BD6973FVE2 - ROHM SEMICONDUCTOR

○Product structure：Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays

1/13 TSZ02201-0H1H0B100190-1-2

www.rohm.com

TSZ22111・14・001

Datashee

t

DC Brushless Fan Motor Drivers

Multifunction Single-phase Full-wave

Fan Motor Driver

BD6973FV

●General description

BD6973FV is a pre-driver that controls the motor drive

part composed of the power transistors. Moreover, a lot

of functions are installed, and the pin is compatible with

BD6974FV(lock alarm signal output).

●Features

 Pre-driver for external power transistors

 Speed controllable by DC / direct PWM input

 PWM soft switching

 Soft start

 Quick start

 Current limit

 Lock protection and automatic restart

 Rotation speed pulse signal (FG) output

●Package W (Typ.) x D (Typ.) x H (M ax.)

SSOP-B16 5.00mm x 6.40mm x 1.35mm

●Application

 Fan motors for general consumer equipme nt of desktop PC , and Server, etc.

●Absolute maximum ratings

Parameter Symbol Limit Unit

Supply voltage Vcc 20 V

Power dissipation Pd 874.7 *1 mW

Operating temperature range Topr –40 to +100 °C

Storage temperature range Tstg –55 to +150 °C

High side output voltage Voh 36 V

Low side output voltage Vol 15 V

Low side output current Iol 10 mA

Rotation speed pulse signal (FG) output voltage Vfg 20 V

Rotation speed pulse signal (FG) output current Ifg 10 mA

Reference voltage (REF) output current Iref 12 mA

Hall bias (HB) output current Ihb 12 mA

Input voltage (H+, H–, TH, MIN, CS) Vin 7 V

Junction temperature Tj 150 °C

*1 Reduce by 7.0mW/°C over Ta=25°C. (On 70.0mm×70.0mm×1.6mm glass epoxy board)

●Recommended operating conditions

Parameter Symbol Limit Unit

Operating supply voltage range Vcc 4.3 to 17.0 V

Operating input voltage range 1 (H+, H–)

(more than Vcc=9V) 0 to 7 V

Operating input voltage range 1 (H+, H–)

(less than Vcc=9V)

Vin1 0 to Vcc–2 V

Operating input voltage range 2 (TH, MIN) Vin2 0 to Vref V

SSOP-B16

2/13

Datasheet

BD6973FV

TSZ02201-0H1H0B100190-1-2

www.rohm.com

TSZ22111・15・001

●Pin configuration

●Pin description

P/No. T/Name Function

1 FG Speed pulse signal output terminal

2 OSC

Oscillating capacitor connecting

terminal

3 MIN Minimum output duty setting terminal

4 TH Output duty controllable input terminal

5 REF Reference voltage output terminal

6 Vcc Power supply terminal

7 A1H High side output terminal 1

8 A1L Low side output terminal 1

9 A2L Low side output terminal 2

10 A2H High side output terminal 2

11 CS Output current detection terminal

12 SS

Soft start capacitor connecting

terminal

13 H+ Hall + input t erminal

14 HB Hall bias terminal

15 H– Hall – input te r m inal

16 GND Ground terminal

●Block diagram

●I/O truth table

Hall input Driver output

H+ H– A1H A1L A2H A2L FG

H L Hi-Z H L L Hi-Z

L H L L Hi-Z H L

H; High, L; Low, Hi-Z; High impedance

FG output is open-drain type.

Fig.2 Block diagram

MIN

REF

HB

A1H

H+

H–

FG

A2H

Vcc

OSC

CS

GND

TH

A1L

1

2

3

4

5

6

7

15

A2L

SS

16

8

14

13

12

11

9

10

Fig.1 Pin configuration

(TOP VIEW)

TH

MIN

OSC

FG

SIGNAL

OUTPUT

REF

A1H

Vcc

H+

A1L

GND

CS

HALL

COMP

HALL

AMP

HB

CONTROL

LOGIC

PRE-

DRIVER

A2L

A2H

REF

REG

OSC

QUICK

START

LOCK

PROTECT

TSD

H–

SS

PWM SOFT

SWITCHING

PWM

COMP

PWM

COMP

HALL

BIAS

SOFT START

& CURRENT

LIMIT COMP

1

2

3

4

5

6

7

8

10

9

14

13

12

11

16

15

Vcl

3/13

Datasheet

BD6973FV

TSZ02201-0H1H0B100190-1-2

www.rohm.com

TSZ22111・15・001

●Electrical charact eristics(Unless otherwise specified Ta=25°C, Vcc=12V)

Limit

Parameter Symbol Min. Typ. Max. Unit Conditions Ref.

data

Circuit current Icc 3 5 8 mA Fig.3

Hall input hysteresis voltage Vhys ±5 ±10 ±15 mV Fig.4

High side output current Ioh 9.0 12.0 16.5 mA Voh=12V Fig.5

High side output leak current Iohl - - 10 µA Voh=36V Fig.6

Low side output high voltage Volh 9.3 9.5 - V Iol=–5mA Fig.7, 8

Low side output lo w voltage Voll - 0.5 0.7 V Iol=5mA Fig.9, 10

Lock detection ON t ime Ton 0. 20 0.30 0.45 s Fig.11

Lock detection OFF time Toff 4.0 6.0 9.0 s Fig.12

FG output lo w voltage Vfgl - - 0.3 V Ifg=5mA Fig.13, 14

FG output leak current Ifgl - - 10 µA Vfg=17V Fig.15

OSC high voltage Vosch 2.3 2.5 2.7 V Fig.16

OSC low voltage Voscl 0.8 1.0 1.2 V Fig.16

OSC charge current Icosc –55 –40 –25 µA Fig.17

OSC discharge current Idosc 25 40 55 µA F ig.17

Output ON duty 1 Poh1 75 80 85 % Vth=Vref x 0.26

Pull up resistance 1kΩ,

OSC=470pF -

Output ON duty 2 Poh2 45 50 55 % Vth=Vref x 0.35

Pull up resistance 1kΩ,

OSC=470pF -

Output ON duty 3 Poh3 15 20 25 % Vth=Vref x 0.44

Pull up resistance 1kΩ,

OSC=470pF -

Reference voltage Vref 4.8 5.0 5.2 V Iref=–2mA Fig.18, 19

Hall bias voltage Vhb 1.10 1.26 1.50 V Ihb=–2mA Fig.20, 21

Current limit sett ing voltage Vcl 120 150 180 mV Fig. 22

SS charge current Iss –300 –120 –50 nA Vss=0V Fig.23

TH input bias current Ith - - –0.2 µA Vth= 0V Fig.24

MIN input bias current Imin - - –0.2 µA Vmin=0V Fig.25

CS input bias current Ics - - –0.2 µA Vcs=0V Fig.26

About a current item, define the inflow current to IC as a positive notation, and the outflow current from IC as a negative notation.

4/13

Datasheet

BD6973FV

TSZ02201-0H1H0B100190-1-2

www.rohm.com

TSZ22111・15・001

●Typical performance curves(Reference data)

2

5

8

11

14

17

0 5 10 15 20

Supply voltage: Vcc[V]

High side output current: Ioh[mA]

Fig.5 High side output current

Operating range

100°C

25°C

–

40°C

0

2

4

6

8

10

0 5 10 15 20

Supply voltage: Vcc[V]

Circuit current: Icc[mA]

Fig.3 Circuit current

Operating range

100°C

25°C

–

40°C

-20

-10

0

10

20

0 5 10 15 20

Supply voltage: Vcc[V]

Hall input hysteresis voltage: Vhys[mV]

Fig.4 Hall input h yster esis

Operating range

100°C

25°C

–

40°C

100°C

25°C

–

40°C

-2

0

2

4

6

8

0 10203040

Supply voltage: Voh[V]

High side output leak current: Iohl[uA]

Operating range

Fig.6 High side output leak current

100°C

25°C

–

40°C

5/13

Datasheet

BD6973FV

TSZ02201-0H1H0B100190-1-2

www.rohm.com

TSZ22111・15・001

●Typical performance curves(Reference data)

0

2

4

6

8

10

12

0246810

Output source current: Io[mA]

Low side output high voltage: Volh[V]

Fig.7 Low side output high voltage (Vcc=12V)

100°C

25°C

–

40°C

0.0

0.4

0.8

1.2

1.6

0246810

Output sink current: Io[mA]

Low side output low voltage: Voll[V]

Fig.9 Low side out put low voltage (Vcc=12V)

100°C

25°C

–

40°C

0

2

4

6

8

10

12

0246810

Output source current: Io[mA]

Low side output high voltage: Volh[V]

Fig.8 Low side out put high voltage (Ta=25°C)

17

V

12

V

4.3

V

0.0

0.4

0.8

1.2

1.6

0246810

Output sink current: Io[mA]

Low side output low voltage: Voll[V]

Fig.10 Low side out put low voltage (Ta=25°C)

17

V

12

V

4.3

V

6/13

Datasheet

BD6973FV

TSZ02201-0H1H0B100190-1-2

www.rohm.com

TSZ22111・15・001

●Typical performance curves(Reference data)

4.0

5.0

6.0

7.0

8.0

0 5 10 15 20

Supply voltage: Vcc[V]

Lock detection OFF time: Toff[s]

Operating range

Fig.12 Lock detect ion OFF time

100°C

25°C

–

40°C

0.0

0.2

0.4

0.6

0.8

0246810

Output sink current: Ifg[mA]

FG output low voltage: Vfgl[V]

Fig.13 FG output low voltage (Vcc=12V)

100°C

25°C

–

40°C

0.0

0.2

0.4

0.6

0.8

0246810

Output sink current: Ifg[mA]

FG output low voltage: Vfgl[V]

Fig.14 FG output low voltage (Ta=25°C)

17

V

12

V

4.3

V

0.20

0.25

0.30

0.35

0.40

0 5 10 15 20

Supply voltage: Vcc[V]

Lock detection ON time: Ton[s]

Fig.11 Lock detection ON time

100°C

25°C

–

40°C

Operating

r

ange

7/13

Datasheet

BD6973FV

TSZ02201-0H1H0B100190-1-2

www.rohm.com

TSZ22111・15・001

●Typical performance curves(Reference data)

2

3

4

5

6

0 5 10 15 20

Supply voltage: Vcc[V]

Reference voltage: Vref[V]

Operating range

Fig.18 Reference voltage

100°C

25°C

–

40°C

-60

-40

-20

0

20

40

60

0 5 10 15 20

Supply voltage: Vcc[V]

OSC charge/discharge current: Icosc/Idosc [uA]

Operating range

Fig.17 OSC charge/discharge current

100°C

25°C

–

40°C

100°C

25°C

–

40°C

-2

0

2

4

6

8

0 5 10 15 20

Supply voltage: Vcc[V]

FG output leak current: Ifgl[uA]

Operating range

Fig.15 FG output leak current

100°C

25°C

–

40°C

0.5

1.0

1.5

2.0

2.5

3.0

0 5 10 15 20

Supply voltage: Vcc[V]

OSC high/low voltage: Vosch/Voscl [V]

Operating range

Fig.16 OSC high/low voltage

100°C

25°C

–

40°C

100°C

25°C

–

40°C

8/13

Datasheet

BD6973FV

TSZ02201-0H1H0B100190-1-2

www.rohm.com

TSZ22111・15・001

●Typical performance curves(Reference data)

1.1

1.2

1.3

1.4

1.5

036912

Output source current: Ihb[mA]

Hall bias voltage: Vhb[V]

Fig.21 Hall bias voltage current ability (Vcc=12V)

100°C

25°C

–

40°C

4.8

4.9

5.0

5.1

5.2

036912

Output source current: Iref[mA]

Reference voltage: Vref[V]

Fig.19 Reference volt age current ability (Vcc=12V)

100°C

25°C

–

40°C

1.1

1.2

1.3

1.4

1.5

0 5 10 15 20

Supply voltage: Vcc[V]

Hall bias voltage: Vhb[V]

Operating range

Fig.20 Hall bias voltage

100°C

25°C

–

40°C

120

135

150

165

180

0 5 10 15 20

Supply voltage: Vcc[V]

Current limit setting voltage: Vcl[mV]

Operating range

Fig.22 Current limit setting voltage

100°C

25°C

–

40°C

9/13

Datasheet

BD6973FV

TSZ02201-0H1H0B100190-1-2

www.rohm.com

TSZ22111・15・001

●Typical performance curves(Reference data)

-0.20

-0.15

-0.10

-0.05

0.00

0.05

0 5 10 15 20

Supply voltage: Vcc[V]

CS bias current: Ics[uA]

Operating range

Fig.26 CS bias current

100°C

25°C

–

40°C

-300

-250

-200

-150

-100

-50

0 5 10 15 20

Supply voltage: Vcc[V]

SS charge current: Iss[nA]

Operating range

Fig.23 SS charge current

100°C

25°C

–

40°C

-0.20

-0.15

-0.10

-0.05

0.00

0.05

0 5 10 15 20

Supply voltage: Vcc[V]

MIN bias current: Imin[uA]

Operating range

Fig.25 MIN bias current

100°C

25°C

–

40°C

-0.20

-0.15

-0.10

-0.05

0.00

0.05

0 5 10 15 20

Supply voltage: Vcc[V]

TH bias current: Ith[uA]

Operating range

Fig.24 TH bias current

100°C

25°C

–

40°C

10/13

Datasheet

BD6973FV

TSZ02201-0H1H0B100190-1-2

www.rohm.com

TSZ22111・15・001

●Application circuit example(Constant values are for reference)

Substrate design note

a) Motor power and ground lines are made as fat as possible.

b) IC power line is made as fat as possible.

c) IC ground line is common with the application ground except motor groun d (i.e. hall ground etc.), and arranged

near to (–) land.

d) The bypass capacitors (Vcc side and Vm side) are arrangement near to Vcc terminal and FETs, respectively.

e) H+ and H– lines are arranged side by side and made from the hall element to IC as shorter as possible,

because it is easy for the noise to influence the hall lines.

Fig.27 PWM controllab le 4 wires type motor applicati on circuit

Protection of FG open-drain

Low-pass filter for RNF v o ltage

smoothing

Noise measures of substrate

So bypass capacitor,

arrangement near to FETs as

much as

p

ossible

So bypass capacitor,

arrangement near to Vcc

terminal as much as

p

ossible

Reverse-connected prevention

of the FAN connector

Reverse-connected prevention

of the FAN connector

Circuit that convert s PWM du ty

into DC voltage

Stabilization of REF voltage

Soft start time setting

Minimum output duty setting

Output PWM frequency setting

To limit motor current, the

current is detected.

Note the power consumption of

detection resistance.

Drive the PMOS FET gate by

constant current flowing to IC

Adjustment the PMOS FET

slew rate

Adjustment the NMOS FET

slew rate

Stabilization of NMOS FET gate

drive

Hall bias is set according to the

amplitude of hall element

output and hall input voltage

range.

＋

PWM

M

470Ω to 1kΩ

0Ω to 2kΩ

0Ωto 2

k

Ω

2kΩ to 20 kΩ

1µF to

TH

MIN

OSC

FG

SIGNAL

OUTPUT

REF

A1H

Vcc

H+

A1L

GND

CS

HALL

COMP

HALL

AMP

HB

CONTROL

LOGIC

PRE-

DRIVER

A2L

A2H

REF

REG

OSC

QUICK

START

LOCK

PROTECT

TSD

H–

SS

PWM SO FT

SWITCHING

PWM

COMP

PWM

COMP

HALL

BIAS

SOFT START

& CURRENT

LIMIT COMP

1

2

3

4

5

6

7

8

10

9

14

13

12

11

16

15

Vcl

SIG

0Ω to

100pF

to 1000pF

0.1µ F to

H

0Ω to

0.01µF

to 4.7µF

－

200Ω

to 20kΩ

100pF

to 0.01µF

11/13

Datasheet

BD6973FV

TSZ02201-0H1H0B100190-1-2

www.rohm.com

TSZ22111・15・001

●Power dissipation

Power dissipation (total loss) indicates the power that can be consumed by IC at Ta=25°C (normal temperature). IC is

heated when it consumes power, and the temperature of IC chip becomes higher than ambient temperature. The

temperature that can be accepted by IC chip depen ds on circui t configurati on, manufact uring process, et c, and consumabl e

power is limited. Power dissipation is determined by the temperature allowed in IC chip (maximum junction temperature)

and thermal resistance of package (heat dissipation capability). The maximum junction temperature is in general equal to

the maximum value in the storage temperat ure range.

Heat generated by consumed power of IC is radiated from the mold resin or lead frame of package. The parameter which

indicates this heat dissipation capability (hardness of heat release) is called heat resistance, represented by the symbol

θja[°C/W]. This heat resistance can estimate the temperature of IC inside the package. Fig.28 shows the model of heat

resistance of the package. Heat resistance θja, ambient temperatur e Ta, junction temp erat ure Tj, and power consumpt ion P

can be calculated by the equation below:

Thermal de-rating curve indicates power that can be consumed by IC with reference to ambient temperature. Power that

can be consumed by IC begins to attenuate at certain ambient temperature. This gradient is determined by thermal

resistance θja. Thermal resistance θja depends on chip siz e, po wer consumption, package ambient t emperatur e, packaging

condition, wind velocity, etc., even when the same package is used. Thermal de-rating curve indicates a reference value

measured at a specified condition. Fig.29 shows a thermal de-rating curve (Value when mounting FR4 glass epoxy board

70[mm] x 70[mm] x 1.6[mm] (copper foil area below 3[%])). Thermal resistance θjc from IC chip joint part to the package

surface part of mounting the above-ment ioned same substrate is shown in the following as a reference value.

＊Reduce by 7.0mW/°C over 25°C

(On 70.0mm x 70.0mm x 1. 6mm glass epoxy board)

●I/O equivalence circuit(Resistance values are typical)

1) Power supply terminal, 2) Hall input terminals, 3) Minimum output duty setting 4) Soft start capacitor

and Ground terminal Output duty controllable input terminal connecting terminal

terminal,

and Output current detection

terminal

5) High side output 1, 2 6) Low side output 1, 2 7) Reference voltage output 8) Oscillating capacitor

terminals, and terminals terminal, connecting terminal

Speed pulse signal output and Hall bias terminal

terminal

OSC

Vcc

1kΩ

Vcc

1kΩ

θja = (Tj – Ta) / P [°C/W]

θjc = (Tj – Tc) / P [°C/W]

Fig.28 Thermal resistance Fig.29 Thermal de-rating curve

θja = (Tj – Ta) / P [°C/W]

500

750

Pd[mW]

0 25 50 75 100 125 150 Ta[° C]

250

874.7

θja=1 42 .9 [°C/W]

θjc = 36 [°C/W] (reference value)

Chip su rfa ce temperature Tj [°C]

Package surfa ce temperature Tc[°C]

Power consumption P[W]

Ambient tem peratur e Ta[ °C]

TH

1kΩ

H+

H–

CS

Vcc

GND

MIN

1

k

Ω

Vcc

30Ω

SS 1

k

Ω

Vcc

30Ω

Vcc

20Ω

A1L

A2L

REG

20Ω

A1H

A2H

FG

REF

36kΩ

Vcc

HB

31kΩ

Vcc

12/13

Datasheet

BD6973FV

TSZ02201-0H1H0B100190-1-2

www.rohm.com

TSZ22111・15・001

●Operational Notes

1) Absolute maximum ratings

An excess in the absolute maximum ratings, such as supply voltage, temperature range of oper ating conditions, etc.,

can break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open

circuit. If any o ver rated values will expect to excee d the absolute m aximum ratings, con sider adding circuit prot ection

devices, such as fuses.

2) Connecting the power supply connector back war d

Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power

supply lines. An external direction diode can be added.

3) Power supply line

Back electromotive f orce cau ses reg en erate d current to p o wer suppl y lin e, theref ore take a me asure s u ch as plac ing a

capacitor between power supply and GND for routing regenerated current. And fully ensure that the capacitor

characteristics have no problem before determine a capacitor value. (When applying electrolytic capacitors,

capacitance characteristic values are reduced at low temperatures)

4) GND potential

It is possible that the motor output terminal may deflect below GND terminal because of influence by back

electromotive force of motor. The potential of GND terminal must be minimum potential in all operating conditions,

except that th e levels of t he motor outp uts terminals are under GND lev el by the back elect romotive force of the motor

coil. Also ensure that all terminals except GND and motor output terminals do not fall below GND voltage including

transient characteristics. Malfunction may possibly occur depending on use condition, environment, and property of

individual motor. Please make fully confirmation that no pr oblem is found on operation of IC.

5) Thermal design

Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating

conditions.

6) Inter-pin shorts and mounting errors

Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any

connection error or if pins are shorted together.

7) Actions in strong electromagnetic field

Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to

malfunction.

8) ASO

When using the IC, set the output transistor so that it does not exceed absolute maximum rations or ASO.

9) Thermal shut down circuit

The IC incorporates a b uilt-in thermal shutdown circuit (TSD circuit). Operation temperat ure is 175°C (typ.) and has a

hysteresis width of 25°C (typ.). When IC chip temperature rises and TSD circuit works, the output terminal becomes an

open state. TSD circuit is des igned only to shut the I C off to prevent thermal runaway. It is not desi gned to protect the

IC or guarantee its operatio n. Do not continu e to use the IC after operati on this circuit or use the I C in an environm ent

where the operation of this circuit is assumed.

10) Testing on application boards

When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to

stress. Always discharge capacitors after each process or step. Always turn the IC’s power supply off before

connecting it to or removing it from a jig or f ixture during the inspecti on process. Ground the IC during ass embly steps

as an antistatic measure. Use similar precaution when transporting or storing the IC.

11) GND wiring pattern

When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns,

placing a single ground point at the ground potential of application so that the pattern wiring resistance and voltage

variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to

change the GND wiring pattern of any external components, either.

12) Capacitor between output and GND

When a large capacitor is connected bet ween output and GND, if V cc is shorted with 0V or GND for some cause, it is

possible that the current charged in the capacitor may flow into the outp ut resulting in destruction. Keep t he capacitor

between outpu t and GND below 100µF.

13) IC terminal input

When Vcc voltage is not appl ied to IC, do not apply v oltage to each input terminal. When voltage abov e Vcc or below

GND is applied to the input terminal, parasitic element is actuated due to the structure of IC. Operation of parasitic

element causes mut ual interferenc e between circuits, resul ting in malfunct ion as well as destruction in the l ast. Do not

use in a manner where parasitic element is act uated.

14) In use

We are sure that the example of application circuit is preferable, but please check the character further more in

application to a part that requires high precision. In using the unit with external circuit constant changed, consider the

variation of externally equipped parts and our IC including not only static character but also transient character and

allow sufficient margin in determining.

●Status of this document

The Japanese version of this document is formal specification. A customer may use this translation version only for a

reference to help reading the formal version.

If there are any differences in translation version of this document, formal version takes priority.

13/13

Datasheet

BD6973FV

TSZ02201-0H1H0B100190-1-2

www.rohm.com

TSZ22111・15・001

●Physical dimension tape and reel information

●Marking diagram

●Revision history

Date Revision Comments

07.JUL.2012 001 New Release

28.JUL.2012 002 Color appearance change (There is no change i n the content.)

(Unit : mm)

SSOP-B16

4.4±0.2

6.4±0.3

1.15±0.1

9

8

16

1

0.10

0.65

0.3Min.

5.0±0.2

0.22±0.1

0.15±0.1

0.1

∗

Order quantity needs to be multiple of the minimum quantity.

Embossed carrier tapeTape

Quantity

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

2500pcs

E2

()

Direction of feed

Reel 1pin

D6973

SSOP-B16

(TOP VIEW)

Part Number

LOT Number

1PIN Mark

Datasheet

Notice - GE Rev.002

Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN USA EU CHINA

CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ

CLASSⅣ CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual

ambient temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the

ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Datasheet

Notice - GE Rev.002

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

QR code printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,

please consult with ROHM representative in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable

for infringement of any intellectual property rights or other damages arising from use of such information or data.:

2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the information contained in this document.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

DatasheetDatasheet

Notice – WE Rev.001

General Precaution

1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.

ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny

ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s

representative.

3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or

liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or

concerning such information.