TVS Diode Arrays (SPA(R) Diodes) General Purpose ESD Protection - SP1001 Series SP1001 Series - 8pF 15kV Unidirectional TVS Array RoHS Pb GREEN Description Zener diodes fabricated in a proprietary silicon avalanche technology protect each I/O pin to provide a high level of protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes above the maximum level specified in the IEC 61000-4-2 international standard (Level 4, 8kV contact discharge) without performance degradation. Their very low loading capacitance also makes them ideal for protecting highspeed signal pins. Features Pinout *SP1001-02 (SC70-3) *SP1001-04 (SC70-5) 1 1 5 3 2 4 SP1001-04 (SOT 553) 2 3 1 6 NC 2 5 2 3 4 NC SP1001-05 (SOT 563) 5 SP1001-05 (SOT 963) 1 6 1 2 5 2 5 4 3 4 3 4 SP1001-02 (SOT 553) *SP1001-05 (SC70-6) 2 3 1 0.5 to 0.1A (MAX) at 5V * Low capacitance of 8pF (TYP) per I/O 6 *Note: AEC-Q101 qualified Functional Block Diagram SP1001-02 2 1 5 4 * Small package saves board space * ESD protection of 15kV contact discharge, 30kV air discharge, (Level 4, IEC 61000-4-2) * Lightning protection, IEC 61000-4-5, 2nd edition 2A (8/20s) * EFT protection, IEC 61000-4-4, 40A (5/50ns) * AEC-Q101 qualified (SC70-x packages) * RoHS compliant and leadfree * Low leakage current of Applications * Computer Peripherals * LCD/PDP TVs * Mobile Phones * Set Top Boxes * Digital Cameras * DVD Players * Desktops/Notebooks * MP3/PMP SP1001-02 4 5 Application Example LCD module Controller Input 3 1 SP1001-05 4 2 3 6 1 5 2 4 3 Outside World SP1001-04 5 D1 D2 D3 D4 2 SP 1001-04JTG (SC70-5) SP 1001-04XTG (SOT553) Shield Ground Signal Ground Additional Information Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. Resources Samples (c) 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/12/17 TVS Diode Arrays (SPA(R) Diodes) General Purpose ESD Protection - SP1001 Series Absolute Maximum Ratings Symbol Thermal Information Parameter Value Units 2 A Storage Temperature Range Operating Temperature -40 to 125 C Storage Temperature -55 to 150 C IPP Peak Current (tp=8/20s) TOP TSTOR Parameter CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Rating Units -55 to 150 C Maximum Junction Temperature 150 C Maximum Lead Temperature (Soldering 20s-40s) 260 C Electrical Characteristics (TOP = 25C) Parameter Symbol Test Conditions Min Typ Max Units VF IF=10mA 0.7 0.9 1.2 V 6.0 8.5 V 5.5 V Forward Voltage Drop VR IR=1mA Reverse Standoff Voltage Reverse Voltage Drop VRWM IR1A Reverse Leakage Current ILEAK Clamp Voltage1 VR=5V VC Dynamic Resistance RDYN ESD Withstand Voltage1,2 VESD Diode Capacitance1 CD 0.1 A IPP=1A, tp=8/20s, Fwd 8.0 11.0 V IPP=2A, tp=8/20s, Fwd 9.7 13.0 (VC2 - VC1) / (IPP2 - IPP1) 1.7 IEC61000-4-2 (Contact) 15 IEC61000-4-2 (Air) 30 V kV kV Reverse Bias=0V 12 pF Reverse Bias=2.5V 8 pF Reverse Bias=5V 7 pF Notes: 1 Parameter is guaranteed by device characterization 2 A minimum of 1,000 ESD pulses are applied at 1s intervals between the anode and common cathode of each diode Design Consideration Capacitance vs. Reverse Bias Because of the fast rise-time of the ESD transient, placement of ESD devices is a key design consideration. To achieve optimal ESD suppression, the devices should be placed on the circuit board as close to the source of the ESD transient as possible. Install the ESD suppressors directly behind the connector so that they are the first board-level circuit component encountered by the ESD transient. They are connected from signal/data line to ground. 14 12 Capacitance (pF) 10 8 6 4 2 0 0 0.5 1 1.5 2 2.5 3 3.5 DC Bias (V) (c) 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/12/17 4 4.5 5 5.5 6 TVS Diode Arrays (SPA(R) Diodes) General Purpose ESD Protection - SP1001 Series Soldering Parameters Pb - Free assembly Reflow Condition Pre Heat - Temperature Min (Ts(min)) 150C - Temperature Max (Ts(max)) 200C - Time (min to max) (ts) 60 - 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3C/second max TS(max) to TL - Ramp-up Rate 3C/second max Reflow - Temperature (TL) (Liquidus) 217C - Temperature (tL) 60 - 150 seconds Peak Temperature (TP) 260+0/-5 C Time within 5C of actual peak Temperature (tp) 20 - 40 seconds Ramp-down Rate 6C/second max Time 25C to peak Temperature (TP) 8 minutes max. Do not exceed 260C Part Numbering System Product Characteristics SP1001-0* * T G TVS Diode Arrays (SPA(R) Diodes) G= Green T= Tape & Reel Package Series Number of Channels J = SC70-3, SC70-5 or SC70-6 X = SOT553 or SOT563 V = SOT963 02 = 2 Channel 04 = 4 Channel 05 = 5 Channel Part Marking System Matte Tin (SC70-x) Pre-Plated Frame (SOT5x3, SOT963) Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Substitute Material Silicon Body Material Molded Epoxy Flammability UL 94 V-0 Notes : 1. All dimensions are in millimeters A* * A** Lead Plating Product Series 2. Dimensions include solder plating. Number of Channels A = SP1001 series (varies) Assembly Site 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. (varies) Ordering Information Part Number Package Marking Min. Order Qty. SP1001-02JTG SC70-3 A*2 3000 SP1001-02XTG SOT553 A*2 3000 SP1001-04JTG SC70-5 A*4 3000 SP1001-04XTG SOT553 A*4 3000 SP1001-05JTG SC70-6 A*5 3000 SP1001-05VTG SOT963 A*5 8000 SP1001-05XTG SOT563 A*5 3000 (c) 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/12/17 TVS Diode Arrays (SPA(R) Diodes) General Purpose ESD Protection - SP1001 Series Package Dimensions -- SC70 SC70-3 B Solder Pad Layout 3 Package SC70-3 Pins 3 JEDEC MO-203 Millimeters E HE 2 1 e e D A2 A A1 Max Min Max A 0.80 1.10 0.031 0.043 A1 0.00 0.10 0.000 0.004 A2 0.70 1.00 0.028 0.039 B 0.15 0.30 0.006 0.012 c 0.08 0.25 0.003 0.010 D 1.85 2.25 0.073 0.089 E 1.15 1.35 0.045 0.053 0.66 BSC e C L 6 SC70-5 e e 5 not used Solder Pad Layout 4 2.00 2.40 0.079 0.094 L 0.26 0.46 0.010 0.018 Package SC70-5 Pins 5 JEDEC MO-203 Millimeters 3 2 1 B D A2 A A1 C L 6 SC70-6 B 5 4 Solder Pad Layout E 1 2 HE Min Max Min Max 0.80 1.10 0.031 0.043 A1 0.00 0.10 0.000 0.004 A2 0.70 1.00 0.028 0.039 B 0.15 0.30 0.006 0.012 c 0.08 0.25 0.003 0.010 D 1.85 2.25 0.073 0.089 E 1.15 1.35 0.045 0.053 0.65 BSC 2.00 2.40 0.079 0.094 L 0.26 0.46 0.010 0.018 Package SC70-6 Pins 6 JEDEC MO-203 Millimeters 3 D A2 A A1 C (c) 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/12/17 Max Inches Min Max A 0.80 1.10 0.031 0.043 A1 0.00 0.10 0.000 0.004 A2 0.70 1.00 0.028 0.039 B 0.15 0.30 0.006 0.012 c 0.08 0.25 0.003 0.010 D 1.85 2.25 0.073 0.089 E 1.15 1.35 0.045 0.053 e L 0.026 BSC HE Min B Inches A e B 0.026 BSC HE HE E Inches Min 0.65 BSC 0.026 BSC HE 2.00 2.40 0.079 0.094 L 0.26 0.46 0.010 0.018 TVS Diode Arrays (SPA(R) Diodes) General Purpose ESD Protection - SP1001 Series Package Dimensions -- SOT553 and SOT563 A 6 Package L D SOT 553 5 (not used) 4 E HE 5 Millimeters Solder Pad Layout e Max Min Max 0.50 0.60 0.020 0.024 B 0.17 0.27 0.007 0.011 c 0.08 0.18 0.003 0.007 D 1.50 1.70 0.059 0.067 E 1.10 1.30 0.043 0.051 c B 0.50 BSC e A D 6 5 2 4 3 e E L SOT 563 L 0.10 0.30 0.004 0.012 1.50 1.70 0.059 0.067 Package SOT 563 Pins 6 Millimeters Inches Min Max Min Max 0.50 0.60 0.020 0.024 B 0.17 0.27 0.007 0.011 c 0.08 0.18 0.003 0.007 D 1.50 1.70 0.059 0.067 E 1.10 1.30 0.043 0.051 HE A B 0.020 BSC HE Solder Pad Layout c Inches Min A 3 2 SOT 553 Pins 0.50 BSC e 0.020 BSC L 0.10 0.30 0.004 0.012 HE 1.50 1.70 0.059 0.067 Package Dimensions -- SOT963 Package SOT 963 Pins 6 Millimeters Inches Min Nom Max Min Nom Max 0.44 0.48 0.50 0.0173 0.0189 0.0197 B 0.10 0.15 0.20 0.004 0.006 0.008 c 0.05 0.10 0.15 0.002 0.004 0.006 A D 0.95 1.00 1.05 0.037 0.039 0.041 E 0.75 0.80 0.85 0.029 0.031 0.033 E1 0.95 1.00 1.05 0.037 0.039 0.041 0.35 BSC e 0.014 BSC L 0.05 0.10 0.15 0.002 0.004 0.006 L1 0.125 0.15 0.175 0.005 0.006 0.007 o 3 5 7 3 5 7 Recommanded Solder Pad Layout (c) 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/12/17 TVS Diode Arrays (SPA(R) Diodes) General Purpose ESD Protection - SP1001 Series Embossed Carrier Tape & Reel Specification -- SC70-3 Dimensions Millimetres Min Inches Max Min Max E 1.65 1.85 0.065 0.073 F 3.45 3.55 0.135 0.139 P2 1.95 2.05 0.077 0.081 D 1.40 1.60 0.055 0.063 D1 1.00 1.25 0.039 0.049 P0 3.90 4.10 0.154 0.161 10P0 40.0 0.20 1.574 0.008 W 7.70 8.10 0.303 0.318 P 3.90 4.10 0.153 0.161 A0 2.30 2.50 0.090 0.098 1.00 Ref A1 B0 2.30 2.50 0.090 1.90 Ref B1 K0 0.039 Ref 0.098 0.074 1.10 1.30 0.043 0.051 K1 0.60 Ref 0.023 Ref t 0.27 max 0.010 Millimetres Inches Embossed Carrier Tape & Reel Specification -- SC70-5 and SC70-6 Dimensions Min Max Min Max E 1.65 1.85 0.065 0.073 F 3.45 3.55 0.135 0.139 P2 1.95 2.05 0.077 0.081 D 1.40 1.60 0.055 0.063 D1 1.00 1.25 0.039 0.049 P0 3.90 4.10 0.154 0.161 10P0 7.70 8.10 1.574 0.008 0.303 0.318 P 3.90 4.10 0.153 0.161 A0 2.14 2.34 0.084 0.092 B0 2.24 2.44 0.088 0.096 K0 1.12 1.32 0.044 0.052 t (c) 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/12/17 40.0 0.20 W 0.27 max 0.010 max TVS Diode Arrays (SPA(R) Diodes) General Purpose ESD Protection - SP1001 Series Embossed Carrier Tape & Reel Specification -- SOT553 and SOT563 Dimensions Millimetres Min Inches Max Min Max E 1.65 1.85 0.065 0.073 F 3.45 3.55 0.135 0.139 P2 1.95 2.05 0.077 0.081 D 1.40 1.60 0.055 0.063 D1 0.45 0.55 0.017 0.021 P0 3.90 4.1 0.154 0.161 10P0 40.0 0.20 1.574 0.008 W 7.70 8.10 0.303 0.318 P 3.90 4.10 0.153 0.161 A0 1.73 1.83 0.068 0.072 B0 1.73 1.83 0.068 0.072 K0 0.64 0.74 0.025 0.029 0.22 max t .009 max Embossed Carrier Tape & Reel Specification - SOT963 t W KO AO BO Inches Max Min Max E 1.65 1.85 0.065 0.073 F 3.45 3.55 0.136 0.140 D1 0.45 0.55 0.018 0.022 P0 P Millimetres Min 1.50 min D F oD1 / Dimensions Symbol E P2 o/ D PO 10P0 3.90 0.059 min 4.10 40.0 0.20 0.154 0.161 1.575 0.008 P 1.95 2.05 0.077 0.081 P2 1.95 2.05 0.077 0.081 W 7.90 8.20 0.311 0.323 A0 1.11 1.21 0.044 0.048 B0 1.11 1.21 0.044 0.048 K0 0.58 0.68 0.023 0.027 t 0.22 max 0.009 max Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics. (c) 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/12/17