Features n Surface mount packaging for automated assembly n Small footprint size (1210) and low profile for space-constrained mobile applications n Ultra-low resistance, quick response n RoHS compliant* n Agency recognition: MF-USML/X Series - Low Ohmic PTC Resettable Fuses Electrical Characteristics Model MF-USML175/12 V max. I max. Ihold Itrip at 23 C Volts 12 Amps Amps Resistance Max. Time To Trip at 23 C Ohms at 23 C 50 1.75 3.5 Rmin 0.006 R1max 0.050 Amps 8.0 Seconds Tripped Power Dissipation Watts at 23 C Typ. 0.8 1.0 Certifications cUL TUV E174545 R50391579 3 3 MF-USML200/12 12 50 2.0 4.0 0.005 0.040 8.0 5.0 1.0 3 3 MF-USML260/12 12 50 2.6 5.2 0.004 0.030 8.0 5.0 1.0 3 3 MF-USML300/12 12 50 3.0 6.0 0.003 0.024 15.0 5.0 1.0 3 3 MF-USML350/12 12 50 3.5 7.0 0.002 0.022 17.0 5.0 1.0 3 3 MF-USML380/12 12 50 3.8 7.6 0.002 0.020 19.0 5.0 1.0 3 3 MF-USML400/12 12 50 4.0 8.0 0.002 0.018 20.0 5.0 1.0 3 3 MF-USML450/12 12 50 4.5 9.0 0.002 0.014 22.5 2.0 1.0 3 3 MF-USML500/12 12 50 5.0 10.0 0.001 0.012 25.0 2.0 1.2 3 3 MF-USML550/12 12 50 5.5 11.0 0.001 0.010 27.5 2.0 1.2 3 3 Environmental Characteristics Operating Temperature.......................................... -40 C to +85 C Storage Condition Before Opening................................................ +40 C max. / 70 % RH max. After Opening................................................... +40 C max. / 10 % RH max. Floor Condition After Opening............................... Consumption within 4 weeks at floor condition +30 C max. / 60 % RH max. Passive Aging........................................................ +85 C, 1000 hours................................................ 10 % typical resistance change Humidity Aging...................................................... +85 C, 85 % R.H. 100 hours................................ 15 % typical resistance change Thermal Shock...................................................... +85 C to -40 C, 20 times..................................... 30 % typical resistance change Solvent Resistance................................................ MIL-STD-202, Method 215.................................... No change (marking still legible) Vibration................................................................ MIL-STD-883C, Method 2007.1,............................ No change (Rmin<R<R1max) Condition A Moisture Sensitivity Level (MSL)........................... See Note ESD Classification - HBM...................................... 6 Test Procedures and Requirements Test Test Conditions Accept/Reject Criteria Visual/Mech........................................................... Verify dimensions and materials............................ Per MF physical description Resistance............................................................. In still air @ 23 C.................................................. Rmin R R1max Time to Trip............................................................ At specified current, Vmax, 23 C........................... T max. time to trip (seconds) Hold Current.......................................................... 30 min. at Ihold....................................................... No trip Trip Cycle Life........................................................ Vmax, Imax, 100 cycles.......................................... No arcing or burning Trip Endurance...................................................... Vmax, 48 hours...................................................... No arcing or burning Solderability........................................................... 245 C 5 C, 5 seconds....................................... 95 % min. coverage WARNING Cancer and Reproductive Harm - www.P65Warnings.ca.gov * RoHS Directive 2015/863, Mar 31, 2015 and Annex. ** Bourns considers a product to be "halogen free" if (a) the Bromine (Br) content is 900 ppm or less; (b) the Chlorine (Cl) content is 900 ppm or less; and (c) the total Bromine (Br) and Chlorine (Cl) content is 1500 ppm or less. Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. Applications n n n n n n n Li-ion battery pack protection Power delivery port protection Higher voltage withstand PC motherboards - Plug & Play protection Mobile phones - battery & charging protection USB port protection Game console port protection MF-USML/X Series - Low Ohmic PTCFuses Resettable Fuses MF-NSMF Series - PTC Resettable Product Dimensions A Model MF-USML175/12 MF-USML200/12 MF-USML260/12 B C D E Min. Max. Min. Max. Min. Max. Min. Min. Max. 3.00 (0.12) 3.43 (0.14) 2.35 (0.09) 2.80 (0.11) 0.40 (0.016) 0.80 (0.031) 0.25 (0.010) 0.05 (0.002) 0.45 (0.018) 3.00 (0.12) 3.43 (0.14) 2.35 (0.09) 2.80 (0.11) 0.60 (0.024) 1.20 (0.047) 0.25 (0.010) 0.05 (0.002) 0.45 (0.018) MF-USML300/12 MF-USML350/12 MF-USML380/12 MF-USML400/12 MF-USML450/12 MF-USML500/12 MF-USML550/12 DIMENSIONS: MM (INCHES) Side View Top View A C Terminal material: ENIG-plated terminals Bottom View D E Recommended Pad Layout 1.0 0.05 (.039 .002) 1.0 0.05 (.039 .002) B 2.5 0.1 (.098 .004) 2.0 0.1 (.079 .004) Packaging Quantity MF-USML175/12 ~ MF-USML260/12 = 5000 pcs. per reel MF-USML300/12 ~ MF-USML550/12 = 3500 pcs. per reel Thermal Derating Table - Ihold (Amps) Model Ambient Operating Temperature -40 C -20 C 0 C 23 C 40 C 50 C 60 C 70 C 85 C MF-USML175/12 2.57 2.33 2.07 1.75 1.49 1.34 1.24 1.00 0.88 MF-USML200/12 2.94 2.65 2.35 2.00 1.70 1.53 1.42 1.14 1.00 MF-USML260/12 3.82 3.46 3.07 2.60 2.21 1.95 1.85 1.48 1.30 MF-USML300/12 4.41 3.99 3.54 3.00 2.55 2.30 2.13 1.71 1.50 MF-USML350/12 5.10 4.65 4.13 3.50 2.98 2.65 2.50 2.00 1.75 MF-USML380/12 5.59 5.05 4.48 3.80 3.23 2.95 2.70 2.17 1.90 MF-USML400/12 5.80 5.25 4.70 4.00 3.40 3.10 2.80 2.28 2.00 MF-USML450/12 6.30 5.65 4.95 4.50 3.83 3.40 2.95 2.50 2.05 MF-USML500/12 7.00 6.25 5.50 5.00 4.25 3.75 3.25 2.75 2.25 MF-USML550/12 7.70 6.90 6.05 5.50 4.68 4.15 3.60 3.05 2.40 Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. MF-USML/X Low OhmicPotentiometer PTC Resettable Fuses 3312 - 2 mmSeries SMD -Trimming Solder Reflow Recommendations Notes: tp TP * CRITICAL ZONE T L TO TP RAMP-UP * TL Temperature tL * Ts max RAMP-DOWN Ts min * * ts PREHEAT MF-USML/X models cannot be wave soldered or hand soldered. Please contact Bourns for soldering recommendations. All temperatures refer to topside of the package, measured on the package body surface. If reflow temperatures exceed the recommended profile, devices may not meet the published specifications. Compatible with Pb and Pb-free solder reflow profiles. Excess solder may cause a short circuit. Please refer to the Multifuse(R) Polymer PTC Soldering Recommendation guidelines. 25 t 25 C TO PEAK Time Profile Feature Pb-Free Assembly Average Ramp-Up Rate (Ts max to Tp) PREHEAT: Temperature Min. (Tsmin) Temperature Max. (Tsmax) Process Time (Tsmin to Tsmax) (ts) Materials Description MAINTAINED ABOVE: 1. TIME Apply solder paste to * Sn 96.5 / Ag 3.0 / Cu 0.5 test Temperature board (8 - 10 mil(T thick) Alloy water soluble or no L) clean solder paste Time (tL) 3 C / second max. Temperature Room temperature (see note 1) 150 C 200 C Inspect solder joint to determine if solder joint is Time 60~180 seconds Interval acceptable (i.e. exhibits wetting of joint's surface). Use the following criteria (ref. acceptability of printed board assemblies, IPC-A-610): 217 C A) Acceptable (see Figure 1) 60~150 seconds (1) The solder connection wetting angle (solder to component and solder to PCB termination) does not exceed 90 . Peak Temperature (Tp) * single sided epoxy glass 260 C * PCPeak boardTemperature approx. 4x4x.06 in. Time within 5 C of Actual (tp) 20~40 seconds (2) Solder balls that do not violate minimum (G10) (UL approved) 2. Place test units onto board 6 units/board 3. Ramp up Convection oven Ramp-Down Rate 4. Time Preheat25 (TSC ) to Peak Temperature 5. Time above liquidus (TL) 6. Peak temperature (TP) How to Order MF - USML 400 / 12 - 2 7. Ramp down Multifuse(R) 8.Product CleaningDesignator water clean profile High pressure deionized water 65 PSI max. Series USML = 1210 Low Ohmic Surface Mount Component Temperature Hold Current, Iof Lead/Pad Junction hold 175 - 550 (1.75 Amps - 5.50 Amps) (Derived using 6-zone Convection Oven) Maximum Voltage, Vmax 12 = 12 Volts Packaging -2 = Tape and Reel Packaged per EIA 481 MF-USML/X SERIES, REV. A, 03/19 (see note 2) electrical clearances and are attached 6 C / second max. (soldered) to a metal surface. 2.5 C 0.5 /sec. Unacceptable (see Figure 2) max. 90 30 s8 ec.minutes B) (1) Solder connection wetting angle exceeding 220 C 60-90 sec. 90 . 250 C +0 /-5 Typical Part Marking (2) Incomplete reflow of solder paste. 10-20 sec. within 5 C of peak (3) Dewetting. 150 C to 190 C Represents total content. Layout may vary. Room temperature (see note 2) 3 C 0.5 C/sec. If unacceptable, determine cause and correct prior to next run. PART IDENTIFICATION: 72 F to 160 F (22 C to 71 C) As required NOTES: MF-USML175/12 = H12 MF-USML200/12 = J12 MF-USML260/12 = N12 1. Water soluble solder paste only above 100K. MF-USML300/12 = P12 2. Refer to ref. temperature =profile. MF-USML350/12 S12 Temperature at lead/pad junction with "K"= type MF-USML380/12 V12 thermocouple. = U12for environmental 3. Units thatMF-USML400/12 are board mounted MF-USML450/12 = X12 testing must see a peak temperature in the reflow MF-USML500/12 = Y12 zone, as specified. This is to ensure that all test MF-USML550/12 = 512 U12 units will see "worst case conditions". 4. Ramp down rate to be measured from 245 C to 150 C. MANUFACTURING DATE CODE IS LOCATED ON PACKING LABEL. 5. Process Description 8 does not apply to open frame trimmers. Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. MF-USML/X Series - Low Ohmic PTCFuses Resettable Fuses MF-NSMF Series - PTC Resettable Packaging Specifications MF-USML/X Series per EIA 481 0.6 MAX. (.024) 1.50 +0.1 / -0 DIA. (.059 +.004 / -0) 4.0 0.10 (.157 .004) 2.0 0.05 (.079 .002) 5.50 0.05 (.216 .002) 12.0 0.30 (.472 .012) 4.5 MAX. (.177) K0 1.75 0.10 (.069 .004) COVER TAPE 3.50 0.10 (.138 .004) 0.1 MAX. (.004) 4.0 0.10 (.157 .004) LEADER MIN. 390 (15.35) 2.90 0.10 (.114 .004) 10.25 TYP. (.404) TRAILER MIN. 160 (6.30) K0 0.65 0.10 MF-USML175/12 ~ MF-USML260/12 (.026 .004) 1.10 0.10 MF-USML300/12 ~ MF-USML550/12 (.043 .004) 185 MAX. (7.283) 15.4* MAX. (.606) 50 MIN. (1.97) HUB DIA. 12.4 +1 / -0* (.488 +.039 / -0) *MEASURED AT HUB DIMENSIONS: MM (INCHES) Asia-Pacific: Tel: +886-2 2562-4117 * Email: asiacus@bourns.com EMEA: Tel: +36 88 885 877 * Email: eurocus@bourns.com The Americas: Tel: +1-951 781-5500 * Email: americus@bourns.com www.bourns.com Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. Bourns PPTC Resettable Fuses 3312 - (R)2 Multifuse mm SMD(R) Trimming Potentiometer Application Notice * Users are responsible for independent and adequate evaluation of Bourns(R) Multifuse(R) Polymer PTC devices in the user's application, including the PPTC device characteristics stated in the applicable data sheet. * Polymer PTC devices must not be allowed to operate beyond their stated maximum ratings. Operation in excess of such maximum ratings could result in damage to the PTC device and possibly lead to electrical arcing and/or fire. Circuits with inductance may generate a voltage above the rated voltage of the polymer PTC device and should be thoroughly evaluated within the user's application during the PTC selection and qualification process. * Polymer PTC devices are intended to protect against adverse effects of temporary overcurrent or overtemperature conditions up to rated limits and are not intended to serve as protective devices where overcurrent or overvoltage conditions are expected to be repetitive or prolonged. * In normal operation, polymer PTC devices experience thermal expansion under fault conditions. Thus, a polymer PTC device must be protected against mechanical stress, and must be given adequate clearance within the user's application to accommodate such thermal expansion. Rigid potting materials or fixed housings or coverings that do not provide adequate clearance should be thoroughly examined and tested by the user, as they may result in the malfunction of polymer PTC devices if the thermal expansion is inhibited. * Exposure to lubricants, silicon-based oils, solvents, gels, electrolytes, acids, and other related or similar materials may adversely affect the performance of polymer PTC devices. * Aggressive solvents may adversely affect the performance of polymer PTC devices. Conformal coating, encapsulating, potting, molding, and sealing materials may contain aggressive solvents including but not limited to xylene and toluene, which are known to cause adverse effects on the performance of polymer PTCs. Such aggressive solvents must be thoroughly cured or baked to ensure their complete removal from polymer PTCs to minimize the possible adverse effect on the device. * Recommended storage conditions should be followed at all times. Such conditions can be found on the applicable data sheet and on the Multifuse(R) Polymer PTC Moisture/Reflow Sensitivity Classification (MSL) note: https://www.bourns.com/docs/RoHS-MSL/msl_mf.pdf MFAN 12/18 Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. Legal Disclaimer Notice This legal disclaimer applies to purchasers and users of Bourns(R) products manufactured by or on behalf of Bourns, Inc. and its affiliates (collectively, "Bourns"). Unless otherwise expressly indicated in writing, Bourns(R) products and data sheets relating thereto are subject to change without notice. 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