TPS799xxDDC
TSOT23-5
(TOPVIEW)
OUT
NR
IN
GND
EN
1
2
3
5
4
TPS799xxYZU
WCSP
(TOPVIEW)
C3 C1
B2
A3 A1
OUT
EN
IN
GND
NR
GND
TPS79901YZU
WCSP
(TOPVIEW)
OUT
EN
IN
FB
C3 C1
B2
A3 A1
TPS79901DDC
TSOT23-5
(TOPVIEW)
OUT
FB
IN
GND
EN
1
2
3
5
4
TPS799xxDRV
2mmx2mmSON-6
(TOPVIEW)
IN
N/C
EN
6
5
4
OUT
NR
GND
1
2
3
GND
TPS79901DRV
2mmx2mmSON-6
(TOPVIEW)
IN
N/C
EN
6
5
4
OUT
FB
GND
1
2
3
GND
TPS799xx
www.ti.com
SBVS056J –JANUARY 2005–REVISED AUGUST 2010
200mA, Low Quiescent Current, Ultra-Low Noise, High PSRR
Low Dropout Linear Regulator
Check for Samples: TPS799xx
1FEATURES DESCRIPTION
23• 200mA Low Dropout Regulator with EN The TPS799xx family of low-dropout (LDO)
low-power linear regulators offer excellent AC
• Low IQ: 40mAperformance with very low ground current. High
• Multiple Output Voltage Versions Available: power-supply rejection ratio (PSRR), low noise, fast
– Fixed Outputs of 1.2V to 4.5V Using start-up, and excellent line and load transient
Innovative Factory EEPROM Programming response are provided while consuming a very low
40mA (typical) ground current. The TPS799xx is
– Adjustable Outputs from 1.20V to 6.5V stable with ceramic capacitors and uses an advanced
• High PSRR: 66dB at 1kHz BiCMOS fabrication process to yield dropout voltage
• Ultra-low Noise: 29.5mVRMS typically 100mV at 200mA output. The TPS799xx
uses a precision voltage reference and feedback loop
• Fast Start-Up Time: 45msto achieve overall accuracy of 2% over all load, line,
• Stable with a Low-ESR, 2.0mF Typical Output process, and temperature variations. It is fully
Capacitance specified from TJ= –40°C to +125°C and is offered in
• Excellent Load/Line Transient Response low profile ThinSOT23, Wafer Chip-Scale (WCSP),
and 2mm × 2mm SON packages, ideal for wireless
• 2% Overall Accuracy (Load/Line/Temp) handsets and WLAN cards.
• Very Low Dropout: 100mV
• ThinSOT-23, WCSP, and 2mm × 2mm SON-6
Packages
APPLICATIONS
• Cellular Phones
• Wireless LAN, Bluetooth®
• VCOs, RF
• Handheld Organizers, PDAs
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2Bluetooth is a registered trademark of Bluetooth SIG, Inc.
3All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 2005–2010, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
TPS799xx
SBVS056J –JANUARY 2005–REVISED AUGUST 2010
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION(1)
PRODUCT VOUT (2)
TPS799xx yyy z XX is nominal output voltage (for example, 28 = 2.8V, 285 = 2.85V, 01 = Adjustable).(3)
YYY is package designator.
Zis package quantity.
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(2) Output voltages from 1.2V to 4.5V in 50mV increments are available through the use of innovative factory EEPROM programming;
minimum order quantities may apply. Contact factory for details and availability.
(3) For fixed 1.2V operation, tie FB to OUT.
ABSOLUTE MAXIMUM RATINGS
Over operating temperature range (unless otherwise noted).(1)
PARAMETER TPS799xx UNIT
VIN range –0.3 to +7.0 V
VEN range –0.3 to VIN +0.3 V
VOUT range –0.3 to VIN +0.3 V
Peak output current Internally limited
Continuous total power dissipation See Dissipation Ratings Table
Junction temperature range, TJ–55 to +150 °C
Storage junction temperature range , TSTG –55 to +150 °C
ESD rating, HBM 2 kV
ESD rating, CDM 500 V
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
THERMAL INFORMATION TPS799xx
THERMAL METRIC(1)(2) UNITS
DRV (6 PINS)
qJA Junction-to-ambient thermal resistance 74.2
qJCtop Junction-to-case (top) thermal resistance 58.8
qJB Junction-to-board thermal resistance 145.9 °C/W
yJT Junction-to-top characterization parameter 0.2
yJB Junction-to-board characterization parameter 54.4
qJCbot Junction-to-case (bottom) thermal resistance 7.2
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) For thermal estimates of this device based on PCB copper area, see the TI PCB Thermal Calculator.
2Submit Documentation Feedback Copyright © 2005–2010, Texas Instruments Incorporated
TPS799xx
www.ti.com
SBVS056J –JANUARY 2005–REVISED AUGUST 2010
ELECTRICAL CHARACTERISTICS
Over operating temperature range (TJ= –40°C to +125°C), VIN = VOUT(TYP) + 0.3V or 2.7V, whichever is greater; IOUT = 1mA,
VEN = VIN, COUT = 2.2mF, CNR = 0.01mF, unless otherwise noted. For TPS79901, VOUT = 3.0V.
Typical values are at TJ= +25°C.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIN Input voltage range(1) 2.7 6.5 V
VFB Internal reference (TPS79901) 1.169 1.193 1.217 V
VOUT Output voltage range (TPS79901) VFB 6.5 – VDO V
VOUT Output accuracy Nominal TJ= +25°C –1.0 +1.0 %
Over VIN, VOUT + 0.3V ≤VIN ≤6.5V
VOUT Output accuracy(1) –2.0 ±1.0 +2.0 %
IOUT, Temp 500mA≤IOUT ≤200mA
ΔVOUT%/ ΔVIN Line regulation(1) VOUT(NOM) + 0.3V ≤VIN ≤6.5V 0.02 %/V
ΔVOUT%/ ΔIOUT Load regulation 500mA≤IOUT ≤200mA 0.002 %/mA
Dropout voltage(2)
VDO VOUT < 3.3V IOUT = 200mA 100 175 mV
(VIN = VOUT(NOM) – 0.1V)
Dropout voltage
VDO VOUT ≥3.3V IOUT = 200mA 90 160 mV
(VIN = VOUT(NOM) – 0.1V)
ICL Output current limit VOUT = 0.9 × VOUT(NOM) 200 400 600 mA
IGND Ground pin current 500mA≤IOUT ≤200mA 40 60 mA
ISHDN Shutdown current (IGND) VEN ≤0.4V, 2.7V ≤VIN ≤6.5V 0.15 1.0 mA
IFB Feedback pin current (TPS79901) –0.5 0.5 mA
f = 100Hz 70 dB
Power-supply rejection ratio f = 1kHz 66 dB
PSRR VIN = 3.85V, VOUT = 2.85V, f = 10kHz 51 dB
CNR = 0.01mF, IOUT = 100mA f = 100kHz 38 dB
CNR = 0.01mF 10.5 x VOUT mVRMS
Output noise voltage
VNBW = 10Hz to 100kHz, VOUT = 2.8V CNR = none 94 x VOUT mVRMS
CNR = 0.001mF 45 ms
Startup time CNR = 0.047mF 45 ms
TSTR VOUT = 2.85V, CNR = 0.01mF 50 ms
RL= 14Ω, COUT = 2.2mFCNR = none 50 ms
VEN(HI) Enable high (enabled) 1.2 VIN V
VEN(LO) Enable low (shutdown) 0 0.4 V
IEN(HI) Enable pin current, enabled VEN = VIN = 6.5V 0.03 1.0 mA
Shutdown, temperature increasing 165 °C
TSD Thermal shutdown temperature Reset, temperature decreasing 145 °C
TJOperating junction temperature –40 +125 °C
Under-voltage lock-out VIN rising 1.90 2.20 2.65 V
UVLO Hysteresis VIN falling 70 mV
(1) Minimum VIN = VOUT + VDO or 2.7V, whichever is greater.
(2) VDO is not measured for devices with VOUT(NOM) < 2.8V because minimum VIN = 2.7V.
Copyright © 2005–2010, Texas Instruments Incorporated Submit Documentation Feedback 3
Thermal
Shutdown
UVLO
Current
Limit
2µA
Overshoot
Detect
500k
Quickstart
1.193V
Bandgap
IN
EN
NR
OUT
GND
400Ω
Thermal
Shutdown
UVLO
Current
Limit
3.3MΩ
Overshoot
Detect
500k
1.193V
Bandgap
IN
EN
FB
OUT
GND
400Ω
TPS799xxDDC
TSOT23-5
(TOPVIEW)
OUT
NR
IN
GND
EN
1
2
3
5
4
TPS799xxYZU
WCSP
(TOPVIEW)
C3 C1
B2
A3 A1
OUT
EN
IN
GND
NR
GND
TPS79901YZU
WCSP
(TOPVIEW)
OUT
EN
IN
FB
C3 C1
B2
A3 A1
TPS79901DDC
TSOT23-5
(TOPVIEW)
OUT
FB
IN
GND
EN
1
2
3
5
4
TPS799xxDRV
2mmx2mmSON-6
(TOPVIEW)
IN
N/C
EN
6
5
4
OUT
NR
GND
1
2
3
GND
TPS79901DRV
2mmx2mmSON-6
(TOPVIEW)
IN
N/C
EN
6
5
4
OUT
FB
GND
1
2
3
GND
TPS799xx
SBVS056J –JANUARY 2005–REVISED AUGUST 2010
www.ti.com
DEVICE INFORMATION
FUNCTIONAL BLOCK DIAGRAMS
Figure 1. Fixed Voltage Versions Figure 2. Adjustable Voltage Versions
PIN CONFIGURATIONS
Table 1. PIN DESCRIPTIONS
TPS799xx
NAME DDC YZU DRV DESCRIPTION
IN 1 C3 6 Input supply.
GND 2 B2 3, Pad Ground. The pad must be tied to GND.
Driving the enable pin (EN) high turns on the regulator. Driving this pin low puts the regulator
EN 3 A1 4 into shutdown mode. EN can be connected to IN if not used.
Fixed voltage versions only; connecting an external capacitor to this pin bypasses noise
NR 4 A3 2 generated by the internal bandgap. This capacitor allows output noise to be reduced to very
low levels.
Adjustable version only; this pin is the input to the control loop error amplifier, and is used to
FB 4 A3 2 set the output voltage of the device.
Output of the regulator. A small capacitor (total typical capacitance ≥2.0mF ceramic) is
OUT 5 C1 1 needed from this pin to ground to assure stability.
N/C — — 5 Not internally connected. This pin must either be left open, or tied to GND.
4Submit Documentation Feedback Copyright © 2005–2010, Texas Instruments Incorporated
2.5 3.5 4.5 5.5 6.5
VIN (V)
1.0
0.8
0.6
0.4
0.2
0
−0.2
−0.4
−0.6
−0.8
−1.0
Change in VOUT (%)
7.5
IOUT = 100mA
TJ = +125°C
TJ = +85°C
TJ = −40°CTJ = +25°C
0 50 100 150 200
IOUT (mA)
28.50
21.38
14.25
7.13
0
−7.13
−14.25
−21.38
−28.50
Change in VOUT (mV)
TJ = +125°CTJ = +85°C
TJ = −40°C
TJ = +25°C
200
180
160
140
120
100
80
60
40
20
0
VDO (mV)
0 50 100 150 200
IOUT (mA)
TJ= +85_C
TJ=−40_C
TJ= +125_C
TJ= +25_C
TJ (°C)
2.0
1.5
1.0
0.5
0
−0.5
−1.0
−1.5
−2.0
Change in VOUT (%)
IOUT = 100mA
IOUT = 200mA
IOUT = 1mA
−40 −25 5 35 65 9550 125
−15 20 80 110
110
100
90
80
70
60
50
40
30
20
10
0
VDO (mV)
2.5 3.0 3.5 4.0 5.0 6.0 7.04.5 5.5 6.5
VIN (V)
IOUT = 200mA
TJ (°C)
200
180
160
140
120
100
80
60
40
20
0
VDO (mV)
5 35 65 9550 12520 80 110
IOUT = 100mA
IOUT = 200mA
IOUT = 1mA
−40 −25 −15
TPS799xx
www.ti.com
SBVS056J –JANUARY 2005–REVISED AUGUST 2010
TYPICAL CHARACTERISTICS
Over operating temperature range (TJ= –40°C to +125°C), VIN = VOUT(TYP) + 0.3V or 2.7V, whichever is greater; IOUT = 1mA, VEN = VIN, COUT
= 2.2mF, CNR = 0.01mF, unless otherwise noted. For TPS79901, VOUT = 3.0V.
Typical values are at TJ= +25°C.
LOAD REGULATION LINE REGULATION
Figure 3. Figure 4.
OUTPUT VOLTAGE vs TPS799285 DROPOUT VOLTAGE vs
JUNCTION TEMPERATURE OUTPUT CURRENT
Figure 5. Figure 6.
TPS799285 DROPOUT VOLTAGE vs TPS79901 DROPOUT vs
JUNCTION TEMPERATURE INPUT VOLTAGE
Figure 7. Figure 8.
Copyright © 2005–2010, Texas Instruments Incorporated Submit Documentation Feedback 5
60
50
40
30
20
10
0
IGND (µA)
VIN = 5.0V
VIN = 3.2V
VIN = 2.7V
(dropout)
VOUT = 2.85V
IOUT = 200mA
−40 −25 5 35 65 9550 125
−15 20 80 110
TJ (°C)
90
80
70
60
50
40
30
20
10
010 100 1k 10k
Frequency (Hz)
PSRR (dB)
100k 1M 10M
IOUT = 200mA
IOUT = 100mA
IOUT = 1mA
CNR = 0.01µF
COUT = 2.2µF
TJ (°C)
600
500
400
300
200
100
0
IGND (nA)
VEN = 0.4V
VIN = 6.5V
VIN = 3.2V
−40 −25 5 35 65 9550 125
−15 20 80 110
TPS799xx
SBVS056J –JANUARY 2005–REVISED AUGUST 2010
www.ti.com
TYPICAL CHARACTERISTICS (continued)
Over operating temperature range (TJ= –40°C to +125°C), VIN = VOUT(TYP) + 0.3V or 2.7V, whichever is greater; IOUT = 1mA,
VEN = VIN, COUT = 2.2mF, CNR = 0.01mF, unless otherwise noted. For TPS79901, VOUT = 3.0V.
Typical values are at TJ= +25°C.
GROUND PIN CURRENT vs TPS799285 GROUND PIN CURRENT vs
INPUT VOLTAGE JUNCTION TEMPERATURE
Figure 9. Figure 10.
GROUND PIN CURRENT (DISABLED) vs TPS799285 POWER-SUPPLY RIPPLE REJECTION vs
JUNCTION TEMPERATURE FREQUENCY (VIN – VOUT = 1.0V)
Figure 11. Figure 12.
6Submit Documentation Feedback Copyright © 2005–2010, Texas Instruments Incorporated
90
80
70
60
50
40
30
20
10
010 100 1k 10k
Frequency (Hz)
PSRR (dB)
100k 1M 10M
IOUT = 100mA IOUT = 1mA
IOUT = 200mA
CNR = 0.01µF
COUT = 2.2µF
90
80
70
60
50
40
30
20
10
010 100 1k 10k
Frequency (Hz)
PSRR (dB)
100k 1M 10M
IOUT = 1mA
IOUT = 100mA
IOUT = 200mA
CNR = 0.01µF
COUT = 2.2µF
90
80
70
60
50
40
30
20
10
010 100 1k 10k
Frequency (Hz)
PSRR (dB)
100k 1M 10M
IOUT = 1mA
IOUT = 200mA
CNR = 0.01µF
COUT = 10.0µF
90
80
70
60
50
40
30
20
10
010 100 1k 10k
Frequency (Hz)
PSRR (dB)
100k 1M 10M
IOUT = 1mA
IOUT = 200mA
CNR = 0.01µF
COUT = 10.0µF
90
80
70
60
50
40
30
20
10
010 100 1k 10k
Frequency (Hz)
PSRR (dB)
100k 1M 10M
IOUT = 200mA
CNR = None
COUT = 10.0µF
IOUT = 1mA
90
80
70
60
50
40
30
20
10
0
PSRR (dB)
0.0 1.0 1.50.5 2.0 2.5
VIN −VOUT (V)
3.0 3.5 4.0
0.1kHz
10kHz
1kHz
100kHz
1MHz
CNR = 0.01µF
COUT = 2.2µF
TPS799xx
www.ti.com
SBVS056J –JANUARY 2005–REVISED AUGUST 2010
TYPICAL CHARACTERISTICS (continued)
Over operating temperature range (TJ= –40°C to +125°C), VIN = VOUT(TYP) + 0.3V or 2.7V, whichever is greater; IOUT = 1mA,
VEN = VIN, COUT = 2.2mF, CNR = 0.01mF, unless otherwise noted. For TPS79901, VOUT = 3.0V.
Typical values are at TJ= +25°C.
TPS799285 POWER-SUPPLY RIPPLE REJECTION vs TPS799285 POWER-SUPPLY RIPPLE REJECTION vs
FREQUENCY (VIN – VOUT = 0.5V) FREQUENCY (VIN – VOUT = 0.25V)
Figure 13. Figure 14.
TPS799285 POWER-SUPPLY RIPPLE REJECTION vs TPS799285 POWER-SUPPLY RIPPLE REJECTION vs
FREQUENCY (VIN – VOUT = 1.0V) FREQUENCY (VIN – VOUT = 0.25V)
Figure 15. Figure 16.
TPS799285 POWER-SUPPLY RIPPLE REJECTION vs POWER-SUPPLY RIPPLE REJECTION vs
FREQUENCY (VIN – VOUT = 1.0V) VIN – VOUT, IOUT = 1mA
Figure 17. Figure 18.
Copyright © 2005–2010, Texas Instruments Incorporated Submit Documentation Feedback 7
90
80
70
60
50
40
30
20
10
00.0 1.0 1.50.5 2.0 2.5
VIN −VOUT (V)
PSRR (dB)
3.0 3.5 4.0
0.1kHz 1kHz
10kHz
100kHz 1MHz
CNR = 0.01µF
COUT = 2.2µF
90
80
70
60
50
40
30
20
10
00.0 1.0 1.50.5 2.0 2.5
VIN −VOUT (V)
PSRR (dB)
3.0 3.5 4.0
0.1kHz
100kHz
1kHz
10kHz
1MHz
CNR = 0.01µF
COUT = 2.2µF
200
180
160
140
120
100
80
60
40
20
0
0.01 0.1 1
CNR (nF)
10
IOUT = 1mA
COUT = 2.2µF
Total Noise (µVrms)
35
30
25
20
15
10
5
00 5 10 15 20
COUT (µF)
Total Noise (µVrms)
25
IOUT = 1mA
CNR = 0.01µF
20µs/div
20mV/div
20mV/div
1V/div
VOUT
VOUT
VIN
IOUT = 150mA
dVIN
dt = 1V/µs
COUT = 10µF
COUT = 2.2µF
3.15V
4.15V
20 s/divm
100mV/div
100mV/div
100mA/div
VOUT
VOUT
IOUT
C =2.2 F
OUT m
C =10 F
OUT m
V =3.35V
IN
150mA
1mA
TPS799xx
SBVS056J –JANUARY 2005–REVISED AUGUST 2010
www.ti.com
TYPICAL CHARACTERISTICS (continued)
Over operating temperature range (TJ= –40°C to +125°C), VIN = VOUT(TYP) + 0.3V or 2.7V, whichever is greater; IOUT = 1mA,
VEN = VIN, COUT = 2.2mF, CNR = 0.01mF, unless otherwise noted. For TPS79901, VOUT = 3.0V.
Typical values are at TJ= +25°C.
POWER-SUPPLY RIPPLE REJECTION vs POWER-SUPPLY RIPPLE REJECTION vs
VIN – VOUT, IOUT = 100mA VIN – VOUT, IOUT = 200mA
Figure 19. Figure 20.
TPS799285 TPS799285
TOTAL NOISE vs CNR TOTAL NOISE vs COUT
Figure 21. Figure 22.
TPS799285 TPS799285
LINE TRANSIENT RESPONSE LOAD TRANSIENT RESPONSE
Figure 23. Figure 24.
8Submit Documentation Feedback Copyright © 2005–2010, Texas Instruments Incorporated
10 s/divm
1V/div
4V/div
VOUT
VIN
0V
3.85V
RW
LOAD =19
C =10 F
OUT m
RW
LOAD =19
C =2.2 F
OUT m
10 s/divm
1V/div
5V/div
VOUT
VEN
RW
LOAD =19
C =2.2 F
OUT mRW
LOAD =19
C =10 F
OUT m
V =3.85V
IN
50ms/div
Volts
7
6
5
4
3
2
1
0
−1
VIN
VOUT
RL= 19Ω
TPS799xx
www.ti.com
SBVS056J –JANUARY 2005–REVISED AUGUST 2010
TYPICAL CHARACTERISTICS (continued)
Over operating temperature range (TJ= –40°C to +125°C), VIN = VOUT(TYP) + 0.3V or 2.7V, whichever is greater; IOUT = 1mA,
VEN = VIN, COUT = 2.2mF, CNR = 0.01mF, unless otherwise noted. For TPS79901, VOUT = 3.0V.
Typical values are at TJ= +25°C.
TPS799285
TURN-ON RESPONSE TPS799285
(VEN = VIN) ENABLE RESPONSE
Figure 25. Figure 26.
TPS799285
POWER-UP/POWER-DOWN
Figure 27.
Copyright © 2005–2010, Texas Instruments Incorporated Submit Documentation Feedback 9
TPS79901
GNDEN FB
IN OUT
VIN VOUT
R1CFB
R2
Optionalinputcapacitor.
Mayimprovesource
impedance,noise,orPSRR.
V =
OUT ´1.193
(R1 2
+R )
R2
VEN
2.2 Fm
Ceramic
TPS799xx
GNDEN NR
IN OUT
VIN VOUT
Optional input capacitor.
May improve source
impedance, noise, or PSRR.
Optional bypass capacitor
to reduce output noise
and increase PSRR.
2.2mF
Ceramic
VEN
TPS799xx
SBVS056J –JANUARY 2005–REVISED AUGUST 2010
www.ti.com
APPLICATION INFORMATION
The TPS799xx family of LDO regulators combines
the high performance required of many RF and Feedback Capacitor Requirements
precision analog applications with ultra-low current (TPS79901 only)
consumption. High PSRR is provided by a high gain, The feedback capacitor, CFB, shown in Figure 29 is
high bandwidth error loop with good supply rejection required for stability. For a parallel combination of R1
at very low headroom (VIN – VOUT). Fixed voltage and R2equal to 250kΩ, any value from 3pF to 1nF
versions provide a noise reduction pin to bypass can be used. Fixed voltage versions have an internal
noise generated by the bandgap reference and to 30pF feedback capacitor which is quick-charged at
improve PSRR while a quick-start circuit fast-charges start-up. The adjustable version does not have this
this capacitor at startup. The combination of high quick-charge circuit, so values below 5pF should be
performance and low ground current also make the used to ensure fast startup; values above 47pF can
TPS799xx an excellent choice for portable be used to implement an output voltage soft-start.
applications. All versions have thermal and Larger value capacitors also improve noise slightly.
over-current protection and are fully specified from The TPS79901 is stable in unity-gain configuration
–40°C to +125°C. (OUT tied to FB) without CFB.
Figure 28 shows the basic circuit connections for
fixed voltage models. Figure 29 gives the connections Output Noise
for the adjustable output version (TPS79901). R1and
R2can be calculated for any output voltage using the In most LDOs, the bandgap is the dominant noise
formula in Figure 29. Sample resistor values for source. If a noise reduction capacitor (CNR) is used
common output voltages are shown in Figure 29. with the TPS799xx, the bandgap does not contribute
significantly to noise. Instead, noise is dominated by
the output resistor divider and the error amplifier
Input and Output Capacitor Requirements input. To minimize noise in a given application, use a
Although an input capacitor is not required for 0.01mF noise reduction capacitor; for the adjustable
stability, it is good analog design practice to connect version, smaller value resistors in the output resistor
a 0.1mF to 1mF low ESR capacitor across the input divider reduce noise. A parallel combination that
supply near the regulator. This will counteract gives 2mA of divider current will have the same noise
reactive input sources and improve transient performance as a fixed voltage version. To further
response, noise rejection, and ripple rejection. A optimize noise, equivalent series resistance of the
higher-value capacitor may be necessary if large, fast output capacitor can be set to approximately 0.2Ω.
rise-time load transients are anticipated or the device This configuration maximizes phase margin in the
is located several inches from the power source. If control loop, reducing total output noise by up to
source impedance is not sufficiently low, a 0.1mF10%.
input capacitor may be necessary to ensure stability. space
The TPS799xx is designed to be stable with standard space
ceramic capacitors of values 2.2mF or larger. X5R
and X7R type capacitors are best as they have space
minimal variation in value and ESR over temperature.
Maximum ESR should be < 1.0Ω.space
Figure 29. Typical Application Circuit for
Adjustable Voltage Version
Figure 28. Typical Application Circuit for
Fixed Voltage Versions
10 Submit Documentation Feedback Copyright © 2005–2010, Texas Instruments Incorporated
V =xV
N OUT
10.5 VmRMS
V
TPS799xx
www.ti.com
SBVS056J –JANUARY 2005–REVISED AUGUST 2010
Noise can be referred to the feedback point (FB pin) Startup
such that with CNR = 0.01mF total noise is Fixed voltage versions of the TPS799xx use a
approximately given by Equation 1:quick-start circuit to fast-charge the noise reduction
capacitor, CNR, if present (see Functional Block
(1) Diagrams,Figure 1). This allows the combination of
very low output noise and fast start-up times. The NR
The TPS79901 adjustable version does not have the pin is high impedance so a low leakage CNR capacitor
noise-reduction pin available, so ultra-low noise must be used; most ceramic capacitors are
operation is not possible. Noise can be minimized appropriate in this configuration.
according to the above recommendations. Note that for fastest startup, VIN should be applied
Board Layout Recommendations to Improve first, then the enable pin (EN) driven high. If EN is
PSRR and Noise Performance tied to IN, startup will be somewhat slower. Refer to
Figure 25 and Figure 26 in the Typical Characteristics
To improve ac performance such as PSRR, output section. The quick-start switch is closed for
noise, and transient response, it is recommended that approximately 135ms. To ensure that CNR is fully
the board be designed with separate ground planes charged during the quick-start time, a 0.01mF or
for VIN and VOUT, with each ground plane connected smaller capacitor should be used.
only at the GND pin of the device. In addition, the
ground connection for the bypass capacitor should Transient Response
connect directly to the GND pin of the device. As with any regulator, increasing the size of the
Internal Current Limit output capacitor will reduce over/undershoot
magnitude but increase duration of the transient
The TPS799xx internal current limit helps protect the response. In the adjustable version, adding CFB
regulator during fault conditions. During current limit, between OUT and FB will improve stability and
the output will source a fixed amount of current that is transient response. The transient response of the
largely independent of output voltage. For reliable TPS799xx is enhanced by an active pull-down that
operation, the device should not be operated in engages when the output overshoots by
current limit for extended periods of time. approximately 5% or more when the device is
enabled. When enabled, the pull-down device
The PMOS pass element in the TPS799xx has a behaves like a 350Ωresistor to ground.
built-in body diode that conducts current when the
voltage at OUT exceeds the voltage at IN. This
current is not limited, so if extended reverse voltage Under-Voltage Lock-Out (UVLO)
operation is anticipated, external limiting may be The TPS799xx utilizes an under-voltage lock-out
appropriate. circuit to keep the output shut off until internal
circuitry is operating properly. The UVLO circuit has a
Shutdown de-glitch feature so that it will typically ignore
undershoot transients on the input if they are less
The enable pin (EN) is active high and is compatible than 50ms duration.
with standard and low voltage TTL-CMOS levels.
When shutdown capability is not required, EN can be
connected to IN. Minimum Load
The TPS799xx is stable and well-behaved with no
Dropout Voltage output load. To meet the specified accuracy, a
minimum load of 500mA is required. Below 500mA at
The TPS799xx uses a PMOS pass transistor to junction temperatures near +125°C, the output can
achieve low dropout. When (VIN – VOUT) is less than drift up enough to cause the output pull-down to turn
the dropout voltage (VDO), the PMOS pass device is on. The output pull-down will limit voltage drift to 5%
in its linear region of operation and the input-to-output typically but ground current could increase by
resistance is the RDS, ON of the PMOS pass element. approximately 50mA. In typical applications, the
Because the PMOS device behaves like a resistor in junction cannot reach high temperatures at light loads
dropout, VDO will approximately scale with output since there is no appreciable dissipated power. The
current. specified ground current would then be valid at no
As with any linear regulator, PSRR and transient load in most applications.
response are degraded as (VIN – VOUT) approaches
dropout. This effect is shown in Figure 18 through
Figure 20 in the Typical Characteristics section.
Copyright © 2005–2010, Texas Instruments Incorporated Submit Documentation Feedback 11
PD+ǒVIN*VOUTǓ@IOUT
NOTES: A.Alllineardimensionsareinmillimeters.
B.Thisdrawingissubjecttochangewithoutnotice.
C.NanoStaräpackageconfiguration.
NanoStarisatrademarkofTexasInstruments.
1,427
1,327
1,060
0,960
(d=0.30 0.05)±
0,625Max
TPS799xx
SBVS056J –JANUARY 2005–REVISED AUGUST 2010
www.ti.com
THERMAL INFORMATION
The internal protection circuitry of the TPS799xx has
Thermal Protection been designed to protect against overload conditions.
It was not intended to replace proper heatsinking.
Thermal protection disables the output when the Continuously running the TPS799xx into thermal
junction temperature rises to approximately +165°C, shutdown will degrade device reliability.
allowing the device to cool. When the junction
temperature cools to approximately +145°C the
output circuitry is again enabled. Depending on power Power Dissipation
dissipation, thermal resistance, and ambient The ability to remove heat from the die is different for
temperature, the thermal protection circuit may cycle each package type, presenting different
on and off. This cycling limits the dissipation of the considerations in the PCB layout. The PCB area
regulator, protecting it from damage due to around the device that is free of other components
overheating. moves the head from the device to the ambient air.
Any tendency to activate the thermal protection circuit Performance data for JEDEC low- and high-K boards
indicates excessive power dissipation or an are given in the Dissipation Ratings table. Using
inadequate heatsink. For reliable operation, junction heavier copper will increase the effectiveness in
temperature should be limited to +125°C maximum. removing heat from the device. The addition of plated
To estimate the margin of safety in a complete design through-holes to heat-dissipating layers will also
(including heatsink), increase the ambient improve the heatsink effectiveness.
temperature until the thermal protection is triggered; Power dissipation depends on input voltage and load
use worst-case loads and signal conditions. For good conditions. Power dissipation is equal to the product
reliability, thermal protection should trigger at least of the output current time the voltage drop across the
+35°C above the maximum expected ambient output pass element, as shown in Equation 2:
condition of your particular application. This
configuration produces a worst-case junction (2)
temperature of +125°C at the highest expected
ambient temperature and worst-case load. Package Mounting
Solder pad footprint recommendations for the
TPS799xx are available from the Texas Instruments'
web site at www.ti.com.
Figure 30. YZU Wafer Chip-Scale Package Dimensions (in mm)
12 Submit Documentation Feedback Copyright © 2005–2010, Texas Instruments Incorporated
TPS799xx
www.ti.com
SBVS056J –JANUARY 2005–REVISED AUGUST 2010
REVISION HISTORY
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision I (November, 2007) to Revision J Page
• Replaced the Dissipation Ratings table with the Thermal Information table ........................................................................ 2
Copyright © 2005–2010, Texas Instruments Incorporated Submit Documentation Feedback 13
PACKAGE OPTION ADDENDUM
www.ti.com 1-Aug-2012
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
TPS79901DDCR ACTIVE SOT DDC 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79901DDCRG4 ACTIVE SOT DDC 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79901DDCT ACTIVE SOT DDC 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79901DDCTG4 ACTIVE SOT DDC 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79901DRVR ACTIVE SON DRV 6 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79901DRVRG4 ACTIVE SON DRV 6 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79901DRVT ACTIVE SON DRV 6 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79901DRVTG4 ACTIVE SON DRV 6 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79901YZUR ACTIVE DSBGA YZU 5 3000 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM
TPS79901YZUT ACTIVE DSBGA YZU 5 250 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM
TPS799125YZUR ACTIVE DSBGA YZU 5 3000 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM
TPS799125YZUT ACTIVE DSBGA YZU 5 250 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM
TPS79912DDCR ACTIVE SOT DDC 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79912DDCRG4 ACTIVE SOT DDC 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79912DDCT ACTIVE SOT DDC 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79912DDCTG4 ACTIVE SOT DDC 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79912DRVR ACTIVE SON DRV 6 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
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Addendum-Page 2
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
TPS79912DRVRG4 ACTIVE SON DRV 6 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79912DRVT ACTIVE SON DRV 6 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79912DRVTG4 ACTIVE SON DRV 6 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79912YZUR ACTIVE DSBGA YZU 5 3000 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM
TPS79912YZUT ACTIVE DSBGA YZU 5 250 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM
TPS79913DDCR ACTIVE SOT DDC 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79913DDCRG4 ACTIVE SOT DDC 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79913DDCT ACTIVE SOT DDC 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79913DDCTG4 ACTIVE SOT DDC 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79913YZUR ACTIVE DSBGA YZU 5 3000 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM
TPS79913YZUT ACTIVE DSBGA YZU 5 250 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM
TPS79915DDCR ACTIVE SOT DDC 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79915DDCRG4 ACTIVE SOT DDC 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79915DDCT ACTIVE SOT DDC 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79915DDCTG4 ACTIVE SOT DDC 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79915YZUR ACTIVE DSBGA YZU 5 3000 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM
TPS79915YZUT ACTIVE DSBGA YZU 5 250 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM
TPS799185DDCR ACTIVE SOT DDC 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 1-Aug-2012
Addendum-Page 3
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
TPS799185DDCRG4 ACTIVE SOT DDC 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS799185DDCT ACTIVE SOT DDC 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS799185DDCTG4 ACTIVE SOT DDC 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS799185YZUR ACTIVE DSBGA YZU 5 3000 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM
TPS799185YZUT ACTIVE DSBGA YZU 5 250 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM
TPS79918DDCR ACTIVE SOT DDC 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79918DDCRG4 ACTIVE SOT DDC 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79918DDCT ACTIVE SOT DDC 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79918DDCTG4 ACTIVE SOT DDC 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79918DRVR ACTIVE SON DRV 6 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79918DRVRG4 ACTIVE SON DRV 6 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79918DRVT ACTIVE SON DRV 6 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79918DRVTG4 ACTIVE SON DRV 6 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79918YZUR ACTIVE DSBGA YZU 5 3000 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM
TPS79918YZUT ACTIVE DSBGA YZU 5 250 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM
TPS799195DRVR ACTIVE SON DRV 6 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS799195DRVRG4 ACTIVE SON DRV 6 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS799195DRVT ACTIVE SON DRV 6 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 1-Aug-2012
Addendum-Page 4
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
TPS799195DRVTG4 ACTIVE SON DRV 6 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS799195YZUR PREVIEW DSBGA YZU 5 3000 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM
TPS799195YZUT PREVIEW DSBGA YZU 5 250 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM
TPS79919YZUR ACTIVE DSBGA YZU 5 3000 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM
TPS79919YZUT ACTIVE DSBGA YZU 5 250 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM
TPS79920YZUR ACTIVE DSBGA YZU 5 3000 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM
TPS79920YZUT ACTIVE DSBGA YZU 5 250 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM
TPS79921YZUR ACTIVE DSBGA YZU 5 3000 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM
TPS79921YZUT ACTIVE DSBGA YZU 5 250 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM
TPS79925DDCR ACTIVE SOT DDC 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79925DDCRG4 ACTIVE SOT DDC 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79925DDCT ACTIVE SOT DDC 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79925DDCTG4 ACTIVE SOT DDC 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79925YZUR ACTIVE DSBGA YZU 5 3000 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM
TPS79925YZUT ACTIVE DSBGA YZU 5 250 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM
TPS79926YZUR ACTIVE DSBGA YZU 5 3000 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM
TPS79926YZUT ACTIVE DSBGA YZU 5 250 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM
TPS799275YZUR ACTIVE DSBGA YZU 5 3000 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 1-Aug-2012
Addendum-Page 5
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
TPS799275YZUT ACTIVE DSBGA YZU 5 250 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM
TPS79927DDCR ACTIVE SOT DDC 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79927DDCRG4 ACTIVE SOT DDC 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79927DDCT ACTIVE SOT DDC 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79927DDCTG4 ACTIVE SOT DDC 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79927DRVR ACTIVE SON DRV 6 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79927DRVRG4 ACTIVE SON DRV 6 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79927DRVT ACTIVE SON DRV 6 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79927DRVTG4 ACTIVE SON DRV 6 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79927YZUR ACTIVE DSBGA YZU 5 3000 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM
TPS79927YZUT ACTIVE DSBGA YZU 5 250 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM
TPS799285DDCR ACTIVE SOT DDC 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS799285DDCRG4 ACTIVE SOT DDC 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS799285DDCT ACTIVE SOT DDC 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS799285DDCTG4 ACTIVE SOT DDC 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS799285DRVR ACTIVE SON DRV 6 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS799285DRVRG4 ACTIVE SON DRV 6 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS799285DRVT ACTIVE SON DRV 6 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 1-Aug-2012
Addendum-Page 6
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
TPS799285DRVTG4 ACTIVE SON DRV 6 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS799285YZUR ACTIVE DSBGA YZU 5 3000 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM
TPS799285YZUT ACTIVE DSBGA YZU 5 250 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM
TPS79928DDCR ACTIVE SOT DDC 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79928DDCRG4 ACTIVE SOT DDC 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79928DDCT ACTIVE SOT DDC 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79928DDCTG4 ACTIVE SOT DDC 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79928DRVR ACTIVE SON DRV 6 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79928DRVRG4 ACTIVE SON DRV 6 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79928DRVT ACTIVE SON DRV 6 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79928DRVTG4 ACTIVE SON DRV 6 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79928YZUR ACTIVE DSBGA YZU 5 3000 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM
TPS79928YZUT ACTIVE DSBGA YZU 5 250 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM
TPS79930DDCR ACTIVE SOT DDC 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79930DDCRG4 ACTIVE SOT DDC 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79930DDCT ACTIVE SOT DDC 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79930DDCTG4 ACTIVE SOT DDC 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79930YZUR ACTIVE DSBGA YZU 5 3000 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
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Addendum-Page 7
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
TPS79930YZUT ACTIVE DSBGA YZU 5 250 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM
TPS799315DDCR ACTIVE SOT DDC 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS799315DDCRG4 ACTIVE SOT DDC 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS799315DDCT ACTIVE SOT DDC 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS799315DDCTG4 ACTIVE SOT DDC 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS799315YZUR ACTIVE DSBGA YZU 5 3000 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM
TPS799315YZUT ACTIVE DSBGA YZU 5 250 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM
TPS79932YZUR ACTIVE DSBGA YZU 5 3000 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM
TPS79932YZUT ACTIVE DSBGA YZU 5 250 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM
TPS79933DDCR ACTIVE SOT DDC 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79933DDCRG4 ACTIVE SOT DDC 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79933DDCT ACTIVE SOT DDC 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79933DDCTG4 ACTIVE SOT DDC 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79933DRVR ACTIVE SON DRV 6 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79933DRVRG4 ACTIVE SON DRV 6 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79933DRVT ACTIVE SON DRV 6 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79933DRVTG4 ACTIVE SON DRV 6 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79933YZUR ACTIVE DSBGA YZU 5 3000 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 1-Aug-2012
Addendum-Page 8
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
TPS79933YZUT ACTIVE DSBGA YZU 5 250 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM
TPS79942DDCR ACTIVE SOT DDC 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79942DDCRG4 ACTIVE SOT DDC 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79942DDCT ACTIVE SOT DDC 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79942DDCTG4 ACTIVE SOT DDC 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79945YZUR ACTIVE DSBGA YZU 5 3000 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM
TPS79945YZUT ACTIVE DSBGA YZU 5 250 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
PACKAGE OPTION ADDENDUM
www.ti.com 1-Aug-2012
Addendum-Page 9
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TPS79901, TPS79912, TPS79915, TPS79918, TPS79925, TPS79927, TPS79933 :
•Automotive: TPS79901-Q1, TPS79912-Q1, TPS79915-Q1, TPS79918-Q1, TPS79925-Q1, TPS79927-Q1, TPS79933-Q1
NOTE: Qualified Version Definitions:
•Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TPS79901DDCR SOT DDC 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS79901DDCT SOT DDC 5 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS79901DRVR SON DRV 6 3000 179.0 8.4 2.2 2.2 1.2 4.0 8.0 Q2
TPS79901DRVT SON DRV 6 250 179.0 8.4 2.2 2.2 1.2 4.0 8.0 Q2
TPS79901YZUR DSBGA YZU 5 3000 180.0 8.4 1.07 1.42 0.74 4.0 8.0 Q1
TPS79901YZUT DSBGA YZU 5 250 180.0 8.4 1.07 1.42 0.74 4.0 8.0 Q1
TPS799125YZUR DSBGA YZU 5 3000 180.0 8.4 1.07 1.42 0.74 4.0 8.0 Q1
TPS799125YZUT DSBGA YZU 5 250 180.0 8.4 1.07 1.42 0.74 4.0 8.0 Q1
TPS79912DDCR SOT DDC 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS79912DDCT SOT DDC 5 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS79912DRVR SON DRV 6 3000 179.0 8.4 2.2 2.2 1.2 4.0 8.0 Q2
TPS79912DRVT SON DRV 6 250 179.0 8.4 2.2 2.2 1.2 4.0 8.0 Q2
TPS79912YZUR DSBGA YZU 5 3000 180.0 8.4 1.07 1.42 0.74 4.0 8.0 Q1
TPS79912YZUT DSBGA YZU 5 250 180.0 8.4 1.07 1.42 0.74 4.0 8.0 Q1
TPS79913DDCR SOT DDC 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS79913DDCT SOT DDC 5 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS79913YZUR DSBGA YZU 5 3000 180.0 8.4 1.07 1.42 0.74 4.0 8.0 Q1
TPS79913YZUT DSBGA YZU 5 250 180.0 8.4 1.07 1.42 0.74 4.0 8.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TPS79915DDCR SOT DDC 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS79915DDCT SOT DDC 5 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS79915YZUR DSBGA YZU 5 3000 180.0 8.4 1.07 1.42 0.74 4.0 8.0 Q1
TPS79915YZUT DSBGA YZU 5 250 180.0 8.4 1.07 1.42 0.74 4.0 8.0 Q1
TPS799185DDCR SOT DDC 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS799185DDCT SOT DDC 5 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS799185YZUR DSBGA YZU 5 3000 180.0 8.4 1.07 1.42 0.74 4.0 8.0 Q1
TPS799185YZUT DSBGA YZU 5 250 180.0 8.4 1.07 1.42 0.74 4.0 8.0 Q1
TPS79918DDCR SOT DDC 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS79918DDCT SOT DDC 5 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS79918DRVR SON DRV 6 3000 179.0 8.4 2.2 2.2 1.2 4.0 8.0 Q2
TPS79918DRVT SON DRV 6 250 179.0 8.4 2.2 2.2 1.2 4.0 8.0 Q2
TPS79918YZUR DSBGA YZU 5 3000 180.0 8.4 1.07 1.42 0.74 4.0 8.0 Q1
TPS79918YZUT DSBGA YZU 5 250 180.0 8.4 1.07 1.42 0.74 4.0 8.0 Q1
TPS799195DRVR SON DRV 6 3000 179.0 8.4 2.2 2.2 1.2 4.0 8.0 Q2
TPS799195DRVT SON DRV 6 250 179.0 8.4 2.2 2.2 1.2 4.0 8.0 Q2
TPS79919YZUR DSBGA YZU 5 3000 180.0 8.4 1.07 1.42 0.74 4.0 8.0 Q1
TPS79919YZUT DSBGA YZU 5 250 180.0 8.4 1.07 1.42 0.74 4.0 8.0 Q1
TPS79920YZUR DSBGA YZU 5 3000 180.0 8.4 1.07 1.42 0.74 4.0 8.0 Q1
TPS79920YZUT DSBGA YZU 5 250 180.0 8.4 1.07 1.42 0.74 4.0 8.0 Q1
TPS79921YZUR DSBGA YZU 5 3000 180.0 8.4 1.07 1.42 0.74 4.0 8.0 Q1
TPS79921YZUT DSBGA YZU 5 250 180.0 8.4 1.07 1.42 0.74 4.0 8.0 Q1
TPS79925DDCR SOT DDC 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS79925DDCT SOT DDC 5 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS79925YZUR DSBGA YZU 5 3000 180.0 8.4 1.07 1.42 0.74 4.0 8.0 Q1
TPS79925YZUT DSBGA YZU 5 250 180.0 8.4 1.07 1.42 0.74 4.0 8.0 Q1
TPS79926YZUR DSBGA YZU 5 3000 180.0 8.4 1.07 1.42 0.74 4.0 8.0 Q1
TPS79926YZUT DSBGA YZU 5 250 180.0 8.4 1.07 1.42 0.74 4.0 8.0 Q1
TPS799275YZUR DSBGA YZU 5 3000 180.0 8.4 1.07 1.42 0.74 4.0 8.0 Q1
TPS799275YZUT DSBGA YZU 5 250 180.0 8.4 1.07 1.42 0.74 4.0 8.0 Q1
TPS79927DDCR SOT DDC 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS79927DDCT SOT DDC 5 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS79927DRVR SON DRV 6 3000 179.0 8.4 2.2 2.2 1.2 4.0 8.0 Q2
TPS79927DRVT SON DRV 6 250 179.0 8.4 2.2 2.2 1.2 4.0 8.0 Q2
TPS79927YZUR DSBGA YZU 5 3000 180.0 8.4 1.07 1.42 0.74 4.0 8.0 Q1
TPS79927YZUT DSBGA YZU 5 250 180.0 8.4 1.07 1.42 0.74 4.0 8.0 Q1
TPS799285DDCR SOT DDC 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS799285DDCT SOT DDC 5 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS799285DRVR SON DRV 6 3000 179.0 8.4 2.2 2.2 1.2 4.0 8.0 Q2
TPS799285DRVT SON DRV 6 250 179.0 8.4 2.2 2.2 1.2 4.0 8.0 Q2
TPS799285YZUR DSBGA YZU 5 3000 180.0 8.4 1.07 1.42 0.74 4.0 8.0 Q1
TPS799285YZUT DSBGA YZU 5 250 180.0 8.4 1.07 1.42 0.74 4.0 8.0 Q1
TPS79928DDCR SOT DDC 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TPS79928DDCT SOT DDC 5 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS79928DRVR SON DRV 6 3000 179.0 8.4 2.2 2.2 1.2 4.0 8.0 Q2
TPS79928DRVT SON DRV 6 250 179.0 8.4 2.2 2.2 1.2 4.0 8.0 Q2
TPS79928YZUR DSBGA YZU 5 3000 180.0 8.4 1.07 1.42 0.74 4.0 8.0 Q1
TPS79928YZUT DSBGA YZU 5 250 180.0 8.4 1.07 1.42 0.74 4.0 8.0 Q1
TPS79930DDCR SOT DDC 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS79930DDCT SOT DDC 5 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS79930YZUR DSBGA YZU 5 3000 180.0 8.4 1.07 1.42 0.74 4.0 8.0 Q1
TPS79930YZUT DSBGA YZU 5 250 180.0 8.4 1.07 1.42 0.74 4.0 8.0 Q1
TPS799315DDCR SOT DDC 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS799315DDCT SOT DDC 5 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS799315YZUR DSBGA YZU 5 3000 180.0 8.4 1.07 1.42 0.74 4.0 8.0 Q1
TPS799315YZUT DSBGA YZU 5 250 180.0 8.4 1.07 1.42 0.74 4.0 8.0 Q1
TPS79932YZUR DSBGA YZU 5 3000 180.0 8.4 1.07 1.42 0.74 4.0 8.0 Q1
TPS79932YZUT DSBGA YZU 5 250 180.0 8.4 1.07 1.42 0.74 4.0 8.0 Q1
TPS79933DDCR SOT DDC 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS79933DDCT SOT DDC 5 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS79933DRVR SON DRV 6 3000 179.0 8.4 2.2 2.2 1.2 4.0 8.0 Q2
TPS79933DRVT SON DRV 6 250 179.0 8.4 2.2 2.2 1.2 4.0 8.0 Q2
TPS79933YZUR DSBGA YZU 5 3000 180.0 8.4 1.07 1.42 0.74 4.0 8.0 Q1
TPS79933YZUT DSBGA YZU 5 250 180.0 8.4 1.07 1.42 0.74 4.0 8.0 Q1
TPS79942DDCR SOT DDC 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS79942DDCT SOT DDC 5 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS79945YZUR DSBGA YZU 5 3000 180.0 8.4 1.07 1.42 0.74 4.0 8.0 Q1
TPS79945YZUT DSBGA YZU 5 250 180.0 8.4 1.07 1.42 0.74 4.0 8.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 3
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TPS79901DDCR SOT DDC 5 3000 203.0 203.0 35.0
TPS79901DDCT SOT DDC 5 250 203.0 203.0 35.0
TPS79901DRVR SON DRV 6 3000 203.0 203.0 35.0
TPS79901DRVT SON DRV 6 250 203.0 203.0 35.0
TPS79901YZUR DSBGA YZU 5 3000 210.0 185.0 35.0
TPS79901YZUT DSBGA YZU 5 250 210.0 185.0 35.0
TPS799125YZUR DSBGA YZU 5 3000 210.0 185.0 35.0
TPS799125YZUT DSBGA YZU 5 250 210.0 185.0 35.0
TPS79912DDCR SOT DDC 5 3000 203.0 203.0 35.0
TPS79912DDCT SOT DDC 5 250 203.0 203.0 35.0
TPS79912DRVR SON DRV 6 3000 203.0 203.0 35.0
TPS79912DRVT SON DRV 6 250 203.0 203.0 35.0
TPS79912YZUR DSBGA YZU 5 3000 210.0 185.0 35.0
TPS79912YZUT DSBGA YZU 5 250 210.0 185.0 35.0
TPS79913DDCR SOT DDC 5 3000 203.0 203.0 35.0
TPS79913DDCT SOT DDC 5 250 203.0 203.0 35.0
TPS79913YZUR DSBGA YZU 5 3000 210.0 185.0 35.0
TPS79913YZUT DSBGA YZU 5 250 210.0 185.0 35.0
TPS79915DDCR SOT DDC 5 3000 203.0 203.0 35.0
TPS79915DDCT SOT DDC 5 250 203.0 203.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 4
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TPS79915YZUR DSBGA YZU 5 3000 210.0 185.0 35.0
TPS79915YZUT DSBGA YZU 5 250 210.0 185.0 35.0
TPS799185DDCR SOT DDC 5 3000 203.0 203.0 35.0
TPS799185DDCT SOT DDC 5 250 203.0 203.0 35.0
TPS799185YZUR DSBGA YZU 5 3000 210.0 185.0 35.0
TPS799185YZUT DSBGA YZU 5 250 210.0 185.0 35.0
TPS79918DDCR SOT DDC 5 3000 203.0 203.0 35.0
TPS79918DDCT SOT DDC 5 250 203.0 203.0 35.0
TPS79918DRVR SON DRV 6 3000 203.0 203.0 35.0
TPS79918DRVT SON DRV 6 250 203.0 203.0 35.0
TPS79918YZUR DSBGA YZU 5 3000 210.0 185.0 35.0
TPS79918YZUT DSBGA YZU 5 250 210.0 185.0 35.0
TPS799195DRVR SON DRV 6 3000 203.0 203.0 35.0
TPS799195DRVT SON DRV 6 250 203.0 203.0 35.0
TPS79919YZUR DSBGA YZU 5 3000 210.0 185.0 35.0
TPS79919YZUT DSBGA YZU 5 250 210.0 185.0 35.0
TPS79920YZUR DSBGA YZU 5 3000 210.0 185.0 35.0
TPS79920YZUT DSBGA YZU 5 250 210.0 185.0 35.0
TPS79921YZUR DSBGA YZU 5 3000 210.0 185.0 35.0
TPS79921YZUT DSBGA YZU 5 250 210.0 185.0 35.0
TPS79925DDCR SOT DDC 5 3000 203.0 203.0 35.0
TPS79925DDCT SOT DDC 5 250 203.0 203.0 35.0
TPS79925YZUR DSBGA YZU 5 3000 210.0 185.0 35.0
TPS79925YZUT DSBGA YZU 5 250 210.0 185.0 35.0
TPS79926YZUR DSBGA YZU 5 3000 210.0 185.0 35.0
TPS79926YZUT DSBGA YZU 5 250 210.0 185.0 35.0
TPS799275YZUR DSBGA YZU 5 3000 210.0 185.0 35.0
TPS799275YZUT DSBGA YZU 5 250 210.0 185.0 35.0
TPS79927DDCR SOT DDC 5 3000 203.0 203.0 35.0
TPS79927DDCT SOT DDC 5 250 203.0 203.0 35.0
TPS79927DRVR SON DRV 6 3000 203.0 203.0 35.0
TPS79927DRVT SON DRV 6 250 203.0 203.0 35.0
TPS79927YZUR DSBGA YZU 5 3000 210.0 185.0 35.0
TPS79927YZUT DSBGA YZU 5 250 210.0 185.0 35.0
TPS799285DDCR SOT DDC 5 3000 203.0 203.0 35.0
TPS799285DDCT SOT DDC 5 250 203.0 203.0 35.0
TPS799285DRVR SON DRV 6 3000 203.0 203.0 35.0
TPS799285DRVT SON DRV 6 250 203.0 203.0 35.0
TPS799285YZUR DSBGA YZU 5 3000 210.0 185.0 35.0
TPS799285YZUT DSBGA YZU 5 250 210.0 185.0 35.0
TPS79928DDCR SOT DDC 5 3000 203.0 203.0 35.0
TPS79928DDCT SOT DDC 5 250 203.0 203.0 35.0
TPS79928DRVR SON DRV 6 3000 203.0 203.0 35.0
TPS79928DRVT SON DRV 6 250 203.0 203.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 5
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TPS79928YZUR DSBGA YZU 5 3000 210.0 185.0 35.0
TPS79928YZUT DSBGA YZU 5 250 210.0 185.0 35.0
TPS79930DDCR SOT DDC 5 3000 203.0 203.0 35.0
TPS79930DDCT SOT DDC 5 250 203.0 203.0 35.0
TPS79930YZUR DSBGA YZU 5 3000 210.0 185.0 35.0
TPS79930YZUT DSBGA YZU 5 250 210.0 185.0 35.0
TPS799315DDCR SOT DDC 5 3000 203.0 203.0 35.0
TPS799315DDCT SOT DDC 5 250 203.0 203.0 35.0
TPS799315YZUR DSBGA YZU 5 3000 210.0 185.0 35.0
TPS799315YZUT DSBGA YZU 5 250 210.0 185.0 35.0
TPS79932YZUR DSBGA YZU 5 3000 210.0 185.0 35.0
TPS79932YZUT DSBGA YZU 5 250 210.0 185.0 35.0
TPS79933DDCR SOT DDC 5 3000 203.0 203.0 35.0
TPS79933DDCT SOT DDC 5 250 203.0 203.0 35.0
TPS79933DRVR SON DRV 6 3000 203.0 203.0 35.0
TPS79933DRVT SON DRV 6 250 203.0 203.0 35.0
TPS79933YZUR DSBGA YZU 5 3000 210.0 185.0 35.0
TPS79933YZUT DSBGA YZU 5 250 210.0 185.0 35.0
TPS79942DDCR SOT DDC 5 3000 203.0 203.0 35.0
TPS79942DDCT SOT DDC 5 250 203.0 203.0 35.0
TPS79945YZUR DSBGA YZU 5 3000 210.0 185.0 35.0
TPS79945YZUT DSBGA YZU 5 250 210.0 185.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 6
X: Max =
Y: Max =
1.387 mm, Min =
1.021 mm, Min =
1.287 mm
0.92 mm
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
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TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
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