RFSW2040D RFSW2040D DC to 25GHz GaAs SPST Switch DC TO 25GHz GaAs SPST SWITCH Package: Die, 1.91mm x 1.11mm x 0.10mm Product Description Features RFMD's RFSW2040D is an absorptive SPST GaAs microwave monolithic integrated circuit (MMIC) switch designed using the RFMD FD05 0.5m switch process. The RFSW2040D is developed for broadband communications, instrumentation, and electronic warfare. Optimum Technology Matching(R) Applied RFin RFout Applications GaAs HBT GaAs MESFET InGaP HBT SiGe BiCMOS 50O Si BiCMOS SiGe HBT RFSW2040D GaAs pHEMT Low Insertion Loss: 1.0dB at 20GHz High Isolation: 50dB at 20GHz Excellent Return Loss 21nS Switching Speed GaAs pHEMT Technology V2 V1 Si CMOS Broadband Communications Test Instrumentation Fiber Optics Military Aerospace Si BJT GaN HEMT InP HBT RF MEMS LDMOS Parameter Operating Frequency Insertion Loss (0GHz to 5GHz) Insertion Loss (5GHz to 10GHz) Insertion Loss (10GHz to 15GHz) Insertion Loss (15GHz to 20GHz) Insertion Loss (20GHz to 25GHz) Isolation (DC to 25GHz) Input Return Loss (DC to 25GHz) Output Return Loss (DC to 25GHz) IIP3 IIP2 Switching Speed Control Current Control Voltage Min. Specification Typ. DC 36 13 11 3 42 76 -3 0.5 0.7 0.8 1.0 1.2 43 17 22 7 46 83 21 8 -5 Max. 25 0.8 1.0 1.3 1.7 28 25 -8 Unit GHz dB dB dB dB dB dB dB dB dB dBm dBm ns uA VDC Condition ON State ON State ON State ON State ON State OFF State ON State ON State OFF State 100MHz spacing 2dBm input 100MHz spacing 2dBm input 50% control to 90% RF Sum of all control lines RF MICRO DEVICES(R), RFMD(R), Optimum Technology Matching(R), Enabling Wireless ConnectivityTM, PowerStar(R), POLARISTM TOTAL RADIOTM and UltimateBlueTM are trademarks of RFMD, LLC. BLUETOOTH is a trademark owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RFMD. All other trade names, trademarks and registered trademarks are the property of their respective owners. (c)2006, RF Micro Devices, Inc. DS130208 7628 Thorndike Road, Greensboro, NC 27409-9421 * For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. 1 of 8 RFSW2040D Absolute Maximum Ratings Rating Unit Drain Bias Voltage (VCTRL) Parameter -10 VDC RF Input Port Power (Any State) +30 dBm RF Output Port Power (ON State only) +30 dBm RF Output Port Power (OFF State only) +21 dBm Storage Temperature -40 to +150 C Operating Temperature -40 to +85 C ESD JESD22-A114 Human Body Model (HBM) Class 1A (All Pads) Caution! ESD sensitive device. Exceeding any one or a combination of the Absolute Maximum Rating conditions may cause permanent damage to the device. Extended application of Absolute Maximum Rating conditions to the device may reduce device reliability. Specified typical performance or functional operation of the device under Absolute Maximum Rating conditions is not implied. The information in this publication is believed to be accurate and reliable. However, no responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any infringement of patents, or other rights of third parties, resulting from its use. No license is granted by implication or otherwise under any patent or patent rights of RFMD. RFMD reserves the right to change component circuitry, recommended application circuitry and specifications at any time without prior notice. RFMD Green: RoHS compliant per EU Directive 2002/95/EC, halogen free per IEC 61249-2-21, < 1000ppm each of antimony trioxide in polymeric materials and red phosphorus as a flame retardant, and <2% antimony in solder. Typical Electrical Performance 2 of 8 7628 Thorndike Road, Greensboro, NC 27409-9421 * For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. DS130208 RFSW2040D DS130204 7628 Thorndike Road, Greensboro, NC 27409-9421 * For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. 3 of 8 RFSW2040D 4 of 8 7628 Thorndike Road, Greensboro, NC 27409-9421 * For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. DS130208 RFSW2040D DS130204 7628 Thorndike Road, Greensboro, NC 27409-9421 * For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. 5 of 8 RFSW2040D Die Layout GND RFin RFout GND GND V2 155 V1 440 590 740 GND 590 440 1110 740 98 862 1067 1815 1910 DC and GND bondpads are 88x88um. RF bondpads are 88x150um. All units are in um. 6 of 8 7628 Thorndike Road, Greensboro, NC 27409-9421 * For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. DS130208 RFSW2040D Pin Names and Description Pin 1 Name RFIN 2 RFOUT Description Interface Schematic RF input. This pad is DC coupled and matched to 50 from DC to 20GHz. 50 microstrip transmission line on 0.127mm (5mil) thick alumina thin film substrate is recommended. RFIN RF output. This pad is DC coupled and matched to 50 from DC to 20GHz. 50 microstrip transmission line on 0.127mm (5mil) thich alumina thing film substrate is recommended. RFOUT 50 3, 4 V1, V2 DC control pad for switch operation. Nominal operating voltage is -5V. 2 k 5.8 pF VCTRL 5 GND Provides ground path for probe measurements. Truth Table Control Line V1 RF Path V2 RFIN - RF OUT High Low ON (Low Loss) Low High OFF (High Isolation) High = -3V to -8V (-5V nominal), Low = 0, 0.2V Measurement Technique All specifications and typical performances reported in this document were based on data taken with the equipment listed in the stated manner. Data was taken using a temperature controlled probe station utilizing 150um pitch GSG probes. The probes were placed on a ceramic coplanar to microstrip launch. The launch was then wire bonded to the die using two 1 mil bondwires. The spacing between the launch and the die was 200um, and the bondwire loop height was 100um. the thickness of the test interface was 125um (5mil). The calibration included the probes and test interfaces, so that the measurement reference plane was at the point of bondwire attachment. Therefore, all data represents the part and accompanying bondwires. Insertion Loss, Return Loss, and Isolation data were taken using an Agilent E8363B PNA. IIP3 and IIP2 data were taken utilizing a pair of Agilent E8257D signal generators and an Agilent E4446A PSA. DS130204 7628 Thorndike Road, Greensboro, NC 27409-9421 * For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. 7 of 8 RFSW2040D Preferred Assembly Instructions GaAs devices are fragile and should be handled with great care. Specially designed collets should be used where possible. The back of the die is metallized and the recommended mounting method is by the use of conductive epoxy. Epoxy should be applied to the attachment surface uniformly and sparingly to avoid encroachment of epoxy onto the top face of the die. Ideally it should not exceed half the chip height. For automated dispense Ablestick LMISR4 is recommended and for manual dispense Ablestick 84-1 LMI or 84-1 LMIT are recommended. These should be cured at a temperature of 150C for one hour in an oven especially set aside for epoxy curing only. If possible the curing oven should be flushed with dry nitrogen. The gold-tin (80% Au 20% Sn) eutectic die attach has a melting point of approximately 280C but the absolute temperature being used depends on the leadframe material used and the particular application. The time at maximum temperature should be kept to a minimum. This part has gold (Au) bond pads requiring the use of gold (99.99% pure) bondwire. It is recommended that 25.4um diameter gold wire be used. Recommended lead bond technique is thermocompression wedge bonding with 0.001" (25m) diameter wire. Bond force, time stage temperature, and ultrasonics are all critical parameters and the settings are dependent on the setup and application being used. Ultrasonic or thermosonic bonding is not recommended. Bonds should be made from the die first and then to the mounting substrate or package. The physical length of the bondwires should be minimized especially when making RF or ground connections. Handling Precautions To avoid damage to the devices, care should be exercised during handling. Proper Electrostatic Discharge (ESD) precautions should be observed at all stages of storage, handling, assembly, and testing. ESD/MSL Rating These devices should be treated as Class 1A (250V to 500V) using the human body model as defined in JEDEC Standard No. 22-A114. Further information on ESD control measures can be found in MIL-STD-1686 and MIL-HDBK-263. This is an unpackaged part and therefore no MSL rating applies. Ordering Information 8 of 8 Part Number Description Delivery Method RFSW2040DS2 Sample, DC to 25GHz GaAs SPST Switch Waffle Pack 2 pc RFSW2040DSB Sample, DC to 25GHz GaAs SPST Switch Waffle Pack 5 pc RFSW2040DSQ Small Quantity, DC to 25GHz GaAs SPDT Switch Waffle Pack 25 pc RFSW2040D DC to 25GHz GaAs SPDT Switch Waffle Pack 100 pc 7628 Thorndike Road, Greensboro, NC 27409-9421 * For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. Quantity DS130208