Brightek 3030 Series
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5ZSC30DV24JV01ZM
◆ Outline：3.0*3.0*3.0mm
◆ High efficiency
◆ Good thermal dissipation & optical uniform
Table of Contents:
Features-----------------------------------------------------
Product Code----------------------------------------------
Typical Product Characteristics-------------------------
Maximum Rating------------------------------------------
Dominant Wavelength Binning------------------------
Intensity Binning------------------------------------------
Forward Voltage Binning-------------------------------
Electronic-Optical Characteristics--------------------
Relative Spectral Power Distribution----------------
Typical spatial distribution------------------------------
Thermal Design for De-rating--------------------------
Dimensions-------------------------------------------------
Suggest Stencil Pattern---------------------------------
Packing-----------------------------------------------------
Reflow Profile--------------------------------------------
Precautions-----------------------------------------------
Test items and results of reliability------------------
Features
RoHS2.0 and REACH-compliant
MSL2 qualified according to J-STD 020
ESD 2KV (HBM : MIL-STD-883 Class 2)
Applications
Automobile lighting
Decorative lighting
1
2
3
4
5
5
5
6
7
7
7
8
8
9
11
12
14
Brightek 3030 Series
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Product Code
5 – Z – SC30 – D – V24J – V – 0 – 1 – Z – M
① ② ③ ④ ⑤ ⑥ ⑦ ⑧ ⑨ ⑩
① ② ③ ④ ⑤
Process type
Category
Specification
Lens Angle code
Dice wavelength
& Luminous rank
5: For Automotive Z: High Power
LED
SC30: 3030 D: 30° VXXX: Red light &
level
⑥ ⑦ ⑧ ⑨ ⑩
Support code
Zener
Cap color code
Module &
Lens code
Current code
V: Substrate Code 0: None Zener
1: Series No. Z: Molding M : 70mA
Brightek 3030 Series
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Typical Product Characteristics(Ta=25℃)
Luminous Flux (lm)
@70mA
Luminous Intensity
(mcd)
@70mA
Dominant
Wavelength
(nm)
Forward Voltage (V)
@70mA
Viewing
Angle
Group
Min.
Max.
Min.
Max.
Min.
Max.
B09
8 9 12000 15000
620-630 2.0 2.6 25°
B10
9 10 15000 18000
B11
10 12 18000 21000
B12
12 14 21000 23000
Notes:
1. Forward voltage (VF ) ±0.1V；Radiant power (PO) ±7%；Wavelength (λd) ±1nm；
Viewing angle(2θ1/2) ±10°
2. IS standard testing.
3. Note: the brightness data is only for reference
Brightek 3030 Series
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Maximum Rating (Ta : 25℃)
Characteristics
Symbol
Min.
Typical
Max.
Unit
DC Forward Current1
IF 100 mA
Reverse Voltage
VR 5 V
Reverse Current
IR 10 μA
Junction Temperature2
Tj 125 ℃
Thermal Resistance Junction /
Solder Point
Rj-s 28 ℃/W
Storage Temperature Range
Tstg -40 – 100 ℃
Soldering Temperature
Tsol 260 ℃
Notes:
1. For other ambient, limited setting of current will depend on de-rating curves.
2. When drive on maximum current , Tj must be kept below 125℃
Brightek 3030 Series
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Dominant Wavelength Binning
Bin code
(70mA)
Min. λd
(nm)
Max. λd
(nm)
R620
620 625
R625
625 630
Intensity Binning
Bin code
(70mA)
Min. Φv
(Lm)
Max. Φv
(lm)
B09
8 9
B10
9 10
B11
10 12
B12
12 14
Forward Voltage Binning
Bin code
(70mA)
Min. VF
(V)
Max. VF
(V)
V2022
2.0 2.2
V2224
2.2 2.4
V2426
2.4 2.6
Brightek 3030 Series
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Electronic-Optical Characteristics
Forward Current vs. Forward Voltage (Ta=25℃)
Relative luminous Flux vs. Forward Current (Ta=25℃)
Forward Current vs. Relative Luminous Flux (Ta=25℃)
Brightek 3030 Series
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Relative spectral power distribution
Typical Spatial Distribution
Relative luminous Intensity(%)
Genealogies angle Ta=25°C
90°
10°
1. 0
0. 5
0
0
10
20
30
40
50
60
70
80
90
20° 30° 40° 50° 60° 70° 80°
0
0. 10. 20. 30. 40. 50. 60. 70. 80. 91. 0
Thermal Design for De-rating
The maximum forward current is determined by the thermal resistance between the LED junction
and ambient. It is crucial for the end product to be designed in a manner that minimizes the thermal
resistance from the solder point to ambient in order to optimize lamp life and optical characteristics.
0%
20%
40%
60%
80%
100%
120%
400 500 600 700 800
Relative Spectral Power(%)
Wavelength(nm)
Brightek 3030 Series
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Dimensions
§ All dimensions are in millimeters.
§ Tolerance is ±0.13mm unless other specified.
Suggest Stencil Pattern (Recommendations for reference)
1.60
0.51
0.54
2.40
0.64
1.50
0.41
2.40
§ Suggest stencil t =0.12 mm
RECOMMENDED PCB SOLDER PAD
RECOMMENDED STENCIL PATTERN
(HATCHED AREA IS OPENING)
Brightek 3030 Series
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Packing
Trailer 160(min) of empty
pockets sealed with tape
Leader 400mm (min) of empty
pockets sealed with tape
Loaded Pockets
(650 pcs)
+
-
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Brightek 3030 Series
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Notes:
1. Each reel (minimum number of pieces is 500 and maximum is 650 for 30 degree
product) is packed in a moisture-proof bag along with a packs of desiccant and a
humidity indicator card.
2. A maximum of 5 moisture-proof bags are packed in an inner box (size: 260mm x
230mm x 100mm ±5mm).
3. A maximum of 4 inner boxes are put in an outer box (size: 480mm x 275mm x 215mm
±5mm).
4. Part No., Lot No., quantity should be indicated on the label of the moisture-proof bag
and the cardboard box.
Label
Label
Label
Brightek 3030 Series
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Reflow Profile
IR Reflow Soldering Profile
Profile Feature Symbol
Pb-Free (SnAgCu) Assembly
Unit
Minimum
Recommendation
Maximum
Ramp-up Rate to Preheat (25°C to 150°C) 2 3 K/s
Time tS (TSmin to Tsmax) tS 60 100 120 s
Ramp-up Rate to Peak (TSmax to TP) 2 3 K/s
Liquidus Temperature TL 217 °C
Time above Liquidus temperature tL 80 100 s
Peak Temperature TP 245 260 °C
Time within 5 °C of the specified
peaktemperature TP - 5 K tP 10 20 30 s
Ramp-down Rate (TP to 100 °C) 3 4 K/s
Time 25 °C to TP 480 s
Notes:
1. Do not stress the silicone resin while it is exposed to high temperature.
2. The reflow process should not exceed 2 times.
Brightek 3030 Series
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Precautions
1. Recommendation for using LEDs
1.1 The lens of LEDs should not be exposed to dust or debris. Excessive dust and debris may
cause a drastic decrease in the luminosity.
1.2 Avoid mechanical stress on LED lens.
1.3 Do not touch the LED lens surface. It would affect the optical performance of the LED
due to the LED lens’ damage.
1.4 Pick & place tools are recommended for the remove of LEDs from the factory tape & reel
packaging
2. Lens handling
Please follow the guideline to pick LEDs.
2.1 Use tweezers to pick LEDs.
2.2 Do not touch the lens by using tweezers.
2.3 Do not touch lens with fingers.
2.4 Do not apply more than 4N (400gw) directly onto the lens.
3. Lens cleaning
In the case which a small amount of dirt and dust particles remain on the lens surface, a
suitable cleaning solution can be applied.
3.1 Try a gentle wiping with dust-free cloth.
3.2 If needed, use dust-free cloth and isopropyl alcohol to gently clean the dirt from the lens
surface.
Correct ( √ ) Wrong ( X )
Brightek 3030 Series
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3.3 Do not use other solvents as they may directly react with the LED assembly.
3.4 Do not use ultrasonic cleaning which will damage the LEDs.
4. Carrier tape handling
The following items are recommended when handling the carrier tape of LEDs.
4.1 Do not twist the carrier tape.
4.2 The inward bending diameter should not be smaller than 6cm for each carrier tape.
4.3 Do not bend the tape outward.
5. Storage
5.1 The moisture-proof bag is sealed：
The LEDs should be stored at 30°C or less and 90%RH or less. And the LEDs are limited
to use within one year, while the LEDs is packed in moisture-proof package with the
desiccants inside.
5.2 The moisture-proof bag is opened：
The LEDs should be stored at 30°C or less and 60%RH or less. Moreover, the LEDs are
limited to solder process within 168hrs. If the humidity indicator card shows the pink color
in 10% even higher or exceed the storage limiting time since opened, that we
recommended to baking LEDs at 60°C at least 24hrs. To seal the remainder LEDs return
to the moisture-proof bag, it’s recommended to be with workable desiccants.
Brightek 3030 Series
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Test Items and Results of Reliability
Notes:
1. USL: Upper specification level
2. LSL: Lower specification level
Test Item
Test Conditions
Duration/
Cycle
Number of
Damage
Reference
Thermal Shock
–40℃ 30min
↑↓5min
125℃ 30min
1000 cycles 0/77 AEC-Q101
High Temperature
Storage
Ta=100℃ 1000 hrs 0/22 EIAJ ED-4701
200 201
Humidity Heat
Storage
Ta=85℃
RH=85% 1000 hrs 0/22 EIAJ ED-4701
100 103
Low Temperature
Storage
Ta=-40℃ 1000 hrs 0/22 EIAJ ED-4701
200 202
Life Test
Ta=25℃
If=70mA 1000 hrs 0/22
High Humidity Heat
Operation
85℃ RH=85%
If=70mA 1000 hrs 0/22
High Temperature
Operation
Ta=85℃
If=70mA 1000 hrs 0/22
ESD(HBM)
2KV at 1.5kΩ;100pf 3 Times 0/22 MIL-STD-883
Failure Criteria
Item
Symbol
Condition
Criteria for Judgment
Min
Max
Forward Voltage
VF If=70mA - USL1×1.1
Reverse Current
IR VR =5V - 100μA
Luminous Intensity
Iv If=70mA LSL2×0.7 -
