T4-LDS-0231, Rev. 1 (111902) ©2011 Microsemi Corporation Page 1 of 5
1N5415 thru 1N5420
Availa ble on
commercial
versions
VOIDLESS HERMETICALLY SEALED FAST
RECOVERY GLASS RECTIFIERS
Qualified per MIL-PRF-19500/411
Qualified Levels:
JAN, JANTX, JANTXV
and JANS
DESCRIPTION
This “fast recovery” rectifier diode series is military qualified and is ideal for high-reliability appl icat ion s
where a failure cannot be tolerated. These industry-recognized 3.0 amp rated rectifiers for working peak
reverse voltages from 50 to 600 volts are hermetically sealed with voidless-glass construction using an
internal “Category 1” metallurgical bond. These devices are also available in surface mount MELF
package configurations. Microsemi also offers numerous other rectifier products to meet higher and
lower current ratings with various recovery time speed requirements including fast and ultrafast device
types in both through-hole and surface mount packages.
“B” Package
Also available in:
“B” SQ-MELF
(D-5B) Package
(surface mount)
1N5415US – 1N5420US
Important: For the latest information, visit our website http://www.microsemi.com.
FEATURES
• Popular JEDEC registered 1N5415 thru 1N 5420 series.
• Voidless hermetically sealed glass package.
• Quadruple-layer passivation.
• Internal “Category 1” metallurgical bonds.
• Working Peak Reverse Voltage 50 to 600 volts.
• JAN, JANTX, JANTXV and JANS qualifications avail able per MIL-PRF-19500/411.
• RoHS compliant versions available (commercial grade only).
APPLICATIONS / BENEFITS
• Fast recovery 3 amp 50 to 600 volt rectifiers.
• Military and other high-reliability applicat ions.
• General rectifier applications including bridges, half-bridges, catch diodes, etc.
• High forwar d surge curr ent capability.
• Extr emely rob ust constr u cti on.
• Low thermal resistance.
• Controlled avalanche with peak reverse power capability.
• Inherently radiation hard as described in Microsemi “MicroNote 050”.
MAXIMUM RATINGS
MSC – Lawrence
6 Lake Street,
Lawrence, MA 01841
1-800-446-1158
Tel: (978) 620-2600
Fax: (978) 689-0803
MSC – Ireland
Gort Road Business Park,
Ennis, Co. Clare, Ireland
Tel: +353 (0) 65 6840044
Fax: +353 (0) 65 6822298
Website:
www.microsemi.com
Parameters/Test Conditions
Symbol
Value
Unit
Junction and Storage Temperature
TJ and TSTG
-65 to +175
oC
Thermal Resi stan ce Jun cti on-to-Lead (1)
RӨJL
22
oC/W
Forward Surge Current @ 8.3 ms half-sine
IFSM
80
A
Average Rectified Forward Current
(4)
@ TA = +55
o
C
@ TA = +100
o
C
IO
(2, 3)
IO (3) 3
2 A
Working Peak Reverse Voltage 1N5415
1N5416
1N5417
1N5418
1N5419
1N5420
VRWM
50
100
200
400
500
600
V
Maximum Reverse Recovery Time (5) 1N5415
1N5416
1N5417
1N5418
1N5419
1N5420
trr
150
150
150
150
250
400
ns
Solder Temperature @ 10 s
TSP
260
oC
See notes on next page.
T4-LDS-0231, Rev. 1 (111902) ©2011 Microsemi Corporation Page 2 of 5
1N5415 thru 1N5420
MAXIMUM RATINGS
Notes: 1. At 3/8 inch (10 mm) lead length from body.
2. Derate linearly at 22 mA/oC for 55 oC < TA < 100 oC.
3. Above TA = 100 oC, derate linearly at 26.7 mA/oC to zero at TA = 175 oC.
4. These ambient ratings are for PC boards where thermal resistance from mounting point to ambient is suffici entl y control l ed where TJ(max)
does not exceed 175 oC.
5. IF = 0. 5 A, IRM = 1 A, IR(REC) = 0.250 A.
• CASE: Hermetically sealed voidless hard glass with tungsten slugs.
• TERMINALS: Axial-leads are tin/lead (Sn/Pb) over copper. R oHS compli ant matt e-tin is available for commercial grade only.
• MARKING: Body paint and part number.
• POLARITY: Cathode band.
• TAPE & REEL option: Standard per EIA-296. Contact factory for quantities.
• WEIGHT: 750 milligrams.
• See Package Dimensions on last page.
JAN 1N5415 (e3)
Reliability Level
JAN = JAN Level
JANTX = JANTX Level
JANTXV = JANTXV Level
JANS = JANS Level
Blank = commercial
JEDEC type number
See Electrical Characteristics
table
RoHS Compli ance
e3 = RoHS compliant (available
on commercial grade only)
Blank = non-RoHS compliant
SYMBOLS & DEFINITIONS
Symbol
Definition
VBR
Minimum Breakdown Voltage: The minimum voltage the device will exhibit at a specified current.
VRWM
Working Peak Reverse Voltage: The maximum peak voltage that can be applied over the operating temperature range
excluding all transient voltages (ref JESD282-B).
IO
Average Rectified Output Current: The Output Current averaged over a full cycle with a 50 Hz or 60 Hz sine-wave
input and a 180 degree conduction angle.
VF
Maximum Forward Voltage: The maximum forward voltage the device will exhibit at a specified current.
IR
Maximum Reverse Current: The maximum reverse (leakage) current that will flow at the specified voltage and
temperature.
trr
Reverse Recovery Time: The time interval between the instant the current passes through zero when changing from
the forward direction to the reverse direction and a specified decay point after a peak reverse current occurs.
T4-LDS-0231, Rev. 1 (111902) ©2011 Microsemi Corporation Page 3 of 5
1N5415 thru 1N5420
TYPE
MINIMUM
BREAKDOWN
VOLTAGE
VBR @ 50
µ
A
Volts
FORWARD
VOLTAGE
VF @ 9 A
MAXIMUM
REVERSE
CURRENT
IR @ VRWM
CAPACITANCE
C
VR @ 4 V
pF
MIN.
Volts MAX.
Volts 25
o
C
µA 100
o
C
µA
1N5415
1N5416
1N5417
1N5418
1N5419
1N5420
55
110
220
440
550
660
0.6
0.6
0.6
0.6
0.6
0.6
1.5
1.5
1.5
1.5
1.5
1.5
1.0
1.0
1.0
1.0
1.0
1.0
20
20
20
20
20
20
550
430
250
165
140
120
NOTE 1: IF = 0.5 A, IRM = 1 A, IR(REC) = 0.250 A.
T4-LDS-0231, Rev. 1 (111902) ©2011 Microsemi Corporation Page 4 of 5
1N5415 thru 1N5420
% PIV tH Heating Time (seconds)
FIGURE 1 FIGURE 2
Typical Reverse Current vs. PIV Maximum Thermal Impedance
VF – Voltage (V)
FIGURE 3
Typical Forward Current vs. Forward Voltage
I
F
– Current (µA)
I
F
– Current (A)
Z
ӨJX
(o
C
/Watt)
T4-LDS-0231, Rev. 1 (111902) ©2011 Microsemi Corporation Page 5 of 5
1N5415 thru 1N5420
Symbol
Dimensions
Notes
Inch
Millimeters
Min
Max
Min
Max
BD
0.110
0.180
2.79 4.57 3
LD
0.036
0.042
0.91
1.07
4
BL
0.130
0.260
3.30
6.60
4
LL
0.90
1.30
22.9
33.0
NOTES:
1. Dimensions are in inches.
2. Millimeter equivalents are given for general information only.
3. Dimension BD shall be measured at the largest diameter.
4. The BL dimension shall include the entire body including slugs and sections of the lead over which the diameter is
uncontrolled. This uncontrolled area is defined as the zone between the edge of the diode body and extending
.050 inch (1.27 mm) onto the leads.
5. In accordance with ASME Y14.5M, diameters are equivalent to Φx symbology.