IS281-4GB
TEMPERATURE PROFILE OF SOLDERING REFLOW
(2) When using another soldering method such as infrated ray lamp, the temperatu re m ay ris e
partially in the mold of the device.
Keep the temperature on the package of the device within the condition of above (1)
Notes:
- Isocom is continually improving the quality, reliability, function or design and
Isocom reserves the right to make changes without further notices.
- The products shown in this publication are designed for the general use in electronic
applications such as office automation equipment, communications devices,
audio/visual equipment, electrical application and instrumentation.
- For equipment/devices where high reliability or safety is required, such as space
applications, nuclear power control equipment, medical equipment, etc, please
contact our sales representatives.
- When requiring a device for any ”specific” application, please contact our sales in
advice.
- If there are any questions about the contents of this publication, please contact us at
your convenience.
- The contents described herein are subject to change without prior notice.
- Do not immerse unit’s body in solder paste.
Part No. : IS281-4GB Page : 10 of 10