Brightek 3030 Series 5ZSC30DV24JV01ZM Outline3.0*3.0*3.0mm High efficiency Good thermal dissipation & optical uniform Table of Contents: Features Features----------------------------------------------------- 1 RoHS2.0 and REACH-compliant Product Code---------------------------------------------- 2 MSL2 qualified according to J-STD 020 Typical Product Characteristics-------------------------3 ESD 2KV (HBM : MIL-STD-883 Class 2) Maximum Rating------------------------------------------ 4 Dominant Wavelength Binning------------------------ 5 Applications Intensity Binning------------------------------------------ 5 Automobile lighting Forward Voltage Binning------------------------------- 5 Decorative lighting Electronic-Optical Characteristics-------------------- 6 Relative Spectral Power Distribution---------------- 7 Typical spatial distribution------------------------------ 7 Thermal Design for De-rating-------------------------- 7 Dimensions------------------------------------------------- 8 Suggest Stencil Pattern--------------------------------- 8 Packing----------------------------------------------------- 9 Reflow Profile-------------------------------------------- 11 Precautions----------------------------------------------- 12 Test items and results of reliability------------------ 14 Version:IS-1.0 NO:BT-HP-180815009 Page 1 of 15 Brightek 3030 Series Product Code 5 - Z - SC30 - D - V24J - V - 0 - 1 - Z - M Process type Category Specification Lens Angle code 5: For Automotive Z: High Power SC30: 3030 D: 30 Dice wavelength & Luminous rank VXXX: Red light & LED level Support code Zener Cap color code V: Substrate Code 0: None Zener Version:IS-1.0 1: Series No. NO:BT-HP-180815009 Module & Lens code Z: Molding Current code M : 70mA Page 2 of 15 Brightek 3030 Series Typical Product Characteristics(Ta=25) Luminous Flux (lm) Luminous Intensity @70mA (mcd) @70mA Group Min. Max. Min. Max. B09 8 9 12000 15000 B10 9 10 15000 18000 Dominant 10 12 18000 21000 B12 12 14 21000 23000 @70mA Wavelength (nm) 620-630 B11 Forward Voltage (V) Viewing Angle Min. Max. 2.0 2.6 25 Notes: 1. Forward voltage (VF ) 0.1VRadiant power (PO) 7%Wavelength (d) 1nm Viewing angle(21/2) 10 2. IS standard testing. 3. Note: the brightness data is only for reference Version:IS-1.0 NO:BT-HP-180815009 Page 3 of 15 Brightek 3030 Series Maximum Rating (Ta : 25) Characteristics Symbol DC Forward Current1 Max. Unit IF 100 mA Reverse Voltage VR 5 V Reverse Current IR 10 A Junction Temperature2 Tj 125 Thermal Resistance Junction / Solder Point Min. Rj-s Storage Temperature Range Tstg Soldering Temperature Tsol Typical 28 -40 - /W 100 260 Notes: 1. For other ambient, limited setting of current will depend on de-rating curves. 2. When drive on maximum current , Tj must be kept below 125 Version:IS-1.0 NO:BT-HP-180815009 Page 4 of 15 Brightek 3030 Series Dominant Wavelength Binning Bin code Min. d Max. d (70mA) (nm) (nm) R620 620 625 R625 625 630 Bin code Min. v Max. v (70mA) (Lm) (lm) B09 8 9 B10 9 10 B11 10 12 B12 12 14 Bin code Min. VF Max. VF (70mA) (V) (V) V2022 2.0 2.2 V2224 2.2 2.4 V2426 2.4 2.6 Intensity Binning Forward Voltage Binning Version:IS-1.0 NO:BT-HP-180815009 Page 5 of 15 Brightek 3030 Series Electronic-Optical Characteristics Forward Current vs. Forward Voltage (Ta=25) Forward Current vs. Relative Luminous Flux Version:IS-1.0 Relative luminous Flux vs. Forward Current (Ta=25) (Ta=25) NO:BT-HP-180815009 Page 6 of 15 Brightek 3030 Series Relative Spectral Power(%) Relative spectral power distribution 120% 100% 80% 60% 40% 20% 0% 400 500 600 700 800 Wavelength(nm) Relative luminous Intensity(%) Typical Spatial Distribution 30 20 10 0 1. 0 40 50 60 0. 5 70 80 90 0 1. 0 0. 9 0. 80. 7 0. 6 0. 5 0. 40. 3 0. 2 0. 1 0 10 20 30 40 50 60 70 80 90 Genealogies angle Ta=25C Thermal Design for De-rating The maximum forward current is determined by the thermal resistance between the LED junction and ambient. It is crucial for the end product to be designed in a manner that minimizes the thermal resistance from the solder point to ambient in order to optimize lamp life and optical characteristics. Version:IS-1.0 NO:BT-HP-180815009 Page 7 of 15 Brightek 3030 Series Dimensions All dimensions are in millimeters. Tolerance is 0.13mm unless other specified. Suggest Stencil Pattern (Recommendations for reference) 1.60 1.50 0.41 2.40 2.40 0.51 0.64 0.54 RECOMMENDED PCB SOLDER PAD Suggest stencil t =0.12 mm Version:IS-1.0 RECOMMENDED STENCIL PATTERN (HATCHED AREA IS OPENING) NO:BT-HP-180815009 Page 8 of 15 Brightek 3030 Series Packing - + Trailer 160(min) of empty pockets sealed with tape Version:IS-1.0 Loaded Pockets (650 pcs) NO:BT-HP-180815009 Leader 400mm (min) of empty pockets sealed with tape Page 9 of 15 Brightek 3030 Series Version:IS-1.0 NO:BT-HP-180815009 Page 10 of 15 Brightek 3030 Series Label Label Label Notes: 1. Each reel (minimum number of pieces is 500 and maximum is 650 for 30 degree product) is packed in a moisture-proof bag along with a packs of desiccant and a humidity indicator card. 2. A maximum of 5 moisture-proof bags are packed in an inner box (size: 260mm x 230mm x 100mm 5mm). 3. A maximum of 4 inner boxes are put in an outer box (size: 480mm x 275mm x 215mm 5mm). 4. Part No., Lot No., quantity should be indicated on the label of the moisture-proof bag and the cardboard box. Version:IS-1.0 NO:BT-HP-180815009 Page 11 of 15 Brightek 3030 Series Reflow Profile IR Reflow Soldering Profile Profile Feature Ramp-up Rate to Preheat Time tS Minimum Recommendation Maximum (25C to 150C) tS (TSmin to Tsmax) Ramp-up Rate to Peak Symbol Pb-Free (SnAgCu) Assembly 60 (TSmax to TP) Unit 2 3 K/s 100 120 s 2 3 K/s Liquidus Temperature TL 217 Time above Liquidus temperature tL 80 100 s Peak Temperature TP 245 260 C Time within 5 C of the specified peaktemperature TP - 5 K tP 20 30 s 3 4 K/s 480 s 10 Ramp-down Rate (TP to 100 C) Time 25 C to TP C Notes: 1. Do not stress the silicone resin while it is exposed to high temperature. 2. The reflow process should not exceed 2 times. Version:IS-1.0 NO:BT-HP-180815009 Page 12 of 15 Brightek 3030 Series Precautions 1. Recommendation for using LEDs 1.1 The lens of LEDs should not be exposed to dust or debris. Excessive dust and debris may cause a drastic decrease in the luminosity. 1.2 Avoid mechanical stress on LED lens. 1.3 Do not touch the LED lens surface. It would affect the optical performance of the LED due to the LED lens' damage. 1.4 Pick & place tools are recommended for the remove of LEDs from the factory tape & reel packaging 2. Lens handling Please follow the guideline to pick LEDs. 2.1 Use tweezers to pick LEDs. 2.2 Do not touch the lens by using tweezers. 2.3 Do not touch lens with fingers. 2.4 Do not apply more than 4N (400gw) directly onto the lens. Correct ( ) Wrong ( X ) 3. Lens cleaning In the case which a small amount of dirt and dust particles remain on the lens surface, a suitable cleaning solution can be applied. 3.1 Try a gentle wiping with dust-free cloth. 3.2 If needed, use dust-free cloth and isopropyl alcohol to gently clean the dirt from the lens surface. Version:IS-1.0 NO:BT-HP-180815009 Page 13 of 15 Brightek 3030 Series 3.3 Do not use other solvents as they may directly react with the LED assembly. 3.4 Do not use ultrasonic cleaning which will damage the LEDs. 4. Carrier tape handling The following items are recommended when handling the carrier tape of LEDs. 4.1 Do not twist the carrier tape. 4.2 The inward bending diameter should not be smaller than 6cm for each carrier tape. 4.3 Do not bend the tape outward. 5. Storage 5.1 The moisture-proof bag is sealed The LEDs should be stored at 30C or less and 90%RH or less. And the LEDs are limited to use within one year, while the LEDs is packed in moisture-proof package with the desiccants inside. 5.2 The moisture-proof bag is opened The LEDs should be stored at 30C or less and 60%RH or less. Moreover, the LEDs are limited to solder process within 168hrs. If the humidity indicator card shows the pink color in 10% even higher or exceed the storage limiting time since opened, that we recommended to baking LEDs at 60C at least 24hrs. To seal the remainder LEDs return to the moisture-proof bag, it's recommended to be with workable desiccants. Version:IS-1.0 NO:BT-HP-180815009 Page 14 of 15 Brightek 3030 Series Test Items and Results of Reliability Test Item Thermal Shock High Temperature Storage Test Conditions Duration/ Cycle Number of Damage Reference -40 30min 5min 125 30min 1000 cycles 0/77 AEC-Q101 Ta=100 1000 hrs 0/22 1000 hrs 0/22 1000 hrs 0/22 1000 hrs 0/22 1000 hrs 0/22 1000 hrs 0/22 3 Times 0/22 Humidity Heat Ta=85 Storage RH=85% Low Temperature Ta=-40 Storage Ta=25 Life Test If=70mA High Humidity Heat 85 RH=85% Operation If=70mA High Temperature Ta=85 Operation If=70mA ESD(HBM) 2KV at 1.5k;100pf EIAJ ED-4701 200 201 EIAJ ED-4701 100 103 EIAJ ED-4701 200 202 MIL-STD-883 Failure Criteria Item Symbol Condition Forward Voltage VF Reverse Current Luminous Intensity Criteria for Judgment Min Max If=70mA - USL1x1.1 IR VR =5V - 100A Iv If=70mA LSL2x0.7 - Notes: 1. USL: Upper specification level 2. LSL: Lower specification level Version:IS-1.0 NO:BT-HP-180815009 Page 15 of 15