Copyright ©2008 by Zilog, Inc. All rights reserved.
www.zilog.com
Product Specification
PS007226-0408
Packaging
PS007226-0408
DO NOT USE IN LIFE SUPPORT
LIFE SUPPORT POLICY
ZILOG'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICA L COMPONENTS IN LIFE
SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS PRIOR WRITTEN APPROVAL OF
THE PRESIDENT AND GENERAL COUNSEL OF ZILOG CORPORATION.
As used herein
Life support devices or systems are devices which (a) are intended for surgical implant into the body, or (b)
support or sustain life and whose failure to perform when properly used in accordance with instructions for
use provided in the labeling can be reasonably expected to result in a significant injury to the user. A
critical component is any component in a life support device or system whose failure to perform can be
reasonably expected to cause the failure of the life support device or system or to affect its safety or
effectiveness.
Document Disclaimer
©2008 by Zilog, Inc. All rights reserved. Information in this publication concerning the devices,
applications, or technology described is intended to suggest possible uses and may be superseded. ZILOG,
INC. DOES NOT ASSUME LIABILITY FOR OR PROVIDE A REPRESENTATION OF ACCURACY
OF THE INFORMATION, DEVICES, OR TECHNOLOGY DESCRIBED IN THIS DOCUMENT.
ZILOG ALSO DOES NOT ASSUME LIABILITY FOR INTELLECTUAL PROPERTY
INFRINGEMENT RELATED IN ANY MANNER TO USE OF INFORMATION, DEVICES, OR
TECHNOLOGY DESCRIBED HEREIN OR OTHERWISE. The information contained within this
document has be en verified according to the gene ral pr inciples of electrical and mechanical engineering.
Z8, Z8 Encore!, Z8 Encore! XP, Z8 Encore! MC, Crimzon, eZ80, and ZNEO are trademarks or registered
trademarks of Zilog, Inc. All other product or service names are the property of their respective owners.
Warning:
Packaging
Product Specification
PS007226-0408 Table of Contents
iii
Table of Contents
Ordering Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Package Designators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Environmental Flow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Package Designators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Environmental Flow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Tape, Reel, Tray, and Tube Counts. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Solderability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Mark Permanency (For Ink Mark). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Plastic Dual In-Line Packages (PDIPs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Shrink Dual In-Line Packages (SDIPs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Plastic Leaded Chip Carriers (PLCCs). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Low-Profile Quad Flat Packages (LQFPs). . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Quad Flat No Lead (QFNs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Plastic Quad Flat Packages (QFPs). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Small Outline Integrated Circuits (SOICs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Shrink Small Outline Packages (SSOPs). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Low-Profile Ball Grid Arrays (LBGAs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Transceiver Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Lead Type, Carrier Tape Size, and Reel Quantity . . . . . . . . . . . . . . . . . . . 41
Preferred Package Migration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Change Log . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Customer Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Packaging
Product Specification
PS007226-0408 List of Figures
iv
List of Figures
Figure 1. Current Part-Numbering Scheme. . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Figure 2. Motor Control Part-Numbering Scheme. . . . . . . . . . . . . . . . . . . . . . . 2
Figure 3. IR Part-Numbering Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Figure 4. ARM Part Numbering Scheme. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Figure 5. Previous Part-Numbering Scheme. . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Figure 6. 8-Lead Plastic Dual In-Line Package . . . . . . . . . . . . . . . . . . . . . . . . . 8
Figure 7. 14-Lead Plastic Dual In-Line Package . . . . . . . . . . . . . . . . . . . . . . . . 9
Figure 8. 18-Lead Plastic Dual In-Line Package . . . . . . . . . . . . . . . . . . . . . . . . 9
Figure 9. 20-Lead Plastic Dual In-Line Package . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 10. 22-Lead Plastic Dual In-Line Package . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 11. 28-Lead Plastic Dual In-Line Package . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 12. 40-Lead Plastic Dual In-Line Package . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 13. 48-Lead Plastic Dual In-Line Package . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 14. 42-Lead Shrink Dual In-Line Package . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 15. 52-Lead Shrink Dual In-Line Package . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 16. 64-Lead Shrink Dual In-Line Package . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 17. 28-Lead Plastic Leaded Chip Carrier . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 18. 44-Lead Plastic Leaded Chip Carrier . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 19. 68-Lead Plastic Leaded Chip Carrier . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 20. 84-Lead Plastic Leaded Chip Carrier . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 21. 32-Lead Plastic Low-Profile Quad Flat
Package (7 x 7 x 1.4 mm). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 22. 44-Lead Plastic Low-Profile Quad Flat
Package (10 x 10 x 1.4 mm). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 23. 64-Lead Plastic Low-Profile Quad Flat
Package (10 x 10 x 1.4 mm). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 24. 64-Lead Plastic Low-Profile Quad Flat
Package (14 x 14 x 1.4 mm). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Figure 25. 100-Lead Plastic Low-Profile Quad Flat Package . . . . . . . . . . . . . . 23
Figure 26. 144-Lead Plastic Low-Profile Quad Flat Package . . . . . . . . . . . . . . 24
Figure 27. 8 Quad Flat No Lead (5 x 6 x 0.9 mm) . . . . . . . . . . . . . . . . . . . . . . . 25
Figure 28. 20 Quad Flat No Lead (5 x 5 x 0.9 mm). . . . . . . . . . . . . . . . . . . . . . 26
Figure 29. 28 Quad Flat No Lead (5 x 5 x 0.9 mm). . . . . . . . . . . . . . . . . . . . . . 26
Figure 30. 32 Quad Flat No Lead (5 x 5 x 0.9 mm). . . . . . . . . . . . . . . . . . . . . . 27
Packaging
Product Specification
PS007226-0408 List of Figures
v
Figure 31. 44 Quad Flat No Lead (7 x 7 mm) . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Figure 32. 80-Lead Plastic Quad Flat Package. . . . . . . . . . . . . . . . . . . . . . . . . 28
Figure 33. 100-Lead Plastic Quad Flat Package. . . . . . . . . . . . . . . . . . . . . . . . 29
Figure 34. 144-Lead Plastic Quad Flat Package. . . . . . . . . . . . . . . . . . . . . . . . 30
Figure 35. 8-Lead Small Outline Integrated Circuit . . . . . . . . . . . . . . . . . . . . . . 31
Figure 36. 18-Lead Small Outline Integrated Circuit . . . . . . . . . . . . . . . . . . . . . 32
Figure 37. 20-Lead Small Outline Integrated Circuit . . . . . . . . . . . . . . . . . . . . . 33
Figure 38. 28-Lead Small Outline Integrated Circuit . . . . . . . . . . . . . . . . . . . . . 34
Figure 39. 20-Lead Shrink Small Outline Package . . . . . . . . . . . . . . . . . . . . . . 35
Figure 40. 28-Lead Shrink Small Outline Package . . . . . . . . . . . . . . . . . . . . . . 36
Figure 41. 48-Lead Shrink Small Outline Package . . . . . . . . . . . . . . . . . . . . . . 37
Figure 42. 144-Lead Low-Profile Ball Grid Array. . . . . . . . . . . . . . . . . . . . . . . . 38
Figure 43. 196-Lead Low-Profile Ball Grid
Array (15 x 15 mm, 1.0 mm pitch) . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Figure 44. 256-Lead Low-Profile Ball Grid
Array (17 x 17 mm, 1.0 mm pitch) . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Figure 45. ZHX1203 Transceiver. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Figure 46. ZHX1223 Mechanical Specification . . . . . . . . . . . . . . . . . . . . . . . . . 43
Figure 47. ZHX1403 Transceiver. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Figure 48. ZHX1423 Transceiver. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Figure 49. ZHX1810 Transceiver. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Figure 50. Alternate ZHX1810 Transceiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Figure 51. ZHX1820 Transceiver. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Figure 52. Alternate ZHX1820 Transceiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Figure 53. 18-/20-Lead Migration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Figure 54. 28-Lead Migration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Figure 55. 40-/44-/48-Lead Migration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Figure 56. 100-/144-Lead Migration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Packaging
Product Specification
PS007226-0408 Ordering Codes
1
Ordering Codes
Orders placed for Zilog® components must include the component part number as
displayed in Figure 1, Figure 2 on page 2 or Figure 3 on page 3. Figure 4 on page 3
displays the ARM part numbering scheme. The part number in Figure 1 consists of a ‘Z’
followed by a six-character alphanumeric product identifier, a two-letter package
designator, a three-digit speed designator, a letter identifying the operating temperature
range, and a letter identifying the environmental flow. If the component is a ROM device,
an ‘R’ follows the environmental flow designator with a four-character alphanumeric
special lot code.
Figure 1. Current Part-Numbering Scheme
Package Designators
AZ—Low-Profile Quad Flat Package
FZ—Plastic Quad Flat Package
HZ—Shrink Small Outline Package
NA—Low-Profile Ball Grid Array (LBGA)
NP—Ball Grid Array (Plastic)
PZ—Plastic Dual In-Line Package
QN—Quad Flat No Lead (QFN)
SZ—Small Outline Integrated Circuit
Z 8PE003 PZ 010 S C R1234 ROM code or special lot code (optional)—a
ROM code is designated by an ‘R’; special
lot codes are alphanumeric
Environmental flow
Temperature range
Speed designator
Package designator
Product identifier
Zilog prefix
Packaging
Product Specification
PS007226-0408 Ordering Codes
2
VZ—Plastic Leaded Chip Carrier
Temperature Range
E—Extended Temperature: –40 °C to +105 °C
S—Standard Temperature: 0 °C to +70 °C
Environmental Flow
C—Plastic Standard
D—Plastic Stressed
G—Green Pa ck age
Figure 2. Motor Control Part-Numbering Scheme
Z 8F MC 32300 HZ S
‘TR’’ (optional)
4-digit special lot number or
5-digit ROM code (optional)
Flow
Temperature
Package
Product
ASSP family
Product family
Product line/company
C2068 TR
Packaging
Product Specification
PS007226-0408 Ordering Codes
3
Figure 3. IR Part-Numbering Scheme
Figure 4. ARM Part Numbering Scheme
ZL R 16 300 P 28
5-digit ROM code (optional)
Backend environmental test flow codes
Memory size
Number of pins
Package
Relative performance
Memory size or regional database coverage
Memory type
Product line/comp a ny
16 R53AR TR
4-digit special LOT number or
‘TR’ (optional)
C
Z A9L 0010 NW 1L S
4-digit special LOT number or
Flow
Temperature
Speed
Package
Product/Customer Version
Product Family
Product line/comp an y
GA007
5-digit ROM code (optional)
Packaging
Product Specification
PS007226-0408 Ordering Codes
4
Figure 5 displays the previous part-numbering scheme. The previous part number
consisted of a ‘Z,’ followed by a five-character alphanumeric product identifier, a two-
digit speed designator, a letter identifying the package, a letter identifying the operating
temperature range, and a letter identifying the environmental flow. If the component is a
ROM device, an ‘R’ follows the environmental flow designator with a four-character
alphanumeric special lot code.
Figure 5. Previous Part-Numbering Scheme
Package Designators
A—Low-Profile Quad Flat Package
F—Plastic Quad Flat Package
H—Shrink Small Outline Package
P—Plastic Dual In-Line Package
Q—Quad Flat No Lead
S—Small Outline Integrated Circuit
V—Plastic Leaded Chip Carrier
Temperature Range
Same as previous. See Temperature Range on page 2.
Z 80185 33 F S C R1234 ROM code or special lot code (optional)—a
ROM code is designated by an ‘R’; special lot
codes are alphanumeric
Environmental flow
Temperature range
Package designator
Speed designator
Product identifier
Zilog prefix
Packaging
Product Specification
PS007226-0408 Tape, Reel, Tray, and Tube Counts
5
Environmental Flow
Same as previous. See Environmental Flow on page 2.
Tape, Reel, Tray, and Tu be Counts
The following table describes the tape, reel, tray, and tube counts for various lead types.
Lead Type Unit Packing
Quantity Tape and Reel Dry Pack
PDIP 8 LEAD 50/RAIL
PDIP 14 LEAD 25/RAIL
PDIP 18 LEAD 20/RAIL
PDIP 20 LEAD 18/RAIL
PDIP 22 LEAD 17/RAIL
PDIP 28 LEAD 15/RAIL
PDIP 40 LEAD 10/RAIL
PDIP 48 LEAD 8/RAIL
SDIP 42 LEAD 15/RAIL
SDIP 52 LEAD 10/RAIL
SDIP 64 LEAD 8/RAIL
PLCC 28 LEAD 39/RAIL 750/REEL 936/BAG
PLCC 44 LEAD 25/RAIL 500/REEL 500/BAG
PLCC 68 LEAD 20/RAIL 250/REEL 400/BAG
PLCC 84 LEAD 15/RAIL 250/REEL 225/BAG
QFP 80L 14 x 20 x 2.7 66/TRAY 450/REEL 660/BAG
QFP 100L 14 x 20 x 2.7 66/TRAY 450/REEL 660/BAG
QFP 144L 28 x 28 x 3.42 24/TRAY 240/BAG
LQFP 32L 7 x 7 x 1.4 250/T RAY 2000/REEL 2500/BAG
LQFP 44L 10 x 10 x 1.4 160/TRAY 1500/REEL 1600/BAG
Packaging
Product Specification
PS007226-0408 Solderability
6
Solderability
Unless otherwise noted, the solderability uses current revision of MIL-STD-883.
LQFP 64L 10 x 10x 1.4 160/TRAY 1500/REEL 1600/BAG
LQFP 64L 14 x 14 x 1.4 90/TRAY 1500/REEL 900/BAG
LQFP 100L 14 x 14 x1.4 90/TRAY 1500/REEL 900/BAG
LQFP 144L 20 x 20 x 1.4 60/TRAY 600/BAG
SOIC 8L 150 mil 96/RAIL 3000/REEL 9600/BAG
SOIC 18L 300 mil 40/RAIL 2000/REEL 1000/BAG
SOIC 20L 300 mil 38/RAIL 1800/REEL 950/BAG
SOIC 28L 300 mil 27/RAIL 1800/REEL 1080/BAG
SSOP 20L 5.3 mm 67/RAIL 2000/REEL 1675/BAG
SSOP 28L 5.3 mm 47/RAIL 2000/REEL 1175/BAG
SSOP 48L 30/RAIL 1000/REEL 1200/BAG
144 LBGA 13 x 13 160/TRAY 1600/BAG
256 LBGA 17 x 17 90/TRAY 900/BAG
8 QFN 5 x 6 x 0.9 mm 490/TRAY 6000/REEL 4900/BAG
20 QFN 5 x 5 x 0.9 mm 490/TRAY 6000/REEL 4900/BAG
28 QFN 5 x 5 x 0.9 mm 490/TRAY 6000/REEL 4900/BAG
32 QFN 5 x 5 x 0.9 mm 490/TRAY 6000/REEL 4900/BAG
44 QFN 7 x 7 mm 260/TRAY 2600/BAG
Lead Type Unit Packing
Quantity Tape and Reel Dry Pack
Packaging
Product Specification
PS007226-0408 Mark Permanency (For Ink Mark)
7
Mark Permanency (For Ink Mark)
Unless otherwise noted, the following applies:
1 part by volume isopropyl alcohol and 3 parts by volume mineral spirits.
3X soak, 1 minute duration each soak.
Mech. brush after each soak.
Packaging
Product Specification
PS007226-0408 Plastic Dual In-Line Packages (PDIPs)
8
Plastic Dual In-Line Packages (PDIPs)
Zilog® offers the following plastic dual in-line packages (PDIPs):
•
8-lead (Figure 6)
•
14-lead (Figure 7 on page 9)
•
18-lead (Figure 8 on page 9)
•
20-lead (Figure 9 on page 10)
•
22-lead (Figure 10 on page 10)
•
28-lead (Figure 11 on page 11)
•
40-lead (Figure 12 on page 12)
•
48-lead (Figure 13 on page 12)
Zilog does not recommend this package for new designs and recommends using
the 8-lead SOIC package (Figure 35 on page 31) instead.
Figure 6. 8-Lead Plastic Dual In-Line Package
Note:
Packaging
Product Specification
PS007226-0408 Plastic Dual In-Line Packages (PDIPs)
9
Figure 7. 14-Lead Plastic Dual In-Line Package
Figure 8. 18-Lead Plastic Dual In-Line Package
Packaging
Product Specification
PS007226-0408 Plastic Dual In-Line Packages (PDIPs)
10
Figure 9. 20-Lead Plastic Dual In-Line Package
Figure 10. 22-Lead Plastic Dual In-Line Package
eA
E
D1 eB
C
D
1
B1
22
E1
11
12
0.0050.13D1
0.145
0.420
MIN
0.015
0.014
0.045
0.009
1.065
0.390
0.330
0.115
MILLIMETER
SYMBOL
2.54 BSC
L
eA
e
2.92
10.67
E
E1
D
9.91
8.38
27.60
11.94
4.10
-
10.80
9.40
28.45
3.68A2
B1
C
B
1.14
0.23
0.36
A1 0.38
MIN
3.94
0.56
0.38
1.65
MAX
1.02
INCH
0.100 BSC
0.160
-
0.470
0.425
0.370
1.120
0.155
0.065
0.015
0.022
0.040
MAX
A2
A1
L
Packaging
Product Specification
PS007226-0408 Plastic Dual In-Line Packages (PDIPs)
12
See preferred package 40-/44-/48-Lead migration ( Figure 55 on page 51).
Figure 12. 40-Lead Plastic Dual In-Line Package
Figure 13. 48-Lead Plastic Dual In-Line Package
Note:
e
SB1
B
Q1
A2
LA1
D
E1
0.66016.76 0.61015.49
eA
CONT ROLLING DIMENSIONS : INCH
eA
E
C
Q1
S
L1.40
1.52
3.05 1.91
2.29
3.81
0.090
0.075
0.150
0.060
0.055
0.120
0.530.38
B
E1
e
E
D
C
B1
52.58
2.54 TYP
13.59
15.24 14.22
15.75
0.23
52.07
1.02 0.38
1.52
SYMBOL
M
A1
A2
MILLIMETER
0.38
3.18
MIN 1.02
4.06
MAX
0.0210.015
2.070
0.015
0.060
0.560
0.620
0.100 TYP
0.600
0.535
0.009
0.040
2.050
0.160
0.040
MAX
INCH
0.125
0.015
MIN
Packaging
Product Specification
PS007226-0408 Shrink Dual In-Line Packages (SDIPs)
13
Shrink Dual In-Line Packages (SDIPs)
Zilog offers the follo wing shrink dual in-line packages (SDIPs):
•
42-lead (Figure 14)
•
52-lead (Figure 15 on page 14)
•
64-lead (Figure 16 on page 15)
Figure 14. 42-Lead Shrink Dual In-Line Package
Packaging
Product Specification
PS007226-0408 Shrink Dual In-Line Packages (SDIPs)
14
Figure 15. 52-Lead Shrink Dual In-Line Package
Packaging
Product Specification
PS007226-0408 Shrink Dual In-Line Packages (SDIPs)
15
Figure 16. 64-Lead Shrink Dual In-Line Package
Packaging
Product Specification
PS007226-0408 Plastic Leaded Chip Carriers (PLCCs)
16
Plastic Leaded Chip Carriers (PLCCs)
Zilog offers the following plastic leaded chip carriers (PLCCs):
•
28-lead (Figure 17)
•
44-lead (Figure 18 on page 17)
•
68-lead (Figure 19 on page 18)
•
84-lead (Figure 20 on page 18)
See preferred package 28-Lead migration (Figure 54 on page 51).
Figure 17. 28-Lead Plastic Leaded Chip Carrier
Note:
D
D1
25
E
E1
19
4261
5
1
1
12 18
SYMBOL
A
A1
D/E
D1/E1
D2
e
MILLIMETER INCH
MIN MAX MIN MAX
4.19
2.41
12.32
11.43
9.91
1.27 TYP
4.57
2.92
12.57
11.58
10.92
.050 TYP
.165
.095
.485
.450
.390
.180
.115
.495
.456
.430
0.81/0.66
.032-.026
0.53/0.33
.021/.013
0.66/0.51
.026/.020
R 1.14/0.64
.045/.025
e
1.219/1.067
.048/.042
D2
DIM. FROM CENTER
T O CENTER OF RADII
NOTES:
1. CONTROLLING DIMENSIONS: INCH
2. LEADS ARE COPLANAR WITHIN .004 INCH.
3. DIMENSION: MM
INCH
A
A1
Packaging
Product Specification
PS007226-0408 Plastic Leaded Chip Carriers (PLCCs)
18
Figure 19. 68-Lead Plastic Leaded Chip Carrier
Figure 20. 84-Lead Plastic Leaded Chip Carrier
Packaging
Product Specification
PS007226-0408 Low-Profile Quad Flat Packages (LQFPs)
19
Low-Profile Quad Flat Packages (LQFPs)
Zilog offers the following low-profile quad flat packages (LQFPs):
•
32-lead (Figure 21)
•
44-lead (Figure 22 on page 20)
•
64-lead (Figure 23 on page 21 and Figure 24 on page 22)
•
100-lead (Figure 25 on page 23)
•
144-lead (Figure 26 on page 24)
Figure 21. 32-Lead Plastic Low-Profile Quad Flat Package (7 x 7 x 1.4 mm)
Packaging
Product Specification
PS007226-0408 Low-Profile Quad Flat Packages (LQFPs)
20
Figure 22. 44-Lead Plastic Low-Profile Quad Flat Package (10 x 10 x 1.4 mm)
Packaging
Product Specification
PS007226-0408 Low-Profile Quad Flat Packages (LQFPs)
21
Figure 23. 64-Lead Plastic Low-Profile Quad Flat Package (10 x 10 x 1.4 mm)
Packaging
Product Specification
PS007226-0408 Low-Profile Quad Flat Packages (LQFPs)
22
Figure 24. 64-Lead Plastic Low-Profile Quad Flat Package (14 x 14 x 1.4 mm)
Packaging
Product Specification
PS007226-0408 Low-Profile Quad Flat Packages (LQFPs)
23
Figure 25. 100-Lead Plastic Low-Profile Quad Flat Package
Packaging
Product Specification
PS007226-0408 Low-Profile Quad Flat Packages (LQFPs)
24
Figure 26. 144-Lead Plastic Low-Profile Quad Flat Package
Packaging
Product Specification
PS007226-0408 Quad Flat No Lead (QFNs)
25
Quad Flat No Lead (QFNs)
Zilog offers the following quad flat no lead (QFNs) packages:
•
8 QFN (Figure 27)
•
20 QFN (Figure 28 on page 26)
•
28 QFN (Figure 29 on page 26)
•
32 QFN (Figure 30 on page 27)
•
44 QFN (Figure 31 on page 27)
Figure 27. 8 Quad Flat No Lead (5 x 6 x 0.9 mm)
Packaging
Product Specification
PS007226-0408 Quad Flat No Lead (QFNs)
26
Figure 28. 20 Quad Flat No Lead (5 x 5 x 0.9 mm)
Figure 29. 28 Quad Flat No Lead (5 x 5 x 0.9 mm)
Packaging
Product Specification
PS007226-0408 Quad Flat No Lead (QFNs)
27
Figure 30. 32 Quad Flat No Lead (5 x 5 x 0.9 mm)
Figure 31. 44 Quad Flat No Lead (7 x 7 mm)
Packaging
Product Specification
PS007226-0408 Plastic Quad Flat Packages (QFPs)
28
Plastic Quad Flat Packages (QFPs)
Zilog offers the following plastic quad flat packages (QFPs):
•
80-lead (Figure 32 on page 28)
•
100-lead (Figure 33 on page 29)
•
144-lead (Figure 34 on page 30)
Zilog does not recommend this package for new designs and recommends using
the 44-lead LQFP (Figure 22 on page 20) or 48-lead SSOP (Figure 41 on
page 37) instead. The 44-lead LQFP is a drop-in replacement for the 44-lead
QFP; no board layout changes are needed for this switch. See preferred package
40-/44-/48-Lead migration (Figure 55 on page 51 ).
Figure 32. 80-Lead Plastic Quad Flat Package
Note:
Packaging
Product Specification
PS007226-0408 Plastic Quad Flat Packages (QFPs)
29
Figure 33. 100-Lead Plastic Quad Flat Package
Packaging
Product Specification
PS007226-0408 Plastic Quad Flat Packages (QFPs)
30
Figure 34. 144-Lead Plastic Quad Flat Package
Packaging
Product Specification
PS007226-0408 Small Outline Integrated Circuits (SOICs)
31
Small Outline Integrated Circuits (SOICs)
Zilog offers the following small outline integrated circuits (SOICs):
•
8-lead (Figure 35)
•
18-lead (Figure 36 on page 32)
•
20-lead (Figure 37 on page 33)
•
28-lead (Figure 38 on page 34)
Figure 35. 8-Lead Small Outline Integrated Circuit
Packaging
Product Specification
PS007226-0408 Small Outline Integrated Circuits (SOICs)
32
Figure 36. 18-Lead Small Outline Integrated Circuit
Packaging
Product Specification
PS007226-0408 Shrink Small Outline Packages (SSOPs)
35
Shrink Small Outline Packages (SSOPs)
Zilog offers the follo wing shrink small outline packages (SSOPs):
•
20-lead (Figure 39)
•
28-lead (Figure 40 on page 36)
•
48-lead (Figure 41 on page 37)
Figure 39. 20-Lead Shrink Small Outline Package
Packaging
Product Specification
PS007226-0408 Shrink Small Outline Packages (SSOPs)
36
Figure 40. 28-Lead Shrink Small Outline Package
Packaging
Product Specification
PS007226-0408 Shrink Small Outline Packages (SSOPs)
37
Figure 41. 48-Lead Shrink Small Outline Package
Packaging
Product Specification
PS007226-0408 Low-Profile Ball Grid Arrays (LBGAs)
38
Low-Profile Ball Grid Arrays (LBGAs)
Zilog offers the following low-profile ball grid arrays (LBGAs):
•
144-lead (Figure 42)
•
196-lead (Figure 43 on page 39)
•
256-lead (Figure 44 on page 40)
Figure 42. 144-Lead Low-Profile Ball Grid Array
0.65-0.75
Ø0.40 or Ø0.46 TYP
1.20-1.50 0.36
13.00
BALL COPLA - MAX 0.12 mm
TOLERANCE : ±0.05
ALL DIMENSIONS ARE IN MM.
13.00
A1 BALL
PAD CORNER
TOP VIEW
K
1.00 REF
SEATING PLANE
1.00
1.00 REF
144 SOLDER BALLS
M
L
A1 BALL PAD CORNER
1.00
7
BOTTOM VIEW
10
1112 98 65 3
42
B
F
H
J
G
D
E
C
A
1
C
Packaging
Product Specification
PS007226-0408 Low-Profile Ball Grid Arrays (LBGAs)
39
Figure 43. 196-Lead Low-Profile Ball Grid Array (15 x 15 mm, 1.0 mm pitch)
Packaging
Product Specification
PS007226-0408 Low-Profile Ball Grid Arrays (LBGAs)
40
Figure 44. 256-Lead Low-Profile Ball Grid Array (17 x 17 mm, 1.0 mm pitch)
Packaging
Product Specification
PS007226-0408 Transceiver Packages
41
Transceiver Packages
Zilog offers the following transceiver packages:
•
ZHX1203 (Figure 45 on page 42)
•
ZHX1223TB (Figure 46 on page 43)
•
ZHX1403 (Figure 47 on page 44)
•
ZHX1423 (Figure 48 on page 45)
•
ZHX1810 (Figure 49 on page 46 an d Figure 50 on page 47)
•
ZHX1820 (Figure 51 on page 48 an d Figure 52 on page 49)
Lead Type, Carrier Tape Size, and Reel Quantity
The following table describes the carrier tape size and reel quantity for the transceiver
packages.
Lead Type Carrier Tape Size (mm) Reel Quantity
ZHX1010 16 2000
ZHX1010-01 24 500
ZHX1403/1203 16 3500
ZHX1810/Z8HX1820 16 2000
16 2000
ZHX1223/1423 16 2500
Packaging
Product Specification
PS007226-0408 Transceiver Packages
42
Quantity: 3500 pieces per reel
Figure 45. ZHX1203 Transceiver
Packaging
Product Specification
PS007226-0408 Transceiver Packages
43
Figure 46. ZHX1223 Mechanical Specification
ZHX1223
Packaging
Product Specification
PS007226-0408 Transceiver Packages
44
Quantity: 3500 pieces per reel
Figure 47. ZHX1403 Transceiver
Packaging
Product Specification
PS007226-0408 Transceiver Packages
45
Quantity: 2500 pieces per reel
Figure 48. ZHX1423 Transceiver
To achieve the lowest possible costs and lead times, Zilog® maintains multiple assembly
facilities. Figure 49 and Figure 50 on page 47 display the mechanical drawings for the
ZHX1810 transceivers. These devices, which display the minor mechanical differences,
are functionally equivalent in every way and meet all Zilog and IrDA standards and
specifications. All ZHX1810 devices use the identical solder pad layout. Although reels
are never mixed, Zilog reserves the right to ship from either facility in order to meet the
delivery requirements. When designing a n IrDA su bsystem, you must allow mecha nical
clearance for all versions of the IrDA transceiver.
Packaging
Product Specification
PS007226-0408 Transceiver Packages
46
Quantity: 2000 pieces per reel
Figure 49. ZHX1810 Transceiver
Packaging
Product Specification
PS007226-0408 Transceiver Packages
47
Quantity: 2000 pieces per reel
Figure 50. Alternate ZHX1810 Transceiver
Packaging
Product Specification
PS007226-0408 Transceiver Packages
48
Quantity: 2000 units per reel. For more information, refer to Ta ping and Packing of IrDA
Devices (MAC8000).
Figure 51. ZHX1820 Transceiver
Packaging
Product Specification
PS007226-0408 Transceiver Packages
49
Figure 52. Alternate ZHX1820 Transceiver
1.35
1.475
33.1
1.8
2.75
3.3
3.65
Units: mm
Tolerance: +/- 0.2
PIN FUNCTION PIN FUNCTION
1
GND
2
RXD
3
VCC
4SD
5
6
LEDA
TXD
P1.55±0.1×5=7.75±0.1
0.7
3.875 (3.875)
0.475
(6) (5) (4) (3) (2) (1)
0.8
Note that this style has a larger
emitter lens than receive lens
RXTX
Receiving Center
LENS VIEW
CONTACTS VIEW
Top Look Solder Pad layout
9.0 (ref.)
Emitting Center
This style does not
have side solder vias
SIDE VIEW
0.70
0.80
1.55
Mounting
Center
4.325
0.45 0.45
0.75
Packaging
Product Specification
PS007226-0408 Preferred Package Migration
50
Preferred Package Migration
Zilog offers the follo wing migration packages:
•
18-/20-lead (Figure 53)
•
28-lead (Figure 54 on page 51)
•
40-/44-/48-lead (Figure 55 on page 51)
•
100-/144-lead (Figure 56 on page 52)
Figure 53. 18-/20-Lead Migration
FP: 25mm²
FP: 56.2mm²FP: 132mm²FP: 180mm²
ARROW
ARROW -
-PREFERRED MIGRATION
PREFERRED MIGRATION
20PDIP
FP: 200 mm²
Packaging
Product Specification
PS007226-0408 Preferred Package Migration
51
Figure 54. 28-Lead Migration
Figure 55. 40-/44-/48-Lead Migration
44 QFN
FP~ 49 sq mm
40 PDIP
FP: ~810sq mm
48L SSOP
FP ~ 165 sq mm
44L PLCC
FP ~307 sq mm
ARROW
ARROW -
-PREFERRED MIGRATION
PREFERRED MIGRATION
FP
FP-
-Footprint
Footprint
44 LQFP
FP~144 sq mm
Packaging
Product Specification
PS007226-0408 Preferred Package Migration
52
Figure 56. 100-/144-Lead Migration
FP: 484mm² FP: 428mm² FP: 256mm²
ARROW
ARROW -
-PREFERRED MIGRATION
PREFERRED MIGRATION
FP: 121mm²FP: 169mm²
144 28x28 QFP
FP: 973mm²
FP - FOOTPRINT
Packaging
Product Specification
PS007226-0408 Change Log
53
Change Log
The following change notices are incorporated in this document:
Date Control Number Drawing Numb er
04/09/08 21011 MKT71C1150-00 Rev. Obs
06/15/07 20985 MKT71C1178-00 Rev. D
MKT71C1156-00 Rev. I
MKT71C1164-00 Rev. G
MKT71C1154-00 Rev. H
06/15/07 20984 MKT71C1168-00 Rev. F
MKT71C1190-00 Rev. B
MKT71C1202-00 Rev. B
MKT71C1182-00 Rev. D
MKT71C1176-00 Rev. D
MKT71C1159-00 Rev. I
MKT71C1173-00 Rev. D
06/15/07 20980 MKT71C1180-00 Rev. C
02/20/07 20976 MKT71C1167-00 Rev. H
01/29/07 20972 MKT71C1000-00
12/05/06 20961 MKT71C1200-00
08/29/06 20911 MKT71C0002-00 Rev. I
08/29/06 20935 MKT71C1177-00 Rev. D
08/29/06 20923 MKT71C1200-00 Rev. B
08/29/06 20937 MKT71C1203-00 Rev. C
10/31/05 20859 MKT71C1206-00 Rev. A
10/31/05 20874 MKT71C0005-00 Rev. M
9/9/05 20856 MKT71C1203-00 Rev. B
9/9/05 20856 MKT71C1204-00 Rev. C
9/9/05 20856 MKT71C1205-00 Rev. C
9/12/05 20809 MKT71C1204-00 Rev. A
9/12/05 20809 MKT71C1205-00 Rev. A
9/12/05 20809 MKT71C1194-00 Rev. OBS
9/12/05 20809 MKT71C1199-00 Rev. OBS
2/2/05 20773 MKT71C1198-00 Rev. A
Packaging
Product Specification
PS007226-0408 Change Log
54
2/2/05 20787 MKT71C1200-00 Rev. A
MKT71C1201-00 Rev. A
2/2/05 20797 MKT71C1202-00 Rev. A
8/16/04 20720 MKT71C1194-00 Rev. A
6/9/04 20712 N/A
6/9/04 20721 MKT71C1160-00 Rev. OBS
MKT71C1169-00 Rev. OBS
MKT71C1174-00 Rev. OBS
MKT71C1175-00 Rev. OBS
MKT71C1183-00 Rev. OBS
MKT71C1186-00 Rev. OBS
MKT71C1188-00 Rev. OBS
MKT71C1191-00 Rev. OBS
11/12/03 N/A MKT71C1192-00 Rev. OBS
MKT71C1187-00 Rev. OBS
MKT71C1193-00 Rev. C
9/8/03 N/A MKT71C0004-00 Rev. M
6/9/03 N/A MKT71C1189-00 Rev. OBS
MKT71C1193-00 Rev. B
8/23/02 N/A MKT71C0719-00 Rev. E
5/16/02 N/A MKT71C0006-00 Rev. H
MKT71C1151-00 Rev. L
5/15/02 N/A MKT71C1001-00 Rev. M
MKT71C1153-00 Rev. N
MKT71C1164-00 Rev. E
MKT71C1192-00 Rev. A
MKT71C1193-00 Rev. A
Date Control Number Drawing Numb er
Packaging
Product Specification
PS007226-0408 Change Log
55
5/14/02 N/A MKT71C0101-00 Rev. OBS
MKT71C0110-00 Rev. OBS
MKT71C0115-00 Rev. OBS
MKT71C0116-00 Rev. OBS
MKT71C0119-00 Rev. OBS
MKT71C0123-00 Rev. OBS
MKT71C0124-00 Rev. OBS
MKT71C0130-00 Rev. OBS
MKT71C0133-00 Rev. OBS
MKT71C0181-00 Rev. OBS
MKT71C0183-00 Rev. OBS
MKT71C0184-00 Rev. OBS
MKT71C0185-00 Rev. OBS
MKT71C0196-00 Rev. OBS
MKT71C0199-00 Rev. OBS
MKT71C0803-00 Rev. OBS
MKT71C0804-00 Rev. OBS
MKT71C0805-00 Rev. OBS
MKT71C0806-00 Rev. OBS
MKT71C0807-00 Rev. OBS
1/26/01 52951 MKT71C1187-00
1/26/01 52958 MKT71C1159-00
MKT71C1167-00
MKT71C1173-00
MKT71C1176-00
MKT71C1182-00
MKT71C1186-00
12/5/00 52855 MKT71C1191-00
10/25/00 52592 MKT71C1187-00
10/25/00 52667 MKT71C1153-00
8/24/00 51671 MKT71C1188-00
8/24/00 51989 MKT71C1190-00
8/24/00 51672 MKT71C1189-00
8/23/00 19026 MKT71C0002-00
8/23/00 16970 MKT71C1172-00
8/22/00 51015 MKT71C1177-00
Date Control Number Drawing Numb er
Packaging
Product Specification
PS007226-0408 Customer Support
56
Customer Support
For answers to technical questions about the product, documentation, or any other issues
with Zilog’s offerings, please visit Zilog’s Knowledge Base at
http://www.zilog.com/kb.
For any comments, detail technical questions, or reporting problems, please visit Zilog’s
Technical Support at http://support.zilog.com.
