LM2766 www.ti.com SNVS071B - MARCH 2000 - REVISED MAY 2013 LM2766 Switched Capacitor Voltage Converter Check for Samples: LM2766 FEATURES DESCRIPTION * * * * * The LM2766 CMOS charge-pump voltage converter operates as a voltage doubler for an input voltage in the range of +1.8V to +5.5V. Two low cost capacitors and a diode are used in this circuit to provide up to 20 mA of output current. 1 2 Doubles Input Supply Voltage SOT-23 6-Pin Package 20 Typical Output Impedance 90% Typical Conversion Efficiency at 20 mA 0.1A Typical Shutdown Current APPLICATIONS * * * * * * Cellular Phones Pagers PDAs Operational Amplifier Power Supplies Interface Power Supplies Handheld Instruments The LM2766 operates at 200 kHz switching frequency to reduce output resistance and voltage ripple. With an operating current of only 350 A (operating efficiency greater than 90% with most loads) and 0.1A typical shutdown current, the LM2766 provides ideal performance for battery powered systems. The device is manufactured in a SOT-23 6-pin package. Basic Application Circuits Figure 1. Voltage Doubler Connection Diagram 1 6 2 5 3 4 Figure 2. DBV Package Top View Figure 3. Actual Size 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 2000-2013, Texas Instruments Incorporated LM2766 SNVS071B - MARCH 2000 - REVISED MAY 2013 www.ti.com Pin Description Pin Name Function 1 V+ 2 GND Power supply positive voltage input. Power supply ground input. 3 CAP- Connect this pin to the negative terminal of the charge-pump capacitor. 4 SD 5 VOUT Shutdown control pin, tie this pin to V+ in normal operation. Positive voltage output. 6 CAP+ Connect this pin to the positive terminal of the charge-pump capacitor. These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) Supply Voltage (V+ to GND, or V+ to VOUT) 5.8V (GND - 0.3V) to (V+ + 0.3V) SD VOUT Continuous Output Current Output Short-Circuit Duration to GND 40 mA (3) 1 sec. Continuous Power Dissipation (TA = 25C) (4) 600 mW TJMax (4) (1) (2) (3) (4) 150C Absolute maximum ratings indicate limits beyond which damage to the device may occur. Electrical specifications do not apply when operating the device beyond its rated operating conditions. If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications. VOUT may be shorted to GND for one second without damage. However, shorting VOUT to V+ may damage the device and should be avoided. Also, for temperatures above 85C, VOUT must not be shorted to GND or V+, or device may be damaged. The maximum allowable power dissipation is calculated by using PDMax = (TJMax - TA)/JA, where TJMax is the maximum junction temperature, TA is the ambient temperature, and JA is the junction-to-ambient thermal resistance of the specified package. Operating Ratings JA (1) 210C/W -40 to 100C Junction Temperature Range Ambient Temperature Range -40 to 85C Storage Temperature Range -65C to 150C Lead Temp. (Soldering, 10 seconds) ESD Rating (2) (1) (2) 2 240C Human body model 2kV Machine model 200V The maximum allowable power dissipation is calculated by using PDMax = (TJMax - TA)/JA, where TJMax is the maximum junction temperature, TA is the ambient temperature, and JA is the junction-to-ambient thermal resistance of the specified package. The human body model is a 100pF capacitor discharged through a 1.5k resistor into each pin. The machine model is a 200pF capacitor discharged directly into each pin. Submit Documentation Feedback Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: LM2766 LM2766 www.ti.com SNVS071B - MARCH 2000 - REVISED MAY 2013 Electrical Characteristics Limits in standard typeface are for TJ = 25C, and limits in boldface type apply over the full operating temperature range. Unless otherwise specified: V+ = 5V, C1 = C2 = 1.0 F. (1) Symbol Parameter V+ Supply Voltage IQ Supply Current ISD Shutdown Supply Current Condition Min No Load TA = 85C VSD Shutdown Pin Input Voltage Typ Max Units 5.5 V 350 950 A 0.1 0.5 1.8 Shutdown Mode 0.2 0.6 Normal Operation IL Output Current 2.0 2.5V VIN 5.5V 20 1.8V VIN < 2.5V 10 A V mA ROUT Output Resistance (2) IL = 20 mA 20 55 fOSC Oscillator Frequency See (3) 220 400 700 kHz fSW Switching Frequency See (3) 110 200 350 kHz PEFF Power Efficiency IL = 20 mA to GND VOEFF Voltage Conversion Efficiency No Load (1) (2) (3) 94 % 99.96 % In the test circuit, capacitors C1 and C2 are 1.0 F, 0.3 maximum ESR capacitors. Capacitors with higher ESR will increase output resistance, reduce output voltage and efficiency. Specified output resistance includes internal switch resistance and capacitor ESR. See the details in the application information for positive voltage doubler. The output switches operate at one half of the oscillator frequency, fOSC = 2fSW. Test Circuit Figure 4. LM2766 Test Circuit Submit Documentation Feedback Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: LM2766 3 LM2766 SNVS071B - MARCH 2000 - REVISED MAY 2013 www.ti.com Typical Performance Characteristics (Circuit of Figure 4, VIN = 5V, TA = 25C unless otherwise specified) 4 Supply Current vs Supply Voltage Output Resistance vs Capacitance Figure 5. Figure 6. Output Resistance vs Supply Voltage Output Resistance vs Temperature Figure 7. Figure 8. Output Voltage vs Load Current Efficiency vs Load Current Figure 9. Figure 10. Submit Documentation Feedback Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: LM2766 LM2766 www.ti.com SNVS071B - MARCH 2000 - REVISED MAY 2013 Typical Performance Characteristics (continued) (Circuit of Figure 4, VIN = 5V, TA = 25C unless otherwise specified) Switching Frequency vs Supply Voltage Switching Frequency vs Temperature Figure 11. Figure 12. Output Ripple vs Load Current Figure 13. Submit Documentation Feedback Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: LM2766 5 LM2766 SNVS071B - MARCH 2000 - REVISED MAY 2013 www.ti.com CIRCUIT DESCRIPTION The LM2766 contains four large CMOS switches which are switched in a sequence to double the input supply voltage. Energy transfer and storage are provided by external capacitors. Figure 14 illustrates the voltage conversion scheme. When S2 and S4 are closed, C1 charges to the supply voltage V+. During this time interval, switches S1 and S3 are open. In the next time interval, S2 and S4 are open; at the same time, S1 and S3 are closed, the sum of the input voltage V+ and the voltage across C1 gives the 2V+ output voltage when there is no load. The output voltage drop when a load is added is determined by the parasitic resistance (Rds(on) of the MOSFET switches and the ESR of the capacitors) and the charge transfer loss between capacitors. Details will be discussed in the following application information section. Figure 14. Voltage Doubling Principle POSITIVE VOLTAGE DOUBLER The main application of the LM2766 is to double the input voltage. The range of the input supply voltage is 1.8V to 5.5V. The output characteristics of this circuit can be approximated by an ideal voltage source in series with a resistance. The voltage source equals 2V+. The output resistance Rout is a function of the ON resistance of the internal MOSFET switches, the oscillator frequency, and the capacitance and ESR of C1 and C2. Since the switching current charging and discharging C1 is approximately twice as the output current, the effect of the ESR of the pumping capacitor C1 will be multiplied by four in the output resistance. The output capacitor C2 is charging and discharging at a current approximately equal to the output current, therefore, its ESR only counts once in the output resistance. A good approximation of Rout is: (1) where RSW is the sum of the ON resistance of the internal MOSFET switches shown in Figure 14. RSW is typically 8 for the LM2766. The peak-to-peak output voltage ripple is determined by the oscillator frequency as well as the capacitance and ESR of the output capacitor C2: (2) High capacitance, low ESR capacitors can reduce both the output resistance and the voltage ripple. The Schottky diode D1 is only needed to protect the device from turning-on its own parasitic diode and potentially latching-up. During start-up, D1 will also quickly charge up the output capacitor to VIN minus the diode drop thereby decreasing the start-up time. Therefore, the Schottky diode D1 should have enough current carrying capability to charge the output capacitor at start-up, as well as a low forward voltage to prevent the internal parasitic diode from turning-on. A Schottky diode like 1N5817 can be used for most applications. If the input voltage ramp is less than 10V/ms, a smaller Schottky diode like MBR0520LT1 can be used to reduce the circuit size. SHUTDOWN MODE A shutdown (SD) pin is available to disable the device and reduce the quiescent current to 0.1 A. In normal operating mode, the SD pin is connected to V+. The device can be brought into the shutdown mode by applying to the SD pin a voltage less than 20% of the V+ pin voltage. 6 Submit Documentation Feedback Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: LM2766 LM2766 www.ti.com SNVS071B - MARCH 2000 - REVISED MAY 2013 CAPACITOR SELECTION As discussed in the Positive Voltage Doubler section, the output resistance and ripple voltage are dependent on the capacitance and ESR values of the external capacitors. The output voltage drop is the load current times the output resistance, and the power efficiency is (3) Where IQ(V+) is the quiescent power loss of the IC device, and IL2Rout is the conversion loss associated with the switch on-resistance, the two external capacitors and their ESRs. The selection of capacitors is based on the specifications of the dropout voltage (which equals Iout Rout), the output voltage ripple, and the converter efficiency. Low ESR capacitors (Table 1) are recommended to maximize efficiency, reduce the output voltage drop and voltage ripple. Table 1. Low ESR Capacitor Manufacturers Phone Website Nichicon Corp. Manufacturer (847)-843-7500 www.nichicon.com PL & PF series, through-hole aluminum electrolytic Capacitor Type AVX Corp. (843)-448-9411 www.avxcorp.com TPS series, surface-mount tantalum Sprague (207)-324-4140 www.vishay.com 593D, 594D, 595D series, surface-mount tantalum Sanyo (619)-661-6835 www.sanyovideo.com OS-CON series, through-hole aluminum electrolytic Murata (800)-831-9172 www.murata.com Ceramic chip capacitors Taiyo Yuden (800)-348-2496 www.t-yuden.com Ceramic chip capacitors Tokin (408)-432-8020 www.tokin.com Ceramic chip capacitors Other Applications PARALLELING DEVICES Any number of LM2766s can be paralleled to reduce the output resistance. Each device must have its own pumping capacitor C1, while only one output capacitor Cout is needed as shown in Figure 15. The composite output resistance is: (4) Figure 15. Lowering Output Resistance by Paralleling Devices Submit Documentation Feedback Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: LM2766 7 LM2766 SNVS071B - MARCH 2000 - REVISED MAY 2013 www.ti.com CASCADING DEVICES Cascading the LM2766s is an easy way to produce a greater voltage (A two-stage cascade circuit is shown in Figure 16). The effective output resistance is equal to the weighted sum of each individual device: Rout = 1.5Rout_1 + Rout_2 (5) Note that increasing the number of cascading stages is pracitically limited since it significantly reduces the efficiency, increases the output resistance and output voltage ripple. Figure 16. Increasing Output Voltage by Cascading Devices REGULATING VOUT It is possible to regulate the output of the LM2766 by use of a low dropout regulator (such as LP2980-5.0). The whole converter is depicted in Figure 17 A different output voltage is possible by use of LP2980-3.3, LP2980-3.0, or LP2980-adj. Note that the following conditions must be satisfied simultaneously for worst case design: 2Vin_min >Vout_min +Vdrop_max (LP2980) + Iout_max x Rout_max (LM2766) 2Vin_max < Vout_max +Vdrop_min (LP2980) + Iout_min x Rout_min (LM2766) (6) (7) Figure 17. Generate a Regulated +5V from +3V Input Voltage 8 Submit Documentation Feedback Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: LM2766 LM2766 www.ti.com SNVS071B - MARCH 2000 - REVISED MAY 2013 REVISION HISTORY Changes from Revision A (May 2013) to Revision B * Page Changed layout of National Data Sheet to TI format ............................................................................................................ 8 Submit Documentation Feedback Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: LM2766 9 PACKAGE OPTION ADDENDUM www.ti.com 1-Nov-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) LM2766M6 NRND SOT-23 DBV 6 1000 TBD Call TI Call TI -40 to 85 S16B LM2766M6/NOPB ACTIVE SOT-23 DBV 6 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 S16B LM2766M6X/NOPB ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 S16B (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 1-Nov-2013 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) LM2766M6 SOT-23 DBV 6 1000 178.0 8.4 LM2766M6/NOPB SOT-23 DBV 6 1000 178.0 LM2766M6X/NOPB SOT-23 DBV 6 3000 178.0 3.2 3.2 1.4 4.0 8.0 Q3 8.4 3.2 3.2 1.4 4.0 8.0 Q3 8.4 3.2 3.2 1.4 4.0 8.0 Q3 Pack Materials-Page 1 W Pin1 (mm) Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM2766M6 SOT-23 DBV 6 1000 210.0 185.0 35.0 LM2766M6/NOPB SOT-23 DBV 6 1000 210.0 185.0 35.0 LM2766M6X/NOPB SOT-23 DBV 6 3000 210.0 185.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as "components") are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI's terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers' products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers' products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI's goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or "enhanced plastic" are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP(R) Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2013, Texas Instruments Incorporated