PMBT2222A,235 - NXP - Datasheet.Live

1. Product profile

1.1 General description

NPN switching transistors in a small SOT23 (TO-236 AB) Surface- Mounted Device ( SMD)

plastic package.

1.2 Features and benefits

High current (max. 600 mA)

Low voltage (max. 40 V)

1.3 Applications

Switching and linear amplification

1.4 Quick reference data

[1] Pulse test: tp≤300 μs; δ≤0.02.

PMBT2222; PMBT2222A

NPN switching transistors

Rev. 6 — 12 November 2010 Product data sheet

Table 1. Product overview

Type number Package PNP complement

NXP JEDEC

PMBT2222 SOT23 TO-236AB PMBT2907

PMBT2222A PMBT2907A

Table 2. Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

VCEO collector-emitter voltage open base

PMBT2222 - - 30 V

PMBT2222A - - 40 V

ICcollector current - - 600 mA

hFE DC current gai n VCE =10V;

IC= 150 mA [1] 100 - 300

PMBT2222 VCE =10V;

IC= 500 mA [1] 30 - -

PMBT2222A VCE =10V;

IC= 500 mA [1] 40 - -

Product data sheet Rev. 6 — 12 November 2010 2 of 12

NXP Semiconductors PMBT2222; PMBT2222A

NPN switching transistors

2. Pinning information

3. Ordering information

4. Marking

[1] * = placeholder for manufacturing site code

Table 3. Pinning

Pin Description Simplified outline Graphic symbol

1base

2emitter

3 collector

sym02

Table 4. Ordering information

Type number Package

Name Description Version

PMBT2222 - plastic surface-mounted package; 3 leads SOT23

PMBT2222A

Table 5. Marking codes

Type number Marking code[1]

PMBT2222 *1B

PMBT2222A *1P

Product data sheet Rev. 6 — 12 November 2010 3 of 12

NXP Semiconductors PMBT2222; PMBT2222A

NPN switching transistors

5. Limiting values

[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard

footprint.

6. Thermal characteristics

[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

Table 6. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

VCBO collector-base voltage open emitter

PMBT2222 - 60 V

PMBT2222A - 75 V

VCEO collector-emitter voltage open base

PMBT2222 - 30 V

PMBT2222A - 40 V

VEBO emitter-base voltage open collector

PMBT2222 - 5 V

PMBT2222A - 6 V

ICcollector current - 600 mA

ICM peak collector current - 800 mA

IBM peak base current - 200 mA

Ptot total power dissipation Tamb ≤25 °C[1] -250mW

Tjjunction temperature - 150 °C

Tamb ambient temperature −65 +150 °C

Tstg storage temperature −65 +150 °C

Table 7. Thermal characteris tics

Symbol Parameter Conditions Min Typ Max Unit

Rth(j-a) thermal resistance from

junction to ambient in free air [1] --500K/W

Product data sheet Rev. 6 — 12 November 2010 4 of 12

NXP Semiconductors PMBT2222; PMBT2222A

NPN switching transistors

7. Characteristics

Table 8. Characteristics

Tj=25

C unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

ICBO collector -base cut-off

current

PMBT2222 VCB =50V; I

E=0A - - 10 nA

VCB =50V; I

E=0A;

Tj= 125 °C--10μA

collector -base cut-off

current

PMBT2222A VCB =60V; I

E=0A - - 10 nA

VCB =60V; I

E=0A;

Tj= 125 °C--10μA

IEBO emitter-base cut-off

current VEB =5V; I

C=0A - - 10 nA

hFE DC current gai n VCE =10V;

IC=0.1mA 35

VCE =10V;

IC=1mA 50 - -

VCE =10V;

IC=10mA 75 - -

VCE =10V;

IC=10mA;

Tamb =−55 °C

35 - -

VCE =10V;

IC= 150 mA [1] 100 - 300

VCE =1V;

IC= 150 mA [1] 50 - -

DC current gai n VCE =10V;

IC= 500 mA [1]

PMBT2222 30 - -

PMBT2222A 40 - -

VCEsat collector-emitter

saturation voltage IC= 150 mA;

IB=15mA [1]

PMBT2222 - - 400 mV

PMBT2222A - - 300 mV

collector-emitter

saturation voltage IC= 500 mA;

IB=50mA [1]

PMBT2222 - - 1.6 V

PMBT2222A - - 1 V

Product data sheet Rev. 6 — 12 November 2010 5 of 12

NXP Semiconductors PMBT2222; PMBT2222A

NPN switching transistors

[1] Pulse test: tp≤300 μs; δ≤0.02.

VBEsat base-emitter saturation

voltage IC= 150 mA;

IB=15mA [1]

PMBT2222 - - 1.3 V

PMBT2222A 0.6 - 1.2 V

base-emitter saturation

voltage IC= 500 mA;

IB=50mA [1]

PMBT2222 - - 2.6 V

PMBT2222A - - 2 V

Cccollector capacitance VCB =10V;

IE=i

e=0A;

f=1MHz

--8pF

Ceemitter capacitance VEB =500mV;

IC=i

c=0A;

f=1MHz

PMBT2222 - - 30 pF

PMBT2222A - - 25 pF

fTtransition frequency VCE =20V;

IC=20mA;

f = 100 MHz

PMBT2222 250 - - MHz

PMBT2222A 300 - - MHz

NF noise figure VCE =5V;

IC= 100 μA;

RS=1kΩ;

f=1kHz

--4dB

tddelay time VCC =10V;

IC= 150 mA;

IBon =15mA;

IBoff =−15 mA

--15ns

trrise time - - 20 ns

ton turn-on time - - 35 ns

tsstorage time - - 200 ns

tffall time - - 60 ns

toff turn-off time - - 250 ns

Table 8. Characteristics …continued

Tj=25

C unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

Product data sheet Rev. 6 — 12 November 2010 6 of 12

NXP Semiconductors PMBT2222; PMBT2222A

NPN switching transistors

8. Test information

8.1 Quality information

This product has been qualified in accordance with the Automotive Electronics Council

(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is

suitable for use in auto motive applications.

Fig 1. Switching time definition

VCC =10V; I

C=150mA; I

Bon =15mA; I

Boff =−15 mA

Fig 2. Test circuit for switching times

006aaa003

IBon (100 %)

input pulse

(idealized waveform)

IBoff

90 %

10 %

IC (100 %)

ton

90 %

10 %

output pulse

(idealized waveform)

toff

DUT

mlb826

(probe)

450 Ω

(probe)

450 Ω

oscilloscope oscilloscope

VBB

VCC

Product data sheet Rev. 6 — 12 November 2010 7 of 12

NXP Semiconductors PMBT2222; PMBT2222A

NPN switching transistors

9. Package outline

10. Packing information

[1] For further information and the availability of packing methods, see Section 14.

Fig 3. Package outline SOT23 (TO-236AB)

04-11-04Dimensions in mm

0.45

0.15

1.9

1.1

0.9

3.0

2.8

2.5

2.1

1.4

1.2

0.48

0.38

0.15

0.09

Table 9. Packing methods

The indicated -xxx are the last thre e digits of the 12NC ordering code.[1]

Type number Package Description Packing quantity

3000 10000

PMBT2222 SOT23 4 mm pitch, 8 mm tape and reel -215 -235

PMBT2222A

Product data sheet Rev. 6 — 12 November 2010 8 of 12

NXP Semiconductors PMBT2222; PMBT2222A

NPN switching transistors

11. Soldering

Fig 4. Reflow solde ring footprint SOT23 (TO-2 36 AB)

Fig 5. Wave soldering footprint SOT23 (TO-236AB)

solder lands

solder resist

occupied area

solder paste

sot023_

0.5

(3×)

0.6

(3×)

0.6

(3×)

0.7

(3×)

3.3

2.9

1.7

1.9

Dimensions in mm

solder lands

solder resist

occupied area

preferred transport direction during soldering

sot023_

2.8

4.5

1.4

4.6

1.4

(2×)

1.2

(2×)

2.2

2.6

Dimensions in mm

Product data sheet Rev. 6 — 12 November 2010 9 of 12

NXP Semiconductors PMBT2222; PMBT2222A

NPN switching transistors

12. Revision history

Table 10. Revision history

Document ID Release date Data sheet status Change notice Supersedes

PMBT2222_PMBT2222A v.6 20101112 Product data sheet - PMBT2222_2222A_5

Modifications: •Section 4 “Marking”: updated

•Figure 1 “Switching time definition”: added

•Section 8 “Test information”: updated

•Section 10 “Packing information”: added

•Section 11 “Soldering”: added

•Section 13 “Legal information”: updated

PMBT2222_2222A_5 20040122 Product specification - PMBT2222_2222A_4

PMBT2222_2222A_4 19990427 Product specification - PMBT2222_3

PMBT2222_3 19970909 Product specification - -

Product data sheet Rev. 6 — 12 November 2010 10 of 12

NXP Semiconductors PMBT2222; PMBT2222A

NPN switching transistors

13. Legal information

13.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of de vice(s) descr ibed in th is document m ay have cha nged since thi s document w as publish ed and may di ffe r in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

13.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full dat a sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not b e relied u pon to cont ain det ailed and

full information. For detailed and full information se e the relevant full data

sheet, which is available on request via the local NXP Semicond uctors sales

office. In case of any inconsistency or conflict with the shor t data sheet, the

full data sheet shall pre va il.

Product specificatio n — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to off er functions and qualities beyond those described in the

Product data sheet.

13.3 Disclaimers

Limited warr a nty and liability — Information in this document is believed to

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Notwithstanding any damages that customer might incur for any reason

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customer for the products described herein shall be limited in accordance

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limitation specifications and product descriptions, at any time and without

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NXP Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and ope ration of their applications

and products using NXP Semiconductors product s, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suit able and fit for the custome r’s applications and

products planned, as well as fo r the planned application and use of

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applications and products.

NXP Semiconductors does not accept any liability rela ted to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

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testing for the customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings onl y and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individua l agreement. In case an individual

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applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

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Export control — This document as well as the item(s) described herein

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Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contains data from the objective specification for product development.

Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.

Product [short] data sheet Production This document contains the product specification.

Product data sheet Rev. 6 — 12 November 2010 11 of 12

NXP Semiconductors PMBT2222; PMBT2222A

NPN switching transistors

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristi cs sections of this

document, and as such is not complete, exhaustive or legally binding.

13.4 Trademarks

Notice: All referenced b rands, produc t names, service names and trademarks

are the property of their respective ow ners.

14. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

NXP Semiconductors PMBT2222; PMBT2222A

NPN switching transistors

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 12 November 2010

Document identifier: PMBT2222_PMBT2222A

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

15. Contents

1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1 General description . . . . . . . . . . . . . . . . . . . . . 1

1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1

1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1

2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3

6 Thermal characteristics . . . . . . . . . . . . . . . . . . 3

7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4

8 Test information. . . . . . . . . . . . . . . . . . . . . . . . . 6

8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 6

9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7

10 Packing information . . . . . . . . . . . . . . . . . . . . . 7

11 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

12 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 9

13 Legal information. . . . . . . . . . . . . . . . . . . . . . . 10

13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10

13.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

13.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 10

13.4 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

14 Contact information. . . . . . . . . . . . . . . . . . . . . 11

15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12