CM8064401724501S R204 - INTEL

Intel® Xeon® Processor E5-2643 v3

(20M Cache, 3.40 GHz)

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Specifications

Essentials

Performance

Memory Specifications

Expansion Options

Package Specifications

Advanced Technologies

Intel® Data Protection

Technology

Intel® Platform

Protection Technology

Compatible Products

Ordering / sSpecs /

Steppings

Specifications

-Essentials

Status Launched

Launch Date Q3'14

Processor Number E5-2643V3

Intel® Smart Cache 20 MB

Intel® QPI Speed 9.6 GT/s

# of QPI Links 2

Instruction Set 64-bit

Instruction Set Extensions AVX 2.0

Embedded Options Available No

Lithography 22 nm

Scalability 2S

VID Voltage Range 0.65V–1.30V

Recommended Customer Price TRAY: $1552.00

Datasheet Link

Product Brief Link

Additional Information URL Link

-Performance

# of Cores 6

# of Threads 12

Processor Base Frequency 3.4 GHz

Max Turbo Frequency 3.7 GHz

TDP 135 W

-Memory Specifications

Max Memory Size (dependent on memory type) 768 GB

Memory Types DDR4-1600/1866/2133

# of Memory Channels 4

Max Memory Bandwidth 68 GB/s

Physical Address Extensions 46-bit

ECC Memory Supported ‡Yes

-Expansion Options

PCI Express Revision 3.0

PCI Express Configurations ‡x4, x8, x16

Max # of PCI Express Lanes 40

-Package Specifications

Max CPU Configuration 2

TCASE 77.3°C

Package Size 52.5mm x 45mm

Sockets Supported FCLGA2011-3

Low Halogen Options Available See MDDS

-Advanced Technologies

Intel® Turbo Boost Technology ‡2.0

Intel® vPro Technology ‡Yes

Intel® Hyper-Threading Technology ‡Yes

Intel® Virtualization Technology (VT-x) ‡Yes

Intel® Virtualization Technology for Directed I/O (VT-

d) ‡Yes

Intel® VT-x with Extended Page Tables (EPT) ‡Yes

Related Products

Intel® Xeon® Processor

E5 v3 Family

Intel® Xeon® Processor

E5-2600 v3 Product Family

Products formerly Haswell

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PCN/MDDS Information

SR204

936799: MDDS

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ARK | Intel® Xeon® Processor E5-2643 v3 (20M Cache, 3.40 GHz) 12/31/2014

http://ark.intel.com/products/81900/Intel-Xeon-Processor-E5-2643-v3-20M-Cache-3_40-GHz#@specifications 1 / 3

All information prov ided is subject to change at any  time, without notice. Intel may make changes to manufacturing life cy cle, specifications, and product descriptions at any time, without notice. The
information herein is prov ided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy  of the information, nor on the product features, availability, functionality, or
compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
"Intel classifications" consist of Export Control Classification Numbers (EC CN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not
be construed as a representation or warranty regarding the proper EC C N or HTS. Your company  may be the exporter of record, and as such, your company  is responsible for determining the correct
classification of any  item at the time of export.
Refer to Datasheet for formal definitions of product properties and features.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
Some products can support AES New Instructions with a Processor C onfiguration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. Please contact
OEM for the BIO S that includes the latest Processor configuration update.
‡ This feature may not be available on all computing systems. Please check  with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard,
processor, chipset, power supply, HDD, graphics controller, memory , BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality,
performance, and other benefits of this feature may vary depending on system configuration.
“Conflict free” and “conflict-free” means “DRC conflict free”, which is defined by  the U.S. Securities and Exchange Commission rules to mean products that do not contain conflict minerals (tin, tantalum,
tungsten and/or gold) that directly or indirectly finance or benefit armed groups in the Democratic Republic of the Congo (DRC ) or adjoining countries. Intel also uses the term "conflict-free" in a broader
sense to refer to suppliers, supply chains, smelters and refiners whose sources of conflict minerals do not finance conflict in the DRC or adjoining countries. Intel processors manufactured before January  1,
2013 are not confirmed conflict free. The conflict free designation refers only  to product manufactured after that date. For Intel Boxed Processors, the conflict free designation refers to the processor only,
not to any  additional included accessories, such as heatsinks/coolers.
See http://www.intel.com/content/www/us/en/architecture-and-technology/hy per-threading/hy per-threading-technology.html?wapk w=hy per+threading for more information including details on which
processors support Intel® HT Technology.
Max Turbo Frequency  refers to the maximum single-core processor frequency that can be achieved with Intel® Turbo Boost Technology. See www.intel.com/technology /turboboost/ for more
information.
The Recommended C ustomer Price (“RCP”) is pricing guidance for Intel products. Prices are for direct Intel customers and are subject to change without notice. Taxes and shipping, etc. not included. Prices
may vary for other pack age types and shipment quantities, and special promotional arrangements may apply. Listing of these RCP does not constitute a formal pricing offer from Intel. Please work with
your appropriate Intel representative to obtain a formal price quotation.
Sy stem and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/O s for chipsets are used.
Low Halogen: A pplies only to brominated and chlorinated flame retardants (BF Rs/CFRs) and PVC in the final product. Intel components as well as purchased components on the finished assembly meet JS-
709 requirements, and the PC B / substrate meet IEC 61249-2-21 requirements. The replacement of halogenated flame retardants and/or PVC may not be better for the env ironment.
For benchmark ing data see http://www.intel.com/performance.
Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See
http://www.intel.com/content/www/us/en/processors/processor-numbers.html for details.
Processors that support 64-bit computing on Intel® architecture require an Intel 64 architecture-enabled BIOS.
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Intel® TSX-NI No
Intel® 64 ‡Yes
Idle States Yes
Enhanced Intel SpeedStep® Technology Yes
Intel® Demand Based Switching Yes
Thermal Monitoring Technologies Yes
Intel® Flex Memory Access No
Intel® Identity Protection Technology ‡No
-Intel® Data Protection Technology
AES New Instructions Yes
Secure Key Yes
-Intel® Platform Protection Technology
OS Guard Yes
Trusted Execution Technology ‡Yes
Execute Disable Bit ‡Yes
ARK | Intel® Xeon® Processor E5-2643 v3 (20M Cache, 3.40 GHz) 12/31/2014
http://ark.intel.com/products/81900/Intel-Xeon-Processor-E5-2643-v3-20M-Cache-3_40-GHz#@specifications 2 / 3