0805
Size
(L" x W")
5
Voltage
6.3V = 6
10V = Z
16V = Y
25V = 3
50V = 5
100V = 1
200V = 2
C
Dielectric
X7R = C
103
Capacitance
Code (In pF)
2 Sig. Digits +
Number of
Zeros
M
Capacitance
Tolerance
Preferred
J = ± 5%
K = ±10%
M = ± 20%
A
Failure
Rate
A = Not
Applicable
T
Terminations
T = Plated Ni
and Sn
7 = Gold
Plated
2
Packaging
2 = 7" Reel
4 = 13" Reel
7 = Bulk Cass.
9 = Bulk
Contact
Factory For
Multiples
A
Special
Code
A = Std.
Product
11
X7R Dielectric
General Specifications
X7R formulations are called “temperature stable” ceramics
and fall into EIA Class II materials. X7R is the most popular
of these intermediate dielectric constant materials. Its tem-
perature variation of capacitance is within ±15% from
-55°C to +125°C. This capacitance change is non-linear.
Capacitance for X7R varies under the influence of electrical
operating conditions such as voltage and frequency.
X7R dielectric chip usage covers the broad spectrum of
industrial applications where known changes in capaci-
tance due to applied voltages are acceptable.
PART NUMBER (see page 2 for complete part number explanation)
% Cap Change
10
-60 -40 -20 0 20 40 60 80 100 120 140
Temperature °C
X7R Dielectric
Typical Temperature Coefficient
5
0
-5
-10
-15
-20
-25
% Capacitance
+10
+20
+30
0
-10
-20
-30
1KHz 10 KHz 100 KHz 1 MHz 10 MHz
Frequency
Capacitance vs. Frequency
Insulation Resistance (Ohm-Farads)
1,000
10,000
100
0020 120
40 60 80
Temperature °C
Insulation Resistance vs Temperature
100
Impedance,
10 100 1000
Frequency, MHz
Variation of Impedance with Cap Value
Impedance vs. Frequency
1,000 pF vs. 10,000 pF - X7R
0805
0.10
0.01
1.00
1,000 pF
10,000 pF
10.00
Impedance,
110
100 1,000
Frequency, MHz
Variation of Impedance with Chip Size
Impedance vs. Frequency
100,000 pF - X7R
0.1
.01
1.0
1206
0805
10
1210
Impedance,
110
100 1,000
Frequency, MHz
Variation of Impedance with Chip Size
Impedance vs. Frequency
10,000 pF - X7R
0.1
.01
1.0
1206
0805
10
1210
12
X7R Dielectric
Specifications and Test Methods
Parameter/Test X7R Specification Limits Measuring Conditions
Operating Temperature Range -55ºC to +125ºC Temperature Cycle Chamber
Capacitance Within specified tolerance
2.5% for 50V DC rating Freq.: 1.0 kHz ± 10%
Dissipation Factor 3.0% for 25V DC rating Voltage: 1.0Vrms ± .2V
3.5% for 16V DC rating For Cap > 10 µF, 0.5Vrms @ 120Hz
5.0% for 10V DC rating
Insulation Resistance 100,000Mor 1000M- µF, Charge device with rated voltage for
whichever is less 60 ± 5 secs @ room temp/humidity
Charge device with 300% of rated voltage for
Dielectric Strength No breakdown or visual defects 1-5 seconds, w/charge and discharge current
limited to 50 mA (max)
Appearance No defects Deflection: 2mm
Capacitance Test Time: 30 seconds
Resistance to Variation ±12%
Flexure Dissipation Meets Initial Values (As Above)
Stresses Factor
Insulation Initial Value x 0.3
Resistance
Solderability 95% of each terminal should be covered Dip device in eutectic solder at 230 ± 5ºC
with fresh solder for 5.0 ± 0.5 seconds
Appearance No defects, <25% leaching of either end terminal
Capacitance
Variation ±7.5%
Dip device in eutectic solder at 260ºC for 60
Dissipation Meets Initial Values (As Above) seconds. Store at room temperature for 24 ± 2
Resistance to Factor hours before measuring electrical properties.
Solder Heat Insulation Meets Initial Values (As Above)
Resistance
Dielectric Meets Initial Values (As Above)
Strength
Appearance No visual defects Step 1: -55ºC ± 30 ± 3 minutes
Capacitance
Variation ±7.5% Step 2: Room Temp 3 minutes
Dissipation Meets Initial Values (As Above) Step 3: +125ºC ± 30 ± 3 minutes
Thermal Factor
Shock Insulation Meets Initial Values (As Above) Step 4: Room Temp 3 minutes
Resistance
Dielectric Meets Initial Values (As Above) Repeat for 5 cycles and measure after
Strength 24 ± 2 hours at room temperature
Appearance No visual defects
Capacitance
Variation ±12.5%
Dissipation Initial Value x 2.0 (See Above)
Load Life Factor
Insulation Initial Value x 0.3 (See Above)
Resistance
Dielectric Meets Initial Values (As Above)
Strength
Appearance No visual defects
Capacitance
Variation ±12.5%
Load Dissipation Initial Value x 2.0 (See Above)
Humidity Factor
Insulation Initial Value x 0.3 (See Above)
Resistance
Dielectric Meets Initial Values (As Above)
Strength
Charge device with twice rated voltage in
test chamber set at 125ºC ± 2ºC
for 1000 hours (+48, -0)
Remove from test chamber and stabilize
at room temperature for 24 ± 2 hours
before measuring.
Store in a test chamber set at 85ºC ± 2ºC/
85% ± 5% relative humidity for 1000 hours
(+48, -0) with rated voltage applied.
Remove from chamber and stabilize at
room temperature and humidity for
24 ± 2 hours before measuring.
1mm/sec
90 mm
13
X7R Dielectric
Capacitance Range
PREFERRED SIZES ARE SHADED
SIZE 0201 0402 0603 0805 1206
Soldering Reflow Only Reflow Only Reflow/Wave Reflow/Wave Reflow/Wave
Packaging All Paper All Paper All Paper Paper/Embossed Paper/Embossed
(L) Length MM 0.60 ± 0.03 1.00 ± 0.10 1.60 ± 0.15 2.01 ± 0.20 3.20 ± 0.20
(in.) (0.024 ± 0.001) (0.040 ± 0.004) (0.063 ± 0.006) (0.079 ± 0.008) (0.126 ± 0.008)
(W) Width MM 0.30 ± 0.03 0.50 ± 0.10 0.81 ± 0.15 1.25 ± 0.20 1.60 ± 0.20
(in.) (0.011 ± 0.001) (0.020 ± 0.004) (0.032 ± 0.006) (0.049 ± 0.008) (0.063 ± 0.008)
(t) Terminal MM 0.15 ± 0.05 0.25 ± 0.15 0.35 ± 0.15 0.50 ± 0.25 0.50 ± 0.25
(in.) (0.006 ± 0.002) (0.010 ± 0.006) (0.014 ± 0.006) (0.020 ± 0.010) (0.020 ± 0.010)
WVDC 10 16 6.3 10 16 25 50 6.3 10 16 25 50 100 200 10 16 25 50 100 200 10 16 25 50 100 200
Cap 100 A A C C C C C
(pF) 120 A A C C C C C
150 A A C C C C C
180 A A C C C C C G G G G G G G
220 A A C C C C C G G G G G G G
270 A A C C C C C G G G G G G G E E E E E E
330 A A C C C C C G G G G G G G E E E E E E
390 A A C C C C C G G G G G G G E E E E E E
470 A A C C C C C G G G G G G G E E E E E E
560 A A C C C C C G G G G G G G E E E E E E
680 A A C C C C C G G G G G G G E E E E E E
820 A A C C C C C G G G G G G G E E E E E E
1000 A A C C C C C G G G G G G G E E E E E E J J J J J J
1200 C C C C C G G G G G G E E E E E J J J J J J J
1500 C C C C C G G G G G G E E E E E J J J J J J J
1800 C C C C C G G G G G G E E E E E J J J J J J J
2200 C C C C C G G G G G G E E E E E J J J J J J J
2700 C C C C C G G G G G G E E E E E J J J J J J J
3300 C C C C C G G G G G G E E E E E J J J J J J J
3900 C C C C C G G G G G G E E E E E J J J J J J J
4700 C C C C C G G G G G G E E E E J J J J J J J J
5600 C C C C C G G G G G G E E E E J J J J J J J J
6800 C C C C G G G G G G E E E E J J J J J J J J
8200 C C C C G G G G G G E E E E J J J J J J J J
Cap. 0.010 C C C G G G G G G E E E E J J J J J J J J
(µF) 0.012 C C C G G G G G G J J J J J J J J J J J M
0.015 C C C G G G G G J J J J J J J J J J J M
0.018 C C C G G G G G J J J J J M J J J J J M
0.022 C C C G G G G G J J J J J M J J J J J M
0.027 C C G G G G G J J J J J J J J J J M
0.033 C C G G G G G J J J J M J J J J J M
0.039 C C G G G G G J J J J M J J J J J M
0.047 G G G G J J J J M J J J J J M
0.056 G G G G J J J J J J J J J P
0.068 G G G G J J J J J J J J J P
0.082 G G G G J J J J J J J J M
0.10 G G G G J J J J J J J J M
0.12 G G J J J M J J J J
0.15 G G J J J J J J J
0.18 G G J J M J J J J
0.22 G G J J M J J J J
0.27 MM J J J M
0.33 MM J J MM
0.47 NM M M MM
0.56 NMMQ
0.68 NMMQ
0.82 NMMQ
1.0 NMMQ
1.2 P
1.5 P
1.8 P
2.2 Q
3.3
4.7
10
22
47
100
WVDC 10 16 6.3 10 16 25 50 6.3 10 16 25 50 100 200 10 16 25 50 100 200 10 16 25 50 100 200
SIZE 0201 0402 0603 0805 1206
Contact Factory for Multiples
L
W
T
t
Letter A C E G J K M N P Q X Y Z BB CC
Max. 0.33 0.56 0.71 0.86 0.94 1.02 1.27 1.40 1.52 1.78 2.29 2.54 2.79 3.05 3.175
Thickness (0.013) (0.022) (0.028) (0.034) (0.037) (0.040) (0.050) (0.055) (0.060) (0.070) (0.090) (0.100) (0.110) (0.120) (0.125)
PAPER EMBOSSED
14
X7R Dielectric
Capacitance Range
PREFERRED SIZES ARE SHADED
SIZE 1210 1812 1825 2220 2225
Soldering Reflow/Wave Reflow Only Reflow Only Reflow Only Reflow Only
Packaging Paper/Embossed All Embossed All Embossed All Embossed All Embossed
(L) Length MM 3.20 ± 0.20 4.50 ± 0.30 4.50 ± 0.30 5.7 ± 0.40 5.72 ± 0.25
(in.) (0.126 ± 0.008) (0.177 ± 0.012) (0.177 ± 0.012) (0.224 ± 0.016) (0.225 ± 0.010)
(W) Width MM 2.50 ± 0.20 3.20 ± 0.20 6.40 ± 0.40 5.0 ± 0.40 6.35 ± 0.25
(in.) (0.098 ± 0.008) (0.126 ± 0.008) (0.252 ± 0.016) (0.197 ± 0.016) (0.250 ± 0.010)
(t) Terminal MM 0.50 ± 0.25 0.61 ± 0.36 0.61 ± 0.36 0.64 ± 0.39 0.64 ± 0.39
(in.) (0.020 ± 0.010) (0.024 ± 0.014) (0.024 ± 0.014) (0.025 ± 0.015) (0.025 ± 0.015)
WVDC 10 16 25 50 100 16 25 50 100 50 100 50 100 200 50 100
Cap 100
(pF) 120
150
180
220
270
330
390
470
560
680
820
1000 J J J J J
1200 J J J J J
1500 J J J J J
1800 J J J J J
2200 J J J J J
2700 J J J J J
3300 J J J J J
3900 J J J J J
4700 J J J J J
5600 J J J J J
6800 J J J J J
8200 J J J J J
Cap. 0.010 J J J J J K K M M X X X M M
(µF) 0.012 J J J J J K K M M X X X M M
0.015 J J J J J K K M M X X X M M
0.018 J J J J J K K M M X X X M M
0.022 J J J J J K K M M X X X M M
0.027 J J J J J K K M M X X X M M
0.033 J J J J J K K M M X X X M M
0.039 J J J J J K K M M X X X M M
0.047 J J J J J K K M M X X X M M
0.056 J J J J J K K M M X X X M M
0.068 J J J J J K K M M X X X M M
0.082 J J J J J K K M M X X X M M
0.10 J J J J J K K M M X X X M M
0.12 J J J J M K K M M X X X M M
0.15 J J J J M K K M M X X X M M
0.18 J J J J P K K M M X X X M M
0.22 J J J J P K K M M X X X M M
0.27 J J J J Z K M M M X X M M
0.33 J J J J Z K M M M X X M M
0.47 M M M M Z K P M M X X M M
0.56 M M M Z M Q M M X X M M
0.68 M M P Z M X M Q X X M M
0.82 M M P M X M Q X M M
1.0 N N P X Z M X M Q X M M
1.2 N N M M X M P
1.5 N N MMP
1.8 N P M
2.2 X ZM
3.3
4.7 Q Z
10 Z
22
47
100
WVDC 10 16 25 50 100 16 25 50 100 50 100 50 100 200 50 100
SIZE 1210 1812 1825 2220 2225
Contact Factory for Multiples
L
W
T
t
Letter A C E G J K M N P Q X Y Z BB CC
Max. 0.33 0.56 0.71 0.86 0.94 1.02 1.27 1.40 1.52 1.78 2.29 2.54 2.79 3.05 3.175
Thickness (0.013) (0.022) (0.028) (0.034) (0.037) (0.040) (0.050) (0.055) (0.060) (0.070) (0.090) (0.100) (0.110) (0.120) (0.125)
PAPER EMBOSSED