030 Data Sheet
Modules
0
ARTIK 030 Mesh Networking Module
Data Sheet
The ARTIK 030 is a fully-integrated, pre-certified module, enabling rapid development of
wireless mesh networking solutions. The ARTIK 030 combines an energy-efficient, multi-
protocol wireless SoC with a proven RF/antenna design and industry-leading wireless
software stacks. This integration accelerates time-to-market and saves months of
engineering effort and development costs.
ARTIK 030 can be used in a wide variety of applications:
KEY FEATURES
Industry-leading mesh networking (ZigBee/
Thread) software and development tools
Antenna: internal chip and U.FL variants
TX power: up to +10 dBm
RX sensitivity: down to -99 dBm
32-bit ARM® Cortex®-M4 at 40 MHz
Flash memory: 256 kB
RAM: 32 kB
Autonomous Hardware Crypto Accelerator
and Random Number Generator
Integrated DC-DC Converter
Connected Home
Building Automation
Lighting
Security and Monitoring
Smart Grid / Metering
Industrial Automation
Others
Timers and Triggers
RTCC
Cryotimer
Timer/Counter
Low energy timer
Pulse Counter
Watchdog Timer
Protocol Timer
32-bit bus
Peripheral Reflex System
Serial Interfaces
I/O Ports
Analog I/F
Lowest power mode with peripheral operational:
USART
Low Energy
UART
I2 C
External
Interrupts
General Purpose
I/O
Pin Reset
Pin Wakeup
ADC
IDAC
Analog
Comparator
Radio Transceiver
DEMOD
AGC
IFADC
CRC
BUFC
FRC
RAC
EM3— Stop EM2— Deep Sleep EM1— Sleep EM4— Hibernate EM4— Shutoff EM0— Active
I
Q
RF Frontend
LNA
MOD
Frequency
Synthesizer
PGA
BALUN
Core / Memory
ARM Cortex M4 Processor
with DSP Extensions and FPU
Energy Management
Brown-Out
Detector
DC-DC
Converter
Voltage
Regulator Voltage Monitor
Power-On Reset
Other
CRYPTO
CRC
Clock Management
High Frequency
Crystal Oscillator
Low Frequency
Crystal Oscillator
Low Frequency
RC Oscillator
High Frequency
RC Oscillator
Ultra Low
Frequency
RC Oscillator
Auxiliary
High Frequency
RC Oscillator
Flash Program
Memory
RAM Memory
Debug Interface
DMA Controller
Memory
Protection Unit
Antenna
Crystals
32.768 kHz
38.4 MHz
Chip Antenna
Matching
Ext. Antenna
(ARTIK-030A)
(ARTIK-030E)
PA
u.FL Connector
Preliminary Rev. 0.5 Samsung ARTIK™ Modules | artik.io
This information applies to a product under development. Its characteristics and specifications are subject to change without notice.
Table of Contents
1. Feature List ................................
1
2. Ordering Information ............................2
3. System Overview ..............................3
3.1 Introduction...............................3
3.2 Radio.................................3
3.2.1 Antenna Interface ............................3
3.2.2 Packet and State Trace ..........................4
3.2.3 Random Number Generator ........................4
3.3 Power ................................5
3.3.1 Energy Management Unit (EMU) .......................5
3.3.2 DC-DC Converter ............................5
3.4 General Purpose Input/Output (GPIO)......................6
3.5 Clocking ................................6
3.5.1 Clock Management Unit (CMU) .......................6
3.5.2 Internal Oscillators............................6
3.6 Counters/Timers and PWM .........................6
3.6.1 Timer/Counter (TIMER) ..........................6
3.6.2 Real Time Counter and Calendar (RTCC) ....................6
3.6.3 Low Energy Timer (LETIMER)........................6
3.6.4 Ultra Low Power Wake-up Timer (CRYOTIMER) .................7
3.6.5 Pulse Counter (PCNT) ..........................7
3.6.6 Watchdog Timer (WDOG) .........................7
3.7 Communications and Other Digital Peripherals ...................7
3.7.1 Universal Synchronous/Asynchronous Receiver/Transmitter (USART) ..........7
3.7.2 Low Energy Universal Asynchronous Receiver/Transmitter (LEUART) ..........7
3.7.3 Inter-Integrated Circuit Interface (I2C) .....................7
3.7.4 Peripheral Reflex System (PRS) .......................7
3.8 Security Features.............................7
3.8.1 GPCRC (General Purpose Cyclic Redundancy Check) ...............7
3.8.2 Crypto Accelerator (CRYPTO)........................8
3.9 Analog ................................8
3.9.1 Analog Port (APORT) ..........................8
3.9.2 Analog Comparator (ACMP) ........................8
3.9.3 Analog to Digital Converter (ADC) ......................8
3.9.4 Digital to Analog Current Converter (IDAC) ...................8
3.10 Reset Management Unit (RMU) .......................8
3.11 Core and Memory ............................8
3.11.1 Processor Core ............................8
3.11.2 Memory System Controller (MSC) ......................9
3.11.3 Linked Direct Memory Access Controller (LDMA) .................9
3.12 Memory Map ..............................10
3.13 Configuration Summary ..........................11
ARTIK 030 Mesh Networking Module Data Sheet
Table of Contents ii
4. Electrical Specifications ..........................12
4.1 Electrical Characteristics ..........................12
4.1.1 Absolute Maximum Ratings ........................12
4.1.2 General Operating Conditions ........................13
4.1.3 DC-DC Converter ............................14
4.1.4 Current Consumption...........................15
4.1.4.1 Current Consumption 3.3 V using DC-DC Converter ...............15
4.1.4.2 Current Consumption Using Radio .....................16
4.1.5 Wake up times .............................16
4.1.6 Brown Out Detector ...........................17
4.1.7 Frequency Synthesizer Characteristics .....................17
4.1.8 2.4 GHz RF Transceiver Characteristics ....................18
4.1.8.1 RF Transmitter General Characteristics for the 2.4 GHz Band ............18
4.1.8.2 RF Receiver General Characteristics for the 2.4 GHz Band .............18
4.1.8.3 RF Receiver Characteristics for 802.15.4 O-QPSK DSSS in the 2.4 GHz Band.......19
4.1.9 Oscillators ..............................21
4.1.9.1 LFXO ...............................21
4.1.9.2 HFXO ...............................21
4.1.9.3 LFRCO ...............................21
4.1.9.4 HFRCO and AUXHFRCO ........................22
4.1.9.5 ULFRCO ..............................22
4.1.10 Flash Memory Characteristics .......................23
4.1.11 GPIO................................24
4.1.12 VMON ...............................25
4.1.13 ADC ................................26
4.1.14 IDAC ................................29
4.1.15 Analog Comparator (ACMP) ........................31
4.1.16 I2C ................................33
4.1.17 USART SPI .............................35
5. Typical Connection Diagrams ........................37
5.1 Network Co-Processor (NCP) Application with UART Host ...............37
5.2 Network Co-Processor (NCP) Application with SPI Host................37
5.3 SoC Application .............................38
6. Layout Guidelines ............................39
6.1 Module Placement and Application PCB Layout Guidelines ..............39
6.2 Effect of Plastic and Metal Materials ......................40
6.3 Locating the Module Close to Human Body ....................40
6.4 2D Radiation Pattern Plots .........................41
7. Hardware Design Guidelines ........................43
7.1 Power Supply Requirements .........................43
7.2 Reset Functions .............................43
7.3 Debug and Firmware Updates ........................43
7.3.1 JTAG ................................43
7.3.2 Packet Trace Interface (PTI) ........................43
ARTIK 030 Mesh Networking Module Data Sheet
Table of Contents iii
8. Pin Definitions ..............................44
8.1 Pin Definitions ..............................44
8.1.1 GPIO Overview.............................53
8.2 Alternate Functionality Pinout ........................54
8.3 Analog Port (APORT) ...........................60
9. Package Specifications ..........................68
9.1 ARTIK 030 Dimensions...........................68
9.2 ARTIK 030 Module Footprint .........................68
9.3 ARTIK 030 Recommended PCB Land Pattern ...................69
9.4 ARTIK 030 Package Marking.........................70
10. Tape and Reel Specifications ........................72
10.1 Tape and Reel Packaging .........................72
10.2 Reel Material and Dimensions ........................72
10.3 Module Orientation and Tape Feed ......................73
10.4 Tape and Reel Box Dimensions .......................74
10.5 Moisture Sensitivity Level .........................74
11. Certifications ..............................75
12. Revision History............................. 76
12.1 Revision 0.5 ..............................76
ARTIK 030 Mesh Networking Module Data Sheet
Table of Contents iv
1. Feature List
MCU Features
ARM Cortex®-M4 + Floating Point Unit
Up to 40 MHz Clock Speed
Low Active Mode Current: 63 μA/MHz
256 kB flash, 32 kB SRAM
Advanced hardware cryptographic engine with support for
AES-128/-256, ECC, SHA-1, SHA-256, and a Random Num-
ber Generator
8 Channel DMA Controller
Digital Peripherals
2 x USART (UART, SPI, IrDA, I2S)
Low Energy UART (LEUART)
I2C peripheral interface (address recognition down to EM3)
Timers: RTCC, Low Energy Timer, Pulse Counter
12-channel Peripheral Reflex System (PRS)
Up to 25 GPIO with interrupts
Analog Peripherals
ADC (12-bit, 1 Msps, 326 µA)
Current-mode Digital to Analog Converter (IDAC)
2 x Analog Comparator (ACMP)
Energy Efficient Low Power Modes
Energy Mode 2 (Deep Sleep) Current: 2.5 µA
(Full RAM retention and RTCC running from LXFO)
Ultra-fast wake up: 3 µS down to EM3
Wide Supply Voltage range of 1.85 to 3.8 V
Environmental & Regulatory
Operating Temperature: -40 to +85°C
FCC, IC, CE, Aus/NZ, Korea certifications (pending)
Dimensions
W x L x H: 12.9 x 15.0 x 2.2 mm
Radio Features
2.4 GHz with integrated balun
Support for wireless mesh networking (ZigBee/Thread)
Integrated PA (up to +10 dBm TX power)
Packet Trace Interface (PTI) for non-intrusive packet trace with
Simplicity Studio development tools
Antenna interface: integrated high-performance chip antenna
or u.FL variant for external antenna
ZigBee and Thread Features
IEEE 802.15.4
Data Rate / Modulation: 250 kbps DSSS-OQPSK
+10 dBm Programmable TX Power
-99 dBm RX Sensitivity
9.8 mA RX current
8.2 mA TX current (at +0 dBm)
Support for SoC and Network Co-Processor (NCP) architec-
tures with SPI/UART host support
Serial and Over-The-Air (OTA) bootloaders
ARTIK 030 Mesh Networking Module Data Sheet
Feature List
Samsung ARTIK™ Modules | artik.io Preliminary Rev. 0.5 | 1
2. Ordering Information
Ordering Code Description Max TX
Power
Antenna Packaging Production Status
ARTIK-030-AV1 ARTIK 030 Mesh Networking
Module
+10 dBm Integrated
chip antenna
Cut Reel
(100 pcs)
Initial Production / Engineering
Samples (non-certified)
ARTIK-030-AV1R ARTIK 030 Mesh Networking
Module
+10 dBm Integrated
chip antenna
Reel
(1000 pcs)
Initial Production / Engineering
Samples (non-certified)
ARTIK-030-EV1 ARTIK 030 Mesh Networking
Module
+10 dBm External (U.FL) Cut Reel
(100 pcs)
Initial Production / Engineering
Samples (non-certified) 1
ARTIK-030-EV1R ARTIK 030 Mesh Networking
Module
+10 dBm External (U.FL) Reel
(1000 pcs)
Initial Production / Engineering
Samples (non-certified) 1
ARTIK-030-AV2 ARTIK 030 Mesh Networking
Module
+10 dBm Integrated
chip antenna
Cut Reel
(100 pcs)
Full Production (certified) 1
ARTIK-030-AV2R ARTIK 030 Mesh Networking
Module
+10 dBm Integrated
chip antenna
Reel
(1000 pcs)
Full Production (certified) 1
ARTIK-030-EV2 ARTIK 030 Mesh Networking
Module
+10 dBm External (U.FL) Cut Reel
(100 pcs)
Full Production (certified) 1
ARTIK-030-EV2R ARTIK 030 Mesh Networking
Module
+10 dBm External (U.FL) Reel
(1000 pcs)
Full Production (certified) 1
SIP-KITSZG001 ARTIK 030 Mesh Networking
Kit (includes 3 x ARTIK-030-A
development boards)
Development Kit
Note:
1. Contact sales@artik.io for availability and certification timelines.
2. ARTIK 030 development kit and IAR license required for ZigBee® and Thread software development.
ARTIK 030 Mesh Networking Module Data Sheet
Ordering Information
Samsung ARTIK™ Modules | artik.io Preliminary Rev. 0.5 | 2
3. System Overview
3.1 Introduction
This section provides a brief overview of the ARTIK 030 module architecture including both MCU and RF sub-systems. A detailed func-
tional description of the Silicon Lab's EFR32MG1 SoC used inside the module is available in the EFR32MG1 Mighty Gecko Datasheet
and EFR32xG1 Wireless Gecko Reference Manual and a block diagram of the EFR32MG1 SoC is shown in the figure below.
Analog Peripherals
Clock Management
LFXTAL_P / N LFXO
IDAC
ARM Cortex-M4 Core
Up to 256 KB ISP Flash
Program Memory
Up to 32 KB RAM
A
H
B
Watchdog
Timer
Reset
Management
Unit
Brown Out /
Power-On
Reset
RESETn
Digital Peripherals
Input MUX
Port
Mapper
Port I/O Configuration
I2C
Analog Comparator
12-bit ADC
Temp
Sensor
VREFVDD
VDD
Internal
Reference
TIMER
CRYOTIMER
PCNT
USART
Port A
Drivers
Port B
Drivers
PAn
Port C
Drivers PCn
PBn
Port D
Drivers PDn
LETIMER
RTC / RTCC
IOVDD
AUXHFRCO
HFRCO
ULFRCO
HFXO
Port F
Drivers PFn
Memory Protection Unit
LFRCO
A
P
B
LEUART
CRYPTO
CRC
DMA Controller
+
-
APORT
Floating Point Unit
Energy Management
DC-DC
Converter
DVDD
VREGVDD
VSS
VREGSW
bypass
AVDD
PAVDD
RFVDD
Voltage
Regulator
DECOUPLE
IOVDD
Voltage
Monitor
VREGVSS
RFVSS
PAVSS
Serial Wire Debug /
Programming
Radio Transciever
2G4RF_IOP
2G4RF_ION
RF Frontend
PA
I
Q
LNA
BALUN
RFSENSE
Frequency
Synthesizer
DEMOD
AGC
IFADC
CRC
BUFC
MOD
FRC
RAC
PGA
HFXTAL_P
HFXTAL_N
Figure 3.1. Detailed EFR32MG1 Block Diagram
3.2 Radio
The ARTIK 030 features a flexible, multi-protocol radio that supports wireless mesh networking (ZigBee® / Thread) protocols.
3.2.1 Antenna Interface
The ARTIK 030 module family includes options for either a high-performance, integrated chip-antenna (ARTIK-030-A) or external an-
tenna (ARTIK-030-E) via a U.FL connector. The table below includes performance specifications for the integrated chip antenna.
Table 3.1. Antenna Efficiency and Peak Gain (ARTIK-030-A)
Parameter With optimal layout Note
Efficiency -2 dB to -3 dB Antenna efficiency, gain and radiation pattern are highly depend-
ent on the application PCB layout and mechanical design. Refer
to Chapter 6. Layout Guidelines for PCB layout and antenna inte-
gration guidelines for optimal performance.
Peak gain 1.0 dBi
ARTIK 030 Mesh Networking Module Data Sheet
System Overview
Samsung ARTIK™ Modules | artik.io Preliminary Rev. 0.5 | 3
3.2.2 Packet and State Trace
The ARTIK 030 Frame Controller has a packet and state trace unit that provides valuable information during the development phase. It
features:
Non-intrusive trace of transmit data, receive data and state information
Data observability on a single-pin UART data output, or on a two-pin SPI data output
Configurable data output bitrate / baudrate
Multiplexed transmitted data, received data and state / meta information in a single serial data stream
3.2.3 Random Number Generator
The Frame Controller (FRC) implements a random number generator that uses entropy gathered from noise in the RF receive chain.
The data is suitable for use in cryptographic applications.
Output from the random number generator can be used either directly or as a seed or entropy source for software-based random num-
ber generator algorithms such as Fortuna.
ARTIK 030 Mesh Networking Module Data Sheet
System Overview
Samsung ARTIK™ Modules | artik.io Preliminary Rev. 0.5 | 4
3.3 Power
The ARTIK 030 has an Energy Management Unit (EMU) and efficient integrated regulators to generate internal supply voltages. Only a
single external supply voltage is required, from which all internal voltages are created. An integrated DC-DC buck regulator is utilized to
further reduce the current consumption.
Figure 3.2. ARTIK 030 Power Block
3.3.1 Energy Management Unit (EMU)
The Energy Management Unit manages transitions of energy modes in the device. Each energy mode defines which peripherals and
features are available and the amount of current the device consumes. The EMU can also be used to turn off the power to unused RAM
blocks, and it contains control registers for the dc-dc regulator and the Voltage Monitor (VMON). The VMON is used to monitor multiple
supply voltages. It has multiple channels which can be programmed individually by the user to determine if a sensed supply has fallen
below a chosen threshold.
3.3.2 DC-DC Converter
The DC-DC buck converter covers a wide range of load currents and provides up to 90% efficiency in energy modes EM0, EM1, EM2
and EM3. Patented RF noise mitigation allows operation of the DC-DC converter without degrading sensitivity of radio components.
Protection features include programmable current limiting, short-circuit protection, and dead-time protection. The DC-DC converter may
also enter bypass mode when the input voltage is too low for efficient operation. In bypass mode, the DC-DC input supply is internally
connected directly to its output through a low resistance switch. Bypass mode also supports in-rush current limiting to prevent input
supply voltage droops due to excessive output current transients.
ARTIK 030 Mesh Networking Module Data Sheet
System Overview
Samsung ARTIK™ Modules | artik.io Preliminary Rev. 0.5 | 5
3.4 General Purpose Input/Output (GPIO)
ARTIK 030 has up to 25 General Purpose Input/Output pins. Each GPIO pin can be individually configured as either an output or input.
More advanced configurations including open-drain, open-source, and glitch-filtering can be configured for each individual GPIO pin.
The GPIO pins can be overridden by peripheral connections, like SPI communication. Each peripheral connection can be routed to sev-
eral GPIO pins on the device. The input value of a GPIO pin can be routed through the Peripheral Reflex System to other peripherals.
The GPIO subsystem supports asynchronous external pin interrupts.
3.5 Clocking
3.5.1 Clock Management Unit (CMU)
The Clock Management Unit controls oscillators and clocks in the ARTIK 030. Individual enabling and disabling of clocks to all peripher-
al modules is perfomed by the CMU. The CMU also controls enabling and configuration of the oscillators. A high degree of flexibility
allows software to optimize energy consumption in any specific application by minimizing power dissipation in unused peripherals and
oscillators.
3.5.2 Internal Oscillators
The ARTIK 030 fully integrates two crystal oscillators and four RC oscillators, listed below.
A 38.4MHz high frequency crystal oscillator (HFXO) provides a precise timing reference for the MCU and radio.
A 32.768 kHz crystal oscillator (LFXO) provides an accurate timing reference for low energy modes.
An integrated high frequency RC oscillator (HFRCO) is available for the MCU system, when crystal accuracy is not required. The
HFRCO employs fast startup at minimal energy consumption combined with a wide frequency range.
An integrated auxilliary high frequency RC oscillator (AUXHFRCO) is available for timing the general-purpose ADC and the Serial
Wire debug port with a wide frequency range.
An integrated low frequency 32.768 kHz RC oscillator (LFRCO) can be used as a timing reference in low energy modes, when crys-
tal accuracy is not required.
An integrated ultra-low frequency 1 kHz RC oscillator (ULFRCO) is available to provide a timing reference at the lowest energy con-
sumption in low energy modes.
3.6 Counters/Timers and PWM
3.6.1 Timer/Counter (TIMER)
TIMER peripherals keep track of timing, count events, generate PWM outputs and trigger timed actions in other peripherals through the
PRS system. The core of each TIMER is a 16-bit counter with up to 4 compare/capture channels. Each channel is configurable in one
of three modes. In capture mode, the counter state is stored in a buffer at a selected input event. In compare mode, the channel output
reflects the comparison of the counter to a programmed threshold value. In PWM mode, the TIMER supports generation of pulse-width
modulation (PWM) outputs of arbitrary waveforms defined by the sequence of values written to the compare registers, with optional
dead-time insertion available in timer unit TIMER_0 only.
3.6.2 Real Time Counter and Calendar (RTCC)
The Real Time Counter and Calendar (RTCC) is a 32-bit counter providing timekeeping in all energy modes. The RTCC includes a
Binary Coded Decimal (BCD) calendar mode for easy time and date keeping. The RTCC can be clocked by any of the on-board oscilla-
tors with the exception of the AUXHFRCO, and it is capable of providing system wake-up at user defined instances. When receiving
frames, the RTCC value can be used for timestamping. The RTCC includes 128 bytes of general purpose data retention, allowing easy
and convenient data storage in all energy modes.
3.6.3 Low Energy Timer (LETIMER)
The unique LETIMER is a 16-bit timer that is available in energy mode EM2 Deep Sleep in addition to EM1 Sleep and EM0 Active. This
allows it to be used for timing and output generation when most of the device is powered down, allowing simple tasks to be performed
while the power consumption of the system is kept at an absolute minimum. The LETIMER can be used to output a variety of wave-
forms with minimal software intervention. The LETIMER is connected to the Real Time Counter and Calendar (RTCC), and can be con-
figured to start counting on compare matches from the RTCC.
ARTIK 030 Mesh Networking Module Data Sheet
System Overview
Samsung ARTIK™ Modules | artik.io Preliminary Rev. 0.5 | 6
3.6.4 Ultra Low Power Wake-up Timer (CRYOTIMER)
The CRYOTIMER is a 32-bit counter that is capable of running in all energy modes. It can be clocked by either the 32.768 kHz crystal
oscillator (LFXO), the 32.768 kHz RC oscillator (LFRCO), or the 1 kHz RC oscillator (ULFRCO). It can provide periodic Wakeup events
and PRS signals which can be used to wake up peripherals from any energy mode. The CRYOTIMER provides a wide range of inter-
rupt periods, facilitating flexible ultra-low energy operation.
3.6.5 Pulse Counter (PCNT)
The Pulse Counter (PCNT) peripheral can be used for counting pulses on a single input or to decode quadrature encoded inputs. The
clock for PCNT is selectable from either an external source on pin PCTNn_S0IN or from an internal timing reference, selectable from
among any of the internal oscillators, except the AUXHFRCO. The module may operate in energy mode EM0 Active, EM1 Sleep, EM2
Deep Sleep, and EM3 Stop.
3.6.6 Watchdog Timer (WDOG)
The watchdog timer can act both as an independent watchdog or as a watchdog synchronous with the CPU clock. It has windowed
monitoring capabilities, and can generate a reset or different interrupts depending on the failure mode of the system. The watchdog can
also monitor autonomous systems driven by PRS.
3.7 Communications and Other Digital Peripherals
3.7.1 Universal Synchronous/Asynchronous Receiver/Transmitter (USART)
The Universal Synchronous/Asynchronous Receiver/Transmitter is a flexible serial I/O module. It supports full duplex asynchronous
UART communication with hardware flow control as well as RS-485, SPI, MicroWire and 3-wire. It can also interface with devices sup-
porting:
ISO7816 SmartCards
IrDA
I2S
3.7.2 Low Energy Universal Asynchronous Receiver/Transmitter (LEUART)
The unique LEUARTTM provides two-way UART communication on a strict power budget. Only a 32.768 kHz clock is needed to allow
UART communication up to 9600 baud. The LEUART includes all necessary hardware to make asynchronous serial communication
possible with a minimum of software intervention and energy consumption.
3.7.3 Inter-Integrated Circuit Interface (I2C)
The I2C module provides an interface between the MCU and a serial I2C bus. It is capable of acting as both a master and a slave and
supports multi-master buses. Standard-mode, fast-mode and fast-mode plus speeds are supported, allowing transmission rates from 10
kbit/s up to 1 Mbit/s. Slave arbitration and timeouts are also available, allowing implementation of an SMBus-compliant system. The
interface provided to software by the I2C module allows precise timing control of the transmission process and highly automated trans-
fers. Automatic recognition of slave addresses is provided in active and low energy modes.
3.7.4 Peripheral Reflex System (PRS)
The Peripheral Reflex System provides a communication network between different peripheral modules without software involvement.
Peripheral modules producing Reflex signals are called producers. The PRS routes Reflex signals from producers to consumer periph-
erals which in turn perform actions in response. Edge triggers and other functionality can be applied by the PRS. The PRS allows pe-
ripherals to act autonomously without waking the MCU core, saving power.
3.8 Security Features
3.8.1 GPCRC (General Purpose Cyclic Redundancy Check)
The GPCRC module implements a Cyclic Redundancy Check (CRC) function. It supports both 32-bit and 16-bit polynomials. The sup-
ported 32-bit polynomial is 0x04C11DB7 (IEEE 802.3), while the 16-bit polynomial can be programmed to any value, depending on the
needs of the application.
ARTIK 030 Mesh Networking Module Data Sheet
System Overview
Samsung ARTIK™ Modules | artik.io Preliminary Rev. 0.5 | 7
3.8.2 Crypto Accelerator (CRYPTO)
The Crypto Accelerator is a fast and energy-efficient autonomous hardware encryption and decryption accelerator. It supports AES en-
cryption and decryption with 128- or 256-bit keys and ECC over both GF(P) and GF(2m), SHA-1 and SHA-2 (SHA-224 and SHA-256).
Supported modes of operation for AES include: ECB, CTR, CBC, PCBC, CFB, OFB, CBC-MAC, GMAC and CCM.
Supported ECC NIST recommended curves include P-192, P-224, P-256, K-163, K-233, B-163 and B-233.
The CRYPTO is tightly linked to the Radio Buffer Controller (BUFC) enabling fast and efficient autonomous cipher operations on data
buffer content. It allows fast processing of GCM (AES), ECC and SHA with little CPU intervention. CRYPTO also provides trigger sig-
nals for DMA read and write operations.
3.9 Analog
3.9.1 Analog Port (APORT)
The Analog Port (APORT) is an analog interconnect matrix allowing access to analog modules ADC, ACMP, and IDAC on a flexible
selection of pins. Each APORT bus consists of analog switches connected to a common wire. Since many clients can operate differen-
tially, buses are grouped by X/Y pairs.
3.9.2 Analog Comparator (ACMP)
The Analog Comparator is used to compare the voltage of two analog inputs, with a digital output indicating which input voltage is high-
er. Inputs are selected from among internal references and external pins. The tradeoff between response time and current consumption
is configurable by software. Two 6-bit reference dividers allow for a wide range of internally-programmable reference sources. The
ACMP can also be used to monitor the supply voltage. An interrupt can be generated when the supply falls below or rises above the
programmable threshold.
3.9.3 Analog to Digital Converter (ADC)
The ADC is a Successive Approximation Register (SAR) architecture, with a resolution of up to 12 bits at up to 1 MSamples/s. The
output sample resolution is configurable and additional resolution is possible using integrated hardware for averaging over multiple
samples. The ADC includes integrated voltage references and an integrated temperature sensor. Inputs are selectable from a wide
range of sources, including pins configurable as either single-ended or differential.
3.9.4 Digital to Analog Current Converter (IDAC)
The Digital to Analog Current Converter can source or sink a configurable constant current. This current can be driven on an output pin
or routed to the selected ADC input pin for capacitive sensing. The current is programmable between 0.05 µA and 64 µA with several
ranges with various step sizes.
3.10 Reset Management Unit (RMU)
The RMU is responsible for handling reset of the ARTIK 030. A wide range of reset sources are available, including several power sup-
ply monitors, pin reset, software controlled reset, core lockup reset and watchdog reset.
3.11 Core and Memory
3.11.1 Processor Core
The ARM Cortex-M4F processor includes a 32-bit RISC processor integrating the following features and tasks in the system:
ARM Cortex-M4F RISC processor achieving 1.25 Dhrystone MIPS/MHz
Memory Protection Unit (MPU) supporting up to 8 memory segments
256 KB flash program memory
32 KB RAM data memory
Configuration and event handling of all modules
2-pin Serial-Wire debug interface
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3.11.2 Memory System Controller (MSC)
The Memory System Controller (MSC) is the program memory unit of the microcontroller. The flash memory is readable and writable
from both the Cortex-M and DMA. The flash memory is divided into two blocks; the main block and the information block. Program code
is normally written to the main block, whereas the information block is available for special user data and flash lock bits. There is also a
read-only page in the information block containing system and device calibration data. Read and write operations are supported in en-
ergy modes EM0 Active and EM1 Sleep.
3.11.3 Linked Direct Memory Access Controller (LDMA)
The Linked Direct Memory Access (LDMA) controller features 8 channels capable of performing memory operations independently of
software. This reduces both energy consumption and software workload. The LDMA allows operations to be linked together and stag-
ed, enabling sophisticated operations to be implemented.
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3.12 Memory Map
The ARTIK 030 memory map is shown in the figures below.
Figure 3.3. ARTIK 030 Memory Map — Core Peripherals and Code Space
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Figure 3.4. ARTIK 030 Memory Map — Peripherals
3.13 Configuration Summary
The features of the ARTIK 030 are a subset of the feature set described in the EFR32xG1 Wireless Gecko Reference Manual. The Pin
Definitions section describes device specific implementation of the features.
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4. Electrical Specifications
4.1 Electrical Characteristics
All electrical parameters in all tables are specified under the following conditions, unless stated otherwise:
Typical values are based on TAMB=25 °C and VDD= 3.3 V, by production test and/or technology characterization.
Radio performance numbers are measured in conducted mode, based on Silicon Laboratories reference designs using output pow-
er-specific external RF impedance-matching networks for interfacing to a 50 Ω antenna.
Minimum and maximum values represent the worst conditions across supply voltage, process variation and operating temperature.
Refer to Table 4.2 General Operating Conditions on page 13 for more details about operational supply and temperature limits.
4.1.1 Absolute Maximum Ratings
Stresses above those listed below may cause permanent damage to the device. This is a stress rating only and functional operation of
the devices at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure
to maximum rating conditions for extended periods may affect device reliability.
Table 4.1. Absolute Maximum Ratings
Parameter Symbol Test Condition Min Typ Max Unit
Storage temperature range TSTG -40 +85 °C
External main supply voltage VDDMAX 0 3.8 V
External main supply voltage
ramp rate
VDDRAMPMAX 1 V / μs
Voltage on any 5V tolerant
GPIO pin1
VDIGPIN -0.3 Min of 5.25
and VDD+2
V
Voltage on non-5V tolerant
GPIO pins
-0.3 VDD+0.3 V
Input RF level PRFMAX2G4 10 dBm
Current per I/O pin (sink) IIOMAX 50 mA
Current per I/O pin (source) 50 mA
Current for all I/O pins (sink) IIOALLMAX 200 mA
Current for all I/O pins
(source)
200 mA
Note:
1. When a GPIO pin is routed to the analog module through the APORT, the maximum voltage = VDD.
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4.1.2 General Operating Conditions
Table 4.2. General Operating Conditions
Parameter Symbol Test Condition Min Typ Max Unit
Operating temperature range TOP Ambient Temperature -40 25 85 °C
VDD supply voltage1VVDD DCDC in regulation 2.4 3.3 3.8 V
DCDC in bypass, 50mA load 1.85 3.3 3.8 V
VDD Current IVDD DCDC in bypass 200 mA
HFCLK frequency fCORE 0 wait-states (MODE = WS0) 2 26 MHz
1 wait-states (MODE = WS1) 2 38.4 40 MHz
Note:
1. The minimum voltage required in bypass mode is calculated using RBYP from the DCDC specification table. Requirements for
other loads can be calculated as VVDD_min+ILOAD * RBYP_max
2. in MSC_READCTRL register
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4.1.3 DC-DC Converter
Test conditions: VDCDC_I=3.3 V, VDCDC_O=1.8 V, IDCDC_LOAD=50 mA, Heavy Drive configuration, FDCDC_LN=7 MHz, unless otherwise
indicated.
Table 4.3. DC-DC Converter
Parameter Symbol Test Condition Min Typ Max Unit
Input voltage range VDCDC_I Bypass mode, IDCDC_LOAD = 50
mA
1.85 VVDD_MAX V
Low noise (LN) mode, 1.8 V out-
put, IDCDC_LOAD = 100 mA, or
Low power (LP) mode, 1.8 V out-
put, IDCDC_LOAD = 10 mA
2.4 VVDD_MAX V
Low noise (LN) mode, 1.8 V out-
put, IDCDC_LOAD = 200 mA
2.6 VVDD_MAX V
Output voltage programma-
ble range 1
VDCDC_O 1.8 VVREGVDD V
Max load current ILOAD_MAX Low noise (LN) mode, Heavy
Drive 3
200 mA
Low noise (LN) mode, Medium
Drive 3
100 mA
Low noise (LN) mode, Light Drive
3
50 mA
Low power (LP) mode,
LPCMPBIAS 2 = 0
75 μA
Low power (LP) mode,
LPCMPBIAS 2 = 3
10 mA
Note:
1. Due to internal dropout, the DC-DC output will never be able to reach its input voltage, VVDD
2. In EMU_DCDCMISCCTRL register
3. Drive levels are defined by configuration of the PFETCNT and NFETCNT registers. Light Drive: PFETCNT=NFETCNT=3; Medi-
um Drive: PFETCNT=NFETCNT=7; Heavy Drive: PFETCNT=NFETCNT=15.
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4.1.4 Current Consumption
4.1.4.1 Current Consumption 3.3 V using DC-DC Converter
Unless otherwise indicated, typical conditions are: VDD = 3.3 V, DC-DC enabled. TOP = 25 °C. Minimum and maximum values in this
table represent the worst conditions across supply voltage and process variation at TOP = 25 °C.
Table 4.4. Current Consumption 3.3V with DC-DC
Parameter Symbol Test Condition Min Typ Max Unit
Current consumption in EM0
Active mode with all periph-
erals disabled, DCDC in Low
Noise DCM mode1.
IACTIVE 38.4 MHz crystal, CPU running
while loop from flash2
88 μA/MHz
38 MHz HFRCO, CPU running
Prime from flash
63 μA/MHz
38 MHz HFRCO, CPU running
while loop from flash
71 μA/MHz
38 MHz HFRCO, CPU running
CoreMark from flash
78 μA/MHz
26 MHz HFRCO, CPU running
while loop from flash
76 μA/MHz
Current consumption in EM0
Active mode with all periph-
erals disabled, DCDC in Low
Noise CCM mode3.
38.4 MHz crystal, CPU running
while loop from flash2
98 μA/MHz
38 MHz HFRCO, CPU running
Prime from flash
75 μA/MHz
38 MHz HFRCO, CPU running
while loop from flash
81 μA/MHz
38 MHz HFRCO, CPU running
CoreMark from flash
88 μA/MHz
26 MHz HFRCO, CPU running
while loop from flash
94 μA/MHz
Current consumption in EM1
Sleep mode with all peripher-
als disabled, DCDC in Low
Noise DCM mode1.
IEM1 38.4 MHz crystal2 49 μA/MHz
38 MHz HFRCO 32 μA/MHz
26 MHz HFRCO 38 μA/MHz
Current consumption in EM1
Sleep mode with all peripher-
als disabled, DCDC in Low
Noise CCM mode3.
38.4 MHz crystal2 61 μA/MHz
38 MHz HFRCO 45 μA/MHz
26 MHz HFRCO 58 μA/MHz
Current consumption in EM2
Deep Sleep mode. DCDC in
Low Power mode4.
IEM2 Full RAM retention and RTCC
running from LFXO
2.5 μA
4 kB RAM retention and RTCC
running from LFRCO
2.2 μA
Current consumption in EM3
Stop mode
IEM3 Full RAM retention and CRYO-
TIMER running from ULFRCO
2.1 μA
Current consumption in
EM4H Hibernate mode
IEM4 128 byte RAM retention, RTCC
running from LFXO
0.86 μA
128 byte RAM retention, CRYO-
TIMER running from ULFRCO
0.58 μA
128 byte RAM retention, no RTCC 0.58 μA
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Parameter Symbol Test Condition Min Typ Max Unit
Current consumption in
EM4S Shutoff mode
IEM4S no RAM retention, no RTCC 0.04 μA
Note:
1. DCDC Low Noise DCM Mode = Light Drive (PFETCNT=NFETCNT=3), F=3.0 MHz (RCOBAND=0), ANASW=DCDC voltage.
2. CMU_HFXOCTRL_LOWPOWER=0
3. DCDC Low Noise CCM Mode = Light Drive (PFETCNT=NFETCNT=3), F=6.4 MHz (RCOBAND=4), ANASW=DCDC voltage.
4. DCDC Low Power Mode = Medium Drive (PFETCNT=NFETCNT=7), LPOSCDIV=1, LPBIAS=3, LPCILIMSEL=1, ANASW=DCDC
voltage.
4.1.4.2 Current Consumption Using Radio
Unless otherwise indicated, typical conditions are: VDD = 3.3 V. TOP = 25 °C. Minimum and maximum values in this table represent the
worst conditions across supply voltage and process variation at TOP = 25 °C.
Table 4.5. Current Consumption 3.3 V with DC-DC
Parameter Symbol Test Condition Min Typ Max Unit
Current consumption in re-
ceive mode, active packet
reception (MCU in EM1 @
38.4 MHz, peripheral clocks
disabled)
IRX 1 Mbit/s, 2GFSK, F = 2.4 GHz,
Radio clock prescaled by 4
8.7 mA
802.15.4 receiving frame, F = 2.4
GHz, Radio clock prescaled by 3
9.8 mA
Current consumption in
transmit mode (MCU in EM1
@ 38.4 MHz, peripheral
clocks disabled)
ITX F = 2.4 GHz, CW, 0 dBm, Radio
clock prescaled by 3
8.2 mA
F = 2.4 GHz, CW, 10.5 dBm 32.7 mA
4.1.5 Wake up times
Table 4.6. Wake up times
Parameter Symbol Test Condition Min Typ Max Unit
Wake up from EM2 Deep
Sleep
tEM2_WU Code execution from flash 10.7 μs
Code execution from RAM 3 μs
Wakeup time from EM1
Sleep
tEM1_WU Executing from flash 3 AHB
Clocks
Executing from RAM 3 AHB
Clocks
Wake up from EM3 Stop tEM3_WU Executing from flash 10.7 μs
Executing from RAM 3 μs
Wake up from EM4H Hiber-
nate1
tEM4H_WU Executing from flash 60 μs
Wake up from EM4S Shut-
off1
tEM4S_WU 290 μs
Note:
1. Time from wakeup request until first instruction is executed. Wakeup results in device reset.
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4.1.6 Brown Out Detector
For the table below, see Figure 3.2 ARTIK 030 Power Block on page 5 to see the internal connection and relation between DVDD and
AVDD. The module itself has only one external power supply input (VDD).
Table 4.7. Brown Out Detector
Parameter Symbol Test Condition Min Typ Max Unit
AVDD BOD threshold VAVDDBOD AVDD rising 1.85 V
AVDD falling 1.62 V
AVDD BOD hysteresis VAVDDBOD_HYST 21 mV
AVDD response time tAVDDBOD_DELAY Supply drops at 0.1V/μs rate 2.4 μs
EM4 BOD threshold VEM4DBOD AVDD rising 1.7 V
AVDD falling 1.45 V
EM4 BOD hysteresis VEM4BOD_HYST 46 mV
EM4 response time tEM4BOD_DELAY Supply drops at 0.1V/μs rate 300 μs
4.1.7 Frequency Synthesizer Characteristics
Table 4.8. Frequency Synthesizer Characteristics
Parameter Symbol Test Condition Min Typ Max Unit
RF Synthesizer Frequency
range
FRANGE_2400 2.4 GHz frequency range 2400 2483.5 MHz
LO tuning frequency resolu-
tion
FRES_2400 2400 - 2483.5 MHz 73 Hz
Maximum frequency devia-
tion
ΔFMAX_2400 1677 kHz
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4.1.8 2.4 GHz RF Transceiver Characteristics
4.1.8.1 RF Transmitter General Characteristics for the 2.4 GHz Band
Unless otherwise indicated, typical conditions are: TOP = 25 °C, VDD = 3.3 V. RF center frequency 2.45 GHz. Measurements are con-
ducted from the antenna feed point.
Table 4.9. RF Transmitter General Characteristics for 2.4 GHz Band
Parameter Symbol Test Condition Min Typ Max Unit
Maximum TX power POUTMAX 10 dBm
Minimum active TX Power POUTMIN CW -30 dBm
Output power step size POUTSTEP -5 dBm < Output power < 0 dBm 1 dB
0 dBm < output power <
POUTMAX
0.5 dB
Output power variation vs
supply at POUTMAX
POUTVAR_V 1.85 V < VVDD < 3.3 V using DC-
DC converter
2.2 dB
Output power variation vs
temperature at POUTMAX
POUTVAR_T From -40 to +85 °C, DCDC ena-
bled
1.5 dB
Output power variation vs RF
frequency at POUTMAX
POUTVAR_F Over RF tuning frequency range 0.4 dB
RF tuning frequency range FRANGE 2400 2483.5 MHz
4.1.8.2 RF Receiver General Characteristics for the 2.4 GHz Band
Unless otherwise indicated, typical conditions are: TOP = 25 °C,VDD = 3.3 V. RF center frequency 2.440 GHz. Measurements are con-
ducted from the antenna feed point.
Table 4.10. RF Receiver General Characteristics for 2.4 GHz Band
Parameter Symbol Test Condition Min Typ Max Unit
RF tuning frequency range FRANGE 2400 2483.5 MHz
Receive mode maximum
spurious emission
SPURRX 30 MHz to 1 GHz -57 dBm
1 GHz to 12 GHz -47 dBm
Max spurious emissions dur-
ing active receive mode, per
FCC Part 15.109(a)
SPURRX_FCC 216 MHz to 960 MHz, Conducted
Measurement
-55.2 dBm
Above 960 MHz, Conducted
Measurement
-47.2 dBm
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4.1.8.3 RF Receiver Characteristics for 802.15.4 O-QPSK DSSS in the 2.4 GHz Band
Unless otherwise indicated, typical conditions are: T=25 °C,VDD = 3.3 V. RF center frequency 2.445 GHz. Meaurements are conducted
from the antenna feed point.
Table 4.11. RF Receiver Characteristics for 802.15.4 DSSS-OQPSK in the 2.4 GHz Band
Parameter Symbol Test Condition Min Typ Max Unit
Max usable receiver input
level, 1% PER
SAT Signal is reference signal1. Packet
length is 20 octets.
10 dBm
Sensitivity, 1% PER SENS Signal is reference signal. Packet
length is 20 octets. Using DC-DC
converter.
-99 dBm
Signal is reference signal. Packet
length is 20 octets. DC-DC con-
verter in bypass mode.
-99 dBm
Co-channel interferer rejec-
tion, 1% PER
CCR Desired signal 10 dB above sensi-
tivity limit
-2.6 dB
High-side adjacent channel
rejection, 1% PER. Desired
is reference signal at 3dB
above reference sensitivity
level2
ACR+1 Interferer is reference signal at +1
channel-spacing.
33.75 dB
Interferer is filtered reference sig-
nal3 at +1 channel-spacing.
52.2 dB
Interferer is CW at +1 channel-
spacing.4
58.6 dB
Low-side adjacent channel
rejection, 1% PER. Desired
is reference signal at 3dB
above reference sensitivity
level2
ACR-1 Interferer is reference signal at -1
channel-spacing.
35 dB
Interferer is filtered reference sig-
nal3 at -1 channel-spacing.
54.7 dB
Interferer is CW at -1 channel-
spacing.
60.1 dB
Alternate channel rejection,
1% PER. Desired is refer-
ence signal at 3dB above
reference sensitivity level2
ACR2Interferer is reference signal at ±2
channel-spacing
45.9 dB
Interferer is filtered reference sig-
nal3 at ±2 channel-spacing
56.8 dB
Interferer is CW at ±2 channel-
spacing
65.5 dB
Image rejection , 1% PER,
Desired is reference signal at
3dB above reference sensi-
tivity level2
IR Interferer is CW in image band4 49.3 dB
Blocking rejection of all other
channels. 1% PER, Desired
is reference signal at 3dB
above reference sensitivity
level2. Interferer is reference
signal.
BLOCK Interferer frequency < Desired fre-
quency - 3 channel-spacing
57.2 dB
Interferer frequency > Desired fre-
quency + 3 channel-spacing
57.9 dB
Blocking rejection of 802.11g
signal centered at +12MHz
or -13MHz
BLOCK80211G Desired is reference signal at 6dB
above reference sensitivity level2
51.6 dB
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Parameter Symbol Test Condition Min Typ Max Unit
Upper limit of input power
range over which RSSI reso-
lution is maintained
RSSIMAX 5 dBm
Lower limit of input power
range over which RSSI reso-
lution is maintained
RSSIMIN -98 dBm
RSSI resolution RSSIRES over RSSIMIN to RSSIMAX 0.25 dB
RSSI accuracy in the linear
region as defined by
802.15.4-2003
RSSILIN ±1 dB
Note:
1. Reference signal is defined as O-QPSK DSSS per 802.15.4, Frequency range = 2400-2483.5 MHz, Symbol rate = 62.5 ksym-
bols/s
2. Reference sensitivity level is -85 dBm
3. Filter is characterized as a symmetric bandpass centered on the adjacent channel having a 3dB bandwidth of 4.6 MHz and stop-
band rejection better than 26 dB beyond 3.15 MHz from the adjacent carrier.
4. Due to low-IF frequency, there is some overlap of adjacent channel and image channel bands. Adjacent channel CW blocker
tests place the Interferer center frequency at the Desired frequency ±5 MHz on the channel raster, whereas the image rejection
test places the CW interferer near the image frequency of the Desired signal carrier, regardless of the channel raster.
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4.1.9 Oscillators
4.1.9.1 LFXO
Table 4.12. LFXO
Parameter Symbol Test Condition Min Typ Max Unit
Crystal Frequency fLFXO 32.768 kHz
Crystal Frequency Tolerance -100 +100 ppm
4.1.9.2 HFXO
Table 4.13. HFXO
Parameter Symbol Test Condition Min Typ Max Unit
Crystal Frequency fHFXO 38.4 MHz
Crystal Frequency Tolerance -40 +40 ppm
4.1.9.3 LFRCO
Table 4.14. LFRCO
Parameter Symbol Test Condition Min Typ Max Unit
Oscillation frequency fLFRCO ENVREF = 1 in
CMU_LFRCOCTRL
30.474 32.768 34.243 kHz
ENVREF = 0 in
CMU_LFRCOCTRL
30.474 32.768 33.915 kHz
Startup time tLFRCO 500 μs
Current consumption 1ILFRCO ENVREF = 1 in
CMU_LFRCOCTRL
342 nA
ENVREF = 0 in
CMU_LFRCOCTRL
494 nA
Note:
1. Block is supplied by VDD if ANASW = 0, or DCDC if ANASW=1 in EMU_PWRCTRL register
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4.1.9.4 HFRCO and AUXHFRCO
Table 4.15. HFRCO and AUXHFRCO
Parameter Symbol Test Condition Min Typ Max Unit
Frequency Accuracy fHFRCO Any frequency band, across sup-
ply voltage and temperature
-2.5 2.5 %
Start-up time tHFRCO fHFRCO19 MHz 300 ns
4 < fHFRCO < 19 MHz 1 μs
fHFRCO ≤ 4 MHz 2.5 μs
Current consumption on all
supplies
IHFRCO fHFRCO = 38 MHz 204 228 μA
fHFRCO = 32 MHz 171 190 μA
fHFRCO = 26 MHz 147 164 μA
fHFRCO = 19 MHz 126 138 μA
fHFRCO = 16 MHz 110 120 μA
fHFRCO = 13 MHz 100 110 μA
fHFRCO = 7 MHz 81 91 μA
fHFRCO = 4 MHz 33 35 μA
fHFRCO = 2 MHz 31 35 μA
fHFRCO = 1 MHz 30 35 μA
Step size SSHFRCO Coarse (% of period) 0.8 %
Fine (% of period) 0.1 %
Period Jitter PJHFRCO 0.2 % RMS
4.1.9.5 ULFRCO
Table 4.16. ULFRCO
Parameter Symbol Test Condition Min Typ Max Unit
Oscillation frequency fULFRCO 0.95 1 1.07 kHz
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4.1.10 Flash Memory Characteristics
Table 4.17. Flash Memory Characteristics1
Parameter Symbol Test Condition Min Typ Max Unit
Flash erase cycles before
failure
ECFLASH 10000 cycles
Flash data retention RETFLASH 10 years
Word (32-bit) programming
time
tW_PROG 20 26 40 μs
Page erase time tPERASE 20 27 40 ms
Mass erase time tMERASE 20 27 40 ms
Device erase time2tDERASE 60 74 ms
Page erase current3IERASE 3 mA
Mass or Device erase cur-
rent3
5 mA
Write current3IWRITE 3 mA
Note:
1. Flash data retention information is published in the Quarterly Quality and Reliability Report.
2. Device erase is issued over the AAP interface and erases all flash, SRAM, the Lock Bit (LB) page, and the User data page Lock
Word (ULW)
3. Measured at 25°C
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4.1.11 GPIO
Table 4.18. GPIO
Parameter Symbol Test Condition Min Typ Max Unit
Input low voltage VIOIL VDD*0.3 V
Input high voltage VIOIH VDD*0.7 V
Output high voltage relative
to VDD
VIOOH Sourcing 3 mA, VDD ≥ 3 V,
DRIVESTRENGTH1 = WEAK
VDD*0.8 V
Sourcing 1.2 mA, VDD ≥ 1.62 V
DRIVESTRENGTH1 = WEAK
VDD*0.6 V
Sourcing 20 mA, VDD ≥ 3 V,
DRIVESTRENGTH1 = STRONG
VDD*0.8 V
Sourcing 8 mA, VDD ≥ 1.62 V
DRIVESTRENGTH1 = STRONG
VDD*0.6 V
Output low voltage relative to
VDD
VIOOL Sinking 3 mA, VDD ≥ 3 V,
DRIVESTRENGTH1 = WEAK
VDD*0.2 V
Sinking 1.2 mA, VDD ≥ 1.62 V
DRIVESTRENGTH1 = WEAK
VDD*0.4 V
Sinking 20 mA, VDD ≥ 3 V,
DRIVESTRENGTH1 = STRONG
VDD*0.2 V
Sinking 8 mA, VDD ≥ 1.62 V
DRIVESTRENGTH1 = STRONG
VDD*0.4 V
Input leakage current IIOLEAK All GPIO except LFXO pins, GPIO
≤ VDD
0.1 30 nA
LFXO Pins, GPIO ≤ VDD 0.1 50 nA
Input leakage current on
5VTOL pads above VDD
I5VTOLLEAK VDD < GPIO ≤ VDD + 2 V 3.3 15 μA
I/O pin pull-up resistor RPU 30 43 65 kΩ
I/O pin pull-down resistor RPD 30 43 65 kΩ
Pulse width of pulses re-
moved by the glitch suppres-
sion filter
tIOGLITCH 20 25 35 ns
Output fall time, From 70%
to 30% of VIO
tIOOF CL = 50 pF,
DRIVESTRENGTH1 = STRONG,
SLEWRATE1 = 0x6
1.8 ns
CL = 50 pF,
DRIVESTRENGTH1 = WEAK,
SLEWRATE1 = 0x6
4.5 ns
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Parameter Symbol Test Condition Min Typ Max Unit
Output rise time, From 30%
to 70% of VIO
tIOOR CL = 50 pF,
DRIVESTRENGTH1 = STRONG,
SLEWRATE = 0x61
2.2 ns
CL = 50 pF,
DRIVESTRENGTH1 = WEAK,
SLEWRATE1 = 0x6
7.4 ns
Note:
1. In GPIO_Pn_CTRL register
4.1.12 VMON
Table 4.19. VMON
Parameter Symbol Test Condition Min Typ Max Unit
VMON Supply Current IVMON In EM0 or EM1, 1 supply moni-
tored
5.8 8.26 μA
In EM0 or EM1, 4 supplies moni-
tored
11.8 16.8 μA
In EM2, EM3 or EM4, 1 supply
monitored
62 nA
In EM2, EM3 or EM4, 4 supplies
monitored
99 nA
VMON Loading of Monitored
Supply
ISENSE In EM0 or EM1 2 μA
In EM2, EM3 or EM4 2 nA
Threshold range VVMON_RANGE 1.62 3.4 V
Threshold step size NVMON_STESP Coarse 200 mV
Fine 20 mV
Response time tVMON_RES Supply drops at 1V/μs rate 460 ns
Hysteresis VVMON_HYST 26 mV
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4.1.13 ADC
Table 4.20. ADC
Parameter Symbol Test Condition Min Typ Max Unit
Resolution VRESOLUTION 6 12 Bits
Input voltage range VADCIN Single ended 0 2*VREF V
Differential -VREF VREF V
Input range of external refer-
ence voltage, single ended
and differential
VADCREFIN_P 1 VAVDD V
Power supply rejection1PSRRADC At DC 80 dB
Analog input common mode
rejection ratio
CMRRADC At DC 80 dB
Current from all supplies, us-
ing internal reference buffer.
Continous operation. WAR-
MUPMODE2 = KEEPADC-
WARM
IADC_CONTI-
NOUS_LP
1 Msps / 16 MHz ADCCLK,
BIASPROG = 0, GPBIASACC = 1
3
301 350 μA
250 ksps / 4 MHz ADCCLK, BIA-
SPROG = 6, GPBIASACC = 1 3
149 μA
62.5 ksps / 1 MHz ADCCLK,
BIASPROG = 15, GPBIASACC =
1 3
91 μA
Current from all supplies, us-
ing internal reference buffer.
Duty-cycled operation. WAR-
MUPMODE2 = NORMAL
IADC_NORMAL_LP 35 ksps / 16 MHz ADCCLK,
BIASPROG = 0, GPBIASACC = 1
3
51 μA
5 ksps / 16 MHz ADCCLK
BIASPROG = 0, GPBIASACC = 1
3
9 μA
Current from all supplies, us-
ing internal reference buffer.
Duty-cycled operation.
AWARMUPMODE2 = KEEP-
INSTANDBY or KEEPIN-
SLOWACC
IADC_STAND-
BY_LP
125 ksps / 16 MHz ADCCLK,
BIASPROG = 0, GPBIASACC = 1
3
117 μA
35 ksps / 16 MHz ADCCLK,
BIASPROG = 0, GPBIASACC = 1
3
79 μA
Current from all supplies, us-
ing internal reference buffer.
Continous operation. WAR-
MUPMODE2 = KEEPADC-
WARM
IADC_CONTI-
NOUS_HP
1 Msps / 16 MHz ADCCLK,
BIASPROG = 0, GPBIASACC = 0
3
345 μA
250 ksps / 4 MHz ADCCLK, BIA-
SPROG = 6, GPBIASACC = 0 3
191 μA
62.5 ksps / 1 MHz ADCCLK,
BIASPROG = 15, GPBIASACC =
0 3
132 μA
ARTIK 030 Mesh Networking Module Data Sheet
Electrical Specifications
Samsung ARTIK™ Modules | artik.io Preliminary Rev. 0.5 | 26
Parameter Symbol Test Condition Min Typ Max Unit
Current from all supplies, us-
ing internal reference buffer.
Duty-cycled operation. WAR-
MUPMODE2 = NORMAL
IADC_NORMAL_HP 35 ksps / 16 MHz ADCCLK,
BIASPROG = 0, GPBIASACC = 0
3
102 μA
5 ksps / 16 MHz ADCCLK
BIASPROG = 0, GPBIASACC = 0
3
17 μA
Current from all supplies, us-
ing internal reference buffer.
Duty-cycled operation.
AWARMUPMODE2 = KEEP-
INSTANDBY or KEEPIN-
SLOWACC
IADC_STAND-
BY_HP
125 ksps / 16 MHz ADCCLK,
BIASPROG = 0, GPBIASACC = 0
3
162 μA
35 ksps / 16 MHz ADCCLK,
BIASPROG = 0, GPBIASACC = 0
3
123 μA
Current from HFPERCLK IADC_CLK HFPERCLK = 16 MHz 140 μA
ADC Clock Frequency fADCCLK 16 MHz
Throughput rate fADCRATE 1 Msps
Conversion time4tADCCONV 6 bit 7 cycles
8 bit 9 cycles
12 bit 13 cycles
Startup time of reference
generator and ADC core
tADCSTART WARMUPMODE2 = NORMAL 5 μs
WARMUPMODE2 = KEEPIN-
STANDBY
2 μs
WARMUPMODE2 = KEEPINSLO-
WACC
1 μs
SNDR at 1Msps and fin =
10kHz
SNDRADC Internal reference, 2.5 V full-scale,
differential (-1.25, 1.25)
58 67 dB
vrefp_in = 1.25 V direct mode with
2.5 V full-scale, differential
68 dB
Spurious-Free Dynamic
Range (SFDR)
SFDRADC 1 MSamples/s, 10 kHz full-scale
sine wave
75 dB
Input referred ADC noise,
rms
VREF_NOISE Including quantization noise and
distortion
380 μV
Offset Error VADCOFFSETERR -3 0.25 3 LSB
Gain error in ADC VADC_GAIN Using internal reference -0.2 5 %
Using external reference -1 %
Differential non-linearity
(DNL)
DNLADC 12 bit resolution -1 2 LSB
Integral non-linearity (INL),
End point method
INLADC 12 bit resolution -6 6 LSB
Temperature Sensor Slope VTS_SLOPE -1.84 mV/°C
ARTIK 030 Mesh Networking Module Data Sheet
Electrical Specifications
Samsung ARTIK™ Modules | artik.io Preliminary Rev. 0.5 | 27
Parameter Symbol Test Condition Min Typ Max Unit
Note:
1. PSRR is referenced to AVDD when ANASW=0 and to DVDD when ANASW=1 in EMU_PWRCTRL
2. In ADCn_CNTL register
3. In ADCn_BIASPROG register
4. Derived from ADCCLK
ARTIK 030 Mesh Networking Module Data Sheet
Electrical Specifications
Samsung ARTIK™ Modules | artik.io Preliminary Rev. 0.5 | 28
4.1.14 IDAC
Table 4.21. IDAC
Parameter Symbol Test Condition Min Typ Max Unit
Number of Ranges NIDAC_RANGES 4 -
Output Current IIDAC_OUT RANGSEL1 = RANGE0 0.05 1.6 μA
RANGSEL1 = RANGE1 1.6 4.7 μA
RANGSEL1 = RANGE2 0.5 16 μA
RANGSEL1 = RANGE3 2 64 μA
Linear steps within each
range
NIDAC_STEPS 32
Step size SSIDAC RANGSEL1 = RANGE0 50 nA
RANGSEL1 = RANGE1 100 nA
RANGSEL1 = RANGE2 500 nA
RANGSEL1 = RANGE3 2 μA
Total Accuracy, STEPSEL1 =
0x10
ACCIDAC EM0 or EM1, AVDD=3.3 V, T = 25
°C
-2 2 %
EM0 or EM1 -18 22 %
EM2 or EM3, Source mode,
RANGSEL1 = RANGE0,
AVDD=3.3 V, T = 25 °C
-2 %
EM2 or EM3, Source mode,
RANGSEL1 = RANGE1,
AVDD=3.3 V, T = 25 °C
-1.7 %
EM2 or EM3, Source mode,
RANGSEL1 = RANGE2,
AVDD=3.3 V, T = 25 °C
-0.8 %
EM2 or EM3, Source mode,
RANGSEL1 = RANGE3,
AVDD=3.3 V, T = 25 °C
-0.5 %
EM2 or EM3, Sink mode, RANG-
SEL1 = RANGE0, AVDD=3.3 V, T
= 25 °C
-0.7 %
EM2 or EM3, Sink mode, RANG-
SEL1 = RANGE1, AVDD=3.3 V, T
= 25 °C
-0.6 %
EM2 or EM3, Sink mode, RANG-
SEL1 = RANGE2, AVDD=3.3 V, T
= 25 °C
-0.5 %
EM2 or EM3, Sink mode, RANG-
SEL1 = RANGE3, AVDD=3.3 V, T
= 25 °C
-0.5 %
Start up time tIDAC_SU Output within 1% of steady state
value
5 μs
ARTIK 030 Mesh Networking Module Data Sheet
Electrical Specifications
Samsung ARTIK™ Modules | artik.io Preliminary Rev. 0.5 | 29
Parameter Symbol Test Condition Min Typ Max Unit
Settling time, (output settled
within 1% of steady state val-
ue)
tIDAC_SETTLE Range setting is changed 5 μs
Step value is changed 1 μs
Current consumption in EM0
or EM1 2
IIDAC Source mode, excluding output
current
8.9 13 μA
Sink mode, excluding output cur-
rent
12 16 μA
Current consumption in EM2
or EM32
Source mode, excluding output
current, duty cycle mode, T = 25
°C
1.04 μA
Sink mode, excluding output cur-
rent, duty cycle mode, T = 25 °C
1.08 μA
Source mode, excluding output
current, duty cycle mode, T ≥ 85
°C
8.9 μA
Sink mode, excluding output cur-
rent, duty cycle mode, T ≥ 85 °C
12 μA
Output voltage compliance in
source mode, source current
change relative to current
sourced at 0 V
ICOMP_SRC RANGESEL1=0, output voltage =
min(VIOVDD, VAVDD2-100 mv)
0.04 %
RANGESEL1=1, output voltage =
min(VIOVDD, VAVDD2-100 mV)
0.02 %
RANGESEL1=2, output voltage =
min(VIOVDD, VAVDD2-150 mV)
0.02 %
RANGESEL1=3, output voltage =
min(VIOVDD, VAVDD2-250 mV)
0.02 %
Output voltage compliance in
sink mode, sink current
change relative to current
sunk at IOVDD
ICOMP_SINK RANGESEL1=0, output voltage =
100 mV
0.18 %
RANGESEL1=1, output voltage =
100 mV
0.12 %
RANGESEL1=2, output voltage =
150 mV
0.08 %
RANGESEL1=3, output voltage =
250 mV
0.02 %
Note:
1. In IDAC_CURPROG register
2. The IDAC is supplied by either AVDD, DVDD, or IOVDD based on the setting of ANASW in the EMU_PWRCTRL register and
PWRSEL in the IDAC_CTRL register. Setting PWRSEL to 1 selects IOVDD. With PWRSEL cleared to 0, ANASW selects be-
tween AVDD (0) and DVDD (1).
ARTIK 030 Mesh Networking Module Data Sheet
Electrical Specifications
Samsung ARTIK™ Modules | artik.io Preliminary Rev. 0.5 | 30
4.1.15 Analog Comparator (ACMP)
Table 4.22. ACMP
Parameter Symbol Test Condition Min Typ Max Unit
Input voltage range VACMPIN CMPVDD =
ACMPn_CTRL_PWRSEL 1
0 CMPVDD V
Supply Voltage VACMPVDD BIASPROG20x10 or FULL-
BIAS2 = 0
1.85 VVDD_MAX V
0x10 < BIASPROG2 ≤ 0x20 and
FULLBIAS2 = 1
2.1 VVDD_MAX V
Active current not including
voltage reference
IACMP BIASPROG2 = 1, FULLBIAS2 = 0 50 nA
BIASPROG2 = 0x10, FULLBIAS2
= 0
306 nA
BIASPROG2 = 0x20, FULLBIAS2
= 1
74 95 μA
Current consumption of inter-
nal voltage reference
IACMPREF VLP selected as input using 2.5 V
Reference / 4 (0.625 V)
50 nA
VLP selected as input using VDD 20 nA
VBDIV selected as input using
1.25 V reference / 1
4.1 μA
VADIV selected as input using
VDD/1
2.4 μA
Hysteresis (VCM = 1.25 V,
BIASPROG2 = 0x10, FULL-
BIAS2 = 1)
VACMPHYST HYSTSEL3 = HYST0 -1.75 0 1.75 mV
HYSTSEL3 = HYST1 10 18 26 mV
HYSTSEL3 = HYST2 21 32 46 mV
HYSTSEL3 = HYST3 27 44 63 mV
HYSTSEL3 = HYST4 32 55 80 mV
HYSTSEL3 = HYST5 38 65 100 mV
HYSTSEL3 = HYST6 43 77 121 mV
HYSTSEL3 = HYST7 47 86 148 mV
HYSTSEL3 = HYST8 -4 0 4 mV
HYSTSEL3 = HYST9 -27 -18 -10 mV
HYSTSEL3 = HYST10 -47 -32 -18 mV
HYSTSEL3 = HYST11 -64 -43 -27 mV
HYSTSEL3 = HYST12 -78 -54 -32 mV
HYSTSEL3 = HYST13 -93 -64 -37 mV
HYSTSEL3 = HYST14 -113 -74 -42 mV
HYSTSEL3 = HYST15 -135 -85 -47 mV
ARTIK 030 Mesh Networking Module Data Sheet
Electrical Specifications
Samsung ARTIK™ Modules | artik.io Preliminary Rev. 0.5 | 31
Parameter Symbol Test Condition Min Typ Max Unit
Comparator delay4tACMPDELAY BIASPROG2 = 1, FULLBIAS2 = 0 30 μs
BIASPROG2 = 0x10, FULLBIAS2
= 0
3.7 μs
BIASPROG2 = 0x20, FULLBIAS2
= 1
35 ns
Offset voltage VACMPOFFSET BIASPROG2 =0x10, FULLBIAS2
= 1
-35 35 mV
Reference Voltage VACMPREF Internal 1.25 V reference 1 1.25 1.47 V
Internal 2.5 V reference 2 2.5 2.8 V
Capacitive Sense Internal
Resistance
RCSRES CSRESSEL5 = 0 inf kΩ
CSRESSEL5 = 1 15 kΩ
CSRESSEL5 = 2 27 kΩ
CSRESSEL5 = 3 39 kΩ
CSRESSEL5 = 4 51 kΩ
CSRESSEL5 = 5 102 kΩ
CSRESSEL5 = 6 164 kΩ
CSRESSEL5 = 7 239 kΩ
Note:
1. CMPVDD is a supply chosen by the setting in ACMPn_CTRL_PWRSEL and may be VDD or DCDC.
2. In ACMPn_CTRL register.
3. In ACMPn_HYSTERESIS register.
4. ±100 mV differential drive.
5. In ACMPn_INPUTSEL register.
The total ACMP current is the sum of the contributions from the ACMP and its internal voltage reference as given as:
IACMPTOTAL = IACMP + IACMPREF
IACMPREF is zero if an external voltage reference is used.
ARTIK 030 Mesh Networking Module Data Sheet
Electrical Specifications
Samsung ARTIK™ Modules | artik.io Preliminary Rev. 0.5 | 32
4.1.16 I2C
I2C Standard-mode (Sm)
Table 4.23. I2C Standard-mode (Sm)1
Parameter Symbol Test Condition Min Typ Max Unit
SCL clock frequency2fSCL 0 100 kHz
SCL clock low time tLOW 4.7 μs
SCL clock high time tHIGH 4 μs
SDA set-up time tSU,DAT 250 ns
SDA hold time3tHD,DAT 100 3450 ns
Repeated START condition
set-up time
tSU,STA 4.7 μs
(Repeated) START condition
hold time
tHD,STA 4 μs
STOP condition set-up time tSU,STO 4 μs
Bus free time between a
STOP and START condition
tBUF 4.7 μs
Note:
1. For CLHR set to 0 in the I2Cn_CTRL register
2. For the minimum HFPERCLK frequency required in Standard-mode, refer to the I2C chapter in the reference manual
3. The maximum SDA hold time (tHD,DAT) needs to be met only when the device does not stretch the low time of SCL (tLOW)
ARTIK 030 Mesh Networking Module Data Sheet
Electrical Specifications
Samsung ARTIK™ Modules | artik.io Preliminary Rev. 0.5 | 33
I2C Fast-mode (Fm)
Table 4.24. I2C Fast-mode (Fm)1
Parameter Symbol Test Condition Min Typ Max Unit
SCL clock frequency2fSCL 0 400 kHz
SCL clock low time tLOW 1.3 μs
SCL clock high time tHIGH 0.6 μs
SDA set-up time tSU,DAT 100 ns
SDA hold time3tHD,DAT 100 900 ns
Repeated START condition
set-up time
tSU,STA 0.6 μs
(Repeated) START condition
hold time
tHD,STA 0.6 μs
STOP condition set-up time tSU,STO 0.6 μs
Bus free time between a
STOP and START condition
tBUF 1.3 μs
Note:
1. For CLHR set to 1 in the I2Cn_CTRL register
2. For the minimum HFPERCLK frequency required in Fast-mode, refer to the I2C chapter in the reference manual
3. The maximum SDA hold time (tHD,DAT) needs to be met only when the device does not stretch the low time of SCL (tLOW)
I2C Fast-mode Plus (Fm+)
Table 4.25. I2C Fast-mode Plus (Fm+)1
Parameter Symbol Test Condition Min Typ Max Unit
SCL clock frequency2fSCL 0 1000 kHz
SCL clock low time tLOW 0.5 μs
SCL clock high time tHIGH 0.26 μs
SDA set-up time tSU,DAT 50 ns
SDA hold time tHD,DAT 100 ns
Repeated START condition
set-up time
tSU,STA 0.26 μs
(Repeated) START condition
hold time
tHD,STA 0.26 μs
STOP condition set-up time tSU,STO 0.26 μs
Bus free time between a
STOP and START condition
tBUF 0.5 μs
Note:
1. For CLHR set to 0 or 1 in the I2Cn_CTRL register
2. For the minimum HFPERCLK frequency required in Fast-mode Plus, refer to the I2C chapter in the reference manual
ARTIK 030 Mesh Networking Module Data Sheet
Electrical Specifications
Samsung ARTIK™ Modules | artik.io Preliminary Rev. 0.5 | 34
4.1.17 USART SPI
SPI Master Timing
Table 4.26. SPI Master Timing
Parameter Symbol Test Condition Min Typ Max Unit
SCLK period 1 2tSCLK 2 *
tHFPERCLK
ns
CS to MOSI 1 2tCS_MO 0 8 ns
SCLK to MOSI 1 2tSCLK_MO 3 20 ns
MISO setup time 1 2tSU_MI VDD = 3.0 V 37 ns
MISO hold time 1 2tH_MI 6 ns
Note:
1. Applies for both CLKPHA = 0 and CLKPHA = 1 (figure only shows CLKPHA = 0)
2. Measurement done with 8 pF output loading at 10% and 90% of VDD (figure shows 50% of VDD)
CS
SCLK
CLKPOL = 0
MOSI
MISO
tCS_MO
tH_MI
tSU_MI
tSCKL_MO
tSCLK
SCLK
CLKPOL = 1
Figure 4.1. SPI Master Timing Diagram
ARTIK 030 Mesh Networking Module Data Sheet
Electrical Specifications
Samsung ARTIK™ Modules | artik.io Preliminary Rev. 0.5 | 35
SPI Slave Timing
Table 4.27. SPI Slave Timing
Parameter Symbol Test Condition Min Typ Max Unit
SCKL period 1 2tSCLK_sl 2 *
tHFPERCLK
ns
SCLK high period1 2tSCLK_hi 3 *
tHFPERCLK
ns
SCLK low period 1 2tSCLK_lo 3 *
tHFPERCLK
ns
CS active to MISO 1 2tCS_ACT_MI 4 50 ns
CS disable to MISO 1 2tCS_DIS_MI 4 50 ns
MOSI setup time 1 2tSU_MO 4 ns
MOSI hold time 1 2tH_MO 3 + 2 *
tHFPERCLK
ns
SCLK to MISO 1 2tSCLK_MI 16 +
tHFPERCLK
66 + 2 *
tHFPERCLK
ns
Note:
1. Applies for both CLKPHA = 0 and CLKPHA = 1 (figure only shows CLKPHA = 0)
2. Measurement done with 8 pF output loading at 10% and 90% of VDD (figure shows 50% of VDD)
CS
SCLK
CLKPOL = 0
MOSI
MISO
tCS_ACT_MI
tSCLK_HI
tSCLK
tSU_MO
tH_MO
tSCLK_MI
tCS_DIS_MI
tSCLK_LO
SCLK
CLKPOL = 1
Figure 4.2. SPI Slave Timing Diagram
ARTIK 030 Mesh Networking Module Data Sheet
Electrical Specifications
Samsung ARTIK™ Modules | artik.io Preliminary Rev. 0.5 | 36
5. Typical Connection Diagrams
5.1 Network Co-Processor (NCP) Application with UART Host
The ARTIK 030 can be controlled over the UART interface as a peripheral to an external host processor. Typical power supply, pro-
gramming/debug, and host interface connections are shown in the figure below. Refer to AN958: Debugging and Programming Interfa-
ces for Custom Designs for more details.
Figure 5.1. Connection Diagram: UART NCP Configuration
5.2 Network Co-Processor (NCP) Application with SPI Host
The ARTIK 030 can be controlled over the SPI interface as a peripheral to an external host processor. Typical power supply, program-
ming/debug and host interface connections are shown in the figure below. Refer to AN958: Debugging and Programming Interfaces for
Custom Designs for more details.
Figure 5.2. Connection Diagram: SPI NCP Configuration
ARTIK 030 Mesh Networking Module Data Sheet
Typical Connection Diagrams
Samsung ARTIK™ Modules | artik.io Preliminary Rev. 0.5 | 37
5.3 SoC Application
The ARTIK 030 can be used in a standalone SoC configuration with no external host processor. Typical power supply and program-
ming/debug connections are shown in the figure below. Refer to AN958: Debugging and Programming Interfaces for Custom Designs
for more details. Refer to AN772: Using the Application Bootloader for recommendations on supported serial flash ICs (optional).
Figure 5.3. Connection Diagram: SoC Configuration
ARTIK 030 Mesh Networking Module Data Sheet
Typical Connection Diagrams
Samsung ARTIK™ Modules | artik.io Preliminary Rev. 0.5 | 38
6. Layout Guidelines
For optimal performance of the ARTIK 030A (with intergrated antenna), please follow the PCB layout guidelines and ground plane rec-
ommendations indicated in this section.
6.1 Module Placement and Application PCB Layout Guidelines
Place the module at the edge of the PCB, as shown in the figure below.
Do not place any metal (traces, components, battery, etc.) within the clearance area of the antenna (shown in the figure below).
Connect all ground pads directly to a solid ground plane.
Place the ground vias as close to the ground pads as possible.
Do not place plastic or any other dielectric material in touch with the antenna.
Figure 6.1. Recommended Application PCB Layout for ARTIK 030A
The layouts in the next figure will result in severely degraded RF-performance.
Figure 6.2. Non-optimal Module Placements for ARTIK 030A
ARTIK 030 Mesh Networking Module Data Sheet
Layout Guidelines
Samsung ARTIK™ Modules | artik.io Preliminary Rev. 0.5 | 39
Figure 6.3. Impact of GND Plane Size vs. Range for ARTIK 030A
6.2 Effect of Plastic and Metal Materials
Do not place plastic or any other dielectric material in closs proximity to the antenna.
Any metallic objects in close proximity to the antenna will prevent the antenna from radiating freely. The minimum recommended dis-
tance of metallic and/or conductive objects is 10 mm in any direction from the antenna except in the directions of the application PCB
ground planes.
6.3 Locating the Module Close to Human Body
Placing the module in touch or very close to the human body will negatively impact antenna efficiency and reduce range.
ARTIK 030 Mesh Networking Module Data Sheet
Layout Guidelines
Samsung ARTIK™ Modules | artik.io Preliminary Rev. 0.5 | 40
6.4 2D Radiation Pattern Plots
Figure 6.4. Typical 2D Radiation Pattern – Front View
Figure 6.5. Typical 2D Radiation Pattern – Side View
ARTIK 030 Mesh Networking Module Data Sheet
Layout Guidelines
Samsung ARTIK™ Modules | artik.io Preliminary Rev. 0.5 | 41
Figure 6.6. Typical 2D Radiation Pattern – Top View
ARTIK 030 Mesh Networking Module Data Sheet
Layout Guidelines
Samsung ARTIK™ Modules | artik.io Preliminary Rev. 0.5 | 42
7. Hardware Design Guidelines
The ARTIK 030 is an easy-to-use module with regard to hardware application design but certain design guidelines must be followed to
guarantee optimal performance. These guidelines are listed in the next sub-sections.
7.1 Power Supply Requirements
Coin cell batteries cannot withstand high peak currents (e.g. higher than 15 mA). If the peak current exceeds 15 mA it’s recommended
to place 47 - 100 µF capacitor in parallel with the coin cell battery to improve the battery life time. Notice that the total current consump-
tion of your application is a combination of the radio, peripherals and MCU current consumption so you must take all of these into ac-
count. ARTIK 030 should be powered by a unipolar supply voltage with nominal value of 3.3 V.
7.2 Reset Functions
The ARTIK 030 can be reset by three different methods: by pulling the RESET line low, by the internal watchdog timer or software
command. The reset state in ARTIK 030 does not provide any power saving functionality and thus is not recommended as a means to
conserve power. ARTIK 030 has an internal system power-up reset function. The RESET pin includes an on-chip pull-up resistor and
can therefore be left unconnected if no external reset switch or source is needed.
7.3 Debug and Firmware Updates
This section contains information on debug and firmware update methods. For additional information, refer to the following application
note: AN958: Debugging and Programming Interfaces for Custom Designs.
7.3.1 JTAG
It is recommended to expose the JTAG debug pins in your own hardware design for firmware update and debug purposes. The follow-
ing table lists the required pins for JTAG connection.
The debug pins have pull-down and pull-up enabled by default, so leaving them enabled may increase current consumption if left con-
nected to supply or ground. If enabling the JTAG pins the module must be power cycled to enable a SWD debug session.
Table 7.1. JTAG Pads
PAD NAME PAD NUMBER JTAG SIGNAL NAME COMMENTS
PF3 24 TDI This pin is disabled after reset. Once enabled the pin has a built-in pull-up.
PF2 23 TDO This pin is disabled after reset
PF1 22 TMS Pin is enabled after reset and has a built-in pull-up
PF0 21 TCK Pin is enabled after reset and has a built-in pull-down
7.3.2 Packet Trace Interface (PTI)
The ARTIK 030 integrates a true PHY-level PTI with the MAC, allowing complete, non-intrusive capture of all packets to and from the
EFR32 Wireless STK development tools.
ARTIK 030 Mesh Networking Module Data Sheet
Hardware Design Guidelines
Samsung ARTIK™ Modules | artik.io Preliminary Rev. 0.5 | 43
8. Pin Definitions
8.1 Pin Definitions
GND
PD13
PD14
PD15
PA0
PA1
PA2
PA3
PA4
PA5
PB11
GND
GND
RESETn
VDD
PF7
PF6
PF5
PF3
PF2
PF1
PF0
GND
PB13
PC6
PC7
PC8
PC9
PC10
1
2
3
4
5
6
7
8
9
10
11
12
13 14 15 16 17 18
PC11
19
31
30
29
28
27
26
24
23
22
21
20
ARTIK-030
TOP VIEW
25
PF4
Figure 8.1. ARTIK 030 Pinout
ARTIK 030 Mesh Networking Module Data Sheet
Pin Definitions
Samsung ARTIK™ Modules | artik.io Preliminary Rev. 0.5 | 44
Table 8.1. Device Pinout
ARTIK 030 Pin Alternate Functionality / Description
Pin # Pin Name Analog Timers Communication Radio Other
1 GND Ground
2 PD13
BUSCY [ADC0:
APORT3YCH5
ACMP0:
APORT3YCH5
ACMP1:
APORT3YCH5
IDAC0:
APORT1YCH5]
BUSDX [ADC0:
APORT4XCH5
ACMP0:
APORT4XCH5
ACMP1:
APORT4XCH5]
TIM0_CC0 #21
TIM0_CC1 #20
TIM0_CC2 #19
TIM0_CDTI0 #18
TIM0_CDTI1 #17
TIM0_CDTI2 #16
TIM1_CC0 #21
TIM1_CC1 #20
TIM1_CC2 #19
TIM1_CC3 #18 LE-
TIM0_OUT0 #21
LETIM0_OUT1 #20
PCNT0_S0IN #21
PCNT0_S1IN #20
US0_TX #21
US0_RX #20
US0_CLK #19
US0_CS #18
US0_CTS #17
US0_RTS #16
US1_TX #21
US1_RX #20
US1_CLK #19
US1_CS #18
US1_CTS #17
US1_RTS #16
LEU0_TX #21
LEU0_RX #20
I2C0_SDA #21
I2C0_SCL #20
FRC_DCLK #21
FRC_DOUT #20
FRC_DFRAME #19
MODEM_DCLK
#21 MODEM_DIN
#20 MO-
DEM_DOUT #19
MODEM_ANT0
#18 MO-
DEM_ANT1 #17
PRS_CH3 #12
PRS_CH4 #4
PRS_CH5 #3
PRS_CH6 #15
ACMP0_O #21
ACMP1_O #21
3 PD14
BUSCX [ADC0:
APORT3XCH6
ACMP0:
APORT3XCH6
ACMP1:
APORT3XCH6
IDAC0:
APORT1XCH6]
BUSDY [ADC0:
APORT4YCH6
ACMP0:
APORT4YCH6
ACMP1:
APORT4YCH6]
TIM0_CC0 #22
TIM0_CC1 #21
TIM0_CC2 #20
TIM0_CDTI0 #19
TIM0_CDTI1 #18
TIM0_CDTI2 #17
TIM1_CC0 #22
TIM1_CC1 #21
TIM1_CC2 #20
TIM1_CC3 #19 LE-
TIM0_OUT0 #22
LETIM0_OUT1 #21
PCNT0_S0IN #22
PCNT0_S1IN #21
US0_TX #22
US0_RX #21
US0_CLK #20
US0_CS #19
US0_CTS #18
US0_RTS #17
US1_TX #22
US1_RX #21
US1_CLK #20
US1_CS #19
US1_CTS #18
US1_RTS #17
LEU0_TX #22
LEU0_RX #21
I2C0_SDA #22
I2C0_SCL #21
FRC_DCLK #22
FRC_DOUT #21
FRC_DFRAME #20
MODEM_DCLK
#22 MODEM_DIN
#21 MO-
DEM_DOUT #20
MODEM_ANT0
#19 MO-
DEM_ANT1 #18
CMU_CLK0 #5
PRS_CH3 #13
PRS_CH4 #5
PRS_CH5 #4
PRS_CH6 #16
ACMP0_O #22
ACMP1_O #22
GPIO_EM4WU4
4 PD15
BUSCY [ADC0:
APORT3YCH7
ACMP0:
APORT3YCH7
ACMP1:
APORT3YCH7
IDAC0:
APORT1YCH7]
BUSDX [ADC0:
APORT4XCH7
ACMP0:
APORT4XCH7
ACMP1:
APORT4XCH7]
TIM0_CC0 #23
TIM0_CC1 #22
TIM0_CC2 #21
TIM0_CDTI0 #20
TIM0_CDTI1 #19
TIM0_CDTI2 #18
TIM1_CC0 #23
TIM1_CC1 #22
TIM1_CC2 #21
TIM1_CC3 #20 LE-
TIM0_OUT0 #23
LETIM0_OUT1 #22
PCNT0_S0IN #23
PCNT0_S1IN #22
US0_TX #23
US0_RX #22
US0_CLK #21
US0_CS #20
US0_CTS #19
US0_RTS #18
US1_TX #23
US1_RX #22
US1_CLK #21
US1_CS #20
US1_CTS #19
US1_RTS #18
LEU0_TX #23
LEU0_RX #22
I2C0_SDA #23
I2C0_SCL #22
FRC_DCLK #23
FRC_DOUT #22
FRC_DFRAME #21
MODEM_DCLK
#23 MODEM_DIN
#22 MO-
DEM_DOUT #21
MODEM_ANT0
#20 MO-
DEM_ANT1 #19
CMU_CLK1 #5
PRS_CH3 #14
PRS_CH4 #6
PRS_CH5 #5
PRS_CH6 #17
ACMP0_O #23
ACMP1_O #23
DBG_SWO #2
ARTIK 030 Mesh Networking Module Data Sheet
Pin Definitions
Samsung ARTIK™ Modules | artik.io Preliminary Rev. 0.5 | 45
ARTIK 030 Pin Alternate Functionality / Description
Pin # Pin Name Analog Timers Communication Radio Other
5 PA0
ADC0_EXTN
BUSCX [ADC0:
APORT3XCH8
ACMP0:
APORT3XCH8
ACMP1:
APORT3XCH8
IDAC0:
APORT1XCH8]
BUSDY [ADC0:
APORT4YCH8
ACMP0:
APORT4YCH8
ACMP1:
APORT4YCH8]
TIM0_CC0 #0
TIM0_CC1 #31
TIM0_CC2 #30
TIM0_CDTI0 #29
TIM0_CDTI1 #28
TIM0_CDTI2 #27
TIM1_CC0 #0
TIM1_CC1 #31
TIM1_CC2 #30
TIM1_CC3 #29 LE-
TIM0_OUT0 #0 LE-
TIM0_OUT1 #31
PCNT0_S0IN #0
PCNT0_S1IN #31
US0_TX #0
US0_RX #31
US0_CLK #30
US0_CS #29
US0_CTS #28
US0_RTS #27
US1_TX #0
US1_RX #31
US1_CLK #30
US1_CS #29
US1_CTS #28
US1_RTS #27
LEU0_TX #0
LEU0_RX #31
I2C0_SDA #0
I2C0_SCL #31
FRC_DCLK #0
FRC_DOUT #31
FRC_DFRAME #30
MODEM_DCLK #0
MODEM_DIN #31
MODEM_DOUT
#30 MO-
DEM_ANT0 #29
MODEM_ANT1
#28
CMU_CLK1 #0
PRS_CH6 #0
PRS_CH7 #10
PRS_CH8 #9
PRS_CH9 #8
ACMP0_O #0
ACMP1_O #0
6 PA1
ADC0_EXTP
BUSCY [ADC0:
APORT3YCH9
ACMP0:
APORT3YCH9
ACMP1:
APORT3YCH9
IDAC0:
APORT1YCH9]
BUSDX [ADC0:
APORT4XCH9
ACMP0:
APORT4XCH9
ACMP1:
APORT4XCH9]
TIM0_CC0 #1
TIM0_CC1 #0
TIM0_CC2 #31
TIM0_CDTI0 #30
TIM0_CDTI1 #29
TIM0_CDTI2 #28
TIM1_CC0 #1
TIM1_CC1 #0
TIM1_CC2 #31
TIM1_CC3 #30 LE-
TIM0_OUT0 #1 LE-
TIM0_OUT1 #0
PCNT0_S0IN #1
PCNT0_S1IN #0
US0_TX #1
US0_RX #0
US0_CLK #31
US0_CS #30
US0_CTS #29
US0_RTS #28
US1_TX #1
US1_RX #0
US1_CLK #31
US1_CS #30
US1_CTS #29
US1_RTS #28
LEU0_TX #1
LEU0_RX #0
I2C0_SDA #1
I2C0_SCL #0
FRC_DCLK #1
FRC_DOUT #0
FRC_DFRAME #31
MODEM_DCLK #1
MODEM_DIN #0
MODEM_DOUT
#31 MO-
DEM_ANT0 #30
MODEM_ANT1
#29
CMU_CLK0 #0
PRS_CH6 #1
PRS_CH7 #0
PRS_CH8 #10
PRS_CH9 #9
ACMP0_O #1
ACMP1_O #1
7 PA2
BUSCX [ADC0:
APORT3XCH10
ACMP0:
APORT3XCH10
ACMP1:
APORT3XCH10
IDAC0:
APORT1XCH10]
BUSDY [ADC0:
APORT4YCH10
ACMP0:
APORT4YCH10
ACMP1:
APORT4YCH10]
TIM0_CC0 #2
TIM0_CC1 #1
TIM0_CC2 #0
TIM0_CDTI0 #31
TIM0_CDTI1 #30
TIM0_CDTI2 #29
TIM1_CC0 #2
TIM1_CC1 #1
TIM1_CC2 #0
TIM1_CC3 #31 LE-
TIM0_OUT0 #2 LE-
TIM0_OUT1 #1
PCNT0_S0IN #2
PCNT0_S1IN #1
US0_TX #2
US0_RX #1
US0_CLK #0
US0_CS #31
US0_CTS #30
US0_RTS #29
US1_TX #2
US1_RX #1
US1_CLK #0
US1_CS #31
US1_CTS #30
US1_RTS #29
LEU0_TX #2
LEU0_RX #1
I2C0_SDA #2
I2C0_SCL #1
FRC_DCLK #2
FRC_DOUT #1
FRC_DFRAME #0
MODEM_DCLK #2
MODEM_DIN #1
MODEM_DOUT #0
MODEM_ANT0
#31 MO-
DEM_ANT1 #30
PRS_CH6 #2
PRS_CH7 #1
PRS_CH8 #0
PRS_CH9 #10
ACMP0_O #2
ACMP1_O #2
ARTIK 030 Mesh Networking Module Data Sheet
Pin Definitions
Samsung ARTIK™ Modules | artik.io Preliminary Rev. 0.5 | 46
ARTIK 030 Pin Alternate Functionality / Description
Pin # Pin Name Analog Timers Communication Radio Other
8 PA3
BUSCY [ADC0:
APORT3YCH11
ACMP0:
APORT3YCH11
ACMP1:
APORT3YCH11
IDAC0:
APORT1YCH11]
BUSDX [ADC0:
APORT4XCH11
ACMP0:
APORT4XCH11
ACMP1:
APORT4XCH11]
TIM0_CC0 #3
TIM0_CC1 #2
TIM0_CC2 #1
TIM0_CDTI0 #0
TIM0_CDTI1 #31
TIM0_CDTI2 #30
TIM1_CC0 #3
TIM1_CC1 #2
TIM1_CC2 #1
TIM1_CC3 #0 LE-
TIM0_OUT0 #3 LE-
TIM0_OUT1 #2
PCNT0_S0IN #3
PCNT0_S1IN #2
US0_TX #3
US0_RX #2
US0_CLK #1
US0_CS #0
US0_CTS #31
US0_RTS #30
US1_TX #3
US1_RX #2
US1_CLK #1
US1_CS #0
US1_CTS #31
US1_RTS #30
LEU0_TX #3
LEU0_RX #2
I2C0_SDA #3
I2C0_SCL #2
FRC_DCLK #3
FRC_DOUT #2
FRC_DFRAME #1
MODEM_DCLK #3
MODEM_DIN #2
MODEM_DOUT #1
MODEM_ANT0 #0
MODEM_ANT1
#31
PRS_CH6 #3
PRS_CH7 #2
PRS_CH8 #1
PRS_CH9 #0
ACMP0_O #3
ACMP1_O #3
GPIO_EM4WU8
9 PA4
BUSCX [ADC0:
APORT3XCH12
ACMP0:
APORT3XCH12
ACMP1:
APORT3XCH12
IDAC0:
APORT1XCH12]
BUSDY [ADC0:
APORT4YCH12
ACMP0:
APORT4YCH12
ACMP1:
APORT4YCH12]
TIM0_CC0 #4
TIM0_CC1 #3
TIM0_CC2 #2
TIM0_CDTI0 #1
TIM0_CDTI1 #0
TIM0_CDTI2 #31
TIM1_CC0 #4
TIM1_CC1 #3
TIM1_CC2 #2
TIM1_CC3 #1 LE-
TIM0_OUT0 #4 LE-
TIM0_OUT1 #3
PCNT0_S0IN #4
PCNT0_S1IN #3
US0_TX #4
US0_RX #3
US0_CLK #2
US0_CS #1
US0_CTS #0
US0_RTS #31
US1_TX #4
US1_RX #3
US1_CLK #2
US1_CS #1
US1_CTS #0
US1_RTS #31
LEU0_TX #4
LEU0_RX #3
I2C0_SDA #4
I2C0_SCL #3
FRC_DCLK #4
FRC_DOUT #3
FRC_DFRAME #2
MODEM_DCLK #4
MODEM_DIN #3
MODEM_DOUT #2
MODEM_ANT0 #1
MODEM_ANT1 #0
PRS_CH6 #4
PRS_CH7 #3
PRS_CH8 #2
PRS_CH9 #1
ACMP0_O #4
ACMP1_O #4
10 PA5
BUSCY [ADC0:
APORT3YCH13
ACMP0:
APORT3YCH13
ACMP1:
APORT3YCH13
IDAC0:
APORT1YCH13]
BUSDX [ADC0:
APORT4XCH13
ACMP0:
APORT4XCH13
ACMP1:
APORT4XCH13]
TIM0_CC0 #5
TIM0_CC1 #4
TIM0_CC2 #3
TIM0_CDTI0 #2
TIM0_CDTI1 #1
TIM0_CDTI2 #0
TIM1_CC0 #5
TIM1_CC1 #4
TIM1_CC2 #3
TIM1_CC3 #2 LE-
TIM0_OUT0 #5 LE-
TIM0_OUT1 #4
PCNT0_S0IN #5
PCNT0_S1IN #4
US0_TX #5
US0_RX #4
US0_CLK #3
US0_CS #2
US0_CTS #1
US0_RTS #0
US1_TX #5
US1_RX #4
US1_CLK #3
US1_CS #2
US1_CTS #1
US1_RTS #0
LEU0_TX #5
LEU0_RX #4
I2C0_SDA #5
I2C0_SCL #4
FRC_DCLK #5
FRC_DOUT #4
FRC_DFRAME #3
MODEM_DCLK #5
MODEM_DIN #4
MODEM_DOUT #3
MODEM_ANT0 #2
MODEM_ANT1 #1
PRS_CH6 #5
PRS_CH7 #4
PRS_CH8 #3
PRS_CH9 #2
ACMP0_O #5
ACMP1_O #5
ARTIK 030 Mesh Networking Module Data Sheet
Pin Definitions
Samsung ARTIK™ Modules | artik.io Preliminary Rev. 0.5 | 47
ARTIK 030 Pin Alternate Functionality / Description
Pin # Pin Name Analog Timers Communication Radio Other
11 PB11
BUSCY [ADC0:
APORT3YCH27
ACMP0:
APORT3YCH27
ACMP1:
APORT3YCH27
IDAC0:
APORT1YCH27]
BUSDX [ADC0:
APORT4XCH27
ACMP0:
APORT4XCH27
ACMP1:
APORT4XCH27]
TIM0_CC0 #6
TIM0_CC1 #5
TIM0_CC2 #4
TIM0_CDTI0 #3
TIM0_CDTI1 #2
TIM0_CDTI2 #1
TIM1_CC0 #6
TIM1_CC1 #5
TIM1_CC2 #4
TIM1_CC3 #3 LE-
TIM0_OUT0 #6 LE-
TIM0_OUT1 #5
PCNT0_S0IN #6
PCNT0_S1IN #5
US0_TX #6
US0_RX #5
US0_CLK #4
US0_CS #3
US0_CTS #2
US0_RTS #1
US1_TX #6
US1_RX #5
US1_CLK #4
US1_CS #3
US1_CTS #2
US1_RTS #1
LEU0_TX #6
LEU0_RX #5
I2C0_SDA #6
I2C0_SCL #5
FRC_DCLK #6
FRC_DOUT #5
FRC_DFRAME #4
MODEM_DCLK #6
MODEM_DIN #5
MODEM_DOUT #4
MODEM_ANT0 #3
MODEM_ANT1 #2
PRS_CH6 #6
PRS_CH7 #5
PRS_CH8 #4
PRS_CH9 #3
ACMP0_O #6
ACMP1_O #6
12 GND Ground
13 PB13
BUSCY [ADC0:
APORT3YCH29
ACMP0:
APORT3YCH29
ACMP1:
APORT3YCH29
IDAC0:
APORT1YCH29]
BUSDX [ADC0:
APORT4XCH29
ACMP0:
APORT4XCH29
ACMP1:
APORT4XCH29]
TIM0_CC0 #8
TIM0_CC1 #7
TIM0_CC2 #6
TIM0_CDTI0 #5
TIM0_CDTI1 #4
TIM0_CDTI2 #3
TIM1_CC0 #8
TIM1_CC1 #7
TIM1_CC2 #6
TIM1_CC3 #5 LE-
TIM0_OUT0 #8 LE-
TIM0_OUT1 #7
PCNT0_S0IN #8
PCNT0_S1IN #7
US0_TX #8
US0_RX #7
US0_CLK #6
US0_CS #5
US0_CTS #4
US0_RTS #3
US1_TX #8
US1_RX #7
US1_CLK #6
US1_CS #5
US1_CTS #4
US1_RTS #3
LEU0_TX #8
LEU0_RX #7
I2C0_SDA #8
I2C0_SCL #7
FRC_DCLK #8
FRC_DOUT #7
FRC_DFRAME #6
MODEM_DCLK #8
MODEM_DIN #7
MODEM_DOUT #6
MODEM_ANT0 #5
MODEM_ANT1 #4
PRS_CH6 #8
PRS_CH7 #7
PRS_CH8 #6
PRS_CH9 #5
ACMP0_O #8
ACMP1_O #8
DBG_SWO #1
GPIO_EM4WU9
14 PC6
BUSAX [ADC0:
APORT1XCH6
ACMP0:
APORT1XCH6
ACMP1:
APORT1XCH6]
BUSBY [ADC0:
APORT2YCH6
ACMP0:
APORT2YCH6
ACMP1:
APORT2YCH6]
TIM0_CC0 #11
TIM0_CC1 #10
TIM0_CC2 #9
TIM0_CDTI0 #8
TIM0_CDTI1 #7
TIM0_CDTI2 #6
TIM1_CC0 #11
TIM1_CC1 #10
TIM1_CC2 #9
TIM1_CC3 #8 LE-
TIM0_OUT0 #11
LETIM0_OUT1 #10
PCNT0_S0IN #11
PCNT0_S1IN #10
US0_TX #11
US0_RX #10
US0_CLK #9
US0_CS #8
US0_CTS #7
US0_RTS #6
US1_TX #11
US1_RX #10
US1_CLK #9
US1_CS #8
US1_CTS #7
US1_RTS #6
LEU0_TX #11
LEU0_RX #10
I2C0_SDA #11
I2C0_SCL #10
FRC_DCLK #11
FRC_DOUT #10
FRC_DFRAME #9
MODEM_DCLK
#11 MODEM_DIN
#10 MO-
DEM_DOUT #9
MODEM_ANT0 #8
MODEM_ANT1 #7
CMU_CLK0 #2
PRS_CH0 #8
PRS_CH9 #11
PRS_CH10 #0
PRS_CH11 #5
ACMP0_O #11
ACMP1_O #11
ARTIK 030 Mesh Networking Module Data Sheet
Pin Definitions
Samsung ARTIK™ Modules | artik.io Preliminary Rev. 0.5 | 48
ARTIK 030 Pin Alternate Functionality / Description
Pin # Pin Name Analog Timers Communication Radio Other
15 PC7
BUSAY [ADC0:
APORT1YCH7
ACMP0:
APORT1YCH7
ACMP1:
APORT1YCH7]
BUSBX [ADC0:
APORT2XCH7
ACMP0:
APORT2XCH7
ACMP1:
APORT2XCH7]
TIM0_CC0 #12
TIM0_CC1 #11
TIM0_CC2 #10
TIM0_CDTI0 #9
TIM0_CDTI1 #8
TIM0_CDTI2 #7
TIM1_CC0 #12
TIM1_CC1 #11
TIM1_CC2 #10
TIM1_CC3 #9 LE-
TIM0_OUT0 #12
LETIM0_OUT1 #11
PCNT0_S0IN #12
PCNT0_S1IN #11
US0_TX #12
US0_RX #11
US0_CLK #10
US0_CS #9
US0_CTS #8
US0_RTS #7
US1_TX #12
US1_RX #11
US1_CLK #10
US1_CS #9
US1_CTS #8
US1_RTS #7
LEU0_TX #12
LEU0_RX #11
I2C0_SDA #12
I2C0_SCL #11
FRC_DCLK #12
FRC_DOUT #11
FRC_DFRAME #10
MODEM_DCLK
#12 MODEM_DIN
#11 MO-
DEM_DOUT #10
MODEM_ANT0 #9
MODEM_ANT1 #8
CMU_CLK1 #2
PRS_CH0 #9
PRS_CH9 #12
PRS_CH10 #1
PRS_CH11 #0
ACMP0_O #12
ACMP1_O #12
16 PC8
BUSAX [ADC0:
APORT1XCH8
ACMP0:
APORT1XCH8
ACMP1:
APORT1XCH8]
BUSBY [ADC0:
APORT2YCH8
ACMP0:
APORT2YCH8
ACMP1:
APORT2YCH8]
TIM0_CC0 #13
TIM0_CC1 #12
TIM0_CC2 #11
TIM0_CDTI0 #10
TIM0_CDTI1 #9
TIM0_CDTI2 #8
TIM1_CC0 #13
TIM1_CC1 #12
TIM1_CC2 #11
TIM1_CC3 #10 LE-
TIM0_OUT0 #13
LETIM0_OUT1 #12
PCNT0_S0IN #13
PCNT0_S1IN #12
US0_TX #13
US0_RX #12
US0_CLK #11
US0_CS #10
US0_CTS #9
US0_RTS #8
US1_TX #13
US1_RX #12
US1_CLK #11
US1_CS #10
US1_CTS #9
US1_RTS #8
LEU0_TX #13
LEU0_RX #12
I2C0_SDA #13
I2C0_SCL #12
FRC_DCLK #13
FRC_DOUT #12
FRC_DFRAME #11
MODEM_DCLK
#13 MODEM_DIN
#12 MO-
DEM_DOUT #11
MODEM_ANT0
#10 MO-
DEM_ANT1 #9
PRS_CH0 #10
PRS_CH9 #13
PRS_CH10 #2
PRS_CH11 #1
ACMP0_O #13
ACMP1_O #13
17 PC9
BUSAY [ADC0:
APORT1YCH9
ACMP0:
APORT1YCH9
ACMP1:
APORT1YCH9]
BUSBX [ADC0:
APORT2XCH9
ACMP0:
APORT2XCH9
ACMP1:
APORT2XCH9]
TIM0_CC0 #14
TIM0_CC1 #13
TIM0_CC2 #12
TIM0_CDTI0 #11
TIM0_CDTI1 #10
TIM0_CDTI2 #9
TIM1_CC0 #14
TIM1_CC1 #13
TIM1_CC2 #12
TIM1_CC3 #11 LE-
TIM0_OUT0 #14
LETIM0_OUT1 #13
PCNT0_S0IN #14
PCNT0_S1IN #13
US0_TX #14
US0_RX #13
US0_CLK #12
US0_CS #11
US0_CTS #10
US0_RTS #9
US1_TX #14
US1_RX #13
US1_CLK #12
US1_CS #11
US1_CTS #10
US1_RTS #9
LEU0_TX #14
LEU0_RX #13
I2C0_SDA #14
I2C0_SCL #13
FRC_DCLK #14
FRC_DOUT #13
FRC_DFRAME #12
MODEM_DCLK
#14 MODEM_DIN
#13 MO-
DEM_DOUT #12
MODEM_ANT0
#11 MO-
DEM_ANT1 #10
PRS_CH0 #11
PRS_CH9 #14
PRS_CH10 #3
PRS_CH11 #2
ACMP0_O #14
ACMP1_O #14
ARTIK 030 Mesh Networking Module Data Sheet
Pin Definitions
Samsung ARTIK™ Modules | artik.io Preliminary Rev. 0.5 | 49
ARTIK 030 Pin Alternate Functionality / Description
Pin # Pin Name Analog Timers Communication Radio Other
18 PC10
BUSAX [ADC0:
APORT1XCH10
ACMP0:
APORT1XCH10
ACMP1:
APORT1XCH10]
BUSBY [ADC0:
APORT2YCH10
ACMP0:
APORT2YCH10
ACMP1:
APORT2YCH10]
TIM0_CC0 #15
TIM0_CC1 #14
TIM0_CC2 #13
TIM0_CDTI0 #12
TIM0_CDTI1 #11
TIM0_CDTI2 #10
TIM1_CC0 #15
TIM1_CC1 #14
TIM1_CC2 #13
TIM1_CC3 #12 LE-
TIM0_OUT0 #15
LETIM0_OUT1 #14
PCNT0_S0IN #15
PCNT0_S1IN #14
US0_TX #15
US0_RX #14
US0_CLK #13
US0_CS #12
US0_CTS #11
US0_RTS #10
US1_TX #15
US1_RX #14
US1_CLK #13
US1_CS #12
US1_CTS #11
US1_RTS #10
LEU0_TX #15
LEU0_RX #14
I2C0_SDA #15
I2C0_SCL #14
FRC_DCLK #15
FRC_DOUT #14
FRC_DFRAME #13
MODEM_DCLK
#15 MODEM_DIN
#14 MO-
DEM_DOUT #13
MODEM_ANT0
#12 MO-
DEM_ANT1 #11
CMU_CLK1 #3
PRS_CH0 #12
PRS_CH9 #15
PRS_CH10 #4
PRS_CH11 #3
ACMP0_O #15
ACMP1_O #15
GPIO_EM4WU12
19 PC11
BUSAY [ADC0:
APORT1YCH11
ACMP0:
APORT1YCH11
ACMP1:
APORT1YCH11]
BUSBX [ADC0:
APORT2XCH11
ACMP0:
APORT2XCH11
ACMP1:
APORT2XCH11]
TIM0_CC0 #16
TIM0_CC1 #15
TIM0_CC2 #14
TIM0_CDTI0 #13
TIM0_CDTI1 #12
TIM0_CDTI2 #11
TIM1_CC0 #16
TIM1_CC1 #15
TIM1_CC2 #14
TIM1_CC3 #13 LE-
TIM0_OUT0 #16
LETIM0_OUT1 #15
PCNT0_S0IN #16
PCNT0_S1IN #15
US0_TX #16
US0_RX #15
US0_CLK #14
US0_CS #13
US0_CTS #12
US0_RTS #11
US1_TX #16
US1_RX #15
US1_CLK #14
US1_CS #13
US1_CTS #12
US1_RTS #11
LEU0_TX #16
LEU0_RX #15
I2C0_SDA #16
I2C0_SCL #15
FRC_DCLK #16
FRC_DOUT #15
FRC_DFRAME #14
MODEM_DCLK
#16 MODEM_DIN
#15 MO-
DEM_DOUT #14
MODEM_ANT0
#13 MO-
DEM_ANT1 #12
CMU_CLK0 #3
PRS_CH0 #13
PRS_CH9 #16
PRS_CH10 #5
PRS_CH11 #4
ACMP0_O #16
ACMP1_O #16
DBG_SWO #3
20 GND Ground
21 PF0
BUSAX [ADC0:
APORT1XCH16
ACMP0:
APORT1XCH16
ACMP1:
APORT1XCH16]
BUSBY [ADC0:
APORT2YCH16
ACMP0:
APORT2YCH16
ACMP1:
APORT2YCH16]
TIM0_CC0 #24
TIM0_CC1 #23
TIM0_CC2 #22
TIM0_CDTI0 #21
TIM0_CDTI1 #20
TIM0_CDTI2 #19
TIM1_CC0 #24
TIM1_CC1 #23
TIM1_CC2 #22
TIM1_CC3 #21 LE-
TIM0_OUT0 #24
LETIM0_OUT1 #23
PCNT0_S0IN #24
PCNT0_S1IN #23
US0_TX #24
US0_RX #23
US0_CLK #22
US0_CS #21
US0_CTS #20
US0_RTS #19
US1_TX #24
US1_RX #23
US1_CLK #22
US1_CS #21
US1_CTS #20
US1_RTS #19
LEU0_TX #24
LEU0_RX #23
I2C0_SDA #24
I2C0_SCL #23
FRC_DCLK #24
FRC_DOUT #23
FRC_DFRAME #22
MODEM_DCLK
#24 MODEM_DIN
#23 MO-
DEM_DOUT #22
MODEM_ANT0
#21 MO-
DEM_ANT1 #20
PRS_CH0 #0
PRS_CH1 #7
PRS_CH2 #6
PRS_CH3 #5
ACMP0_O #24
ACMP1_O #24
DBG_SWCLKTCK
#0
ARTIK 030 Mesh Networking Module Data Sheet
Pin Definitions
Samsung ARTIK™ Modules | artik.io Preliminary Rev. 0.5 | 50
ARTIK 030 Pin Alternate Functionality / Description
Pin # Pin Name Analog Timers Communication Radio Other
22 PF1
BUSAY [ADC0:
APORT1YCH17
ACMP0:
APORT1YCH17
ACMP1:
APORT1YCH17]
BUSBX [ADC0:
APORT2XCH17
ACMP0:
APORT2XCH17
ACMP1:
APORT2XCH17]
TIM0_CC0 #25
TIM0_CC1 #24
TIM0_CC2 #23
TIM0_CDTI0 #22
TIM0_CDTI1 #21
TIM0_CDTI2 #20
TIM1_CC0 #25
TIM1_CC1 #24
TIM1_CC2 #23
TIM1_CC3 #22 LE-
TIM0_OUT0 #25
LETIM0_OUT1 #24
PCNT0_S0IN #25
PCNT0_S1IN #24
US0_TX #25
US0_RX #24
US0_CLK #23
US0_CS #22
US0_CTS #21
US0_RTS #20
US1_TX #25
US1_RX #24
US1_CLK #23
US1_CS #22
US1_CTS #21
US1_RTS #20
LEU0_TX #25
LEU0_RX #24
I2C0_SDA #25
I2C0_SCL #24
FRC_DCLK #25
FRC_DOUT #24
FRC_DFRAME #23
MODEM_DCLK
#25 MODEM_DIN
#24 MO-
DEM_DOUT #23
MODEM_ANT0
#22 MO-
DEM_ANT1 #21
PRS_CH0 #1
PRS_CH1 #0
PRS_CH2 #7
PRS_CH3 #6
ACMP0_O #25
ACMP1_O #25
DBG_SWDIOTMS
#0
23 PF2
BUSAX [ADC0:
APORT1XCH18
ACMP0:
APORT1XCH18
ACMP1:
APORT1XCH18]
BUSBY [ADC0:
APORT2YCH18
ACMP0:
APORT2YCH18
ACMP1:
APORT2YCH18]
TIM0_CC0 #26
TIM0_CC1 #25
TIM0_CC2 #24
TIM0_CDTI0 #23
TIM0_CDTI1 #22
TIM0_CDTI2 #21
TIM1_CC0 #26
TIM1_CC1 #25
TIM1_CC2 #24
TIM1_CC3 #23 LE-
TIM0_OUT0 #26
LETIM0_OUT1 #25
PCNT0_S0IN #26
PCNT0_S1IN #25
US0_TX #26
US0_RX #25
US0_CLK #24
US0_CS #23
US0_CTS #22
US0_RTS #21
US1_TX #26
US1_RX #25
US1_CLK #24
US1_CS #23
US1_CTS #22
US1_RTS #21
LEU0_TX #26
LEU0_RX #25
I2C0_SDA #26
I2C0_SCL #25
FRC_DCLK #26
FRC_DOUT #25
FRC_DFRAME #24
MODEM_DCLK
#26 MODEM_DIN
#25 MO-
DEM_DOUT #24
MODEM_ANT0
#23 MO-
DEM_ANT1 #22
CMU_CLK0 #6
PRS_CH0 #2
PRS_CH1 #1
PRS_CH2 #0
PRS_CH3 #7
ACMP0_O #26
ACMP1_O #26
DBG_TDO #0
DBG_SWO #0
GPIO_EM4WU0
24 PF3
BUSAY [ADC0:
APORT1YCH19
ACMP0:
APORT1YCH19
ACMP1:
APORT1YCH19]
BUSBX [ADC0:
APORT2XCH19
ACMP0:
APORT2XCH19
ACMP1:
APORT2XCH19]
TIM0_CC0 #27
TIM0_CC1 #26
TIM0_CC2 #25
TIM0_CDTI0 #24
TIM0_CDTI1 #23
TIM0_CDTI2 #22
TIM1_CC0 #27
TIM1_CC1 #26
TIM1_CC2 #25
TIM1_CC3 #24 LE-
TIM0_OUT0 #27
LETIM0_OUT1 #26
PCNT0_S0IN #27
PCNT0_S1IN #26
US0_TX #27
US0_RX #26
US0_CLK #25
US0_CS #24
US0_CTS #23
US0_RTS #22
US1_TX #27
US1_RX #26
US1_CLK #25
US1_CS #24
US1_CTS #23
US1_RTS #22
LEU0_TX #27
LEU0_RX #26
I2C0_SDA #27
I2C0_SCL #26
FRC_DCLK #27
FRC_DOUT #26
FRC_DFRAME #25
MODEM_DCLK
#27 MODEM_DIN
#26 MO-
DEM_DOUT #25
MODEM_ANT0
#24 MO-
DEM_ANT1 #23
CMU_CLK1 #6
PRS_CH0 #3
PRS_CH1 #2
PRS_CH2 #1
PRS_CH3 #0
ACMP0_O #27
ACMP1_O #27
DBG_TDI #0
ARTIK 030 Mesh Networking Module Data Sheet
Pin Definitions
Samsung ARTIK™ Modules | artik.io Preliminary Rev. 0.5 | 51
ARTIK 030 Pin Alternate Functionality / Description
Pin # Pin Name Analog Timers Communication Radio Other
25 PF4
BUSAX [ADC0:
APORT1XCH20
ACMP0:
APORT1XCH20
ACMP1:
APORT1XCH20]
BUSBY [ADC0:
APORT2YCH20
ACMP0:
APORT2YCH20
ACMP1:
APORT2YCH20]
TIM0_CC0 #28
TIM0_CC1 #27
TIM0_CC2 #26
TIM0_CDTI0 #25
TIM0_CDTI1 #24
TIM0_CDTI2 #23
TIM1_CC0 #28
TIM1_CC1 #27
TIM1_CC2 #26
TIM1_CC3 #25 LE-
TIM0_OUT0 #28
LETIM0_OUT1 #27
PCNT0_S0IN #28
PCNT0_S1IN #27
US0_TX #28
US0_RX #27
US0_CLK #26
US0_CS #25
US0_CTS #24
US0_RTS #23
US1_TX #28
US1_RX #27
US1_CLK #26
US1_CS #25
US1_CTS #24
US1_RTS #23
LEU0_TX #28
LEU0_RX #27
I2C0_SDA #28
I2C0_SCL #27
FRC_DCLK #28
FRC_DOUT #27
FRC_DFRAME #26
MODEM_DCLK
#28 MODEM_DIN
#27 MO-
DEM_DOUT #26
MODEM_ANT0
#25 MO-
DEM_ANT1 #24
PRS_CH0 #4
PRS_CH1 #3
PRS_CH2 #2
PRS_CH3 #1
ACMP0_O #28
ACMP1_O #28
26 PF5
BUSAY [ADC0:
APORT1YCH21
ACMP0:
APORT1YCH21
ACMP1:
APORT1YCH21]
BUSBX [ADC0:
APORT2XCH21
ACMP0:
APORT2XCH21
ACMP1:
APORT2XCH21]
TIM0_CC0 #29
TIM0_CC1 #28
TIM0_CC2 #27
TIM0_CDTI0 #26
TIM0_CDTI1 #25
TIM0_CDTI2 #24
TIM1_CC0 #29
TIM1_CC1 #28
TIM1_CC2 #27
TIM1_CC3 #26 LE-
TIM0_OUT0 #29
LETIM0_OUT1 #28
PCNT0_S0IN #29
PCNT0_S1IN #28
US0_TX #29
US0_RX #28
US0_CLK #27
US0_CS #26
US0_CTS #25
US0_RTS #24
US1_TX #29
US1_RX #28
US1_CLK #27
US1_CS #26
US1_CTS #25
US1_RTS #24
LEU0_TX #29
LEU0_RX #28
I2C0_SDA #29
I2C0_SCL #28
FRC_DCLK #29
FRC_DOUT #28
FRC_DFRAME #27
MODEM_DCLK
#29 MODEM_DIN
#28 MO-
DEM_DOUT #27
MODEM_ANT0
#26 MO-
DEM_ANT1 #25
PRS_CH0 #5
PRS_CH1 #4
PRS_CH2 #3
PRS_CH3 #2
ACMP0_O #29
ACMP1_O #29
27 PF6
BUSAX [ADC0:
APORT1XCH22
ACMP0:
APORT1XCH22
ACMP1:
APORT1XCH22]
BUSBY [ADC0:
APORT2YCH22
ACMP0:
APORT2YCH22
ACMP1:
APORT2YCH22]
TIM0_CC0 #30
TIM0_CC1 #29
TIM0_CC2 #28
TIM0_CDTI0 #27
TIM0_CDTI1 #26
TIM0_CDTI2 #25
TIM1_CC0 #30
TIM1_CC1 #29
TIM1_CC2 #28
TIM1_CC3 #27 LE-
TIM0_OUT0 #30
LETIM0_OUT1 #29
PCNT0_S0IN #30
PCNT0_S1IN #29
US0_TX #30
US0_RX #29
US0_CLK #28
US0_CS #27
US0_CTS #26
US0_RTS #25
US1_TX #30
US1_RX #29
US1_CLK #28
US1_CS #27
US1_CTS #26
US1_RTS #25
LEU0_TX #30
LEU0_RX #29
I2C0_SDA #30
I2C0_SCL #29
FRC_DCLK #30
FRC_DOUT #29
FRC_DFRAME #28
MODEM_DCLK
#30 MODEM_DIN
#29 MO-
DEM_DOUT #28
MODEM_ANT0
#27 MO-
DEM_ANT1 #26
CMU_CLK1 #7
PRS_CH0 #6
PRS_CH1 #5
PRS_CH2 #4
PRS_CH3 #3
ACMP0_O #30
ACMP1_O #30
ARTIK 030 Mesh Networking Module Data Sheet
Pin Definitions
Samsung ARTIK™ Modules | artik.io Preliminary Rev. 0.5 | 52
ARTIK 030 Pin Alternate Functionality / Description
Pin # Pin Name Analog Timers Communication Radio Other
28 PF7
BUSAY [ADC0:
APORT1YCH23
ACMP0:
APORT1YCH23
ACMP1:
APORT1YCH23]
BUSBX [ADC0:
APORT2XCH23
ACMP0:
APORT2XCH23
ACMP1:
APORT2XCH23]
TIM0_CC0 #31
TIM0_CC1 #30
TIM0_CC2 #29
TIM0_CDTI0 #28
TIM0_CDTI1 #27
TIM0_CDTI2 #26
TIM1_CC0 #31
TIM1_CC1 #30
TIM1_CC2 #29
TIM1_CC3 #28 LE-
TIM0_OUT0 #31
LETIM0_OUT1 #30
PCNT0_S0IN #31
PCNT0_S1IN #30
US0_TX #31
US0_RX #30
US0_CLK #29
US0_CS #28
US0_CTS #27
US0_RTS #26
US1_TX #31
US1_RX #30
US1_CLK #29
US1_CS #28
US1_CTS #27
US1_RTS #26
LEU0_TX #31
LEU0_RX #30
I2C0_SDA #31
I2C0_SCL #30
FRC_DCLK #31
FRC_DOUT #30
FRC_DFRAME #29
MODEM_DCLK
#31 MODEM_DIN
#30 MO-
DEM_DOUT #29
MODEM_ANT0
#28 MO-
DEM_ANT1 #27
CMU_CLK0 #7
PRS_CH0 #7
PRS_CH1 #6
PRS_CH2 #5
PRS_CH3 #4
ACMP0_O #31
ACMP1_O #31
GPIO_EM4WU1
29 VDD Module power supply
30 RESETn Reset input, active low.To apply an external reset source to this pin, it is required to only drive this pin low
during reset, and let the internal pull-up ensure that reset is released.
31 GND Ground
8.1.1 GPIO Overview
The GPIO pins are organized as 16-bit ports indicated by letters A through F, and the individual pins on each port are indicated by a
number from 15 down to 0.
Table 8.2. GPIO Pinout
Port Pin
15
Pin
14
Pin
13
Pin
12
Pin
11
Pin
10
Pin 9 Pin 8 Pin 7 Pin 6 Pin 5 Pin 4 Pin 3 Pin 2 Pin 1 Pin 0
Port A ----------PA5
(5V)
PA4
(5V)
PA3
(5V)
PA2
(5V) PA1 PA0
Port B PB13
(5V)
PB11
(5V) -----------
Port C ----PC11
(5V)
PC10
(5V)
PC9
(5V)
PC8
(5V)
PC7
(5V)
PC6
(5V) ------
Port D PD15
(5V)
PD14
(5V)
PD13
(5V) ----------
Port E ----------------
Port F --------PF7
(5V)
PF6
(5V)
PF5
(5V)
PF4
(5V)
PF3
(5V)
PF2
(5V)
PF1
(5V)
PF0
(5V)
Note:
1. GPIO with 5V tolerance are indicated by (5V).
2. The pins PA4, PA3, PA2, PB13, PB11, PD15, PD14, and PD13 will not be 5V tolerant on all future devices. In order to preserve
upgrade options with full hardware compatibility, do not use these pins on 5V domains.
ARTIK 030 Mesh Networking Module Data Sheet
Pin Definitions
Samsung ARTIK™ Modules | artik.io Preliminary Rev. 0.5 | 53
8.2 Alternate Functionality Pinout
A wide selection of alternate functionality is available for multiplexing to various pins. The following table shows the name of the alter-
nate functionality in the first column, followed by columns showing the possible LOCATION bitfield settings.
Note: Some functionality, such as analog interfaces, do not have alternate settings or a LOCATION bitfield. In these cases, the pinout
is shown in the column corresponding to LOCATION 0.
Table 8.3. Alternate Functionality Overview
Alternate LOCATION
Functionality 0 - 3 4 - 7 8 - 11 12 - 15 16 - 19 20 - 23 24 - 27 28 - 31 Description
ACMP0_O 0: PA0
1: PA1 6: PB11 8: PB13 15: PC10 16: PC11
21: PD13
22: PD14
23: PD15
24: PF0
25: PF1
26: PF2
27: PF3
Analog comparator
ACMP0, digital out-
put.
ACMP1_O 0: PA0
1: PA1 6: PB11 8: PB13 15: PC10 16: PC11
21: PD13
22: PD14
23: PD15
24: PF0
25: PF1
26: PF2
27: PF3
Analog comparator
ACMP1, digital out-
put.
ADC0_EXTN
0: PA0 Analog to digital
converter ADC0 ex-
ternal reference in-
put negative pin
ADC0_EXTP
0: PA1 Analog to digital
converter ADC0 ex-
ternal reference in-
put positive pin
CMU_CLK0 0: PA1
3: PC11
5: PD14
6: PF2
Clock Management
Unit, clock output
number 0.
CMU_CLK1 0: PA0
3: PC10
5: PD15
6: PF3
Clock Management
Unit, clock output
number 1.
DBG_SWCLKTCK
0: PF0
Debug-interface
Serial Wire clock
input and JTAG
Test Clock.
Note that this func-
tion is enabled to
the pin out of reset,
and has a built-in
pull down.
DBG_SWDIOTMS
0: PF1
Debug-interface
Serial Wire data in-
put / output and
JTAG Test Mode
Select.
Note that this func-
tion is enabled to
the pin out of reset,
and has a built-in
pull up.
ARTIK 030 Mesh Networking Module Data Sheet
Pin Definitions
Samsung ARTIK™ Modules | artik.io Preliminary Rev. 0.5 | 54
Alternate LOCATION
Functionality 0 - 3 4 - 7 8 - 11 12 - 15 16 - 19 20 - 23 24 - 27 28 - 31 Description
DBG_SWO
0: PF2
1: PB13
2: PD15
3: PC11
Debug-interface
Serial Wire viewer
Output.
Note that this func-
tion is not enabled
after reset, and
must be enabled by
software to be
used.
DBG_TDI
0: PF3
Debug-interface
JTAG Test Data In.
Note that this func-
tion is enabled to
pin out of reset,
and has a built-in
pull up.
DBG_TDO
0: PF2
Debug-interface
JTAG Test Data
Out.
Note that this func-
tion is enabled to
pin out of reset.
FRC_DCLK 0: PA0
1: PA1 6: PB11 8: PB13 15: PC10 16: PC11
21: PD13
22: PD14
23: PD15
24: PF0
25: PF1
26: PF2
27: PF3
Frame Controller,
Data Sniffer Clock.
FRC_DFRAME 4: PB11
6: PB13
13: PC10
14: PC11 19: PD13
20: PD14
21: PD15
22: PF0
23: PF1
24: PF2
25: PF3
30: PA0
31: PA1
Frame Controller,
Data Sniffer Frame
active
FRC_DOUT 0: PA1 5: PB11
7: PB13
14: PC10
15: PC11
20: PD13
21: PD14
22: PD15
23: PF0
24: PF1
25: PF2
26: PF3
31: PA0
Frame Controller,
Data Sniffer Out-
put.
GPIO_EM4WU0
0: PF2 Pin can be used to
wake the system
up from EM4
GPIO_EM4WU1
Pin can be used to
wake the system
up from EM4
GPIO_EM4WU4
0: PD14 Pin can be used to
wake the system
up from EM4
GPIO_EM4WU8
Pin can be used to
wake the system
up from EM4
ARTIK 030 Mesh Networking Module Data Sheet
Pin Definitions
Samsung ARTIK™ Modules | artik.io Preliminary Rev. 0.5 | 55
Alternate LOCATION
Functionality 0 - 3 4 - 7 8 - 11 12 - 15 16 - 19 20 - 23 24 - 27 28 - 31 Description
GPIO_EM4WU9
0: PB13 Pin can be used to
wake the system
up from EM4
GPIO_EM4WU12
0: PC10 Pin can be used to
wake the system
up from EM4
I2C0_SCL 0: PA1 5: PB11
7: PB13
14: PC10
15: PC11
20: PD13
21: PD14
22: PD15
23: PF0
24: PF1
25: PF2
26: PF3
31: PA0 I2C0 Serial Clock
Line input / output.
I2C0_SDA 0: PA0
1: PA1 6: PB11 8: PB13 15: PC10 16: PC11 21: PD13
22: PD14
23: PD15
24: PF0
25: PF1
26: PF2
27: PF3
I2C0 Serial Data in-
put / output.
LETIM0_OUT0 0: PA0
1: PA1 6: PB11 8: PB13 15: PC10 16: PC11
21: PD13
22: PD14
23: PD15
24: PF0
25: PF1
26: PF2
27: PF3
Low Energy Timer
LETIM0, output
channel 0.
LETIM0_OUT1
0: PA1
5: PB11
7: PB13
14: PC10
15: PC11
20: PD13
21: PD14
22: PD15
23: PF0
24: PF1
25: PF2
26: PF3 31: PA0
Low Energy Timer
LETIM0, output
channel 1.
LEU0_RX
0: PA1
5: PB11
7: PB13
14: PC10
15: PC11
20: PD13
21: PD14
22: PD15
23: PF0
24: PF1
25: PF2
26: PF3 31: PA0 LEUART0 Receive
input.
LEU0_TX
0: PA0
1: PA1
6: PB11
8: PB13 15: PC10 16: PC11 21: PD13
22: PD14
23: PD15
24: PF0
25: PF1
26: PF2
27: PF3
LEUART0 Transmit
output. Also used
as receive input in
half duplex commu-
nication.
MODEM_DCLK
0: PA0
1: PA1 6: PB11 8: PB13
15: PC10
16: PC11 21: PD13
22: PD14
23: PD15
24: PF0
25: PF1
26: PF2
27: PF3
MODEM data clock
out.
MODEM_DIN
0: PA1
5: PB11
7: PB13
14: PC10
15: PC11
20: PD13
21: PD14
22: PD15
23: PF0
24: PF1
25: PF2
26: PF3 31: PA0 MODEM data in.
MODEM_DOUT 4: PB11
6: PB13
13: PC10
14: PC11 19: PD13
20: PD14
21: PD15
22: PF0
23: PF1
24: PF2
25: PF3 30: PA0
31: PA1 MODEM data out.
PCNT0_S0IN
0: PA0
1: PA1
6: PB11
8: PB13 15: PC10 16: PC11 21: PD13
22: PD14
23: PD15
24: PF0
25: PF1
26: PF2
27: PF3
Pulse Counter
PCNT0 input num-
ber 0.
PCNT0_S1IN
0: PA1
5: PB11
7: PB13
14: PC10
15: PC11
20: PD13
21: PD14
22: PD15
23: PF0
24: PF1
25: PF2
26: PF3 31: PA0
Pulse Counter
PCNT0 input num-
ber 1.
ARTIK 030 Mesh Networking Module Data Sheet
Pin Definitions
Samsung ARTIK™ Modules | artik.io Preliminary Rev. 0.5 | 56
Alternate LOCATION
Functionality 0 - 3 4 - 7 8 - 11 12 - 15 16 - 19 20 - 23 24 - 27 28 - 31 Description
PRS_CH0
0: PF0
1: PF1
2: PF2
3: PF3
12: PC10
13: PC11 Peripheral Reflex
System PRS, chan-
nel 0.
PRS_CH1
0: PF1
1: PF2
2: PF3
7: PF0
Peripheral Reflex
System PRS, chan-
nel 1.
PRS_CH2
0: PF2
1: PF3
6: PF0
7: PF1
Peripheral Reflex
System PRS, chan-
nel 2.
PRS_CH3
0: PF3
5: PF0
6: PF1
7: PF2
12: PD13
13: PD14
14: PD15
Peripheral Reflex
System PRS, chan-
nel 3.
PRS_CH4
4: PD13
5: PD14
6: PD15
Peripheral Reflex
System PRS, chan-
nel 4.
PRS_CH5
3: PD13
4: PD14
5: PD15 Peripheral Reflex
System PRS, chan-
nel 5.
PRS_CH6
0: PA0
1: PA1
6: PB11
8: PB13 15: PD13
16: PD14
17: PD15 Peripheral Reflex
System PRS, chan-
nel 6.
PRS_CH7
0: PA1
5: PB11
7: PB13 10: PA0
Peripheral Reflex
System PRS, chan-
nel 7.
PRS_CH8
4: PB11
6: PB13 9: PA0
10: PA1
Peripheral Reflex
System PRS, chan-
nel 8.
PRS_CH9 3: PB11 5: PB13 8: PA0
9: PA1 15: PC10 16: PC11
Peripheral Reflex
System PRS, chan-
nel 9.
PRS_CH10 4: PC10
5: PC11
Peripheral Reflex
System PRS, chan-
nel 10.
PRS_CH11 3: PC10 4: PC11
Peripheral Reflex
System PRS, chan-
nel 11.
TIM0_CC0 0: PA0
1: PA1 6: PB11
8: PB13 15: PC10 16: PC11
21: PD13
22: PD14
23: PD15
24: PF0
25: PF1
26: PF2
27: PF3
Timer 0 Capture
Compare input /
output channel 0.
ARTIK 030 Mesh Networking Module Data Sheet
Pin Definitions
Samsung ARTIK™ Modules | artik.io Preliminary Rev. 0.5 | 57
Alternate LOCATION
Functionality 0 - 3 4 - 7 8 - 11 12 - 15 16 - 19 20 - 23 24 - 27 28 - 31 Description
TIM0_CC1 0: PA1 5: PB11
7: PB13
14: PC10
15: PC11
20: PD13
21: PD14
22: PD15
23: PF0
24: PF1
25: PF2
26: PF3 31: PA0
Timer 0 Capture
Compare input /
output channel 1.
TIM0_CC2
4: PB11
6: PB13 13: PC10
14: PC11 19: PD13
20: PD14
21: PD15
22: PF0
23: PF1
24: PF2
25: PF3 30: PA0
31: PA1
Timer 0 Capture
Compare input /
output channel 2.
TIM0_CDTI0 3: PB11 5: PB13 12: PC10
13: PC11
18: PD13
19: PD14
20: PD15
21: PF0
22: PF1
23: PF2
24: PF3 29: PA0
30: PA1
Timer 0 Compli-
mentary Dead Time
Insertion channel 0.
TIM0_CDTI1
2: PB11
4: PB13
11: PC10 12: PC11 17: PD13
18: PD14
19: PD15
20: PF0
21: PF1
22: PF2
23: PF3
28: PA0
29: PA1
Timer 0 Compli-
mentary Dead Time
Insertion channel 1.
TIM0_CDTI2 1: PB11
3: PB13
10: PC10
11: PC11
16: PD13
17: PD14
18: PD15
19: PF0
20: PF1
21: PF2
22: PF3 27: PA0 28: PA1
Timer 0 Compli-
mentary Dead Time
Insertion channel 2.
TIM1_CC0 0: PA0
1: PA1 6: PB11 8: PB13
15: PC10
16: PC11
21: PD13
22: PD14
23: PD15
24: PF0
25: PF1
26: PF2
27: PF3
Timer 1 Capture
Compare input /
output channel 0.
TIM1_CC1 0: PA1 5: PB11
7: PB13 14: PC10
15: PC11
20: PD13
21: PD14
22: PD15
23: PF0
24: PF1
25: PF2
26: PF3 31: PA0
Timer 1 Capture
Compare input /
output channel 1.
TIM1_CC2
4: PB11
6: PB13 13: PC10
14: PC11
19: PD13
20: PD14
21: PD15
22: PF0
23: PF1
24: PF2
25: PF3
30: PA0
31: PA1
Timer 1 Capture
Compare input /
output channel 2.
TIM1_CC3 3: PB11
5: PB13 12: PC10
13: PC11
18: PD13
19: PD14
20: PD15
21: PF0
22: PF1
23: PF2
24: PF3 29: PA0
30: PA1
Timer 1 Capture
Compare input /
output channel 3.
US0_CLK
4: PB11
6: PB13 13: PC10
14: PC11 19: PD13
20: PD14
21: PD15
22: PF0
23: PF1
24: PF2
25: PF3 30: PA0
31: PA1
USART0 clock in-
put / output.
US0_CS 3: PB11 5: PB13 12: PC10
13: PC11
18: PD13
19: PD14
20: PD15
21: PF0
22: PF1
23: PF2
24: PF3 29: PA0
30: PA1
USART0 chip se-
lect input / output.
US0_CTS
2: PB11
4: PB13 11: PC10 12: PC11
17: PD13
18: PD14
19: PD15
20: PF0
21: PF1
22: PF2
23: PF3
28: PA0
29: PA1
USART0 Clear To
Send hardware
flow control input.
US0_RTS 1: PB11
3: PB13
10: PC10
11: PC11
16: PD13
17: PD14
18: PD15
19: PF0
20: PF1
21: PF2
22: PF3 27: PA0 28: PA1
USART0 Request
To Send hardware
flow control output.
ARTIK 030 Mesh Networking Module Data Sheet
Pin Definitions
Samsung ARTIK™ Modules | artik.io Preliminary Rev. 0.5 | 58
Alternate LOCATION
Functionality 0 - 3 4 - 7 8 - 11 12 - 15 16 - 19 20 - 23 24 - 27 28 - 31 Description
US0_RX 0: PA1 5: PB11
7: PB13
14: PC10
15: PC11
20: PD13
21: PD14
22: PD15
23: PF0
24: PF1
25: PF2
26: PF3 31: PA0
USART0 Asynchro-
nous Receive.
USART0 Synchro-
nous mode Master
Input / Slave Out-
put (MISO).
US0_TX
0: PA0
1: PA1
6: PB11
8: PB13 15: PC10 16: PC11
21: PD13
22: PD14
23: PD15
24: PF0
25: PF1
26: PF2
27: PF3
USART0 Asynchro-
nous Transmit. Al-
so used as receive
input in half duplex
communication.
USART0 Synchro-
nous mode Master
Output / Slave In-
put (MOSI).
US1_CLK
4: PB11
6: PB13 13: PC10
14: PC11 19: PD13
20: PD14
21: PD15
22: PF0
23: PF1
24: PF2
25: PF3 30: PA0
31: PA1
USART1 clock in-
put / output.
US1_CS 3: PB11 5: PB13
12: PC10
13: PC11
18: PD13
19: PD14
20: PD15
21: PF0
22: PF1
23: PF2
24: PF3 29: PA0
30: PA1
USART1 chip se-
lect input / output.
US1_CTS
2: PB11
4: PB13 11: PC10 12: PC11
17: PD13
18: PD14
19: PD15
20: PF0
21: PF1
22: PF2
23: PF3
28: PA0
29: PA1
USART1 Clear To
Send hardware
flow control input.
US1_RTS 1: PB11
3: PB13 10: PC10
11: PC11
16: PD13
17: PD14
18: PD15
19: PF0
20: PF1
21: PF2
22: PF3 27: PA0 28: PA1
USART1 Request
To Send hardware
flow control output.
US1_RX
0: PA1
5: PB11
7: PB13
14: PC10
15: PC11
20: PD13
21: PD14
22: PD15
23: PF0
24: PF1
25: PF2
26: PF3 31: PA0
USART1 Asynchro-
nous Receive.
USART1 Synchro-
nous mode Master
Input / Slave Out-
put (MISO).
US1_TX 0: PA0
1: PA1 6: PB11 8: PB13 15: PC10 16: PC11
21: PD13
22: PD14
23: PD15
24: PF0
25: PF1
26: PF2
27: PF3
USART1 Asynchro-
nous Transmit. Al-
so used as receive
input in half duplex
communication.
USART1 Synchro-
nous mode Master
Output / Slave In-
put (MOSI).
ARTIK 030 Mesh Networking Module Data Sheet
Pin Definitions
Samsung ARTIK™ Modules | artik.io Preliminary Rev. 0.5 | 59
8.3 Analog Port (APORT)
The Analog Port (APORT) is an infrastructure used to connect chip pins with on-chip analog clients such as analog comparators, ADCs,
and DACs. The APORT consists of wires, switches, and control needed to configurably implement the routes. Please see the device
Reference Manual for a complete description.
PC6 BUSAX
PC8
PC10
PF0
PF2
PF4
PF6
BUSBY
PC7 BUSAY
PC9
PC11
PF1
PF3
PF5
PF7
BUSBX
BUSCX
PD14
PA0
PA2
PA4
BUSDY
BUSCY
PD13
PD15
PA1
PA3
PA5
PB11
PB13
BUSDX
ACMP0
1X1Y2X2Y3X3Y4X4Y
ACMP1
1X1Y2X2Y3X3Y4X4Y
ADC0
1X1Y2X2Y3X3Y4X4Y
IDAC0
1X1Y
Figure 8.2. ARTIK 030 APORT
ARTIK 030 Mesh Networking Module Data Sheet
Pin Definitions
Samsung ARTIK™ Modules | artik.io Preliminary Rev. 0.5 | 60
Table 8.4. APORT Client Map
Analog Module Analog Module Channel Shared Bus Pin
ACMP0 APORT1XCH6 BUSAX PC6
APORT1XCH8 PC8
APORT1XCH10 PC10
APORT1XCH16 PF0
APORT1XCH18 PF2
APORT1XCH20 PF4
APORT1XCH22 PF6
ACMP0 APORT1YCH7 BUSAY PC7
APORT1YCH9 PC9
APORT1YCH11 PC11
APORT1YCH17 PF1
APORT1YCH19 PF3
APORT1YCH21 PF5
APORT1YCH23 PF7
ACMP0 APORT2XCH7 BUSBX PC7
APORT2XCH9 PC9
APORT2XCH11 PC11
APORT2XCH17 PF1
APORT2XCH19 PF3
APORT2XCH21 PF5
APORT2XCH23 PF7
ACMP0 APORT2YCH6 BUSBY PC6
APORT2YCH8 PC8
APORT2YCH10 PC10
APORT2YCH16 PF0
APORT2YCH18 PF2
APORT2YCH20 PF4
APORT2YCH22 PF6
ARTIK 030 Mesh Networking Module Data Sheet
Pin Definitions
Samsung ARTIK™ Modules | artik.io Preliminary Rev. 0.5 | 61
Analog Module Analog Module Channel Shared Bus Pin
ACMP0 APORT3XCH2 BUSCX
APORT3XCH4
APORT3XCH6 PD14
APORT3XCH8 PA0
APORT3XCH10 PA2
APORT3XCH12 PA4
APORT3XCH28
APORT3XCH30
ACMP0 APORT3YCH3 BUSCY
APORT3YCH5 PD13
APORT3YCH7 PD15
APORT3YCH9 PA1
APORT3YCH11 PA3
APORT3YCH13 PA5
APORT3YCH27 PB11
APORT3YCH29 PB13
APORT3YCH31
ACMP0 APORT4XCH3 BUSDX
APORT4XCH5 PD13
APORT4XCH7 PD15
APORT4XCH9 PA1
APORT4XCH11 PA3
APORT4XCH13 PA5
APORT4XCH27 PB11
APORT4XCH29 PB13
APORT4XCH31
ACMP0 APORT4YCH2 BUSDY
APORT4YCH4
APORT4YCH6 PD14
APORT4YCH8 PA0
APORT4YCH10 PA2
APORT4YCH12 PA4
APORT4YCH28
APORT4YCH30
ARTIK 030 Mesh Networking Module Data Sheet
Pin Definitions
Samsung ARTIK™ Modules | artik.io Preliminary Rev. 0.5 | 62
Analog Module Analog Module Channel Shared Bus Pin
ACMP1 APORT1XCH6 BUSAX PC6
APORT1XCH8 PC8
APORT1XCH10 PC10
APORT1XCH16 PF0
APORT1XCH18 PF2
APORT1XCH20 PF4
APORT1XCH22 PF6
ACMP1 APORT1YCH7 BUSAY PC7
APORT1YCH9 PC9
APORT1YCH11 PC11
APORT1YCH17 PF1
APORT1YCH19 PF3
APORT1YCH21 PF5
APORT1YCH23 PF7
ACMP1 APORT2XCH7 BUSBX PC7
APORT2XCH9 PC9
APORT2XCH11 PC11
APORT2XCH17 PF1
APORT2XCH19 PF3
APORT2XCH21 PF5
APORT2XCH23 PF7
ACMP1 APORT2YCH6 BUSBY PC6
APORT2YCH8 PC8
APORT2YCH10 PC10
APORT2YCH16 PF0
APORT2YCH18 PF2
APORT2YCH20 PF4
APORT2YCH22 PF6
ACMP1 APORT3XCH2 BUSCX
APORT3XCH4
APORT3XCH6 PD14
APORT3XCH8 PA0
APORT3XCH10 PA2
APORT3XCH12 PA4
APORT3XCH28
APORT3XCH30
ARTIK 030 Mesh Networking Module Data Sheet
Pin Definitions
Samsung ARTIK™ Modules | artik.io Preliminary Rev. 0.5 | 63
Analog Module Analog Module Channel Shared Bus Pin
ACMP1 APORT3YCH3 BUSCY
APORT3YCH5 PD13
APORT3YCH7 PD15
APORT3YCH9 PA1
APORT3YCH11 PA3
APORT3YCH13 PA5
APORT3YCH27 PB11
APORT3YCH29 PB13
APORT3YCH31
ACMP1 APORT4XCH3 BUSDX
APORT4XCH5 PD13
APORT4XCH7 PD15
APORT4XCH9 PA1
APORT4XCH11 PA3
APORT4XCH13 PA5
APORT4XCH27 PB11
APORT4XCH29 PB13
APORT4XCH31
ACMP1 APORT4YCH2 BUSDY
APORT4YCH4
APORT4YCH6 PD14
APORT4YCH8 PA0
APORT4YCH10 PA2
APORT4YCH12 PA4
APORT4YCH28
APORT4YCH30
ADC0 APORT1XCH6 BUSAX PC6
APORT1XCH8 PC8
APORT1XCH10 PC10
APORT1XCH16 PF0
APORT1XCH18 PF2
APORT1XCH20 PF4
APORT1XCH22 PF6
ARTIK 030 Mesh Networking Module Data Sheet
Pin Definitions
Samsung ARTIK™ Modules | artik.io Preliminary Rev. 0.5 | 64
Analog Module Analog Module Channel Shared Bus Pin
ADC0 APORT1YCH7 BUSAY PC7
APORT1YCH9 PC9
APORT1YCH11 PC11
APORT1YCH17 PF1
APORT1YCH19 PF3
APORT1YCH21 PF5
APORT1YCH23 PF7
ADC0 APORT2XCH7 BUSBX PC7
APORT2XCH9 PC9
APORT2XCH11 PC11
APORT2XCH17 PF1
APORT2XCH19 PF3
APORT2XCH21 PF5
APORT2XCH23 PF7
ADC0 APORT2YCH6 BUSBY PC6
APORT2YCH8 PC8
APORT2YCH10 PC10
APORT2YCH16 PF0
APORT2YCH18 PF2
APORT2YCH20 PF4
APORT2YCH22 PF6
ADC0 APORT3XCH2 BUSCX
APORT3XCH4
APORT3XCH6 PD14
APORT3XCH8 PA0
APORT3XCH10 PA2
APORT3XCH12 PA4
APORT3XCH28
APORT3XCH30
ARTIK 030 Mesh Networking Module Data Sheet
Pin Definitions
Samsung ARTIK™ Modules | artik.io Preliminary Rev. 0.5 | 65
Analog Module Analog Module Channel Shared Bus Pin
ADC0 APORT3YCH3 BUSCY
APORT3YCH5 PD13
APORT3YCH7 PD15
APORT3YCH9 PA1
APORT3YCH11 PA3
APORT3YCH13 PA5
APORT3YCH27 PB11
APORT3YCH29 PB13
APORT3YCH31
ADC0 APORT4XCH3 BUSDX
APORT4XCH5 PD13
APORT4XCH7 PD15
APORT4XCH9 PA1
APORT4XCH11 PA3
APORT4XCH13 PA5
APORT4XCH27 PB11
APORT4XCH29 PB13
APORT4XCH31
ADC0 APORT4YCH2 BUSDY
APORT4YCH4
APORT4YCH6 PD14
APORT4YCH8 PA0
APORT4YCH10 PA2
APORT4YCH12 PA4
APORT4YCH28
APORT4YCH30
IDAC0 APORT1XCH2 BUSCX
APORT1XCH4
APORT1XCH6 PD14
APORT1XCH8 PA0
APORT1XCH10 PA2
APORT1XCH12 PA4
APORT1XCH28
APORT1XCH30
ARTIK 030 Mesh Networking Module Data Sheet
Pin Definitions
Samsung ARTIK™ Modules | artik.io Preliminary Rev. 0.5 | 66
Analog Module Analog Module Channel Shared Bus Pin
IDAC0 APORT1YCH3 BUSCY
APORT1YCH5 PD13
APORT1YCH7 PD15
APORT1YCH9 PA1
APORT1YCH11 PA3
APORT1YCH13 PA5
APORT1YCH27 PB11
APORT1YCH29 PB13
APORT1YCH31
ARTIK 030 Mesh Networking Module Data Sheet
Pin Definitions
Samsung ARTIK™ Modules | artik.io Preliminary Rev. 0.5 | 67
9. Package Specifications
9.1 ARTIK 030 Dimensions
Figure 9.1. ARTIK 030A Package Dimensions
9.2 ARTIK 030 Module Footprint
The figure below shows the Module footprint and PCB dimensions.
Figure 9.2. ARTIK 030 Footprint
ARTIK 030 Mesh Networking Module Data Sheet
Package Specifications
Samsung ARTIK™ Modules | artik.io Preliminary Rev. 0.5 | 68
9.3 ARTIK 030 Recommended PCB Land Pattern
The figure below shows the recommended land pattern.
Figure 9.3. ARTIK 030 Recommended PCB Land Pattern
ARTIK 030 Mesh Networking Module Data Sheet
Package Specifications
Samsung ARTIK™ Modules | artik.io Preliminary Rev. 0.5 | 69
9.4 ARTIK 030 Package Marking
The figure below shows the Module markings printed on the RF-shield.
Figure 9.4. ARTIK 030 Package Marking
Mark Method: Laser
Shield Size:
X x Y
10.75 x 11.70 mm
Font Size: 0.70 mm Left-Justified
Space between lines : 0.40 mm
Distance from edge of
package:
1.00 mm
Line 1 Logo(HXW) :
4.00 x 3.5mm
TM font: 0.45mm
Line 2 Marking Module Name ARTIK-030-A-V1
Line 3 Marking: Model Name Model: ARTIK-030-A
ARTIK 030 Mesh Networking Module Data Sheet
Package Specifications
Samsung ARTIK™ Modules | artik.io Preliminary Rev. 0.5 | 70
Line 4 Marking: YWWRVMTT YY -Last digit of Year (e.g.: 6 for 2016)
WW - Work Week (01-53)
R - Major Revision (fixed character 1-9, A-Z, assigned by Silicon Labs)
1. Increment for major changes. Use QS7110-Product Change Action Board as guid-
ance
2. Supplier initiated changes reviewed /managed by SLI CAB (W7111F2- Change Ma-
trix for Suppliers)
V - Minor Revision (fixed character 1-9, A-Z, assigned by Silicon Labs)
M - Contract Manufacturer Site assigned by Silicon Labs
TT - Unique Batch ID assigned by CM (2 characters A-Z)
ARTIK 030 Mesh Networking Module Data Sheet
Package Specifications
Samsung ARTIK™ Modules | artik.io Preliminary Rev. 0.5 | 71
10. Tape and Reel Specifications
10.1 Tape and Reel Packaging
This section contains information regarding the tape and reel packaging for the ARTIK 030.
10.2 Reel Material and Dimensions
Reel material: Polystyrene (PS)
Reel diameter: 13 inches (330 mm)
Number of modules per reel: 1000 pcs
Disk deformation, folding whitening and mold imperfections: Not allowed
Disk set: consists of two 13 inch (330 mm) rotary round disks and one central axis (100 mm)
Antistatic treatment: Required
Surface resistivity: 104 - 109 Ω/sq.
Figure 10.1. Reel Dimensions - Side View
Symbol Dimensions [mm]
W0 32.5 ± 0.3
W1 37.1 ± 1.0
ARTIK 030 Mesh Networking Module Data Sheet
Tape and Reel Specifications
Samsung ARTIK™ Modules | artik.io Preliminary Rev. 0.5 | 72
10.3 Module Orientation and Tape Feed
The user direction of feed, start and end of tape on reel and orientation of the Modules on the tape are shown in the figures below.
Figure 10.2. Module Orientation and Feed Direction
ARTIK 030 Mesh Networking Module Data Sheet
Tape and Reel Specifications
Samsung ARTIK™ Modules | artik.io Preliminary Rev. 0.5 | 73
10.4 Tape and Reel Box Dimensions
Figure 10.3. Tape and Reel Box Dimensions
Symbol Dimensions [mm]
W2368
W3338
W472
10.5 Moisture Sensitivity Level
Reels are delivered in packing which conforms to MSL3 (Moisture Sensitivity Level 3) requirements.
ARTIK 030 Mesh Networking Module Data Sheet
Tape and Reel Specifications
Samsung ARTIK™ Modules | artik.io Preliminary Rev. 0.5 | 74
11. Certifications
Certifications are ongoing for ARTIK 030. For a complete list of planned certifications and timelines, please contact your sales team.
ARTIK 030 Mesh Networking Module Data Sheet
Certifications
Samsung ARTIK™ Modules | artik.io Preliminary Rev. 0.5 | 75
12. Revision History
12.1 Revision 0.5
Initial Publication
ARTIK 030 Mesh Networking Module Data Sheet
Revision History
Samsung ARTIK™ Modules | artik.io Preliminary Rev. 0.5 | 76
Legal Information
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH THE SAMSUNG ARTIK™ DEVELOPMENT KIT AND ALL RELATED PRODUCTS, UPDATES, AND
DOCUMENTATION (HEREINAFTER “SAMSUNG PRODUCTS”). NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY
RIGHTS IS GRANTED BY THIS DOCUMENT. THE LICENSE AND OTHER TERMS AND CONDITIONS RELATED TO YOUR USE OF THE SAMSUNG PRODUCTS ARE GOVERNED
EXCLUSIVELY BY THE SAMSUNG ARTIK™ DEVELOPER LICENSE AGREEMENT THAT YOU AGREED TO WHEN YOU REGISTERED AS A DEVELOPER TO RECEIVE THE
SAMSUNG PRODUCTS. EXCEPT AS PROVIDED IN THE SAMSUNG ARTIK™ DEVELOPER LICENSE AGREEMENT, SAMSUNG ELECTRONICS CO., LTD. AND ITS AFFILIATES
(COLLECTIVELY, “SAMSUNG”) AND ITS SUPPLIERS ASSUME NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION CONSEQUENTIAL OR INCIDENTAL DAMAGES,
AND SAMSUNG DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, ARISING OUT OF OR RELATED TO YOUR SALE, APPLICATION AND/OR USE OF SAMSUNG PRODUCTS
INCLUDING LIABILITY OR WARRANTIES RELATED TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR
OTHER INTELLECTUAL PROPERTY RIGHT.
SAMSUNG RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION, DOCUMENTATION AND SPECIFICATIONS WITHOUT NOTICE. THIS INCLUDES MAKING
CHANGES TO THIS DOCUMENTATION AT ANY TIME WITHOUT PRIOR NOTICE. CHARACTERIZATION DATA, AVAILABLE MODULES AND PERIPHERALS, MEMORY SIZES AND
MEMORY ADDRESSES REFER TO EACH SPECIFIC DEVICE, AND "TYPICAL" PARAMETERS PROVIDED CAN AND DO VARY IN DIFFERENT APPLICATIONS. THIS
DOCUMENTATION IS PROVIDED FOR REFERENCE PURPOSES ONLY, AND ALL INFORMATION DISCUSSED HEREIN IS PROVIDED ON AN “AS IS” BASIS, WITHOUT
WARRANTIES OF ANY KIND. SAMSUNG AND ITS SUPPLIERS ASSUME NO RESPONSIBILITY FOR POSSIBLE ERRORS OR OMISSIONS, OR FOR ANY CONSEQUENCES FROM
THE USE OF THE DOCUMENTATION CONTAINED HEREIN.
Samsung Products are not intended for use in medical, life support, critical care, safety equipment, or similar applications where product failure could result in loss of life or personal or
physical harm, or any military or defense application, or any governmental procurement to which special terms or provisions may apply. Samsung Products shall under no circumstances
be used in weapons of mass destruction including (but not limited to) nuclear, biological or chemical weapons, or missiles capable of delivering such weapons.
This document and all information discussed herein remain the sole and exclusive property of Samsung. All brand names, trademarks and registered trademarks belong to their respective
owners. For updates or additional information about Samsung ARTIK™, contact the Samsung ARTIK™ team via the Samsung ARTIK™ website at www.artik.io. Silicon Laboratories
Inc.®, Silicon Labs®, SiLabs®, Simplicity Studio™, EFR32™, LEUART™ and others are trademarks or registered trademarks of Silicon Laboratories Inc. ARM and Cortex-M4 are
trademarks or registered trademarks of ARM Holdings.
Copyright © 2016 Samsung Electronics Co., Ltd.
All rights reserved. No part of this publication may be reproduced, stored in a retrieval system, or transmitted in any form or by any means, electric or mechanical, by photocopying,
recording, or otherwise, without the prior written consent of Samsung Electronics.
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