7
1
2
3
45
6
8
NC
ANODE
CATHODE
NC GND
V
CC
V
O
NC
SHIELD
TRUTH TABLE
(POSITIVE LOGIC)
LED
ON
OFF
V
O
HIGH
LOW
Description
The ACPL-4800 fast speed optocoupler contains a
GaAsP LED and photo detector with built-in
Schmitt trigger to provide logic-compatible
waveforms, eliminating the need for additional
wave shaping. The totem pole output eliminates
the need for a pull up resistor and allows for direct
drive Intelligent Power Module or gate drive.
Functional Diagram
Features
••
••
•Performance Specified for Fast IPM Applications over
Industrial Temperature Range: -40°C to 100°C
••
••
•Wide Operating VCC Range: 4.5 to 20 Volts
••
••
•Typical Propagation Delays 150 ns
••
••
•Minimized Pulse Width Distortion
PWD = 250 ns
••
••
•Propagation Delay Difference
Min. –100 ns, Max. 250 ns
••
••
•30 kV/µµ
µµ
µs Minimum Common Mode Transient
Immunity at VCM = 1000 V
••
••
•Hysteresis
••
••
•Totem Pole Output (No Pull-up Resistor Required)
••
••
•Safety Approval:
Pending for UL 1577, 3750 Vrms / 1 minute
Pending for CSA File CA88324, Notice #5
Pending for IEC/EN/DIN EN 60747-5-2, VIORM = 630
Vpeak
Applications
••
••
•IPM Interface Isolation
••
••
•Isolated IGBT/MOSFET Gate Drive
••
••
•AC and Brushless DC Servo Motor Drives
••
••
•Low Power Inverters
••
••
•General Digital Isolation
Note: The connection of a 0.1 µF bypass capacitor
between pins 5 & 8 is recommended.
ACPL-4800
High CMR Intelligent Power Module and Gate Drive Interface Optocoupler
Datasheet
2
ACPL-4800-XXX
060 = IEC/EN/DIN EN 60747-5-2 Option
300 = Gull Wing Lead Option
500 = Tape and Reel Packaging Option
XXXE = Lead-Free Option
Schematic
Package Outline Drawings
DIP-8 Package
I
F
SHIELD
V
F
V
CC
V
O
GND
I
CC
I
O
+
-
2
3
8
5
6
1.080 ± 0.320
(0.043 ± 0.013) 2.54 ± 0.25
(0.100 ± 0.010)
0.51 (0.020) MIN.
0.65 (0.025) MAX.
4.70 (0.185) MAX.
2.92 (0.115) MIN.
5˚ TYP. 0.254 + 0.076
- 0.051
(0.010 + 0.003)
- 0.002)
7.62 ± 0.25
(0.300 ± 0.010)
6.35 ± 0.25
(0.250 ± 0.010)
9.65 ± 0.25
(0.380 ± 0.010)
1.78 (0.070) MAX.
1.19 (0.047) MAX.
A XXXXZ
YYWW
DATE CODE
DIMENSIONS IN MILLIMETERS AND (INCHES).
5678
4321
OPTION CODE*
UL
RECOGNITION
UR
TYPE NUMBER
* MARKING CODE LETTER FOR OPTION NUMBERS
"V" = OPTION 060
OPTION NUMBERS 300 AND 500 NOT MARKED.
3.56 ± 0.13
(0.140 ± 0.005)
Option data sheets are available. Contact Avago
sales representative or authorized distributor for
information.
Ordering Information
Specify Part Number followed by Option Number
(if desired).
Example:
3
0.635 ± 0.25
(0.025 ± 0.010) 12˚ NOM.
9.65 ± 0.25
(0.380 ± 0.010)
0.635 ± 0.130
(0.025 ± 0.005)
7.62 ± 0.25
(0.300 ± 0.010)
5
6
7
8
4
3
2
1
9.65 ± 0.25
(0.380 ± 0.010)
6.350 ± 0.25
(0.250 ± 0.010)
1.016 (0.040)
1.27 (0.050)
10.9 (0.430)
2.0 (0.080)
LAND PATTERN RECOMMENDATION
1.080 ± 0.320
(0.043 ± 0.013)
3.56 ± 0.13
(0.140 ± 0.005)
1.780
(0.070)
MAX.
1.19
(0.047)
MAX.
2.54
(0.100)
BSC
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
0.254 + 0.076
- 0.051
(0.010 + 0.003)
- 0.002)
DIP-8 Package with Gull Wing Surface Mount Option 300
4
Solder Reflow Temperature Profile (Gull Wing Surface Mount Option 300 Parts)
Note: Use of non-chlorine-activated fluxes is highly recommended
0
TIME (SECONDS)
TEMPERATURE (˚C)
200
100
50 150100 200 250
300
0
30
SEC.
50 SEC.
30
SEC.
160˚C
140˚C
150˚C
PEAK
TEMP.
245˚C
PEAK
TEMP.
240¡C PEAK
TEMP.
230˚C
SOLDERING
TIME
200˚C
PREHEATING TIME
150˚C, 90 + 30 SEC.
2.5˚C ± 0.5˚C/SEC.
3˚C + 1˚C/-0.5˚C
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
PREHEATING RATE 3˚C + 1˚C/-0.5˚C/SEC.
REFLOW HEATING RATE 2.5˚C ± 0.5˚C/SEC.
Recommended Pb-Free IR Profile
217˚C
RAMP-DOWN
6˚C/SEC. MAX.
RAMP-UP
3˚C/SEC. MAX.
150 - 200 ˚C
260 +0/-5˚C
t 25˚C to PEAK
60 to 150 SEC.
20-40 SEC.
TIME WITHIN 5˚C of ACTUAL
PEAK TEMPERATURE
tp
t
s
PREHEAT
60 to 180 SEC.
t
L
T
L
T
smax
T
smin
25
T
p
TIME (SECONDS)
TEMPERATURE (˚C)
NOTES:
THE TIME FROM 25 C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
smax
= 200˚C, T
smin
= 150˚C
5
Table 3. IEC/EN/DIN EN 60747-5-2 Insulation Characteristics (Option 060)
Description Symbol Characteristic Unit
Installation classification per DIN VDE 0110/1.89, Table 1
for rated mains voltage ≤ 300 Vrms I-IV
for rated mains voltage ≤ 450 Vrms I-III
Climatic Classification 55/85/21
Pollution Degree (DIN VDE 0110/1.89) 2
Maximum Working Insulation Voltage VIORM 630 Vpeak
Input to Output Test Voltage, Method b*
VIORM x 1.875=VPR,100% Production Test with tm=1 sec, Partial discharge < 5 pC
VPR 1181 Vpeak
Input to Output Test Voltage, Method a*
VIORM x 1.5=VPR, Type and Sample Test, tm=60 sec, Partial discharge < 5 pC
VPR 945 Vpeak
Highest Allowable Over-voltage
(Transient Over-voltage tini = 10 sec)
VIOTM 6000 Vpeak
Safety-limiting values - maximum values allowed in the event of a failure.
Case Temperature TS175 °C
Input Current IS, INPUT 230 mA
Output Power (refer to Thermal Derating Curve) PS, OUTPUT 600 mW
Insulation Resistance at TS, VIO = 500 V RS>109 Ω
* Refer to the optocoupler section of the Isolation and Control Components Designer’s Catalog, under Product Safety Regulations section, (IEC/EN/
DIN EN 60747-5-2) for a detailed description of Method a and Method b partial discharge test profiles.
Note:
Isolation characteristics are guaranteed only within the safety maximum ratings which must be ensured by protective circuits in application.
Table 2. Insulation and Safety Related Specifications
Parameter Symbol 8-Pin DIP Unit Conditions
Minimum External
Air Gap
(External Clearance)
L(101) 7.1 mm Measured from input terminals to output terminals,
shortest distance through air.
Minimum External
Tracking
(External Creepage)
L(102) 7.4 mm Measured from input terminals to output terminals,
shortest distance path along body.
Minimum Internal
Plastic Gap
(Internal Clearance)
0.08 Through insulation distance, conductor to conductor,
usually the direct distance between the photo emitter
and photo detector inside the optocoupler cavity.
Minimum Internal
Tracking
(Internal Creepage)
NA mm Measured from input terminals to output terminals,
along internal cavity.
Tracking Resistance
(Comparative Tracking Index)
CTI 200 mm DIN IEC 112/VDE 0303 Part 1
Isolation Group IIIa Material Group (DIN VDE 0110, 1/89, Table 1)
Option 300 - surface mount classification is Class A in accordance with CECC 00802.
6
Table 4. Absolute Maximum Rating
Parameter Symbol Min. Max. Units Note
Storage Temperature TS-55 125 °C
Operating Temperature TA-40 100 °C
Average Forward Input Current IF(AVG) 10 mA
Peak Transient Input Current IF(TRAN)
( ≤1 µs Pulse Width, 300 pps) 1.0 A
( ≤200 µs Pulse Width, < 1% Duty Cycle) 40 mA
Reverse Input Voltage VR5V
Average Output Current IO25 mA
Supply Voltage VCC 025V
Output Voltage VO-0.5 25 V
Total Package Power Dissipation PT210 mW 1
Lead Solder Temperature (Through Hole Parts Only) 260 °C for 10 sec., 1.6 mm below seating plane
Solder Reflow Temperature Profile (Surface Mount Parts Only) See Package Outline Drawings section
Table 5. Recommended Operating Conditions
Parameter Symbol Min. Max. Units
Power Supply Voltage VCC 4.5 20 V
Forward Input Current (ON) IF(ON) 6 10 mA
Forward Input Voltage (OFF) VF(OFF) - 0.8 V
Operating Temperature TA-40 100 C
OUTPUT POWER - P
S
, INPUT CURRENT - I
S
0
0
T
A
- CASE TEMPERATURE - oC
20050
400
12525 75 100 150
600
800
200
100
300
500
700
175
P
S
(mW)
I
S
(mA)
Thermal Derating Curve
7
Table 6. Electrical Specification
-40°C ≤ TA ≤ 100°C, 4.5V ≤ VCC ≤ 20V, 6mA ≤ IF(ON) ≤ 10 mA, 0V ≤ VF(OFF) ≤ 0.8 V, unless otherwise specified.
All Typicals at TA = 25°C. See Note 7.
Parameter Sym. Min. Typ. Max. Units Test Conditions Fig. Note
Logic Low Output Voltage VOL 0.5 V IOL = 6.4 mA 1,3
Logic High Output Voltage VOH 2.4 VCC - 1.1V V IOH = -2.6 mA 2,3,7
2.7 IOH = -0.4 mA
Output Leakage Current
(VOUT = VCC+0.5V)
IOHH 100 µAVcc = 5 V IF = 10mA
500 Vcc = 20 V
Logic Low Supply Current ICCL 1.9 3.0 mA Vcc = 5.5 V VF = 0 V
IO = Open
2.0 3.0 Vcc = 20 V
Logic High Supply Current ICCH 1.5 2.5 mA Vcc = 5.5 V IF = 10 mA
IO = Open
1.6 2.5 Vcc = 20 V
Logic Low Short Circuit
Output Current
IOSL 25 mA VO = Vcc = 5.5 V VF=0V 2
50 VO = Vcc = 20 V
Logic High Short Circuit
Output Current
IOSH -25 mA VCC = 5.5 V IF=6mA
VO=GND
2
-50 VCC = 20 V
Input Forward Voltage VF1.5 1.7 V TA = 25 C IF=6mA 4
1.85
Input Reverse Breakdown
Voltage
BVR5VI
R = 10 µA
Input Diode Temperature
Coefficient
DVF
DTA
-1.7 mV/°C IF = 6 mA
Input Capacitance CIN 60 pF f = 1 MHz, VF = 0 V 3
8
Table 7. Switching Specifications (AC)
-40°C ≤ TA ≤ 100°C, 4.5V ≤ VCC ≤ 20V, 6mA ≤ IF(ON) ≤ 10 mA, 0V ≤ VF(OFF) ≤ 0.8V.
All Typicals at TA = 25°C, IF(ON) = 6 mA unless otherwise specified.
Parameter Sym. Min. Typ. Max. Units Test Conditions Fig. Note
Propagation Delay Time to
Logic Low Output Leve
tPHL 150 350 ns With Peaking Capacitor 5,6 5
Propagation Delay Time to
Logic High Output Level
tPLH 110 350 ns With Peaking Capacitor 5,6 5
Pulse Width Distortion PWD 250 ns | tPHL - tPLH | 8
Propagation Delay
Difference Between Any 2
Parts
PDD -100 250 ns 10
Output Rise Time (10-90%) tr16 ns 5,8
Output Fall Time (90-10%) tf20 ns 5,8
Logic High Common Mode
Transient Immunity
|CMH| -30000 V/µs|V
CM| = 1000 V, IF = 6.0 mA,
VCC = 5 V, TA = 25 C
96
Logic Low Common Mode
Transient Immunity
|CML| 30000 V/µs|V
CM| = 1000 V, VF = 0 V,
VCC = 5 V, TA = 25 C
96
Table 8.Package Characteristics
Notes:
1. Derate total package power dissipation, PT, linearly above 70°C free-air temperature at a rate of 4.5 mW/°C.
2. Duration of output short circuit time should not exceed 10 ms.
3. Input capacitance is measured between pin 2 and pin 3.
4. Device considered a two-terminal device: pins 1, 2, 3, and 4 shorted together and pins 5, 6, 7, and 8 shorted together.
5. The tPLH propagation delay is measured from the 50% point on the leading edge of the input pulse to the 1.3 V point on the leading edge of the output
pulse. The tPHL propagation delay is measured from the 50% point on the trailing edge of the input pulse to the 1.3 V point on the trailing edge of the
output pulse.
6. CMH is the maximum slew rate of the common mode voltage that can be sustained with the output voltage in the logic high state, VO > 2.0 V. CML is
the maximum slew rate of the common mode voltage that can be sustained with the output voltage in the logic low state, VO < 0.8 V.
7. In accordance with UL 1577, each optocoupler is proof tested by applying an insulation test voltage ³ 4200 V rms for one second (leakage detection
current limit, II-O ≤ 5 mA). This test is performed before the 100% production test for partial discharge (Method b) shown in the IEC/EN/DIN EN
60747-5-2 Insulation Characteristics Table, if applicable.
8. Pulse Width Distortion (PWD) is defined as |tPHL - tPLH | for any given device.
9. Use of a 0.1 µF bypass capacitor connected between pins 5 and 8 is recommended.
10. The difference between tPLH and tPHL between any two devices under the same test condition.
Parameter Sym. Min. Typ. Max. Units Test Conditions Fig. Note
Input-Output Momentary
Withstand Voltage*
VISO 3750 Vrms RH < 50%, t = 1 min.
TA = 25°C
4,7
Input-Output Resistance RI-O 1012 ΩVI-O = 500 Vdc 4
Input-Output Capacitance CI-O 0.6 pF f = 1 MHz, VI-O = 0 Vdc 4
9
Figure 5. Circuit for tPLH,tPHL,tr,tf
7
1
45
6
8
GND
V
CC
5 V
619 Ω
INPUT
MONITORING
NODE
PULSE GEN.
t
r
= t
f =
5 ns
f = 100 kHz
10 % DUTY
CYCLE
V
O
= 5 V
Z
O
= 50
C
2
=
15 pF
OUTPUT V
O
MONITORING
NODE
V
CC
R
1
D
1
D
2
5 k Ω
D
3
D
4
2
3
C
1
=
120 pF
*
Figure 1. Typical Logic Low Output Voltage vs. Temputer Figure 2. Typical Logic High Output Current vs. Temputer
Figure 3. Typical Output Voltage vs. Forward Input Current Figure 4. Typical Input Diode Forward Characteristic
0.1
0.11
0.12
0.13
0.14
0.15
-50 0 50 100 150
V
OL
- LOW LEVEL OUTPUT VOLTAGE - V
T
A
- TEMPERATURE - ˚C
V
CC
= 4.5/20V
V
F
= 0V
I
O
= 6.4mA
V
CC
= 4.5V
V
CC
= 20V
-25
-20
-15
-10
-5
0
-50 0 50 100 150
TA - TEMPERATURE - ˚C
IOH - HIGH LEVEL OUTPUT CURRENT - mA
VCC = 4.5V
IF = 6mA
VO = 2.4V
VO = 2.7V
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
012345
I
F
- INPUT CURRENT - mA
Vo - OUTPUT VOLTAGE - V
I
O
= -2.6mA
T
A
= 25C
V
CC
= 4.5V
I
O
= 6.4mA
I
F
- FORWARD CURRENT - mA
1.1
0.001
V
F
- FORWARD VOLTAGE - V
1.0
1000
1.3
0.01
1.51.2 1.4
0.1
T
A
= 25 ˚C
10
100 I
F
+
-
V
F
THE PROBE AND JIG CAPACITANCES
ARE INCLUDED IN C1 AND C2.
R
1
I
F
(ON)
1.10 k
Ω
3 mA
681
Ω
5 mA
ALL DIODES ARE 1N916 OR 1N3064.
I
F
(ON)
50 % I
F
(ON)
0 mA
t
PLH
t
PHL
V
OH
1.3 VV
OL
INPUT I
F
OUTPUT V
O
* 0.1 µF BYPASS Ñ SEE NOTE 9.
330
Ω
10 mA
10
Figure 6. Typical Propagation Delays vs.Temperature. Figure 7. Typical Logic High Output Voltage vs. Supply Voltage
Figure 8. Typical Propogation Delats vs. Supply Voltage
50
70
90
110
130
150
170
190
210
230
-60 -40 -20 0 20 40 60 80 100 120
T
A
- TEMPERATURE - C
Tp - PROPAGATION DELAY - ns
Tplh
V
CC
= 20V
I
F
= 10mA
Tphl
0
5
10
15
20
25
0 5 10 15 20 25
V
CC
- SUPPLY VOLTAGE - V
Vo - OUTPUT VOLTAGE - V
T
A
= 25
o
C
I
O
= -2.6mA
0
20
40
60
80
100
120
140
160
180
200
0 5 10 15 20 25
V
CC
- SUPPLY VOLTAGE - V
T
P
- PROPAGTION DELAY - ns
Tphl
I
F
(mA)
10
6
Tplh
I
F
(mA)
6
10
T
A
= 25
o
C
Figure 9. Test Circuit for Common Mode Transient Immunity and Typical Waveforms
V
CM
(PEAK)
OUTPUT V
O
0 V
V
OH
|V
CM
|
V
OL
V
O
(MAX.)*
V
O
(MIN.)*
SWITCH AT A: I
F
= 5 mA**
SWITCH AT B: V
F
= 0 V
7
1
45
6
8
0.1 µF
BYPASS
OUTPUT V
O
MONITORING
NODE
V
CC
R
IN
2
3
V
FF
A
B
-+
V
CM
PULSE GENERATOR
-
+
11
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Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Pte. in the United States and other countries.
Data subject to change. Copyright © 2006 Avago Technologies Pte. All rights reserved. Obsoletes 5989-4496EN
5989-4685EN - January9, 2006