** Also for M3 screw. Nylon Shoulder Washers "C" "A" "E" Shoulder Washer "D" 0.33 (0.013) "B" Material is nylon type 6 Part number 100 "A" Dim "B" Dim "C" Dim "D" Dim "E" Dim 7721-11NG 7.80/8.05 (0.307/0.317) 2.87/3.00 (0.113/0.118) 3.56/3.81 (0.140/0.150) 3.76/3.89 (0.148/0.153) 1.09/1.35 (0.043/0.053) 7721-13NG 5.89/6.05 (0.232/0.238) 2.87/3.00 (0.113/0.118) N/A 3.43/3.56 (0.135/0.140) 1.19/1.40 (0.047/0.055) 7721-15NG 5.59/6.10 (0.220/0.240) 2.90/2.95 (0.114/0.116) 1.73/1.91 (0.068/0.075) 3.43/3.58 (0.135/0.140) 0.51/0.64 (0.020/0.025) sales.na@aavid.com www.shopaavid.com ThermalfilmTM and ThermalfilmTM MT ThermalfilmTM Polyimide Plastic Films ThermalfilmTM and ThermalfilmTM MT are low cost polymide plastic insulating films designed to be an improved replacement for mica. These insulators have a distinctive amber color and can be easily recognized and assembled on a production line. ACCESSORIES ThermalfilmTM MT, made from high performance KaptonTM MT material, provides thermal conductivity nearly 2-5 times greater than standard ThermalfilmTM. Both insulators have an extremely high resistance to flow or thin out under high compressive stresses, particularly at elevated temperatures. Excellent physical, mechanical and electrical properties remain nearly constant over a wide range of temperatures and frequencies. They are radiation resistant, have no melting points, and have no known organic solvents. The polymide plastic film is UL listed as a component in UL's publication "Component - Plastic Material" dated September 18, 1969. The UL card number is E39505R, Guide QMFZ2 filed by E. I. du Pont de Nemours & Co., Inc. ThermalfilmTM is rated 94-V/0. ORDERING INFORMATION For standard pre-cut sizes of ThermalfilmTM and ThermafilmTM MT see page 102. ELECTRICAL - TYPICAL VALUE @ 25 C PROPERTY THERMALFILMTM 0.03mm (1-mil) 240 x 103 volts/mm (6,100 volts/mil) 3.5 Dielectric constant 0.002 Dissipation factor 1017 ohm-cm Volume resistivity 1016 ohms Surface resistivity Corona start voltage 0.025mm (1-mil) 465 volts 100.000 megohm mfds. Insulation resistance Dielectric strength THERMALFILMTM MT TEST METHOD 177.2 x 103 volts/mm (4500 volts/mm) ASTM D149-64 4.3 0.002 1017 ohm-cm 1016 ohms 465 volts 100.000 megohm mfds. ASTM D150-64T ASTM D150-64T ASTM D257-61 ASTM D257-61 ASTM D1868-61T Based on 0.05 mfd wound capacitor using 0.25 mm (1-mil) Film PHYSICAL Material thickness Ultimate tensile strength (MD) Bursting strength test (Mullen) Tear strength - initial Density Folding endurance (MIT) 0.05mm (0.002") 1.72 x 108 Pa (25,000 psi) 3.10 x 105 Pa (45 psi) 27,559 gm/mm (700 gm/mil) 1.42 gm/cm3 (88.7 lb/ft3) >10,000 cycles Melting point Zero strength temperature Cut through temperature NONE 815C (1499F) 435C (815F) 525C (977F) -260C to 240C (-436F to 464F) 0.156W/m C (0.09 BTU/hr-ft-F) V-0, UL "E" card E39505 0.05mm (0.002") 103 MPa (1500 psi) 0.31 MPa (45 psi) 35,433 gm/mm (900 gm/mil) 1.78 gm/cm3 (111.1 lb/ft3) >10,000 cycles ASTM D882-64T ASTM 0774-63 ASTM D1004-61 ASTM D1505-63T ASTM D2176-63T THERMAL Service temperature Thermal conductivity Flammability NONE 815C (1499F) 435C (815F) 525C (977F) -260C to 240C (-436F to 464F) 0.379 W/m C (0.219 BTU/hr-ft-F) V-0, UL "E" card E39505 Hot Bar (Du Pont test) Weighted probe on heated film (Du Pont test) Model TC-1000 twin heatmeter Comparative tester UL 94 Notes: One mil equals 0.001 inch Dimensional tolerances are 0.38mm (0.015"), hole diameters are 0.25mm (0.010") and angularity is 1 1/2 unless otherwise specified. sales.na@aavid.com www.shopaavid.com 101 Insulators - ThermalfilmTM and ThermalfilmTM MT ThermalfilmTM for TO-3 1.83 (0.072) ORDERING INFORMATION Part number "A" Dim "B" Dim "C" Dim "D" Dim 43-03-2G 42.04 (1.655) 27.00 (1.063) 3.96 (0.156) 1.57 (0.062) 43-03-4G 39.70 (1.563) 26.67 (1.050) 3.56 (0.140) 1.57 (0.062) "A" "D" DIA TYP (2) 10.92 (0.430) "B" "C" DIA TYP (2) ThermalfilmTM information on page 101 Dimensional tolerances are 0.38mm (0.015), hole diameters are 0.25mm (0.010) and angularity is 1 1/2 unless otherwise specified. ACCESSORIES 30.15 (1.187) ThermalfilmTM for TO-5 and TO-18 ORDERING INFORMATION Part number 43-05-1G Device Figure "A" Dim "B" Dim "C" Dim TO-5 A 9.91 (0.390) 5.08 (0.200) 0.91 (0.036) 43-05-2G TO-5 B 9.91 (0.390) 5.08 (0.200) 0.91 (0.036) 43-18-1G TO-18 A 6.35 (0.250) 2.54 (0.100) 0.91 (0.036) ThermalfilmTM information on page 101 Dimensional tolerances are 0.38mm (0.015), hole diameters are 0.25mm (0.010) and angularity is 1 1/2 unless otherwise specified. FIGURE B FIGURE A "A" "A" "C" DIA TYP (4) "C" DIA TYP (3) "B" "B" ThermalfilmTM for TO-220, TO-126, Case 77, Case 199, Case 90, TO-218 and TO-3P ORDERING INFORMATION Part number Device "A" Dim "B" Dim "C" Dim "D" Dim 43-77-1G TO-126, Case 77 11.10 (0.437) 7.92 (0.312) 3.56 (0.140) 2.36 (0.093) 43-77-2G Case 90, Case 199 17.45 (0.687) 14.27 (0.562) 5.54 (0.218) 3.18 (0.125) 43-77-8G Case 90, Case 199 18.92 (0.745) 13.84 (0.545) 5.38 (0.212) 3.81 (0.150) 43-77-9G TO-220 18.42 (0.725) 13.21 (0.520) 4.32 (0.170) 2.92 (0.115) 46-77-9G* TO-220 18.42 (0.725) 13.21 (0.520) 4.32 (0.170) 2.92 (0.115) 43-77-20G TO-220, TO-218, TO-3P 23.24 (0.915) 18.80 (0.740) 6.98 (0.275) 3.66 (0.144) * ThermalfilmTM MT part numbers begin with "46" "A" "D" DIA "B" "C" Thermalfilm information on page 101 Dimensional tolerances are 0.38mm (0.015), hole diameters are 0.25mm (0.010) and angularity is 1 1/2 unless otherwise specified. TM 102 sales.na@aavid.com www.shopaavid.com Insulators - Mica and ThermalsilTM III Mica and ThermalsilTM III FIGURE A ThermalsilTM III provides excellent thermal conductivity and electrical resistance. It is used as an electrically-isolating interface material composed of silicone elastomer binder with a thermally conductive filler. It is reinforced with glass cloth to resist tearing and cut-through due to burrs on transistors or heat sinks. "A" "A" "D" DIA TYP (2) "D" DIA 10.92 (0.430) "B" "B" "C" DIA TYP (2) "C" 30.15 (1.187) Mica insulators provide high maximum operating temperatures (550C) and excellent electrical properties. ACCESSORIES ThermalsilTM III eliminates the need for grease application and conforms to mounting surfaces under clamping pressure for optimum heat conduction. The finely woven glass cloth provides the thinnest possible matrix for enhanced thermal resistance. ThermalsilTM III is available in any configuration with adhesive backing. 1.83 (0.072) FIGURE B ORDERING INFORMATION Part number Description Device "A" Dim "B" Dim "C" Dim "D" Dim 56-77-9G Mica TO-220 18.42 (0.725) 13.21 (0.520) 4.32 (0.170) 2.92 (0.115) Figure B 56-03-2G Mica TO-3 42.04 (1.655) 27.00 (1.063) 3.96 (0.156) 1.57 (0.062) A 53-77-9G ThermalsilTM III TO-220 18.42 (0.725) 13.21 (0.520) 4.32 (0.170) 2.92 (0.115) B 53-03-2G ThermalsilTM III TO-3 42.04 (1.655) 27.00 (1.063) 3.96 (0.156) 1.57 (0.062) A TYPICAL PROPERTIES FOR MICA INSULATORS TYPICAL PROPERTIES FOR THERMALSILTM III Property Property Dielectric strength 172 X 103 volts/mm (4500 volts/mil) 0.025 mm to 0.076 mm thick in air (1 to 3 mils thick in air) Typical value 25C Test method Electrical Electrical Dielectric constant 2.5@50 Hz 2.5@103 Hz 2.5@106 Hz ASTM D-150 Dielectric constant 6.5 to 8.7 Dissipation factor 0.0001-0.0004 @ 106 Hz Dielectric breakdown voltage 26.3 x 103 volts/mm (667 volts/mil) ASTM D-149 Volume resistivity 10 ohm-cm Volume resistivity 5.7 x 1015 ohm-cm ASTM D-257 Physical Dielectric dissipation factor 0.008@50 Hz 0.004 @103 Hz 0.004 @106 Hz ASTM D-150 15 Modules of elasticity in tension 172 X 103 Mpa (25 X 106) psi Tensile strength 310 Mpa (45,000 psi) Hardness mohs, shore 3.0, 115 Compressive strength 2.21 X 108 Pa (32,000 psi) Specific gravity Physical Thickness 0.15mm (0.006 inch) 2.9 Color Gray-Green Thermal Tensile strength 6.1 x 107 Pa (8786 psi) Thermal conductivity 0.528 W/(m C ) (0.30 Btu/hr-ft F) Hardness, shore A 87 Coefficient of thermal expansion 3.24 X 10-5 C (1.8 X 10-5 F) Elongation Specific heat 0.084 KJ/Kg C (0.02 Btu/Lb F) Melting point 1275C (2327 F) Thermal conductivity 0.92 W/(m C ) (0.532 Btu/hr. ft F) Max. operating temperature 550 C (1022 F) Flame resistance UL 94V-0 Service temperature -60C to 180C (-76F to 356F) 2% or less Thermal UL card #E-58126 (S) sales.na@aavid.com www.shopaavid.com 103 Insulators - Aluminum Oxide Aluminum Oxide Aluminum oxide has unique thermal conductivity qualities and features low loss factors at high frequencies. It has high compressive strength, high volume resistivity, low thermal expansion and resists radiation. Aluminum oxide insulating washers have a dielectric strength of approximately 21.7 x 103 volts/mm for .76mm material (550 volts/mil for 0.030 inch material) and 16.9 x 103 volts/mm for 1.57mm material (430 volts/mil for 0.062 inch material). The thermal conductivity of aluminum oxide is 15.06W/(mC) at 75C. PROPERTY A1203 CHEMICAL - TYPICAL VALUE 94% nominal Dielectric constant 25C (77F) ELECTRICAL 8.9 (1MHz) 8.9 (10GHz) 0.0001 (MHz) 0.0010 (10GHz) >1014 ohm-cm 8.66 x 103 volts/mm (6.35mm thick) [220 volts/mil (0.250" thick)] 16.73 x 103 volts/mm (1.27mm thick) [425 volts/mil (0.050" thick)] 28.35 x 103 volts/mm (0.25mm thick) [720 volts/mil (0.010" thick)] PHYSICAL 3.62 g/cm3 (226 lb/ft3) 78 (Rockwell 45 N) MECHANICAL 3.17 x 108 Pa (minimum) [46.00 psi (minimum)] 3.52 x 108 Pa (typical) [51,000 psi (typical)] 2.83 x 1011 Pa (41 x 106 psi) 0.21 1.93 x 108 Pa (28,000 psi) 2.10 x 109 Pa (305,000 psi) THERMAL 7.9 x 106/C (4.4 x 106/F) 18.01 W/(mC) @ 25C 14.24 W/(mC) @ 100C 79.56 W/(mC) @ 400C 8.79 x 104 KJ/kgC [2.1 x 104 Btu/lb F] >3600C (6512F) 1700C (3100F) Dissipation factor 25C (77F) ACCESSORIES Electrical resistivity 25C (77F) Dielectric strength (AC) Density Hardness Flexural strength 25C (77F) Modules of elasticity Poisson's ratio Tensile strength 25C (77F) Compressive strength 25C (77F) Coefficient of thermal expansion Thermal conductivity Specific heat (100C) Melting point Maximum temperature for continuous use Aluminum Oxide for TO-3 Part number Thickness "A" Dim "B" Dim 4103G* 1.91 (0.075) 39.70 (1.563) 26.67 (1.050) 13.34 (0.525) 4.75 (0.187) 30.40 (1.197) "C" Dim "D" Dim 4104G* 1.78 (0.070) 44.45 (1.750) 31.75 (1.250) 15.88 (0.625) 7.16 (0.282) 30.15 (1.187) ASTM D150-70 ASTM D2520-70 ASTM D150-70 ASTM D2520-70 ASTM D1829-66 ASTM D116-69 ASTM C20-70 ASTM E18-67 ACMA Test #2 ASTM C623-69T ASTM C623-69T ACMA Test #4 ASTM C528-63T ASTM C372-56 ASTM C408-58 ASTM C351-61 "C" RAD TYP (2) 3.68 (0.145) DIA TYP (4) ORDERING INFORMATION TEST METHOD Spectrographic analysis (100%-% by wt. of total metallic impurity) "A" 1.83 (0.072) "E" Dim 10.92 "B" (0.430) 5.46 (0.215) "D" RAD TYP (2) 15.09 (0.594) "E" Aluminum Oxide Ceramic for TO-220 "D" "C" ORDERING INFORMATION Part number Thickness 4169G* 1.57 (0.062) 4170G** 1.78 (0.070) 4171G** 4177G** "A" Dim "B" Dim "C" Dim "D" Dim "E" Dim 19.30 (0.760) 13.97 (0.550) 4.78 (0.188) 6.98 (0.275) 3.68 (0.145) 19.30 (0.760) 13.97 (0.550) 4.78 (0.188) 6.98 (0.275) 3.68 (0.145) 1.78 (0.070) 16.51 (0.650) 12.70 (0.500) 4.32 (0.170) 6.35 (0.250) 3.81 (0.150) 1.78 (0.070) 17.45 (0.687) 14.27 (0.562) 5.54 (0.218) 7.14 (0.281) 3.18 (0.125) "A" "E" DIA "B" "B" Aluminum Oxide Ceramic for TO-218, TO-247, and TO-3P "D" ORDERING INFORMATION Part number Thickness 4180G* 1.78 (0.070) 23.24 (0.915) "A" Dim "B" Dim "C" Dim 18.80 (0.740) 6.98 (0.275) "D" Dim "E" Dim 9.40 (0.370) 3.96 (0.156) "A" "C" "E" 104 sales.na@aavid.com www.shopaavid.com Insulators - Stanchion Pads 8923-1, 8923-2, 8924 Stanchion Pads FEATURES * Reduces stress on leads during wave solder and post-soldering operations * Provides stable mount to resist shock and vibration damage to leads 2.54 (0.100) 2.54 (0.100) * 8923-1, 8923-2, and 8924 fit the TO-220 SEE DETAIL "D" (8924 ONLY) 4.06 (0.160) 1.52 (0.060) 1.02 (0.040) ORDERING INFORMATION "A" Dim "B" Dim "C" Dim 8923-1G 2.54 (0.100) 20.32 (0.800) 8.00 (0.315) 8923-2G 1.27 (0.050) 19.05 (0.750) 8.00 (0.315) 8924G 1.27 (0.050) 19.05 (0.750) 7.87 (0.310) Note: Tolerances 0.25 (0.010) unless otherwise specified. Material is nylon 6/6 rated 94 V-O DETAIL "D" (8924 ONLY) 3.05 (0.120) 8.26 (0.325) 1.52 (0.060) SQ TYP (4) 10.16 (0.400) ACCESSORIES Part number 2.03 (0.080) DIA THRU TYP (3) 1.40 (0.055) 11.18 (0.440) "B" 3.05 (0.120) "A" "C" sales.na@aavid.com www.shopaavid.com 105 Insulating Covers TO-3 Insulating Covers Insulating covers are designed to provide protection from accidental shock during field service or repair. Pan head screws not provided-MS 51957-30 or equivalent recommended-secure the cover to the TO-3. At the typical mounting screw torque of 0.68-0.90 Nm (6-8 inch pounds), the TO-3 cover material cold-flows around the screw head to securely fasten the cover. ACCESSORIES Included are No.6 split washers as inserts to provide electrical connection of mounting screws to the TO-3 collector and an insulating snap-in cover for the screw heads. A test probe hole is provided in the top of the cover. The 8903VB is made from thermoplastic polyester that meets the requirements of UL Bulletin 94 V-O. In addition to its excellent flammability rating, thermoplastic polyester offers resistance to most chemical environments, heat deflection temperature to 215.6C (420F) and UL continuous use temperature of 130C (266F). 41.91 (1.650) ORDERING INFORMATION Part number Material Color Flammability standards 8903NWG Nylon White Self-extinguishing UL 94 V-2 8903VBG Thermoplastic polyester Black Self-extinguishing UL 94 V-0 UL 492 Type 1 1.19 (0.047) DIA THRU 28.45 (1.120) 30.23 (1.190) 6.22 (0.245) DIA THRU TYP (2) 4.57 (0.180) 9.91 (0.390) 22.61 (0.890) 39.88 (1.570) Teflon-filled Acetal Insulators for TO-3 Part number Fits notch "A" Dim 103G 4.83 (0.190) 4.90 (0.193) 109G 6.35 (0.250) 6.35 (0.250) 1.47 (0.058) "A" O 3.58 O 9.52 (0.141) (0.375) 5.54 (0.218) Teflon-filled Acetal Bushings for TO-3 Part number "I.D." "O.D." "T" 110G 5.03/5.21(0.198/0.205) 6.81/6.98 (0.268/0.275) 1.57/1.40 (0.062/0.055) 113G 6.43/6.60 (0.253/0.260) 7.82/8.00 (0.308/0.315) 1.57/1.40 (0.062/0.055) "O.D." "I.D." "T" 106 sales.na@aavid.com www.shopaavid.com Mounting Pads FEATURES PRODUCT INFORMATION * Prevent heat damage during soldering Suffix Base material NG Nylon base resin per ASTM STD D4066-82-PA111 121.0C 250F 243.3C 470F Natural DAPG* Diallyl Phthalate per MIL-M-14G type SDG 204.4C 400F 282.2C 540F Black only * Facilitate board clean-up * Prevent solder bridges * Assure uniform device height MAXIMUM OPERATING TEMPERATURE Continuous Deflection Color * All "DAP" mounting pads meet UL 94 V-0 Note: Please specify material for each mounting pad: "N" = nylon; "DAP" = Diallyl Phtalate. Example: 7717-3NG, 7717-86DAPG ACCESSORIES Index of Semiconductor Lead Conversion Pads ORDERING INFORMATION Part number Converts lead spacing from To # of Leads Outside dia Thickness 5.84 (0.230) 1.02 (0.040) For epoxy transistors 7717-130G 0.05 In-Line TO-92 & TO-15 3 For TO-18 7717-247G TO-18 TO-5 3 7.11 (0.280) 3.81 (0.170) 7717-26G TO-18 TO-5 3 8.71 (0.343) 3.05 (0.120) 7717-44G TO-18 TO-5 4 7.75 (0.305) 3.18 (0.125) See pages 108 and 109 for mechanical drawings Index of Semiconductor Mounting Pads ORDERING INFORMATION Part number Leads Outside dia Thickness For TO-5 7717-86G 3 8.71 (0.343) 1.91 (0.075) 7717-178G 3 8.89 (0.350) 0 .53 (0.021) 7717-79G 3 9.02 (0.355) 0.97 (0.038) 7717-3G 3-4 8.64 (0.340) 1.91 (0.075) 7717-15G 4 8.89 (0.350) 0.51 (0.020) 7717-5G 4 8.89 (0.350) 3.18 (0.125) 7717-4G 4 9.53 (0.375) 1.91 (0.075) For TO-18 7717-16G 4 5.08 (0.200) 7717-18G 4 5.08 (0.200) 0.51 (0.020) 2.54 (0.100) 7717-108G 4 5.16 (0.203) 1.78 (0.070) 7717-89G 4 6.35 (0.250) 2.03 (0.080) 7717-7G 4 6.35 (0.250) 3.18 (0.125) For integrated circuits 7717-122G 8 9.27 (0.365) 7717-8G 8 9.53 (0.375) 1.78 (0.070) 1.91 (0.075) 7717-156G 14 19.05 x 11.43 (0.750 x 0.450) 1.27 (0.050) Misc. mounting pads 7717-175G Crystal Can Relay 10.16 / 20.32 (0.400 x 0.800) 1.27 (0.050) See pages 108 and 109 for mechanical drawings sales.na@aavid.com www.shopaavid.com 107 Mounting Pads 7717-3G 7717-4G 2.54 (0.100) TYP 1.27 (0.050) 1.40 (0.055) 1.90 (0.075) 0.13 (0.005) O 8.64 (0.340) O 1.52 DIA (0.060) TYP (4) O 9.52 (0.375) O 5.08 (0.200) O 5.08 (0.200) 0.64 (0.025) O 0.91 (0.036) TYP (4) 1.91 (0.075) 0.64 (0.025) 7717-7G 7717-5G ACCESSORIES O 1.27 (0.050) C SINK TYP (4) O 1.90 (0.075) TYP(8) 1.27 (0.050) 0.51 (0.020) 1.27 (0.050) 0.51 (0.020) TYP O 5.08 (0.200) 8.89 (0.350) O 1.27 (0.050) C SINK TYP (4) o 2.54 (0.100) B.C. 0.64 (0.025) O 0.71 (0.028) TYP (4) 6.35 (0.250) 3.18 (0.125) o 1.65 (0.065) TYP o 0.71 (0.028) TYP 3.18 (0.125) MAX 7717-15G 7717-8G 1.90 (0.075) O 0.91 (0.036) TYP (8) O 1.52 (0.060) TYP (4) 1.40 (0.055) 9.52 (0.375) O 1.27 (0.050) TYP (8) O 5.08 (0.200) B.C. 0.51 (0.020) O 5.08 (0.200) 8.89 (0.350) O 0.91 (0.036) TYP (4) 0.64 (0.025) 7717-18G 7717-16G 2.54 (0.100) 0.51 (0.020) O 2.54 (0.100) B.C. O 1.52 (0.060) O 5.08 (0.200) 5.08 (0.200) O 0.64 (0.025) TYP (4) THRU O 0.91 (0.036) TYP (4) 7717-26G Lead Conversion 7717-44G O 1.57 (0.062) TYP (6) 8.71 (0.343) 108 1.02 (0.040) 0.51 (0.020) Lead Conversion 2.67 (0.105) 1.14 (0.045) O 5.08 (0.200) O 1.02 (0.040) 0.51 (0.020) 1.02 (0.040) 0.51 (0.020) O 6.48 (0.255) B.C. 1.40 (0.055) TYP 3.05 (0.120) 7.75 (0.305) O 0.83 (0.033) THRU TYP (4) O 5.08 (0.200) B.C. O 1.02 (0.040) OPP TYP (4) 0.25 (0.010) 0.51 (0.020) sales.na@aavid.com www.shopaavid.com Mounting Pads 7717-79G 7717-86G 0.43 (0.017) O 5.08 (0.200) O 9.02 (0.355) O 1.57 (0.062) TYP (3) 0.25 (0.010) O 1.14 (0.045) O 1.52 (0.060) 1.90 (0.075) DIA TYP (3) O 5.08 (0.200) O 8.74 (0.344) O 1.14 (0.045) TYP (3) O 1.27 (0.050) TYP (6) 0.51 (0.020) 0.97 (0.038) 7717-89G 1.91 (0.075) 2.03 (0.080) 1.14 (0.045) O 2.54 (0.100) B.C. O 4.78 (0.188) O 0.71 (0.028) TYP (4) 6.35 (0.250) O 1.27 (0.050) C SINK TYP (4) 9.27 (0.365) O 5.08 (0.200) O 1.02 (0.040) TYP (4) 0.13 (0.005) 1.78 (0.070) 12.70 (0.500) O 0.79 (0.031) TYP 1.78 (0.070) Epoxy Transistors 1.02 (0.040) 0.51 (0.020) O 0.63 (0.025) TYP (3) O 1.02 (0.040) TYP (4) 0.71 (0.028) TYP (2) 0.64 (0.025) 7717-156G O 1.02 (0.040) TYP 0.51 (0.020) 5.84 (0.230) MAX 2.54 (0.100) 0.76 (0.030) 1.02 (0.040) 5.16 (0.203) O 1.40 (0.055) TYP (4) 2.67 (0.105) 7717-130G 0.25 (0.010) 2.67 (0.105) 2.39 (0.094) 0.56 (0.022) 7717-122G O 8.00 (0.315) B.C. 2.39 (0.094) O 0.64 (0.025) THRU TYP (4) ACCESSORIES 7717-108G O 1.52 (0.060) OPP TYP (4) O 1.57 (0.062) TYP (4) 0.76 (0.030) 7717-175G 1.43 (0.450) 1.27 (0.050) 19.05 (0.750) 2.54 (0.100) TYP 6 PLCS 4.19 (0.165) 7717-178G 7717-247G O 1.52 (0.060) C SINK TYP (3) 2.54 (0.100) TYP 5.08 (0.200) TYP O 0.89 (0.035) THRU TYP (8) O 1.27 (0.050) C SINK TYP (14) 0.53 (0.021) O 1.57 (0.062) TYP (6) 5.08 (0.200) TYP 6.35 (0.250) 7.62 (0.300) 9.86 (0.388) 0.76 (0.030) 10.16 (0.400) 0.51 (0.020) O 0.89 (0.035) THRU TYP (14) 2.54 (0.100) 20.32 (0.800) O 1.27 (0.050) TYP (8) C SINK 0.51 (0.020) Lead Conversion 3.81 (0.150) 2.54 (0.100) 5.08 (0.200) P.C. 0.56 (0.022) 0.25 (0.010) 0.51 (0.020) O 7.11 (0.280) O 8.89 (0.350) O 5.08 (0.200) O 1.14 (0.045) THRU TYP (3) O 1.02 (0.04) 4 BOSSES 6.35 (0.250) 2.03 (0.080) 0.51 (0.020) sales.na@aavid.com www.shopaavid.com 109 Finishes ACCESSORIES Finish Aavid Code Thermalloy Suffix Description Black Anodize B B Recommended for increased thermal performance. Anodize is electrically isolating and does not provide electrical insulation. AavSHIELD3 V V For corrosion protection or painting only. Color variation may be expected with this finish. Chromate is electrically conductive. Does not provide electrical insulation. Tin Plating D D Allows heat sink to be soldered to the PC Board. Pre-Black Anodized J PB Edges cut during the manufacturing process will be unfinished. Green Anodize M Unfinished U Black Anodize w/Black Paint W Alternative finish to Black anodize. Recommended for increased thermal performance. Electrically isolating but does not provide electrical insulation. U Clean, no finish. Paint on mounting surface prevents metal from contacting the circuit thus avoiding shorts. ORDERING INFORMATION Aavid code - Finish option must be noted by one of the above letters in the 7th position. Aavid's standard finish is black anodize (B) unless otherwise noted. example 12 digit part 530122B00000G A B C A = Base part B = Finish code C = RoHS compliant Thermalloy origin suffix - The suffixes should be added after the model number to indicate the desired finish. example Thermalloy origin part 6396B G A B C A = Model number B = Finish suffix C = RoHS compliant Note : All thermal graphs reflect black anodize finish. 110 sales.na@aavid.com www.shopaavid.com Card Ejectors Snap-On Ejectors / Pullers FEATURES 5021NG Ejector * Saves time - no roll pin required 17.02 (0.670) 13.97 (0.550) 7.14 (0.281) * Excellent for retrofit applications O 2.49 (0.098) * Material is nylon per ASTM D4066-82PA162F11 21.26 (0.837) * Cost no more than conventional ejector/puller 31.75 (1.250) * Rated at 222.5N (50 lbs.) / ejector force per pair * One piece - no assembly required 0.89 (0.035) 0.51 (0.020) ACCESSORIES * May be heat stamped ORDERING INFORMATION 2.67 (0.105) Part number 7.24 (0.285) 5021NG Standard Ejectors / Pullers FEATURES * Lever action releases card from its connector safely and quickly * Cards, their components and connectors are less frequently damaged when extracting PC boards * No special extraction tools are needed for board removal * Material is nylon per ASTM D4066-82 PA120B4413F24, UL 94 V-O rated (natural color) * Roll pins are provided (NAS 561-P3-4) FIGURE A 5005-09NG PULLER * 11.12 (0.438) ORDERING INFORMATION Part number Figure 5005-09NG A 5005-08NG B 5005-25NG C 22.22 (0.875) 9.52 (0.375) 1.90 (0.075) 63.50 (2.500) 11.12 (0.438) 3.18 (0.125) DIA TYP(2) 6.55 (0.258) 50.80 (2.000) 4.70 (0.185) *No roll pins provided FIGURE B 5005-08NG SLIM FACE/ FLAT FIGURE C 7.24 (0.285) 31.75 (1.250) 11.10 (0.437) 15.88 (0.625) 30.48 (1.200) 6.35 (0.250) 22.22 (1.875) 14.27 (0.562) O 2.46 (0.097) 7.14 (0.281) 5005-25NG COMBINATION EJECTOR/PULLER 3.05 (0.120) 1.57 (0.062) o 2.36 (0.093) 7.14 (0.281) 1.78 (0.070) sales.na@aavid.com www.shopaavid.com 111 Grease & Epoxy Sil-FreeTM Sil-FreeTM 1020 is a metal-oxide-filled, silicone-free synthetic grease specially formulated to enhance heat transfer across the interface between the semiconductor case and the heat sink without the migration or contamination associated with silicone-based products. Color White Thermal conductivity 0.79 W/(m-C) Dry interface case-to-sink thermal resistance is typically reduced 50% to 75% with proper application of Sil-FreeTM 1020. Operating temperature range -40C to +200C Volume 1012 Ohm-cm 2.3 0.5 Weight 47.5 grams Dielectric strength 225 volts/mil Consistency Paste Bleed 0.09 max % after 24hr @ 200C Specific gravity 2.8 0.2 Shelf life Indefinite (unopened)* ACCESSORIES This virtually "no-bleed", high-performance compound will not dry out, harden, melt, or run, even after long-term continuous exposure to temperatures up to 200C. Even in a vacuum atmosphere (10-5 Torr, 24 hours@100C), Sil-FreeTM 1020 exhibits virtually "no bleed" or evaporation. ORDERING INFORMATION Part number Package Size 101700F00000G Syringe 43 grams (1.5 oz) 101800F00000G Tube 57 grams (2.0 oz) 101900F00000G Jar 57 grams (2.0 oz) 102000F00000G Tube 143 grams (5.0 oz) 102100F00000G Jar 457 grams (16.0 oz) PRODUCT INFORMATION * It is recommended that the containers be turned over every 6 months to minimize settling for ease of mixing Ther-O-LinkTM Ther-O-LinkTM is a silicone-based thermal compound that cost effectively enhances the heat transfer between a semiconductor case and a heat sink. Easy to apply, Ther-O-LinkTM substantially reduces dry interface thermal resistance, while providing long life under a variety of conditions. ORDERING INFORMATION Part number Package Size 100000F00000G Ampule 1 gram (0.03 oz) 100100F00000G Syringe 35.7 grams (1.25 oz) 100200F00000G Tube 57 grams (2.0 oz) 100500F00000G Tube 143 grams (5.0 oz) 100800F00000G Tube 228.6 grams (8.0 oz) 101600F00000G Can 0.45 kg (1 lb) 108000F00000G Can 2.27 kg (5 lb) 132000F00000G Can 9.07 kg (20 lb) PRODUCT INFORMATION Color White Thermal conductivity 0.73 W/(m-C) Operating temperature range -40C to +200C Volume resistivity 1.0 x 1015 Ohm-cm Dielectric strength 250 volts/mil Consistency Paste Bleed 0.6 max Specific gravity 2.8 Shelf life Indefinite (unopened)* * It is recommended that the containers be turned over every 6 months to minimize settling for ease of mixing UltrastickTM Aavid's UltrastickTM is a unique phase-change thermal interface material that surpasses grease in thermal performance and long-term stability. This solid, silicone-free, paraffinbased thermal compound changes phase at 60C, with a concurrent volumetric expansion that fills gaps between the mating surfaces. UltrastickTM comes in a convenient applicator bar, allowing for neat, fast application to both heat sink and component surfaces. One cost-effective application leaves a thin, film-like deposit, providing excellent heat transfer and low interface thermal resistance. ORDERING INFORMATION Part number 100300F00000G 112 Package Bar PRODUCT INFORMATION Temperature range -40C to +200C Volume resistivity 1.0 X 1.015 Ohm-cm Dielectric strength 250 volts/mil Consistency Paste Bleed 0.6 max Specific gravity 0.28 Color Opaque White Thermal resistance 0.03C/W per square inch @ 20 psi 0.02C/W per square inch @ 100 psi Shelf life Indefinite* * Recommended max. storage temperature: 40C (105F) Size 47.5 grams (0.16 oz) sales.na@aavid.com www.shopaavid.com Grease & Epoxy ThermalcoteTM ThermalcoteTM is a superior thermal joint compound of thermally loaded silicone based grease for use with all heat sinks. It improves the transfer of thermal energy across the metal to metal interfaces between the transistor or rectifier case and the heat sink. ThermalcoteTM conducts heat approximately 15 times better than air and more than 4 times better than unloaded silicone grease. It is non-toxic, extremely stable, and neither cakes or runs from -40 to 204C (-40F to 399F). PRODUCT INFORMATION Color Opaque white Operating temperature range -40C to 204C (-40F to 399F) Thermal conductivity 0.765W/(m C )(.226 Btu/hr ft F) Dielectric strength 11.8 x 103 volts/mm (300 volts/mil) 1.27 mm gap (0.050" gap) Cleaning solvent Mineral spirits or turpentine Specific gravity 1.6 Evaporation 24 hours@200C (392F), wt% 1 Shelf life Indefinite (unopened)* Part number Net weight 249G 28 grams (1 oz) tube 250G 57 grams (2 oz) tube 251G 0.45 kg (1 lb) can 252G 2.27kg (5 lb) can 253G 4.54 kg(10 lb) can ACCESSORIES ORDERING INFORMATION * It is recommended that the containers be turned over every 6 months to minimize settling for ease of mixing ThermalcoteTM ll ThermalcoteTM II was developed as the sensible alternative to silicone-based thermal greases. ThermalcoteTM II employs a highly conductive synthetic base fluid that enables the finished product to exhibit the same thermal characteristics as the silicone-based products. ThermalcoteTM II contains no silicone. The high lubricity of the base oil permits efficient application to both semiconductor case or heat sink, and it will effectively fill the microscopic air gaps on the metal-to-metal mating surfaces. It is non-toxic, extremely stable, and neither cakes or runs from -40 to 200C (-40F to 392F). PRODUCT INFORMATION Color Blue Operating temperature range -40C to 200C (-40F to 392F) Thermal conductivity 0.699W/(M C) (0.204 Btu/hr ft F) Dielectric strength 7.9 x 103volts/mm (200volts/mil) 1.27 mm gap (0.050" gap) Cleaning solvent Mineral spirits or turpentine Specific gravity 2.93@60F (15.6C) Evaporation, 24 hours@200C (392F), wt% 0.6 max Shelf life Indefinite (unopened)* ORDERING INFORMATION Part number Net weight 349G 28 grams (1 oz) tube 350G 57 grams (2 oz) jar 351G 0.45 kg (1 lb) can * It is recommended that the containers be turned over every 6 months to minimize settling for ease of mixing sales.na@aavid.com www.shopaavid.com 113 Grease & Epoxy Ther-O-BondTM Adhesive ACCESSORIES ORDERING INFORMATION Part number Description Package/Kit Size 159900F00000G Ther-O-BondTM 1500 Resin and hardener 0.946 liter (1 qt) 161000F00000G Ther-O-BondTM 1600 2-Part plastic kit 10gm (0.35 oz) 164000F00000G Ther-O-BondTM 1600 2-Part plastic kit 40gm (1.40 oz) 200000F00000G Ther-O-BondTM 2000 Adhesive syringe Activator bottle 25ml 13ml Ther-O-BondTM 1500 Ther-O-BondTM 1600 Ther-O-BondTM 1500 is a versatile epoxy casting system developed for high performance, production potting and encapsulating applications where low shrinkage and rapid air evacuation are required. This formulation has a very low surface tension and a flowable viscosity, which affords excellent air release. Ther-O-BondTM 1500 adhers to rigid plastics and laminates, metals and ceramics, has a low coefficient of thermal expansion and is readily machined and shaped with ordinary shop tools. The fully cured epoxy system is an excellent electrical insulator which provides good resistance to electrolysis, leakage and corrosion room water, weather, gases and chemical compounds. For smaller applications, Ther-O-BondTM 1600 produces a stable, durable, high-impact bond, with good heat transfer characteristics. It is a thixotropic (smooth paste) thermally conductive epoxy system used for staking thermistors, diodes, resistors, integrated circuits and other heat sensitive components to printed circuit boards. This two-part adhesive develops strong, durable, high impact bonds at room temperature, which improve heat transfer while maintaining electrical insulation. Ther-O-bondTM 1600 bonds readily to itself, to metals, silica, steatie, alumina, sapphire and other ceramics, glass, plastics and many other materials because its coefficient of thermal expansion provides a good match for those materials over a fairly wide temperature range. HANDLING CHARACTERISTICS HANDLING CHARACTERISTICS Mix ratio by weight, resin to hardener: 100 to 15 Mix ratio by weight, resin to hardener: 100 to 5 Mixed viscosity @ 25C, cps: 1000 - 1500 Mixed viscosity @ 25C, cps: 33,000 Work-life @ 25C 45 Minutes Work-life @ 25C 45 Minutes Gel time @ 25C 3-6 Hours Gel time @ 25C 3-6 Hours Cure schedule @ 25C 8 Hours Cure schedule @ 25C 8 Hours Cure schedule @ 65C 1 Hour Cure schedule @ 65C 1 Hour Cure schedule @ 100C 0.5 Hour Cure schedule @ 100C 0.5 Hour PHYSICAL PROPERTIES PHYSICAL PROPERTIES Color Black Color Blue Specific gravity 1.5 Specific gravity: 2.30 Operating temp, C -60 to 155 Operating temp, C -70 to 115 Heat distortion temp, C 100 Hardness, shore D: 90 Hardness, shore D: 88 Izod impact, F1 Lbs/Inch of notch 0.49 Thermal conductivity W/(mC) 1.26 Thermal conductivity W/(m-C) 0.85 Compressive strength, psi 14,000 C.T.E. (ppm/C) 25 Dissipation factor, 0.01 Tensile strength (@25C) 9200 psi Self extinguishing: yes Tensile lap shear, psi 2900 C.T.E. (ppm/C) 25 Dielectric strength (volts/mil) 410 Tensile strength (@25C) 9200 psi Dielectric constant (1 KHz @ 25C) 5.9 Dielectric 800 Dissipation factor, KH@ 25C 5.9 Shelf life 18 months* Shelf life 18 months* * Stated shelf life is from date of manufacture. To allow for inventory cycle, product shipped from Aavid will have less than 18 months remaining shelf life. Aavid guarantees a minimum of 3 months remaining shelf life. Please adjust order quantity so all product will be consumed within 3 months of date of shipment. Ther-O-BondTM 2000 Ther-O-BondTM 2000 acrylic adhesive cures rapidly at room temperature, while providing a repairable, thermally conductive bond. PRODUCT INFORMATION Color White Thermal conductivity W/(m-C) 0.48 C.T.E. (ppm/C) 25 Tensile strength (@25C) 2360 psi Dielectric strength (volts/mil) 220 Shelf life 18 months* * Stated shelf life is from date of manufacture. To allow for inventory cycle, product shipped from Aavid will have less than 18 months remaining shelf life. Aavid guarantees a minimum of 3 months remaining shelf life. Please adjust order quantity so all product will be consumed within 3 months of date of shipment. 114 sales.na@aavid.com www.shopaavid.com Grease & Epoxy ThermalbondTM ThermalbondTM is a thermally conductive, high strength epoxy adhesive. It provides exceptional adhesion to copper, aluminum, steel, glass, ceramics, and most plastics. ThermalbondTM also has a coefficient of thermal expansion compatible with aluminum, copper, and brass, making it particularly well suited for thermally bonding semiconductors and other components to chassis or heat sinks. ORDERING INFORMATION HANDLING CHARACTERISTICS Typical electrical and physical properties at room temperature with RT-7 hardener Net weight 4949G 0.8 oz (25 gram kit) Color Green 4950G 1.7 oz (50 gram kit) Specific gravity 2.35 4951G 3.5 oz (100 gram kit) Working viscosity 25,000 cps 4952G 7.0 oz (200 gram kit) Thermal conductivity 1.34W/(m C) (0.77 Btu/hr *ft* F) 4953G 4 lbs (1814 grams) Thermal resistivity 29.4C in/watt Tensile strength 6.34 x 107 Pa (9,2000 psi) MIXING INSTRUCTIONS Mix resin thoroughly before removing material. Add 7.1 parts of RT-7 hardener to 100 parts of resin by weight, or 17 parts of RT-7 hardener to 100 parts of resin by volume. Adhesive will set up in: 24 hrs at 25C (77F) 2 hrs. at 65C (149F) 1 hr. at 100C (212F) 30min. at 130C (266F) Note: For maximum electrical and physical properties, a post cure is neccessary. Post cure at room temperature for 4 days or for 4 hours at 93C (200F). Compressive strength 1.44 x 108 Pa (20,9000 psi) Bond shear strength aluminum to aluminum, 25.4mm (1") overlap @ 25C, (77F) 3.17 x 107 Pa (4,6000 psi) Thermal coefficient of expansion 24 x 10-6/C (1.32 x 10-6/F) Water absorption, % after 10 days@ 25C (77F) 0.20 Hardness, Shore D 86 Volume resistivity 1.0 x 1016 Dielectric strength 59.1 x 103 volts/mm (1500 volts/mil) Dielectric constant@25C (77F) 100KHz 6.1 Dielectric factor@25C (77F) 100KHz 0.020 Operating temperatures -65C to 155C (-85F to 311F) Linear shrinkage 0.002 in/in Shelf life 12 months* Pot life@25C (77F) 2-3 hours Suggested stripping agent Miller-Stephenson MS 111 Cleaning solvent Acetone ACCESSORIES Part number * Stated shelf life is from date of manufacture. To allow for inventory cycle, product shipped from Aavid will have less than 12 months remaining shelf life. Aavid guarantees a minimum of 3 months remaining shelf life. Please adjust order quantity so all product will be consumed within 3 months of date of shipment. sales.na@aavid.com www.shopaavid.com 115 THE TOTAL INTEGRATED SOLUTION FOR COOLING ELECTRONICS The Total Integrated Solution for Cooling Electronics(R) Aavid has the expertise to design and manufacture cooling solutions spanning the entire range of thermal efficiency and mechanical complexity. The board level products displayed in this catalog represent only a fraction of our capabilities. Most applications require custom solutions, which is why so many leading electronics companies partner with Aavid. For demanding applications Aavid can design and validate custom innovative solutions utilizing the most advanced engineering resources saving you precious development time. Our manufacturing facilities, located in strategic markets around the globe, deliver cost effective products providing you a competitive advantage. From concept to production, Aavid can enable your design anywhere in the world. Experts at solving cooling challenges ranging from networking, telecom and consumer electronics, to power and biomedical devices. Utilizing the latest CFD/ FEA and experimental techniques we can: * Perform conjugate analyses with conduction, convection and radiation * Optimize venting and fan placement * Increase power density * Reduce noise, cost and size. * Increase MTBF Dedicated thermal engineers characterize your system and provide the most advanced and effective cooling solutions, saving thousands in engineering resources, thermal modeling software, and test hardware. Aavid's expertise covers 4 major cooling mechanisms: natural convection, forced convection, fluid phase change, and liquid cooling. The above graph is a starting point to determine which technology can be used for your system configuration. For more information regarding any of these cooling mechanisms, please contact Aavid at: www.shopaavid.com 116 sales.na@aavid.com www.shopaavid.com