Packaging Product Specification PS007226-0408 Copyright (c)2008 by Zilog, Inc. All rights reserved. www.zilog.com Warning: DO NOT USE IN LIFE SUPPORT LIFE SUPPORT POLICY ZILOG'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS PRIOR WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF ZILOG CORPORATION. As used herein Life support devices or systems are devices which (a) are intended for surgical implant into the body, or (b) support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in a significant injury to the user. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system or to affect its safety or effectiveness. Document Disclaimer (c)2008 by Zilog, Inc. All rights reserved. Information in this publication concerning the devices, applications, or technology described is intended to suggest possible uses and may be superseded. ZILOG, INC. DOES NOT ASSUME LIABILITY FOR OR PROVIDE A REPRESENTATION OF ACCURACY OF THE INFORMATION, DEVICES, OR TECHNOLOGY DESCRIBED IN THIS DOCUMENT. Z I L O G A L S O D O E S N O T A S S U M E L I A B I L I T Y F O R I N T E L L E C T U A L P R O P E RT Y INFRINGEMENT RELATED IN ANY MANNER TO USE OF INFORMATION, DEVICES, OR TECHNOLOGY DESCRIBED HEREIN OR OTHERWISE. The information contained within this document has been verified according to the general principles of electrical and mechanical engineering. Z8, Z8 Encore!, Z8 Encore! XP, Z8 Encore! MC, Crimzon, eZ80, and ZNEO are trademarks or registered trademarks of Zilog, Inc. All other product or service names are the property of their respective owners. PS007226-0408 Packaging Product Specification iii Table of Contents Ordering Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Package Designators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Environmental Flow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Package Designators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Environmental Flow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1 2 2 4 4 5 Tape, Reel, Tray, and Tube Counts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Solderability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Mark Permanency (For Ink Mark). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Plastic Dual In-Line Packages (PDIPs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Shrink Dual In-Line Packages (SDIPs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Plastic Leaded Chip Carriers (PLCCs). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Low-Profile Quad Flat Packages (LQFPs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Quad Flat No Lead (QFNs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Plastic Quad Flat Packages (QFPs). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Small Outline Integrated Circuits (SOICs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Shrink Small Outline Packages (SSOPs). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 Low-Profile Ball Grid Arrays (LBGAs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 Transceiver Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 Lead Type, Carrier Tape Size, and Reel Quantity . . . . . . . . . . . . . . . . . . . 41 Preferred Package Migration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 Change Log . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 Customer Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 PS007226-0408 Table of Contents Packaging Product Specification iv List of Figures Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. Figure 13. Figure 14. Figure 15. Figure 16. Figure 17. Figure 18. Figure 19. Figure 20. Figure 21. Figure 22. Figure 23. Figure 24. Figure 25. Figure 26. Figure 27. Figure 28. Figure 29. Figure 30. PS007226-0408 Current Part-Numbering Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Motor Control Part-Numbering Scheme . . . . . . . . . . . . . . . . . . . . . . . 2 IR Part-Numbering Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 ARM Part Numbering Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Previous Part-Numbering Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 8-Lead Plastic Dual In-Line Package . . . . . . . . . . . . . . . . . . . . . . . . . 8 14-Lead Plastic Dual In-Line Package . . . . . . . . . . . . . . . . . . . . . . . . 9 18-Lead Plastic Dual In-Line Package . . . . . . . . . . . . . . . . . . . . . . . . 9 20-Lead Plastic Dual In-Line Package . . . . . . . . . . . . . . . . . . . . . . . 10 22-Lead Plastic Dual In-Line Package . . . . . . . . . . . . . . . . . . . . . . . 10 28-Lead Plastic Dual In-Line Package . . . . . . . . . . . . . . . . . . . . . . . 11 40-Lead Plastic Dual In-Line Package . . . . . . . . . . . . . . . . . . . . . . . 12 48-Lead Plastic Dual In-Line Package . . . . . . . . . . . . . . . . . . . . . . . 12 42-Lead Shrink Dual In-Line Package . . . . . . . . . . . . . . . . . . . . . . . 13 52-Lead Shrink Dual In-Line Package . . . . . . . . . . . . . . . . . . . . . . . 14 64-Lead Shrink Dual In-Line Package . . . . . . . . . . . . . . . . . . . . . . . 15 28-Lead Plastic Leaded Chip Carrier . . . . . . . . . . . . . . . . . . . . . . . . 16 44-Lead Plastic Leaded Chip Carrier . . . . . . . . . . . . . . . . . . . . . . . . 17 68-Lead Plastic Leaded Chip Carrier . . . . . . . . . . . . . . . . . . . . . . . . 18 84-Lead Plastic Leaded Chip Carrier . . . . . . . . . . . . . . . . . . . . . . . . 18 32-Lead Plastic Low-Profile Quad Flat Package (7 x 7 x 1.4 mm). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 44-Lead Plastic Low-Profile Quad Flat Package (10 x 10 x 1.4 mm). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 64-Lead Plastic Low-Profile Quad Flat Package (10 x 10 x 1.4 mm). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 64-Lead Plastic Low-Profile Quad Flat Package (14 x 14 x 1.4 mm). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 100-Lead Plastic Low-Profile Quad Flat Package . . . . . . . . . . . . . . 23 144-Lead Plastic Low-Profile Quad Flat Package . . . . . . . . . . . . . . 24 8 Quad Flat No Lead (5 x 6 x 0.9 mm) . . . . . . . . . . . . . . . . . . . . . . . 25 20 Quad Flat No Lead (5 x 5 x 0.9 mm) . . . . . . . . . . . . . . . . . . . . . . 26 28 Quad Flat No Lead (5 x 5 x 0.9 mm) . . . . . . . . . . . . . . . . . . . . . . 26 32 Quad Flat No Lead (5 x 5 x 0.9 mm) . . . . . . . . . . . . . . . . . . . . . . 27 List of Figures Packaging Product Specification v Figure 31. Figure 32. Figure 33. Figure 34. Figure 35. Figure 36. Figure 37. Figure 38. Figure 39. Figure 40. Figure 41. Figure 42. Figure 43. Figure 44. Figure 45. Figure 46. Figure 47. Figure 48. Figure 49. Figure 50. Figure 51. Figure 52. Figure 53. Figure 54. Figure 55. Figure 56. PS007226-0408 44 Quad Flat No Lead (7 x 7 mm) . . . . . . . . . . . . . . . . . . . . . . . . . . 80-Lead Plastic Quad Flat Package . . . . . . . . . . . . . . . . . . . . . . . . . 100-Lead Plastic Quad Flat Package . . . . . . . . . . . . . . . . . . . . . . . . 144-Lead Plastic Quad Flat Package . . . . . . . . . . . . . . . . . . . . . . . . 8-Lead Small Outline Integrated Circuit . . . . . . . . . . . . . . . . . . . . . . 18-Lead Small Outline Integrated Circuit . . . . . . . . . . . . . . . . . . . . . 20-Lead Small Outline Integrated Circuit . . . . . . . . . . . . . . . . . . . . . 28-Lead Small Outline Integrated Circuit . . . . . . . . . . . . . . . . . . . . . 20-Lead Shrink Small Outline Package . . . . . . . . . . . . . . . . . . . . . . 28-Lead Shrink Small Outline Package . . . . . . . . . . . . . . . . . . . . . . 48-Lead Shrink Small Outline Package . . . . . . . . . . . . . . . . . . . . . . 144-Lead Low-Profile Ball Grid Array . . . . . . . . . . . . . . . . . . . . . . . . 196-Lead Low-Profile Ball Grid Array (15 x 15 mm, 1.0 mm pitch) . . . . . . . . . . . . . . . . . . . . . . . . . . 256-Lead Low-Profile Ball Grid Array (17 x 17 mm, 1.0 mm pitch) . . . . . . . . . . . . . . . . . . . . . . . . . . ZHX1203 Transceiver. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ZHX1223 Mechanical Specification . . . . . . . . . . . . . . . . . . . . . . . . . ZHX1403 Transceiver. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ZHX1423 Transceiver. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ZHX1810 Transceiver. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Alternate ZHX1810 Transceiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . ZHX1820 Transceiver. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Alternate ZHX1820 Transceiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18-/20-Lead Migration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28-Lead Migration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40-/44-/48-Lead Migration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100-/144-Lead Migration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 28 29 30 31 32 33 34 35 36 37 38 39 40 42 43 44 45 46 47 48 49 50 51 51 52 List of Figures Packaging Product Specification 1 Ordering Codes Orders placed for Zilog(R) components must include the component part number as displayed in Figure 1, Figure 2 on page 2 or Figure 3 on page 3. Figure 4 on page 3 displays the ARM part numbering scheme. The part number in Figure 1 consists of a `Z' followed by a six-character alphanumeric product identifier, a two-letter package designator, a three-digit speed designator, a letter identifying the operating temperature range, and a letter identifying the environmental flow. If the component is a ROM device, an `R' follows the environmental flow designator with a four-character alphanumeric special lot code. Z 8PE003 PZ 010 S C R1234 ROM code or special lot code (optional)--a ROM code is designated by an `R'; special lot codes are alphanumeric Environmental flow Temperature range Speed designator Package designator Product identifier Zilog prefix Figure 1. Current Part-Numbering Scheme Package Designators AZ--Low-Profile Quad Flat Package FZ--Plastic Quad Flat Package HZ--Shrink Small Outline Package NA--Low-Profile Ball Grid Array (LBGA) NP--Ball Grid Array (Plastic) PZ--Plastic Dual In-Line Package QN--Quad Flat No Lead (QFN) SZ--Small Outline Integrated Circuit PS007226-0408 Ordering Codes Packaging Product Specification 2 VZ--Plastic Leaded Chip Carrier Temperature Range E--Extended Temperature: -40 C to +105 C S--Standard Temperature: 0 C to +70 C Environmental Flow C--Plastic Standard D--Plastic Stressed G--Green Package Z 8F MC 32300 HZ S C 2068 TR `TR'' (optional) 4-digit special lot number or 5-digit ROM code (optional) Flow Temperature Package Product ASSP family Product family Product line/company Figure 2. Motor Control Part-Numbering Scheme PS007226-0408 Ordering Codes Packaging Product Specification 3 ZL R 16 300 P 28 16 C R53AR TR `TR' (optional) 4-digit special LOT number or 5-digit ROM code (optional) Backend environmental test flow codes Memory size Number of pins Package Relative performance Memory size or regional database coverage Memory type Product line/company Figure 3. IR Part-Numbering Scheme Z A9L 0010 NW 1L S G A007 4-digit special LOT number or 5-digit ROM code (optional) Flow Temperature Speed Package Product/Customer Version Product Family Product line/company Figure 4. ARM Part Numbering Scheme PS007226-0408 Ordering Codes Packaging Product Specification 4 Figure 5 displays the previous part-numbering scheme. The previous part number consisted of a `Z,' followed by a five-character alphanumeric product identifier, a twodigit speed designator, a letter identifying the package, a letter identifying the operating temperature range, and a letter identifying the environmental flow. If the component is a ROM device, an `R' follows the environmental flow designator with a four-character alphanumeric special lot code. Z 80185 33 F S C R1234 ROM code or special lot code (optional)--a ROM code is designated by an `R'; special lot codes are alphanumeric Environmental flow Temperature range Package designator Speed designator Product identifier Zilog prefix Figure 5. Previous Part-Numbering Scheme Package Designators A--Low-Profile Quad Flat Package F--Plastic Quad Flat Package H--Shrink Small Outline Package P--Plastic Dual In-Line Package Q--Quad Flat No Lead S--Small Outline Integrated Circuit V--Plastic Leaded Chip Carrier Temperature Range Same as previous. See Temperature Range on page 2. PS007226-0408 Ordering Codes Packaging Product Specification 5 Environmental Flow Same as previous. See Environmental Flow on page 2. Tape, Reel, Tray, and Tube Counts The following table describes the tape, reel, tray, and tube counts for various lead types. PS007226-0408 Lead Type Unit Packing Quantity PDIP 8 LEAD 50/RAIL PDIP 14 LEAD 25/RAIL PDIP 18 LEAD 20/RAIL PDIP 20 LEAD 18/RAIL PDIP 22 LEAD 17/RAIL PDIP 28 LEAD 15/RAIL PDIP 40 LEAD 10/RAIL PDIP 48 LEAD 8/RAIL SDIP 42 LEAD 15/RAIL SDIP 52 LEAD 10/RAIL SDIP 64 LEAD 8/RAIL PLCC 28 LEAD Tape and Reel Dry Pack 39/RAIL 750/REEL 936/BAG PLCC 44 LEAD 25/RAIL 500/REEL 500/BAG PLCC 68 LEAD 20/RAIL 250/REEL 400/BAG PLCC 84 LEAD 15/RAIL 250/REEL 225/BAG QFP 80L 14 x 20 x 2.7 66/TRAY 450/REEL 660/BAG QFP 100L 14 x 20 x 2.7 66/TRAY 450/REEL 660/BAG QFP 144L 28 x 28 x 3.42 24/TRAY LQFP 32L 7 x 7 x 1.4 250/TRAY 2000/REEL 2500/BAG LQFP 44L 10 x 10 x 1.4 160/TRAY 1500/REEL 1600/BAG 240/BAG Tape, Reel, Tray, and Tube Counts Packaging Product Specification 6 Lead Type Unit Packing Quantity Tape and Reel Dry Pack LQFP 64L 10 x 10x 1.4 160/TRAY 1500/REEL 1600/BAG LQFP 64L 14 x 14 x 1.4 90/TRAY 1500/REEL 900/BAG LQFP 100L 14 x 14 x1.4 90/TRAY 1500/REEL 900/BAG LQFP 144L 20 x 20 x 1.4 60/TRAY SOIC 8L 150 mil 96/RAIL 3000/REEL 9600/BAG SOIC 18L 300 mil 40/RAIL 2000/REEL 1000/BAG SOIC 20L 300 mil 38/RAIL 1800/REEL 950/BAG SOIC 28L 300 mil 27/RAIL 1800/REEL 1080/BAG SSOP 20L 5.3 mm 67/RAIL 2000/REEL 1675/BAG SSOP 28L 5.3 mm 47/RAIL 2000/REEL 1175/BAG SSOP 48L 30/RAIL 1000/REEL 1200/BAG 144 LBGA 13 x 13 160/TRAY 1600/BAG 256 LBGA 17 x 17 90/TRAY 900/BAG 8 QFN 5 x 6 x 0.9 mm 490/TRAY 6000/REEL 4900/BAG 20 QFN 5 x 5 x 0.9 mm 490/TRAY 6000/REEL 4900/BAG 28 QFN 5 x 5 x 0.9 mm 490/TRAY 6000/REEL 4900/BAG 32 QFN 5 x 5 x 0.9 mm 490/TRAY 6000/REEL 4900/BAG 44 QFN 7 x 7 mm 260/TRAY 600/BAG 2600/BAG Solderability Unless otherwise noted, the solderability uses current revision of MIL-STD-883. PS007226-0408 Solderability Packaging Product Specification 7 Mark Permanency (For Ink Mark) Unless otherwise noted, the following applies: 1 part by volume isopropyl alcohol and 3 parts by volume mineral spirits. 3X soak, 1 minute duration each soak. Mech. brush after each soak. PS007226-0408 Mark Permanency (For Ink Mark) Packaging Product Specification 8 Plastic Dual In-Line Packages (PDIPs) Zilog(R) offers the following plastic dual in-line packages (PDIPs): * * * * * * * * 8-lead (Figure 6) 14-lead (Figure 7 on page 9) 18-lead (Figure 8 on page 9) 20-lead (Figure 9 on page 10) 22-lead (Figure 10 on page 10) 28-lead (Figure 11 on page 11) 40-lead (Figure 12 on page 12) 48-lead (Figure 13 on page 12) Note: Zilog does not recommend this package for new designs and recommends using the 8-lead SOIC package (Figure 35 on page 31) instead. Figure 6. 8-Lead Plastic Dual In-Line Package PS007226-0408 Plastic Dual In-Line Packages (PDIPs) Packaging Product Specification 9 Figure 7. 14-Lead Plastic Dual In-Line Package Figure 8. 18-Lead Plastic Dual In-Line Package PS007226-0408 Plastic Dual In-Line Packages (PDIPs) Packaging Product Specification 10 Figure 9. 20-Lead Plastic Dual In-Line Package SYMBOL MILLIMETER MIN 12 E1 11 1 D E A2 L D1 e B A1 MAX 1.02 0.015 0.040 A2 3.68 3.94 0.145 0.155 B 0.36 0.56 0.014 0.022 B1 1.14 1.65 0.045 0.065 C 0.23 0.38 0.009 0.015 D 27.60 28.45 1.065 1.120 E 9.91 10.80 0.390 0.425 E1 8.38 9.40 0.330 0.370 e B1 INCH MIN 0.38 A1 22 MAX 0.100 BSC 2.54 BSC eA 10.67 11.94 0.420 0.470 L 2.92 4.10 0.115 0.160 D1 0.13 - 0.005 - C eA Figure 10. 22-Lead Plastic Dual In-Line Package PS007226-0408 Plastic Dual In-Line Packages (PDIPs) Packaging Product Specification 11 Note: See preferred package 28-Lead Migration (Figure 54 on page 51). Figure 11. 28-Lead Plastic Dual In-Line Package PS007226-0408 Plastic Dual In-Line Packages (PDIPs) Packaging Product Specification 12 Note: See preferred package 40-/44-/48-Lead migration (Figure 55 on page 51). SYMBOL E1 M D E Q1 A1 A2 B B1 C D E E1 e eA L Q1 S MILLIMETER MIN MAX 0.38 3.18 0.38 1.02 0.23 52.07 15.24 13.59 2.54 15.49 3.05 1.40 1.52 1.02 4.06 0.53 1.52 0.38 52.58 15.75 14.22 TYP 16.76 3.81 1.91 2.29 INCH MIN MAX 0.015 0.040 0.125 0.160 0.015 0.021 0.040 0.060 0.009 0.015 2.050 2.070 0.600 0.620 0.535 0.560 0.100 TYP 0.610 0.120 0.055 0.060 0.660 0.150 0.075 0.090 A2 CONTROLLING DIMENSIONS : INCH C L A1 eA S e B B1 Figure 12. 40-Lead Plastic Dual In-Line Package Figure 13. 48-Lead Plastic Dual In-Line Package PS007226-0408 Plastic Dual In-Line Packages (PDIPs) Packaging Product Specification 13 Shrink Dual In-Line Packages (SDIPs) Zilog offers the following shrink dual in-line packages (SDIPs): * * * 42-lead (Figure 14) 52-lead (Figure 15 on page 14) 64-lead (Figure 16 on page 15) Figure 14. 42-Lead Shrink Dual In-Line Package PS007226-0408 Shrink Dual In-Line Packages (SDIPs) Packaging Product Specification 14 Figure 15. 52-Lead Shrink Dual In-Line Package PS007226-0408 Shrink Dual In-Line Packages (SDIPs) Packaging Product Specification 15 Figure 16. 64-Lead Shrink Dual In-Line Package PS007226-0408 Shrink Dual In-Line Packages (SDIPs) Packaging Product Specification 16 Plastic Leaded Chip Carriers (PLCCs) Zilog offers the following plastic leaded chip carriers (PLCCs): * * * * 28-lead (Figure 17) 44-lead (Figure 18 on page 17) 68-lead (Figure 19 on page 18) 84-lead (Figure 20 on page 18) Note: See preferred package 28-Lead migration (Figure 54 on page 51). A A1 D1 4 1 26 5 25 E1 0.81/0.66 .032-.026 E 19 11 SYMBOL 0.66/0.51 .026/.020 e 0.53/0.33 .021/.013 MILLIMETER MIN D2 DIM. FROM CENTER TO CENTER OF RADII 1.219/1.067 .048/.042 D INCH MAX MIN MAX A 4.19 4.57 .165 .180 A1 2.41 2.92 .095 .115 D/E 12.32 12.57 .485 .495 D1/E1 11.43 11.58 .450 .456 D2 9.91 10.92 .390 .430 e 1.27 TYP .050 TYP 18 12 R 1.14/0.64 .045/.025 NOTES: 1. CONTROLLING DIMENSIONS: INCH 2. LEADS ARE COPLANAR WITHIN .004 INCH. 3. DIMENSION: MM INCH Figure 17. 28-Lead Plastic Leaded Chip Carrier PS007226-0408 Plastic Leaded Chip Carriers (PLCCs) Packaging Product Specification 17 Note: See preferred package 40-/44-/48-lead migration (Figure 55 on page 51). Figure 18. 44-Lead Plastic Leaded Chip Carrier PS007226-0408 Plastic Leaded Chip Carriers (PLCCs) Packaging Product Specification 18 Figure 19. 68-Lead Plastic Leaded Chip Carrier Figure 20. 84-Lead Plastic Leaded Chip Carrier PS007226-0408 Plastic Leaded Chip Carriers (PLCCs) Packaging Product Specification 19 Low-Profile Quad Flat Packages (LQFPs) Zilog offers the following low-profile quad flat packages (LQFPs): * * * * * 32-lead (Figure 21) 44-lead (Figure 22 on page 20) 64-lead (Figure 23 on page 21 and Figure 24 on page 22) 100-lead (Figure 25 on page 23) 144-lead (Figure 26 on page 24) Figure 21. 32-Lead Plastic Low-Profile Quad Flat Package (7 x 7 x 1.4 mm) PS007226-0408 Low-Profile Quad Flat Packages (LQFPs) Packaging Product Specification 20 Figure 22. 44-Lead Plastic Low-Profile Quad Flat Package (10 x 10 x 1.4 mm) PS007226-0408 Low-Profile Quad Flat Packages (LQFPs) Packaging Product Specification 21 Figure 23. 64-Lead Plastic Low-Profile Quad Flat Package (10 x 10 x 1.4 mm) PS007226-0408 Low-Profile Quad Flat Packages (LQFPs) Packaging Product Specification 22 Figure 24. 64-Lead Plastic Low-Profile Quad Flat Package (14 x 14 x 1.4 mm) PS007226-0408 Low-Profile Quad Flat Packages (LQFPs) Packaging Product Specification 23 Figure 25. 100-Lead Plastic Low-Profile Quad Flat Package PS007226-0408 Low-Profile Quad Flat Packages (LQFPs) Packaging Product Specification 24 Figure 26. 144-Lead Plastic Low-Profile Quad Flat Package PS007226-0408 Low-Profile Quad Flat Packages (LQFPs) Packaging Product Specification 25 Quad Flat No Lead (QFNs) Zilog offers the following quad flat no lead (QFNs) packages: * * * * * 8 QFN (Figure 27) 20 QFN (Figure 28 on page 26) 28 QFN (Figure 29 on page 26) 32 QFN (Figure 30 on page 27) 44 QFN (Figure 31 on page 27) Figure 27. 8 Quad Flat No Lead (5 x 6 x 0.9 mm) PS007226-0408 Quad Flat No Lead (QFNs) Packaging Product Specification 26 Figure 28. 20 Quad Flat No Lead (5 x 5 x 0.9 mm) Figure 29. 28 Quad Flat No Lead (5 x 5 x 0.9 mm) PS007226-0408 Quad Flat No Lead (QFNs) Packaging Product Specification 27 Figure 30. 32 Quad Flat No Lead (5 x 5 x 0.9 mm) Figure 31. 44 Quad Flat No Lead (7 x 7 mm) PS007226-0408 Quad Flat No Lead (QFNs) Packaging Product Specification 28 Plastic Quad Flat Packages (QFPs) Zilog offers the following plastic quad flat packages (QFPs): * * * 80-lead (Figure 32 on page 28) 100-lead (Figure 33 on page 29) 144-lead (Figure 34 on page 30) Note: Zilog does not recommend this package for new designs and recommends using the 44-lead LQFP (Figure 22 on page 20) or 48-lead SSOP (Figure 41 on page 37) instead. The 44-lead LQFP is a drop-in replacement for the 44-lead QFP; no board layout changes are needed for this switch. See preferred package 40-/44-/48-Lead migration (Figure 55 on page 51). Figure 32. 80-Lead Plastic Quad Flat Package PS007226-0408 Plastic Quad Flat Packages (QFPs) Packaging Product Specification 29 Figure 33. 100-Lead Plastic Quad Flat Package PS007226-0408 Plastic Quad Flat Packages (QFPs) Packaging Product Specification 30 Figure 34. 144-Lead Plastic Quad Flat Package PS007226-0408 Plastic Quad Flat Packages (QFPs) Packaging Product Specification 31 Small Outline Integrated Circuits (SOICs) Zilog offers the following small outline integrated circuits (SOICs): * * * * 8-lead (Figure 35) 18-lead (Figure 36 on page 32) 20-lead (Figure 37 on page 33) 28-lead (Figure 38 on page 34) Figure 35. 8-Lead Small Outline Integrated Circuit PS007226-0408 Small Outline Integrated Circuits (SOICs) Packaging Product Specification 32 Figure 36. 18-Lead Small Outline Integrated Circuit PS007226-0408 Small Outline Integrated Circuits (SOICs) Packaging Product Specification 33 Note: For a smaller footprint, use the 20-lead SSOP package (Figure 39 on page 35). Figure 37. 20-Lead Small Outline Integrated Circuit PS007226-0408 Small Outline Integrated Circuits (SOICs) Packaging Product Specification 34 Note: For a smaller footprint, use the 28-lead SSOP package (Figure 40 on page 36) instead. Figure 38. 28-Lead Small Outline Integrated Circuit PS007226-0408 Small Outline Integrated Circuits (SOICs) Packaging Product Specification 35 Shrink Small Outline Packages (SSOPs) Zilog offers the following shrink small outline packages (SSOPs): * * * 20-lead (Figure 39) 28-lead (Figure 40 on page 36) 48-lead (Figure 41 on page 37) Figure 39. 20-Lead Shrink Small Outline Package PS007226-0408 Shrink Small Outline Packages (SSOPs) Packaging Product Specification 36 Figure 40. 28-Lead Shrink Small Outline Package PS007226-0408 Shrink Small Outline Packages (SSOPs) Packaging Product Specification 37 Figure 41. 48-Lead Shrink Small Outline Package PS007226-0408 Shrink Small Outline Packages (SSOPs) Packaging Product Specification 38 Low-Profile Ball Grid Arrays (LBGAs) Zilog offers the following low-profile ball grid arrays (LBGAs): * * * 144-lead (Figure 42) 196-lead (Figure 43 on page 39) 256-lead (Figure 44 on page 40) TOP VIEW 0.36 O0.40 or O0.46 TYP 13.00 0.65-0.75 C 1.00 A1 BALL PAD CORNER 1.20-1.50 12 11 10 9 8 7 6 5 4 3 2 1 A B C D E F G H J K L M 1.00 REF 13.00 SEATING PLANE A1 BALL PAD CORNER BOTTOM VIEW 1.00 REF ALL DIMENSIONS ARE IN MM. TOLERANCE : 0.05 BALL COPLA - MAX 0.12 mm 1.00 144 SOLDER BALLS Figure 42. 144-Lead Low-Profile Ball Grid Array PS007226-0408 Low-Profile Ball Grid Arrays (LBGAs) Packaging Product Specification 39 Figure 43. 196-Lead Low-Profile Ball Grid Array (15 x 15 mm, 1.0 mm pitch) PS007226-0408 Low-Profile Ball Grid Arrays (LBGAs) Packaging Product Specification 40 Figure 44. 256-Lead Low-Profile Ball Grid Array (17 x 17 mm, 1.0 mm pitch) PS007226-0408 Low-Profile Ball Grid Arrays (LBGAs) Packaging Product Specification 41 Transceiver Packages Zilog offers the following transceiver packages: * * * * * * ZHX1203 (Figure 45 on page 42) ZHX1223TB (Figure 46 on page 43) ZHX1403 (Figure 47 on page 44) ZHX1423 (Figure 48 on page 45) ZHX1810 (Figure 49 on page 46 and Figure 50 on page 47) ZHX1820 (Figure 51 on page 48 and Figure 52 on page 49) Lead Type, Carrier Tape Size, and Reel Quantity The following table describes the carrier tape size and reel quantity for the transceiver packages. Lead Type Carrier Tape Size (mm) Reel Quantity ZHX1010 16 2000 ZHX1010-01 24 500 ZHX1403/1203 16 3500 ZHX1810/Z8HX1820 16 2000 16 2000 16 2500 ZHX1223/1423 PS007226-0408 Transceiver Packages Packaging Product Specification 42 Quantity: 3500 pieces per reel Figure 45. ZHX1203 Transceiver PS007226-0408 Transceiver Packages Packaging Product Specification 43 ZHX1223 Figure 46. ZHX1223 Mechanical Specification PS007226-0408 Transceiver Packages Packaging Product Specification 44 Quantity: 3500 pieces per reel Figure 47. ZHX1403 Transceiver PS007226-0408 Transceiver Packages Packaging Product Specification 45 Quantity: 2500 pieces per reel Figure 48. ZHX1423 Transceiver To achieve the lowest possible costs and lead times, Zilog(R) maintains multiple assembly facilities. Figure 49 and Figure 50 on page 47 display the mechanical drawings for the ZHX1810 transceivers. These devices, which display the minor mechanical differences, are functionally equivalent in every way and meet all Zilog and IrDA standards and specifications. All ZHX1810 devices use the identical solder pad layout. Although reels are never mixed, Zilog reserves the right to ship from either facility in order to meet the delivery requirements. When designing an IrDA subsystem, you must allow mechanical clearance for all versions of the IrDA transceiver. PS007226-0408 Transceiver Packages Packaging Product Specification 46 Quantity: 2000 pieces per reel Figure 49. ZHX1810 Transceiver PS007226-0408 Transceiver Packages Packaging Product Specification 47 Quantity: 2000 pieces per reel Figure 50. Alternate ZHX1810 Transceiver PS007226-0408 Transceiver Packages Packaging Product Specification 48 Quantity: 2000 units per reel. For more information, refer to Taping and Packing of IrDA Devices (MAC8000). Figure 51. ZHX1820 Transceiver PS007226-0408 Transceiver Packages Packaging Product Specification 49 Units: mm Tolerance: +/- 0.2 0.8 9.0 (ref.) Emitting Center TX RX Receiving Center Note that this style has a larger emitter lens than receive lens 0.475 2.75 1.35 1.475 1.8 0.7 3 3.1 3.3 3. 65 (5) (3) (2) (1) (3.875) P1.550.1x5=7.750.1 PIN FUNCTION PIN FUNCTION 1 LEDA 4 SD 2 TXD 5 VCC 3 GND RXD 6 CONTACTS VIEW This style does not have side solder vias (4) 3.875 SIDE VIEW LENS VIEW (6) 4.325 Mounting Center 0.75 0.80 0.45 0.70 1.55 0.45 Top Look Solder Pad layout Figure 52. Alternate ZHX1820 Transceiver PS007226-0408 Transceiver Packages Packaging Product Specification 50 Preferred Package Migration Zilog offers the following migration packages: * * * * 18-/20-lead (Figure 53) 28-lead (Figure 54 on page 51) 40-/44-/48-lead (Figure 55 on page 51) 100-/144-lead (Figure 56 on page 52) 20PDIP FP: 200 mm FP: 180mm FP: 132mm ARROW - PREFERRED MIGRATION FP: 56.2mm FP: 25mm Figure 53. 18-/20-Lead Migration PS007226-0408 Preferred Package Migration Packaging Product Specification 51 Figure 54. 28-Lead Migration ARROW - PREFERRED MIGRATION FPFP- Footprint 40 PDIP FP: ~810sq mm 44L PLCC 44 LQFP FP ~307 sq mm FP~144 sq mm 48L SSOP 44 QFN FP ~ 165 sq mm FP~ 49 sq mm Figure 55. 40-/44-/48-Lead Migration PS007226-0408 Preferred Package Migration Packaging Product Specification 52 ARROW - PREFERRED MIGRATION 144 28x28 QFP FP: 973mm FP: 484mm FP: 169mm FP: 428mm FP: 256mm FP: 121mm FP - FOOTPRINT Figure 56. 100-/144-Lead Migration PS007226-0408 Preferred Package Migration Packaging Product Specification 53 Change Log The following change notices are incorporated in this document: PS007226-0408 Date Control Number Drawing Number 04/09/08 21011 MKT71C1150-00 Rev. Obs 06/15/07 20985 MKT71C1178-00 Rev. D MKT71C1156-00 Rev. I MKT71C1164-00 Rev. G MKT71C1154-00 Rev. H 06/15/07 20984 MKT71C1168-00 Rev. F MKT71C1190-00 Rev. B MKT71C1202-00 Rev. B MKT71C1182-00 Rev. D MKT71C1176-00 Rev. D MKT71C1159-00 Rev. I MKT71C1173-00 Rev. D 06/15/07 20980 MKT71C1180-00 Rev. C 02/20/07 20976 MKT71C1167-00 Rev. H 01/29/07 20972 MKT71C1000-00 12/05/06 20961 MKT71C1200-00 08/29/06 20911 MKT71C0002-00 Rev. I 08/29/06 20935 MKT71C1177-00 Rev. D 08/29/06 20923 MKT71C1200-00 Rev. B 08/29/06 20937 MKT71C1203-00 Rev. C 10/31/05 20859 MKT71C1206-00 Rev. A 10/31/05 20874 MKT71C0005-00 Rev. M 9/9/05 20856 MKT71C1203-00 Rev. B 9/9/05 20856 MKT71C1204-00 Rev. C 9/9/05 20856 MKT71C1205-00 Rev. C 9/12/05 20809 MKT71C1204-00 Rev. A 9/12/05 20809 MKT71C1205-00 Rev. A 9/12/05 20809 MKT71C1194-00 Rev. OBS 9/12/05 20809 MKT71C1199-00 Rev. OBS 2/2/05 20773 MKT71C1198-00 Rev. A Change Log Packaging Product Specification 54 PS007226-0408 Date Control Number Drawing Number 2/2/05 20787 MKT71C1200-00 Rev. A MKT71C1201-00 Rev. A 2/2/05 20797 MKT71C1202-00 Rev. A 8/16/04 20720 MKT71C1194-00 Rev. A 6/9/04 20712 N/A 6/9/04 20721 MKT71C1160-00 Rev. OBS MKT71C1169-00 Rev. OBS MKT71C1174-00 Rev. OBS MKT71C1175-00 Rev. OBS MKT71C1183-00 Rev. OBS MKT71C1186-00 Rev. OBS MKT71C1188-00 Rev. OBS MKT71C1191-00 Rev. OBS 11/12/03 N/A MKT71C1192-00 Rev. OBS MKT71C1187-00 Rev. OBS MKT71C1193-00 Rev. C 9/8/03 N/A MKT71C0004-00 Rev. M 6/9/03 N/A MKT71C1189-00 Rev. OBS MKT71C1193-00 Rev. B 8/23/02 N/A MKT71C0719-00 Rev. E 5/16/02 N/A MKT71C0006-00 Rev. H MKT71C1151-00 Rev. L 5/15/02 N/A MKT71C1001-00 Rev. M MKT71C1153-00 Rev. N MKT71C1164-00 Rev. E MKT71C1192-00 Rev. A MKT71C1193-00 Rev. A Change Log Packaging Product Specification 55 PS007226-0408 Date Control Number Drawing Number 5/14/02 N/A MKT71C0101-00 Rev. OBS MKT71C0110-00 Rev. OBS MKT71C0115-00 Rev. OBS MKT71C0116-00 Rev. OBS MKT71C0119-00 Rev. OBS MKT71C0123-00 Rev. OBS MKT71C0124-00 Rev. OBS MKT71C0130-00 Rev. OBS MKT71C0133-00 Rev. OBS MKT71C0181-00 Rev. OBS MKT71C0183-00 Rev. OBS MKT71C0184-00 Rev. OBS MKT71C0185-00 Rev. OBS MKT71C0196-00 Rev. OBS MKT71C0199-00 Rev. OBS MKT71C0803-00 Rev. OBS MKT71C0804-00 Rev. OBS MKT71C0805-00 Rev. OBS MKT71C0806-00 Rev. OBS MKT71C0807-00 Rev. OBS 1/26/01 52951 MKT71C1187-00 1/26/01 52958 MKT71C1159-00 MKT71C1167-00 MKT71C1173-00 MKT71C1176-00 MKT71C1182-00 MKT71C1186-00 12/5/00 52855 MKT71C1191-00 10/25/00 52592 MKT71C1187-00 10/25/00 52667 MKT71C1153-00 8/24/00 51671 MKT71C1188-00 8/24/00 51989 MKT71C1190-00 8/24/00 51672 MKT71C1189-00 8/23/00 19026 MKT71C0002-00 8/23/00 16970 MKT71C1172-00 8/22/00 51015 MKT71C1177-00 Change Log Packaging Product Specification 56 Customer Support For answers to technical questions about the product, documentation, or any other issues with Zilog's offerings, please visit Zilog's Knowledge Base at http://www.zilog.com/kb. For any comments, detail technical questions, or reporting problems, please visit Zilog's Technical Support at http://support.zilog.com. PS007226-0408 Customer Support