10/29/2017 DDR4 SODIMM 260P 9.2H STD: 2309413-1 DDR4 DIMM | TE Connectivity TE Connectivity: Every Connection Counts (c) 2017 TE Connectivity Ltd. family of companies. All Rights Reserved Connectors Card Edge Connectors & Sockets Memory Sockets SO DIMM TE CONNECTIVITY (TE) - DDR4 DIMM | DDR4 DIMM DDR4 SODIMM 260P 9.2H STD ACTIVE 2309413-1 TE Internal Number: 2309413-1 Get Sample Compatible Parts & Tooling Add to List Documents Features Compliance Similar Products PRODUCT DRAWING 3D PDF English DOCUMENTATION FEATURES Please review product documents or contact us for the latest agency approval information. Please Note: Use the Product Drawing for all design activity. http://www.te.com/usa-en/product-2309413-1.html#pdp-docs-features 1/3 10/29/2017 DDR4 SODIMM 260P 9.2H STD: 2309413-1 DDR4 DIMM | TE Connectivity Product Type Features DRAM Type Small Outline (SO) Connector System Cable-to-Board Profile High Row-to-Row Spacing 8.2 mm [ .322 in ] Sealable No Connector & Contact Terminates To Printed Circuit Board Center Post Without Product Type Socket Configuration Features Module Orientation Right Angle Number of Positions 260 Number of Rows 2 Keying Standard Number of Keys 1 Center Key Offset Left Electrical Characteristics DRAM Voltage (V) 1.2 Signal Characteristics SGRAM Voltage (V) 1.2 Body Features Ejector Type Locking Module Key Type Offset Left Retention Post Location Both Ends Latch Material High Temperature Thermoplastic Ejector Location Both Ends Retention Post Material Stainless Steel Contact Features Solder Tail Contact Plating Material Gold Flash over Nickel Contact Mating Area Plating Material Gold Flash Contact Current Rating (Max) (A) .5 Contact Base Material Copper Alloy Socket Type Memory Card Socket Style SO DIMM Termination Features Insertion Style Cam-In http://www.te.com/usa-en/product-2309413-1.html#pdp-docs-features 2/3 10/29/2017 DDR4 SODIMM 260P 9.2H STD: 2309413-1 DDR4 DIMM | TE Connectivity Mechanical Attachment PCB Mounting Style Surface Mount Connector Mounting Type Board Mount PCB Mount Retention With PCB Mount Retention Type Solder Peg Housing Features Centerline (Pitch) (mm) .5, 7.3 Centerline (Pitch) (in) .0197 Housing Material High Temperature Thermoplastic Housing Color Black Dimensions Stack Height 9.2 mm [ .362 in ] Usage Conditions Operating Temperature Range -55 - 85 C [ -67 - 185 F ] Operation/Application Circuit Application Power Industry Standards UL Flammability Rating UL 94V-0 Packaging Features Packaging Method Tape & Reel Packaging Quantity 500 PRODUCT COMPLIANCE Compatible Products Contact Product Support Also in the Series | DDR4 DIMM DIMM Sockets (71) SO DIMM Sockets (40) http://www.te.com/usa-en/product-2309413-1.html#pdp-docs-features 3/3