1
TABLE OF CONTENTS
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General Information
How to Use This Standard Part Catalog....................................................................................................................................................................................................................
Index by Part Number.....................................................................................................................................................................................................................................................
Index by Device and Thermal Resistance............................................................................................................................................................................................................
Index by Style and Thermal Resistance................................................................................................................................................................................................................
How to Select a Heat Sink......................................................................................................................................................................................................................................
How to Read a Thermal Graph...................................................................................................................................................................................................................................
Board Mounted Heat Sinks
Heat Sinks for IC Packages
BGA.........................................................................................................................................................................................................................................................
DIP...........................................................................................................................................................................................................................................................
Surface Mount Discrete Semiconductor Packages
D-PAK.....................................................................................................................................................................................................................................................
SO...................................................................................................................................................................................................................................................................
SMT Footprints..........................................................................................................................................................................................................................................
Thru-Hole Discrete Semiconductor Packages
TO-220..................................................................................................................................................................................................................................................
TO-220 and TO-262..........................................................................................................................................................................................................................
TO-220,TO-218, and TO-247.........................................................................................................................................................................................................
TO-220 and TO-202..................................................................................................................................................................................................................................
TO-220,TO-218,TO-247, and Multiwatt....................................................................................................................................................................................
TO-218..........................................................................................................................................................................................................................................................
TO-202...................................................................................................................................................................................................................................................
TO-126..........................................................................................................................................................................................................................................................
SIP............................................................................................................................................................................................................................................................
TO-92.............................................................................................................................................................................................................................................................
TO-3........................................................................................................................................................................................................................................................
TO-66.............................................................................................................................................................................................................................................................
TO-5........................................................................................................................................................................................................................................................
Axial Lead Devices....................................................................................................................................................................................................................................
Bridge Rectifiers........................................................................................................................................................................................................................................
Options
Table of Contents....................................................................................................................................................................................................................................................
How to Decipher an Aavid 13 Digit Part Number..............................................................................................................................................................................................
How to Decipher a "Thermalloy" Origin Part Number......................................................................................................................................................................................
Index A, B, C = Aavid Standard Parts w/Options..........................................................................................................................................................................................
Index D = "Thermalloy" Origin Parts w/Options.................................................................................................................................................................................................
Interface Materials
In-Sil™, Kondux™, Grafoil® Pads..............................................................................................................................................................................................................................
Hi-Flow®, Alignment Pads..........................................................................................................................................................................................................................................
Double Sided Tape Options (Factory Applied)....................................................................................................................................................................................................
Labor Saving Heat Sink to Board and Semiconductor Mounts
Wave-On™ Mounts, Semiconductor Mounts, Shur-Lock™ Tabs, Solderable Tabs, Solderable Pins.........................................................................................
Solderable Nuts, Clinch Nuts, Solderable Studs, Device Mounting Studs..........................................................................................................................................
Clips
Kool-Klips™.......................................................................................................................................................................................................................................................................
Thermal Clips....................................................................................................................................................................................................................................................................
Accessories
Mounting Kits........................................................................................................................................................................................................................................................................................
Insulating Shoulder Washers.........................................................................................................................................................................................................................................................
Insulators–Thermalfilm™ and Thermalfilm™ MT.........................................................................................................................................................................................................
Insulators–Mica and Thermasil™ III.............................................................................................................................................................................................................................................
Insulating Washers/Aluminum Oxide.........................................................................................................................................................................................................................................
Insulating Stanchion Pads..............................................................................................................................................................................................................................................................
Insulating Covers................................................................................................................................................................................................................................................................................
Mounting Pads..........................................................................................................................................................................................................................................................................
Finishes..................................................................................................................................................................................................................................................................................................
Card Ejectors & Guides....................................................................................................................................................................................................................................................................
Thermal Greases and Epoxies..............................................................................................................................................................................................................................................
2
3
4–5
6–8
9–10
11
12–19
21–23
24–25
24
26
27–50
51–53
53–58
59
60–61
62
63–64
65
66–67
68
69–73
74
75–76
77
77
78–79
80
81
82–84
85
86
87
88
89–94
94–96
97
98
99
100
101–102
103
104
105
106
107–109
110
111
112–115
Table of Contents
2
GENERAL INFORMATION
How to Use This Catalog
Style description
for heat sink
Base part
number
Ordering information will
specify the base heat sink with
available accessories.
Aavid has a large selection of popular
options to enhance your heat sink selection.
This section will indicate the most popular
options available.
Detailed indexes are available
to select additional options.
Icons indicate that
a mounting kit, grease
or epoxy can be used
with the heat sink
Detailed description
illustrates the heat sink’s
differentiating features.
Semiconductor devices
have been included in photos to
assist in determining mounting
position.
Thermal graphs show natural and forced
convection based on black anodize finish.
For information on how to use a thermal graph,
please refer to page 11.
7022 Channel style heat sink with folded back fins
Channel style heat sink with
folded back fins for increased
cooling surface area. Available
with tin plated solderable tabs
for easy attachment to the
printed circuit card.
9.52
(0.375)
50.44
(1.986)
23.01
(0.906)
49.99
(1.968)
3.81
(0.150)
21.03
(0.828)
2x 3.81
(0.150) 2.02
(0.080)
2.67
(0.105)
24.16
(0.951)
4.83
(0.190)
3.18
(0.125)
2.29
(0.090)
2x
4.44
(0.175)
ø
2x 2.03
(0.080)
"X"
14.48
(0.570)
TAB
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5
0
20
40
60
80
100
048121620
4
3
1
2
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Part Number Description Finish
7022BG Channel heat sink with folded back fins Black anodize
7022PBG Channel heat sink with folded back fins Pre-black anodize*
7022B-MTG With solderable tabs Black anodize 2.90 (0.114)
7022PB-MTG With solderable tabs Pre-black anodize* 2.90 (0.114)
ORDERING INFORMATION
Material: 1.27 (0.050) Thick Aluminum
Finish: See Table
* Edges cut during the manufacturing process will be unfinished.
See page XX for more information
Position Code Description Location Details
A TC11-MT Insulated device mounting clip for T0-220 and solderable tabs Hole X Page
POPULAR OPTIONS:
Dia of PCB
Plated Thru
Hole for Tabs
7022B- G
For additional options see page xx
TO-220 Heat Sinks
Semiconductor
device
Mechanical drawing
dimensions as shown
are mm (inches)
Material and finish
information is shown
for each part
Base part no. A
Grease
Epoxy
&
page112
Mounting
Kits
page 99
RoHS Compliant
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3
INDEX
Part Number Page
10-5597-02G 14
10-5597-22G 14
10-5597-33G 14
10-5607-04G 14
10-5607-05G 14
10-5634-01G 12
10-6326-27G 14
10-6326-28G 14
10-6327-01G 14
10-BRD1-01G 12
10-BRD1-03G 12
10-BRD1-04G 12
10-BRD1-05G 12
10-BRD1-07G 12
10-BRD2-01G 12
10-CLS1-01G 12
10-CLS2-01G 12
10-L4LB-03G 14
10-L4LB-05G 14
10-L4LB-11G 14
10-THMA-01G 12
10-TNT2-01G 14
2317B-EP11-BGS1G 18
2319B-TACHG 17
2321B-TACHG 17
2327B-CP50G 16
2327B-TACHG 16
2332B-TACHG 17
2338B-TACHG 17
2342B-TACHG 17
2518B-EP11-BGS2G 18
2519B-EP11-BGS5G 18
2520B-EP04-BGS5G 18
2522B-EP04-BGS5G 18
320105B00000G 76
320205B00000G 76
323005B00000G 76
325705B00000G 76
326005B00000G 76
335114B00032G 19
335211B00000G 19
335211B00032G 19
335214B00000G 19
335214B00032G 19
335214B00034G 19
335224B00032G 17
335224B00034G 16
335314B00000G 19
335314B00032G 19
335314B00035G 19
335324B00032G 16
335714B00000G 19
335714B00032G 19
335724B00032G 17
335814B00000G 19
335814B00032G 19
335824B00032G 17
335824B00034G 16
336314B00000G 19
336624B00032G 17
364424B00032G 17
364424B00034G 16
371824B00032G 17
371824B00034G 16
372024B00032G 17
372024B00034G 16
372924M02000G 14
373024B00032G 17
373024B00034G 16
373224M00032G 17
373324M00032G 17
374024B00032G 17
374024B00035G 16
374024B60023G 12
374124B00032G 17
374124B00035G 16
374124B60023G 12
374224B00032G 17
374224B00035G 16
374224B60023G 12
374324B00032G 17
374324B00035G 16
374324B60023G 12
Part Number Page
374424B00032G 17
374424B00035G 16
374424B60023G 12
374524B00032G 17
374524B00035G 16
374524B60023G 12
374624B00032G 17
374624B00035G 16
374624B60024G 12
374724B00032G 17
374724B00035G 16
374724B60024G 12
374824B00032G 17
374824B00035G 16
374824B60024G 12
374924B00032G 17
374924B00035G 16
374924B60024G 12
375024B00032G 17
375024B00035G 16
375024B60024G 12
375124B00032G 17
375124B00035G 16
375124B60024G 12
375224B00032G 17
375324B00035G 16
375424B00034G 16
500103B00000G 72
500203B00000G 72
500303B00000G 72
500403B00000G 72
501000B00000G 20
501000J00000G 20
501100B00000G 23
501200B00000G 23
501303B00000G 70
501403B00000G 70
501503B00000G 70
501603B00000G 70
501706B00000G 74
501806B00000G 74
501906B00000G 74
502006B00000G 74
504102B00000G 38
504222B00000G 38
505103B00000G 72
505303B00000G 72
505403B00000G 72
506003B00000G 69
506304B00000G 63
506902B00000G 41
507002B00000G 41
507102B00000G 41
507222B00000G 41
507302B00000G 38
507302J00000G 38
508500B00000G 23
508600B00000G 23
508700B00000G 23
513001B02500G 58
513002B02500G 58
513101B02500G 58
513102B02500G 58
513201B02500G 58
513202B02500G 58
513301B02500G 58
513302B02500G 58
519703B00000G 71
519803B00000G 71
519903B00000G 71
520103B00000G 71
520327B00000G 69
520328B00000G 69
520329B00000G 69
529701B02500G 56
529702B02500G 56
529801B02500G 56
529802B02500G 56
529901B02500G 56
529902B02500G 56
530001B02500G 56
530002B02500G 56
530101B00100G 54
Part Number Page
530101B00150G 54
530102B00100G 54
530102B00150G 54
530161B00162G 54
530162B00162G 54
530401B00100G 55
530401B00150G 55
530402B00100G 55
530402B00150G 55
530510B00000G 66
530510U00000G 66
530613B00000G 40
530614B00000G 40
530714B00000G 40
530801B05100G 54
530801B05150G 54
530802B05100G 54
530802B05150G 54
530861B05162G 54
530862B05162G 54
531002B02500G 59
531002V02500G 59
531102B02500G 59
531102V02500G 59
531202B02500G 59
531202V02500G 59
531302B02500G 59
531302V02500G 59
532602B02500G 50
532702B02500G 50
532802B02500G 50
533001B02551G 55
533002B02551G 55
533101B02551G 55
533102B02551G 55
533201B02551G 55
533202B02551G 55
533301B02551G 55
533302B02551G 55
533401B02552G 57
533402B02552G 57
533421B02552G 57
533422B02552G 57
533501B02552G 57
533502B02552G 57
533521B02552G 57
533522B02552G 57
533601B02552G 57
533602B02552G 57
533621B02552G 57
533622B02552G 57
533701B02552G 57
533702B02552G 57
533721B02552G 57
533722B02552G 57
533802B02554G 50
533902B02554G 50
534002B02554G 50
534202B02853G 37
534202B03453G 37
542502B00000G 49
542502D00000G 49
551002B00000G 29
560200B00000G 20
560200W00000G 20
563002B00000G 33
563002D00000G 33
566010B00000G 66
566010B03100G 66
566010B03400G 66
566902B00000G 53
566902B03100G 53
566902B04000G 53
569003B00000G 71
569022B00000G 42
573100D00000G 24
573100D00010G 24
573300D00000G 24
573300D00010G 24
573400D00000G 25
573400D00010G 25
574004B00000G 63
574004U00000G 63
Part Number Page
574102B00000G 45
574102B03300G 45
574204B00000G 63
574204B03300G 63
574402B00000G 45
574402B03200G 45
574502B00000G 45
574502B03300G 45
574602B00000G 45
574602B03300G 45
574802B00000G 43
574802B03300G 43
574902B00000G 45
574902B03300G 45
575002B00000G 33
575002D00000G 33
575102B00000G 46
575200B00000G 68
575300B00000G 68
575400B00000G 68
575603B00000G 70
575703B00000G 70
575803B00000G 70
575903B00000G 70
576012B00000G 40
576014B00000G 40
576103B00000G 73
576203B00000G 73
576303B00000G 73
576403B00000G 73
576602B00000G 33
576602D00000G 33
576802B00000G 52
576802B03100G 52
576802B04000G 52
576802V00000G 52
576802V03100G 52
576802V04000G 52
576802U00000G 52
576802U03100G 52
576802U04000G 52
576904B00000G 64
577002B00000G 34
577002B04000G 34
577102B00000G 34
577102B04000G 34
577202B00000G 34
577202B04000G 34
577304B00000G 64
577404B00000G 64
577500B00000G 65
577500U00000G 65
577922B00000G 40
578105B00000G 75
578205B00000G 75
578305B00000G 75
578405B00000G 75
578505B00000G 75
578622B03200G 40
579003B00000G 71
579103B00000G 69
579103V00000G 69
579206B00000G 74
579206V00000G 74
579302B00000G 46
579402B00000G 46
579604B00000G 63
579604B03300G 63
579704B00000G 63
579704B03300G 63
579802B00000G 43
579802B03300G 43
579902B00000G 43
579902B03300G 43
580100B00000G 20
580100W00000G 20
580200B00000G 20
580200W00000G 20
580300B00000G 21
580400B00000G 22
580500B00000G 22
580600B00000G 21
581001B02500G 61
Part Number Page
581002B02500G 61
581101B02500G 61
581102B02500G 61
581201B02500G 61
581202B02500G 61
584000B00000G 67
584000B03500G 67
5900PBG 32
590102B03600G 34
590302B03600G 34
591202B00000G 51
591202B03100G 51
591202B04000G 51
591302B00000G 51
591302B02800G 51
591302B04000G 51
592201B03400G 62
592502B03400G 49
592502U03400G 49
592902B03400G 33
593002B03400G 33
593101B03600G 62
593202B03500G 48
5FG 75
6000DG 77
6000UG 77
6021BG 30
6021PBG 30
6022BG 47
6022PBG 47
6025DG 48
6032DG 47
6038BG 36
6043PBG 43
6046PBG 64
6047PBG 64
6049PBG 43
6094PBG 43
6109PBG 35
6110PBG 35
615653B00250G 19
6201PBG 75
6202PBG 75
6203PBG 75
6221PBG 30
6222BG 77
6223BG 77
6224BG 77
6225B-MTG 47
6230DG 30
6232B-MTG 48
6232PB-MTG 48
6236BG 39
6236PBG 39
6237BG 42
6237PBG 42
6238BG 37
6238B-MTG 37
6239B-MTG 37
6284BG 23
6374BG 61
6380BG 60
6381BG 60
6382BG 60
6396BG 60
6396B-P2G 60
6398BG 60
6398B-P2G 60
6399BG 60
6399B-P2G 60
6400BG 60
6400B-P2G 60
700353U01100G 19
7019BG 27
7019B-MTG 27
7019PBG 27
7020BG 27
7020B-MTG 27
7021BG 28
7021B-MTG 28
7022BG 29
7022B-MTG 29
7022PBG 29
Part Number Page
7022PB-MTG 29
7023BG 28
7023B-MTG 28
7025BG 27
7025B-MTG 27
7038BG 67
709203B00400G 19
7106DG 24
7106D/TRG 24
7109DG 25
7109D/TRG 25
7128DG 36
7130DG 62
7136DG 35
7137DG 42
7139DG 35
7140DG 42
7141DG 38
7142DG 36
7148DG 67
7173DG 39
7178DG 35
799403B01500G 19
92FG 68
BW38-2G 58
BW38-4G 58
BW50-2G 58
BW50-4G 58
BW63-2G 58
BW63-4G 58
ML26AAG 50
PF432G 52
PF433G 52
PF434G 52
PF435G 52
PF436G 52
PF523G 73
PF526G 73
PF527G 73
PF720G 44
PF723G 44
PF730G 65
PF732G 65
PF750G 44
PF752G 44
PF758G 44
SW25-2G 56
SW25-4G 56
SW25-6G 59
SW38-2G 56
SW38-4G 56
SW38-6G 59
SW50-2G 56
SW50-4G 56
SW63-2G 56
SW63-4G 56
TV1500G 32
TV1505G 32
TV265G 32
TV35G 31
TV4G 65
TV40G 39
TV46G 31
TV47G 31
TV58G 31
TV96G 53
TV97G 53
YB32-4G 61
Index by Part Number
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4
INDEX
6000UG 15.0 V 77
6000DG 15.0 V 77
6222BG 9.4 V 77
6223BG 9.4 V 77
6224BG 9.4 V 77
501200B00000G 68.0 H 23
501100B00000G 67.0 H 23
501000J00000G 60.0 H 20
501000B00000G 60.0 H 20
580300B00000G 39.0 H 21
580400B00000G 39.0 H 22
508500B00000G 34.0 H 23
508600B00000G 32.0 H 23
580100B00000G 30.0 H 20
580100W00000G 30.0 H 20
508700B00000G 27.2 H 23
6284BG 25.0 H 23
560200B00000G 20.0 H 20
560200W00000G 20.0 H 20
580200B00000G 20.0 H 20
580200W00000G 20.0 H 20
580500B00000G 20.0 H 22
580600B00000G 20.0 H 21
Bi Directional Air Flow H 19
Solder Anchor H 12
Push Pin H 14
Clip Attachment H 18
Tape Attachment H 16
YB32-4G 8.4 V 61
6380BG 6.8 V 60
6381BG 5.8 V 60
6396BG 5.6 V 60
6396B-P2G 5.6 V 60
6374BG 5.0 V 61
6398BG 4.4 V 60
6398B-P2G 4.4 V 60
6382BG 4.2 V 60
6399BG 3.3 V 60
6399B-P2G 3.3 V 60
6400BG 2.7 V 60
6400B-P2G 2.7 V 60
530510U00000G 20.6 V 66
530510B00000G 20.6 V 66
7038BG 16.0 V 67
7148DG 16.0 V 67
566010B00000G 11.5 H-V 66
566010B03400G 11.5 V 66
566010B03100G 11.5 H 66
584000B00000G 10.0 V 67
584000B03500G 10.0 V 67
6380BG 6.8 V 60
6381BG 5.8 V 60
6382BG 4.2 V 60
D-PAK TO-252
573100D00010G 25.0 H 24
573100D00000G 25.0 H 24
D2PAK TO-263
573300D00010G 16.0 H 24
573300D00000G 16.0 H 24
7109D/TRG 9.0 H 25
7109DG 9.0 H 25
D2PAK TO-263 SO-10
7106D/TRG 14.0 H 24
7106DG 14.0 H 24
D3PAK TO-268
573400D00010G 11.0 H 25
573400D00000G 11.0 H 25
575603B00000G 15.6 H 70
575703B00000G 13.4 H 70
579103B00000G 12.5 H 69
579103V00000G 12.5 H 69
501303B00000G 12.0 H 70
519803B00000G 11.4 H 71
575803B00000G 11.0 H 70
PF523G 10.1 H 73
501403B00000G 10.0 H 70
505103B00000G 10.0 H 72
575903B00000G 9.8 H 70
PF526G 8.9 H 73
501503B00000G 8.4 H 70
501603B00000G 7.8 H 70
505303B00000G 7.8 H 72
PF527G 7.4 H 73
500103B00000G 7.2 H 72
576103B00000G 7.2 H 73
506003B00000G 7.0 H 69
500203B00000G 6.2 H 72
576203B00000G 6.2 H 73
579003B00000G 6.0 H 71
505403B00000G 6.0 H 72
576303B00000G 6.0 H 73
500303B00000G 5.8 H 72
569003B00000G 5.5 H 71
520103B00000G 5.4 H 71
576403B00000G 5.1 H 73
500403B00000G 5.0 H 72
519703B00000G 4.8 H 71
520329B00000G 4.7 H 69
520328B00000G 4.7 H 69
520327B00000G 4.7 H 69
519903B00000G 4.2 H 71
320105B00000G 63.0 V 76
320205B00000G 63.0 V 76
325705B00000G 60.0 V 76
326005B00000G 57.0 V 76
323005B00000G 56.0 V 76
6201PBG 54.0 V 75
5FG 45.2 V 75
6202PBG 43.0 V 75
578105B00000G 40.0 V 75
578205B00000G 38.0 V 75
6203PBG 38.0 V 75
578305B00000G 35.0 V 75
578405B00000G 31.0 V 75
578505B00000G 28.0 V 75
579206B00000G 22.0 H 74
579206V00000G 22.0 H 74
501706B00000G 12.0 H 74
501806B00000G 9.6 H 74
501906B00000G 8.0 H 74
502006B00000G 8.0 H 74
575200B00000G 60.0 V 68
575300B00000G 50.0 V 68
575400B00000G 40.0 V 68
92FG 36.1 V 68
PF730G 35.8 H-V 65
PF732G 35.8 H-V 65
577500B00000G 26.0 V 65
577500U00000G 26.0 V 65
TV4G 21.6 H 65
576904B00000G 32.0 H–V 64
574004B00000G 28.0 V 63
574004U00000G 28.0 V 63
577304B00000G 27.2 H–V 64
6046PBG 25.0 V 64
6047PBG 25.0 V 64
579604B00000G 24.0 V 63
579604B03300G 24.0 V 63
579704B00000G 24.0 V 63
579704B03300G 24.0 V 63
577404B00000G 24.0 H–V 64
574204B00000G 16.8 V 63
574204B03300G 16.8 V 63
506304B00000G 14.4 H–V 63
531002B02500G 13.4 V 59
531002V02500G 13.4 V 59
SW25-6G 13.0 V 59
531102B02500G 10.4 V 59
531102V02500G 10.4 V 59
SW38-6G 10.0 V 59
531302B02500G 8.0 V 59
531302V02500G 8.0 V 59
531202V02500G 7.5 V 59
531202B02500G 7.5 V 59
TV96G 24.0 H 53
7130DG 23.1 V 62
TV97G 20.0 H 53
581001B02500G 19.6 V 61
581101B02500G 16.8 V 61
581201B02500G 12.8 V 61
513001B02500G 13.4 V 58
533001B02551G 13.0 V 55
SW25-2G 11.4 V 56
SW25-4G 11.4 V 56
533101B02551G 11.0 V 55
513101B02500G 11.0 V 58
SW38-2G 10.2 V 56
SW38-4G 10.2 V 56
533201B02551G 9.0 V 55
513201B02500G 9.0 V 58
SW50-2G 8.8 V 56
SW50-4G 8.8 V 56
593101B03600G 8.6 V 62
YB32-4G 8.4 V 61
513301B02500G 8.0 V 58
533301B02551G 8.0 V 55
530001B02500G 8.0 V 56
BW63-4G 7.4 V 58
BW38-2G 7.2 V 58
BW38-4G 7.2 V 58
SW63-2G 7.0 V 56
SW63-4G 7.0 V 56
6380BG 6.8 V 60
592201B03400G 6.8 V 62
530101B00100G 6.3 V 54
530101B00150G 6.3 V 54
530801B05100G 6.3 V 54
530801B05150G 6.3 V 54
530401B00100G 6.3 V 55
530401B00150G 6.3 V 55
6381BG 5.8 V 60
BW50-2G 5.8 V 58
BW50-4G 5.8 V 58
533701B02552G 5.7 V 57
533721B02552G 5.7 V 57
6396BG 5.6 V 60
6396B-P2G 5.6 V 60
529701B02500G 5.5 V 56
6374BG 5.0 V 61
533401B02552G 5.0 V 57
533421B02552G 5.0 V 57
529801B02500G 5.0 V 56
BW63-2G 4.7 V 58
529901B02500G 4.5 V 56
533501B02552G 4.5 V 57
533521B02552G 4.5 V 57
530161B00162G 4.4 V 54
530861B05162G 4.4 V 54
6398BG 4.4 V 60
6398B-P2G 4.4 V 60
6382BG 4.2 V 60
533601B02552G 3.8 V 57
533621B02552G 3.8 V 57
6399BG 3.3 V 60
6399B-P2G 3.3 V 60
6400BG 2.7 V 60
6400B-P2G 2.7 V 60
6094PBG 40.5 H 43
PF730G 35.8 V 65
PF732G 35.8 V 65
7178DG 35.7 V 35
6049PBG 34.1 V 43
576802V00000G 32.6 V 52
576802U00000G 32.6 V 52
576802V03100G 32.6 H 52
576802U03100G 32.6 H 52
576802V04000G 32.6 V 52
576802U04000G 32.6 V 52
577002B00000G 32.0 H–V 34
577002B04000G 32.0 V 34
TV58G 29.9 H–V 31
PF720G 28.9 V 44
PF723G 28.9 V 44
7139DG 28.3 H 35
576802B00000G 27.3 V 52
576802B03100G 27.3 H 52
576802B04000G 27.3 V 52
TV46G 27.1 H–V 31
TV47G 27.1 H–V 31
591202B00000G 26.8 H–V 51
591202B03100G 26.8 H 51
Index by Device Cooled and Thermal Resistance
Board
Part Number θn Mounting Page
AXIAL LEAD
BRIDGE RECTIFIERS
DIPS
IC PACKAGES, BGA, PGA, QFP, LCC
MULTIWATT
SIPS
TO-3
SMT
TO-5
TO-92
TO-218
TO-66
TO-126
TO-202
KEY
H = Horizontal mount
V = Vertical mount
H–V = Either horizontal or vertical
depending on device leads
θn= Natural convection thermal resistance
based on a 75°C heat sink temperature rise
TO-220
Board
Part Number θn Mounting Page
Board
Part Number θn Mounting Page
Board
Part Number θn Mounting Page
sales.na@aavid.com www.shopaavid.com
5
INDEX
591202B04000G 26.8 V 51
591302B00000G 26.8 H–V 51
591302B02800G 26.8 V 51
591302B04000G 26.8 H 51
579802B00000G 26.4 V 43
579802B03300G 26.4 V 43
579902B00000G 26.4 V 43
579902B03300G 26.4 V 43
577102B00000G 25.9 H–V 34
577102B04000G 25.9 V 34
7173DG 25.8 V 39
6236BG 25.0 V 39
6236PBG 25.0 V 39
6237BG 25.0 H 42
6237PBG 25.0 H 42
577202B00000G 24.4 H–V 34
577202B04000G 24.4 V 34
507302B00000G 24.0 H–V 38
507302J00000G 24.0 H–V 38
542502B00000G 24.0 H 49
542502D00000G 24.0 H 49
TV96G 24.0 H 53
PF752G 23.7 V 44
576014B00000G 23.2 H–V 40
574402B00000G 23.2 H–V 45
574402B03200G 23.2 H 45
574102B00000G 23.2 H–V 45
574102B03300G 23.2 V 45
6043PBG 23.0 V 43
592502B03400G 22.0 V 49
592502U03400G 22.0 V 49
574602B00000G 21.6 H–V 45
574602B03300G 21.6 V 45
574502B00000G 21.2 H–V 45
574502B03300G 21.2 V 45
6110PBG 21.0 H–V 35
576012B00000G 20.8 H–V 40
7137DG 20.8 V 42
7140DG 20.8 H 42
574802B00000G 20.4 H–V 43
574802B03300G 20.4 V 43
PF750G 20.3 V 44
7142DG 20.3 H 36
7141DG 20.3 V 38
530714B00000G 20.3 H–V 40
PF432G 20.3 V 52
PF433G 20.3 V 52
PF434G 20.3 H 52
PF435G 20.3 V 52
PF436G 20.3 H 52
506902B00000G 20.0 V 41
TV97G 20.0 H–V 53
7136DG 19.7 V 35
7128DG 19.2 V 36
566902B00000G 18.8 H-V 53
566902B03100G 18.8 H 53
566902B04000G 18.8 V 53
6038BG 18.0 V 36
592902B03400G 17.9 V 33
6025DG 17.9 V 48
6025B-TTG 17.9 V 48
ML26AAG 17.9 H 50
581002B02500G 17.4 V 61
PF758G 17.3 V 44
TV1505G 17.0 V 32
6109PBG 17.0 H–V 35
575102B00000G 16.8 H–V 46
579302B00000G 16.8 V 46
579402B00000G 16.8 V 46
581102B02500G 16.8 V 61
530614B00000G 16.7 H–V 40
530613B00000G 16.7 H–V 40
6022PBG 16.7 V 47
6022BG 16.7 V 47
576602B00000G 16.6 V 33
576602D00000G 16.6 V 33
574902B00000G 16.0 H–V 45
574902B03300G 16.0 V 45
504102B00000G 15.6 H–V 38
507002B00000G 15.6 H–V 41
507102B00000G 15.6 H–V 41
6225B-MTG 15.0 V 47
TV1500G 14.2 V 32
575002B00000G 13.6 V 33
575002D00000G 13.6 V 33
6238BG 13.6 H–V 37
6238B-MTG 13.6 V 37
6239B-MTG 13.6 V 37
593002B03400G 13.4 V 33
534202B02853G 13.4 V 37
534202B03453G 13.4 V 37
513002B02500G 13.4 V 58
531002B02500G 13.4 V 59
531002V02500G 13.4 V 59
577922B00000G 13.2 V 40
578622B03200G 13.2 V 40
TV265G 13.0 V 32
5900PBG 13.0 V 32
563002B00000G 13.0 V 33
563002D00000G 13.0 V 33
533802B02554G 13.0 V 50
533002B02551G 13.0 V 55
SW25-6G 13.0 V 59
581202B02500G 12.8 V 61
6021BG 12.5 V 30
6021PBG 12.5 V 30
6221PBG 12.5 V 30
6230DG 12.5 V 30
551002B00000G 12.4 H 29
SW25-2G 11.4 V 56
SW25-4G 11.4 V 56
590302B03600G 11.2 V 34
7019BG 11.0 V 27
7019PBG 11.0 V 27
7019B-MTG 11.0 V 27
533902B02554G 11.0 V 50
513102B02500G 11.0 V 58
533102B02551G 11.0 V 55
593202B03500G 10.4 V 48
531102B02500G 10.4 V 59
531102V02500G 10.4 V 59
SW38-2G 10.2 V 56
SW38-4G 10.2 V 56
590102B03600G 10.0 V 34
6232B-MTG 10.0 V 48
6232PB-MTG 10.0 V 48
SW38-6G 10.0 V 59
TV40G 9.9 H 39
507222B00000G 9.6 H 41
534002B02554G 9.0 V 50
533202B02551G 9.0 V 55
513202B02500G 9.0 V 58
SW50-2G 8.8 V 56
SW50-4G 8.8 V 56
7020BG 8.7 V 27
7020B-MTG 8.7 V 27
YB32-4G 8.4 V 61
6032DG 8.3 V 47
533302B02551G 8.0 V 55
513302B02500G 8.0 V 58
531302B02500G 8.0 V 59
531302V02500G 8.0 V 59
531202V02500G 7.5 V 59
531202B02500G 7.5 V 59
Index by Device Cooled and Thermal Resistance
TV35G 7.2 H 31
BW38-2G 7.2 V 58
BW38-4G 7.2 V 58
SW63-2G 7.0 V 56
SW63-4G 7.0 V 56
7025BG 6.8 V 27
7025B-MTG 6.8 V 27
7021BG 6.8 V 28
7021B-MTG 6.8 V 28
6380BG 6.8 V 60
7022BG 6.5 V 29
7022PBG 6.5 V 29
7022B-MTG 6.5 V 29
7022PB-MTG 6.5 V 29
504222B00000G 6.4 H 38
530102B00100G 6.3 V 54
530102B00150G 6.3 V 54
530802B05100G 6.3 V 54
530802B05150G 6.3 V 54
530402B00100G 6.3 V 55
530402B00150G 6.3 V 55
6381BG 5.8 V 60
BW50-2G 5.8 V 58
BW50-4G 5.8 V 58
533702B02552G 5.7 V 57
533722B02552G 5.7 V 57
6396BG 5.6 V 60
6396B-P2G 5.6 V 60
569022B00000G 5.5 H 42
532602B02500G 5.5 V 50
529702B02500G 5.5 V 56
6374BG 5.0 V 61
533402B02552G 5.0 V 57
533422B02552G 5.0 V 57
532702B02500G 4.8 V 50
BW63-2G 4.7 V 58
BW63-4G 4.7 V 58
529902B02500G 4.5 V 56
533502B02552G 4.5 V 57
7023BG 4.4 V 28
7023B-MTG 4.4 V 28
530162B00162G 4.4 V 54
530862B05162G 4.4 V 54
6398BG 4.4 V 60
6398B-P2G 4.4 V 60
532802B02500G 4.2 V 50
6382BG 4.2 V 60
533602B02552G 3.8 V 57
533622B02552G 5.0 V 57
6399BG 5.0 V 60
529802B02500G 3.7 V 56
6399B-P2G 3.3 V 60
6400BG 2.7 V 60
6400B-P2G 2.7 V 60
533522B02552G 2.7 V 57
530002B02500G 2.6 V 56
TV96G 24.0 H 53
TV97G 20.0 H–V 53
513001B02500G 13.4 V 58
533001B02551G 13.0 V 55
SW25-2G 11.4 V 56
SW25-4G 11.4 V 56
533101B02551G 11.0 V 55
513101B02500G 11.0 V 58
SW38-2G 10.2 V 56
SW38-4G 10.2 V 56
533201B02551G 9.0 V 55
513201B02500G 9.0 V 58
SW50-2G 8.8 V 56
SW50-4G 8.8 V 56
YB32-4G 8.4 V 61
533301B02551G 8.0 V 55
530001B02500G 2.6 V 56
513301B02500G 8.0 V 58
BW38-2G 7.2 V 58
BW38-4G 7.2 V 58
SW63-2G 7.0 V 56
SW63-4G 7.0 V 56
6380BG 6.8 V 60
530101B00100G 6.3 V 54
530101B00150G 6.3 V 54
530801B05100G 6.3 V 54
530801B05150G 6.3 V 54
530401B00100G 6.3 V 55
530401B00150G 6.3 V 55
6381BG 5.8 V 60
BW50-2G 5.8 V 58
BW50-4G 5.8 V 58
533701B02552G 5.7 V 57
533721B02552G 5.7 V 57
6396BBG 5.6 V 60
6396B-P2G 5.6 V 60
529701B02500G 5.5 V 56
6374BG 5.0 V 61
533401B02552G 5.0 V 57
533421B02552G 5.0 V 57
529801B02500G 5.0 V 56
BW63-2G 4.7 V 58
BW63-4G 4.7 V 58
529901B02500G 4.5 V 56
533501B02552G 4.5 V 57
533521B02552G 4.5 V 57
6398BG 4.4 V 60
6398B-P2G 4.4 V 60
530161B00162G 4.4 V 54
530861B05162G 4.4 V 54
6382BG 4.2 V 60
533601B02552G 3.8 V 57
533621B02552G 3.8 V 57
6399BG 3.3 V 60
6399B-P2G 3.3 V 60
6400BG 2.7 V 60
6400B-P2G 2.7 V 60
576802B00000G 27.3 H–V 52
576802V00000G 32.6 H–V 52
576802U00000G 32.6 H–V 52
576802B03100G 27.3 H 52
576802V03100G 32.6 H 52
576802U03100G 32.6 H 52
576802B04000G 27.3 V 52
576802V04000G 32.6 V 52
576802U04000G 32.6 V 52
591202B00000G 26.8 H-V 51
591202B03100G 26.8 H 51
591202B04000G 26.8 V 51
591302B00000G 26.8 H-V 51
591302B02800G 26.8 V 51
591302B04000G 26.8 H 51
PF432G 20.3 V 52
PF433G 20.3 V 52
PF434G 20.3 H 52
PF435G 20.3 V 52
PF436G 20.3 H 52
566902B00000G 18.8 H-V 53
566902B03100G 18.8 H 53
566902B04000G 18.8 V 53
TO-247
TO-262
NEED HIGHER PERFORMANCE?
Aavid also offers the Max Clip SystemTM
for discrete power semiconductors
featuring simple assembly and high
reliability.
Board
Part Number θn Mounting Page
Board
Part Number θn Mounting Page
Board
Part Number θn Mounting Page
Board
Part Number θn Mounting Page
sales.na@aavid.com www.shopaavid.com
6
INDEX
6000UG 15.0 V 77
6000DG 15.0 V 77
6222BG 9.4 V 77
6223BG 9.4 V 77
6224BG 9.4 V 77
Extruded Heat Sinks
501200B00000G 68.0 H 23
501100B00000G 67.0 H 23
508700B00000G 27.2 H 23
6284BG 25.0 H 23
580500B00000G 20.0 H 22
580600B00000G 20.0 H 21
Slide On Heat Sinks
501000J00000G 60.0 H 20
501000B00000G 60.0 H 20
580300B00000G 39.0 H 21
580400B00000G 39.0 H 22
508500B00000G 34.0 H 23
508600B00000G 32.0 H 23
580100B00000G 30.0 H 20
580100W00000G 30.0 H 20
560200B00000G 20.0 H 20
560200W00000G 20.0 H 20
580200B00000G 20.0 H 20
580200W00000G 20.0 H 20
Bi Directional Air Flow H 19
Solder Anchor H 12
Push Pin H 14
Clip Attachment H 18
Tape Attachment H 16
Extruded Heat Sinks
YB32-4G 8.4 V 61
6380BG 6.8 V 60
6381BG 5.8 V 60
6396BG 5.6 V 60
6396B-P2G 5.6 V 60
6374BG 5.0 V 61
6398BG 4.4 V 60
6398B-P2G 4.4 V 60
6382BG 4.2 V 60
6399BG 3.3 V 60
6399B-P2G 3.3 V 60
6400BG 2.7 V 60
6400B-P2G 2.7 V 60
Channel Style Heat Sinks
530510U00000G 20.6 V 66
530510B00000G 20.6 V 66
Clip On Style Heat Sinks
584000B00000G 10.0 V 67
584000B03500G 10.0 V 67
Extruded Heat Sinks
6380BG 6.8 V 60
6381BG 5.8 V 60
6382BG 4.2 V 60
Plug In Style Heat Sinks
566010B00000G 11.5 H–V 66
566010B03400G 11.5 V 66
566010B03100G 11.5 H 66
Slide On Style Heat Sinks
7038BG 16.0 V 67
7148DG 16.0 V 67
D-Pak TO-252
573100D00010G 15.0 H 24
573100D00000G 15.0 H 24
D2Pak TO-263
573300D00010G 18.0 H 24
573300D00000G 18.0 H 24
7109D/TRG 11.0 H 25
7109DG 11.0 H 25
D2Pak TO-263 SO10 (MO-184)
7106D/TRG 15.0 H 24
7106DG 15.0 H 24
D3Pak TO-268
573400D00010G 14.0 H 25
573400D00000G 14.0 H 25
Diamond Shaped Basket Heat Sinks
575603B00000G 15.6 H 70
575703B00000G 13.4 H 70
501303B00000G 12.0 H 70
575803B00000G 11.0 H 70
PF523G 10.1 H 73
501403B00000G 10.0 H 70
575903B00000G 9.8 H 70
PF526G 8.9 H 73
501503B00000G 8.4 H 70
501603B00000G 7.8 H 70
PF527G 7.4 H 73
Hat Section Heat Sink
506003B00000G 7.0 H 69
Space Saving Collar Heat Sinks
579103B00000G 12.5 H 69
579103V00000G 12.5 H 69
Square Basket Heat Sinks
519803B00000G 11.4 H 71
505103B00000G 10.0 H 72
505303B00000G 7.8 H 72
500103B00000G 7.2 H 72
576103B00000G 7.2 H 73
500203B00000G 6.2 H 72
576203B00000G 6.2 H 73
579003B00000G 6.0 H 71
505403B00000G 6.0 H 72
576303B00000G 6.0 H 73
500303B00000G 5.8 H 72
569003B00000G 5.5 H 71
520103B00000G 5.4 H 71
576403B00000G 5.1 H 73
500403B00000G 5.0 H 72
519703B00000G 4.8 H 71
519903B00000G 4.2 H 71
Two Piece Heat Sinks
520329B00000G 4.7 H 69
520328B00000G 4.7 H 69
520327B00000G 4.7 H 69
Extruded Collar Heat Sinks
320105B00000G 63.0 V 76
320205B00000G 63.0 V 76
325705B00000G 60.0 V 76
326005B00000G 57.0 V 76
323005B00000G 56.0 V 76
Low Cost Push On Heat Sink
5FG 45.2 V 75
Snap On Cooler Heat Sinks
578105B00000G 40.0 V 75
578205B00000G 38.0 V 75
578305B00000G 35.0 V 75
578405B00000G 31.0 V 75
578505B00000G 28.0 V 75
Space Saving Collar Heat Sinks
6201PBG 54.0 V 75
6202PBG 43.0 V 75
6203PBG 38.0 V 75
Diamond Shaped Basket Heat Sinks
501706B00000G 12.0 H 74
501806B00000G 9.6 H 74
501906B00000G 8.0 H 74
502006B00000G 8.0 H 74
Space Saving Collar Heat Sinks
579206B00000G 22.0 H 74
579206V00000G 22.0 H 74
Clip On Style Heat Sink
92FG 36.1 V 68
Slip On Style Heat Sinks
575200B00000G 60.0 V 68
575300B00000G 50.0 V 68
575400B00000G 40.0 V 68
Channel Style Heat Sink
TV4G 21.6 H 65
Slip On Style Heat Sinks
PF730G 35.8 H-V 65
PF732G 35.8 H-V 65
577500B00000G 26.0 V 65
577500U00000G 26.0 V 65
Channel Style Heat Sinks
576904B00000G 32.0 H–V 64
577304B00000G 27.2 H–V 64
577404B00000G 24.0 H–V 64
Compact Slide On Heat Sinks
6046PBG 25.0 V 64
6047PBG 25.0 V 64
Extruded Heat Sinks
531002B02500G 13.4 V 59
531002V02500G 13.4 V 59
SW25-6G 13.0 V 59
531102B02500G 10.4 V 59
531102V02500G 10.4 V 59
SW38-6G 10.0 V 59
531302B02500G 8.0 V 59
531302V02500G 8.0 V 59
531202V02500G 7.5 V 59
531202B02500G 7.5 V 59
Low Cost Slide On Heat Sinks
574004B00000G 28.0 V 63
574004U00000G 28.0 V 63
Board
Part Number θn Mounting Page
Index by Device Cooled, Heat Sink Style, and Thermal Resistance
AXIAL LEAD
BRIDGE RECTIFIERS
DIPS
IC PACKAGES, BGA, PGA, QFP, LCC
MULTI-WATT
SIPS
SMT
TO-3
TO-5
TO-92
TO-126
TO-202
TO-66
Board
Part Number θn Mounting Page
Board
Part Number θn Mounting Page
KEY
H = Horizontal mount
V = Vertical mount
H–V = Either horizontal or vertical
depending on device leads
θn= Natural convection thermal resistance
based on a 75°C heat sink temperature rise
sales.na@aavid.com www.shopaavid.com
7
INDEX
Hat Section Heat Sinks
TV96G 24.0 H 53
TV97G 20.0 H–V 53
High Rise Style Heat Sinks
530101B00100G 6.3 V 54
530101B00150G 6.3 V 54
530801B05100G 6.3 V 54
530801B05150G 6.3 V 54
530401B00100G 6.3 V 55
530401B00150G 6.3 V 55
Plug In Style Heat Sink
592201B03400G 6.8 V 62
Slide On Heat Sink
7130DG 23.1 V 62
Channel Style Heat Sinks
7178DG 35.7 V 35
577002B04000G 32.0 V 35
577002B00000G 32.0 H-V 35
TV58G 29.9 H-V 31
7139DG 28.3 H 35
TV46G 27.1 H–V 31
TV47G 27.1 H–V 31
577102B00000G 25.9 H-V 35
577102B04000G 25.9 V 35
7173DG 25.8 V 39
6236BG 25.0 V 39
6236PBG 25.0 V 39
577202B00000G 24.4 H-V 35
577202B04000G 24.4 V 35
507302B00000G 24.0 H-V 39
507302J00000G 24.0 H-V 39
576014B00000G 23.2 H-V 41
6110PBG 21.0 H-V 35
576012B00000G 20.8 H-V 41
7142DG 20.3 H 36
7141DG 20.3 V 38
530714B00000G 20.3 H-V 41
7136DG 19.7 V 35
7128DG 19.2 V 36
6038BG 18.0 V 36
592902B03400G 17.9 V 33
6109PBG 17.0 H-V 35
TV1505G 17.0 V 32
530614B00000G 16.7 H-V 41
530613B00000G 16.7 H-V 41
576602B00000G 16.6 V 34
576602D00000G 16.6 V 34
504102B00000G 15.6 H–V 39
TV1500G 14.2 V 32
575002B00000G 13.6 V 34
575002D00000G 13.6 V 34
6238BG 13.6 H–V 37
6238B-MTG 13.6 V 37
6239B-MTG 13.6 V 37
593002B03400G 13.4 V 33
534202B02853G 13.4 V 38
534202B03453G 13.4 V 38
577922B00000G 13.2 V 41
578622B03200G 13.2 V 41
563002B00000G 13.0 V 34
563002D00000G 13.0 V 34
TV265G 13.0 V 32
5900PBG 13.0 V 32
6021BG 12.5 V 30
6021PBG 12.5 V 30
6221PBG 12.5 V 30
6230DG 12.5 V 30
551002B00000G 12.4 H 30
590302B03600G 11.2 V 34
7019BG 11.0 V 27
7019PBG 11.0 V 27
7019B-MTG 11.0 V 27
590102B03600G 10.0 V 34
TV40G 9.9 H 39
7020BG 8.7 V 27
7020B-MTG 8.7 V 27
TV35G 7.2 H 31
7025BG 6.8 V 27
7025B-MTG 6.8 V 27
7021BG 6.8 V 28
7021B-MTG 6.8 V 28
7022BG 6.5 V 29
7022PBG 6.5 V 29
7022B-MTG 6.5 V 29
7022PB-MTG 6.5 V 29
504222B00000G 6.4 H 39
7023BG 4.4 V 28
7023B-MTG 4.4 V 28
Clip On Style Heat Sinks
6094PBG 40.5 H 43
6049PBG 34.1 V 43
579802B00000G 26.4 V 44
579802B03300G 26.4 V 44
579902B00000G 26.4 V 44
579902B03300G 26.4 V 44
6043PBG 23.0 V 43
574802B00000G 20.4 H–V 44
574802B03300G 20.4 V 44
Dual Extruded Heat Sinks
6380BG 6.8 V 60
6381BG 5.8 V 60
533722B02552G 5.7 V 57
533422B02552G 5.0 V 57
6374BG 5.0 V 61
6382BG 4.2 V 60
533622B02552G 3.8 V 57
533522B02552G 2.7 V 57
Dual High Rise Style Heat Sinks
530162B00162G 4.4 V 54
530862B05162G 4.4 V 54
Extruded Heat Sinks
ML26AAG 17.9 H 50
581002B02500G 17.4 V 61
581102B02500G 16.8 V 61
513002B02500G 13.4 V 58
531002B02500G 13.4 V 59
531002V02500G 13.4 V 59
533802B02554G 13.0 V 50
533002B02551G 13.0 V 55
SW25-6G 13.0 V 59
581202B02500G 12.8 V 61
SW25-2G 11.4 V 56
SW25-4G 11.4 V 56
533902B02554G 11.0 V 50
533102B02551G 11.0 V 55
513102B02500G 11.0 V 58
531102B02500G 10.4 V 59
531102V02500G 10.4 V 59
Index by Device Cooled, Heat Sink Style, and Thermal Resistance
Low Cost Slide On Cooler Heat Sinks
579604B00000G 24.0 V 63
579604B03300G 24.0 V 63
579704B00000G 24.0 V 63
579704B03300G 24.0 V 63
574204B00000G 16.8 V 63
574204B03300G 16.8 V 63
Low Profile Hat Section Heat Sink
506304B00000G 14.4 H–V 63
Space Saving Staggered Heat Sink
6034DG 8.3 V 64
Channel Style Heat Sink
593101B03600G 8.6 V 62
Dual Extruded Heat Sinks
533721B02552G 5.7 V 57
533421B02552G 5.0 V 57
533521B02552G 4.5 V 57
533621B02552G 3.8 V 57
Dual High Rise Style Heat Sinks
530161B00162G 4.4 V 54
530861B05162G 4.4 V 54
Extruded Heat Sinks
581001B02500G 19.6 V 61
581101B02500G 16.8 V 61
513001B02500G 13.4 V 58
533001B02551G 13.0 V 55
581201B02500G 12.8 V 61
SW25-2G 11.4 V 56
SW25-4G 11.4 V 56
533101B02551G 11.0 V 55
513101B02500G 11.0 V 58
SW38-2G 10.2 V 56
SW38-4G 10.2 V 56
533201B02551G 9.0 V 55
513201B02500G 9.0 V 58
SW50-2G 8.8 V 56
SW50-4G 8.8 V 56
YB32-4G 8.4 V 61
533301B02551G 8.0 V 55
530001B02500G 8.0 V 56
513301B02500G 8.0 V 58
BW63-4G 7.4 V 58
BW38-2G 7.2 V 58
BW38-4G 7.2 V 58
SW63-2G 7.0 V 56
SW63-4G 7.0 V 56
6380BG 6.8 V 60
BW50-2G 5.8 V 58
BW50-4G 5.8 V 58
6381BG 5.8 V 60
533701B02552G 5.7 V 57
6396BG 5.6 V 60
6396B-P2G 5.6 V 60
529701B02500G 5.5 V 56
533401B02552G 5.0 V 57
529801B02500G 5.0 V 56
BW63-2G 4.7 V 58
529901B02500G 4.5 V 56
533501B02552G 4.5 V 57
6398BG 4.4 V 60
6398B-P2G 4.4 V 60
6382BG 4.2 V 60
533601B02552G 3.8 V 57
6399BG 3.3 V 60
6399B-P2G 3.3 V 60
6400BG 2.7 V 60
6400B-P2G 2.7 V 60
6374BG 5.0 V 61
TO-218 TO-220
TO-202 CONTINUED
Board
Part Number θn Mounting Page
Board
Part Number θn Mounting Page
Board
Part Number θn Mounting Page
NEED HIGHER PERFORMANCE?
Aavid also offers the Max Clip
SystemTM for discrete power
semiconductors featuring simple
assembly and high reliability. sales.na@aavid.com www.shopaavid.com
8
INDEX
SW38-2G 10.2 V 56
SW38-4G 10.2 V 56
SW38-6G 10.0 V 59
534002B02554G 9.0 V 50
533202B02551G 9.0 V 55
513202B02500G 9.0 V 58
SW50-2G 8.8 V 56
SW50-4G 8.8 V 56
YB32-4G 8.4 V 61
533302B02551G 8.0 V 55
530002B02500G 2.6 V 56
513302B02500G 8.0 V 58
531302B02500G 8.0 V 59
531302V02500G 8.0 V 59
531202V02500G 7.5 V 59
531202B02500G 7.5 V 59
BW38-2G 7.2 V 58
BW38-4G 7.2 V 58
SW63-2G 7.0 V 56
SW63-4G 7.0 V 56
BW50-2G 5.8 V 58
BW50-4G 5.8 V 58
533702B02552G 5.7 V 57
6396BG 5.6 V 60
6396B-P2G 5.6 V 60
532602B02500G 5.5 V 50
529702B02500G 5.5 V 56
533402B02552G 5.0 V 57
532702B02500G 4.8 V 50
BW63-2G 4.7 V 58
BW63-4G 4.7 V 58
529902B02500G 4.5 V 56
533502B02552G 4.5 V 57
6398BG 4.4 V 60
6398B-P2G 4.4 V 60
532802B02500G 4.2 V 50
533602B02552G 3.8 V 57
529802B02500G 3.7 V 56
6399BG 3.3 V 60
6399B-P2G 3.3 V 60
6400BG 2.7 V 60
6400B-P2G 2.7 V 60
Hat Section Heat Sinks
6237BG 25.0 H 42
6237PBG 25.0 H 42
TV96G 24.0 H 53
7137DG 20.8 V 42
7140DG 20.8 H 42
506902B00000G 20.0 V 42
TV97G 20.0 H–V 53
507002B00000G 15.6 H–V 42
507102B00000G 15.6 H–V 42
507222B00000G 9.6 H 42
High Rise Style Heat Sinks
530102B00100G 6.3 V 54
530102B00150G 6.3 V 54
530802B05100G 6.3 V 54
530802B05150G 6.3 V 54
530402B00100G 6.3 V 55
530402B00150G 6.3 V 55
Plug In Style Heat Sinks
576802B00000G 27.3 V 52
576802V00000G 32.6 V 52
576802U00000G 32.6 V 52
576802B03100G 27.3 H 52
576802V03100G 32.6 H 52
576802U03100G 32.6 H 52
576802B04000G 27.3 V 52
576802V04000G 32.6 V 52
576802U04000G 32.6 V 52
591202B00000G 26.8 H-V 51
591202B03100G 26.8 H 51
591202B04000G 26.8 V 51
591302B00000G 26.8 H-V 51
591302B02800G 26.8 V 51
591302B04000G 26.8 H 51
PF432G 20.3 V 52
PF433G 20.3 V 52
PF434G 20.3 H 52
PF435G 20.3 V 52
PF436G 20.3 H 52
566902B00000G 18.8 H-V 53
566902B03100G 18.8 H 53
566902B04000G 18.8 V 53
Slide On Heat Sinks
PF730G 35.8 V 65
PF732G 35.8 V 65
PF720G 28.9 V 44
PF723G 28.9 V 44
PF752G 23.7 V 44
574402B00000G 23.2 H-V 45
574402B03200G 23.2 H 45
574102B00000G 23.2 H–V 45
574102B03300G 23.2 V 45
574602B00000G 21.6 H-V 45
574602B03300G 21.6 V 45
574502B00000G 21.2 H-V 45
574502B03300G 21.2 V 45
PF750G 20.3 V 44
PF758G 17.3 V 44
574902B00000G 16.0 H-V 45
574902B03300G 16.0 V 45
Snap Down Style Heat Sinks
575102B00000G 16.8 H–V 46
579302B00000G 16.8 V 46
579402B00000G 16.8 V 46
Space Saving Heat Sinks
542502B00000G 24.0 H 49
542502D00000G 24.0 H 49
592502B03400G 22.0 V 49
592502U03400G 22.0 V 49
6025DG 17.9 V 48
6022PBG 16.7 V 47
6022BG 16.7 V 47
6225B-MTG 15.0 V 47
593202B03500G 10.4 V 48
6232B-MTG 10.0 V 48
6232PB-MTG 10.0 V 48
6032DG 8.3 V 47
Square Basket Heat Sink
569022B00000G 5.5 H 42
Dual Extruded Heat Sinks
533721B02552G 5.7 V 57
533421B02552G 5.0 V 57
533521B02552G 4.5 V 57
533621B02552G 3.8 V 57
Dual High Rise Style Heat Sinks
530161B00162G 4.4 V 54
530861B05162G 4.4 V 54
Extruded Heat Sinks
513001B02500G 13.4 V 58
533001B02551G 13.0 V 55
SW25-2G 11.4 V 56
SW25-4G 11.4 V 56
533101B02551G 11.0 V 55
513101B02500G 11.0 V 58
SW38-2G 10.2 V 56
SW38-4G 10.2 V 56
533201B02551G 9.0 V 55
513201B02500G 9.0 V 58
SW50-2G 8.8 V 56
SW50-4G 8.8 V 56
YB32-4G 8.4 V 61
533301B02551G 8.0 V 55
530001B02500G 8.0 V 56
513301B02500G 8.0 V 58
BW38-2G 7.2 V 58
BW38-4G 7.2 V 58
SW63-2G 7.0 V 56
SW63-4G 7.0 V 56
6380BG 6.8 V 60
BW50-2G 5.8 V 58
BW50-4G 5.8 V 58
6381BG 5.8 V 60
533701B02552G 5.7 V 57
6396BG 5.6 V 60
6396B-P2G 5.6 V 60
529701B02500G 5.5 V 56
533401B02552G 5.0 V 57
6374BG 5.0 V 61
529801B02500G 5.0 V 56
BW63-2G 4.7 V 58
BW63-4G 4.7 V 58
529901B02500G 4.5 V 56
533501B02552G 4.5 V 57
6398BG 4.4 V 60
6398B-P2G 4.4 V 60
6382BG 4.2 V 60
533601B02552G 3.8 V 57
6399BG 3.3 V 60
6399B-P2G 3.3 V 60
6400BG 2.7 V 60
6400B-P2G 2.7 V 60
Hat Section Heat Sinks
TV96G 24.0 H 53
TV97G 20.0 H–V 53
High Rise Style Heat Sinks
530101B00100G 6.3 V 54
530101B00150G 6.3 V 54
530801B05100G 6.3 V 54
530801B05150G 6.3 V 54
530401B00100G 6.3 V 55
530401B00150G 6.3 V 55
Plug In Style Heat Sinks
576802B00000G 27.3 H–V 52
576802V00000G 32.6 H–V 52
576802U00000G 32.6 H–V 52
576802B03100G 27.3 H 52
576802V03100G 32.6 H 52
576802U03100G 32.6 H 52
576802B04000G 27.3 V 52
576802V04000G 32.6 V 52
576802U04000G 32.6 V 52
591202B00000G 26.8 H-V 51
591202B03100G 26.8 H 51
591202B04000G 26.8 V 51
591302B00000G 26.8 H-V 51
591302B02800G 26.8 V 51
591302B04000G 26.8 H 51
566902B00000G 18.8 H-V 53
566902B03100G 18.8 H 53
566902B04000G 18.8 V 53
PF432G 20.3 V 52
PF433G 20.3 V 52
PF434G 20.3 H 52
PF435G 20.3 V 52
PF436G 20.3 H 52
Index by Device Cooled, Heat Sink Style, and Thermal Resistance
TO-247
TO-262
TO-220 CONTINUED
Board
Part Number θn Mounting Page
Board
Part Number θn Mounting Page
Board
Part Number θn Mounting Page
KEY
H = Horizontal mount
V = Vertical mount
H–V = Either horizontal or vertical
depending on device leads
θn= Natural convection thermal resistance
based on a 75°C heat sink temperature rise
sales.na@aavid.com www.shopaavid.com
9
HOW TO SELECT A HEAT SINK
The basic equation for heat transfer or power dissipation may be stated as follows:
Where:
PD = the power dissipated by the semiconductor device in watts.
ΔT = the temperature difference of driving potential which causes the flow of heat.
ΣRθ
= the sum of the thermal resistances of the heat flow path across which ΔT exists. The above relationship may be stated in the following forms:
The above equations are generally used to determine the required thermal resistance of the heat sink (RθSA),
since the heat dissipation, maximum junction and/or case temperature, and ambient temperature are known or set.
How To Select a Heat Sink
Where:
TJ =the junction temperature in °C (maximum is usually stated by the manufacturer of the semiconductor device).
TC = case temperature of the semiconductor device in °C.
TS = temperature of the heat sink mounting surface in thermal contact with the semiconductor device in °C.
TA = ambient air temperature in °C.
RθJC = thermal resistance from junction to case of the semiconductor device in °C per watt
(usually stated by manufacturer of semiconductor device).
RθCS = thermal resistance through the interface between the semiconductor device
and the surface on which it is mounted in °C per watt.
RθSA = thermal resistance from mounting surface to ambient or thermal resistance of heat sink in °C per watt.
Figure 1 indicates the location of the various heat
flow paths, temperatures and thermal resistances.
The common practice is to represent the system with
a network of resistances in series as shown in Figure 2.
Atmosphere
or ambient
Mounting surface
(cooler/dissipator)
Semiconductor case
Junction
(heat source)
Interface
Heat flow path mounting
surface to ambient, equation (3)
Heat flow path case
to ambient equation (2)
Heat flow path junction
to ambient, equation (1)
PDPD
TA
RθSA
RθCS
RθJC
TS
TC
TA
TJ
TJ–TA
PD =
RθJC + RθCS + RθSA
TC–TA
PD =
RθCS + RθSA
TS–TA
PD =
RθSA
ΔT
PD =ΣRθ
RθCS
RθJC
TSTA
T
J
RθSA
TC
FIGURE 1 FIGURE 2
How to select a heat sink
sales.na@aavid.com www.shopaavid.com
10
HOW TO SELECT A HEAT SINK
Find a heat sink to keep a TO-220 device below the maximum
150 °C junction temperature in forced convection at 400 ft/min.
Device must be electrically insulated and mounted with a labor
saving clip.
Given:
PD= 12 watts
RθJC = 2.5°C/W (from semiconductor manufacturer)
TJmax = 140°C (from semiconductor manufacturer)
TAmax = 50°C
A Hi-Flow® pad works great with clip mounting and provides the
necessary electrical insulation.Thermal resistance for
Hi-Flow® at low pressure is 1.15°C/W (from page 87).
Using equation 1, solve for RθSA
RθSA = 140 – 50 - (2.5 + 1.15) = 3.85°C/W
12
Many styles are available. If board space is a concern,
533202B02551G (pg 55) meets the requirements.
According to the above graph, an airflow of 400 ft/min results
in a thermal resistance of 3°C/W.This is less than the required
thermal resistance of 3.85°C/W and is therefore acceptable
under these airflow conditions.
If height is a concern, 533702B02552G would meet the
requirements and is only 1.0”tall
Find a space saving heat sink to keep a TO-220 device below the
maximum 150°C junction temperature in natural convection. Device
will be screw mounted with an electrically conductive interface.
Given:
PD= 6 watts
RθJC = 3°C/W (from semiconductor manufacturer)
TJmax = 150°C (from semiconductor manufacturer)
TAmax = 65°C
A KonduxTM pad is a good choice for electrically conductive
applications.Thermal resistance for KonduxTM can be determined
from the following graph.
Example B
Example A
Typical TO-220 Performance
Screw Torque (in-lb)
0.00
012 3 4 5
R (ºC/W)
CS
0.10
0.20
0.30
0.40
0.50
0.60
6
How To Select a Heat Sink
At 2 in-lb of torque the thermal resistance
is approximately RθCS = 0.5°C/W
Using equation 1, solve for RθSA
RθSA = 150 – 65 - ( 3 + 0.5) = 10.7°C/W
6
The Index by Heat Sink Style on page 8 lists space saving heat sinks.
Several models are in the 10 °C/W range. Choose the one that best
fits the application and verify thermal resistance from graph.
Part number 593202B03500G shows
a 60 °C temperature rise at 6 watts.
RθSA = 60 = 10.0°C/W
6
Which meets the above requirement in natural convection.
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
0 2 4 6 8 10
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
02 4 6 810
8
6
2
4
0
0400
200 600 800 1000
53330X
53320X
Mounting Surface Temp
Rise Above Ambient—°C
Hi-Flow®is a trademark of the Bergquist Company
sales.na@aavid.com www.shopaavid.com
11
READING A THERMAL PERFORMANCE GRAPH
The performance graphs you will see in this
catalog (see graph 579802) are actually a
composite of two separate graphs which
have been combined to save space. The small
arrows on each curve indicate to which axis
the curve corresponds.Thermal graphs are
published assuming the device to be cooled
is properly mounted and the heat sink is in
its recommended mounting position.
GRAPH A is used to show heat sink perform-
ance when used in a natural convection envi-
ronment (i.e. without forced air). This graph starts in the lower left hand corner with the horizontal axis representing the heat dissipa-
tion (watts) and the vertical left hand axis representing the rise in heat sink mounting surface temperature above ambient (°C). By knowing the power to be dissipated, the temperature rise of the mounting surface can be predicted. Thermal resistance in natu-
ral convection is determined by dividing this temperature rise by the power input (°C/W).
EXAMPLE A: Aavid part number 579802 is to
be used to dissipate 3 watts of power in
natural convection. Because we are dealing
with natural convection, we refer to graph
“A”. Knowing that 3 watts are to be dis-
sipated, follow the grid line to the curve and find that at 3 watts there is a temperature rise of 75°C. To get the thermal resistance, divide the temperature rise by the power
dissipated, which yields 25°C/W.
GRAPH B is used to show heat sink per-
formance when used in a forced convec-
tion environment (i.e. with forced air flow
through the heat sink).This graph has its
origin in the top right hand corner with
the horizontal axis representing air velocity
over the heat sink LFM* and the vertical
axis representing the thermal resistance of
the heat sink (°C/W). Air velocity is calculat-
ed by dividing the output volumetric flow
rate of the fan by the cross-sectional area
of the outflow air passage.
EXAMPLE B: For the same application
we add a fan which blows air over the heat
sink at a velocity of 400 LFM.
The addition of a fan indicates the use of
forced convection and therefore we refer
to graph “B”. This resistance of 9.50°C/W is
then multiplied by the power to be dissi-
pated, 3 watts. This yields a temperature
rise of 28.5°C.
CONVERTING VOLUME
TO VELOCITY
Although most fans are normally rated and
compared at their free air delivery at zero
back pressure, this is rarely the case in most
applications. For accuracy, the volume of
output must be derated 60%–80% for
the anticipation of back pressure.
EXAMPLE: The output air volume
of a fan is given as 80 CFM. The output area
is 6 inches by 6 inches or 36 in2or 25 ft2.
To find velocity:
80
0.25
Velocity is 320 LFM, which at 80%, derates to 256 LFM.
DESIGN ASSISTANCE
Aavid can assist in the design of heat sinks
for both forced and natural convection
applications. Contact us for help with your
next thermal challenge. For more information, visit our web site at:
www.shopaavid.com
Heat Dissipated—Watts
0
20
40
60
80
100
012 34 5
Mounting Surface Temp
Rise Above Ambient—°C
Air Velocity—Feet Per Minute
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
16
12
4
8
0
0400
200 600 800 1000
GRAPH B
Velocity (LFM) =
Velocity = = 320
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
20
40
60
80
100
012 34 5
16
12
4
8
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
GRAPH A
579802
Reading a Thermal Performance Graph
Velocity (LFM)* = Volume (CFM)**
area (ft2)
* Linear feet per minute
** Cubic feet per minute
Volume (CFM)
area (ft2)
sales.na@aavid.com www.shopaavid.com
12
HEAT SINKS FOR IC PACKAGES
ORDERING INFORMATION
Solder anchor attachment
Aavid's unique Solder anchor attachment method
uses two or four small Solder anchors attached to
the circuit card and a wire spring clip to securely
fasten the heat sink to the device.This method is
rugged, compact and allows for easy removal in
case of rework.
All products include a phase change pad suitable
for most IC package styles to optimize thermal
performance. Models are available with a single
or dual spring clips for additional thermal interface
pressure. Solder anchors are ordered separately.
IC Pkg Size (mm) IC Pkg Style Part Number “W” (mm) “L” (mm) “H” (mm) “A”(mm) θn1θf2Finish Fig. 4PCB Fig.4#Anchors3
23 x 23 All 374024B60023G 23.00 23.00 10.00 49.70 40.00 11.69 Black anodize 1 A 2
23 x 23 All 374124B60023G 23.00 23.00 18.00 49.70 23.40 7.39 Black anodize 1 A 2
23 x 23 All 374224B60023G 23.00 23.00 25.00 49.70 19.70 6.37 Black anodize 1 A 2
27 x 27 All 374324B60023G 27.00 27.00 10.00 49.70 30.60 9.35 Black anodize 1 A 2
27 x 27 All 374424B60023G 27.00 27.00 18.00 49.70 20.30 6.46 Black anodize 1 A 2
27 x 27 All 374524B60023G 27.00 27.00 25.00 49.70 16.50 5.47 Black anodize 1 A 2
35 x 35 Flip chip 10-5634-01G 31.00 34.90 23.00 11.50 4.20 Black anodize 2 C 2
35 x 35 Flip chip 10-THMA-01G 31.00 34.90 35.00 10.70 3.95 Black anodize 2 C 2
35 x 35 All 374624B60024G 35.00 35.00 10.00 62.30 23.40 7.55 Black anodize 1 B 2
35 x 35 All 374724B60024G 35.00 35.00 18.00 62.30 15.30 5.15 Black anodize 1 B 2
35 x 35 All 374824B60024G 35.00 35.00 25.00 62.30 12.00 4.27 Black anodize 1 B 2
37.5 x 37.5 Flip chip 10-BRD2-01G 35.70 37.30 23.00 11.50 4.20 Clear anodize 2 B 2
37.5 x 37.5 Flip chip 10-BRD1-01G 37.50 37.50 23.00 10.10 3.83 Black anodize 2 B 2
37.5 x 37.5 Flip chip 10-BRD1-03G 37.50 37.50 23.00 10.10 3.83 Black anodize 3 D 4
37.5 x 37.5 Flip chip 10-BRD1-04G 37.50 37.50 23.00 10.10 3.83 Black anodize 2 B 2
37.5 x 37.5 Flip chip 10-BRD1-05G 37.50 37.50 23.00 10.10 3.83 Clear anodize 3 D 4
37.5 x 37.5 Flip chip 10-BRD1-07G 37.50 37.50 23.00 10.10 3.83 Clear anodize 2 B 2
40 x 40 All 374924B60024G 40.00 40.00 10.00 62.30 20.30 6.46 Black anodize 1 B 2
40 x 40 All 375024B60024G 40.00 40.00 18.00 62.30 12.20 4.34 Black anodize 1 B 2
42 x 40 All 375124B60024G 40.00 40.00 25.00 62.30 10.30 3.83 Black anodize 1 B 2
42.5 x 42.5 Flip chip 10-CLS1-01G 42.30 42.30 23.00 8.80 3.51 Black anodize 2 E 2
42.5 x 42.5 Flip chip 10-CLS2-01G 42.30 42.30 35.00 8.30 3.44 Black anodize 2 E 2
BGA–Solder Anchor
1. Natural convection thermal resistance based on a 75º C heat sink temperature rise.
2. Force convection thermal resistance based on an entering 1.0 m/s (200LFM) airflow.
3. Solder anchors are sold separately refer to drawing above.
4. Solder anchor mechanical drawings and board mounting drawings see page 13.
7.19
(0.283)
7.62
(0.300)
5.08
(0.200)
0.64
(0.025)
"A"
2.49
(0.098)
SOLDER ANCHOR
Part Number PCB Thickness (mm) “A”Dim (mm)
125700D00000G 1.60 3.61
125800D00000G 2.54-2.79 4.70
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13
HEAT SINKS FOR IC PACKAGES
"L"
"W"
"H"
"A"
"L" "H"
"W" 12.70
(0.500)
54.74
(2.155)
12.70
(0.500)
BGA–Solder Anchor
FIGURE 3
FIGURE 2
FIGURE 1
2X
35.56
(1.400)
17.78
(0.700) 5.08
(0.200)
53.34
(2.100)
26.67
(1.050)
0.97 ± 0.03
(0.038 ± 0.001)
ø
PLATED THROUGH
HOLES 4 X
55.88
(2.200)
PLATED THROUGH
HOLES 4X
0.97 0.03
(0.038 0.001)
66.04
(2.600)
33.02
(1.300)
5.08
(0.200)
27.94
(1.100)
Ø
2X
24.13
(0.950)
5.08
(0.200) 4X
66.04
(2.600) 2X
33.02
(1.300)
Ø
0.97 ± 0.03
(0.038 ± 0.001)
PLATED THROUGH
HOLES 2X
48.26
(1.900) 2X
Ø 0.97 0.03
(0.038 0.001)
45.72
(1.800)
22.86
(0.900) 5.08
(0.200)2X
58.42
(2.300)
29.21
(1.150)
PLATED THROUGH
HOLES 4X
2x
24.13
(0.950)
48.26
(1.900)
66.04
(2.600)
33.02
(1.300)
5.08
(0.200)
0.97 0.03
(0.038 0.001)
PLATED THROUGH
HOLES 4X
Ø
FIGURE A FIGURE B
FIGURE C FIGURE D FIGURE E
45.88
(1.806)
"H"
"L"
"W"
15.00
(0.591)
15.00
(0.591)
Solder anchor heat sinks mechanical drawings
Board mounting pattern information for solder anchor heat sinks
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14
HEAT SINKS FOR IC PACKAGES
ORDERING INFORMATION
Push pin attachment
Push pin heat sinks require two 3.10mm holes in the circuit card
to quickly attach the heat sink over the device.The one piece
design makes assembly a snap. Pressure is maintained by the
tension of the push pin coil springs to ensure even pressure
across the device. Push pins provide a greater margin of reliabil-
ity in applications where gravity or vibration may cause tapes or
adhesives to fail.The addition of a phase change pad optimizes
thermal performance.
IC Pkg. Size (mm) Part Number “W” (mm) “L” (mm) “H” (mm) “S” (mm) “T” (mm) θn2θf3Finish Fig. PCB Fig.1Pin Style Pad
28 x 28 10-6326-27G 28.00 28.00 6.00 46.60 6.50 44.10 13.13 Black anodize 1 A Plastic Yes
28 x 28 10-6326-28G 28.00 28.00 6.00 46.60 6.50 44.10 13.13 Black anodize 1 A Brass Yes
28 x 28 10-6327-01G 28.50 28.50 10.00 46.60 7.00 30.60 9.26 Black anodize 2 A Plastic No
35 x 35 10-TNT2-01G 36.10 48.00 11.60 6.50 18.80 6.13 Black anodize 3 D Plastic No
37.5 x 37.5 10-5597-02G 37.40 37.40 6.00 59.00 6.50 33.30 9.91 Green anodize 5 B Plastic No
37.5 x 37.5 10-5597-22G 37.40 37.40 6.00 59.00 6.50 33.30 9.91 Gold anodize 5 B Plastic Yes
37.5 x 37.5 10-5597-33G 37.40 37.40 6.00 59.00 6.50 33.30 9.91 Gold anodize 5 B Brass Yes
37.5 x 37.5 10-5607-04G 37.40 37.40 10.00 59.00 7.00 22.10 6.99 Black anodize 5 B Plastic Yes
37.5 x 37.5 10-5607-05G 37.40 37.40 10.00 59.00 7.00 22.10 6.99 Black anodize 5 B Brass Yes
37.5 x 37.5 372924M02000G 37.40 37.40 6.00 59.00 6.50 32.60 9.91 Green anodize 5 B Plastic No
45 x 45 10-L4LB-03G 45.20 41.40 11.89 58.80 8.00 16.70 5.60 Black anodize 4 C Plastic Yes
45 x 45 10-L4LB-05G 45.20 41.40 11.89 58.80 8.00 16.70 5.60 Black anodize 4 C Brass Yes
45 x 45 10-L4LB-11G 45.20 41.40 11.70 58.80 8.00 14.20 4.91 Black anodize 4 C Plastic No
BGA–Push Pin Attachment
1. Push pin mechanical drawings and board mounting drawings see page 15
2. Natural convection thermal resistance based on a 75° C heat sink temperature rise.
3. Forced convection thermal resistance based on an entering 1.0 m/s (200LFM) airflow.
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15
HEAT SINKS FOR IC PACKAGES
Mechanical drawings
"W"
"S"
"L"
"T" "H"
"H"
"W"
"L"
"T" 46.60
(1.835)
"S"
"L"
"W"
"H"
"T"
10.69
(0.421)
20.02
(0.788)
FIGURE 4
BGA–Push Pin Attachment
41.50
(1.634)
41.70
(1.642)
"L"
"W" "H"
"T"
FIGURE 3FIGURE 2
FIGURE 1
Ø
3.10 0.03
(0.122 0.001)
THROUGH HOLES
(UNPLATED) 2X
32.95
(1.297)
32.95
(1.297)
16.48
(0.649)
16.48
(0.649)
46.60
(1.830) REF
20.85
(0.821)
41.70
(1.642)
41.50
(1.634)
20.75
(0.817)
Ø
3.10 ± 0.03
(
Ø
0.122 ± 0.001)
THROUGH HOLES
(UNPLA TED) 2X
25.40
(1.000)
50.80
(2.000)
20.02
(0.788)
10.01
(0.394)
Ø
3.10 ± 0.03
(
Ø
0.122 ± 0.001)
THROUGH HOLES
(UNPLATED) 2X
41.74
(1.643)
20.87
(0.822)
20.87
(0.822)
41.74
(1.643)
59.00
(2.320)
3.10 ± 0.030
(0.122 ± 0.001)
THROUGH HOLES
REF
ø
(UNPLATED) 2X
FIGURE A FIGURE B
FIGURE C FIGURE D
Board mounting pattern information
"W"
"S"
"L"
"T"
"H"
FIGURE 5
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16
HEAT SINKS FOR IC PACKAGES
Heat sinks for plastic BGA packages
IC Pkg. Size (mm) IC Pkg. Style Part Number “W” (mm) “L” (mm) “H” (mm) θn2θf3Finish Tape code1
10 x 10 Plastic 375324B00035G 10.20 10.20 10.20 71.40 21.20 Black anodize 35
15 x 15 Plastic 375424B00034G 15.20 15.20 6.40 62.50 17.60 Black anodize 34
23 x 23 Plastic 374024B00035G 23.00 23.00 10.00 40.00 11.69 Black anodize 35
23 x 23 Plastic 374124B00035G 23.00 23.00 18.00 23.40 7.39 Black anodize 35
23 x 23 Plastic 374224B00035G 23.00 23.00 25.00 19.70 6.370 Black anodize 35
25 x 25 Plastic 335224B00034G 25.00 25.00 9.90 34.00 10.39 Black anodize 34
27 x 27 Plastic 374324B00035G 27.00 27.00 10.00 30.60 9.35 Black anodize 35
27 x 27 Plastic 374424B00035G 27.00 27.00 18.00 20.30 6.46 Black anodize 35
27 x 27 Plastic 374524B00035G 27.00 27.00 25.00 16.50 5.47 Black anodize 35
28 x 28 Plastic 373024B00034G 27.90 27.90 8.90 33.30 10.00 Black anodize 34
28 x 28 Plastic 2327B-CP50G 27.90 28.10 15.20 23.40 7.43 Black anodize 34
31 x 31 Plastic 335824B00034G 30.00 30.00 9.40 29.40 9.11 Black anodize 34
35 x 35 Plastic 371824B00034G 35.00 35.00 7.00 31.90 9.67 Black anodize 34
35 x 35 Plastic 374624B00035G 35.00 35.00 10.00 23.40 7.55 Black anodize 35
35 x 35 Plastic 374724B00035G 35.00 35.00 18.00 15.30 5.15 Black anodize 35
35 x 35 Plastic 374824B00035G 35.00 35.00 25.00 12.00 4.27 Black anodize 35
35 x 35 Plastic 372024B00034G 35.00 35.00 27.90 11.90 4.28 Black anodize 34
40 x 40 Plastic 374924B00035G 40.00 40.00 10.00 20.30 6.46 Black anodize 35
40 x 40 Plastic 364424B00034G 40.10 40.00 11.40 18.40 6.02 Black anodize 34
40 x 40 Plastic 375024B00035G 40.00 40.00 18.00 12.20 4.34 Black anodize 35
40 x 40 Plastic 375124B00035G 40.00 40.00 25.00 10.30 3.83 Black anodize 35
BGA–Tape Attachment
Pressure sensitive, thermally conductive adhesive tape
easily and reliably bonds a heat sink to an integrated
circuit package.Tapes provide high thermal conductiv-
ity and exceptional bonding properties. Adhesives are
formulated for plastic and metal/ceramic packages.
"L" "H"
"W"
Material: Aluminum
ORDERING INFORMATION
1. For tape specifications see page 88
2. Natural convection thermal resistance based on a 75° C heat sink temperature rise.
3. Forced convection thermal resistance based on an entering 1.0 m/s (200LFM) airflow.
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17
HEAT SINKS FOR IC PACKAGES
ORDERING INFORMATION
IC Pkg. Size (mm) IC Pkg. Style Part Number “W” (mm) “L” (mm) “H” (mm) θn2θf3Finish Tape Code1
10 x 10 Metal / Ceramic 375224B00032G 10.20 11.10 10.20 71.40 21.20 Black anodize 32
23 x 23 Metal / Ceramic 374024B00032G 23.00 23.00 10.00 40.00 11.69 Black anodize 32
23 x 23 Metal / Ceramic 374124B00032G 23.00 23.00 18.00 23.40 7.39 Black anodize 32
23 x 23 Metal / Ceramic 374224B00032G 23.00 23.00 25.00 19.70 6.370 Black anodize 32
25 x 25 Metal / Ceramic 335224B00032G 25.00 25.00 9.90 34.00 10.39 Black anodize 32
27 x 27 Metal / Ceramic 335324B00032G 26.90 26.90 11.40 27.70 8.71 Black anodize 32
27 x 27 Metal / Ceramic 374324B00032G 27.00 27.00 10.00 30.60 9.35 Black anodize 32
27 x 27 Metal / Ceramic 374424B00032G 27.00 27.00 18.00 20.30 6.46 Black anodize 32
27 x 27 Metal / Ceramic 374524B00032G 27.00 27.00 25.00 16.50 5.47 Black anodize 32
28 x 28 Metal / Ceramic 373024B00032G 27.90 27.90 8.89 33.30 10.00 Black anodize 32
28 x 28 Metal / Ceramic 373224M00032G 28.00 28.00 6.00 44.10 13.13 Green anodize 32
28 x 28 Metal / Ceramic 2327B-TACHG 27.90 28.10 15.20 23.40 7.43 Black anodize 32
31 x 31 Metal / Ceramic 335724B00032G 30.10 30.10 6.60 35.70 10.84 Black anodize 32
31 x 31 Metal / Ceramic 335824B00032G 30.00 30.00 9.40 29.40 9.11 Black anodize 32
32.5 x 32.5 Metal / Ceramic 2338B-TACHG 33.00 31.40 12.50 23.10 7.23 Black anodize 32
35 x 35 Metal / Ceramic 371824B00032G 35.00 35.00 7.00 31.90 9.67 Black anodize 32
35 x 35 Metal / Ceramic 374624B00032G 35.00 35.00 10.00 23.40 7.55 Black anodize 32
35 x 35 Metal / Ceramic 374724B00032G 35.00 35.00 18.00 15.30 5.15 Black anodize 32
35 x 35 Metal / Ceramic 374824B00032G 35.00 35.00 25.00 12.00 4.27 Black anodize 32
35 x 35 Metal / Ceramic 372024B00032G 35.00 35.00 27.90 11.90 4.28 Black anodize 32
37.5 x 37.5 Metal / Ceramic 373324M00032G 37.40 37.40 6.00 32.60 9.91 Green anodize 32
37.5 x 37.5 Metal / Ceramic 2319B-TACHG 38.10 38.10 10.16 12.50 3.50 Black anodize 32
37.5 x 37.5 Metal / Ceramic 336624B00032G 38.10 38.10 16.00 15.30 5.15 Black anodize 32
40 x 40 Metal / Ceramic 374924B00032G 40.00 40.00 10.00 20.30 6.46 Black anodize 32
40 x 40 Metal / Ceramic 364424B00032G 40.10 40.00 11.40 18.40 6.02 Black anodize 32
40 x 40 Metal / Ceramic 375024B00032G 40.00 40.00 18.00 12.20 4.34 Black anodize 32
40 x 40 Metal / Ceramic 375124B00032G 40.00 40.00 25.00 10.30 3.83 Black anodize 32
42.5 x 42.5 Metal / Ceramic 2321B-TACHG 43.20 41.30 8.90 22.10 6.93 Black anodize 32
42.5 x 42.5 Metal / Ceramic 2332B-TACHG 43.20 41.30 16.50 12.90 4.53 Black anodize 32
45 x 45 Metal / Ceramic 2342B-TACHG 45.70 44.60 7.00 23.10 7.26 Black anodize 32
50 + Metal / Ceramic 3334B-TACHG 50.50 50.20 16.50 6.0 3.3 Black anodize 32
Heat sinks for metal/ceramic BGA packages
BGA–Tape Attachment
1. For tape specifications see page 88
2. Natural convection thermal resistance based on a 75° C heat sink temperature rise.
3. Forced convection thermal resistance based on an entering 1.0 m/s (200LFM) airflow.
"L" "H"
"W"
Material: Aluminum
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18
HEAT SINKS FOR IC PACKAGES
ORDERING INFORMATION
Clip attachment
Aavid's BGS Clip heat sinks provide a mechanical
attachment alternative to tape applications
where it is desirable to attach the heat sink
directly to the device.The unique clip uses
spring pressure to ensure even contact across
the device while the end plates firmly engage
the edge of the package, locking the heat sink
in place. Each heat sink uses pre-applied thermal
grease for optimum thermal performance.
IC Pkg. Size (mm) Part Number “W” (mm) “L” (mm) “H” (mm) IC Pkg. Style θn1θf2Interface Clip
27 x 27 2317B-EP11-BGS1G 26.14 20.47 15.24 All 32.60 9.94 EP11 BGS1
35 x 35 2518B-EP11-BGS2G 30.50 28.10 15.60 All 22.70 7.05 EP11 BGS2
42.5 x 42.5 2519B-EP11-BGS5G 34.50 31.40 15.60 All 19.70 6.30 EP11 BGS5
42.5 x 42.5 2520B-EP04-BGS5G 38.10 38.00 15.60 All 15.60 5.17 EP04 BGS5
42.5 x 42.5 2522B-EP04-BGS5G 38.10 38.00 10.16 All 22.10 6.94 EP04 BGS5
BGA–Clip Attachment
"H"
"W"
"L"
Material Description Adhesive Thermal Resistance Color Carrier “D” Dim “E” Dim
EP11 ThermalcoteTM grease with release liner None 0.18 White None 13.34 (0.525) 13.34 (0.525)
EP04 ThermalcoteTM grease with release liner None 0.03 White None 31.75 (1.250) 31.75 (1.250)
TAPE TYPE AND INTERFACE MATERIAL INFORMATION
For more information on ThermalcoteTM see page 113.
Material: Aluminum
Finish: Black Anodize
"D"
"E"
THERMALCOTETM
GREASE
PULL TAB
1. Natural convection thermal resistance based on a 75° C heat sink temperature rise.
2. Forced convection thermal resistance based on an entering 1.0 m/s (200LFM) airflow.
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19
HEAT SINKS FOR IC PACKAGES
ORDERING INFORMATION
Bi Directional
Designed for applications with airflow traveling
in a single direction, these heat sinks are suitable
for a variety of standard square IC packages.
Models are available with pre-applied thermal
tape for easy attachment to the IC. Epoxy attach
models are also available.
IC Pkg Size IC Pkg Style Part Number “W” (mm) “L” (mm) “H” (mm) θn3θf4Finish Attachment Tape Code 2
10 X 10 All 615653B00250G 6.00 6.00 5.00 142.58 76.26 Black anodize Epoxy1N/A
10 X 10 All 709203B00400G 10.00 10.00 10.00 55.98 29.94 Black anodize Epoxy1N/A
24 X 24 Metal 335114B00032G 24.00 24.00 24.00 13.60 7.27 Black anodize Tape 32
25 X 25 Metal 335214B00032G 25.00 25.00 10.00 10.00 5.35 Black anodize Tape 32
25 X 25 Metal 335211B00032G 25.00 25.00 10.00 10.00 5.35 Black anodize Tape 32
25 X 25 All 335214B00000G 25.00 25.00 10.00 10.00 5.35 Black anodize Epoxy1N/A
25 X 25 All 335211B00000G 25.00 25.00 10.00 10.00 5.35 Black anodize Epoxy1N/A
25 X 25 Plastic 335214B00034G 25.00 25.00 10.00 10.00 5.35 Black anodize Tape 34
27 X 27 Plastic 335314B00035G 27.00 27.00 11.00 10.00 5.35 Black anodize Tape 35
27 X 27 Metal 335314B00032G 27.00 27.00 11.00 10.00 5.35 Black anodize Tape 32
27 X 27 All 335314B00000G 27.00 27.00 11.00 10.00 5.35 Black anodize Epoxy1N/A
28 X 28 All 700353U01100G 28.00 28.00 9.00 18.49 9.89 Unfinished Epoxy1N/A
30 X 30 All 335814B00000G 30.00 30.00 9.00 10.50 5.61 Black anodize Epoxy1N/A
30 X 30 All 335714B00000G 30.00 30.00 7.00 15.20 8.13 Black anodize Epoxy1N/A
30 X 30 Metal 335814B00032G 30.00 30.00 9.00 9.20 4.92 Black anodize Tape 32
30 X 30 Metal 335714B00032G 30.00 30.00 7.00 15.20 8.13 Black anodize Tape 32
37.5 X 37.5 All 799403B01500G 38.00 38.00 10.00 12.21 6.53 Black anodize Epoxy1N/A
37.5 X 37.5 All 336314B00000G 36.00 36.00 17.00 11.00 5.88 Black anodize Epoxy1N/A
BGA – Bi Directional
"W"
"H"
"L"
1. Epoxy ordered separately for information on Epoxy see page 114,115.
2. For tape specifications see page 88.
3. Natural convection thermal resistance based on a 75°C heat sink temperature rise.
4. Forced convection thermal resistance based on an entering 1.0 m/s (200LFM) airflow.
Material: Aluminum
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20
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
ORDERING INFORMATION
5801 Slide on heat sink with staggered fins
Slide on heat sink with staggered fins
attaches to 8 pin DIP packages quickly and
easily.The heat sink features double spring
action and locking catch to firmly attach
the device creating a thermal conduction
path on both the top and bottom surfaces.
Available in two finishes.
10.54
(0.415)
14.27
(0.562)
5.33
(0.210)
6.35
(0.250)
LOCKING
CATCH
15.24
(0.600)
11.43
(0.450)
Part Number Finish
580100B00000G Black anodize
580100W00000G Black anodize with black paint on bottom side
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
20
40
60
80
100
0 0.4 0.8 1.2 1.6 2.0
16
12
4
8
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
6.35
(0.250)
15.34
(0.604)
REF
19.05
(0.750)
5.39
(0.212)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
100
0
20
40
60
80
100
0 0.4 0.8 1.2 1.6 2.0
80
60
20
40
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Angle fin heat sink is a simple low
cost solution for cooling DIP devices.
Suitable for 14 and 16 pin packages
and available in two finish options.
Easily attaches using thermal epoxy.
5010 Angle fin heat sink
5602, 5802 Slide on heat sink with angled fins
Slide on heat sink with angled fins
attaches to 14 and 16 pin DIP packages
quickly and easily.The heat sink features
double spring action and locking catch
to firmly attach the device creating a
thermal conduction path on both the
top and bottom surfaces. Available in
two finishes.
15.24
(0.600)
22.61
(0.890)
10.42
(0.410)
LOCKING
CATCH
21.34
(0.840)
5.08
(0.200)
"A"
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
20
40
60
80
100
0 0.4 0.8 1.2 1.6 2.0
16
12
4
8
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Part Number Device Pkg Style Finish “A” Dim
560200B00000G Ceramic Black anodize 7.87 (0.310)
560200W00000G Ceramic Black anodize with black paint on bottom side 7.87 (0.310)
580200B00000G Plastic Black anodize 6.35 (0.250)
580200W00000G Plastic Black anodize with black paint on bottom side 6.35 (0.250)
ORDERING INFORMATION
Material: 0.63 (0.025) Thick Aluminum
Finish: See Table
Material: 1.27 (0.050) Thick Aluminum
Finish: See Table
Material: 0.63 (0.025) Thick Aluminum
Finish: See Table
ORDERING INFORMATION
Part Number Finish
501000J00000G Pre black anodize*
501000B00000G Black anodize
DIPS
* Edges cut during the manufacturing process will be unfinished.
See page 110 for more information.
Grease
Epoxy
&
page112
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21
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
ORDERING INFORMATION
5803 Slide on heat sink with staggered fins
Slide on heat sink with staggered fins
attaches to 18 pin DIP packages quickly
and easily.The heat sink features double
spring action and locking catch to firmly
attach the device creating a thermal
conduction path on both the top and
bottom surfaces.
28.58
(1.125)
17.78
(0.700)
5.33
(0.210)
6.35
(0.250)
14.12
(0.556)
23.62
(0.930)
LOCKING CATCH
Part Number Description
580300B00000G Slide on heat sink with staggered fins
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
20
40
60
80
100
0 0.4 0.8 1.2 1.6 2.0
16
12
4
8
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Material: 0.63 (0.025) Thick Aluminum
Finish: Black Anodize
DIPS
5806 Slide on heat sink with staggered fins
Slide on heat sink with staggered fins
attaches to 28 pin DIP packages quickly
and easily.The heat sink features double
spring action and locking catch to firmly
attach the device creating a thermal
conduction path on both the top and
bottom surfaces.
42.67
(1.680)
37.47
(1.475)
25.40
(1.000)
14.86
(0.585)
12.70
(0.500)
13.72
(0.540)
LOCKING
CATCH
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
0 0.4 0.8 1.2 1.6 2.0
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
ORDERING INFORMATION
Part Number Description
580600B00000G Slide on heat sink with staggered fins
Material: 0.81 (0.032) Thick Aluminum
Finish: Black Anodize
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22
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
ORDERING INFORMATION
28.58
(1.125)
17.78
(0.700)
5.33
(0.210)
6.35
(0.250)
14.12
(0.556)
26.80
(1.055)
LOCKING CATCH
Part Number Description
580400B00000G Slide on heat sink with staggered fins
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
20
40
60
80
100
0 0.4 0.8 1.2 1.6 2.0
16
12
4
8
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Slide on heat sink with staggered fins
attaches to 20 pin DIP packages quickly
and easily.The heat sink features double
spring action and locking catch to firmly
attach the device creating a thermal
conduction path on both the top and
bottom surfaces.
5804 Slide on heat sink with staggered fins
Material: 0.63 (0.025) Thick Aluminum
Finish: Black Anodize
5805 Slide on heat sink with staggered fins
Slide on heat sink with staggered fins
attaches to 24 pin DIP packages quickly
and easily.The heat sink features double
spring action and locking catch to firmly
attach the device creating a thermal
conduction path on both the top and
bottom surfaces.
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
0 0.4 0.8 1.2 1.6 2.0
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
25.60
(1.008)
14.73
(0.580)
37.08
(1.460)
32.51
(1.280)
12.19
(0.480)
13.72
(0.540)
LOCKING
CATCH
ORDERING INFORMATION
Part Number Description
580500B00000G Slide on heat sink with staggered fins
Material: 0.81 (0.032) Thick Aluminum
Finish: Black Anodize
DIPS
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23
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
5085, 5086, 5087 Extruded epoxy attach on heat sink with straight fins
Extruded epoxy attach on heat sink
with straight fins attaches to 24, 28,
and 40 pin DIP packages quickly and
easily. May be added before or after
final board assembly. No additional
board space is required.
13.46
(0.530)
4.83
(0.190)
"A"
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
20
40
60
80
100
01 2 34 5
16
12
4
8
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
508600
508500
508700
ORDERING INFORMATION
Part Number DIP Package “A” Dim
508500B00000G 24 pin 31.75 (1.250)
508600B00000G 28 pin 36.83 (1.450)
508700B00000G 40 pin 50.80 (2.000)
Material: Aluminum
Finish: Black Anodize
6284 Extruded epoxy attach heat sink
Extruded epoxy attach heat sink
which requires no additional board
space is suitable for narrow DIP
packages. May be added before
or after final board assembly. No
additional board space is required.
Attaches to 28 pin DIP.
13.46
(0.530)
12.06
(0.475)
36.83
(1.450)
REF
REF
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
25
0
20
40
60
80
100
012 3 45
20
15
5
10
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
ORDERING INFORMATION
Part Number Description
6284BG Extruded epoxy attach heat sink for 28 pin DIP
Material: Aluminum
Finish: Black Anodize
DIPS
5011, 5012 Extruded epoxy attach heat sink with straight fins
Extruded epoxy attach heat sink with
straight fins attaches to 14 and 16 pin
DIP packages quickly and easily. May be
added before or after final board assembly.
No additional board space is required.
Available in two fin directions.
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
100
0
20
40
60
80
100
0.0 0.4 0.8 1.2 1.6 2.0
80
60
20
40
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
501200
501100
5
01
1
–50
1
2
19.05
(0.750)
REF
6.35
(0.250)
REF
4.82
(0.190)
ORDERING INFORMATION
Part Number Description Figure
501100B00000G Extruded epoxy attach heat sink with straight fins A
501200B00000G Extruded epoxy attach heat sink with straight fins B
Material: Aluminum
Finish: Black Anodize
4.83
(0.190)
18.57
(0.730)
6.35
(0.250)
FIGURE A FIGURE B
For epoxy information see pages 114-115.
For epoxy information see pages 114-115.
For epoxy information see pages 114-115.
Grease
Epoxy
&
page112
Grease
Epoxy
&
page112
Grease
Epoxy
&
page112
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24
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
ORDERING INFORMATION
5731 Surface mount heat sink for D-PAK (TO-252) package semiconductors
Surface mount heat sink for D-PAK
(TO-252) package semiconductors
remove the heat indirectly without
contacting the device like traditional
through hole heat sinks.The device
and the heat sink are soldered directly
to a modified drain pad creating a
thermal transfer path from package
tab to the heat sink.
1.3
(0.05)
8.00
(0.315)
22.86
(0.900)
10.16
(0.400)
10.41
(0.410)
8.13
(0.320)
Part Number Packaging
573100D00010G 13" Reel, 250 per reel
573100D00000G Bulk, 500 per bag
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
25
0
20
40
60
80
100
0.0 0.5 1.0 1.5 2.0 2.5
20
15
5
10
0
0400
200 600 800 1000
Case Temp Rise
Rise Above Ambient—°C
ORDERING INFORMATION
1.3
(0.05)
12.70
(0.500)
26.16
(1.030)
10.16
(0.400)
12.70
(0.500)
7.37
(0.290)
Part Number Packaging
573300D00010G 13" Reel, 250 per reel
573300D00000G Bulk, 500 per bag
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
10
20
30
40
50
0.0 0.5 1.0 1.5 2.0 2.5
16
12
4
8
0
0400
200 600 800 1000
Case Temp Rise
Rise Above Ambient—°C
Surface mount heat sink for D2 PAK
(TO-263) package semiconductors
remove the heat indirectly without
contacting the device like traditional
through hole heat sinks.The device
and the heat sink are soldered directly
to a modified drain pad creating a
thermal transfer path from package
tab to the heat sink.
5733 Surface mount heat sink for D2PAK (TO-263) package semiconductors
7106 Surface mount heat sink for D2 PAK (TO-263), power SO-10 (MO-184) and SO-10 package semiconductors
Surface mount heat sink for D2 PAK
(TO-263), power SO-10 (MO-184)
and SO-10 package semiconductors
remove the heat indirectly without
contacting the device like traditional
through hole heat sinks.The device
and the heat sink are soldered directly
to a modified drain pad creating a
thermal transfer path from package
tab to the heat sink.
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
012 3 45
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Part Number Packaging
7106D/TRG 13" Reel, 200 per reel
7106DG Bulk, 500 per bag
ORDERING INFORMATION
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
SMT
See page 25 for tape and reel information
Refer to Figure A and B on page 26 for board footprint information
See page 25 for tape and reel information
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
Refer to Figure A and B on page 26 for board footprint information
See page 25 for tape and reel information
Refer to Figure C on page 26 for board footprint information
25.91
(1.020)
10.16
(0.400)
7.62
(0.300)
9.52
(0.375)
14.99
(0.590)
10.92
(0.430)
14.99
(0.590)
5.33
(0.210)
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
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25
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
7109 Surface mount heat sink for D2 PAK (TO-263) package semiconductors
Surface mount heat sink for D2 PAK
(TO-263) package semiconductors
remove the heat indirectly without
contacting the device like traditional
through hole heat sinks.The device
and the heat sink are soldered directly
to a modified drain pad creating a
thermal transfer path from package
tab to the heat sink.
25.40
(1.000)
19.38
(0.763)
15.24
(0.600)
11.43
(0.450)
11.43
(0.450)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5
0
20
40
60
80
100
012 3 45
4
3
1
2
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
1.3
(0.05)
12.70
(0.500)
10.16
(0.400) 7.37
(0.290)
30.99
(1.220)
17.53
(0.690)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
10
20
30
40
50
0.0 0.5 1.0 1.5 2.0 2.5
16
12
4
8
0
0400
200 600 800 1000
Case Temp Rise
Rise Above Ambient—°C
Surface mount heat sink for D3 PAK
(TO-268) package semiconductors
remove the heat indirectly without
contacting the device like traditional
through hole heat sinks.The device
and the heat sink are soldered directly
to a modified drain pad creating a
thermal transfer path from package
tab to the heat sink.
5734 Surface mount heat sink for D3 PAK (TO-268) package semiconductors
Tape and Reel information
Part Number “A” Dim “B” Dim “C” Dim “D” Dim
7106D/TRG 44.00 (1.730) 40.40 (1.590) 24.00 (0.940) 4.06 (0.160)
7109D/TRG 44.00 (1.730) 40.40 (1.590) 36.00 (1.420) 4.06 (0.160)
573100D00010G 44.00 (1.730) 40.40 (1.590) 16.00 (0.630) 4.06 (0.160)
573300D00010G 44.00 (1.730) 40.40 (1.590) 24.00 (0.940) 4.06 (0.160)
573400D00010G 44.00 (1.730) 40.40 (1.590) 24.00 (0.940) 4.06 (0.160)
ORDERING INFORMATION
SMT
ORDERING INFORMATION
Part Number Packaging
7109D/TRG 13" Reel, 125 per reel
7109DG Bulk, 500 per bag
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
See below for tape and reel information
Refer to Figure D on page 26 for board footprint information
ORDERING INFORMATION
Part Number Packaging
573400D00010G 13" Reel, 250 per reel
573400D00000G Bulk, 500 per bag
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
See below for tape and reel information
Refer to Figure A and B on page 26 for board footprint information
A
BC
D
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26
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
FIGURE A
SMT Footprints
10.67
(0.420)
15.49
(0.610)
10.41
(0.410)
2.29
(0.090)
7.62
(0.300)
15.49
(0.610)
1.40
(0.060)
0.80
(0.030)
W
W
L
1
2
FIGURE B
FIGURE D
FIGURE C
L
W
16.76
(0.660)
2.54
(0.100)
10.67
(0.420)
20.32
(0.800)
2.54
(0.100)
Recommended copper heat speader drain pad footprint Recommended heat sink solder mask opening
Note: The thickness of
the drain pad is variable
depending on the amount
of heat generated by the
SMT device, design limita-
tions and process.
Part Number “L” “W”
573100 9.53 (0.375) 13.97 (0.550)
573300 14.22 (0.560) 16.26 (0.640)
573400 14.22 (0.560) 21.08 (0.830)
Part Number “L” “W1” “W2”
573100 9.02 (0.355) 13.46 (0.530) 8.89 (0.350)
573300 13.72 (0.540) 15.75 (0.620) 11.18 (0.440)
573400 13.72 (0.540) 20.57 (0.810) 16.00 (0.630)
Recommended copper pad size
for heat sink and device mounting footprint
For D Pak (TO-263) For MO-184 and SO-10
Recommended copper pad size
for heat sink and device mounting footprint
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27
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
ORDERING INFORMATION
7025 Channel style heat sink with folded back fins
Channel style heat sink with folded
back fins for increased cooling surface
area. Available with tin plated solder-
able tabs for easy attachment to the
printed circuit card.
24.13
(0.950)
26.67
(1.050)
48.26
(1.900)
28.03
(1.104)
2.02
(0.080)
28.70
(1.130)
23.62
(0.930)
3.81
(0.150)
THRU
14.48
(0.570)
5.08
(0.200)
2.54
(0.100)
4.45
(0.175)
19.05
(0.750)
3.18
(0.125)
2.29
(0.090)
ø
TAB
Part Number Description
7025BG Channel heat sink with no solderable tabs
7025B-MTG With solderable mounting tabs 2.90 ( 0.114)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5
0
20
40
60
80
100
024 6 810
4
3
1
2
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
ORDERING INFORMATION
25.40
(1.000) 14.48
(0.570)
3.81
(0.150)
THRU
38.23
(1.505)
39.37
(1.550)
2.28
(0.090)
5.08
(0.200)
2.03
(0.080)
9.52
(0.375)
4.83
(0.190)
3.18
(0.125)
11.94
(0.470)
ø
TAB
Part Number Description Finish
7019BG Channel heat sink with no solderable tabs Black anodize
7019PBG Channel heat sink with no solderable tabs Pre black anodize*
7019B-MTG With solderable tabs Black anodize 2.90 ( 0.114)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
024 6810
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Narrow channel style heat sink with
folded back fins for increased cooling
surface area. Available with tin plated
solderable tabs for easy attachment to
the printed circuit card.
7019 Narrow channel style heat sink with folded back fins
7020 Narrow channel style heat sink with folded back fins
Narrow channel style heat sink with
folded back fins for increased cooling
surface area. Available with tin plated
solderable tabs for easy attachment to
the printed circuit card.
(0.700)
17.78
(0.470)
11.94
(1.450)
36.83
(1.300)
33.02
(0.570)
14.48
(0.310)
7.87
(1.255)
31.88 (0.240)
6.10
2x
(0.150)
3.81
(0.190)
4.83
(0.125)
3.18
(0.080)
2.02
C
L
ø
"x"
TAB
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
024 6810
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Part Number Description
7020BG Narrow channel heat sink with no solderable tabs
7020B-MTG With solderable tabs 2.90 (0.114)
ORDERING INFORMATION
Material: 1.27 (0.050) Thick Aluminum
Finish: Black Anodize
Material: 1.02 (0.040) Thick Aluminum
Finish: See Table
Material: 1.27 (0.050) Thick Aluminum
Finish: Black Anodize
Dia of PCB
Plated Thru
Hole for Tabs
TO-220 Heat Sinks
Position Code Description Location Details
A TC10-MT Insulating device mounting clip Hole X Page 93, 98
and solderable tabs
Dia of PCB
Plated Thru
Hole for Tabs
Dia of PCB
Plated Thru
Hole for Tabs
*Edges cut during the manufacturing process will be unfinished.
See page 110 for more information
POPULAR OPTIONS:
Base part no. A
7020B- G
For additional options see page 85
For additional options see page 85
For additional options see page 85
Grease
Epoxy
&
page112
Mounting
Kits
page 99
Grease
Epoxy
&
page112
Mounting
Kits
page 99
Grease
Epoxy
&
page112
Mounting
Kits
page 99
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28
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
ORDERING INFORMATION
7021 Channel style heat sink with folded back fins
Channel style heat sink with
folded back fins for increased
cooling surface area. Available
with tin plated solderable tabs
for easy attachment to the
printed circuit card.
44.45
(1.750)
36.83
(1.450)
43.05
(1.695)
14.48
(0.570)
7.87
(0.310)
9.65
(0.380)
17.78
(0.700)
3.81
(0.150)
4.83
(0.190)
3.18
(0.125)
5.58
(0.220)
2x ø
2.02
(0.080)
2.67
(0.105)
2.28
(0.090)
"X"
TAB
Part Number Description
7021BG Channel heat sink with no solderable tabs
7021B-MTG With solderable tabs 2.90 ( 0.114)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5
0
20
40
60
80
100
024 6810
4
3
1
2
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
26.67
(1.050)
48.26
(1.900)
24.13
(0.950)
28.03
(1.104)
49.53
(1.950)
15.49
(0.610)
14.48
(0.570)
3.81
(0.150)
THRU
4.83
(0.190)
2.29
(0.090)
3.18
(0.125)
5.08
(0.200)
2.54
(0.100)
19.05
(0.750)
4.45
(0.175)
2x
SECTION A-A
A
A
ø
"X"
TAB
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5
0
20
40
60
80
100
024 6 810
4
3
1
2
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Channel style heat sink with
folded back fins for increased
cooling surface area. Available
with tin plated solderable tabs
for easy attachment to the
printed circuit card.
7023 Channel style heat sink with folded back fins
Material: 1.27 (0.050) Thick Aluminum
Finish: Black Anodize
Material: 1.27 (0.050) Thick Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number Description
7023BG Channel heat sink with no solderable tabs
7023B-MTG With solderable tabs 2.90 ( 0.114)
Dia of PCB
Plated Thru
Hole for Tabs
TO-220 Heat Sinks
Position Code Description Location Details
A TC10-MT Locking device mounting clip and solderable tabs Hole X Page 93, 98
A MT5 Bifurcated tabs with 0.205 stand off Page 93
A MT6 Bifurcated tabs with 0.115 stand off Page 93
A TC10-MT5 Locking device mounting clip and bifurcated tabs Hole X Page 93, 98
Position Code Description Location Details
A TC6-MT Locking device mounting clip and solderable tabs Hole X Page 93, 98
A TC7-MT Insulating device mounting clip and solderable tabs Hole X Page93, 98
POPULAR OPTIONS:
Dia of PCB
Plated Thru
Hole for Tabs
POPULAR OPTIONS:
Base part no. A
7021B- G
Base part no. A
7023B- G
For additional options see page 85
For additional options see page 85
Grease
Epoxy
&
page112
Mounting
Kits
page 99
Grease
Epoxy
&
page112
Mounting
Kits
page 99
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29
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
7022 Channel style heat sink with folded back fins
5510 High performance channel style heat sink with folded back fins
High performance channel style
heat sink with folded back fins
for greater cooling capacity in a
minimum of space when mounted
horizontally. Folded back fin design
maximizes surface area without
increasing the vertical space
required by the heat sink.
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
01 2 3 4 5
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Part Number Description
551002B00000G High performance channel style heat sink with folded back fins
ORDERING INFORMATION
25.55
(1.006)
13.21
(0.520)
19.99
(0.787)
ø 3.68
(0.145)
THRU
36.83
(1.450)
13.46
(0.530)
9.91
(0.390)
12.78
(0.503)
C
L
13.46
(0.530)
Material: 1.27 (0.050) Thick Aluminum
Finish: Black Anodize
TO-220 Heat Sinks
Position Code Description Details
A 01 6-32 Wave On threaded insert Page 89
0.100 stand off
POPULAR OPTIONS:
Channel style heat sink with
folded back fins for increased
cooling surface area. Available
with tin plated solderable tabs
for easy attachment to the
printed circuit card.
9.52
(0.375)
50.44
(1.986)
23.01
(0.906)
49.99
(1.968)
3.81
(0.150)
21.03
(0.828)
2x 3.81
(0.150) 2.02
(0.080)
2.67
(0.105)
24.16
(0.951)
4.83
(0.190)
3.18
(0.125)
2.29
(0.090)
2x
4.44
(0.175)
ø
2x 2.03
(0.080)
"X"
14.48
(0.570)
TAB
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5
0
20
40
60
80
100
048121620
4
3
1
2
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Part Number Description Finish
7022BG Channel heat sink with no solderable tabs Black anodize
7022PBG Channel heat sink with no solderable tabs Pre black anodize*
7022B-MTG With solderable tabs Black anodize 2.90 ( 0.114)
7022PB-MTG With solderable tabs Pre black anodize* 2.90 ( 0.114)
ORDERING INFORMATION Material: 1.27 (0.050) Thick Aluminum
Finish: See Table
* Edges cut during the manufacturing process will be unfinished.
See page 110 for more information
Position Code Description Location Details
A TC11-MT Insulated device mounting clip for T0-220 and solderable tabs Hole X Page 93, 98
POPULAR OPTIONS:
Dia of PCB
Plated Thru
Hole for Tabs
Base part no. A
7022B- G
Base part no. A
551002B0 00 00G
For additional options see page 85
For additional options see page 82
Grease
Epoxy
&
page112
Mounting
Kits
page 99
Grease
Epoxy
&
page112
Mounting
Kits
page 99
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30
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
ORDERING INFORMATION
6021, 6221 Channel style heat sink with straight fins
Channel style heat sink with
straight fins features integrated
solderable tabs for easy mounting
to the printed circuit card. Available
with a single device mounting hole
or slotted hole to accomodate
varying device lead lengths.
1.02
(0.040)
25.40
(1.000)
29.97
(1.180)
0.80
(0.032)
24.38
(0.960)
17.78
(0.700)
12.70
(0.500)
3.81
(0.150)
ø 3.38
(0.133)
"A"
"B"
"X"
Part Number Description Finish Figure “A” Dim “B” Dim
6021BG Channel heat sink with straight fins and integrated tabs Black anodize A 2.21 (0.087) 10.16 (0.400) 1.78 (0.070)
6021PBG Channel heat sink with straight fins and integrated tabs Pre-black anodize* A 2.21 (0.087) 10.16 (0.400) 1.78 (0.070)
6221PBG With slotted device mounting hole Pre-black anodize* B 3.18 (0.125) 6.99 (0.275) 2.54 (0.100)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
024 6810
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
29.97
(1.180) 17.78
(0.700)
25.40
(1.000)
12.70
(0.500)
2.54
(0.100)
6.98
(0.275)
3.81
(0.150)
9.53
(0.375)
3.81
(0.150)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
024 6810
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Copper channel style heat sink
with straight fins features integrated
tabs which can be twisted to attach
the heat sink to the board prior to
wave solder.
6230 Copper channel style heat sink with straight fins
Material: 1.02 (0.040) Thick Aluminum
Finish: See Table
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
ORDERING INFORMATION
Part Number Description
6230DG Channel heat sink with straight fins and integrated tabs 3.00 (0.118)
Dia of PCB
Plated Thru
Hole for Tabs
TO-220 Heat Sinks
Position Code Description Location Details
A B Black anodize
A PB Pre-black anodize*
B SF1 4-40 UNC-2A device mounting stud Hole X Page 96
POPULAR OPTIONS:
* Edges cut during the manufacturing process will be unfinished.
See page 110 for more information
Dia of PCB
Plated Thru
Hole for Tabs
Base part no. A
6021- - G
Available on the 6021 only
For additional options for part 6021 see page 85
25.40
(1.000)
3.81
(0.150)
9.52
(0.375)
29.97
(1.180) 17.78
(0.700)
3.80
(0.150) 24.59
(0.968)
1.02
(0.040)
0.80
(0.032)
12.70
(0.500)
WIDE X
LONG SLOT
"A"
"B"
FIGURE A FIGURE B
B
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THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
TV35 Narrow channel style heat sink features twisted fins
TV46, TV47, TV58 Narrow channel style heat sink features twisted fins
Narrow channel style
heat sink features twisted
fins for increased air turbu-
lence and better cooling. Can be
mounted vertically or horizontally.
Air Velocity —Feet Per Minute
Heat Dissipated —Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
20
40
60
80
100
012 3 4 5
16
12
4
8
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
TV46, TV47
TV58
Part Number “A” Dim “B” Dim
TV46G 13.00 (0.512) 9.50 (0.374)
TV47G 13.00 (0.512) 6.30 (0.248)
TV58G 11.00 (0.433) 6.30 (0.248)
ORDERING INFORMATION
19.00
(0.749)
C
L
4.00
(0.157)
"A"
22.00
(0.887)
MAX
11.00
(0.433)
MIN
THRU
ø
“B”
TO-220 Heat Sinks
Narrow channel style heat sink
features twisted fins for increased
air turbulence and better cooling.
Mounts horizontally to accommo-
date two TO-220 devices.
38.00
(1.497)
42.00
(1.655)
35.00
(1.380)
25.00
(0.985)
C
L
10.00
(0.394)
14.00
(0.552)
4.00
(0.158)
THRU
2X ø
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
024 6 810
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Part Number Description
TV35G Channel style heat sink with twisted fins
ORDERING INFORMATION
Material: 0.81 (0.032) Thick Aluminum
Finish: Black Anodize
Material: 0.81 (0.032) Thick Aluminum
Finish: Black Anodize
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&
page112
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THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
ORDERING INFORMATION
TV265, TV1500, TV1505 Channel style heat sink features twisted fins
Channel style heat sink features
twisted fins for increased air turbu-
lence and better cooling. Can be
mounted vertically or horizontally.
Models are available with integrated
twist tabs or mounting solderable tabs.
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
20
40
60
80
100
024 6 810
16
12
4
8
0
0400
200 600 800 1000
TV1505
TV1500
Mounting Surface Temp
Rise Above Ambient—°C
Part Number Description Figure
TV265G Channel style heat sink with twisted fins and solderable tabs A 2.39 (0.094)
TV1500G Channel style heat sink with twisted fins B
TV1505G With integrated twist tabs B 3.30 (0.130)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
024 6810
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
30.40
(1.197)
31.20
(1.228)
25.00
(0.984)
5.10
(0.201)
15.20
(0.598)
12.50
(0.492)
C
L
Slots for
clip attach
3.81
(0.150)
0.80
(0.031)
24.20
(0.953)
11.10
(0.437)
1.90
(0.075)
5.00
(0.197)
Channel style heat sink features
solderable tabs and twisted fins
for increased air turbulence for bet-
ter cooling. For ease of assembly use
with clip 7701 (sold separately) to
attach device. See page 97 for clip
information.
5900 Channel style heat sink features solderable tabs and twisted fins
Material: 1.27 (0.050) Thick Aluminum
Finish: Black Anodize
Material: 1.19 (0.047) Thick Aluminum
Finish: Pre Black Anodize*
ORDERING INFORMATION
Part Number Description
5900PBG Channel style heat sink with twisted fins and solderable tabs 2.40 (0.094)
Dia of PCB
Plated Thru
Hole for Tabs
TO-220 Heat Sinks
Dia of PCB
Plated Thru
Hole for Tabs
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
20
40
60
80
100
0123 4 5
16
12
4
8
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
TV 265
12.70
(0.500)
2.54
(0.100) 5.80
(0.228)
30.00
(1.181)
5.08
(0.200)
1.20
(0.047)
24.13
(0.950)
30.20
(1.187)
3.80
(0.150)
1.90
(0.075)
15.24
(0.600)
TAB
T
V1505
ONLY
C
L
R
45.00
(1.772)
4.50
(0.177) 1.90
(0.075) 10.15
(0.400)
12.70
(0.500)
1.90
(0.075)
R
30.00
(1.181)
22.10
(0.870)
25.40
(1.000)
15.24
(0.600)
5.08
(0.200)
0.75
(0.030)
C
L
* Edges cut during the manufacturing process will be unfinished.
See page 110 for more information.
FIGURE A
FIGURE B
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THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
ORDERING INFORMATION
5929, 5930 Channel style heat sink featuring twisted fins
Channel style heat sink features
twisted fins for increased air turbu-
lence for better cooling.Two heights
are available and include wave solder-
able tin plated tabs for easy attachment
to the PC board.
17.78
(0.700)
3.18
(0.125)
THRU
0.81
(0.032) 10.16
(0.400)
1.90
(0.075)
12.70
(0.500)
4.27
(0.170)
ø
"A"
23.93
(0.942)
"X"
Part Number “A” Dim
592902B03400G 24.89 (0.980) 2.36 (0.093)
593002B03400G 29.97 (1.180) 2.36 (0.093)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
20
40
60
80
100
024 6 810
16
12
4
8
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
593002
592902
17.78
(0.700)
25.40
(1.000)
5.08
(0.200)
"A"
12.70
(0.500)
8.89
(0.350)
2.54
(0.100)
9.52
(0.375)
3.81
(0.150)
TYP
C
L
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
024 6810
8
6
2
4
0
0400
200 600 800 1000
576602
563002
Mounting Surface Temp
Rise Above Ambient—°C
Channel style heat sink features three
integrated tabs for greater stability and
slotted mounting hole to accommodate a
variety of device lead lengths. Available in
two heights. Mounting tabs are designed
for either soldering (tin finish) or twisted.
5630, 5766 Channel style heat sink featuring three integrated tabs
5750 Channel style heat sink with two integrated tabs
Channel style heat sink features two
integrated tabs and slotted mounting
hole to accommodate a variety of device
lead lengths. Mounting tabs are designed
for either soldering (tin finish) or twisted.
25.40
(1.000)
9.52
(0.375)
3.81
(0.150)
5.08
(0.200)
17.78
(0.700)
29.97
(1.180)
12.70
(0.500)
10.16
(0.400)
2.54
(0.100)
C
L
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
024 6810
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Part Number Finish
575002B00000G Black anodize 3.10 (0.122)
575002D00000G Tin plated 3.10 (0.122)
ORDERING INFORMATION
Material: 1.27 (0.050) Thick Aluminum
Finish: Black Anodize
Material: 1.27 (0.050) Thick Aluminum
Finish: See Table
Material: 1.27 (0.050) Thick Aluminum
Finish: See Table
Dia of PCB
Plated Thru
Hole for Tabs
TO-220 Heat Sinks
Position Code Description Location Details
A 05 4-40 male semiconductor mount 0.380 LG Hole X Page 90
ORDERING INFORMATION
Part Number “A” Dim Finish
563002B00000G 29.97 (1.180) Black anodize 3.10 (0.122)
563002D00000G 29.97 (1.180) Tin plated 3.10 (0.122)
576602B00000G 24.13 (0.950) Black anodize 3.10 (0.122)
576602D00000G 24.13 (0.950) Tin plated 3.10 (0.122)
Dia of PCB
Plated Thru
Hole for Tabs
Dia of PCB
Plated Thru
Hole for Tabs
POPULAR OPTIONS:
Base part no. A
59 _ _ 02B034 00G
For additional options see page 82
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THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
5901 Channel style heat sink featuring recessed lower fins
Channel style heat sink features
recessed lower fins to allow closer com-
ponent spacing and longer upper fins for
maximum cooling. Includes two solderable
tabs for easy attachment to the PC card.
25.40
(1.000)
17.78
(0.700)
23.50
(0.925) 3.96
(0.156)
25.40
(1.000)
2.54
(0.100)
12.70
(0.500)
42.54
(1.675)
5.08
(0.200)
9.53
(0.375)
x
øSLOT
23.98
(0.944)
1.27
(0.050)
C
L
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
01 2 3 4 5
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
17.78
(0.700)
42.54
(1.675)
3.96
(0.156)
0.81
(0.032)
11.43
(0.450)
5.08
(0.200)
12.70
(0.500)
24.89
(0.980)
2.54
(0.100)
9.52
(0.375)
ø
C
L
x
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
01 2 3 4 5
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Channel style heat sink features slotted
mounting hole to accommodate a variety of
devices and lead lengths. Includes two solder-
able tabs for easy attachment to the PC card.
5903 Channel style heat sink featuring slotted mounting hole
5770, 5771, 5772 Slim low cost channel style heat sink
Slim low cost channel style heat sink
is ideal where space and cost are limited.
Available in 3 fin heights with or without
solderable mounting tab.
19.05
(0.750)
6.35
(0.250)
1.27
(0.050)
ø 3.81
(0.150) THRU
0.81
(0.032)
13.21
(0.520)
"A"
10.67
(0.420)
13.33
(0.525)
C
L
T
AB
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
20
40
60
80
100
01 2 3 4 5
16
12
4
8
0
0400
200 600 800 1000
577102
577202
577002
Mounting Surface Temp
Rise Above Ambient—°C
Material: 1.27 (0.050) Thick Aluminum
Finish: Black Anodize
Material: 1.27 (0.050) Thick Aluminum
Finish: Black Anodize
Material: 1.27 (0.050) Thick Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number Description
590302B03600G High performance heat sink with solderable tabs 2.92 (0.115)
Dia of PCB
Plated Thru
Hole for Tabs
TO-220 Heat Sinks
ORDERING INFORMATION
Part Number Description
590102B03600G High performance heat sink with recessed lower fins 2.92 (0.115)
Dia of PCB
Plated Thru
Hole for Tabs
ORDERING INFORMATION
Part Number Description “A” Dim
577002B00000G Slim, low cost channel style heat sink with no solderable tabs 6.35 (0.250)
577002B04000G With solderable tab 6.35 (0.250) 1.73 (0.068)
577102B00000G Slim, low cost channel style heat sink with no solderable tabs 9.52 (0.375)
577102B04000G With solderable tab 9.52 (0.375) 1.73 (0.068)
577202B00000G Slim, low cost channel style heat sink with no solderable tabs 12.70 (0.500)
577202B04000G With solderable tab 12.70 (0.500) 1.73 (0.068)
Dia of PCB
Plated Thru
Hole for Tabs
Position Code Description Details
A 3 In-Sil-8TM pad Page 86
POPULAR OPTIONS:
Base part no. A
577_ _02B 0 4000G
For additional options see page 82
For additional options see page 82
For additional options see page 82
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Kits
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THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
ORDERING INFORMATION
6109, 6110 Low cost channel style heat sink featuring integrated alignment tabs
Low cost channel style heat sink features
integrated alignment tabs to prevent the
device from rotating while applying torque
to the mounting hardware. Available in two
lengths with a pre-black anodized finish.
10.92
(0.430)
11.68
(0.460)
8.89
(0.350)
29.97
(1.180)
12.70
(0.500)
AT BASE
25.40
(1.000)
3.81
(0.150)
ø
Part Number Description Figure
6109PBG Low cost channel heat sink with device locating tabs A
6110PBG Low cost channel heat sink with device locating tabs B
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
20
40
60
80
100
0 1 2 3 4 5
16
12
4
8
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
6110
6109
ORDERING INFORMATION
19.05
(0.750) 13.34
(0.525)
6.35
(0.250)
3.81
(0.150) 6.60
(0.260)
3.81
(0.150)
3.81
(0.150)
1.27
(0.050)
9.52
(0.375)
øC
L
13.21
(0.520)
AT BASE
Part Number Description
7178DG Narrow channel copper heat sink 2.54 (0.100)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
0.0 0.4 0.8 1.2 1.6 2.0
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Copper narrow channel style heat sink
includes a single integrated tab to allow
easy attachment to the PC board.Tin plated
finish ensures easy solderability.
7178 Copper narrow channel style heat sink with a single integrated tab
7136, 7139 Copper channel style slide on heat sink featuring integrated mounting clip
Copper channel style slide on heat
sink features integrated mounting
clip for easy no hardware attach-
ment to the device. Also includes
solderable mounting tabs for easy
attachment to the PC board.
21.54
(0.848)
1.27
(0.050)
13.08
(0.515)
13.21
(0.520)
2.79
(0.110)
4.19
(0.165)
2x 1.27
(0.050)
2x
2x
17.78
(0.700)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
20
40
60
80
100
0 1 2 3 4 5
16
12
4
8
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
7139
7136
Part Number Description Figure
7136DG Vertical mount A 2.54 (0.100)
7139DG Horizontal mount B 2.54 (0.100)
ORDERING INFORMATION
19.81
(0.780) 14.86
(0.580)
13.08
(0.515) 2.79
(0.110)
13.21
(0.520)
2.03
(0.080)
Top is cut away
to show detail
16.51
(0.650)
Material: 1.27 (0.050) Thick Aluminum
Finish: Pre-Black Anodize*
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
Dia of PCB
Plated Thru
Hole for Tabs
TO-220 Heat Sinks
Position Code Description Details
A MT Solderable mounting tabs Page 93
Dia of PCB
Plated Thru
Hole for Tabs
* Edges cut during the manufacturing process will be unfinished.
See page 110 for more information
10.92
(0.430)
AT BASE
25.40
(1.000)
5.72
(0.225)
8.89
(0.350)
3.81
(0.150)
18.03
(0.710)
12.70
(0.500)
ø
C
L
POPULAR OPTIONS:
Base part no. A
61_ _PB - G
For additional options see page 85
FIGURE A FIGURE B
FIGURE A FIGURE B
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THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
ORDERING INFORMATION
7128 Copper channel style heat sink with integrated clip
Copper channel style heat sink with
integrated clip and locking tab for
secure attachment to the device. Narrow
profile uses less board space. Includes
tin plated solderable tabs for easy
attachment to the printed circuit card.
27.94
(1.100) 20.32
(0.800)
9.52
(0.375)
22.00
(0.866)
Top is cut
away to
show detail
1.27
(0.050)
1.27
(0.050)
2.79–3.43
(0.110–0.135)
5.31
(0.209)
4.47
(0.176)
6.12
(0.241)
1.68
(0.066)
1.07
(0.042)
10.80
(0.425)
Part Number Description
7128DG Slide on channel heat sink with integrated clip and locking tabs 2.92 (0.115)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From
Case to Ambient—°C/Watt
10
0
20
40
60
80
100
0 1 2 3 4 5
8
6
2
4
0
0400
200 600 800 1000
Case Temp Rise
Rise Above Ambient—°C
29.97
(1.180)
12.70
(0.500)
25.40
(1.000)
2.54
(0.100)
6.35
(0.250) 2.54
(0.100) 10.16
(0.400)
AT BASE
16.51
(0.650) 8.26
(0.325)
11.43
(0.450)
31.24
(1.230)
18.29
(0.720)
5.89
(0.232)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
0 1 2 3 4 5
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Channel style heat sink with
integrated clip and locking tab
for secure attachment to the device.
Tabs can be bent for mounting.
6038 Channel style heat sink with integrated clip
7142 Narrow channel style heat sink with integrated clip
Narrow channel style heat sink with
integrated clip and locking tab for
secure attachment to the device.
Device can be mounted horizontally
using a single center tab that can be
soldered directly to the PC board.
19.81
(0.780)
13.08
(0.515)
13.21
(0.520)
2.79
(0.110)
Top is cut
away to
show detail
2.54
(0.100)
0.64
(0.025)
14.86
(0.585)
C
L
16.51
(0.650)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From
Case to Ambient—°C/Watt
10
0
20
40
60
80
100
0 1 2 3 4 5
8
6
2
4
0
0400
200 600 800 1000
Case Temp Rise
Above Ambient—°C
Part Number Description
7142DG Slide on narrow channel heat sink with integrated clip and locking tabs 3.18 (0.125)
ORDERING INFORMATION
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
ORDERING INFORMATION
Part Number Description
6038BG Slide on channel heat sink with integrated clip and locking tabs 3.81 (0.150)
Dia of PCB
Plated Thru
Hole for Tabs
TO-220 Heat Sinks
Dia of PCB
Plated Thru
Hole for Tabs
Dia of PCB
Plated Thru
Hole for Tabs
Material: 0.81(0.032) Thick Aluminum
Finish: Black Anodize
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37
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
ORDERING INFORMATION
6238, 6239 Channel style heat sink with integrated clip
Channel style heat sink with
integrated clip features strong
spring tension and device lock-
ing tab to attach device securely
to the heat sink. Available with
solderable tabs for vertical
mount or without tabs for
mounting horizontally.
10.80
(0.425)
24.38
(0.960)
2.67
(0.105)
15.49
(0.610)
25.53
(1.005)
5.08
(0.200)
8.00
(0.315)
"A"
2.02
(0.080)
B
B
3.17
(0.125)
19.05
(0.750)
1.90
(0.075)
16.51
(0.650)
SECTION B-B
AT BASE
TAB
Part Number Description “A” Dim
6238BG Channel heat sink with integral clip, no solderable tab
6238B-MTG With solderable mounting tabs 10.16 (0.400) 2.90 (0.114)
6239B-MTG With solderable mounting tabs 6.99 (0.275) 2.90 (0.114)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
0 1 2 3 4 5
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
5342 Channel style heat sink with convenient clip
Material: 1.02 (0.040) Thick Aluminum
Finish: Black Anodize
TO-220 Heat Sinks
Dia of PCB
Plated Thru
Hole for Tabs
ORDERING INFORMATION
Channel style heat sink features
a dittin to locate the device and
a convenient clip to eliminate the
need for mounting hardware. The
twisted fins increase cooling effi-
ciency. Available in two solderable
mounting tab styles. Can be ordered
without the ditton if electrical isola-
tion is required or for mounting
tabless packages.
25.40
(1.000)
17.78
(0.700)
3.12
(0.123)
22.35
(0.880)
12.70
(0.500)
9.27
(0.365)
1.60
(0.063)
29.97
(1.180)
0.762
(0.030)
9.78
(0.385)
C
L
14.12
(0.556) “A”
Part Number Description Figure “A” Dim
534202B02853G With Shur-LockTM tabs and clip A Dia 3.05(0.120) x 0.64(0.025) High Dittin 2.39 (0.094)
534202B03453G With solderable mounting tabs and clip B Dia 3.05(0.120) x 0.64(0.025) High Dittin 2.39 (0.094)
534265B02853G With Shur-LockTM tabs and clip A No Dittin 2.39 (0.094)
534265B03453G With solderable mounting tabs and clip B No Dittin 2.39 (0.094)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
024 6810
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Material: 1.27 (0.050) Thick Aluminum
Finish: Black Anodize
17.78
(0.700)
4.27
(0.170) 23.93
(0.942) 12.70
(0.500)
10.16
(0.400)
1.90
(0.075)
29.97
(1.180)
0.81
(0.032)
9.78
(0.385)
C
L
25.40
(1.000)
14.12
(0.556) “A”
FIGURE A FIGURE B
12.06
(0.475)
3.96
(0.156)
3.17
(0.125)
13.84
(0.545)
CLIP 53
For additional options see page 85
Dia of PCB
Plated Thru
Hole for Tabs
For additional options see page 82
Grease
Epoxy
&
page112
Mounting
Kits
page 99
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38
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
ORDERING INFORMATION
5041, 5042 Economy, narrow base, low profile channel style heat sink
Economy, narrow base, low profile
channel style heat sink is perfect for
use on printed circuit boards with tight
component spacing. Models are available
for single and dual device mounting.
17.80
(0.700)
3.66
(0.144)
THRU
13.46
(0.530)
21.60
(0.850)
19.80
(0.780)
ø
"X"
Part Number Description Figure
504102B00000G Economy, narrow base channel style heat sink A
504222B00000G For dual devices B
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
024 6810
8
6
2
4
0
0400
200 600 800 1000
504222
504102
Mounting Surface Temp
Rise Above Ambient—°C
Material: 1.02 (0.040) Thick Aluminum
Finish: Black Anodize
TO-220 Heat Sinks
Position Code Description Location Details
A 01 6-32 Wave On threaded insert 0.100 stand off Hole X Page 89
21.59
(0.850)
13.47
(0.530)
36.83
(1.450)
3.66
(0.144)
THRU TYP 2
19.81
(0.780)
9.91
(0.390)
ø
"X" "X"
13.47
(0.530)
Economy, narrow base, low profile
channel style heat sink is perfect for use
on printed circuit boards with 0.500 inch
centering.When mounted horizontally, the
total height of the heat sink is just 0.380.
9.65
(0.380)
9.52
(0.375)
13.34
(0.525)
ø 3.81
(0.150)
THRU
19.05
(0.750)
19.05
(0.750)
L
C
"X"
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
20
40
60
80
100
012 34 5
16
12
4
8
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Part Number Finish
507302B00000G Black anodize
507302J00000G Pre-black anodize*
ORDERING INFORMATION Material: 1.27 (0.050) Thick Aluminum
Finish: See Table
Position Code Description Location Details
A 09 Stud 4–40 x 0.350 LG Hole X Page 96
* Edges cut during the manufacturing process will be unfinished. See page 110 for more information
5073 Economy, narrow base, low profile channel style heat sink
7141 Copper narrow channel style heat sink with integrated clip
Copper narrow channel style heat
sink with integrated clip and locking
tab for secure attachment to the device.
Single center tab can be soldered
directly to the PC board.
19.81
(0.780)
5.72
(0.225) 1.27
(0.050)
3.81
(0.150)
3.05
(0.120)
13.08
(0.515)
13.21
(0.520)
Top is cut
away to
show detail
2.54
(0.100)
MAX
16.51
(0.650)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From
Case to Ambient—°C/Watt
10
0
20
40
60
80
100
0 1 2 3 4 5
8
6
2
4
0
0400
200 600 800 1000
Case Temp Rise
Above Ambient—°C
Part Number Description
7141DG Narrow channel heat sink with integrated clip 2.77 (0.109)
ORDERING INFORMATION
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
Dia of PCB
Plated Thru
Hole for Tabs
FIGURE A FIGURE B
POPULAR OPTIONS:
Base part no. A
507302 _ 000 00G
POPULAR OPTIONS:
Base part no. A
504_ _2B00000G
For additional options see page 82
For additional options see page 82
Grease
Epoxy
&
page112
Mounting
Kits
page 99
Grease
Epoxy
&
page112
Mounting
Kits
page 99
sales.na@aavid.com www.shopaavid.com
39
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
7173 Copper channel style heat sink featuring two integrated tabs
6236 Channel style heat sink featuring an integrated device retaining clip
TO-220 Heat Sinks
19.05
(0.750)13.34
(0.525)
ø
3.81
(0.150)
THRU
9.52
(0.375)
19.05
(0.750)
3.81
(0.150)
1.27
(0.050) 4.11
(0.162)
6.35
(0.250)
3.81
(0.150)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
012 3 45
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Copper channel style heat sink
features two integrated tabs.
The heat sink is tin plated and
can be soldered to the PC board.
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
ORDERING INFORMATION
Part Number Description
7173DG Copper channel style heat sink 2.54 (0.100)
Dia of PCB
Plated Thru
Hole for Tabs
Channel style heat sink features
an integrated device retaining clip
that eliminates the need for attachment
hardware. Available in two finish options.
17.78
(0.700)
12.95
(0.510)
13.21
(0.520)
Top is cut away
to show detail
2.54
(0.100)
Locking Catch
14.22
(0.560)
C
L
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
20
40
60
80
100
024 6 8 10
16
12
4
8
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Part Number Finish
6236BG Black anodize
6236PBG Pre-black anodize*
ORDERING INFORMATION Material: 1.02 (0.040) Thick Aluminum
Finish: See Table
* Edges cut during the manufacturing process will be unfinished.
See page 110 for more information.
TV40 Narrow channel style heat sink features twisted fins
38.00
(1.497)
22.00
(0.866)
28.00
(1.103)
C
L
13.00
(0.512)
6.00
(0.236)
4.00
(0.158)
THRU
2X
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
024 6 810
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Narrow channel style heat
sink features twisted fins
for increased air turbulence
and better cooling. Mounts
horizontally to accommodate
two TO-220 devices. Material: 0.81 (0.032) Thick Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number Description
TV40G Narrow channel style heat sink with twisted fins
Grease
Epoxy
&
page112
Mounting
Kits
page 99
Grease
Epoxy
&
page112
Mounting
Kits
page 99
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40
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
5306, 5307, 5760 Channel style heat sink with wide mounting surface
Lightweight, low cost channel style
heat sink with wide mounting surface
and selection of lengths to accept a
variety of packages. Models accomodate
one or two devices.
"C"
AT BASE
25.40
(1.000)
THRU
3.81
(0.150)
ø
"B"
"A"
C
L
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
01 2 3 4 5
8
6
2
4
0
0400
200 600 800 1000
530613 or 530614
576012, 530714 or 576014
Mounting Surface Temp
Rise Above Ambient—°C
Part Number Figure “A” Dim “B”Dim “C” Dim
530613B00000G B 12.19 (0.480) 10.16 (0.400)
530614B00000G A 29.97 (1.180) 11.68 (0.460) 12.70 (0.500)
530714B00000G A 18.03 (0.710) 12.32 (0.485) 12.70 (0.500)
576012B00000G A 22.86 (0.900) 11.43 (0.450) 9.65 (0.380)
576014B00000G A 22.86 (0.900) 8.13 (0.320) 9.65 (0.380)
ORDERING INFORMATION
12.70
(0.500)
29.97
(1.180)
AT BASE
25.40
(1.000)
THRU 2X
3.81
(0.150)
ø
"A"
"B"
C
L
FIGURE A FIGURE B
For additional options see page 82
5779, 5786 Twin channel style heat sink
Twin channel style heat sink
vertically mounts two TO-220 devices
to a single heat sink. Center fins
increase cooling capacity. Available
with integrated twist tabs or staked
on solder tabs for easy attachment
to the PC board.
37.59
(1.480)
12.70
(0.500)
2.54
(0.100)
5.08
(0.200)
26.16
(1.030)
19.30
(0.760)
30.15
(1.187)
3.81
(0.150)
THRU
TYP 2
ø
9.65
(0.380)
TYP 2
15.49
(0.610)
TYP 2
3.81
(0.150)
THRU
TYP 2
ø
37.59
(1.480)
12.70
(0.500)
14.99
(0.590)
35.56
(1.400)
9.65
(0.380)
TYP 2
19.30
(0.760)
5.59
(0.220)
1.57
(0.062) 3.43
(0.135)
12.70
(0.500)
25.40
(1.000)
ORDERING INFORMATION
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
0 1 2 3 4 5
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Material: 1.27 (0.050) Thick Aluminum
Finish: Black Anodize
Part Number Description Figure
577922B00000G Twin channel style heat sink with integrated tabs A 3.10 (0.122)
578622B03200G With staked on solderable tabs B 1.91 (0.075)
Dia of PCB
Plated Thru
Hole for Tabs
FIGURE A FIGURE B
For additional options see page 82
TO-220 Heat Sinks
Material: 1.27 (0.050) Thick Aluminum
Finish: Black Anodize
Grease
Epoxy
&
page112
Mounting
Kits
page 99
Grease
Epoxy
&
page112
Mounting
Kits
page 99
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41
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
ORDERING INFORMATION
5069, 5070, 5071, 5072 Hat section style heat sink
Hat section style heat sinks are low
profile and perfect for use on printed
circuit cards with 0.500 inch centering
between boards. For higher power
applications the 5071 hat can be added
to the 5070 or 5072 for double sided
cooling of a TO-220 device.
17.78
(0.700)
9.52
(0.375)
13.46
(0.530)
17.78
(0.700) C
L
3.66
(0.144)
THRU
ø
"A"
Part Number Description Figure “A” Dim
506902B00000G Hat section heat sink A 31.75 (1.250)
507002B00000G Wide hat section heat sink A 44.45 (1.750)
507102B00000G Hat section heat sink with cut out C
507222B00000G Dual device hat section heat sink B
44.45
(1.750)
12.70
(0.500)
12.70
(0.500)
17.78
(0.700)
3.66
(0.144)
10.67
(0.420)
10.29
(0.405)
13.46
(0.530)
ø
7137, 7140 Copper, hat section, slide on heat sink
Copper, hat section, slide on heat sink
features integrated mounting clip
for easy no hardware attachment to
the device. Also included are solderable
mounting tabs for easy attachment
to the PC card.
21.54
(0.848)
22.86
(0.900)
9.52
(0.375)
13.21
(0.520)
2.54
(0.100)
Top is cut away
to show detail
19.05
(0.750)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
01 2 3 4 5
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Part Number Description Figure
7137DG Vertical mount A 2.54 (0.100)
7140DG Horizontal mount B 2.54 (0.100)
ORDERING INFORMATION
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
TO-220 Heat Sinks
Position Code Description Details
A 1 Kon DuxTM pad Page 86
37.34
(1.470)
44.45
(1.750)
17.78
(0.700)
9.52
(0.375)
13.59
(0.535)
10.16
(0.400)
C
L
3.66
(0.144)
THRU TYP 2
ø
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
01 2 3 4 5
8
6
2
4
0
0400
200 600 800 1000
507002
506902
Mounting Surface Temp
Rise Above Ambient—°C
507102
Dia of PCB
Plated Thru
Hole for Tabs
FIGURE C
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
0 2 4 6 8 10
8
6
2
4
0
0400
200 600 800 1000
507222 with 507102 attached
507222
Mounting Surface Temp
Rise Above Ambient—°C
17.78
(0.700)
22.86
(0.900)
9.52
(0.375)
13.21
(0.520)
1.57
(0.062)
3.05
(0.120)
11.05
(0.435)
For additional options see page 82
FIGURE A FIGURE B
FIGURE A FIGURE B
POPULAR OPTIONS:
Base part no. A
50_ _ _2B 0 0000G
Grease
Epoxy
&
page112
Mounting
Kits
page 99
Material: 1.02 (0.040) Thick Aluminum
Finish: Black Anodize
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42
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
ORDERING INFORMATION
6237 Hat section style heat sink featuring an integrated clip
Hat section style heat sink
features an integrated clip
for secure attachment to the
device without added hard-
ware. Available in two finishes.
14.22
(0.560)
2.54
(0.100)
22.86
(0.900)
9.52
(0.375)
13.21
(0.520)
Top is cut away
to show detail
17.78
(0.700)
Part Number Finish
6237BG Black anodize
6237PBG Pre-black anodize*
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
20
40
60
80
100
024 6 8 10
16
12
4
8
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
ORDERING INFORMATION
TYP 2
4.19
(0.165)
14.73
(0.580) 1.78
(0.070)
11.18
(0.440)
2.41
(0.095)
4.83
(0.190)
TYP 6
1.98
(0.078)
R
DETAIL-A
TYP 2
3.56
(0.140)
2
1
REF
15.49
(0.61)
REF
33.27
(1.31)
REF
27.69
(1.09)
@ BASE
33.27
(1.310)
SQ.
REF
46.48
(1.83)
REF
6.35
(0.25)
THRU
TYP 8
3.66
(0.144)
SEE DETAIL "A"
1
2
C
L
ø
ø
C
L
C
L
TYP 2
C
L
TYP 2
"X"
"X"
Part Number Description
569022B00000G High power, square basket, folded back fin heat sink
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5
0
20
40
60
80
100
0 4 8 12 16 20
4
3
1
2
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
High power, square basket heat sink
accommodates two TO-220 devices.
Features folded back fins for increased
surface area for maximum cooling.
5690 High power, square basket heat sink with folded back fins
Material: 1.02 (0.040) Thick Aluminum
Finish: See Table
Material: 1.60 (0.063) Thick Aluminum
Finish: Black Anodize
TO-220 Heat Sinks
* Edges cut during the manufacturing process will be unfinished.
See page 110 for more information
Position Code Description Location Details
A 01 6–32 Wave On threaded insert, 0.100 stand off 0.062 Bd Hole X Page 89
For additional options see page 82
POPULAR OPTIONS:
Base part no. A
569022B0 00 00G
Grease
Epoxy
&
page112
Mounting
Kits
page 99
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43
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
5748, 5798, 5799 Clip on style heat sink featuring an integrated clip
Clip on style heat sink features
an integrated clip to retain the
device meaning no mounting
hardware is required. Models
have fins on both sides, left or
right side and are available with
solderable tabs for easy attach-
ment to the PC board.
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
20
40
60
80
100
012 34 5
16
12
4
8
0
0400
200 600 800 1000
579902
574802
Mounting Surface Temp
Rise Above Ambient—°C
579802
6043, 6049, 6094 Low cost, clip on style heat sink featuring a locking tab
Low cost, clip on style heat sink
features a locking tab to prevent
the device from dislodging from
the heat sink. Also includes slide
runners to ensure proper device
alignment. Available in a pre-black
anodize finish.
"D" "C"
"A"
"E"
"B"
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
20
40
60
80
100
01 2 3 4 5
16
12
4
8
0
0400
200 600 800 1000
6049
6043
6094
Mounting Surface Temp
Rise Above Ambient—°C
Part Number “A” Dim “B” Dim “C”Dim “D” Dim “E” Dim
6043PBG 25.40 (1.000) 16.51 (0.650) 10.16 (0.400) 20.32 (0.800) 6.81 (0.268)
6049PBG 25.40 (1.000) 16.51 (0.650) 10.16 (0.400) 13.97 (0.550) 6.81 (0.268)
6094PBG 19.71 (0.776) 14.73 (0.580) 10.92 (0.430) 20.32 (0.800) 6.45 (0.254)
ORDERING INFORMATION
Material: 0.63 (0.025) Thick Aluminum
Finish: Pre-Black Anodize*
TO-220 Heat Sinks
Part Number Description Figure
574802B00000G Clip on heat sink, left & right side fins, no solderable tabs A
574802B03300G Left & right side fins with solderable tabs A 1.91 (0.075)
579802B00000G Left side fin, no solderable tabs B
579802B03300G Left side fin with solderable tab B 1.91 (0.075)
579902B00000G Right side fin, no solderable tabs B
579902B03300G Right side fin with solderable tab B 1.91 (0.075)
ORDERING INFORMATION Dia of PCB
Plated Thru
Hole for Tabs
25.15
(0.990)
25.91
(1.020)
10.67
(0.420)
5.97
(0.240)
22.86
(0.900)
3.18
(0.125)
LOCKING CATCH
9.52
(0.380)
0.50
(0.020)
1.57
(0.062)
5.08
(0.200)
ø
TAB
19.05
(0.750)
22.86
(0.900)
13.56
(0.530)
3.18
(0.125)
0.51
(0.020)
1.57
(0.062)
9.52
(0.375)
10.67
(0.420) 5.08
(0.200)
LOCKING CATCH
ø
10.67
(0.420)
TAB
Material: 0.63 (0.025) Thick Aluminum
Finish: Black Anodize
*Edges cut during the manufacturing process will be unfinished.
See page 110 for more information
FIGURE A FIGURE B
Note: Fins on left or right. Right hand side model shown
For additional options see page 82
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44
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
TO-220 Heat Sinks
PF750, PF758 Slip on heat sink featuring integrated tabs
Slip on heat sink is tin plated and has
integrated tabs for soldering to the PC
board. Locating features provide simple
device alignment and spring action holds
the device for good thermal contact.
22.00
(0.866)
1.70
(0.067)
"A"
"B"
9.50
(0.374)
11.00
(0.433)
11.00
(0.433)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
20
40
60
80
100
012 3 4 5
16
12
4
8
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
PF758
PF750
Part Number Description “A” Dim “B”Dim
PF750G Slip on heat sink with tabs 19.00(0.748) 3.00(0.118)
PF758G Slip on heat sink with tabs 24.00(0.945) 5.20(0.205)
ORDERING INFORMATION
Material: 0.71 (0.028) Thick Aluminum
Finish: Tin Plate
PF752 Slip on heat sink
Slip on heat sink has locating features
for simple device alignment. Spring action
holds the device for good thermal contact.
11.00
(0.433)
10.70
(0.421)
19.00
(0.748)
5.00
(0.197)
15.00
(0.590)
3.00
(0.118)
22.00
(0.866)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
20
40
60
80
100
012 3 4 5
16
12
4
8
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Part Number Description
PF752G Slip on heat sink
ORDERING INFORMATION
PF720, PF723 Slip on heat sink
Slip on heat sink has locating features
for simple device alignment. Spring
action holds the device for good thermal
contact. Available with or without solder-
able mounting tabs
4.50
(0.177)
2.10
(0.083) 18.30
(0.720)
8.10
(0.319)
20.00
(0.787)
10.80
(0.425)
16.00
(0.630)
3.00
(0.118)
19.84
(0.781)
DIA 3.00
(0.118)
1.30
(0.051)
TAB
Heat Dissipated – Watts
0
20
40
60
80
100
012 3 4 5
Mounting Surface Temp
Rise Above Ambient—°C
Part Number Description
PF720G Slip on heat sink, no solderable tabs
PF723G With solderable tabs
ORDERING INFORMATION
Material: 0.71 (0.028) Thick Aluminum
Finish: Black Anodize
Material: 0.71 (0.028) Thick Aluminum
Finish: Pre-Black Paint*
* Edges cut during manufacturing process will be unfinished
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45
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
ORDERING INFORMATION
5744, 5745, 5746, 5749 Low cost, labor saving, slide on heat sink featuring spring action
Low cost, labor saving, slide on
heat sink features spring action
to firmly hold the device tab to the
heat sink providing maximum metal
to metal contact and good thermal
conduction. Available with solder-
able tabs for horizontal or vertical
mounting to the PC board.
9.52
(0.375)
21.08
(0.830)
HOLDING TABS
DITTIN
11.81
(0.465)
10.03
(0.395)
21.84
(0.860)
14.99
(0.590)
"A"
3.18
(0.125)
9.02
(0.355)
ø3.81
(0.150)
1.57
(0.062)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
20
40
60
80
100
01 2 3 4 5
16
12
4
8
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
574402
574502
5741 Low cost, labor saving, slide on heat sink featuring spring action
Low cost, labor saving, slide on heat sink
features spring action to firmly hold the device
tab to the heat sink providing maximum metal
to metal contact and good thermal conduction.
Includes a clearance hole in the top side to allow
the use of optional hardware to attach device
and heat sink to circuit board or other surface.
Also available with solderable tabs for vertical
mounting to the PC board.
21.84
(0.860)
9.02
(0.355)
19.05
(0.750)
3.81
(0.150)
10.03
(0.395)
11.81
(0.465)
14.99
(0.590)
20.57
(0.810)
ø
7.62
(0.300)
CLEARANCE
DITTIN
9.52
(0.375)
5.33
(0.210)
1.57
(0.062)
THRU
TAB
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
20
40
60
80
100
0 1 2 3 4 5
16
12
4
8
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Part Number Description
574102B00000G Low cost slide on heat sink, no solderable tabs
574102B03300G With solderable tabs 1.91 (0.075)
ORDERING INFORMATION
10.03
(0.400)
1.57
(0.062)
5.33
(0.210)
9.52
(0.375)
9.02
(0.355)
HOLDING TABS
20.57
(0.810)
21.84
(0.860)
"A"
4.19
(0.165)
11.81
(0.465)
14.99
(0.590)
DITTIN
TAB
Material: 0.63 (0.025) Thick Aluminum
Finish: Black Anodize
Material: 0.63 (0.025) Thick Aluminum
Finish: Black Anodize
TO-220 Heat Sinks
Part Number Description Figure “A” Dim
574402B00000G Low cost slide on heat sink, no solderable tabs A 19.05 (0.750)
574402B03200G With solderable tabs for horizontal mounting A 19.05 (0.750) 1.91 (0.075)
574502B00000G Low cost slide on heat sink, no solderable tabs B 19.05 (0.750)
574502B03300G With solderable tabs for vertical mounting B 19.05 (0.750) 1.91 (0.075)
574602B00000G Low cost slide on heat sink , no solderable tabs B 17.53 (0.690)
574602B03300G With solderable tabs for vertical mounting B 17.53 (0.690) 1.91 (0.075)
574902B00000G Low cost slide on heat sink , no solderable tabs B 35.05 (1.380)
574902B03300G With solderable tabs for vertical mounting B 35.05 (1.380) 1.91 (0.075)
Position Code Description Details
A 37 Solderable tab with step to limit insertion depth Page 92
Dia of PCB
Plated Thru
Hole for Tabs
Dia of PCB
Plated Thru
Hole for Tabs
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
20
40
60
80
100
0 1 2 3 4 5
16
12
4
8
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
574902
574602
POPULAR OPTIONS:
Base part no. A
574102B0 00 00G
For additional options see page 82
FIGURE A FIGURE B
For additional options see page 82
Mounting
Kits
page 99
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46
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
ORDERING INFORMATION
5751, 5793, 5794 Snap down style heat sink featuring two side fins
Snap down style heat sink features
two side fins that act as springs
to hold the semiconductor firmly
to the heat sink. Models include an
integrated clip and device locking
catch for more robust applications.
Available for both standard and
bevel edged TO-220 packages.
Part Number Description Figure
575102B00000G Snap down heat sink A
579302B00000G With integrated clip and locking catch B
579402B00000G With integrated clip and locking catch B
for TO-220 with beveled edge
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
01 2 3 4 5
8
6
2
4
0
0400
200 600 800 1000
579302
Mounting Surface Temp
Rise Above Ambient—°C
579402
TO-220 Heat Sinks
19.05
(0.750)
12.32
(0.485)
14.22
(0.560)
3.81
(0.150)
28.45
(1.120)
THRU
ø
11.18
(0.440)
11.18
(0.440)
11.18
(0.440)
"A" "A"
579302
19.05
(0.750)
24.89
(0.980)
579402
3.15
(0.124)
LOCKING CATCH
View A-A View A-A
ø
FIGURE A FIGURE B
Material: 0.63 (0.025) Thick Aluminum
Finish: Black Anodize
For additional options see page 82
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
20
40
60
80
100
01 2 3 4 5
16
12
4
8
0
0400
200 600 800 1000
575102
Mounting Surface Temp
Rise Above Ambient—°C
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47
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
ORDERING INFORMATION
6225 Space saving staggered fin heat sink
Space saving staggered fin heat sink
for vertical mounting TO-220 devices.
Features solderable mounting tabs for
easy attachment to the PC board.
8.00
(0.315)
27.18
(1.070)
ø3.18
(0.125)
THRU
15.16
(0.597)
3.18
(0.125)
26.01
(1.024)
17.78
(0.700)
2.28
(0.090)
4.83
(0.190)
2.02
(0.080)
Part Number Description
6225B-MTG Space saving staggered fin heat sink 2.90 (0.114)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
0 1 2 3 4 5
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
12.70
(0.500)
35.05
(1.380)
25.40
(1.000)
50.80
(2.000)
2.46
(0.097) 25.40
(1.000)
18.28
(0.720)
4.75
(0.187)
3.18
(0.125)
ø 2x
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
0 2 4 6 8 10
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Copper, space saving staggered
fin heat sink for vertical mounting
TO-220 devices. Features solderable
mounting tabs for easy attachment
to the PC board.
6032 Copper, space saving staggered fin heat sink
6022 Space saving staggered fin heat sink
Space saving staggered fin
heat sink for vertical mounting
TO-220 devices. Features staked
on solderable mounting tabs for
easy attachment to the PC board.
6.35
(0.250)
22.23
(0.875)
3.18
(0.125)
30.73
(1.210)
18.54
(0.730)
1.07
(0.042)
17.78
(0.700)
2.79
(0.110)
ø
1.78
(0.070)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
0 2 4 6 8 10
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Part Number Finish
6022PBG Pre-black anodize* 2.36 (0.093)
6022BG Black anodize 2.36 (0.093)
ORDERING INFORMATION
Material: 1.02 (0.040) Thick Aluminum
Finish: Black Anodize
Material: 1.27 (0.050) Thick Copper
Finish: Tin Plated
Material: 1.02 (0.040) Thick Aluminum
Finish: See Table
ORDERING INFORMATION
Part Number Description
6032DG Copper space saving staggered fin heat sink 3.10 (0.122)
Dia of PCB
Plated Thru
Hole for Tabs
TO-220 Heat Sinks
Dia of PCB
Plated Thru
Hole for Tabs
Dia of PCB
Plated Thru
Hole for Tabs
*Edges cut during the manufacturing process will be unfinished.
See page 110 for more information
For additional options see page 85
For additional options see page 85
Grease
Epoxy
&
page112
Mounting
Kits
page 99
Grease
Epoxy
&
page112
Mounting
Kits
page 99
Grease
Epoxy
&
page112
Mounting
Kits
page 99
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THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
ORDERING INFORMATION
6232 Space saving staggered fin heat sink
Space saving staggered fin heat sink
for vertical mounting TO-220 devices.
Features solderable mounting tabs
with triangular base for easy attach-
ment to the PC board.
35.00
(1.378)
3.18
(0.125)
45.06
(1.774)
20.04
(0.789)
13.34
(0.525)
25.40
(1.000)
2.29
(0.090)
4.83
(0.190)
2.67
(0.105)
12.70
(0.500)
ø 2x
13.00
(0.512)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5
0
20
40
60
80
100
0 2 4 6 8 10
4
3
1
2
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
ORDERING INFORMATION
6.34
(0.250) 22.22
(0.875)
17.78
(0.700)
1.57
(0.062)
8.89
(0.350)
31.75
(1.250)
19.56
(0.770)
3.96
(0.156)
10.67
(0.420)
3.18
(0.125)
THRU
ø
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
0 1 2 3 4 5
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Copper, space saving staggered fin
heat sink for vertical mounting TO-220
devices. Features integrated solderable
mounting tabs for easy attachment to
the PC board.
6025 Copper, space saving staggered fin heat sink
5932 Space saving twisted fin heat sink
Space saving twisted fin heat sink
for vertical mounting TO-220 devices.
Features solderable mounting tabs for
easy attachment to the PC board.
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
0 2 4 6 8 10
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
12.20
(0.480)
35.05
(1.380)
3.17
(0.125)
THRU
TYP 2
50.80
(2.000)
4.75
(0.187)
25.40
(1.000)
2.46
(0.097)
25.40
(1.000)
18.30
(0.720)
0.81
(0.032)
ø
16.51
(0.650)
C
L
Part Number Description
593202B03500G Space saving twisted fin heat sink with solderable tabs 2.84 (0.112)
ORDERING INFORMATION
Material: 1.27 (0.050) Thick Aluminum
Finish: See Table
Material: 1.27 (0.050) Thick Copper
Finish: Tin Plated
Material: 1.27 (0.050) Thick Aluminum
Finish: Black Anodize
Dia of PCB
Plated Thru
Hole for Tabs
TO-220 Heat Sinks
Position Code Description Details
A 34 Solderable tab for 0.094 plated thru hole Page 92
Part Number Finish
6232B-MTG Black anodize 3.10 (0.122)
6232PB-MTG Pre-black anodize* 3.10 (0.122)
Dia of PCB
Plated Thru
Hole for Tabs
Part Number Description
6025DG Copper, space saving staggered fin heat sink with solderable tabs 2.54 (0.100)
Dia of PCB
Plated Thru
Hole for Tabs
*Edges cut during the manufacturing process will be unfinished.
See page 110 for more information
POPULAR OPTIONS:
Base part no. A
593202B0 00 00G
For additional options see page 82
For additional options see page 85
For additional options see page 85
Grease
Epoxy
&
page112
Mounting
Kits
page 99
Grease
Epoxy
&
page112
Mounting
Kits
page 99
Grease
Epoxy
&
page112
Mounting
Kits
page 99
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49
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
TO-220 Heat Sinks
ORDERING INFORMATION
5425 Space saving staggered fin heat sink
Space saving staggered fin heat
sink for vertical mounting TO-220
devices. Features integrated solderable
mounting tabs that can be twisted for
attachment to the PC board. Heat sink
is also available with tin plating for
soldering directly to the PC board.
22.22
(0.875)
10.67
(0.420)
1.57
(0.062)
17.78
(0.700)
6.35
(0.250)
19.56
(0.770)
31.75
(1.250)
3.96
(0.156)
THRU
3.17
(0.125)
8.89
(0.350)
ø
1.27
(0.050)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
20
40
60
80
100
0 1 2 3 4 5
16
12
4
8
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
22.20
(0.875)
3.17
(0.125)
THRU
31.75
(1.250)
19.56
(0.770)
6.35
(0.250)
1.91
(0.075)
2x 5.03
(0.198)
17.78
(0.700)
ø
C
L
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
20
40
60
80
100
0 1 2 3 4 5
16
12
4
8
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Space savings twisted fin heat sink
for vertical mounting TO-220 devices.
Features staked on solderable mounting
tabs for easy attachment to the PC board.
5925 Space saving twisted fin heat sink
Material: 1.27 (0.050) Thick Aluminum
Finish: See Table
Material: 1.27 (0.050) Thick Aluminum
Finish: See Table
ORDERING INFORMATION
Part Number Finish
592502B03400G Black anodize 2.39 (0.094)
592502U03400G Unfinished 2.39 (0.094)
Dia of PCB
Plated Thru
Hole for Tabs
Part Number Finish
542502B00000G Black anodize 2.39 (0.094)
542502D00000G Tin plated 2.39 (0.094)
Dia of PCB
Plated Thru
Hole for Tabs
For additional options see page 82
For additional options see page 82
Grease
Epoxy
&
page112
Mounting
Kits
page 99
Grease
Epoxy
&
page112
Mounting
Kits
page 99
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THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
TO-220 Heat Sinks
10.92
(0.430)
14.22
(0.560)
2.41
(0.095)
7.92
(0.312)
3.18
(0.125)
1.52
(0.060)
12.32
(0.485)
6.15
(0.242)
3.18
(0.125)
9.91
(0.390)
15.88
(0.625)
11.10
(0.437)
18.29
(0.720)
34.93
(1.375)
3.18
(0.125)
12.70
(0.500)
2.36
(0.093)
25.40
(1.000)
3.96
(0.156)
"A"
HIGH DITTIN
0.63
(0.025)
x
ø
SLOT TYP 2
1.78
(0.070)
10.19
(0.401)
x
ø
ø
2.34
(0.092)
2x
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
0246810
8
6
2
4
0
0400
200 600 800 1000
534002
533902
533802
Mounting Surface Temp
Rise Above Ambient—°C
Extruded heat sink with radial fins
and channel clip attach feature
make device attachment easy.
Includes clip and two solderable
mounting pins which permit vertical
mounting and eliminate stress on
device leads. Available in three
heights for TO-220 devices.
5338, 5339, 5340 Extruded heat sink with radial fins
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number “A” Dim
533802B02554G 25.40 (1.000) 2.67 (0.105)
533902B02554G 38.10 (1.500) 2.67 (0.105)
534002B02554G 50.80 (2.000) 2.67 (0.105)
Dia of PCB
Plated Thru
Hole for Pins
CLIP 54
19.05
(0.750)
25.40
(1.000)
2.54
(0.100)
11.68
(0.460)
41.91
(1.650)
2.36
(0.093)
THRU
3.66
(0.144)
20.96
(0.825)
3.96
(0.156)
"A"
25.40
(1.000)
12.70
(0.500)
ø
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5
0
20
40
60
80
100
048121620
4
3
1
2
0
0400
200 600 800 1000
532702
532802
532602
Mounting Surface Temp
Rise Above Ambient—°C
High power extruded heat sink
with large radial fins and
increased fin count for additional
cooling capacity. Solderable pins
allow vertical mounting without
stress on the device leads. Available
in three heights for TO-220 devices.
5326, 5327, 5328 High power extruded heat sink with large radial fins
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number “A” Dim
532602B02500G 38.10 (1.500) 2.67 (0.105)
532702B02500G 50.80 (2.000) 2.67 (0.105)
532802B02500G 63.50 (2.500) 2.67 (0.105)
Dia of PCB
Plated Thru
Hole for Pins
For additional options see page 83
2.00
(0.079)
2.15
(0.085) 15.00
(0.591)
20.00
(0.787)
3.15
(0.124)
THRU
6.00
(0.236)
10.30
(0.406)
25.00
(0.984)
19.50
(0.768)
7.49
(0.295)
ø
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
20
40
60
80
100
02 4 6 810
16
12
4
8
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Extruded channel style heat sink
features serrated fins for increased
cooling capacity. The base of the heat
sink is notched to clear the device
leads when mounted horizontally on
the printed circuit card. Narrow chan-
nel accommodates a TO-220 device.
ML26AA Extruded channel style heat sink featuring serrated fins
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number Description
ML26AAG Extruded channel style heat sink
For additional options see page 83
Grease
Epoxy
&
page112
Grease
Epoxy
&
page112
Mounting
Kits
page 99
Grease
Epoxy
&
page112
Mounting
Kits
page 99
sales.na@aavid.com www.shopaavid.com
51
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
ORDERING INFORMATION
5912 Plug in style heat sink featuring four spring action clips
Plug in style heat sink features
four spring action clips to firmly
hold the device to the heat sink
ensuring maximum metal to
metal thermal contact. Available
with solderable mounting tabs
for both horizontal and vertical
mounting to the PC board.
15.24
(0.600)
12.70
(0.500)
12.70
(0.500)
4.10
(0.160)
14.48
(0.570)
MAX
0.81
(0.032)
1.27
(0.050)
3.81
(0.150)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
20
40
60
80
100
0 1 2 3 4 5
16
12
4
8
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
5913 Plug in style heat sink featuring four spring action clips
Plug in style heat sink features four
spring action clips to firmly hold the
device to the heat sink ensuring maxi-
mum metal to metal thermal contact.
Includes 2 integrated standoffs to steady
the heat sink during wave soldering.
Available with solderable mounting tabs
for vertical mounting to the PC board.
19.05
(0.750)
3.15
(0.124)
12.70
(0.500)
14.48
(0.570)
12.70
(0.500)
1.02
(0.040)
2.67
(0.105)
MAX
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
0 1 2 3 4 5
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
ORDERING INFORMATION
(0.570)
14.48
(0.040)
1.02
(0.500)
12.70
(0.245)
6.22
(0.050)
1.27
(0.032)
0.81
(0.750)
19.05
MAX
(0.124)
3.15
12.70
(0.500)
TAB
Material: 0.81 (0.032) Thick Aluminum
Finish: Black Anodize
Material: 0.81 (0.032) Thick Aluminum
Finish: Black Anodize
TO-220 & TO-262 Heat Sinks
Part Number Description Figure
591202B00000G Plug in style heat sink, no mounting tab A
591202B03100G With horizontal mounting tab A 1.73 (0.068)
591202B04000G With vertical mounting tab B 1.75 (0.069)
Dia of PCB
Plated Thru
Hole for Tabs
1.27
(0.050)
15.24
(0.600)
6.22
(0.245)
0.81
(0.032)
12.70
(0.500)
14.48
(0.570)
12.70
(0.500)
MAX
TAB
Part Number Description Figure
591302B00000G Plug in style heat sink with integrated standoffs, no mounting tab B
591302B02800G With Shur-LockTM tab for vertical mounting A 1.73 (0.068)
591302B04000G With tab for vertical mounting B 1.75 (0.069)
Dia of PCB
Plated Thru
Hole for Tabs
FIGURE A FIGURE B
FIGURE A FIGURE B
For additional options see page 84
For additional options see page 84
sales.na@aavid.com www.shopaavid.com
52
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
PF432, PF433, PF434, PF435, PF436 Plug in style heat sink features pre-blackened finish
Plug in style heat sink features
pre-blackened finish and two
spring action clips to firmly hold
the device to the heat sink
ensuring maximum metal to
metal thermal contact. Available
with solderable mounting tabs
for both horizontal and vertical
mounting to the PC board.
4.00
(0.157)
1.30
(0.051)
19.50
(0.768)
16.80
(0.661)
5.00
(0.197)
12.70
(0.500)
7.50
(0.295)
13.00
(0.512)
3.00
(0.118)
ø
0.40
(0.016)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From
Case to Ambient—°C/Watt
10
0
20
40
60
80
100
0 1 2 3 4 5
8
6
2
4
0
0400
200 600 800 1000
Case Temp Rise
Above Ambient—°C
Part Number Description Figure Dim “A”
PF432G Plug in style heat sink with solderable tab, vertical mount A 6.20 (0.244) 1.60 (0.063)
PF433G With vertical mount no tab A
PF434G With solderable tab, horizontal mount B 1.60 (0.063)
PF435G With solderable tab, vertical mount A 9.50 (0.374) 1.60 (0.063)
PF436G With solderable tab offset from center, horizontal mount C 1.60 (0.063)
ORDERING INFORMATION
19.50
(0.768)
4.00
(0.157)
2.85
(0.112)
12.70
(0.500)
7.50
(0.295)
13.00
(0.512)
3.00
(0.118)
ø
0.27
(0.010)
Material: 0.71 (0.028) Thick Aluminum
Finish: Pre-Black Anodize*
Dia of PCB
Plated Thru
Hole for Tabs
FIGURE A FIGURE B
ORDERING INFORMATION
5768 Plug in style heat sink featuring four spring action clips
Plug in style heat sink features
four spring action clips to firmly
hold the device to the heat sink
ensuring maximum metal to
metal thermal contact. Available
with solderable mounting tabs
for both horizontal and vertical
mounting to the PC board.
19.05
(0.750)
6.22
(0.245)
0.81
(0.032)
14.48
(0.570)
12.70
(0.500)
0.813
(0.032)
4.19
(0.165)
MAX
MAX
12.70
(0.500)
19.05
(0.750)
14.48
(0.570)
12.70
(0.500)
1.27
(0.050)
12.70
(0.500)
4.06
(0.160)
1.27
(0.050)
TAB
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
0 1 2 3 4 5
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
576802V
579602U
576802B
Material: 0.81 (0.032) Thick Aluminum
Finish: See Table
Part Number Description Figure Finish
576802B00000G Slim plug in heat sink, no mounting tab A Black anodize
576802V00000G Slim plug in heat sink, no mounting tab A AavSHIELD3
576802U00000G Slim plug in heat sink, no mounting tab A Unfinished
576802B03100G With single tab for horizontal mounting A Black anodize 1.73 (0.068)
576802V03100G With single tab for horizontal mounting A AavSHIELD31.73 (0.068)
576802U03100G With single tab for horizontal mounting A Unfinished 1.73 (0.068)
576802B04000G With single tab for vertical mounting B Black anodize 1.75 (0.069)
576802V04000G With single tab for vertical mounting B AavSHIELD31.75 (0.069)
576802U04000G With single tab for vertical mounting B Unfinished 1.75 (0.069)
Dia of PCB
Plated Thru
Hole for Tabs
FIGURE A FIGURE B
For additional options see page 84
*Edges cut during the manufacturing process will be unfinished.
See page 110 for more information
19.50
(0.768)
12.00
(0.472)
3.00
(0.118)
1.30
(0.051) 5.70
(0.224)
"A"
13.00
(0.512)
12.70
(0.500)
0.40
(0.016)
ø
TAB
FIGURE C
TO-220 & TO-262 Heat Sinks
sales.na@aavid.com www.shopaavid.com
53
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
TO-220 & TO-262 Heat Sinks
5669 Plug in style heat sink with folded back fins
Plug in style heat sink with folded
back fins for extra cooling capacity.
Features four spring action clips to
firmly hold the device to the heat sink
ensuring maximum metal to metal
thermal contact. Available with or
without solderable mounting tabs
for both horizontal and vertical
mounting to the PC board.
12.70
(0.500)
12.70
(0.500)
0.81
(0.032)
21.59
(0.850)
25.40
(1.000)
1.27
(0.050)
6.20
(0.245)
TAB
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
0 1 2 3 4 5
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Part Number Description Figure
566902B00000G Plug in style heat sink with no mounting tab A
566902B03100G With horizontal mounting tab A 1.73 (0.068)
566902B04000G With vertical mounting tab B 1.75 (0.069)
ORDERING INFORMATION
12.70
(0.500)
12.70
(0.500)
1.27
(0.050)
14.86
(0.585)
4.06
(0.160)
0.81
(0.032)
21.59
(0.850)
25.40
(1.000)
C
L
TAB
Material: 0.81 (0.032) Thick Aluminum
Finish: Black Anodize
Dia of PCB
Plated Thru
Hole for Tabs
FIGURE A FIGURE B
TV96, TV97 Hat section heat sink with twisted fins
Hat section heat sink with
twisted fins is low profile and
perfect for use on circuit cards
with 0.500 spacing.The twisted
fins increase air turbulence for
better thermal performance.
17.80
(0.701)
10.20
(0.402)
17.80
(0.701)
"A"
3.66
(0.144)
13.50
(0.531)
ø
C
L
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
25
0
20
40
60
80
100
012 3 4 5
20
15
5
10
0
0400
200 600 800 1000
TV97
TV96
Mounting Surface Temp
Rise Above Ambient—°C
Material: 0.99 (0.039) Thick Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number “A” Dim
TV96G 31.70 (1.248)
TV97G 44.40 (1.748)
TO-220 & TO-218 & TO-247 Heat Sinks
For additional options see page 82
Grease
Epoxy
&
page112
Mounting
Kits
page 99
sales.na@aavid.com www.shopaavid.com
54
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
TO-220 & TO-218 & TO-247 Heat Sinks
ORDERING INFORMATION
5301 High rise style heat sink features twisted fins and Wave-OnTM solderable mounts
High rise style heat sink features
twisted fins and Wave-OnTM solder-
able mounts for easy attachment
to the PC card. Models include thru
holes on one side to attach devices
using standard hardware and dittins
with special slots on the other for
easy device attachment using a con-
venient spring clip. Dual models use
two dittins and clips to locate and
attach devices.
Part Number Description Device Figure “A” Dim
530101B00100G Heat sink twisted fin TO-218, TO-247 21.08 (0.830) 4.75 (0.187)
530101B00150G With device clip #50 TO-218,TO-247 A 21.08 (0.830) 4.75 (0.187)
530102B00100G Heat sink twisted fin TO-220 18.29 (0.720) 4.75 (0.187)
530102B00150G With device clip #50 TO-220 A 18.29 (0.720) 4.75 (0.187)
530161B00162G With two device clips #62 Dual TO-218, TO-247 B 21.08 (0.830) 4.75 (0.187)
530162B00162G With two device clips #62 Dual TO-220 B 18.29 (0.720) 4.75 (0.187)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5
0
20
40
60
80
100
0 4 8 12 16 20
4
3
1
2
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
530161 or 530162
530101 or 530102
5308 High rise style heat sink features twisted fins and solderable tabs
High rise style heat sink features
twisted fins and solderable tabs
for easy attachment to the PC card.
Models include thru holes on one
side to attach devices using stan-
dard hardware and dittins with
special slots on the other for easy
device attachment using a conven-
ient spring clip. Dual models use
two dittins and clips to locate and
attach devices.
RECOMMENDED
HOLE PATTERN
43.13
(1.698)
2.95
(0.116)
THRU 2x
44.45
(1.750)
2.54
(0.100)
3.20
(0.126)
"A"
3.00
(0.118)
22.90
(0.900)
14.99
(0.590)
3.48
(0.137)
14.99
(0.590)
7.62
(0.300)
ø
10.16
(0.400)
45.72
(1.800)
46.74
(1.841)
ø
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5
0
20
40
60
80
100
0 4 8 12 16 20
4
3
1
2
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
530861 or 530862
530801 or 530802
Material: 1.60 (0.063) Thick Aluminum
Finish: Black Anodize
Material: 1.60 (0.063) Thick Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number Description Device Figure “A” Dim
530801B05100G Heat sink twisted fin and solderable tabs TO-218,TO-247 21.08 (0.830) 2.95 (0.116)
530801B05150G With device clip #50 TO-218,TO-247 A 21.08 (0.830) 2.95 (0.116)
530802B05100G Heat sink twisted fin and solderable tabs TO-220 18.29 (0.720) 2.95 (0.116)
530802B05150G With device clip #50 TO-220 A 18.29 (0.720) 2.95 (0.116)
530861B05162G With two device clips #62 Dual TO-218,TO-247 B 21.08 (0.830) 2.95 (0.116)
530862B05162G With two device clips #62 Dual TO-220 B 18.29 (0.720) 2.95 (0.116)
Dia of PCB
Plated Thru
Hole for Tabs
Dia of PCB
Plated Thru
Hole for Tabs
TYP
4.06
(0.160)
12.70
(0.500)
6.60
(0.260)
30.61
(1.205)
2.79
(0.110)
0.76
(0.030)
x
HIGH
ø
DITTIN
12.45
(0.490)
2.54
(0.100)
1.57
(0.062)
2.79
(0.110)
0.76
(0.030)
x
HIGH
Ø
DITTIN
12.45
(0.490)
2.54
(0.100)
1.57
(0.062)
2X
TYP
4.06
(0.160)
12.70
(0.500)
6.60
(0.260)
30.61
(1.205)
2.79
(0.110)
0.76
(0.030)
x
HIGH
ø
DITTIN
12.45
(0.490)
TYP
4.06
(0.160)
12.70
(0.500)
6.60
(0.260)
30.61
(1.205)
2.79
(0.110)
0.76
(0.030)
X
HIGH
ø
DITTIN
12.45
(0.490)
2X
TYP
4.06
(0.160)
12.70
(0.500)
6.60
(0.260)
30.61
(1.205)
FIGURE A FIGURE B
FIGURE A FIGURE B
CLIP 50
CLIP 50 CLIP 62
CLIP 62
BASE PART
44.45
(1.750)
2.54
(0.100)
3.20
(0.126)
THRU
"A"
3.00
(0.118)
4.24
(0.167) 14.99
(0.590)
3.48
(0.137)
14.99
(0.590)
7.50
(0.295)
ø
7.62
(0.300)
24.13
(0.950)
44.45
(1.750)
10.16
(0.400)
BASE PART
For additional options see page 82
For additional options see page 82
Grease
Epoxy
&
page112
Mounting
Kits
page 99
Grease
Epoxy
&
page112
Mounting
Kits
page 99
sales.na@aavid.com www.shopaavid.com
55
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
TO-220 & TO-218 & TO-247 Heat Sinks
5330, 5331, 5332, 5333 Extruded heat sink with radial fins
Extruded heat sink with radial
fins and clip attach feature
makes device attachment easy.
Includes two solderable mounting
pins which permit vertical mount-
ing and eliminate stress on device
leads. Available in four heights for
TO-220,TO-218 and TO-247 devices.
39.10
(1.540)
6.60
(0.260)
13.50
(0.530)
25.40
(1.000)
2x
2.36
(0.093)
2x3.96
(0.156)
3.18
(0.125)
0.64
(0.025)
"A"
"B"
NOTCH
FOR CLIP 2x
34.92
(1.375)
12.70
(0.500)
DITTIN
HIGH
øX
"C"
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
02 4 6 810
8
6
2
4
0
0400
200 600 800 1000
53310X
53300X
Mounting Surface Temp
Rise Above Ambient—°C
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number Device “A” Dim “B” Dim “C” Dim
533001B02551G TO-218,TO-247 25.40 (1.000) 21.59 (0.850) 17.02 (0.670) 2.67 (0.105)
533002B02551G TO-220 25.40 (1.000) 18.29 (0.720) 15.88 (0.625) 2.67 (0.105)
533101B02551G TO-218,TO-247 38.10 (1.500) 21.59 (0.850) 17.02 (0.670) 2.67 (0.105)
533102B02551G TO-220 38.10 (1.500) 18.29 (0.720) 15.88 (0.625) 2.67 (0.105)
533201B02551G TO-218,TO-247 50.80 (2.000) 21.59 (0.850) 17.02 (0.670) 2.67 (0.105)
533202B02551G TO-220 50.80 (2.000) 18.29 (0.720) 15.88 (0.625) 2.67 (0.105)
533301B02551G TO-218,TO-247 63.50 (2.500) 21.59 (0.850) 17.02 (0.670) 2.67 (0.105)
533302B02551G TO-220 63.50 (2.500) 18.29 (0.720) 15.88 (0.625) 2.67 (0.105)
Dia of PCB
Plated Thru
Hole for Pins
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
02 4 6 810
8
6
2
4
0
0400
200 600 800 1000
53330X
53320X
Mounting Surface Temp
Rise Above Ambient—°C
For additional options see page 83
CLIP 51
5304 High rise style heat sink features staggered fins and Wave-OnTM solderable mounts
High rise style heat sink features
staggered fins and Wave-OnTM
solderable mounts for easy attach-
ment to the PC card. Models include
thru holes on one side to attach
devices using standard hardware
and dittins with special slots on the
other for easy device attachment
using a convenient spring clip.
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5
0
20
40
60
80
100
0 4 8 12 16 20
4
3
1
2
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Part Number Description Device “A” Dim
530401B00100G High rise style heat sink staggered fins TO-218, TO-247 21.08 (0.830) 4.75 (0.187)
530401B00150G With device clip #50 TO-218,TO-247 21.08 (0.830) 4.75 (0.187)
530402B00100G High rise style heat sink staggered fins TO-220 18.29 (0.720) 4.75 (0.187)
530402B00150G With device clip #50 TO-220 18.29 (0.720) 4.75 (0.187)
ORDERING INFORMATION
24.13
(0.950)
44.45
(1.750)
ø
3.20
(0.126)
THRU
7.49
(0.295)
"A"
2.54
(0.100)
12.45
(0.490)
19.05
(0.750)
2.79
(0.110)
0.76
(0.030)
44.45
(1.750)
x
HIGH
ø
7.62
(0.300)
10.16
(0.400)
3.00
(0.118)
4.24
(0.167) 14.99
(0.590)
3.48
(0.137)
14.99
(0.590)
1.57
(0.060)
2.54
(0.100)
DITTIN
TYP
4.06
(0.160)
12.70
(0.500)
6.60
(0.260)
30.61
(1.205)
Material: 1.60 (0.063) Thick Aluminum
Finish: Black Anodize
Dia of PCB
Plated Thru
Hole for Tabs
CLIP 50
For additional options see page 82
Grease
Epoxy
&
page112
Grease
Epoxy
&
page112
Mounting
Kits
page 99
sales.na@aavid.com www.shopaavid.com
56
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
5297, 5298, 5299, 5300 Extruded heat sink with large radial fins
Extruded heat sink with large radial
fins features equal channel widths on
both sides for single or dual device
mounting. Includes two solderable
mounting pins which permit vertical
mounting and eliminate stress on
device leads. Available in four heights
for TO-220, TO-218, and TO-247 devices.
3.18
(0.125)
14.22
(0.560)
13.72
(0.540)
25.40
(1.000)
"C"
"A"
"B"
20.96
(0.825)
41.91
(1.650)
17.02
(0.670)
1.57
(0.062)
3.96
(0.156)
25.40
(1.000)
2.36
(0.093)
2x
2x
ø
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5
0
20
40
60
80
100
0 4 8 12 16 20
4
3
1
2
0
0400
200 600 800 1000
52980X
52970X
Mounting Surface Temp
Rise Above Ambient—°C
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number Device “A” Dim “B” Dim “C” Dim
529701B02500G TO-218,TO-247 25.40 (1.000) 21.59 (0.850) 3.66 (0.144) 2.67 (0.105)
529702B02500G TO-220 25.40 (1.000) 18.29 (0.720) 3.17 (0.125) 2.67 (0.105)
529801B02500G TO-218,TO-247 38.10 (1.500) 21.59 (0.850) 3.66 (0.144) 2.67 (0.105)
529802B02500G TO-220 38.10 (1.500) 18.29 (0.720) 3.17 (0.125) 2.67 (0.105)
529901B02500G TO-218,TO-247 50.80 (2.000) 21.59 (0.850) 3.66 (0.144) 2.67 (0.105)
529902B02500G TO-220 50.80 (2.000) 18.29 (0.720) 3.17 (0.125) 2.67 (0.105)
530001B02500G TO-218,TO-247 63.50 (2.500) 21.59 (0.850) 3.66 (0.144) 2.67 (0.105)
530002B02500G TO-220 63.50 (2.500) 18.29 (0.720) 3.17 (0.125) 2.67 (0.105)
Dia of PCB
Plated Thru
Hole for Pins
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5
0
20
40
60
80
100
0 4 8 12 16 20
4
3
1
2
0
0400
200 600 800 1000
53000X
52990X
Mounting Surface Temp
Rise Above Ambient—°C
For additional options see page 83
TO-220 & TO-218 & TO-247 Heat Sinks
SW25, SW38, SW50, SW63 Extruded heat sink with unequal channel widths
Extruded heat sink with unequal
channel widths front and back
can accommodate a TO-220, TO-218,
or TO-247 devices. Includes two solder-
able mounting pins which permit verti-
cal mounting and eliminate stress on
device leads. Available in three heights.
Version without hole uses clip 5901
(sold separately) to attach device.
See page 97 for clip information.
25.00
(0.984) 19.90
(0.783) 15.00
(0.591)
4.00
(0.157) 2.50
(0.098)
25.40
(1.000)
3.20
(0.126)
"A"
SEE NOTE 1
TYP
ø
34.50
(1.358)
12.50
(0.492)
6.25
(0.246) 2.00
(0.079)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
024 6 810
8
6
2
4
0
0400
200 600 800 1000
SW38
SW25
Mounting Surface Temp
Rise Above Ambient—°C
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number Description “A” Dim Holes
SW25-2G Extruded heat sink with unequal channel widths front and back 25.00 (0.984) No 3.00 (0.118)
SW25-4G With device mounting holes 25.00 (0.984) Yes 3.00 (0.118)
SW38-2G Extruded heat sink with unequal channel widths front and back 38.00 (1.496) No 3.00 (0.118)
SW38-4G With device mounting holes 38.00 (1.496) Yes 3.00 (0.118)
SW50-2G Extruded heat sink with unequal channel widths front and back 50.00 (1.968) No 3.00 (0.118)
SW50-4G With device mounting holes 50.00 (1.968) Yes 3.00 (0.118)
SW63-2G Extruded heat sink with unequal channel widths front and back 63.00 (2.480) No 3.00 (0.118)
SW63-4G With device mounting holes 63.00 (2.480) Yes 3.00 (0.118)
Dia of PCB
Plated Thru
Hole for Pins
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
024 6 810
8
6
2
4
0
0400
200 600 800 1000
SW63
SW50
Mounting Surface Temp
Rise Above Ambient—°C
Grease
Epoxy
&
page112
Mounting
Kits
page 99
Grease
Epoxy
&
page112
Mounting
Kits
page 99
NOTE 1:This hole not present in SW25 model
sales.na@aavid.com www.shopaavid.com
57
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
TO-220 & TO-218 & TO-247 Heat Sinks
7.62
(0.300)
16.51
(0.650)
25.65
(1.01)
REF
6.60
(0.260)
2.39
(0.093)
3.96
(0.156)
17.02
(0.670)
41.91
(1.650)
25.40
(1.000)
25.40
(1.000)
"B"
"A"
3.18 (0.125)
X 0.64 (0.025)
HIGH DITTIN
2x
2x
ø
ø
AA
3.17
(0.125)
VIEW A-A
SINGLE HEAT SINK DEVICE
17.02
(0.670)
41.91
(1.650)
25.40
(1.000)
VIEW A-A
DUAL HEAT SINK DEVICE
12.70
(0.500)
13.72
(0.540)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5
0
20
40
60
80
100
0 4 8 12 16 20
4
3
1
2
0
0400
200 600 800 1000
5334XX
5335XX
Mounting Surface Temp
Rise Above Ambient—°C
Extruded heat sink with large
radial fins and channel clip
attach feature makes device
attachment easy. Includes clip
and two solderable mounting
pins which permit vertical
mounting and eliminate stress
on device leads. Available in
four heights for TO-220, TO-218,
and TO-247 devices.
5334, 5335, 5336, 5337 Extruded heat sink with large radial fins
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number Device Description “A” Dim “B” Dim
533401B02552G TO-218,TO-247 Extruded heat sink with radial fins and device clip #52 38.10 (1.500) 21.59 (0.850) 2.67 (0.105)
533402B02552G TO-220 Extruded heat sink with radial fins and device clip #52 38.10 (1.500) 18.29 (0.720) 2.67 (0.105)
533421B02552G Dual TO-218, TO-247 With 2 device clips #52 38.10 (1.500) 21.59 (0.850) 2.67 (0.105)
533422B02552G Dual TO-220 With 2 device clips #52 38.10 (1.500) 18.29 (0.720) 2.67 (0.105)
533501B02552G TO-218,TO-247 Extruded heat sink with radial fins and device clip #52 50.80 (2.000) 21.59 (0.850) 2.67 (0.105)
533502B02552G TO-220 Extruded heat sink with radial fins and device clip #52 50.80 (2.000) 18.29 (0.720) 2.67 (0.105)
533521B02552G Dual TO-218, TO-247 With 2 device clips #52 50.80 (2.000) 21.59 (0.850) 2.67 (0.105)
533522B02552G Dual TO-220 With 2 device clips #52 50.80 (2.000) 18.29 (0.720) 2.67 (0.105)
533601B02552G TO-218,TO-247 Extruded heat sink with radial fins and device clip #52 63.50 (2.500) 21.59 (0.850) 2.67 (0.105)
533602B02552G TO-220 Extruded heat sink with radial fins and device clip #52 63.50 (2.500) 18.29 (0.720) 2.67 (0.105)
533621B02552G Dual TO-218, TO-247 With 2 device clips #52 63.50 (2.500) 21.59 (0.850) 2.67 (0.105)
533622B02552G Dual TO-220 With 2 device clips #52 63.50 (2.500) 18.29 (0.720) 2.67 (0.105)
533701B02552G TO-218,TO-247 Extruded heat sink with radial fins and device clip #52 25.40 (1.000) 21.59 (0.850) 2.67 (0.105)
533702B02552G TO-220 Extruded heat sink with radial fins and device clip #52 25.40 (1.000) 18.29 (0.720) 2.67 (0.105)
533721B02552G Dual TO-218, TO-247 With 2 device clips #52 25.40 (1.000) 21.59 (0.850) 2.67 (0.105)
533722B02552G Dual TO-220 With 2 device clips #52 25.40 (1.000) 18.29 (0.720) 2.67 (0.105)
Dia of PCB
Plated Thru
Hole for Pins
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5
0
20
40
60
80
100
0 4 8 12 16 20
4
3
1
2
0
0400
200 600 800 1000
5336XX
5337XX
Mounting Surface Temp
Rise Above Ambient—°C
For additional options see page 83
CLIP 52
Grease
Epoxy
&
page112
SEE NOTE 1
SEE NOTE 1
NOTE 1: Graph depicts single device models. Dual device models
exhibit a 15% performance increase.
sales.na@aavid.com www.shopaavid.com
58
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
TO-220 & TO-218 & TO-247 Heat Sinks
5130, 5131, 5132, 5133 Extruded heat sink with radial fins
Extruded heat sink with radial fins
feature equal channel widths on
both sides for single or dual device
mounting. Includes two solderable
mounting pins which permit vertical
mounting and eliminate stress on
device leads. Available in four heights
for TO-220,TO-218, and TO-247 devices.
(0.500)
12.70
(0.125)
3.18
(1.375)
34.92
(0.062)
1.57
(1.000)
25.40
2x
(0.156)
3.96
2x
(0.093)
2.37
"A"
"B"
"C"
ø
17.48
(0.688)
"D"
"E"
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
02 4 6 810
8
6
2
4
0
0400
200 600 800 1000
51310X
51300X
Mounting Surface Temp
Rise Above Ambient—°C
Material: Aluminum
Finish: Black Anodize
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5
0
20
40
60
80
100
02 4 6 810
4
3
1
2
0
0400
200 600 800 1000
51330X
51320X
Mounting Surface Temp
Rise Above Ambient—°C
ORDERING INFORMATION
Part Number Device “A” Dim “B” Dim “C” Dim “D” Dim “E” Dim
513001B02500G TO-218,TO-247 25.40 (1.000) 21.59 (0.850) 3.66 (0.144) 17.02 (0.670) 13.72 (0.540) 2.67 (0.105)
513002B02500G TO-220 25.40 (1.000) 18.29 (0.720) 3.17 (0.125) 15.88 (0.625) 11.10 (0.437) 2.67 (0.105)
513101B02500G TO-218,TO-247 38.10 (1.500) 21.59 (0.850) 3.66 (0.144) 17.02 (0.670) 13.72 (0.540) 2.67 (0.105)
513102B02500G TO-220 38.10 (1.500) 18.29 (0.720) 3.17 (0.125) 15.88 (0.625) 11.10 (0.437) 2.67 (0.105)
513201B02500G TO-218,TO-247 50.80 (2.000) 21.59 (0.850) 3.66 (0.144) 17.02 (0.670) 13.72 (0.540) 2.67 (0.105)
513202B02500G TO-220 50.80 (2.000) 18.29 (0.720) 3.17 (0.125) 15.88 (0.625) 11.10 (0.437) 2.67 (0.105)
513301B02500G TO-218,TO-247 63.50 (2.500) 21.59 (0.850) 3.66 (0.144) 17.02 (0.670) 13.72 (0.540) 2.67 (0.105)
513302B02500G TO-220 63.50 (2.500) 18.29 (0.720) 3.17 (0.125) 15.88 (0.625) 11.10 (0.437) 2.67 (0.105)
Dia of PCB
Plated Thru
Hole for Pins
BW38, BW50, BW63 Wide extruded heat sink with unequal channel
Wide extruded heat sink with
unequal channel widths on front
and back can accommodate a TO-220,
TO-218, or TO-247 device. Includes two
solderable mounting pins which permit
vertical mounting and eliminate stress
on device leads. Available in three heights.
Versions without hole use clip 6801 (sold
separately) to attach device. See page 97
for clip information.
25.40
(1.000)
4.00
(0.157)
2.60
(0.101)
25.40
(1.000)
21.60
(0.850)
2.00
(0.079)
3.6
(0.144)
"A"
ø
34.90
(1.375)
12.70
(0.500)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
048121620
8
6
2
4
0
0400
200 600 800 1000
BW50
BW63
BW38
Mounting Surface Temp
Rise Above Ambient—°C
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number Description “A” Dim Holes
BW38-2G Extruded heat sink with unequal channel widths front and back 38.00 (1.496) No 3.00 (0.118)
BW38-4G With device mounting hole 38.00 (1.496) Yes 3.00 (0.118)
BW50-2G Extruded heat sink with unequal channel widths front and back 50.00 (1.968) No 3.00 (0.118)
BW50-4G With device mounting hole 50.00 (1.968) Yes 3.00 (0.118)
BW63-2G Extruded heat sink with unequal channel widths front and back 63.00 (2.480) No 3.00 (0.118)
BW63-4G With device mounting hole 63.00 (2.480) Yes 3.00 (0.118)
Dia of PCB
Plated Thru
Hole for Pins
For additional options see page 83
Grease
Epoxy
&
page112
Mounting
Kits
page 99
Grease
Epoxy
&
page112
Mounting
Kits
page 99
sales.na@aavid.com www.shopaavid.com
59
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
TO-220 & TO-202 Heat Sinks
SW25-6, SW38-6 Extruded heat sink with unequal channel widths
Extruded heat sink with unequal
channel widths front and back
can accommodate a TO-220 or
TO-202 device. Includes two solder-
able mounting pins which permit
vertical mounting and eliminate stress
on device leads. Clip 5901 (sold sepa-
rately) can be used to attach device.
See page 97 for clip information.
25.00
(0.984) 19.90
(0.783) 15.00
(0.591)
4.00
(0.157)
2.50
(0.098)
25.40
(1.000)
3.20
(0.126)
"A"
SEE NOTE 1
TYP
ø
34.50
(1.358)
12.50
(0.492)
6.25
(0.246)
2.00
(0.079)
NOTCH
11mm DEEP
10.4mm WIDE
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
024 6 810
8
6
2
4
0
0400
200 600 800 1000
SW38
SW25
Mounting Surface Temp
Rise Above Ambient—°C
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number Description “A” Dim
SW25-6G Extruded heat sink with unequal channel widths front and back 25.00 (0.984) 3.00 (0.118)
SW38-6G Extruded heat sink with unequal channel widths front and back. 38.00 (1.496) 3.00 (0.118)
(0.500)
12.70
(0.437)
11.10
(0.370)
9.40
(1.375)
34.92
(0.062)
1.57
(1.000)
25.40
2x
(0.156)
3.96
2x
(0.093)
2.37
"A"
ø
17.48
(0.688)
13.46
(0.530)
18.29
(0.720)
3x
(0.125)
3.18
ø
25.40
(1.000)
(0.625)
15.88
SEE NOTE 1
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
02 4 6 810
8
6
2
4
0
0400
200 600 800 1000
531102
531002
Mounting Surface Temp
Rise Above Ambient—°C
Extruded heat sink with radial
fins and notched base features
equal channel widths on both sides
and mounting holes to accomodate
TO-220 and TO-202 devices. Includes
two solderable mounting pins which
permit vertical mounting and elimi-
nate stress on device leads. Available
in four heights.
5310, 5311, 5312, 5313 Extruded heat sink with radial fins & notched base
Material: Aluminum
Finish: See Table
ORDERING INFORMATION
Part Number “A” Dim Finish
531002B02500G 25.40 (1.000) Black anodize 2.67 (0.105)
531002V02500G 25.40 (1.000) AavSHIELD32.67 (0.105)
531102B02500G 38.10 (1.500) Black anodize 2.67 (0.105)
531102V02500G 38.10 (1.500) AavSHIELD32.67 (0.105)
531202B02500G 50.80 (2.000) Black anodize 2.67 (0.105)
531202V02500G 50.80 (2.000) AavSHIELD32.67 (0.105)
531302B02500G 63.50 (2.500) Black anodize 2.67 (0.105)
531302V02500G 63.50 (2.500) AavSHIELD32.67 (0.105)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
02 4 6 810
8
6
2
4
0
0400
200 600 800 1000
531302
531202
Mounting Surface Temp
Rise Above Ambient—°C
Dia of PCB
Plated Thru
Hole for Pins
Dia of PCB
Plated Thru
Hole for Pins
For additional options see page 83
NOTE 1:This hole not present in 5310 series
Grease
Epoxy
&
page112
Mounting
Kits
page 99
Grease
Epoxy
&
page112
Mounting
Kits
page 99
NOTE 1:This hole not present in SW25 series
sales.na@aavid.com www.shopaavid.com
60
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
6396, 6398, 6399, 6400 High power extruded heat sink with large radial fins
High power extruded heat sink
with large radial fins and solder-
able shoulder pins allows vertical
mounting without stress on the
device leads. Available with shoul-
der pins to provide fixed clearance
between the bottom of the heat
sink and the board. Available in
four heights for TO-220, TO-218,
TO-247and multiwatt devices.
1.57
(0.062)
25.40
(1.000)
41.91
(1.650)
19.05
(0.750)
2.41
(0.095)
1.27
(0.050)
2.46
(0.097) 5.49
(0.216)
"A"
3.81
(0.150)
REF
REF
25.40
(1.000)
0.78
(0.031)
ø
SEE DETAIL A
P2 MODEL ONLY
DETAIL A
P2 MODEL ONLY
3.96
(0.156) 2.21
(0.087)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5
0
20
40
60
80
100
048 121620
4
3
1
2
0
0400
200 600 800 1000
6398
6396
Mounting Surface Temp
Rise Above Ambient—°C
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number Description “A” Dim
6396BG Extruded heat sink with large radial fins and straight pins 25.40 (1.000) 2.89 (0.114)
6396B-P2G With solderable shoulder pins 25.40 (1.000) 3.10 (0.122)
6398BG Extruded heat sink with large radial fins and straight pins 38.10 (1.500) 2.89 (0.114)
6398B-P2G With solderable shoulder pins 38.10 (1.500) 3.10 (0.122)
6399BG Extruded heat sink with large radial fins and straight pins 50.80 (2.000) 2.89 (0.114)
6399B-P2G With solderable shoulder pins 50.80 (2.000) 3.10 (0.122)
6400BG Extruded heat sink with large radial fins and straight pins 63.50 (2.500) 2.89 (0.114)
6400B-P2G With solderable shoulder pins 63.50 (2.500) 3.10 (0.122)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5
0
20
40
60
80
100
048 121620
4
3
1
2
0
0400
200 600 800 1000
6400
6399
Mounting Surface Temp
Rise Above Ambient—°C
Dia of PCB
Plated Thru
Hole for Pins
6380, 6381, 6382 High power extruded heat sink
High power extruded heat sink
for SIP packages. Solderable pins
allow vertical mounting without
stress on the device leads. Available
in three heights. Can also be used
for dual TO-220, TO-218,TO-247
and multiwatt devices.
18.29
(0.720)
3.96
(0.156) 19.86
(0.782)
9.93
(0.391)
3.81
(0.150)
33.05
(1.301)
31.74
(1.250)
25.40
(1.000)
28.70
(1.130)
41.91
(1.650)
2.64
(0.104)
11.91
(0.469)
1.58
(0.062)
ø
"A"
2.21
(0.087)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5
0
20
40
60
80
100
0 4 8 12 16 20
4
3
1
2
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
6381
6382
6380
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number Description “A” Dim
6380BG Extruded heat sink with solderable pins 25.40 (1.000) 2.89 (0.114)
6381BG Extruded heat sink with solderable pins 38.10 (1.500) 2.89 (0.114)
6382BG Extruded heat sink with solderable pins 50.80 (2.000) 2.89 (0.114)
Dia of PCB
Plated Thru
Hole for Pins
TO-220 & TO-218 & TO-247 & Multiwatt Heat Sinks
For additional options see page 85
For additional options see page 85
Grease
Epoxy
&
page112
Mounting
Kits
page 99
Grease
Epoxy
&
page112
Mounting
Kits
page 99
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THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
6374 Extruded heat sink for SIP packages
Extruded heat sink for SIP
packages. Solderable pins
allow vertical mounting
without stress on the device
leads. Can also be used for
dual TO-220,TO-218,TO-247,
and multiwatt devices.
3.96
(0.156) 2.18
(0.086)
31.75
(1.250)
38.10
(1.500)
2.92
(0.115)
17.50
(0.689)
32.00
(1.260)
16.00
(0.630)
8.00
(0.315)
DETAIL A
SEE DETAIL A
24.38
(0.960)
59.99
(2.362)
17.78
(0.700)
3.81
(0.150)
ø
2X
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5
0
20
40
60
80
100
02 4 6 810
4
3
1
2
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number Description
6374BG Extruded heat sink with solderable pins 2.89 (0.114)
Dia of PCB
Plated Thru
Hole for Pins
YB32-4 High power flat back extruded channel style heat sink
High power flat back extruded channel
style heat sink features a wide channel
to accommodate several devices. Includes
two solderable pins to allow vertical
mounting without stress on the device
leads. Can be used with TO-220,TO-218,
TO-247, and multiwatt devices.
2X 3.00
(0.118)
19.00
(0.748)
4.00
(0.157) 38.30
(1.508)
Ø 3.10
(0.122)
THRU
16.00
(0.630)
32.00
(1.260) 4.70
(0.185)
60.00
(2.362)
2X
32.00
(1.260)
8.00
(0.315)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
0 2 4 6 8 10
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number Description
YB32-4G High power flat back extruded heat sink 3.48 (0.137)
TO-220 & TO-218 & TO-247 & Multiwatt Heat Sinks
5810, 5811, 5812 Flat back extruded heat sink featuring solderable pins
Flat back extruded heat sink features
solderable pins which allow vertical
mounting without stess on the device
leads. Available in three heights for
TO-220 and TO-218 devices.
10.29
(0.405)
TYP 2
2.36
(0.093)
3.96
(0.156)
8.13
(0.320)
16.26
(0.640)
"A"
16.26
(0.640)
3.45
(0.136)
#6 - 32 UNC THRU
"B"
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
012 345
8
6
2
4
0
0400
200 600 800 1000
58110X
58100X
Mounting Surface Temp
Rise Above Ambient—°C
58120X
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number Device “A” Dim “B” Dim
581001B02500G TO-218 25.40 (1.000) 21.59 (0.850) 2.67 (0.105)
581002B02500G TO-220 25.40 (1.000) 18.29 (0.720) 2.67 (0.105)
581101B02500G TO-218 38.10 (1.500) 21.59 (0.850) 2.67 (0.105)
581102B02500G TO-220 38.10 (1.500) 18.29 (0.720) 2.67 (0.105)
581201B02500G TO-218 50.80 (2.000) 21.59 (0.850) 2.67 (0.105)
581202B02500G TO-220 50.80 (2.000) 18.29 (0.720) 2.67 (0.105)
Dia of PCB
Plated Thru
Hole for Pins
For additional options see page 85
For additional options see page 83
Grease
Epoxy
&
page112
Mounting
Kits
page 99
Grease
Epoxy
&
page112
Mounting
Kits
page 99
Grease
Epoxy
&
page112
Mounting
Kits
page 99
Dia of PCB
Plated Thru
Hole for Pins
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62
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
5922 Plug in style heat sink
Plug in style heat sink requires no
hardware to attach to the device.
The four spring action clips apply
even pressure eliminating gaps
between the heat sink and device
which rob thermal performance.
24.89
(0.980)
50.04
(1.970)
49.53
(1.950)
11.94
(0.470)
12.70
(0.500)
5.08
(0.200)
1.27
(0.050)
1.90
(0.075)
1.02
(0.040)
0.81
(0.032)
26.54
(1.045)
25.40
(1.000)
Part Number Description
592201B03400G High power plug in heat sink with folded back fins 2.39 (0.094)
and solderable mounting tabs
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
2.0
0
20
40
60
80
100
048121620
1.6
1.2
0.4
0.8
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
ORDERING INFORMATION
41.66
(1.640)
24.77
(0.975)
3.81
(0.150)
THRU
20.57
(0.810)
43.18
(1.700)
8.89
(0.350)
12.70
(0.500)
5.08
(0.200)
1.27
(0.050)
2.54
(0.100)
C
L
6.22
(0.245) 0.81
(0.032)
1.02
(0.040)
ø
Part Number Description
593101B03600G Channel style heat sink with folded back fins 2.92 (0.115)
and solderable tabs
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
02 46810
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Channel style heat sink with
folded back fins for extra cooling
capacity. The heat sink features sol-
derable tabs for easy attachment
to the PC board.
5931 Channel style heat sink with folded back fins
7130 Copper slide on heat sink
Copper slide on heat sink
requires no hardware to
attach the device. In addition,
the copper heat sink is tin/lead
plated to allow easy soldering
to the PC board.
26.04
(1.025)
9.52
(0.375)
25.53
(1.005)
15.49
(0.610)
16.51
(0.650)
1.27
(0.050)
3.81
(0.150) 2.79
(0.110)
1.27
(0.050)
17.15
(0.675)
Top cut away
to show detail
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
012 3 45
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Part Number Description
7130DG Slide on, channel style heat sink with integrated tabs 2.54 (0.100)
ORDERING INFORMATION
Material: 1.27 (0.050) Thick Aluminum
Finish: Black Anodize
Material: 1.27 (0.050) Thick Aluminum
Finish: Black Anodize
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
TO-218 Heat Sinks
Position Code Description Details
A 1 Kon-DuxTM pad Page 86
A 3 In-Sil-8TM pad Page 86
POPULAR OPTIONS:
Base part no. A
593101B 0 0000G
For additional options see page 82
For additional options see page 82
ORDERING INFORMATION
Grease
Epoxy
&
page112
Mounting
Kits
page 99
Mounting
Kits
page 99
Dia of PCB
Plated Thru
Hole for Tabs
Dia of PCB
Plated Thru
Hole for Tabs
Dia of PCB
Plated Thru
Hole for Tabs
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THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
TO-202 Heat Sinks
ORDERING INFORMATION
5063 Low profile hat section heat sink
Low profile hat section heat sink
has a total height of 0.375 making
it perfect for mounting to printed
circuit boards with 0.500 centering
between boards.
44.45
(1.750)
13.46
(0.530) 17.78
(0.700)
ø3.66
(0.144)
THRU 7.78
(0.700)
9.52
(0.375)
10.41
(0.410)
5.59
(0.220)
NOTCH IS
0.410 WIDE
X 0.220 DEEP
Part Number Description
506304B00000G Hat section heat sink
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
20
40
60
80
100
01 2 3 4 5
16
12
4
8
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
ORDERING INFORMATION
14.66
(0.577)
7.75
(0.305)
6.35
(0.250)
20.32
(0.800)
9.40
(0.370)
10.16
(0.400)
2.36
(0.093)
ø
DITTIN
Part Number Finish
574004B00000G Black anodize
574004U00000G Unfinished
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
20
40
60
80
100
01 2 3 4 5
16
12
4
8
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Low cost slide on heat sink
provides positive retention with
an integral locking tab.The spring
tension ensures excellent thermal
contact for maximum performance.
Requires no hardware to mount.
5740 Low cost slide on heat sink
5742, 5796, 5797 Low cost slide on cooler heat sink
Low cost slide on cooler heat sink
is easy to assemble to the device
and requires no mounting hardware.
Models have fins on both sides, or
the left or right. Available with or
without staked on solderable tab
for easy board mounting.
10.67
(0.420)
REF
(0.420)
10.67
(1.020)
25.91
(0.900)
22.86
(0.380)
9.52
(0.062)
1.57
(0.020)
0.51
(0.990)
25.15 TAB
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
20
40
60
80
100
01 2 3 4 5
16
12
4
8
0
0400
200 600 800 1000
579604
579704
574204
Mounting Surface Temp
Rise Above Ambient—°C
Part Number Description Figure
574204B00000G Low cost slide on cooler, no solderable tabs A
574204B03300G With solderable tabs A 1.910 (0.075)
579604B00000G With left side fin only, no solderable tabs B
579604B03300G With left side fin only and solderable tabs B 1.910 (0.075)
579704B00000G With right side fin only, no solderable tabs B
579704B03300G With right side fin only and solderable tabs B 1.910 (0.075)
ORDERING INFORMATION
15.88
(0.630)
18.92
(0.750)
10.67
(0.420)
18.54
(0.730)
2.36
(0.093)
5.97
(0.240)
ø
0.51
(0.020)
10.67
(0.420)
REF
(0.900)
22.86
(0.380)
9.52
(0.062)
1.57
TAB
Material: 1.02 (0.040) Thick Aluminum
Finish: Black Anodize
Material: 0.63 (0.025) Thick Aluminum
Finish: See Table
Material: 0.63 (0.025) Thick Aluminum
Finish: Black Anodize
Dia of PCB
Plated Thru
Hole for Tabs
Note: Fins on Left or Right. Right hand fin model shown.
FIGURE A FIGURE B
For additional options see page 84
For additional options see page 84
Grease
Epoxy
&
page112
Mounting
Kits
page 99
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64
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
TO-202 Heat Sinks
ORDERING INFORMATION
5769, 5773, 5774 Slim low profile channel style heat sink
Slim low profile channel style
heat sink is notched to accom-
modate the TO-202 center tab
packages. Available in 3 heights.
3.81
(0.150)
THRU
13.34
(0.525)
19.05
(0.750)
"A"
13.21
(0.520)
3.81
(0.150)
REF
REF
ø
Part Number “A” Dim
576904B00000G 6.35 (0.250)
577304B00000G 9.53 (0.375)
577404B00000G 12.70 (0.500)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
20
40
60
80
100
01 2 3 4 5
16
12
4
8
0
0400
200 600 800 1000
577304
577404
576904
Mounting Surface Temp
Rise Above Ambient—°C
50.80
(2.000)
25.40
(1.000)
35.05
(1.380)
12.70
(0.500)
17.87
(0.704)
4.75
(0.187)
3.15
(0.124)
9.35
(0.368)
2.46
(0.097)
1.27
(0.050)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
024 6 810
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Space saving heat sink features
staggered fins for increased cooling
efficiency.This verticle mount heat
sink features integrated matte tin
plated tabs to solder directly to the
PC board.
6034 Space saving staggered fin heat sink
6046, 6047 Compact slide on heat sink
Compact slide on heat sink
makes assembly easy. The 6046
features a positive device catch
to lock the heat sink to the device.
15.24
(0.600)
7.62
(0.300)
O.D.
6.35
(0.250)
21.59
(0.850)
"A"
"A"
REF
SECTION A–A
10.41
(0.410)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
20
40
60
80
100
012 34 5
16
12
4
8
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Part Number Description Figure
6046PBG With device catch A
6047PBG Compact slide on heat sink B
ORDERING INFORMATION
15.24
(0.600)
7.62
(0.300)
O.D.
6.35
(0.250)
21.59
(0.850)
"A"
"A"
REF
SECTION A–A
10.41
(0.410)
Material: 1.27 (0.050) Thick Aluminum
Finish: Black Anodize
Material: 1.27 (0.050) Thick Copper
Finish: Tin Plated
Material: 0.63 (0.025) Thick Aluminum
Finish: Pre-Black Anodize*
ORDERING INFORMATION
Part Number Description
6034DG Space saving staggered fin heat sink with 3.10 (0.122)
integrated tin plated tabs
Dia of PCB
Plated Thru
Hole for Tabs
*Edges cut during the manufacturing process will be unfinished.
See page 110 for more information.
FIGURE A FIGURE B
For additional options see page 84
Grease
Epoxy
&
page112
Mounting
Kits
page 99
Grease
Epoxy
&
page112
Mounting
Kits
page 99
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65
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
TO-126 Heat Sinks
ORDERING INFORMATION
5775 Slip on heat sink
Slip on heat sink requires no
hardware to attach to the device.
Spring pressure ensures excellent
retention. May be assembled
before or after the device is
attached to the board.
19.81
(0.780)
13.21
(0.520)
0.63
(0.025)
8.13
(0.320)
7.87
(0.310) 10.67
(0.420)
Part Number Finish
577500B00000G Black anodize
577500U00000G Unfinished
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
20
40
60
80
100
01 23 45
16
12
4
8
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Material: 0.63 (0.025) Thick Aluminum
Finish: See Table
ORDERING INFORMATION
TV4 Narrow channel style heat sink featuring twisted fins
Narrow channel style heat
sink features twisted fins
for increased air turbulance for
better cooling. Can be mounted
horizontally or vertically.
19.00
(0.749)
13.40
(0.528)
22.00
(0.866)
19.00
(0.749)
C
L
4.00
(0.158)
Part Number Description
TV4G Narrow channel style heat sink with twisted fins
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
20
40
60
80
100
01 2 3 4 5
16
12
4
8
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Material: 1.63 (0.064) Thick Aluminum
Finish: Black Anodize
Grease
Epoxy
&
page112
Mounting
Kits
page 99
ORDERING INFORMATION
PF730, PF732 Slip on heat sink
Slip on heat sink has locating
features for simple device align-
ment. Spring action holds the
device for good thermal contact.
The tabbed version is made from
tin plated copper and the no tab
version is lightweight aluminum.
1.30
(0.511)
3.40
(0.139)
8.10
(0.319)
13.20
(0.520)
3.20
(0.126)
8.60
(0.338) 17.90
(0.705)
11.50
(0.453)
4.00
(0.157)
11.50
(0.453)
3.00
(0.118)
13.20
(0.520)
4.00
(0.157)
8.60
(0.338)
8.10
(0.319)
19.70
(0.775)
3.00
(0.118)
TAB
Part Number Description Material Finish Figure
PF730G Slip on heat sink Aluminum Black anodize B
PF732G With solderable tabs Copper Tin plated A
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
50
0
20
40
60
80
100
012 3 4 5
40
30
10
20
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient —°C
FIGURE A FIGURE B
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THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
SIPS
ORDERING INFORMATION
5660 Plug in style heat sink
Plug in style heat sink features
four spring action clips to firmly
hold the device to the heat sink
ensuring maximum metal to metal
contact. Available with or without
solderable tabs for horizontal or
vertical mounting to the PC board.
10.67
(0.420)
15.88
(0.625)
30.99
(1.220)
12.70
(0.500)
4.06
(0.160)
1.27
(0.050)
25.40
(1.000)
C
L
12.06
(0.475)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
024 6810
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
ORDERING INFORMATION
3.81
(0.150)
15.75
(0.620)
3.73
(0.147)
9.65
(0.380)
12.70
(0.500)
21.46
(0.845)
C
L
0.64
(0.025)
LOCKING CATCH
3.30
(0.130)
ø
Part Number Finish
530510U00000G Unfinished
530510B00000G Black anodize
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
20
40
60
80
100
012 34 5
16
12
4
8
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Channel style heat sink with
integrated clip features strong
spring tension and device locking
catch to attach device securely to
the heat sink. Available in two finishes.
5305 Channel style heat sink with integrated clip
Material: 1.27 (0.050) Thick Aluminum
Finish: Black Anodize
Material: 0.81 (0.032) Thick Aluminum
Finish: See Table
Part Number Description Figure
566010B00000G Plug in style heat sink, no solderable tabs B
566010B03100G With solderable tab for horizontal mounting B 1.73 (0.068)
566010B03400G With solderable tabs for vertical mounting A 2.39 (0.094)
Dia of PCB
Plated Thru
Hole for Tabs
Position Code Description Details
A 28 Solderable Shur-LockTM Tab for vertical mounting Page 91
22.86
(0.900)
0.81
(0.032)
30.99
(1.220)
5.03
(0.198)
1.91
(0.075)
8.13
(0.320)
12.70
(0.500)
25.40
(1.000)
C
L
TAB
FIGURE A FIGURE B
POPULAR OPTIONS:
Base part no. A
566010B0 00 00G
For additional options see page 84
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THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
SIPS
ORDERING INFORMATION
7148 Copper channel style slide on heat sink featuring an integrated clip and solderable tabs
Copper channel style slide on
heat sink features an integrated
clip and solderable tabs. Includes
a device retaining tab to securely
hold the heat sink to the device.
Small footprint consumes less
board space.
DETAIL E
A
A
MAX
(0.160)
4.06 E
(0.075)
1.90
(0.050)
1.27
(0.150)
3.81
(0.200)
5.08
(0.380)
9.65
MAX AT BASE
(0.915)
23.24
20.19
(0.795)
2.79 - 3.18
(0.110) - (0.125)
15.24
(0.600)
SECTION A–A
17.78
(0.700)
Part Number Description
7148DG Slide on heat sink with integrated clip 2.54 (0.100)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
012 34 5
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
(0.032)
0.81
(0.230)
5.84
(0.097)
2.46
(1.150)
29.21
(0.390)
9.91
DITTIN
TYP 2
(0.125)
3.18
(1.700)
43.18
(1.250)
31.75
(0.390)
9.91
(0.125)
3.18
ø
TAB
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5
0
20
40
60
80
100
024 6810
4
3
1
2
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Clip on heat sink features louvers
to provide excellent cooling in natural
or forced air convection. Spring action
provides strong clamping force to
securely hold the heat sink to the
device. Available with or without
solderable tabs.
5840 Clip on heat sink featuring louvers
Material: 0.81 (0.032) Thick Copper
Finish: Tin Plated
Material: 1.02 (0.040) Thick Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number Description
584000B00000G Clip on heat sink. no solderable tabs
584000B03500G With solderable tabs for vertical mounting 2.84 (0.112)
Dia of PCB
Plated Thru
Hole for Tabs
7038 Channel style slide on heat sink featuring an integrated clip and device retaining tab
Channel style slide on heat sink
features an integrated clip and
device retaining tab to hold the
heat sink to the device. Small foot-
print consumes less board space.
Part Number Description
7038BG Channel style slide on heat sink
ORDERING INFORMATION
(0.250)
6.35
(0.915)
23.24
9.65
(0.380)
(0.600)
15.24
A
A
(0.620)
15.75
(0.155)
3.95
13.28
(0.523)
SECTION A–A
1.65
(0.065)
Material: 0.81 (0.032) Thick Aluminum
Finish: Black Anodize
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
012 34 5
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
For additional options see page 84
Dia of PCB
Plated Thru
Hole for Tabs
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THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
ORDERING INFORMATION
15.29
(0.602)
"A" 5.59
(0.220)
Part Number “A” Dim
575200B00000G 18.29 (0.720)
575300B00000G 24.64 (0.970)
575400B00000G 30.99 (1.220)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
25
0
20
40
60
80
100
0.0 0.2 0.4 0.6 0.8 1.0
20
15
5
10
0
0400
200 600 800 1000
575200
575400
Mounting Surface Temp
Rise Above Ambient—°C
Low cost slip on heat sink
features an expandable collar
that tightly grips the device
meaning no extra mounting
hardware is required. Three
heights to choose from.
5752, 5753, 5754 Low cost slip on heat sink
Material: 0.63 (0.025) Thick Aluminum
Finish: Black Anodize
TO-92 Heat Sinks
ORDERING INFORMATION
13.70
(0.539)
13.80
(0.543)
10.16
(0.400)
1.00
(0.039)
11.40
(0.449)
2.50
(0.098)
0.40
(0.016)
8.50
(0.335)
4.27
(0.039)
Part Number Description
92FG Brass clip on heat sink 1.73 (0.068)
Air Velocity – Feet Per Minute
Heat Dissipated – Watts
Thermal Resistance From MTG
Surface to Ambient – °C/Watt
25
0
20
40
60
80
100
012 3 45
20
15
5
10
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient – °C
Low cost brass clip on heat sink
requires no hardware to attach
to the device. Includes integrated
tabs that can be soldered or twisted
to attach the heat sink to the board
reducing stress on the device leads.
92F Low cost brass clip on heat sink
Material: 0.38 (0.015) Thick Brass
Finish: Unfinished
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
25
0
20
40
60
80
100
0.0 0.2 0.4 0.6 0.8 1.0
20
15
5
10
0
0400
200 600 800 1000
575300
Mounting Surface Temp
Rise Above Ambient—°C
Dia of PCB
Plated Thru
Hole for Tabs
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THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
ORDERING INFORMATION
5203 Two piece heat sink
Two piece heat sink adds
extra cooling in the same
amount of board space as
other solutions. Base and
top can be ordered separately.
(1.250)
31.75
(0.500)
12.70
(
1.530
)
38.86
(1.187)
30.15
2x
(0.218)
5.54
2x
THRU
(0.188)
4.78 THRU
16.89
(0.665)
4.34
(0.171)
5.46
(0.215)
10.92
(0.430)
ø
ø
Part Number Description Figure
520327B00000G Two piece heat sink assembly, base and top
520328B00000G Top only B
520329B00000G Base only A
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
02 4 6 810
8
6
2
4
0
0400
200 600 800 1000
520328
520329
520327
Mounting Surface Temp
Rise Above Ambient—°C
ORDERING INFORMATION
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
20
40
60
80
100
01 2 3 4 5
16
12
4
8
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Part Number Finish
579103B00000G Black anodize
579103V00000G AavSHIELD3
SLOT
30.15
(1.187)
REF
4.83
(0.190)
4.06
(0.160)
øx
39.12
(1.540)
22.10
(0.870)
9.91
(0.390)
28.57
(1.125)
Space saving expandable collar heat sink
has the same footprint as the device being
cooled meaning no extra board space is
required to fit the heat sink.The expandable
collar tightly grips the device meaning no
extra hardware is required. May also be used
with any diamond or square basket heat sink
to form a two piece heat sink for additional
cooling. Available in conductive AavSHIELD3
or black anodize finish.
5791 Space saving expandable collar heat sink
5060 Low profile hat section heat sink
Low profile hat section heat sink
is ideal for applications where low
component heights are required
such as card cages with PCBs
mounted on 0.500 centers.
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
048121620
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Part Number Description
506003B00000G Low profile hat section heat sink
ORDERING INFORMATION
Material: 1.60 (0.063) Thick Aluminum
Finish: Black Anodize
Material: 1.27 (0.050) Thick Aluminum
Finish: See Table
(2.000)
50.80
(1.200)
30.48
(1.750)
44.45
(0.375)
9.52
2x
THRU
(0.188)
4.78
(1.187)
30.15
(0.072)
1.82 (0.593)
15.06
(0.430)
10.92
(0.215)
5.46
2x
THRU
(0.218)
5.54 ø
C
L1
C
L2
ø
Material: 1.27 (0.050) Thick Aluminum
Finish: Black Anodize
TO-3 Heat Sinks
For additional options see page 84
FIGURE A FIGURE B
21.34
(0.840)
2.81
(0.110)
38.95
(1.534)
THRU TYP 2
3.71
(0.146)
14.17
(0.558)
THRU TYP 2
4.06
(0.160)
30.65
(1.206)
7.87
(0.310)
9.27
(0.365)
For additional options see page 84
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Epoxy
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Kits
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Epoxy
&
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Kits
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Kits
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THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
ORDERING INFORMATION
5756, 5757, 5758, 5759 Space saver diamond shaped basket heat sink
Space saver diamond shaped
basket heat sink featuring a
narrow base with slanted fins to
increase air turbulence in natural
and forced convection applications.
Made from heavy gauge material.
Four heights to choose from.
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
024 6 810
8
6
2
4
0
0400
200 600 800 1000
575603
575703
Mounting Surface Temp
Rise Above Ambient—°C
Part Number “A” Dim
575603B00000G 12.70 (0.500)
575703B00000G 19.05 (0.750)
575803B00000G 25.40 (1.000)
575903B00000G 31.75 (1.250)
(1.630)
41.40
(1.290)
32.77 TYP 2
(0.218)
5.54
TYP 2
(0.188)
4.78
(1.187)
30.15
(0.594)
15.07
(0.072)
1.83
(0.430)
10.92
(0.215)
5.46
1
2
"X"
"X"
C
L
C
L
ø
"A"
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
02 4 6 810
8
6
2
4
0
0400
200 600 800 1000
501303
501403
Mounting Surface Temp
Rise Above Ambient—°C
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
02 4 6 810
8
6
2
4
0
0400
200 600 800 1000
501503
501603
Mounting Surface Temp
Rise Above Ambient—°C
Low cost diamond shaped
basket heat sink with
straight fins. High fin count
enhances efficiency. Four
heights to choose from.
5013, 5014, 5015, 5016 Low cost diamond shaped basket heat sink
Material: 2.29 (0.090) Thick Aluminum
Finish: Black Anodize
Material: 1.60 (0.063) Thick Aluminum
Finish: Black Anodize
TO-3 Heat Sinks
Position Code Description Location Details
A 1 Kon-DuxTM pad Page 86
A 3 In-Sil-8TM pad Page 86
B 01 6-23 Wave-OnTM threaded insert Hole X Page 89
0.100 stand off
POPULAR OPTIONS:
Base part no. A
575_03B 0 00 00G
For additional options see page 84
ORDERING INFORMATION
Part Number “A” Dim
501303B00000G 12.70 (0.500)
501403B00000G 19.05 (0.750)
501503B00000G 25.40 (1.000)
501603B00000G 31.75 (1.250)
Position Code Description Location Details
A 1 Kon-DuxTM pad Page 86
B 01 6-23 Wave-OnTM threaded insert 0.100 stand off Hole X Page 89
C 08 6-32 x 0.350 Solderable stud Hole X Page 96
POPULAR OPTIONS:
For additional options see page 84
B
Base part no. A
501_03B 0 00 00G
BC
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5
0
20
40
60
80
100
02 4 6 810
4
3
1
2
0
0400
200 600 800 1000
575803
575903
Mounting Surface Temp
Rise Above Ambient—°C
TYP 2
5.54
(0.218)
10.92
(0.430)
5.46
(2.150)
TYP 2
4.75
(0.187)
AT BASE
47.75
(1.880)
AT BASE
35.56
(1.400)
"A"
30.15
(1.187)
15.07
(0.594)
1.83
(0.072)
"X"
"X"
ø
ø
C
L
C
L
Grease
Epoxy
&
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Kits
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Kits
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THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
TO-3 Heat Sinks
ORDERING INFORMATION
5197, 5198, 5199, 5201 Heavy gauge square basket heat sink
Heavy gauge square basket
heat sink provides excellent
performance by using 1/8 thick
aluminum to maximize efficiency.
Available in 4 heights.
10.41
(0.410)
12.24
(0.482)
39.37
(1.550)
32.02
(1.300)
@ BASE
48.26
(1.900)
TYP 2
5.54
(0.218)
TYP 2
4.75
(0.187)
1
2
ø
ø
30.15
(1.187)
15.09
(0.594)
1.83
(0.072) 10.92
(0.430)
5.46
(0.215)
C
L
C
L
"A"
"X"
"X"
Part Number “A” Dim
519703B00000G 38.10 (1.500)
519803B00000G 44.45 (1.750)
519903B00000G 50.80 (2.000)
520103B00000G 31.12 (1.225)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5
0
20
40
60
80
100
0 5 10 15 20 25
4
3
1
2
0
0400
200 600 800 1000
520103
519903
Mounting Surface Temp
Rise Above Ambient—°C
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5
0
20
40
60
80
100
04 8121620
4
3
1
2
0
0400
200 600 800 1000
579003
569003
Mounting Surface Temp
Rise Above Ambient—°C
Square basket heat sink
features folded back fins
to increase surface area
and power dissipation.
Two heights are available.
5690, 5790 Square basket heat sink features folded back fins
Material: 3.17 (0.125) Thick Aluminum
Finish: Black Anodize
Material: 1.60 (0.063) Thick Aluminum
Finish: Black Anodize
Position Code Description Location Details
A 1 Kon-DuxTM pad Page 86
B 01 6-32 Wave-OnTM theaded insert 0.100 stand off Hole X Page 89
POPULAR OPTIONS:
Base part no. A
5_ _ _03B 0 00 00G
For additional options see page 84
ORDERING INFORMATION
Part Number “A” Dim
569003B00000G 33.27 (1.310)
579003B00000G 25.40 (1.000)
Position Code Description Details
A 1 Kon-DuxTM pad Page 86
A 3 In-Sil-8TM pad Page 86
POPULAR OPTIONS:
For additional options see page 84
1.78
(0.070)
15.11
(0.595)
30.23
(1.190)
5.46
(0.215)
10.92
(0.430) REF
27.69
(1.090)
THRU
TYP 8
3.66
(0.144)
THRU
TYP 2
5.59
(0.220) REF
6.35
(0.250)
SQ.
REF
46.48
(1.830)
THRU
TYP 2
4.83
(0.190)
ø
ø
C
L
"A"
C
L
ø
Base part no. A
5_9003B 0 0000G
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5
0
20
40
60
80
100
048121620
4
3
1
2
0
0400
200 600 800 1000
519703
519803
Mounting Surface Temp
Rise Above Ambient—°C
B
Grease
Epoxy
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Kits
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Kits
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THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
TO-3 Heat Sinks
ORDERING INFORMATION
5001, 5002, 5003, 5004 Square basket heat sink featuring slanted fins
Square basket heat sink featuring
a slanted fin design for increased
air turbulence and four integrated
mounting holes. Four heights to
choose from.
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5
0
20
40
60
80
100
04 8121620
4
3
1
2
0
0400
200 600 800 1000
500203
500103
Mounting Surface Temp
Rise Above Ambient—°C
Part Number “A” Dim
500103B00000G 12.70 (0.500)
500203B00000G 19.05 (0.750)
500303B00000G 25.40 (1.000)
500403B00000G 31.75 (1.250)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5
0
20
40
60
80
100
048121620
4
3
1
2
0
0400
200 600 800 1000
500403
500303
Mounting Surface Temp
Rise Above Ambient—°C
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5
0
20
40
60
80
100
02 4 6 810
4
3
1
2
0
0400
200 600 800 1000
505303
505403
505103
Mounting Surface Temp
Rise Above Ambient—°C
Square basket heat sink
features straight fins and
0.090 thick aluminum for
increased cooling capacity.
Three heights to choose from.
5051, 5053, 5054 Square basket heat sink featuring straight fins
Material: 2.29 (0.090) Thick Aluminum
Finish: Black Anodize
Material: 2.29 (0.090) Thick Aluminum
Finish: Black Anodize
Position Code Description Details
A 1 Kon-DuxTM pad Page 86
A 3 In-Sil-8TM pad Page 86
POPULAR OPTIONS:
Base part no.
500_03B 0 0000G
For additional options see page 84
ORDERING INFORMATION
Part Number “A” Dim
505103B00000G 12.70 (0.500)
505303B00000G 25.40 (1.000)
505403B00000G 31.75 (1.250)
Position Code Description Location Details
A 01 6-23 Wave-OnTM threaded insert 0.100 stand off Hole X Page 89
For additional options see page 84
TYP 2
(0.218)
5.54
(0.072)
1.83
(1.187)
30.15
(0.215)
5.46
(0.593)
15.06
(1.780)
45.21
(0.430)
10.92
TYP 2
(0.188)
4.78
1
C
L
C
L2
øø
"X"
"X"
"A"
POPULAR OPTIONS:
Base part no. A
505_03B0 00 00G
A
TYP 2
5.54
(0.218)
THRU TYP 4
ø 3.81
(0.150)
15.06
(0.593)
10.92
(0.430)
30.15
(1.187)
TYP 2
ø 4.78
(0.188)
5.46
(0.215)
1.83
(0.072)
38.10
(1.500)
SQ.
45.97
(1.810)
C
L1
L2
C
"A"
ø
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THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
TO-3 Heat Sinks
ORDERING INFORMATION
5761, 5762, 5763, 5764 Square basket heat sink featuring slanted vane fins
Square basket heat sink features
slanted vane fins for efficient heat
dissipation. Air movement from any
direction is diverted into the center
of the heat sink to create turbulence
and improve heat transfer. Four
heights to choose from.
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—C/Watt
5
0
20
40
60
80
100
04 8121620
4
3
1
2
0
0400
200 600 800 1000
576203
576103
Mounting Surface Temp
Rise Above Ambient—°C
Part Number “A” Dim
576103B00000G 12.70 (0.500)
576203B00000G 19.05 (0.750)
576303B00000G 25.40 (1.000)
576403B00000G 31.75 (1.250)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5
0
20
40
60
80
100
04 8121620
4
3
1
2
0
0400
200 600 800 1000
576403
576303
Mounting Surface Temp
Rise Above Ambient—°C
Material: 2.29 (0.090) Thick Aluminum
Finish: Black Anodize
Position Code Description Location Details
A 1 Kon-DuxTM pad Page 86
B 01 6-32 Wave-OnTM theaded insert Hole X Page 89
0.100 stand off
POPULAR OPTIONS:
Base part no.
576 _ 03B 0 00 00G
For additional options see page 84
"A"
12.32
(0.485)
12.32
(0.485)
REF
45.97
(1.810)
5.46
(0.215)
10.92
(0.430)
30.15
(1.187)
TYP 2
4.77
(0.188)
TYP 2
5.54
(0.218)
2
1
15.09
(0.594)
1.83
(0.072)
ø
"X"
"X"
C
L
C
L
ø
A B
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Kits
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ORDERING INFORMATION
PF523, PF526, PF527 Diamond shaped heat sink
Diamond shaped heat sink
is the same profile as the device
which saves space on the board.
This rugged design is made from
cast aluminum and is available
in three different heights.
Part Number “A” Dim
PF523G 12.50 (0.492)
PF526G 19.00 (0.748)
PF527G 25.00 (0.984)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
0 3 6 9 12 15
8
6
2
4
0
0400
200 600 800 1000
PF526
PF527
PF523
Mounting Surface Temp
Rise Above Ambient—°C
Material: Cast Aluminum
Finish: Black Anodize
3.40
(0.134)
DIA 22.90
(0.902) Approx DIA 8.00(0.315)
area flat around holes
30.15
(1.19)
CTRS
40.80
(1.606)
26.90
(1.060)
"A"
DIA 4.20 (0.165)
4.10 (0.161)
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THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
ORDERING INFORMATION
5017, 5018, 5019, 5020 Low cost diamond shaped basket heat sink
Low cost diamond shaped
basket heat sink with straight
fins. High fin count enhances
efficiency. Four heights to
choose from.
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
024 6 810
8
6
2
4
0
0400
200 600 800 1000
501806
501706
Mounting Surface Temp
Rise Above Ambient—°C
Part Number “A” Dim
501706B00000G 12.70 (0.500)
501806B00000G 19.05 (0.750)
501906B00000G 25.40 (1.000)
502006B00000G 31.75 (1.250)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
024 6 810
8
6
2
4
0
0400
200 600 800 1000
502006
501906
Mounting Surface Temp
Rise Above Ambient—°C
20.62
(0.812)
31.00
(1.220)
13.72
(0.540)
24.38
(0.960)
3.96
(0.156)
4.95
(0.195)
11.68
(0.460)
9.27
(0.365)
4.44
(0.175)
SLOT
x
ø
ø
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
20
40
60
80
100
01 2 3 45
16
12
4
8
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Space saving expandable collar
heat sink has the same footprint
as the device being cooled meaning
no extra board space is required to
fit the heat sink. The expandable
collar tightly grips the device.
5792 Space saving expandable collar heat sink
Material: 1.60 (0.063) Thick Aluminum
Finish: Black Anodize
Material: 1.27 (0.050) Thick Aluminum
Finish: See Table
TO-66 Heat Sinks
@ BASE
39.37
(1.550)
@ BASE
26.42
(1.040)
1
2
TYP 4
3.96
(0.156)
24.38
(0.960)
2.54
(0.100)
5.08
(0.200)
12.19
(0.480)
2.54
(0.100)
C
L
C
L
"A"
ø
ORDERING INFORMATION
Part Number Finish
579206B00000G Black anodize
579206V00000G AavSHIELD3
Grease
Epoxy
&
page112
Mounting
Kits
page 99
Mounting
Kits
page 99
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75
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
ORDERING INFORMATION
6.35
(0.250)
10.03
(0.395)
21.08
(0.830)
8.03
(0.316)
ø
"A"
Part Number “A” Dim
578105B00000G 3.96 (0.156)
578205B00000G 6.35 (0.250)
578305B00000G 12.70 (0.500)
578405B00000G 19.05 (0.750)
578505B00000G 25.40 (1.000)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
50
0
20
40
60
80
100
0.0 0.4 0.8 1.2 1.6 2.0
40
30
10
20
0
0400
200 600 800 1000
578205
578105
Mounting Surface Temp
Rise Above Ambient—°C
Snap on cooler features easy
no tools installation. Folded
back fins provide maximum
surface area while preserving
valuable board space.
5781, 5782, 5783, 5784, 5785 Snap on cooler heat sink
6201, 6202, 6203 Space saving expandable heat sink
Space saving expandable heat sink
features a collar that tightly grips the
device meaning no extra hardware is
required. Heat sinks are constructed of
pre-black anodize material to lower cost.
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
50
0
20
40
60
80
100
0.0 0.4 0.81.2 1.6 2.0
40
30
10
20
0
0400
200 600 800 1000
6202
6201
Mounting Surface Temp
Rise Above Ambient—°C
6203
32.51
(1.280)
6.35
(0.250)
ø 8.03
(0.316)
I.D.
"A"
Part Number “A” Dim # Fins
6201PBG 6.35 (0.250) 1
6202PBG 12.70 (0.500) 2
6203PBG 19.56 (0.770) 3
ORDERING INFORMATION
Material: 0.63 (0.025) Thick Aluminum
Finish: Black Anodize
Material: 0.63 (0.025) Thick Aluminum
Finish: Pre Black Anodize*
TO-05 Heat Sinks
* Edges cut during the manufacturing process will be unfinished.
See page 110 more more information
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
50
0
20
40
60
80
100
0.0 0.4 0.8 1.2 1.6 2.0
40
30
10
20
0
0400
200 600 800 1000
578405
Mounting Surface Temp
Rise Above Ambient—°C
578305
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
50
0
20
40
60
80
100
0.0 0.4 0.8 1.2 1.6 2.0
40
30
10
20
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
578505
5F Low cost push on heat sink
12.70
(0.500)
16.00
(0.630)
7.90
(0.311)
ø
ø
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
50
0
20
40
60
80
100
0 0.5 1 1.5 2 2.5
40
30
10
20
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient —°C
Part Number Description
5FG Low cost push on heat sink
ORDERING INFORMATION
Material: Aluminum
Finish: Black Anodize
Low cost push on heat sink
uses spring pressure to firmly
grip the device case creating
a good thermal interface.
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76
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
TO-5 Heat Sinks
3257, 3260 Extruded collar style heat sink with radial fins
Extruded collar style heat
sink with radial fins. The split
collar design provides a press fit
between the transistor and the
heat sink creating an excellent
thermal conduction path.
Available in two heights.
8.07
(0.318) THRU
12.70
(0.500)
"A"
ø
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
50
0
20
40
60
80
100
0.0 0.4 0.8 1.2 1.6 2.0
40
30
10
20
0
0400
200 600 800 1000
325705
326005
Mounting Surface Temp
Rise Above Ambient—°C
ORDERING INFORMATION
12.70
(0.500) 6.35
(0.250)
"A"
Part Number “A” Dim
320105B00000G 8.07 (0.318)
320205B00000G 7.75 (0.305)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
50
0
20
40
60
80
100
0.0 0.4 0.8 1.2 1.6 2.0
40
30
10
20
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Extruded collar style heat sink with
swept back fins for increased surface
area in a small volume.The split collar
design provides a press fit between
the transistor and the heat sink creating
an excellent thermal conduction path.
Available in two inside diameters.
3201, 3202 Extruded collar style heat sink with swept back fins
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
19.05
(0.750)
ø 8.08
(0.318)
6.35
(0.250)
3.17
(0.125)
ø
7.62
(0.300)
R
Part Number Description
323005B00000G Extruded collar style heat sink with mounting boss
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
50
0
20
40
60
80
100
0.0 0.4 0.8 1.2 1.6 2.0
40
30
10
20
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Extruded collar style heat sink
with mounting hole for hardware
attachment to the circuit card. The heat
sink includes a mount boss that will
accept a 4-40 screw for secure mounting
in high vibration environments. The split
collar design provides a press fit between
the transistor and the heat sink creating
an excellent thermal conduction path.
3230 Extruded collar style heat sink with mounting hole
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number “A” Dim
325705B00000G 6.35 (0.250)
326005B00000G 9.53 (0.375)
Material: Aluminum
Finish: Black Anodize
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77
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
Axial Lead Devices
ORDERING INFORMATION
6000 Copper heat sink for axial lead devices
Copper heat sink for axial
lead device requires no extra
board space to mount. One lead
of the heat sink is soldered to
the device while the other sol-
ders to the PC board. Available
in two finishes.
C SYM
L
14.20
(0.559)
25.40
(1.000)
15.24
(0.600)
(0.250)
6.35
@ BASE
(1.200)
30.48
REF
REF
25.40
(1.000)
27.30
(1.075)
1.90
(0.075) 1.27
(0.050)
15.24
(0.600)
20.32
(0.800) DIA as required
for lead size
2.36
(0.093)
FIGURE A
Part Number Description Finish
6000UG Heat sink for axial lead device Unfinished See figure A
6000DG Heat sink for axial lead device Tin plated* See figure A
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
024 6 810
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
ORDERING INFORMATION
(1.060)
26.92
(1.250)
31.75
"A"
(0.600)
15.24
SQ
Part Number “A” Dim
6222BG 3.61 (0.142) Dia Thru
6223BG 4.14 (0.163) Dia Thru
6224BG 4.77 (0.188) Dia Thru
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
024 6 810
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Square basket style heat sink
for bridge rectifiers uses no
additional board space. Available
with three different mounting
hole diameters.
6222, 6223, 6224 Square basket style heat sink for bridge rectifiers
Material: 0.53 (0.021) Thick Copper
Finish: See Table
Bridge Rectifiers
Material: 1.27 (0.050) Thick Aluminum
Finish: Black Anodize
Dia of PCB
Plated Thru
Hole for Tabs
* See page 110 for more information
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78
OPTIONS & ACCESSORIES CONTENTS
Thermal solutions go beyond the heat dissipator itself. Aavid offers a total solution package, which includes a
number of options and accessory items described in
this section of the catalog.
A total thermal solution includes an efficient thermal interface and means of mechanical attachment. Aavid
has a full-line of interface materials that can be pre-
applied or supplied as an accessory item. Mechanical
assembly options include attachment of semiconductors to heat sinks, heat sinks to printed
circuit boards, and heat sinks to sockets of CPUs.
Aavid offers the most complete line
of value added options of any supplier in the industry. Our full line of accessories includes mounting kits, shoulder washers, insulators, mounting pads,
and various grease products and epoxies, which
are sold separately, and can be used with a variety
of Aavid heat sinks.
This section will provide the most complete solution to your thermal requirement.
CONTENTS
How to decipher or construct an Aavid 12 digit part number.......................
How to decipher or construct a "Thermalloy" origin part number...............
Indexes.................................................................................................................................
Interface Materials
Pads
In-Sil-8TM Pads....................................................................................................................
Kon-DuxTM/Grafoil® Pads..............................................................................................
Hi-Flow® Pads...................................................................................................................
Alignment Pads................................................................................................................
Double Sided Tape Options (factory applied)
T414......................................................................................................................................
T405R....................................................................................................................................
T412......................................................................................................................................
T411......................................................................................................................................
T410R....................................................................................................................................
Labor Saving Heat Sink to Board and Device to Heat Sink Mounts
Wave-OnTM Mounts..........................................................................................................
Semiconductor Mounts.................................................................................................
Shur-LockTM Tabs...............................................................................................................
Solderable Staked on Tabs...........................................................................................
Solderable Mounting Tabs............................................................................................
Solderable Pins.................................................................................................................
Solderable Nuts.................................................................................................................
Clinch Nuts..........................................................................................................................
Solderable Studs...............................................................................................................
Device Mounting Studs..................................................................................................
Clips
Aavid Kool-KlipsTM............................................................................................................
Thermal Clips.....................................................................................................................
80
81
82
86
86
87
87
88
88
88
88
88
89
90
91
91
93
94
94
95
96
96
97
98
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79
OPTIONS & ACCESSORIES CONTENTS
CONTENTS
Accessories
Mounting Kits
TO-220/TO-3 Mounting Kits......................................................................................................................... 99
Insulating Shoulder Washers
Polyphenylene Sulfide (PPS) Shoulder Washers................................................................................... 100
Nylon Shoulder Washers................................................................................................................................100
Insulators
ThermalfilmTM Polymide Plastic Films........................................................................................................101
ThermalfilmTM/ ThermalfilmTM MT................................................................................................................ 102
Mica, ThermalsilTMlll.......................................................................................................................................... 103
Aluminum Oxide Ceramic Insulators........................................................................................................ 104
Stanchion Pads..................................................................................................................................................105
Insulating Covers
TO-3 Insulating Covers................................................................................................................................... 106
Teflon-Filled Acetal Insulators..................................................................................................................... 106
Teflon-Filled Acetal Bushings.......................................................................................................................106
Mounting Pads
(TO-5,TO-18, IC, Universal, TO-18 Lead Conversion, Epoxy Lead Conversion)................ 107
Finishes ..............................................................................................................................................................110
Card Ejectors
Snap-On Ejectors..............................................................................................................................................111
Standard Ejectors............................................................................................................................................. 111
Thermal Greases and Epoxies
Sil-FreeTM.............................................................................................................................................................. 112
Ther-O-LinkTM..................................................................................................................................................... 112
UltrastickTM.......................................................................................................................................................... 112
ThermalCoteTM................................................................................................................................................... 113
ThermalCoteTM II............................................................................................................................................... 113
Ther-O-BondTM 1500........................................................................................................................................ 114
Ther-O-BondTM 1600........................................................................................................................................ 114
Ther-O-BondTM 2000........................................................................................................................................ 114
ThermalbondTM.................................................................................................................................................. 115 sales.na@aavid.com www.shopaavid.com
80
HOW TO DECIPHER A 12 DIGIT PART NUMBER
Aavid standard product line in most cases consists of a 12-digit part number sequence. In most standard offerings, Digits 1 through 4, define the
model basic part number. Digits 5 and 6 designate the package style that a particular heat sink is designed to cool. The 7th digit deter-mines the
finish, and the 8th identifies the interface material, if one can be used for that particular style heat sink. The 9th and 10th digits define the PC board
mounting method, and the 11th and 12th digits define the method of attachment of the package to the heat sink. For digits 8,9,10,11 and 12, the
absence of any of those options is always designated by a zero in those positions. Important NOTE: The 12 digit part number sequence is a general
format. Due to the different variations and styles of heat sinks, we have included an Option Index on pages 82–84 to show available options and
accessories for the products covered in this catalog.
To order most Aavid heat sinks, you must use a 12 digit part number using the following options:
How to decipher an Aavid standard 12 digit part number
Digits 5-6: Package style
CODE DEVICE
00 Blank
01 TO-218
02 TO-220, TO-216, TO-217
03 TO-3
04 TO-202
05 TO-5, TO-39
06 TO-66
08 TO-247
10 Multiwatt/SIP
21 Dual TO-218
22 Dual TO-220
Digit 7: Finish
CODE DESCRIPTION
BBlack Anodize
DSolderable 100% Tin Finish
JPre-Black Anodize
MGreen Anodize
UUnfinished
VAavSHIELD3
WBlack Anodize w/Black Paint
For additional information see page 110
Digit 8: Interface material
CODE DESCRIPTION
0None
1One Kon-Dux™ Pad
2Two Kon-Dux™ Pads
3One In-Sil-8™ Pad
4Two In-Sil-8™ Pad
7One Hi-Flow® Pad
8Two Hi-Flow® Pads
For additional information see pages 86 and 87
Solderable Wave-On™ mounts
CODE STAND-OFF THREAD
01 0.100” #6-32
02 0.100” #4-40
03 0.045” #4-40
04* 0.100” #6-32
05 0.045” #6-32
07 0.100” 3.5mm
09 0.200” #6-32
13 0.129” #6-32
* 0.090 PCB (others 0.062”)
For additional information see page 89
Solderable staked on **tabs
CODE DESCRIPTION
28 Shur-Lock™ Tab (0.130 for 0.062” PC Boards)
31 Centered Horizontal (0.050 W x 0.130 L)
32 Centered Horizontal (0.050 W x 0.130 L)
33 Centered Vertical (0.062 W x 0.340 L)
34 Vertical Pair L & R (0.075 W x 0.170 L)
35 Vertical Pair L & R (0.097 W x 0.200 L)
36 Centered Vertical (0.100 W x 0.150 L)
37 Centered Step (0.062 W x 0.250 L with 0.125 wide step)
39 Centered Vertical (0.050 W x 0.375 L)
40 Centered Vertical (0.050 W x 0.245 L)
43 Centered Step (0.050 W x 0.375 L)
48 Centered Vertical (0.062 W x 0.280 L)
53 MT Tab Vertical Pair (0.090 W x 0.125 L)
54 MT2 Tab Vertical Pair (0.090 W x 0.125 L)
55 MT3 Tab Vertical Pair (0.090 W x 0.125 L)
56 Bifurcated Tab Vertical Pair (0.110 W x 0.125 with 0.190 step)
57 Bifurcated Tab Vertical Pair (0.110 W x 0.125 with 0.100 step)
For additional information see pages 91–93
** For additional tab options, please contact
Application Engineering at (603) 224-9988
Semiconductor mounts
CODE DESCRIPTION LENGTH
01 #6-32 Female
02 #4-40 Female
03 M-3 Female
04 #6-32 Male 0.380”
05 #4-40 Male 0.380”
For additional information see page 90
Studs
CODE DESCRIPTION LENGTH
06 SE-2 Stud #6-32 0.485"
07 SM-3 M-3 Male 0.350”
08 SE-1 Stud #6-32 0.350"
09 SE-3 Stud #4-40 0.350"
11 SF-1 M3 x 0.5 0.302"
14 SE-4 Stud #6-32 0.350"
17 SM-1M-3 Male 0.350"
For additional information see page 96
Clinch nuts
CODE DESCRIPTION
12 CNE-42 4-40 Clinch nut
13 CNM-1 M3 X 0.5 Clinch nut
For additional information see page 95
Standard clips
Kool-Klips™
Sold separately
CODE PART#
50 115000
51 115100
52 115200
53 115300
54 115400
62 116200
For additional information see page 97
Thermal clips
Factory applied to heat sink
CODE PART#
32 TC-1
33 TC-10
34 TC-11
35 TC-12
For additional information see page 98
Solderable pins
for board mounted extrusions
CODE DESCRIPTION
21 Solid Pin with
Stand Off Shoulder 0.050”
25 Solid Solderable Pin
For additional information see page 94
Solderable nut
CODE DESCRIPTION LENGTH
13 SNE-2 6-32 UNC-2B 0.305”
14 SNE-1 4-40 UNC-2B 0.305”
For additional information see page 94
Digits 11-12: Package mounting
Digits 9-10: PC Board mounting
A= Base Part Number
B= Package Style
C= Finish
D= Interface Material
E= PC Board Mounting
F= Package Mounting
G= RoHS Compliant
Standard board level: 5748 02 B 0 37 00 G
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81
HOW TO DECIPHER A THERMALLOY ORIGIN PART NUMBER
Aavid features a variety of Thermalloy origin standard products that consist of a different part number
sequence than the standard Aavid 12 digit part numbering system. In most cases, digits 1 through 4, designate the basic model number of the heat sink. Digits 5-6, designate the finish of the heat sink. Digits 6-13 can designate any number of different options that come with a specific model number. (Please refer to Option Index D on page 85 to see Aavid‘s offerings per base number.)
Popular productivity enhancing options:
Digits (Figure C-D above)
P_= Solderable Roll Pins (see page 94)
TC_ _ = Thermal Clip (see page 98)
CNE_ _ = Clinch Nuts (see page 95)
CNM_= Clinch Nuts Metric (see page 95)
MT= Mounting Tabs (see page 93)
8223-CL03,8241-CL11 = Alignment Pad (see page 87)
SE-_= Solderable Studs (see page 96)
SF_= Mounting Studs (see page 96)
G_= Grafoil® Pad (see page 86)
SNM_= Solderable Nuts Metric (see page 94)
SNE= Solderable Nuts (see page 94)
BGS_= BGS Clip (page 18)
How to decipher a Thermalloy origin part number?
To order most Thermalloy origin heat sinks you must use the basic part numbering system below:
A= Model Number
B= Finish
C= Productivity Enhancement (if applicable)
D= Second Productivity Enhancement (if applicable)
E= RoHS Compliant Suffix
Note: For a wide range of part number specific options, please see our Aavid Option Index D on page 85
Standard board level: 6021 – - G
AB C
Popular finishes*
(followed after base number in location B above)
B=Black Anodize
PB= Pre-Black Anodized
D=Tin Plated
U=Clean, No Finish
V=AavSHIELD3
D
*For additional information see page 110
Esales.na@aavid.com www.shopaavid.com
82
OPTION INDEX
Option Index A
Base part Finishes Solderable tabs Clips Wave-OnTM mounts KonduxTM pads In-Sil-8TM pads Hi-Flow® pads Semiconductor mnts Studs
(page 110) (page 91–93) (page 97) (page 89) (page 86) (page 86) (page 87) (page 90) (page 96)
504102 B U 53 54 55 56 57 01 02 03 05 1 3
504222 B U 01 02 03 05 2 4 01 02 03 05 07 08
506902 B U 01 02 03 05 1 3
507002 B U J 53 54 55 56 57 01 02 03 05 1 3 01 02 03 05 07 08
507102 B U J
507222 B U J V 53 54 55 56 57 01 02 03 05 1 2 3 4 01 02 03 05 07 08
507302 B U J V 33 36 39 40 01 02 03 05 1 3 01 02 03 05 07 08
530101 B U V 50 01 04 05 07 1 2 3 7
530102 B U 50 01 04 05 07 1 2 3 7
530161 B U 62 01 04 05 07 1 2 3
530162 B U 62 01 04 05 07 1 2 3
530401 B U 50 01 04 05 07 1 2 3 7
530402 B U 50 01 04 05 07 1 2 3 7
530613 B U J V 53 54 55 56 57 1 3
530614 B U J 53 54 55 56 57 1 3
530714 B U V 53 54 55 56 57 1 3
530801 B U 50 01 04 05 07 1 2 3 7
530802 B U 50 01 04 05 07 1 2 3 7
530861 B U 62 01 04 05 07 1 2
530862 B U 62 01 04 05 07 1 2
534202 B U 28 34 35 53 1
534265 B U 28 34 35 53 3 7
542502 B U J D 05 1 3 01 02 03 05 07 08
551002 B U 01 02 03 05 1 3 01 02 03 05 07 08
563002 B U J D 3
569022 B U 01 02 03 05 01 02 03 05 07 08
574102 B U 32 33 37
574402 B U 32 33 37
574502 B U V 32 33 37 48
574602 B U 32 33 37 43
574802 B U 33 37
574902 B U 28 33 37 43
575002 B U D
575102 B U V 1 3
576012 B U V 1 3
576014 B U V 1 3
576602 B U D 3
577002 B U V 28 33 36 39 40 01 02 03 05 1 3 01 02 03 05 07 08
577102 B U V 28 33 36 39 40 01 02 03 05 1 3 01 02 03 05 07 08
577202 B U J V 33 36 38 39 40 01 02 03 05 1 3 01 02 03 05 07 08
577922 B U V 2 4
578622 B U V 28 32 34 35 2 4 01 02 03 05 07 08
579302 B U
579402 B U
579802 B U 33
579902 B U 33 1 05
590102 B U 36 02 1
590302 B U 36 37 1 3
592201 B U 34
592502 B U 28 34 35 01 02 03 05 1 3 01 02 03 05 07 08
592902 B U 28 34 1 3 01 02 03 05 07 08
593002 B U V 28 34 35 1 3 01 02 03 05 07 08
593101 B U 36 1 3 01
593202 B U V 28 34 35 01 02 03 05 1 3 01 02 03 05 07 08
Available option codes for Aavid 12 digit part numbers. For additional information on option codes see "How to decipher
an Aavid 12 digit part number" on page 80. To find the appropriate Option Index for a selected part number please refer
to the main product section in the front of the catalog or "How to use this catalog" on page 2.
Ordering Codes sales.na@aavid.com www.shopaavid.com
83
OPTION INDEX
513001 B U 1 2 3 4 01 03 21 25
513002 B U 1 2 3 4 21 25
513101 B U 1 2 3 4 21 25
513102 B U 1 2 3 4 01 02 03 21 25
513201 B U 1 2 3 4 01 05 21 25
513202 B U V 1 2 3 4 01 02 03 21 25
513301 B U 1 2 3 4 02 21 25
513302 B U V 1 2 3 4 01 02 21 25
529701 B 1 2 3 4 21 25
529702 B 1 2 3 4 21 25
529801 B 1 2 3 4 01 02 21 25 11 12
529802 B 1 2 3 4 01 02 21 25 11 12
529901 B 33 34 1 2 3 4 01 02 05 21 25 11 13
529902 B 33 34 1 2 3 4 01 02 05 21 25
530001 B U 33 1 3 01 21 25
530002 B U 1 3 02 21 25
531002 B U V 1 3 21 25
531102 B U V 1 3 02 03 21 25
531202 B U V 1 3 01 02 21 25
531302 B U V 1 3 02 21 25
532602 B 1 3 01 02 21 25
532702 B 1 3 01 21 25
532802 B 1 3 02 21 25
533001 B U 51 1 3 7 21 25
533002 B U 51 1 3 7 21 25
533101 B U 51 1 3 7 21 25
533102 B U 51 1 3 7 21 25
533201 B U 51 1 3 7 21 25
533202 B U 51 1 3 7 21 25
533301 B U 51 1 3 7 21 25
533302 B U 51 1 3 7 21 25
533401 B 52 1 21 25
533402 B 52 1 3 21 25
533421 B 52 1 2 3 21 25
533422 B 52 1 2 3 21 25
533501 B 52 1 3 21 25
533502 B 52 1 3 21 25
533521 B 52 1 2 21 25
533522 B 52 1 2 3 21 25
533601 B 52 1 3 21 25
533602 B 52 1 3 21 25
533621 B 52 1 2 3 21 25
533622 B 52 1 2 3 21 25
533701 B 52 1 21 25
533702 B 52 1 3 21 25
533721 B 52 1 2 3 21 25
533722 B 52 1 2 21 25
533802 B U 54 1 2 3 7 21 25
533902 B U 54 1 2 3 7 21 25
534002 B U 54 1 2 3 7 21 25
581001 B U 1 3 21 25
581002 B U V 1 3 21 25
581101 B U 1 3 21 25
581102 B U 1 3 21 25
581201 B U 1 3 21 25
581202 B U 1 3 21 25
Option Index B
Base part Finishes Clips KonduxTM pads In-Sil-8TM pads Hi-Flow®pads Semiconductor mounts Solderable pins Studs Clinch nuts
(page 110) (page 97–98) (page 86) (page 86) (page 87) (page 90) (page 94) (page 96) (page 95)
Available Option codes for Aavid 12 digit part numbers. For additional information on option codes see "How to decipher
an Aavid 12 digit part number" on page 80. To find the appropriate Option Index for a selected part number please refer
to the main product section in the front of the catalog or "How to use this catalog" on page 2.
Ordering Codes sales.na@aavid.com www.shopaavid.com
84
OPTION INDEX
500103 B U 01 02 04 05 07 1 3 06 08 09
500203 B U 01 02 04 05 09 1 3 06 08 09
500303 B U 01 02 03 04 05 1 3 06 08 09
500403 B U 01 02 03 04 05 1 3 06 08 09
501303 B U 01 03 04 05 07 1 3 13 06 07 08 09
501403 B U 01 02 03 05 07 1 3 13 06 08 17
501503 B U V 01 03 05 07 09 1 3 04 13 06 08 17
501603 B U V 01 02 04 05 07 1 3 13 14 08 17
505103 B U 01 02 03 04 05 1 3
505303 B U 01 02 03 04 05 1 3
505403 B U 01 02 03 04 05 1 3
506003 B U 13 14
506304 B U 01 53 14
519703 B U 01 03 04 05 07 1 3
519803 B U 01 03 04 05 07 1 3
519903 B U V 01 03 04 05 09 1 3
520103 B U V 01 04 05 07 09 1 3
520328 B U V
520329 B U V 08
566010 B U 28 31 34 37
566902 B U 31 37 39 40
569003 B U V 01 02 04 05 1 3 06 08 17
574204 B U 32 33
575603 B U V 01 03 04 05 1 3
575703 B U 01 03 04 05 1 3
575803 B U 01 04 05 07 09 1 3
575903 B U 01 03 04 05 07 1 3
576103 B U V 01 02 03 04 05 1 3
576203 B U V 01 02 03 04 05 1 3
576303 B U 01 02 04 05 1 3
576403 B U V 01 02 04 05 1 3
576802 B U V 31 32 33 37 39 40
576904 B U 01 02 03 05
577304 B U 01 02 03 05 01
577404 B U V 01 02 03 05 05 09 11
579003 B U 05
579604 B U 32 33
579704 B U 32 33
584000 B U 33 35
591202 B U 31 33 37 38 39 40
591302 B U 28 40
Option Index C
Base part Finishes Wave-OnTM mounts KonduxTM In-Sil-8TM Semiconductor Solderable Solderable Solderable
(page 110) pads pads mounts tabs nuts studs
(page 89) (page 86) (page 86) (page 90) (page 91–93) (page 94) (page 96)
Available option codes for Aavid 12 digit part numbers. For additional information on option codes see "How to decipher
an Aavid 12 digit part number" on page 80. To find the appropriate Option Index for a selected part number please refer
to the main product section in the front of the catalog or "How to use this catalog" on page 2.
Ordering Codes sales.na@aavid.com www.shopaavid.com
85
OPTION INDEX
6021 B U PB SF1 CNM1 G5
6022 B U PB SF1 SF2 CNM1
6025 PB D TC-10 SF1 SF3 CNE42 G5
6109 B U PB MT MT5 TC-1 SE3 SE1 SF1 CNE42 G5
6110 B U PB MT SE1 SM3 CNE42
6225 B U PB MT TC-10 SF1 G5
6230 B U PB D
6232 B U PB MT MT3 MT5 TC-1 SF1 G5
6238 B U PB MT MT5 MT6 G5
6239 B U MT
6374 B P2
6380 B P2 CNE42
6396 B P2 P3 CNM1 CNM2
6398 B TC-6 P2 CNE42 CNE43 G7
6399 B TC-6 P2 CNM2 G7
6400 B P2
7019 B U PB MT MT6 SE3 SF1 SNM1
7020 B U MT MT2 MT5 MT6 TC-10 TC-11 TC-12 SE3 CNM1 CNE42 8223-CL03 G5 G4
7021 B U MT MT5 MT6 TC-10 TC-11 TC-12 CNE42 8223-CL03 G5
7022 B U PB MT MT5 TC-1 TC-11 TC-12 SE3 SF1 8241-CL11 8223-CL03
7023 B U MT MT5 TC-1 TC-6 TC-7 TC-12 SNE2 G4
7025 B U MT MT3 MT6 TC-12 SE3 8223-CL03
Base Finishes Mounting Clips Solderable Device Clinch Solderable Alignment Grafoil®
part tabs studs & pins mtg. studs nuts nuts pads pads
(page 110) (page 93) (page 98) (page 94–96) (page 96) (page 95) (page 94) (page 87) (page 86)
Option Index D
Available option codes for Thermalloy origin part numbers. For additional information on option codes see "How to decipher
a Thermalloy Origin part number" on page 81. To find the appropriate Option Index for a selected part number, refer to the
main product section in the front of the catalog or "How to use this catalog" on page 2.
Ordering Codes sales.na@aavid.com www.shopaavid.com
86
INTERFACE MATERIALS
In-Sil-8TM
These silicone based pads provide both thermal
conductivity and electrical isolation. In-Sil-8TM
pads have a fiberglass carrier that withstands
the rigors of assembly, harsh environments
and aging under continuous use. In-Sil-8TM pads
install faster than traditional mica and grease
and will not contaminate solder baths. Screw
mounting is recommended to achieve the best
thermal performance.
The shape and hole pattern of the heat sink will determine the shape and hole
pattern of the pad. If you are ordering a heat sink which mounts to a semicon-
ductor on both sides, the ordering code for two pads should be used.To order
additional In-SilTM pads separate, or factory applied variations please contact
an Aavid sales rep for inquiries.
Interface Material/Pads
Color Grey
Thickness 0.18 (0.007)
Breakdown voltage 3500
Dielectric constant 5.5
KonDux™ / Grafoil® Conducta-Pad**
Kondux™ interface pads are a cost effective
alternative to thermally conductive grease
compounds. Kondux™ pads are electrically
conductive and ideal for use with small,
discrete semiconductors. Aavid pre-applies
Kondux™ to your heatsink to enhance heat
conductance from the semiconductor case
and speed your manufacturing process.
Color Black (metallic)
Thickness 0.13 (0.005)
Thermal resistance See Graph pg 10
Electrical resistivity 15 x 10-6 Ohms
Compression strength: 580 psi
for 10% reduction in thickness
Tensile strength 650 psi
Ultimate compression strength 12500 psi
Service temperature -240°C to +300°C
Liner None
(1.650)
41.91
(1.140)
28.96
2X (0.093)
2.36
2X
(0.140)
3.56
ø
ø
507222B _ 0000G
Ordering code
575703B _ 0000G
Ordering code
ORDERING INFORMATION
example 12 digit part
ORDERING INFORMATION
example 12 digit part
MATERIAL PROPERTIES
Ordering code Description
0 No pads
3 One In-Sil-8TM pad
4 Two In-Sil-8TM pads
The shape and hole pattern of the heat sink will determine the shape and hole
pattern of the pad. If you are ordering a heat sink which mounts to a semicon-
ductor on both sides, the ordering code for two pads should be used.
Ordering code Device Figure "A" Dim "B" Dim "C" Dim
1 or 2* TO-3 A
1 or 2* TO-218 B 19.05 (0.750) 4.57 (0.180) 15.24 (0.600)
1 or 2* TO-220 B 15.88 (0.625) 2.68 (0.105) 10.67 (0.420)
MATERIAL PROPERTIES
21.84
(0.860)
18.80
(0.740) 2.69
(0.160)
16.76
(0.660)
DIA
19.05
(0.750)
12.70
(0.500) 3.73
(0.147)
14.30
(0.563)
DIA
TO-3 TO-220 TO-218
Figure A Figure B
*Factory applied only
One KonDuxTM pad
(1.650)
41.91
(1.140)
28.96
2X (0.093)
2.36
2X
(0.140)
3.56
ø
ø
** The Grafoil® name was originally marketed by Thermalloy and is the same material as KonduxTM
Grafoil® is a registered trademark of the Union Carbide Company
Suffix Device Figure "A" Dim "B" Dim "C" Dim
G1 TO-3 A
G4 TO-218 B 19.30 (0.760) 4.83 (0.190) 15.75 (0.620)
G5 TO-220 B 16.51 (0.650) 3.43 (0.135) 10.67 (0.420)
G7 Multiwatt B 17.53 (0.690) 2.92 (0.115) 20.07 (0.790)
6109B - G
A
example
Thermalloy origin part
B C
A= Model number
B= Grafoil® pad
C= RoHS compliant
"A"
"B"
"C"
TO-3 TO-220 TO-218
Thermal resistance (approx.) 0.33 1.25 0.77
Screw size 6-32 4-40 4-40
Torque in–lbs 6–8 4–6 4–6
sales.na@aavid.com www.shopaavid.com
87
INTERFACE MATERIALS
Alignment Pads
Aavid has added a phase change pad to its
line-up. These pads provide low thermal
resistance and electrical isolation for low
pressure spring mount applications. Above
the phase change temperature the material
flows to fill in surface irregularities and
maximize the heat conduction path.
Interface Material/Pads
Solderable alignment pads are an innovative
way to attach the heat sink to your transistor that
could cut your assembly time by more than half.
Alignment pads provide cost effective solderability,
while providing numerous additional benefits.
Alignment pads are factory applied and can be
bought separately as well. Please refer to accessory
Index D on page 85.
Suffix Device Figure
8223-CL03G TO-220 B
8241-CL11G TO-218 A
Hi-Flow®*
(1.000)
25.40
(0.030)
0.76
(0.122)
3.10
(0.985)
25.02
(0.520)
13.21
(1.200)
30.48
(0.860)
21.84
9.40
(0.370)
5.08
(0.200)
3.25
(0.128)
1
CLIP ASSEMBLY
C
L
(0.460)
11.68
(0.300)
7.62
(0.670)
17.02
0.51
(0.020)
TYP THK
14.22
(0.560)
3.18
(0.125)
0.76
(0.030)
(0.860)
21.84
5.08
(0.200)
(0.790)
20.07
Figure A
ORDERING INFORMATION
example
Thermalloy origin part 7022B–8223–CL03 G
AB
A= Model number
B= Alignment pad
C= RoHS compliant
Figure B
Typical installation
Shown with part number 8241-CL11 Recommended hole pattern for 8223-CL03G Recommended hole pattern for 8241-CL11G
14.73
(0.580)
7.37
(0.290)
2.54
(0.100)
2.54
(0.100)
PLATED THRU HOLE PER
DEVICE MANUFACTURERS
RECOMMENDATION
2.95
(0.116)
DIA PLATED
THRU HOLE
25.40
(1.000)
12.70
(0.500)
5.46
(0.215)
2.95
(0.116)
DIA PLATED
THRU HOLE
5.46
(0.215)
1.60
(0.063)
DIA PLATED
THRU HOLE
TYP(3) TYP(2)
C
Reinforcement carrier Polymide
Thickness 0.127 (0.005)
Continuous use temp (°C) 150
Phase change temp(°C) 55
Dielectric breakdown voltage (Vac) 5000
Dielectric constant (1000 Hz) 4.5
Volume resistivity (Ohm-meter) 1012
MATERIAL PROPERTIES
(1.650)
41.91
(1.140)
28.96
2X (0.093)
2.36
2X
(0.140)
3.56
ø
ø
21.84
(0.860)
18.80
(0.740) 2.69
(0.160)
16.76
(0.660)
DIA
19.05
(0.750)
12.70
(0.500) 3.73
(0.147)
14.30
(0.563)
DIA
TO-3 TO-220 TO-218
530101B _ 5150G
Ordering code
ORDERING INFORMATION
example 12 digit part
Ordering code Description
0 No pads
7 One Hi-Flow® pad
8 Two Hi-Flow® pads
The shape and hole pattern of the heat sink will determine the shape and hole
pattern of the pad. If you are ordering a heat sink which mounts to a semicon-
ductor on both sides, the ordering code for two pads should be used.To order
additional Hi-Flow® pads separate, or factory applied variations please contact
an Aavid sales rep for inquiries.
Thermal impedance vs. pressure
Pressure 10 25 50 200
TO-220 Thermal performance (ºC/W) 1.15 1.14 1.12 1.1
* Hi-Flow® is a registered trademark of the Bergquist Company sales.na@aavid.com www.shopaavid.com
88
INTERFACE MATERIALS
Interface Material / Double Sided Tape
T414 for ceramic or metal packages
Uses a 0.001 inch (0.03 mm) Kapton MTTM filled polymide
film coated on both sides with high-bond strength, pressure-
sensitive acrylic adhesive that is loaded with aluminum oxide
particles. This provides both good thermal performance and
excellent electrical isolation.
Double-sided thermal tapes adhere the heat sink to the device and offer
good thermal characteristics.They are easy to apply, require no curing time,
can be electrically conductive or isolating, and need no mechanical support
to provide thermal or physical contact between the device and the heat sink.
Aavid can apply one side to a heat sink.
Color Beige
Electrical function Insulating
Thickness 0.127 mm (0.005)
Carrier Kapton MTTM
Thermal impedance 0.60 °C-in2/w
Thermal conductivity 0.37 w/m-k
Breakdown voltage 5000 VAC
Volume resistivity 5 x 1015 Ohm-cm
Lap shear adhesion 125 (0.862) psi
Die shear adhesion
Aluminum 25°C 150 psi
Aluminum 150°C 15 psi
Creep adhesion
25°C @ 12psi >50 days
150°C @ 12psi >10 days
T405R for ceramic or metal packages
Uses a 0.002 inch (0.05 mm) aluminum foil core coated on both sides
with high-bond strength, pressure-sensitive acrylic adhesive that is
loaded with aluminum oxide particles. The aluminum foil provides
added thermal conductivity for applications where electrical isolation
is not required. The combination of filter, expanded metal and embossed
surface enhances both tape conformability and thermal performance.
T412 for ceramic or metal packages
Uses an expanded foil carrier coated on both sides with
high-bond strength, pressure sensitive acrylic that is
loaded with titanium diboride particles. The combination
of filter, expanded metal and embossed surface enhances
both tape conformability and thermal performance.
Color Grey
Electrical function Conductive
Thickness 0.009 (0.23 )
Carrier Expanded aluminum
Thermal impedance 0.25 °C-in2/w
Thermal conductivity 1.40 w/m-k
Breakdown voltage N/A
Volume resistivity N/A
UL flammability N/A
Lap shear adhesion 70 psi
Die shear adhesion
Aluminum 25°C 135 psi
Aluminum 150°C 25 psi
Alum.oxide 25°C 125 psi
Alum.oxide 150°C 40 psi
Creep adhesion
25°C @ 12 psi >50 days
150°C @ 12 psi >10 days
T410R / T411 for plastic packages
T410R thermally conductive tape consists of a high bond strength,
pressure sensitive acrylic adhesive loaded with aluminum oxide and
coated onto a 0.002 inch (0.05mm) aluminum foil carrier. The other
side of the foil carrier has a silicone pressure sensitive adhesive which
provides excellent adhesion to silicone-contaminated plastics and
other low energy surfaces.
T411 thermally conductive tape consists of a high bond strength,
pressure sensitive adhesive with an aluminum mesh carrier layer.The
mesh carrier allows the tape to conform to curved surfaces of plastic
molded IC packages, providing a high adhesive strength attachment
for heat sinks.The high performance silicone PSA allows adhesion to
silicone-contaminated plastics and other low energy surfaces.
Typical properties T410R T411
Construction Acrylic Silicone
Adhesive (to heat sink side)
Color White Clear (silver)
Carrier Aluminum foil Aluminum mesh
Adhesive (onto component side) Silicone Silicone
Color (to component side) Clear (Silver) Clear (Silver)
Thickness, mm (inch) 0.18 (0.007) 0.28 (0.011)
Thermal impedance @<1 psi °C-cm2/w (°C-in2/w) 7.1 (1.1) 6.5 (1.0)
Operating temperature range, °C -50 to + 150 -50 to + 150
Lap shear adhesion, psi (MPa) 60 (0.414) 14 (0.094)
Die shear adhesion, psi (MPa) steel/FR4
25°C 170 (1.172) 80 (0.552)
125 °C 40 (0.276) 20 (0.138)
Note: Double Sided Tapes are factory applied only.
Color White
Electrical function Conductive
Thickness 0.006 (0.015)
Carrier Aluminum
Thermal impedance 0.54 °C-in2/w
Thermal conductivity 0.50 w/m-k
Breakdown voltage N/A
Volume resistivity 3 x 10-2 Ohm-cm
UL flammability 94V-0
Rating U.L.94
Lap shear adhesion 134 psi
Die shear adhesion
Aluminum 25°C 125 psi
Aluminum 150°C 55 psi
Alum.oxide 25°C 145 psi
Alum.oxide 150°C 60 psi
Creep adhesion
25°C @ 12 psi >50 days
150°C @ 12 psi >50 days
375224B000 _ _G
Ordering code
ORDERING INFORMATION
example 12 digit part
Ordering code Tape option
31 T414
32 T405R
33 T412
34 T410R
35 T411 sales.na@aavid.com www.shopaavid.com
89
LABOR SAVING HEAT SINK TO BOARD & DEVICE TO HEAT SINK MOUNTS
Wave-OnTM Mounts
Wave-OnTM Mounts
"D"
"C"
"B"
"A"
7.92
(0.312)
Ordering code Model “A” Dim “B” Dim “C” Dim “D” Dim
01 E 4.32 (0.170) 2.54 (0.100) 2.54 (0.100) 0.96 (0.038) #6-32
02 EA 3.43 (0.135) 2.54 (0.100) 2.54 (0.100) 0.96 (0.038) #4-40
03 EG 3.43 (0.135) 2.54 (0.100) 1.14 (0.045) 0.96 (0.038) #4-40
04 EH 4.32 (0.170) 3.43 (0.135) 2.54 (0.100) 0.96 (0.038) #6-32
05 EK 4.32 (0.170) 2.54 (0.100) 1.14 (0.045) 0.96 (0.038) #6-32
07 EM 4.32 (0.170) 2.54 (0.100) 2.54 (0.100) 0.96 (0.038) 3.5MM
09 ER 4.32 (0.170) 2.54 (0.100) 5.08 (0.200) 0.96 (0.038) #6-32
Solderable mounts can be factory installed to practically
every board-mountable heat sink and flat sided extrusion.
The female threaded through holes permit pre-assembly
to the semiconductor via machine screws , allowing the
heat sink/semiconductor package to be treated as one unit
when fitted in PC board through holes for wave soldering.
Threaded
thru holes
PCB
thickness “T”
Model
EA, EG 3.68 (0.145) 1.57 (0.062)
E, EK, EM, ER 4.75 (0.187) 1.57 (0.062)
EH 4.75 (0.187) 2.29 (0.090)
Dia of PCB plated
thru hole
ORDERING INFORMATION
example part
FEATURES
Saves production time and cost
• Cuts production steps by half
• Factory installation eliminates steps
• Permits soldering in one step
• All the benefits of female threaded mount
• Automated fastening
• Excellent solderability
Better thermal performance
• Built in stand-off adds air space between PCB
and heat sink for improved air flow and easier
cleaning
• No lockwashers, nuts or separate
mounts with various thread lengths
574802B0 _ _ 00G
Ordering code
DIM "C"
STAND-OFF LENGTH
DIM "T"
PC BOARD
HEAT SINK
Typical Wave-OnTM mount installation sales.na@aavid.com www.shopaavid.com
90
LABOR SAVING HEAT SINK TO BOARD & DEVICE TO HEAT SINK MOUNTS
Semiconductor Mounts
Ordering code Thread “A”Dim “B” Dim “C” Dim “D” Dim
01 #6-32 7.11 (0.280) 4.75 (0.187) 1.78 (0.070) 2.74 (0.108)
02 #4-40 6.35 (0.250) 4.19 (0.165) 1.78 (0.070) 2.74 (0.108)
03 3.00 (0.118) 6.35 (0.250) 4.22 (0.166) 1.50 (0.059) 2.47 (0.097)
ORDERING INFORMATION
example 12 digit part
Female Semiconductor Mounts
• Fastens semiconductor to heat sink fast and efficiently
• Up to 10 times faster than fastening
with standard nuts and bolts
• Used with most JEDEC case sizes, factory installed
"A"
"B"
"C" "D"
Ordering code Thread
04 #6-32
05 #4-40
507302B000 _ _G
Ordering code
ORDERING INFORMATION
example 12 digit part
Male Semiconductor Mounts
• Captive male studs for semiconductor attachments
• Used with most JEDEC case sizes, factory installed MALE SEMICONDUCTOR
MOUNT
9.65
(0.380) 0.63
(0.025)
"C"
"A"
INSTALL
MOUNT
542502B000 _ _G
Ordering code sales.na@aavid.com www.shopaavid.com
91
LABOR SAVING HEAT SINK TO BOARD & DEVICE TO HEAT SINK MOUNTS
3.56
(0.140)
1.27
(0.050)
6.35
(0.250)
0.76
(0.030)
4.37
(0.172)
4.06
(0.160)
1.57
(0.062)
0.51
(0.020) 1.02
(0.040)
2.79
(0.110)
9.53
(0.375)
6.10
(0.240)
6.10
(0.240)
Tab ordering code 31 Tab ordering code 32
Tabs
Aavid’s Shur-Lock™ self locking stand-off tab (U.S. Patent
#5,437,561) positively secures any heat sink to the printed circuit
board.This Shur-Lock™ tab exhibits many unique design features.
The rounded and bifurcated tip of the Shur-Lock™ solderable tab
has been designed to easily snap into any 0.093”diameter hole.
Once through the hole, the tab provides a positive resistance to
backing or falling out of the hole. In addition, the spring action
between the tab and the plated through hole prevents leaning
or lift-off of the heat sink prior to or during the soldering process.
The tip extension of the Shur-Lock™ tab has been designed to
protrude less than 0.060” beyond the back of a standard 0.0625”
PC board, which is below the normal lead trimming allowance
for assembled PCBs.
Shur-Lock’s™ stand-off design facilitates the cleaning of assem-
bled PCBs and permits electrical traces to be routed under the
heat sink. The wide base supports of the tab further improve
the stability of the heat sink assembly.
• Positive PCB engagement
• Integrated PCB stand-off
• Quick “snap-in” assembly design
• Reduces installed assembly cost
• Designed for rugged shock
and vibration environments
• Can be installed on a variety of stamped
and extruded board level heat sinks
1.58
(0.062)
2.67
(0.105)
6.35
(0.250)
10.41
(0.410)
6.35
(0.250)
0.76
(0.030)
Variations of the above specifications are possible. Contact Aavid for additional details
for use with thicker PCB sizes, such as 0.093” or other hole diameters. *Vertical force
applied to the sink-tab joint.
Material Spring steel
Finish Tin plating over a copper flash
Pull-out force* 70 lbs/tab minimum
Recommended
PCB hole diameter 0.092” – 0.096”
PCB thickness 0.065” – 0.068”
PRODUCT INFORMATION
FEATURES
TM
Shur-LockTM Tabs
Tab ordering code 28
574802B0 _ _ 00G
Ordering code
ORDERING INFORMATION
example 12 digit part
Aavid solderable tabs stake onto heat sinks for solder mounting into the
PC board.The tabs are available in a variety of lengths, widths and thicknesses.
Tabs are factory applied for both vertical and horizontal mountings including:
step tabs, which keep the heat sink elevated above the board, and tabs with a
triangular base for extra stability.
Many of Aavid’s tabs are customized. Below are examples of standard tabs.
Please consult Aavid’s customer service department for information about
other tab options.
574802B0 _ _ 00G
Ordering code
ORDERING INFORMATION
example 12 digit part
TM
Solderable Staked on Tabs
Factory applied only sales.na@aavid.com www.shopaavid.com
92
LABOR SAVING HEAT SINK TO BOARD & DEVICE TO HEAT SINK MOUNTS
Note: The drawing above shows the right hand of a matched pair
which are supplied mounted to the heat sink.
6.10
(0.240)
1.57
(0.062)
8.89
(0.350)
0.51
(0.020)
0.76
(0.030)
15.62
(0.615)
C
L
R
Tabs
7.87
(0.310)
6.10
(0.240)
12.14
(0.478)
0.81
(0.032)
1.90
(0.075)
0.76
(0.030)
0.64
(0.025)
1.75
(0.069)
7.11
(0.280)
5.03
(0.198)
Tab ordering code 33 Tab ordering code 34
12.95
(0.510)
6.10
(0.240)
0.81
(0.032)
2.46
(0.097)
1.63
(0.064)
7.11
(0.280)
5.08
(0.200)
5.08
(0.200) 2.41
(0.095)
8.89
(0.350)
1.78
(0.070)
0.81
(0.032)
Tab ordering code 35 Tab ordering code 36
6.35
(0.250)
9.53
(0.375)
6.35
(0.250)
15.88
(0.625)
3.18
(0.125)
1.60
(0.063)
0.51
(0.020)
1.02
(0.040)
6.35
(0.250)
9.53
(0.375)
15.88
(0.625)
1.27
(0.050)
0.81
(0.032) 1.63
(0.064)
Tab ordering code 37 Tab ordering code 39 sales.na@aavid.com www.shopaavid.com
93
LABOR SAVING HEAT SINK TO BOARD & DEVICE TO HEAT SINK MOUNTS
Tabs
Solderable Mounting Tabs
Heat sinks ordered with solderable mounting
tabs have tin-plated spring steel tabs perma-
nently locked onto the heat sink to provide
wave solderability.The solderable tabs are
mounted on the heat sink after anodizing,
thus eliminating any special coating or han-
dling.The result is a wave solderable heat
sink with black anodized performance.
Suffix Ordering code Stand-off height Features “A” Dim “B” Dim Figure
MT 53 5.21 (0.205) Solderable mounting tab 15.88 (0.625) 4.83 (0.190) A 2.90 ± 0.10 (0.114 ± 0.004)
MT2 54 8.51 (0.335) Solderable mounting tab 19.18 (0.755) 8.13 (0.320) A 2.90 ± 0.10 (0.114 ± 0.004)
MT3 55 5.21 (0.205) 50 degree beveled corners on stand-off portion reducing board footprint 15.88 (0.625) 4.83 (0.190) A 2.90 ± 0.10 (0.114 ± 0.004)
from 7.87 (0.310) to 4.83 (0.190) width. Only tab with this feature.
MT5 56 5.21 (0.205) Bifurcated tabs in lieu of triangular shape 15.88 (0.625) 4.83 (0.190) B 2.95 ± 0.05 (0.116 ± 0.002)
MT6 57 2.92 (0.115) Bifurcated tabs in lieu of triangular shape 13.59 (0.535) 2.54 (0.100) B 2.95 ± 0.05 (0.116 ± 0.002)
7.62
(0.300)
(0.310)
(0.090)
2.03
(0.080)
3.18
(0.125)
2.28
7.87
"A"
"B"
(0.190)
MT3 ONLY
4.83 BEVELED
CORNERS
MT3 ONLY
3.09
(0.122)
2.79
(0.110)
(0.310)
7.87
3.18
(0.125)
7.62
(0.300)
DETAIL B
SEE DETAIL B
"A"
"B"
Notes: Mounting tabs have unique locking features built into their design. Aavid adds to standard
and custom heat sinks. For this reason, the tabs are factory applied, and cannot be sold separately. Please see page 85 for additional tab options.
574802B0 _ _ 00G
Ordering code
6070B– G
B
ORDERING INFORMATION
example 12 digit part
example
Thermalloy origin part
FIGURE B
FIGURE A
A
A= Model number
B= Mounting tab suffix
C= RoHS compliant
TRIANGULAR
TAB
"A" REF
ADD TO
HEIGHT OF PART
Typical Installation
Recommended
PCB plated
thru hole:
0.81
(0.032)
1.63
(0.064)
6.35
(0.250)
6.32
(0.245)
1.27
(0.050)
12.57
(0.495)
C
L
6.35
(0.250)
3.18
(0.125)
1.27
(0.050)
3.18
(0.125)
1.02
(0.040)
6.35
(0.250)
15.88
(0.625)
0.51
(0.020)
Tab ordering code 40 Tab ordering code 43
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94
LABOR SAVING HEAT SINK TO BOARD & DEVICE TO HEAT SINK MOUNTS
Solderable Pins / Solderable Nuts
Solderable nuts are permanently swaged into the heat sink
for quick pre-assembly with the transistor. Screws are used
to mount to the heat sink and are installed from the top.
Solderable nuts feature a closed end that prevents solder
from wicking into threads and trapping contaminants or flux.
Heat sink and transistor are then handled as a single compo-
nent and dropped into plated-thru holes in the PC board for
wave soldering. (Solderable nuts require slightly larger printed
circuit board hole sizes)
• Pre-mounted to heat sink at factory
• Ease of pre-assembly in production
• Mechanical and electrical integrity
• Wave solderability
Solderable Nuts
Note: If a part number requires 2 solderable nuts, simply add a "/2" after the solderable
nut character suffix on Thermalloy origin parts.
FEATURES
Suffix Ordering code Dia of PCB thru hole Thread
SNM-1 N/A 4.95 (0.195) M3X0.5
SNE-1 14 4.95 (0.195) 4-40 UNC-2B
SNE-2 13 4.95 (0.195) 6-32 UNC-2B
(0.170)
4.32
(0.050)
1.27
(0.129)
3.28
(0.140)
3.56
ø
SOLDERABLE NUT
(0.170)
4.32
SOLDERABLE
NUT
(0.129)
3.28
(0.140)
3.56
C
L
(0.065)
1.65
ø
THREAD
7.62
(0.300)
ø
7.75
(0.305)
3.56
(0.140)
3.28
(0.129)
4.32
(0.170)
Mechanical drawings showing heat sinks with solderable nuts
506003B0 _ _ 00G
Ordering code
7019B– G
B
ORDERING INFORMATION
example 12 digit part
example
Thermalloy origin part
A
A= Model number
B= Solderable nut suffix
C= RoHS compliant
Vertically mounted, extruded heat sinks are
converted to wave solderable with the addition
of solderable roll pins. Roll pins are available
with stand-off shoulders in different heights
for easier cleaning after wave soldering.
Suffix Ordering code Description “A” Dim Figure
P2 21 Solid pin w/stand-off shoulder 0.050" 0.050 A
P3 N/A Solid pin w/stand-off shoulder 0.125" 0.125 A
N/A 25 Solid solderable pin B
Solderable Pins
12.70
(0.500)
4.45
(0.175)
2.34
(0.092)
Typical installation P2-P3
529902B0 _ _ 00G
Ordering code
ORDERING INFORMATION
example 12 digit part
FIGURE B
(0.097)
2.46
(0.095)
2.41
(0.216)
5.49
(0.500)
12.70
ø
ø
"A"
FIGURE A
Stand-Off Shoulder
Heat sink
PC Board
"A"
Pin 25
1.27
(0.500)
2.41
(0.095)REF
5.49
(0.216)
REF
REF
3.96
(0.156)
2.46
(0.097)
Pin P2-P3
6396B– G
B
example
Thermalloy origin part
A
A= Model number
B= Solid pin suffix
C= RoHS compliant
C
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95
LABOR SAVING HEAT SINK TO BOARD & DEVICE TO HEAT SINK MOUNTS
Clinch Nuts
Clinch nuts are threaded nuts that allow quick assembly of the
transistor to the heat sink. A single screw mounts the transistor
to the heat sink, reducing your hardware requirements. Clinch
nuts are permanently pressed into the heat sink, and come in a
variety of English and Metric threads–CNE designates an English
thread, and CNM designates a Metric thread.
Clinch Nuts
Suffix Ordering code Thread “A” Dim “B” Dim Figure
CNE42 12 4-40 UNC-2B 0.96 (0.038) A
CNE43 N/A 4-40 UNC-2B 1.37 (0.054) A
CNM1 13 M3 X 0.5 0.76 (0.030) 4.06 (0.160) B
CNM2 N/A M3 X 0.5 0.96 (0.038) 4.22 (0.166) B
CLINCH NUT
CLINCH NUT
INSTALLED
(0.248)
6.30
"A"
1.50
(0.059)
"B"
"A"
SECTION A-A
"A"
1.78
(0.070)
6.35
(0.250
"A"
Mechanical drawing showing heat sink with clinch nut
529801B000 _ _ G
Ordering code
7019B– G
A
ORDERING INFORMATION
example 12 digit part
example
Thermalloy origin part
FIGURE A FIGURE B
B
A= Model number
B= Clinch nut suffix
C= RoHS compliant
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96
LABOR SAVING HEAT SINK TO BOARD & DEVICE TO HEAT SINK MOUNTS
Solderable Studs
Studs
Threaded solderable studs are permanently swaged in place
for quick pre-assembly with the transistor. The device is
placed over the stud (s) followed by the lock washer and
nut. This entire component is then dropped into plated-thru
holes in the printed circuit board for wave soldering.The
end of the stud is tin-plated for excellent solderability and
extends only 0.040" below a 0.062" PC board to clear lead
trimming saws.
Device mounting studs for "Thermalloy-origin"
items are available as options on certain vertical
and board mount heat sinks as a labor-saving aid
for mounting semiconductors.This optional feature
speeds production assembly time and reduces
hardware requirements.
Device Mounting Studs
Suffix Ordering code Dia of PCB thru hole “A” Dim “B” Dim “C” Dim Figure
SE-1 08 3.68 (0.145) 8.89 (0.350) 6-32 1.13-1.26 (0.045-0.050) A
SE-2 06 3.68 (0.145) 12.32 (0.485) 6-32 1.14-1.27 (0.045-0.050) A
SE-3 09 3.68 (0.145) 8.89 (0.350) 4-40 1.14-1.26 (0.045-0.050) A
SE-4 14 3.68 (0.145) 8.89 (0.350) 6-32 3.05 (0.120) B
SM-1 17 3.68 (0.145) 8.89 (0.350) M3 x 0.5 3.05 (0.120) B
SM-3 07 3.68 (0.145) 8.89 (0.350) M3 x 0.5 1.13-1.26 (0.045-0.050) A
Suffix Ordering code “A” Dim “B” Dim “C” Dim “D” Dim
SF1 11 7.92 (0.312) 4-40 UNC-2A 0.25 (0.010) 4.75 (0.187)
SF2 N/A 8.00 (0.315) M3 x 0.5 0.25 (0.010) 4.60 (0.181)
SF3 N/A 7.92 (0.312) 6-32 UNC-2A 0.25 (0.010) 5.23 (0.206)
"B"
"D"
"A"
"C"
C
L
Device
Mounting
Stud
Mechanical drawing showing heat sink with device mounting studs
PC BOARD
"C" "C"
HEAT
SINK
PC BOARD
HEAT
SINK
5.49
(0.216)
ø
"A"
"B"
"C"
501303B000 _ _ G
Ordering code
7022B– G
B
529801B000 _ _G
Ordering code
7019B– G
B
ORDERING INFORMATION
example 12 digit part
example
Thermalloy origin part
ORDERING INFORMATION
example 12 digit part
example
Thermalloy origin part
A
A= Model number
B= Stud suffix
C= RoHS compliant
A
A= Model number
B= Stud suffix
C= RoHS compliant
FIGURE B
FIGURE A
Typical installation
Note: Factory installed only
Note: Factory installed only
C
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97
LABOR SAVING HEAT SINK TO BOARD & DEVICE TO HEAT SINK MOUNTS
Aavid Kool-KlipsTM
Clips
These one piece stainless steel clips eliminate the need for
screws, lock washers and nuts in the assembly process, there-
fore reducing assembly time and cost.These can be bought
separately, or found in the 11th or 12th position when deci-
phering an Aavid Standard product. Please reference Indexes
to see which clips are popular with which product offering.
Part number Transistor case style Ordering code
115000F00000G TO-220, TO-218 50
115100F00000G TO-220, TO-218 51
115200F00000G TO-220, TO-218 52
115300F00000G TO-220, TO-218 53
115400F00000G TO-220 54
116200F00000G TO-220, TO-218 62
5901G TO-220,TO-218, TO-247 Sold separately only
6801G TO-220,TO-218, TO-247 Sold separately only
7701G TO-220 Sold separately only
6.60
(0.260)
25.65
(1.010)
7.62
(0.300)
13.84
(0.545)
12.06
(0.475)
3.18
(0.125)
7.92
(0.312)
5.97
(0.235)
10.92
(0.430)
14.22
(0.560)
30.61
(1.205)
8.69
(0.342)
6.60
(0.260)
12.70
(0.500)
30.60
(1.205)
8.70
(0.342) 12.70
(0.500)
6.60
(0.260)
39.10
(1.540)
13.50
(0.530)
6.60
(0.260)
115000F00000G Code 50 115100F00000G Code 51
115200F00000G Code 52 115300F00000G Code 53
115400F00000G Code 54 116200F00000G Code 62
530101B000 _ _ G
Ordering code
ORDERING INFORMATION
To order clips seperately use part number below.
To order a clip as an option use ordering code.
37.08
(1.460)
7.24
(0.285)
3.99
(0.157)
5901G
6801G
37.10
(1.461)
14.25
(0.561)
7.54
(0.297)
4.75
(0.187)
16.00
(0.630)
11.00
(0.433)
6.60
(0.260)
7701G
example 12 digit part sales.na@aavid.com www.shopaavid.com
98
LABOR SAVING HEAT SINK TO BOARD & DEVICE TO HEAT SINK MOUNTS
Clips
Thermal Clips
Factory-Installed ONLY thermal clips, available on many
standard heat sinks (shown below) eliminate the use of screws
and nuts in assembling the heat sink and transistor. Plastic
case transistors slip into place for easy assembly. Thermal clips
are available in a variety of configurations. Locking clips have
an internal tab to lock the transistor permanently in place.
Suffix Ordering code Transistor case style Clip/Cover features
TC1 32 TO-220 Locking
TC6 36 TO-218, TO-220, Multiwatt Locking
TC7 N/A TO-218, TO-220, Multiwatt Insulated
TC10 33 TO-220, TO-218 Locking
TC11 34 TO-220 Insulated
TC12 35 TO-218, TO-220 Locking
(1.138)
28.91
(0.700)
17.78
(0.400)
10.16
(0.500)
12.70
(0.750)
19.05
(0.207)
5.26
6.35
(0.250)
10.16
(0.400)
11.81
(0.465)
28.91
(1.138)
10.16
(0.400)
6.35
(0.250)
12.70
(0.500)
19.05
(0.750)
28.91
(1.138)
10.16
(0.400)
6.35
(0.250)
12.70
(0.500)
28.90
(1.138)
6.98
(0.275)
(0.155)
3.94
(0.465)
11.82
(0.700)
17.78
(0.202)
5.13
(1.138)
28.90
(0.400)
10.16
17.78
(0.700)
6.35
(0.250)
11.82
(0.465)
19.90
(0.783)
28.88
(1.137)
TC-1 Code 32 TC-6 Code 36
TC-7 Code N/A TC-10 Code 33
TC-11 Code 34 TC-12 Code 35
7023B– G
B
ORDERING INFORMATION
example 12 digit part 530600B000 _ _ G
Ordering code
example
Thermalloy origin part
A
A= Model number
B= Clip suffix
C= RoHS compliant
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99
ACCESSORIES
Mounting Kits
5
2
1
3
6
4
TRANSISTOR
NOT INCLUDED
5
1
23
7
6
4
TRANSISTOR
NOT INCLUDED
• Pre-packaged in heat-sealed plastic bags for use on assembly line.
• Stock mounting hardware using one number
for better control and identification.
• Three different insulating materials available:
Low cost ThermalfilmTM
High temperature Mica
High performance ThermalsilTM lll
• Other insulator materials available for special order include:
hard anodized aluminum and aluminum oxide.
• Individually packaged for convenient stocking and handling
of mounting hardware. Kits contain all hardware necessary to
electrically isolate the transistor from the heat sink.
Note: Smooth side of flat washer should be placed against insulator when using the kit.
TO-220 Mounting kit part number 4880
Part number Item Qty Description
1 1 Insulator
43-77-9 ThermalfilmTM (see page 101)
(56-77-9) Mica (see page 103)
(53-77-9) ThermalsilTM III (see page 103)
7721-7PPS 2 1 Shoulder washer
MS15795-804 3 1 Flat washer #4
No. 4-40 UNC-2B
MS35649-244 4 1 Hex nut
No. 4-40 UNC-2A X
MS51957-17 5 1 1/2 Long phillips pan head screw
MS35338-135 6 1 Lock washer, No. 4
TO-3 Mounting kit part number 4804
Part number Item Qty Description
1 1 Insulator
43-03-2 ThermalfilmTM (see page 101)
(56-03-2) Mica (see page 103)
(53-03-2) ThermalsilTM III (see page 103)
7721-5PPS 2 2 Shoulder washer
MS15795-805 3 2 Flat washer #6
MS35649-264 4 2 No. 6-32 UNC-2B
Hex nut
MS 51957-30 5 2 No. 6-32 UNC-2A X
1/2 Long phillips pan head screw
MS35338-136 6 2 Lock washer, No. 6
322-156 7 1 Solder lug
FEATURES
ORDERING INFORMATION
Note: Smooth side of flat washer should be placed against insulator when using the kit.
ORDERING INFORMATION
Mounting Kits
Part number Description
4880G Kit with ThermalfilmTM
4880MG Kit with Mica Insulator
4880SG Kit with ThermalsilTM III
EACH KIT INCLUDES:
Part number Description
4804G Kit with ThermalfilmTM
4804MG Kit with Mica Insulator
4804SG Kit with ThermalsilTM III
EACH KIT INCLUDES: sales.na@aavid.com www.shopaavid.com
100
ACCESSORIES
• Available in nylon or polyphenylene sulfide
• Chemically inert [no known solvents under 200°C (392°F)]
• Maximum recommended service temperature of 260°C (500°F)
• Recommended torque is 0.565Nm to 0.678Nm (5 to 6 inch-pounds)
on all shoulder washers except –7, which has recommended torque
of 0.452Nm (4 inch-pounds)
"A"
"E"
"D"
DIA
"B"
"C"
Shoulder
Washer
Note: A single gate extension, not to exceed 0.64 (0.025) in length, is allowable on the outside of all shoulder washers.
* Design allows insertion in the tab of a TO-220.
** Also for M3 screw.
Material is nylon type 6
FIGURE A
"A"
5.59
(0.220)
"E"
DIA
FIGURE B
"A"
"B"
0.33
(0.013)
"C"
"D"
"E"
Insulating Shoulder Washers
Polyphenylene Sulfide PPS Shoulder Washers
Nylon Shoulder Washers
Part number “A” Dim “B” Dim “C" Dim "D" Dim "E" Dim Screw size Figure
7721-1PPSG 7.11 (0.280) 3.18 (0.125) 1.07 (0.042) 2.84 (0.112) 3.81 (0.150) 4 A
7721-2PPSG 7.11 (0.280) 4.70 (0.185) 1.07 (0.042) 2.84 (0.112) 3.81 (0.150) 4 A
7721-3PPSG 7.11 (0.280) 3.18 (0.125) 1.07 (0.042) 2.84 (0.112) 3.56 (0.140) 4 A
7721-5PPSG 7.92 (0.312) 0.79 (0.031) 1.19 (0.047) 3.66 (0.144) 4.50 (0.177) 6 A
7721-6PPSG 7.11 (0.280) 0.79 (0.031) 1.19 (0.047) 3.00 (0.118) 3.68 (0.145) 4 A
7721-7PPSG* 5.46 (0.215) 0.81 (0.032) 1.02 (0.040) 2.95 (0.116) 3.43 (0.135) 4 A
7721-10PPSG 7.62 (0.300) 2.41 (0.095) 1.40 (0.055) 2.97 (0.117) 3.56 (0.140) 4 B
Part number “A”Dim “B”Dim "C" Dim "D" Dim "E" Dim
7721-11NG 7.80/8.05 (0.307/0.317) 2.87/3.00 (0.113/0.118) 3.56/3.81 (0.140/0.150) 3.76/3.89 (0.148/0.153) 1.09/1.35 (0.043/0.053)
7721-13NG 5.89/6.05 (0.232/0.238) 2.87/3.00 (0.113/0.118) N/A 3.43/3.56 (0.135/0.140) 1.19/1.40 (0.047/0.055)
7721-15NG 5.59/6.10 (0.220/0.240) 2.90/2.95 (0.114/0.116) 1.73/1.91 (0.068/0.075) 3.43/3.58 (0.135/0.140) 0.51/0.64 (0.020/0.025)
FEATURES
Note: This figure is common to
figures A and B
** sales.na@aavid.com www.shopaavid.com
101
ACCESSORIES
THERMALFILM™ MT
177.2 x 103volts/mm
(4500 volts/mm)
4.3
0.002
1017 ohm-cm
1016 ohms
465 volts
100.000 megohm mfds.
0.05mm (0.002”)
103 MPa (1500 psi)
0.31 MPa (45 psi)
35,433 gm/mm (900 gm/mil)
1.78 gm/cm3(111.1 lb/ft3)
>10,000 cycles
NONE
815ºC (1499ºF)
435ºC (815ºF)
525ºC (977ºF)
-260ºC to 240ºC
(-436ºF to 464ºF)
0.379 W/m ºC
(0.219 BTU/hr-ft-ºF)
V-0, UL “E” card E39505
Thermalfilm™ and Thermalfilm™ MT are low cost polymide plastic insulating films designed
to be an improved replacement for mica.These insulators have a distinctive amber color and
can be easily recognized and assembled on a production line.
Thermalfilm™ MT, made from high performance Kapton™ MT material, provides thermal
conductivity nearly 2-5 times greater than standard Thermalfilm™. Both insulators have an
extremely high resistance to flow or thin out under high compressive stresses, particularly at
elevated temperatures. Excellent physical, mechanical and electrical properties remain nearly
constant over a wide range of temperatures and frequencies.They are radiation resistant,
have no melting points, and have no known organic solvents. The polymide plastic film is UL
listed as a component in UL’s publication “Component – Plastic Material” dated September
18, 1969. The UL card number is E39505R, Guide QMFZ2 filed by E. I. du Pont de Nemours
& Co., Inc.ThermalfilmTM is rated 94-V/0.
PROPERTY
Dielectric strength
Dielectric constant
Dissipation factor
Volume resistivity
Surface resistivity
Corona start voltage 0.025mm (1-mil)
Insulation resistance
Material thickness
Ultimate tensile strength (MD)
Bursting strength test (Mullen)
Tear strength – initial
Density
Folding endurance (MIT)
Melting point
Zero strength temperature
Cut through temperature
Service temperature
Thermal conductivity
Flammability
THERMALFILM™
0.03mm (1-mil)
240 x 103volts/mm
(6,100 volts/mil)
3.5
0.002
1017 ohm-cm
1016 ohms
465 volts
100.000 megohm mfds.
0.05mm (0.002”)
1.72 x 108Pa (25,000 psi)
3.10 x 105Pa (45 psi)
27,559 gm/mm (700 gm/mil)
1.42 gm/cm3(88.7 lb/ft3)
>10,000 cycles
NONE
815ºC (1499ºF)
435ºC (815ºF)
525ºC (977ºF)
-260ºC to 240ºC
(-436ºF to 464ºF)
0.156W/m ºC
(0.09 BTU/hr-ft-ºF)
V-0, UL “E” card E39505
TEST METHOD
ASTM D149-64
ASTM D150-64T
ASTM D150-64T
ASTM D257-61
ASTM D257-61
ASTM D1868-61T
Based on 0.05 mfd wound
capacitor using 0.25 mm
(1-mil) Film
ASTM D882-64T
ASTM 0774-63
ASTM D1004-61
ASTM D1505-63T
ASTM D2176-63T
Hot Bar (Du Pont test)
Weighted probe on heated film
(Du Pont test)
Model TC-1000 twin heatmeter
Comparative tester
UL 94
Notes: One mil equals 0.001 inch
Dimensional tolerances are ± 0.38mm (0.015”), hole diameters are ± 0.25mm (0.010”) and angularity is ± 1 1/2° unless otherwise specified.
PHYSICAL
THERMAL
ELECTRICAL – TYPICAL VALUE @ 25° C
Thermalfilm™ and Thermalfilm™ MT
Thermalfilm™ Polyimide Plastic Films
ORDERING INFORMATION
For standard pre-cut sizes of ThermalfilmTM
and ThermafilmTM MT see page 102. sales.na@aavid.com www.shopaavid.com
102
ACCESSORIES
"A"
"B"
"A"
"B"
"C"
DIA
TYP
(4)
"C"
DIA
TYP
(3)
"B"
30.15
(1.187)
10.92
(0.430)
"A"
1.83
(0.072)
"C"
DIA
TYP (2)
"D"
DIA
TYP (2)
"A"
"B"
"C"
"D"
DIA
Insulators – Thermalfilm™ and Thermalfilm™ MT
Part number “A” Dim “B”Dim “C” Dim “D” Dim
43-03-2G 42.04 (1.655) 27.00 (1.063) 3.96 (0.156) 1.57 (0.062)
43-03-4G 39.70 (1.563) 26.67 (1.050) 3.56 (0.140) 1.57 (0.062)
Thermalfilm™ for TO-3
Thermalfilm™ for TO-5 and TO-18
Thermalfilm™ for TO-220,TO-126, Case 77, Case 199, Case 90, TO-218 and TO-3P
Part number Device Figure “A” Dim “B” Dim “C” Dim
43-05-1G TO-5 A 9.91 (0.390) 5.08 (0.200) 0.91 (0.036)
43-05-2G TO-5 B 9.91 (0.390) 5.08 (0.200) 0.91 (0.036)
43-18-1G TO-18 A 6.35 (0.250) 2.54 (0.100) 0.91 (0.036)
Part number Device “A” Dim “B” Dim “C” Dim “D” Dim
43-77-1G TO-126, Case 77 11.10 (0.437) 7.92 (0.312) 3.56 (0.140) 2.36 (0.093)
43-77-2G Case 90, Case 199 17.45 (0.687) 14.27 (0.562) 5.54 (0.218) 3.18 (0.125)
43-77-8G Case 90, Case 199 18.92 (0.745) 13.84 (0.545) 5.38 (0.212) 3.81 (0.150)
43-77-9G TO-220 18.42 (0.725) 13.21 (0.520) 4.32 (0.170) 2.92 (0.115)
46-77-9G* TO-220 18.42 (0.725) 13.21 (0.520) 4.32 (0.170) 2.92 (0.115)
43-77-20G TO-220,TO-218, TO-3P 23.24 (0.915) 18.80 (0.740) 6.98 (0.275) 3.66 (0.144)
ORDERING INFORMATION
ORDERING INFORMATION
ORDERING INFORMATION
FIGURE A FIGURE B
* ThermalfilmTM MT part numbers begin with “46”
ThermalfilmTM information on page 101
Dimensional tolerances are ± 0.38mm (0.015), hole diameters are ± 0.25mm (0.010)
and angularity is ± 1 1/2° unless otherwise specified.
ThermalfilmTM information on page 101
Dimensional tolerances are ± 0.38mm (0.015), hole diameters are ± 0.25mm (0.010)
and angularity is ± 1 1/2° unless otherwise specified.
ThermalfilmTM information on page 101
Dimensional tolerances are ± 0.38mm (0.015), hole diameters are ± 0.25mm (0.010)
and angularity is ± 1 1/2° unless otherwise specified. sales.na@aavid.com www.shopaavid.com
103
ACCESSORIES
Insulators – Mica and ThermalsilTM III
Mica and ThermalsilTM III
ORDERING INFORMATION
Part number Description Device "A" Dim "B" Dim "C" Dim "D" Dim Figure
56-77-9G Mica TO-220 18.42 (0.725) 13.21 (0.520) 4.32 (0.170) 2.92 (0.115) B
56-03-2G Mica TO-3 42.04 (1.655) 27.00 (1.063) 3.96 (0.156) 1.57 (0.062) A
53-77-9G ThermalsilTM III TO-220 18.42 (0.725) 13.21 (0.520) 4.32 (0.170) 2.92 (0.115) B
53-03-2G ThermalsilTM III TO-3 42.04 (1.655) 27.00 (1.063) 3.96 (0.156) 1.57 (0.062) A
Property
Electrical
Dielectric strength 172 X 103volts/mm (4500 volts/mil)
0.025 mm to 0.076 mm thick in air (1 to 3 mils thick in air)
Dielectric constant 6.5 to 8.7
Dissipation factor 0.0001-0.0004 @ 106Hz
Volume resistivity 1015 ohm-cm
Physical
Modules of elasticity in tension 172 X 103Mpa (25 X 106) psi
Tensile strength 310 Mpa (45,000 psi)
Hardness mohs, shore 3.0, 115
Compressive strength 2.21 X 108Pa (32,000 psi)
Specific gravity 2.9
Thermal
Thermal conductivity 0.528 W/(m °C ) (0.30 Btu/hr-ft °F)
Coefficient of thermal expansion 3.24 X 10-5 °C (1.8 X 10-5 °F)
Specific heat 0.084 KJ/Kg °C (0.02 Btu/Lb °F)
Melting point 1275°C (2327 °F)
Max. operating temperature 550 °C (1022 ºF)
TYPICAL PROPERTIES FOR MICA INSULATORS
Thermalsil™ III provides excellent thermal conductivity
and electrical resistance. It is used as an electrically-isolat-
ing interface material composed of silicone elastomer
binder with a thermally conductive filler. It is reinforced
with glass cloth to resist tearing and cut-through due to
burrs on transistors or heat sinks.
Thermalsil™ III eliminates the need for grease application
and conforms to mounting surfaces under clamping pres-
sure for optimum heat conduction.The finely woven glass
cloth provides the thinnest possible matrix for enhanced
thermal resistance.Thermalsil™ III is available in any con-
figuration with adhesive backing.
Mica insulators provide high maximum operating temper-
atures (550°C) and excellent electrical properties.
FIGURE A FIGURE B
"B"
30.15
(1.187)
10.92
(0.430)
"A"
1.83
(0.072)
"C"
DIA
TYP (2)
"D"
DIA
TYP (2)
"A"
"B"
"C"
"D"
DIA
Property Typical value 25°C Test method
Electrical
Dielectric constant 2.5@50 Hz ASTM D-150
2.5@103Hz
2.5@106Hz
Dielectric breakdown voltage 26.3 x 103volts/mm (667 volts/mil) ASTM D-149
Volume resistivity 5.7 x 1015 ohm-cm ASTM D-257
Dielectric dissipation factor 0.008@50 Hz ASTM D-150
0.004 @103Hz
0.004 @106Hz
Physical
Thickness 0.15mm
(0.006 inch)
Color Gray-Green
Tensile strength 6.1 x 107Pa (8786 psi)
Hardness, shore A 87
Elongation 2% or less
Thermal
Thermal conductivity 0.92 W/(m °C ) (0.532 Btu/hr. ft °F)
Flame resistance UL 94V-0 UL card #E-58126 (S)
Service temperature -60°C to 180°C
(-76°F to 356°F)
TYPICAL PROPERTIES FOR THERMALSILTM III sales.na@aavid.com www.shopaavid.com
104
ACCESSORIES
"C"
"A"
"B"
"E"
DIA
"D"
Insulators – Aluminum Oxide
Aluminum oxide has unique thermal conductivity qualities
and features low loss factors at high frequencies. It has high
compressive strength, high volume resistivity, low thermal
expansion and resists radiation.
Aluminum oxide insulating washers have a dielectric strength
of approximately 21.7 x 103volts/mm for .76mm material (550
volts/mil for 0.030 inch material) and 16.9 x 103volts/mm for
1.57mm material (430 volts/mil for 0.062 inch material). The
thermal conductivity of aluminum oxide is 15.06W/(m°C) at 75°C.
PROPERTY
A1203
Dielectric constant 25‚°C (77°F)
Dissipation factor 25°C (77°F)
Electrical resistivity 25°C (77°F)
Dielectric strength (AC)
Density
Hardness
Flexural strength 25°C (77°F)
Modules of elasticity
Poisson’s ratio
Tensile strength 25°C (77°F)
Compressive strength 25°C (77°F)
Coefficient of thermal expansion
Thermal conductivity
Specific heat (100°C)
Melting point
Maximum temperature for
continuous use
CHEMICAL – TYPICAL VALUE
94% nominal
ELECTRICAL
8.9 (1MHz)
8.9 (10GHz)
0.0001 (MHz)
0.0010 (10GHz)
>1014 ohm-cm
8.66 x 103volts/mm (6.35mm thick)
[220 volts/mil (0.250”thick)]
16.73 x 103volts/mm (1.27mm thick)
[425 volts/mil (0.050”thick)]
28.35 x 103volts/mm (0.25mm thick)
[720 volts/mil (0.010”thick)]
PHYSICAL
3.62 g/cm3(226 lb/ft3)
78 (Rockwell 45 N)
MECHANICAL
3.17 x 108Pa (minimum) [46.00 psi (minimum)]
3.52 x 108Pa (typical) [51,000 psi (typical)]
2.83 x 1011 Pa (41 x 106psi)
0.21
1.93 x 108Pa (28,000 psi)
2.10 x 109Pa (305,000 psi)
THERMAL
7.9 x 106/°C (4.4 x 106/°F)
18.01 W/(m°C) @ 25°C
14.24 W/(m°C) @ 100°C
79.56 W/(m°C) @ 400°C
8.79 x 104KJ/kg°C [2.1 x 104Btu/lb °F]
>3600°C (6512°F)
1700°C (3100°F)
TEST METHOD
Spectrographic analysis
(100%-% by wt. of total
metallic impurity)
ASTM D150-70
ASTM D2520-70
ASTM D150-70
ASTM D2520-70
ASTM D1829-66
ASTM D116-69
ASTM C20-70
ASTM E18-67
ACMA Test #2
ASTM C623-69T
ASTM C623-69T
ACMA Test #4
ASTM C528-63T
ASTM C372-56
ASTM C408-58
ASTM C351-61
"B"
10.92
(0.430)
"A"
1.83
(0.072)
"E"
15.09
(0.594)
"D"
RAD
TYP (2)
5.46
(0.215)
3.68
(0.145)
TYP (4)
"C" RAD
TYP (2)
DIA
Aluminum Oxide
Aluminum Oxide for TO-3
Aluminum Oxide Ceramic for TO-220
Aluminum Oxide Ceramic for TO-218,TO-247, and TO-3P
Part number Thickness “A” Dim “B” Dim “C” Dim “D” Dim “E” Dim
4103G* 1.91 (0.075) 39.70 (1.563) 26.67 (1.050) 13.34 (0.525) 4.75 (0.187) 30.40 (1.197)
4104G* 1.78 (0.070) 44.45 (1.750) 31.75 (1.250) 15.88 (0.625) 7.16 (0.282) 30.15 (1.187)
Part number Thickness “A” Dim “B” Dim “C” Dim “D” Dim “E” Dim
4169G* 1.57 (0.062) 19.30 (0.760) 13.97 (0.550) 4.78 (0.188) 6.98 (0.275) 3.68 (0.145)
4170G** 1.78 (0.070) 19.30 (0.760) 13.97 (0.550) 4.78 (0.188) 6.98 (0.275) 3.68 (0.145)
4171G** 1.78 (0.070) 16.51 (0.650) 12.70 (0.500) 4.32 (0.170) 6.35 (0.250) 3.81 (0.150)
4177G** 1.78 (0.070) 17.45 (0.687) 14.27 (0.562) 5.54 (0.218) 7.14 (0.281) 3.18 (0.125)
Part number Thickness “A” Dim “B” Dim “C” Dim “D” Dim “E” Dim
4180G* 1.78 (0.070) 23.24 (0.915) 18.80 (0.740) 6.98 (0.275) 9.40 (0.370) 3.96 (0.156)
ORDERING INFORMATION
ORDERING INFORMATION
ORDERING INFORMATION
"A"
"B"
"C"
"D"
"E" sales.na@aavid.com www.shopaavid.com
105
ACCESSORIES
• Reduces stress on leads during wave solder and post-soldering operations
• Provides stable mount to resist shock and vibration damage to leads
• 8923-1, 8923-2, and 8924 fit the TO-220
Note: Tolerances ± 0.25 (0.010) unless otherwise specified.
Material is nylon 6/6 rated 94 V-O
1.52
(0.060)
TYP (4) "A"
3.05
(0.120)
"B"
8.26
(0.325)
3.05
(0.120)
10.16
(0.400)
"C"
11.18
(0.440)
1.40
(0.055)
2.54
(0.100)
2.54
(0.100)
2.03
THRU
(0.080)
TYP (3)
4.06
(0.160)
1.02
(0.040)
1.52
(0.060)
SQ
SEE DETAIL "D"
(8924 ONLY)
DIA
DETAIL "D"
(8924 ONLY)
Insulators – Stanchion Pads
8923-1, 8923-2, 8924 Stanchion Pads
Part number “A”Dim “B” Dim “C” Dim
8923-1G 2.54 (0.100) 20.32 (0.800) 8.00 (0.315)
8923-2G 1.27 (0.050) 19.05 (0.750) 8.00 (0.315)
8924G 1.27 (0.050) 19.05 (0.750) 7.87 (0.310)
FEATURES
ORDERING INFORMATION sales.na@aavid.com www.shopaavid.com
106
ACCESSORIES
Insulating Covers
Insulating covers are designed to provide protection from accidental shock
during field service or repair.
Pan head screws not provided–MS 51957-30 or equivalent recommended–secure the cover
to the TO-3. At the typical mounting screw torque of 0.68–0.90 Nm (6-8 inch pounds), the
TO-3 cover material cold-flows around the screw head to securely fasten the cover.
Included are No.6 split washers as inserts to provide electrical connection of mounting screws
to the TO-3 collector and an insulating snap-in cover for the screw heads. A test probe hole is
provided in the top of the cover.
The 8903VB is made from thermoplastic polyester that meets the requirements of UL Bulletin
94 V-O. In addition to its excellent flammability rating, thermoplastic polyester offers resistance
to most chemical environments, heat deflection temperature to 215.6°C (420°F) and UL contin-
uous use temperature of 130°C (266°F). 41.91
(1.650)
30.23
(1.190)
28.45
(1.120)
1.19
(0.047)
THRU
6.22
(0.245)
THRU TYP (2)
22.61
(0.890)
39.88
(1.570)
9.91
(0.390)
4.57
(0.180)
DIA
DIA
5.54
(0.218)
"A"
1.47
(0.058)
3.58
(0.141)
Ø 9.52
(0.375)
Ø
"T"
"O.D." "I.D."
TO-3 Insulating Covers
Teflon-filled Acetal Insulators for TO-3
Teflon-filled Acetal Bushings for TO-3
Part number Material Color Flammability standards
8903NWG Nylon White Self-extinguishing UL 94 V-2
8903VBG Thermoplastic polyester Black Self-extinguishing UL 94 V-0 UL 492 Type 1
Part number Fits notch “A” Dim
103G 4.83 (0.190) 4.90 (0.193)
109G 6.35 (0.250) 6.35 (0.250)
Part number “I.D.” “O.D.” “T”
110G 5.03/5.21(0.198/0.205) 6.81/6.98 (0.268/0.275) 1.57/1.40 (0.062/0.055)
113G 6.43/6.60 (0.253/0.260) 7.82/8.00 (0.308/0.315) 1.57/1.40 (0.062/0.055)
ORDERING INFORMATION sales.na@aavid.com www.shopaavid.com
107
ACCESSORIES
Mounting Pads
• Prevent heat damage during soldering
• Facilitate board clean-up
• Prevent solder bridges
• Assure uniform device height
MAXIMUM OPERATING TEMPERATURE
* All “DAP” mounting pads meet UL 94 V-0
Index of Semiconductor Lead Conversion Pads
Index of Semiconductor Mounting Pads
Suffix Base material Continuous Deflection Color
NG Nylon base resin 121.0°C 250°F 243.3°C 470°F Natural
per ASTM STD
D4066-82-PA111
DAPG* Diallyl Phthalate 204.4°C 400°F 282.2°C 540°F Black only
per MIL-M-14G
type SDG
Converts lead
Part number spacing from To # of Leads Outside dia Thickness
7717-130G 0.05 In-Line TO-92 & TO-15 3 5.84 (0.230) 1.02 (0.040)
7717-247G TO-18 TO-5 3 7.11 (0.280) 3.81 (0.170)
7717-26G TO-18 TO-5 3 8.71 (0.343) 3.05 (0.120)
7717-44G TO-18 TO-5 4 7.75 (0.305) 3.18 (0.125)
For TO-18
For epoxy transistors
For TO-5
For TO-18
For integrated circuits
Misc. mounting pads
FEATURES PRODUCT INFORMATION
ORDERING INFORMATION
ORDERING INFORMATION
See pages 108 and 109 for mechanical drawings
See pages 108 and 109 for mechanical drawings
Note: Please specify material for each mounting pad: “N” = nylon; “DAP” = Diallyl Phtalate.
Example: 7717-3NG, 7717-86DAPG
Part number Leads Outside dia Thickness
7717-86G 3 8.71 (0.343) 1.91 (0.075)
7717-178G 3 8.89 (0.350) 0 .53 (0.021)
7717-79G 3 9.02 (0.355) 0.97 (0.038)
7717-3G 3–4 8.64 (0.340) 1.91 (0.075)
7717-15G 4 8.89 (0.350) 0.51 (0.020)
7717-5G 4 8.89 (0.350) 3.18 (0.125)
7717-4G 4 9.53 (0.375) 1.91 (0.075)
7717-16G 4 5.08 (0.200) 0.51 (0.020)
7717-18G 4 5.08 (0.200) 2.54 (0.100)
7717-108G 4 5.16 (0.203) 1.78 (0.070)
7717-89G 4 6.35 (0.250) 2.03 (0.080)
7717-7G 4 6.35 (0.250) 3.18 (0.125)
7717-122G 8 9.27 (0.365) 1.78 (0.070)
7717-8G 8 9.53 (0.375) 1.91 (0.075)
7717-156G 14 19.05 x 11.43 (0.750 x 0.450) 1.27 (0.050)
7717-175G Crystal Can Relay 10.16/ 20.32 (0.400 x 0.800) 1.27 (0.050) sales.na@aavid.com www.shopaavid.com
108
ACCESSORIES
Mounting Pads
0.13
(0.005)
Ø 8.64
(0.340)
2.54
(0.100)
TYP
0.64
(0.025) 1.91
(0.075)
1.27
(0.050)
Ø 5.08
(0.200)
Ø5.08
(0.200)
Ø 0.91
(0.036)
TYP (4)
1.27
Ø
C SINK
(0.050)
TYP (4)
Ø1.52 DIA
(0.060)
TYP (4)
1.40
(0.055)
1.90
(0.075)
Ø 9.52
(0.375)
0.64
(0.025)
Ø
1.90
(0.075)
TYP(8)
Ø 5.08
(0.200)
Ø 1.27
(0.050)
C SINK TYP (4) Ø 0.71
(0.028)
TYP (4)
1.27
(0.050)
0.51
(0.020)
8.89
(0.350)
0.64
(0.025)
3.18
(0.125)
1.27
(0.050)
1.65
(0.065)
TYP
0.71
(0.028)
TYP
3.18
(0.125)
MAX
6.35
(0.250)
ø 2.54
(0.100)
0.51
(0.020)
TYP
B.C.
ø
ø
Ø
5.08
(0.200)
Ø 0.91
(0.036)
TYP (4)
0.51
(0.020)
8.89
(0.350)
Ø
2.54
(0.100)
B.C.
Ø 0.91
(0.036)
TYP (4)
0.51
(0.020)
5.08
(0.200) 0.64
(0.025)
THRU
TYP (4)
5.08
(0.200)
Ø1.52
(0.060)
0.51
(0.020)
1.02
(0.040)
1.02
(0.040)
2.54
(0.100)
Ø
ØØ
8.71
(0.343)
1.40
(0.055)
3.05
(0.120)
TYP
Ø 5.08
(0.200)
1.14
(0.045)
1.57
(0.062)
TYP (6)
Ø
Ø
5.08
(0.200)
Ø
1.27
(0.050)
TYP (8)
9.52
(0.375)
1.90
(0.075) 1.40
(0.055)
Ø 0.91
(0.036)
TYP (8)
0.64
(0.025)
Ø
1.52
(0.060)
TYP (4) B.C.
1.02
(0.040)
0.51
(0.020)
Ø
1.02
(0.040)
OPP TYP (4)
Ø 5.08
(0.200)
B.C.
Ø 0.83
(0.033)
THRU
TYP (4)
Ø 6.48
(0.255)
2.67
(0.105)
7.75
(0.305)
0.51
(0.020)
0.25
(0.010) 0.51
(0.020)
B.C.
7717-3G 7717-4G
7717-5G 7717-7G
7717-15G
7717-16G 7717-18G
7717-26G Lead Conversion
7717-8G
7717-44G Lead Conversion sales.na@aavid.com www.shopaavid.com
109
ACCESSORIES
Mounting Pads
Ø 5.08
(0.200)
Ø1.14
(0.045)
TYP (3)
0.76
(0.030)
1.90
(0.075)
DIA TYP (3)
0.51
(0.020)
1.91
(0.075)
Ø 8.74
(0.344)
1.57
(0.062) TYP (3)
Ø
Ø
1.14
(0.045)
THRU TYP (3)
Ø 5.08
(0.200)
Ø 1.52
(0.060)
C SINK
TYP (3)
Ø
8.89
(0.350)
0.53
(0.021) 0.25
(0.010)
Ø 1.52
(0.060)
Ø
1.14
(0.045)
0.25
(0.010)
0.43
(0.017)
0.97
(0.038)
Ø 1.27
(0.050)
TYP (6)
Ø5.08
(0.200)
Ø 9.02
(0.355)
Ø
4.78
(0.188)
Ø 0.71
(0.028)
TYP (4)
Ø1.52
(0.060)
TYP (4)
Ø
C SINK
1.27
(0.050)
TYP (4)
Ø 2.54
(0.100) B.C.
1.14
(0.045)
6.35
(0.250)
0.56
(0.022)
2.03
(0.080)
OPP
5.08
(0.200)
TYP
5.08
(0.200)
TYP
2.54
(0.100) TYP
2.54
(0.100)
4.19
(0.165)
20.32
(0.800)
10.16
(0.400)
0.89
(0.035)
THRU TYP (8)
1.57
(0.062)
TYP (6)
1.27
(0.050)
TYP (8) 0.51
(0.020)
0.76
(0.030)
0.51
(0.020)
Ø
Ø
Ø
C SINK
2.39
(0.094)
Ø
THRU
0.64
(0.025)
TYP (4)
2.39
(0.094)
2.67
(0.105)
Ø1.40
(0.055)
TYP (4)
0.25
(0.010) 1.02
(0.040)
Ø 1.02
(0.040) TYP
5.16
(0.203)
Ø 0.79
(0.031) TYP
1.78
(0.070)
0.51
(0.020)
2.67
(0.105)
9.27
(0.365)
0.13
(0.005)
1.78
(0.070)
0.76
(0.030)
Ø 5.08
(0.200)
Ø 1.02
(0.040)
TYP (4)
Ø 8.00
(0.315)
B.C.
3.81
(0.150)
2.54
(0.100)
6.35
(0.250)
Ø 7.11
(0.280)
5.08
(0.200)
0.56
(0.022)
2.03
(0.080)
1.02
(0.04)
4 BOSSES
0.51
(0.020)
P.C.
Ø
1.43
(0.450)
12.70
(0.500)
6.35
(0.250)
Ø
1.57
(0.062)
TYP (4)
7.62
(0.300)
9.86
(0.388)
1.27
(0.050)
Ø
C SINK TYP (14)
2.54
(0.100)
TYP 6 PLCS
Ø 0.89
(0.035)
THRU TYP (14)
1.27
(0.050) 0.51
(0.020)
19.05
(0.750)
2.54
(0.100)
5.84
(0.230)
MAX
1.02
(0.040)
0.51
(0.020)
0.63
(0.025)
TYP (3)
1.02
(0.040)
TYP (4)
0.64
(0.025)
0.71
(0.028)
TYP (2)
Ø
Ø
7717-86G
7717-178G
7717-79G
7717-89G
7717-175G
7717-108G
7717-122G
7717-247G Lead Conversion
7717-156G
7717-130G Epoxy Transistors sales.na@aavid.com www.shopaavid.com
110
ACCESSORIES
Finish Aavid Code Thermalloy Suffix Description
Black Anodize B B Recommended for increased thermal performance.
Anodize is electrically isolating and does not provide
electrical insulation.
AavSHIELD3V V For corrosion protection or painting only.
Color variation may be expected with this finish.
Chromate is electrically conductive.
Does not provide electrical insulation.
Tin Plating D D Allows heat sink to be soldered to the PC Board.
Pre-Black Anodized J PB Edges cut during the manufacturing process will be unfinished.
Green Anodize M Alternative finish to Black anodize.
Recommended for increased thermal performance.
Electrically isolating but does not provide electrical insulation.
Unfinished U U Clean, no finish.
Black Anodize w/Black Paint W Paint on mounting surface prevents metal
from contacting the circuit thus avoiding shorts.
Note : All thermal graphs reflect black anodize finish.
Aavid code – Finish option must be noted by one of the above letters in the 7th position. Aavid's
standard finish is black anodize (B) unless otherwise noted.
Thermalloy origin suffix – The suffixes should be added after the model number to indicate the desired finish.
Finishes
6396BG
B
ORDERING INFORMATION
530122B00000G
example
Thermalloy origin part
A
A= Model number
B= Finish suffix
C= RoHS compliant
A= Base part
B= Finish code
C= RoHS compliant
B
A
example 12 digit part
C
Csales.na@aavid.com www.shopaavid.com
111
ACCESSORIES
Card Ejectors
• Saves time – no roll pin required
• Excellent for retrofit applications
• Material is nylon per ASTM D4066-82PA162F11
• Cost no more than conventional ejector/puller
• Rated at 222.5N (50 lbs.) / ejector force per pair
• One piece – no assembly required
• May be heat stamped
• Lever action releases card from its connector safely and quickly
• Cards, their components and connectors are less frequently damaged when extracting PC boards
• No special extraction tools are needed for board removal
• Material is nylon per ASTM D4066-82 PA120B4413F24, UL 94 V-O rated (natural color)
• Roll pins are provided (NAS 561-P3-4)
22.22
(0.875)
9.52
(0.375)
11.12
(0.438)
1.90
(0.075)
63.50
(2.500)
50.80
(2.000) 4.70
(0.185)
11.12
(0.438)
3.18
(0.125)
DIA TYP (2)
6.55
(0.258)
FIGURE A 5005-09NG PULLER *
31.75
(1.250)
11.10
(0.437)
7.14
(0.281)
Ø
2.46
(0.097)
7.24
(0.285)
1.57
(0.062)
14.27
(0.562)
FIGURE B 5005-08NG SLIM FACE/ FLAT
5021NG Ejector
FIGURE C 5005-25NG COMBINATION EJECTOR/PULLER
30.48
(1.200)
15.88
(0.625)
3.05
(0.120)
22.22
(1.875)
7.14
(0.281)
1.78
(0.070)
6.35
(0.250)
ø2.36
(0.093)
0.51
(0.020)
7.24
(0.285)
0.89
(0.035)
2.67
(0.105)
31.75
(1.250)
21.26
(0.837)
7.14
(0.281) 13.97
(0.550)
17.02
(0.670)
2.49
(0.098)
Ø
Snap-On Ejectors / Pullers
Standard Ejectors / Pullers
FEATURES
FEATURES
ORDERING INFORMATION
Part number Figure
5005-09NG A
5005-08NG B
5005-25NG C
*No roll pins provided
ORDERING INFORMATION
Part number
5021NG sales.na@aavid.com www.shopaavid.com
112
ACCESSORIES
Sil-FreeTM 1020 is a metal-oxide-filled, silicone-free synthetic grease
specially formulated to enhance heat transfer across the interface
between the semiconductor case and the heat sink without the
migration or contamination associated with silicone-based products.
Dry interface case-to-sink thermal resistance is typically reduced
50% to 75% with proper application of Sil-FreeTM 1020.
This virtually "no-bleed", high-performance compound will not dry
out, harden, melt, or run, even after long-term continuous exposure
to temperatures up to 200°C. Even in a vacuum atmosphere (10-5
Torr, 24 hours@100°C), Sil-FreeTM 1020 exhibits virtually "no bleed"
or evaporation.
ORDERING INFORMATION
Sil-FreeTM
Part number Package Size
101700F00000G Syringe 43 grams (1.5 oz)
101800F00000G Tube 57 grams (2.0 oz)
101900F00000G Jar 57 grams (2.0 oz)
102000F00000G Tube 143 grams (5.0 oz)
102100F00000G Jar 457 grams (16.0 oz)
Color White
Thermal 0.79 W/(m-°C)
conductivity
Operating -40°C to +200°C
temperature range
Volume 1012 Ohm-cm 2.3 ± 0.5
Weight 47.5 grams
Dielectric strength 225 volts/mil
Consistency Paste
Bleed 0.09 max
% after 24hr @ 200°C
Specific gravity 2.8 ± 0.2
Shelf life Indefinite
(unopened)*
Ther-O-LinkTM is a silicone-based thermal compound that
cost effectively enhances the heat transfer between a semi-
conductor case and a heat sink. Easy to apply, Ther-O-LinkTM
substantially reduces dry interface thermal resistance, while
providing long life under a variety of conditions.
ORDERING INFORMATION
Ther-O-LinkTM
Part number Package Size
100000F00000G Ampule 1 gram (0.03 oz)
100100F00000G Syringe 35.7 grams (1.25 oz)
100200F00000G Tube 57 grams (2.0 oz)
100500F00000G Tube 143 grams (5.0 oz)
100800F00000G Tube 228.6 grams (8.0 oz)
101600F00000G Can 0.45 kg (1 lb)
108000F00000G Can 2.27 kg (5 lb)
132000F00000G Can 9.07 kg (20 lb)
Color White
Thermal conductivity 0.73 W/(m-°C)
Operating -40°C to +200°C
temperature range
Volume resistivity 1.0 x 1015 Ohm-cm
Dielectric strength 250 volts/mil
Consistency Paste
Bleed 0.6 max
Specific gravity 2.8
Shelf life Indefinite (unopened)*
Aavid's UltrastickTM is a unique phase-change thermal inter-
face material that surpasses grease in thermal performance
and long-term stability.This solid, silicone-free, paraffin-
based thermal compound changes phase at 60°C, with a
concurrent volumetric expansion that fills gaps between the
mating surfaces. UltrastickTM comes in a convenient applica-
tor bar, allowing for neat, fast application to both heat sink
and component surfaces. One cost-effective application
leaves a thin, film-like deposit, providing excellent heat
transfer and low interface thermal resistance.
UltrastickTM
Temperature range -40°C to +200°C
Volume resistivity 1.0 X 1.015 Ohm-cm
Dielectric strength 250 volts/mil
Consistency Paste
Bleed 0.6 max
Specific gravity 0.28
Color Opaque White
Thermal resistance 0.03°C/W per square inch @ 20 psi
0.02°C/W per square inch @ 100 psi
Shelf life Indefinite*
Grease & Epoxy
ORDERING INFORMATION
Part number Package Size
100300F00000G Bar 47.5 grams (0.16 oz)
PRODUCT INFORMATION
PRODUCT INFORMATION
PRODUCT INFORMATION
* Recommended max. storage temperature: 40ºC (105ºF)
* It is recommended that the containers be turned over
every 6 months to minimize settling for ease of mixing
* It is recommended that the containers be turned over
every 6 months to minimize settling for ease of mixing sales.na@aavid.com www.shopaavid.com
113
ACCESSORIES
ThermalcoteTM
Thermalcote™ II was developed as the sensible alternative
to silicone-based thermal greases.ThermalcoteTM II employs
a highly conductive synthetic base fluid that enables the
finished product to exhibit the same thermal characteris-
tics as the silicone-based products.
Thermalcote™ II contains no silicone. The high lubricity of
the base oil permits efficient application to both semicon-
ductor case or heat sink, and it will effectively fill the micro-
scopic air gaps on the metal-to-metal mating surfaces. It is
non-toxic, extremely stable, and neither cakes or runs from
-40° to 200°C (-40°F to 392°F).
ORDERING INFORMATION
Grease & Epoxy
ThermalcoteTM is a superior thermal joint compound of ther-
mally loaded silicone based grease for use with all heat sinks.
It improves the transfer of thermal energy across the metal
to metal interfaces between the transistor or rectifier case
and the heat sink. ThermalcoteTM conducts heat approximately
15 times better than air and more than 4 times better than
unloaded silicone grease. It is non-toxic, extremely stable,
and neither cakes or runs from -40° to 204°C (-40°F to 399°F).
Color Opaque white
Operating -40°C to 204°C (-40°F to 399°F)
temperature range
Thermal conductivity 0.765W/(m °C )(.226 Btu/hr ft °F)
Dielectric strength 11.8 x 103 volts/mm (300 volts/mil)
1.27 mm gap (0.050" gap)
Cleaning solvent Mineral spirits or turpentine
Specific gravity 1.6
Evaporation
24 hours@200°C (392°F), wt% 1
Shelf life Indefinite (unopened)*
ThermalcoteTM ll
Part number Net weight
349G 28 grams (1 oz) tube
350G 57 grams (2 oz) jar
351G 0.45 kg (1 lb) can
ORDERING INFORMATION
Part number Net weight
249G 28 grams (1 oz) tube
250G 57 grams (2 oz) tube
251G 0.45 kg (1 lb) can
252G 2.27kg (5 lb) can
253G 4.54 kg(10 lb) can
Color Blue
Operating -40°C to 200°C (-40°F to 392°F)
temperature range
Thermal conductivity 0.699W/(M °C) (0.204 Btu/hr ft °F)
Dielectric strength 7.9 x 103volts/mm (200volts/mil)
1.27 mm gap (0.050" gap)
Cleaning solvent Mineral spirits or turpentine
Specific gravity 2.93@60°F (15.6°C)
Evaporation,
24 hours@200°C (392°F), wt% 0.6 max
Shelf life Indefinite (unopened)*
PRODUCT INFORMATION
PRODUCT INFORMATION
* It is recommended that the containers be turned over
every 6 months to minimize settling for ease of mixing
* It is recommended that the containers be turned over
every 6 months to minimize settling for ease of mixing sales.na@aavid.com www.shopaavid.com
114
ACCESSORIES
Grease & Epoxy
Ther-O-BondTM 1500 is a versatile epoxy casting system developed
for high performance, production potting and encapsulating appli-
cations where low shrinkage and rapid air evacuation are required.
This formulation has a very low surface tension and a flowable
viscosity, which affords excellent air release. Ther-O-BondTM 1500
adhers to rigid plastics and laminates, metals and ceramics, has
a low coefficient of thermal expansion and is readily machined
and shaped with ordinary shop tools. The fully cured epoxy system
is an excellent electrical insulator which provides good resistance
to electrolysis, leakage and corrosion room water, weather, gases
and chemical compounds.
Ther-O-BondTM Adhesive
Mix ratio by weight, 100 to 15
resin to hardener:
Mixed viscosity @ 25°C, cps: 1000 - 1500
Work-life @ 25°C 45 Minutes
Gel time @ 25°C 3-6 Hours
Cure schedule @ 25°C 8 Hours
Cure schedule @ 65°C 1 Hour
Cure schedule @ 100°C 0.5 Hour
For smaller applications, Ther-O-BondTM 1600 produces a stable,
durable, high-impact bond, with good heat transfer characteris-
tics. It is a thixotropic (smooth paste) thermally conductive epoxy
system used for staking thermistors, diodes, resistors, integrated
circuits and other heat sensitive components to printed circuit
boards.This two-part adhesive develops strong, durable, high
impact bonds at room temperature, which improve heat transfer
while maintaining electrical insulation. Ther-O-bondTM 1600 bonds
readily to itself, to metals, silica, steatie, alumina, sapphire and
other ceramics, glass, plastics and many other materials because
its coefficient of thermal expansion provides a good match for
those materials over a fairly wide temperature range.
Mix ratio by weight, 100 to 5
resin to hardener:
Mixed viscosity @ 25°C, cps: 33,000
Work-life @ 25°C 45 Minutes
Gel time @ 25°C 3-6 Hours
Cure schedule @ 25°C 8 Hours
Cure schedule @ 65°C 1 Hour
Cure schedule @ 100°C 0.5 Hour
HANDLING CHARACTERISTICS
Color Blue
Specific gravity: 2.30
Operating temp, °C -70 to 115
Hardness, shore D: 90
Izod impact, F1 Lbs/Inch of notch 0.49
Thermal 0.85
conductivity W/(m-°C)
C.T.E. (ppm/°C) 25
Tensile strength (@25°C) 9200 psi
Tensile lap shear, psi 2900
Dielectric strength (volts/mil) 410
Dielectric constant (1 KHz @ 25°C) 5.9
Dissipation factor, KH@ 25°C 5.9
Shelf life 18 months*
Ther-O-BondTM 2000 acrylic adhesive cures rapidly
at room temperature, while providing a repairable,
thermally conductive bond.
Color White
Thermal 0.48
conductivity W/(m-°C)
C.T.E. (ppm/°C) 25
Tensile strength (@25°C) 2360 psi
Dielectric strength (volts/mil) 220
Shelf life 18 months*
Part number Description Package/Kit Size
159900F00000G Ther-O-BondTM 1500 Resin and hardener 0.946 liter (1 qt)
161000F00000G Ther-O-BondTM 1600 2-Part plastic kit 10gm (0.35 oz)
164000F00000G Ther-O-BondTM 1600 2-Part plastic kit 40gm (1.40 oz)
200000F00000G Ther-O-BondTM 2000 Adhesive syringe 25ml
Activator bottle 13ml
ORDERING INFORMATION
PRODUCT INFORMATION
Ther-O-BondTM 1500 Ther-O-BondTM 1600
Ther-O-BondTM 2000
HANDLING CHARACTERISTICS
PHYSICAL PROPERTIES
Color Black
Specific gravity 1.5
Operating temp, °C -60 to 155
Heat distortion temp, °C 100
Hardness, shore D: 88
Thermal 1.26
conductivity W/(m°C)
Compressive strength, psi 14,000
Dissipation factor, 0.01
Self extinguishing: yes
C.T.E. (ppm/°C) 25
Tensile strength (@25°C) 9200 psi
Dielectric 800
Shelf life 18 months*
PHYSICAL PROPERTIES
* Stated shelf life is from date of manufacture.To allow for inventory cycle, product shipped from Aavid will
have less than 18 months remaining shelf life. Aavid guarantees a minimum of 3 months remaining shelf life.
Please adjust order quantity so all product will be consumed within 3 months of date of shipment.
* Stated shelf life is from date of manufacture.To allow for inventory cycle, product shipped from Aavid will
have less than 18 months remaining shelf life. Aavid guarantees a minimum of 3 months remaining shelf life.
Please adjust order quantity so all product will be consumed within 3 months of date of shipment.
sales.na@aavid.com www.shopaavid.com
115
ACCESSORIES
Grease & Epoxy
Thermalbond™ is a thermally conductive, high strength epoxy
adhesive. It provides exceptional adhesion to copper, aluminum,
steel, glass, ceramics, and most plastics.ThermalbondTM also has a
coefficient of thermal expansion compatible with aluminum, copper,
and brass, making it particularly well suited for thermally bonding
semiconductors and other components to chassis or heat sinks.
Thermalbond™
Color Green
Specific gravity 2.35
Working viscosity 25,000 cps
Thermal conductivity 1.34W/(m °C)(0.77 Btu/hr •ft• °F)
Thermal resistivity 29.4°C in/watt
Tensile strength 6.34 x 107 Pa (9,2000 psi)
Compressive strength 1.44 x 108 Pa (20,9000 psi)
Bond shear strength 3.17 x 107 Pa (4,6000 psi)
aluminum to aluminum, 25.4mm (1") overlap @ 25°C, (77°F)
Thermal coefficient of expansion 24 x 10-6/°C (1.32 x 10-6/°F)
Water absorption, % after 10 days@ 25°C (77°F) 0.20
Hardness, Shore D 86
Volume resistivity 1.0 x 1016
Dielectric strength 59.1 x 103 volts/mm (1500 volts/mil)
Dielectric constant@25°C (77°F) 100KHz 6.1
Dielectric factor@25°C (77°F) 100KHz 0.020
Operating temperatures -65°C to 155°C (-85°F to 311°F)
Linear shrinkage 0.002 in/in
Shelf life 12 months*
Pot life@25°C (77°F) 2-3 hours
Suggested stripping agent Miller-Stephenson MS 111
Cleaning solvent Acetone
HANDLING CHARACTERISTICS
Mix resin thoroughly before removing material.
Add 7.1 parts of RT-7 hardener to 100 parts of resin
by weight, or 17 parts of RT-7 hardener to 100 parts
of resin by volume. Adhesive will set up in:
24 hrs at 25°C (77°F) 1 hr. at 100°C (212°F)
2 hrs. at 65°C (149°F) 30min. at 130°C (266°F)
Note: For maximum electrical and physical properties, a post cure is neccessary.
Post cure at room temperature for 4 days or for 4 hours at 93°C (200°F).
Typical electrical and physical properties at room temperature with RT-7 hardener
MIXING INSTRUCTIONS
ORDERING INFORMATION
Part number Net weight
4949G 0.8 oz (25 gram kit)
4950G 1.7 oz (50 gram kit)
4951G 3.5 oz (100 gram kit)
4952G 7.0 oz (200 gram kit)
4953G 4 lbs (1814 grams)
* Stated shelf life is from date of manufacture.To allow for inventory cycle, product shipped from Aavid will
have less than 12 months remaining shelf life. Aavid guarantees a minimum of 3 months remaining shelf life.
Please adjust order quantity so all product will be consumed within 3 months of date of shipment. sales.na@aavid.com www.shopaavid.com
116
THE TOTAL INTEGRATED SOLUTION FOR COOLING ELECTRONICS
Aavid has the expertise to design and manufacture
cooling solutions spanning the entire range of thermal
efficiency and mechanical complexity. The board level
products displayed in this catalog represent only a
fraction of our capabilities. Most applications require
custom solutions, which is why so many leading
electronics companies partner with Aavid.
For demanding applications Aavid can design and
validate custom innovative solutions utilizing the most
advanced engineering resources saving you precious
development time. Our manufacturing facilities, located in strategic markets around the globe, deliver
cost effective products providing you a competitive advantage. From concept to production, Aavid can enable your design anywhere in the world.The Total Integrated Solution for Cooling Electronics®
Aavid's expertise covers 4 major cooling mechanisms: natural convection, forced convection, fluid phase
change, and liquid cooling. The above graph is a starting point to determine which technology can be
used for your system configuration.
For more information regarding any of these cooling mechanisms, please contact Aavid at:
www.shopaavid.comExperts at solving cooling challenges ranging from
networking, telecom and consumer electronics, to
power and biomedical devices. Utilizing the latest CFD/
FEA and experimental techniques we can:
• Perform conjugate analyses with conduction,
convection and radiation
• Optimize venting and fan placement
• Increase power density
• Reduce noise, cost and size.
• Increase MTBF
Dedicated thermal engineers characterize your system
and provide the most advanced and effective cooling
solutions, saving thousands in engineering resources,
thermal modeling software, and test hardware.
sales.na@aavid.com www.shopaavid.com
