Product
Specification – January 9, 2015 V.11
DATA SHEET
SURFACE-MOUNT CERAMIC
MULTILAYER CAPACITOR
S
Hi Q Series
Class 1,
NP0
16 V TO 250
V
0.2 pF to 100
pF
RoHS compliant & Halogen Free
Jan. 9, 2015 V. 11
Surface-Moun t Ce r amic M u ltilayer Cap acitor s
Product spe c ific ation
HiQ
16 V to 250 V
NP0
2
12
S
COPE
This specification describes
NP0
series
chip capacitors with lead-
free terminations.
APPLICATIONS
Consumer electronics for
example
- Tuners
- Television receivers
- All types of cameras
Telecommunications
Data processing
FEATURES
Supplied in tape on reel
Nickel-barrier end termination
RoHS compliant
Halogen Free compliant
ORDERING INFORMATIO
N - GLOBAL PART NUMBER, PHYCOMP CTC &
12NC
All part numbers a
re identified by the series, size, tolerance, TC material,
packing style, voltage, process code, termination and capacitance value.
Y
YA
AG
GE
EO
O/
/
P
PH
HY
YC
CO
OM
MP
P
B
BR
RA
AN
ND
D
o
or
rd
de
er
ri
in
ng
g
c
co
od
de
e
GLOBAL PART NUMBER (PREFERRED)
CQ
XXXX X X
NPO
X
BN
XXX
(1) (2) (3) (4) (5)
(
1) SIZE – INCH BASED (METRIC)
0201 (0603)
0402 (1005)
0603 (1608)
0805 (2012)
(
2) TOLERANCE
0.2pF to 2.0pF
A = ±0.05 pF
B = ±0.1 pF
C = ±0.25 pF
2.1pF to 4.9pF
A = ±0.05 pF (by request)
B = ±0.1 pF
C = ±0.25 pF
D = ±0.5 pF
5.0pF to 9.9pF
B = ±0.1 pF
C = ±0.25 pF
D = ±0.5 pF
10pF and over
F = ±1%
G = ±2%
J = ±5%
(
3) PACKING STYLE
R = Paper/PE taping reel; Reel 7 inch
P = Paper/PE taping reel; Reel 13 inch
(
4) RATED VOLTAGE
7 = 16 V 0=100V
8 = 25 V A=200V
9 = 50 V Y=250V
(
5) CAPACITANCE VALUE
2 significant digits + number of zeros
The 3rd digit signifies the multiplying factor, and letter R is decimal point
Example: 121 = 12 x 101 = 120 pF
Jan. 9, 2015 V. 11
Surface-Moun t Ce r amic M u ltilayer Cap acitor s
Product spe c ific ation
HiQ
16 V to 250 V
NP0
3
12
CONSTRUCTION
The capacitor consists of a
rectangular block of c
eramic
dielectric in which a number of
interleaved metal electrodes are
contained. This structure gives
rise to a high capacitance per
unit volume.
The inner electrodes are
connected to the two end
terminations and finally covered
with a layer of plated ti
n (NiSn).
The terminations are lead
-
free. A
cross section of the structure is
shown in Fig.1.
MLB457
terminations
electrodes
ceramic material
Fi g. 1 Surface mounted multilayer ceramic capacitor construction
TYPE
L
1 (mm)
W
(mm) T (MM)
L2
/ L
3
(mm) L
4
(mm)
min.
max. min.
0201
0.6 ±0.03
0.3 ±0.03
Refer to
table 2 to 5
0.10
0.20
0.20
0402
1.0
±0.05
0.5
±0.05
0.20
0.30 0.40
0603
1.6
±0.10
0.8 ±0.10
0.20
0.60 0.40
0805
2.0
±0.20
1.25
±0.20
0.25
0.75 0.55
Ta b le 1 For outlines see fig. 2
DIMENSION
O
O
U
UT
TL
LI
IN
NE
ES
S
For dimension see Table 1
Fi g. 2 Surface mounted multilayer
ceramic capacitor dimension
Jan. 9, 2015 V. 11
Surface-Moun t Ce r amic M u ltilayer Cap acitor s
Product spe c ific ation
HiQ
16 V to 250 V
NP0
4
12
CAPACITANCE RANGE &
THICKNESS FOR NP0
Ta b le 2 Sizes from 0201 to 0402
CAP.
0201
0402
CAP.
0201
0402
25 V
50 V
25 V
50 V
0.2 pF
0.3±0.03
0.5±0.05
2.6 pF
0.3±0.03
0.5±0.05
0.3 pF
2.7 pF
0.4 pF
2.8 pF
0.5 pF
2.9 pF
0.6 pF
3.0 pF
0.7 pF
3.1 pF
0.8 pF
3.2 pF
0.9 pF
3.3 pF
1.0 pF
3.4 pF
1.1 pF
3.5 pF
1.2 pF
3.6 pF
1.3 pF
3.7 pF
1.4 pF
3.8 pF
1.5 pF
3.9 pF
1.6 pF
4.0 pF
1.7 pF
4.1 pF
1.8 pF
4.2 pF
1.9 pF
4.3 pF
2.0 pF
4.4 pF
2.1 pF
4.5 pF
2.2 pF
4.6 pF
2.3 pF
4.7 pF
2.4 pF
4.8 pF
2.5 pF
4.9 pF
Tape width
8mm 5.0 pF
Tape width
8mm
NOTE
1. Values in shaded cells indicate thickness class in mm
Jan. 9, 2015 V. 11
Surface-Moun t Ce r amic M u ltilayer Cap acitor s
Product spe c ific ation
HiQ
16 V to 250 V
NP0
5
12
CAPACITANCE RANGE &
THICKNESS FOR NP0
Ta b le 3 Sizes from 0201 to 0402
CAP. 0201
0402
CAP.
0201
0402
25 V 50 V
25 V
50 V
5.1 pF
0.3±0.03
0.5±0.05
7.8 pF
0.3±0.03
0.5±0.05
5.2 pF 7.9 pF
5.3 pF 8.0 pF
5.4 pF 8.1 pF
5.5 pF 8.2 pF
5.6 pF 8.3 pF
5.7 pF 8.4 pF
5.8 pF 8.5 pF
5.9 pF 8.6 pF
6.0 pF 8.7 pF
6.1 pF 8.8 pF
6.2 pF 8.9 pF
6.3 pF 9.0 pF
6.4 pF 9.1 pF
6.5 pF 9.2 pF
6.6 pF 9.3 pF
6.7 pF 9.4 pF
6.8 pF 9.5 pF
6.9 pF 9.6 pF
7.0 pF 9.7 pF
7.1 pF 9.8 pF
7.2 pF 9.9 pF
7.3 pF 10 pF
7.4 pF 12 pF
7.5 pF 15 pF
7.6 pF 18 pF
7.7 pF 22 pF
Tape width 8mm 27 pF
33 pF
Tape width
8mm
NOTE
2. Values in shaded cells indicate thickness class in mm
Jan. 9, 2015 V. 11
Surface-Moun t Ce r amic M u ltilayer Cap acitor s
Product spe c ific ation
HiQ
16 V to 250 V
NP0
6
12
Ta b le 4 Sizes from 0603 to 0805
CAP.
0603
0805
25 V
50 V 100V
200V 250V
25 V
50 V 100V
200V 250V
0.22 pF
0.8±0.1
0.8±0.1 0.8±0.1
0.8±0.1 0.8±0.1
0.6±0.1
0.6±0.1 0.6±0.1
0.6±0.1 0.6±0.1
0.47 pF
0.56 pF
0.68 pF
0.82 pF
1.0 pF
1.2 pF
1.5 pF
1.8 pF
2.2 pF
2.7 pF
3.3 pF
3.9 pF
4.7 pF
5.6 pF
6.8 pF
8.2 pF
10 pF
12 pF
15 pF
18 pF
22 pF
27 pF
33 pF
39 pF
47 pF
56 pF
68 pF
82 pF
100 pF
Tape width
8mm
NOTE
1. Values in shaded cells indicate thickness class in mm
CAPACITANCE RANGE &
THICKNESS FOR NP0
Jan. 9, 2015 V. 11
Surface-Moun t Ce r amic M u ltilayer Cap acitor s
Product spe c ific ation
HiQ
16 V to 250 V
NP0
7
12
Table 5
THICKNESS CLASSES AN
D PACKING QUANTITY
SIZE
CODE
THICKNESS
CLASSIFICATION
TAPE WIDTH
QUANTITY PER REEL
Ø180 MM / 7 INCH
Ø330 MM / 13 INCH QUANTITY
PER BULK CASE
Paper/PE
Blister
Paper/PE
Blister
0201 0.3 ±0.03 mm 8 mm
15,000
---
50,000 --- ---
0402 0.5 ±0.05 mm 8 mm
10,000
---
50,000 --- ---
0603 0.8 ±0.1 mm 8 mm
4,000
---
15,000 --- ---
0805 0.6 ±0.1 mm 8 mm
4,000
---
20,000 --- ---
SOLDERING RECOMMENDA
TION
Ta b le 7
SOLDERING
METHOD
SIZE
0201
0402
0603 0805
Reflow
O
O
O O
Wave
---
---
O O
ELECTRICAL CHARACTER
ISTICS
N
N
P
P0
0
D
DI
IE
EL
LE
EC
CT
TR
RI
IC
C
C
CA
AP
PA
AC
CI
IT
TO
OR
RS
S;
;
N
NI
IS
SN
N
T
TE
ER
RM
MI
IN
NA
AT
TI
IO
ON
NS
S
Unless otherwise stated all e
lectrical values apply at an ambient temperature of 20±1 °C, an atmospheric
pressure of 86 to 106 kPa, and a relative humidity of 63 to 67%.
DESCRIPTION
VALUE
Capacitance range
0.2 pF to 100 pF
Capacitance tolerance
C < 10
pF ±0.05 pF, ±0.1 pF, ±0.25 pF, ±0.5 pF
C
≥ 10 pF ±2%, ±5%
Q value
C <
30 pF Q ≥ ( 400 + 20C )
C: pF
C ≥
30 pF Q ≥ 1000
Insulation resistance after 1 minute at U
r (DC) Rins ≥ 10 GΩ or Rins × Cr ≥ 500 seconds whichever is less
Maximum capacitance change as a function of temperature
(temper
ature characteristic/coefficient):
±30 ppm/°C
Operating temperature range:
–55 °C to +125 °C
Ta b le 6
Jan. 9, 2015 V. 11
Surface-Moun t Ce r amic M u ltilayer Cap acitor s
Product spe c ific ation
HiQ
16 V to 250 V
NP0
8
12
TESTS AND REQUIREMEN
TS
Ta b le 8 Test procedures and requirements
TEST
TEST METHOD PROCEDURE REQUIREMENTS
Mounting
IEC 60384-
21/22
4.3 The capacitors may be mounted on printed-circuit boards or
ceramic substrates
No visible damage
Visual
inspection
and
dimension
check
4.4 Any applicable method using × 10 magnification In accordance with
specification
Cap
acitance 4.5.1
Class 1:
f = 1 MHz for C ≤ 1 nF, measuring at voltage 1 Vrms at 20 °C
f = 1 KHz for C > 1 nF, measuring at voltage 1 Vrms at 20 °C
Within specified tolerance
Q value
4.5.2
Class 1:
f = 1 MHz for C ≤ 1 nF , measuring at voltage 1 Vrms at 20 °C
f = 1 KHz for C > 1 nF, measuring at voltage 1 Vrms at 20 °C
In accordance with
specification
Insulation
resistance
4.5.3
At Ur (DC) for 1 minute In accordance with
specification
Jan. 9, 2015 V. 11
Surface-Moun t Ce r amic M u ltilayer Cap acitor s
Product spe c ific ation
HiQ
16 V to 250 V
NP0
9
12
TEST
TEST METHOD
PROCEDURE
REQUIREMENTS
Temperature
coefficient
4.6
Capacitance shall be measured by the steps shown in the
following table.
The capacitance change should be measured after 5 min at
each specified temperature stage.
Step Temperature(℃)
a
25±2
b Lower temperature±3℃
c 25±2
d Upper Temperature±2℃
e
25±2
(1) Class I
Temperature Coefficient shall be calculated from the
formula as below
Temp, Coefficient =
6
10
T xC1 C1-C2 ×
Δ
[ppm/℃]
C1: Capacitance at step c
C2: Capacitance at 125℃
∆T: 100℃(=125℃-25℃)
(2) Class II
Capacitance Change shall be calculated from the formula
as below
∆C =
C1
C1-C2
x 100%
C1: Capacitance at step c
C2: Capacitance at step b or d
<General purpose series>
Class1:
∆ C/C: ±30ppm
Class2:
X7R: ∆ C/C: ±15%
Y5V: ∆ C/C: 22~-82%
<High Capacitance series>
Class2:
X7R/X5R: ∆ C/C: ±15%
Y5V: ∆ C/C: 22~-82%
Adhesion
4.7
A force applied for 10 seconds to the line joining the
terminations and in a plane parallel to the substrate
Force
size ≥ 0603: 5N
size = 0402: 2.5N
size = 0201: 1N
Bond
strength of
plating on end
face
4.8
Mounting in accordance with IEC 60384-22 paragraph 4.3
No visible damage
Conditions: bending 1 mm at a rate of 1 mm/s, radius jig
340 mm
<General purpose series>
∆C/C
Class 1:
NP0: within ±1% or 0.5 pF
whichever is greater
ESR
Measuring frequency: 1 ± 0.2GHz at room temperature. 0.2pF ≤ C ≤ 1pF :350m
Ω
max
1pF < C ≤ 5pF :300mΩ max
5pF < C ≤ 10pF :250mΩ max
Measuring frequency: 500 ± 50MHz at room temperature.
10pF < C ≤ 100pF :400mΩ max
Jan. 9, 2015 V. 11
Surface-Moun t Ce r amic M u ltilayer Cap acitor s
Product spe c ific ation
HiQ
16 V to 250 V
NP0
10
12
TEST
TEST METHOD
PROCEDURE
REQUIREMENTS
Resistance to
soldering heat
IEC 60384-
21/22
4.9
Precondition: 150 +0/–10 °
C for 1 hour, then keep for 24
±1 hours at room temperature
Preheating: for size ≤ 1206: 120 °C to 150 °C for 1
minute
Preheating: for size >1206: 100 °C to 120 °
C for 1 minute
and 170 °C to 200 °C for 1 minute
Solder bath temperature: 260 ±5 °C
Dipping time: 10 ±0.5 seconds
Recovery time: 24 ±2 hours
Dissolution of the end face plating
shall not exceed 25% of the length of
the edge concerned
<General purpose series>
∆C/C
Class 1:
NP0: within ±0.5% or 0.5 pF
whichever is greater
D.F. within initial specified value
Rins within initial specified value
Solderability
4.10
Preheated the temperature of 80 °C to 140 °C and
maintained for 30 seconds to 60 seconds.
Test conditions for lead containing solder alloy
Temperature: 235 ±5 °C
Dipping time: 2 ±0.2 seconds
Depth of immersion: 10 mm
Alloy Composition: 60/40 Sn/Pb
Number of immersions: 1
Test conditions for lead-free containing solder alloy
Temperature: 245 ±5 °C
Dipping time: 3 ±0.3 seconds
Depth of immersion: 10 mm
Alloy Composition: SAC305
Number of immersions: 1
The solder should cover over 95% of
the critical area of each termination
Rapid change
of
temperature
4.11
Preconditioning;
150 +0/–10 °C for 1 hour, then keep for
24 ±1 hours at room temperature
5 cycles with following detail:
30 minutes at lower category temperature
30 minutes at upper category temperature
Recovery time 24 ±2 hours
No visual damage
<General purpose series>
∆C/C
Class 1:
NP0: within ±1% or 1 pF
whichever is greater
D.F. meet initial specified value
Rins meet initial specified value
Jan. 9, 2015 V. 11
Surface-Moun t Ce r amic M u ltilayer Cap acitor s
Product spe c ific ation
HiQ
16 V to 250 V
NP0
11
12
TEST
TEST METHOD
PROCEDURE
REQUIREMENTS
Damp heat
with U
r load
IEC 60384-
21/22
4.13
1. Preconditioning, class 2 only:
150 +0/-10 °C /1 hour, then keep for
24 ±1 hour at room temp
2. Initial measure:
Spec: refer to initial spec C, D, IR
3. Damp heat test:
500 ±12 hours at 40 ±2 °C;
90 to 95% R.H. 1.0 Ur applied
4. Recovery:
Class 1: 6 to 24 hours
5. Final measure: C, D, IR
P.S. If the capacitance value is less than the minimum
value permitted, then after the other measurements
have been made the capacitor shall be preconditioned
according to “IEC 60384 4.1” and then the requirement
shall be met.
No visual damage after recovery
<General purpose series>
∆C/C
Class 1:
NP0: within ±2% or 1 pF
whichever is greater
D.F.
Class 1:
NP0: ≤ 2 x specified value
Rins
Class 1:
NP0: ≥ 2,500 MΩ or Rins x Cr ≥ 25s
whichever is less
Endurance
4.14
1. Preconditioning, class 2 only:
150 +0/-10 °C /1 hour, then keep for
24 ±1 hour at room temp
2. Initial measure:
Spec: refer to initial spec C, D, IR
3. Endurance test:
Temperature: NP0: 125 °C
Specified stress voltage applied for 1,000 hours:
Applied 2.0 x Ur for general product.
4. Recovery time: 24 ±2 hours
5. Final measure: C, D, IR
P.S. If the capacitance value is less than the minimum
value permitted, then after the other measurements
have been made the capacitor shall be preconditioned
according to “IEC 60384 4.1” and then the requirement
shall be met.
No visual damage
<General purpose series>
∆C/C
Class1:
NP0: within ±2% or 1 pF
whichever is greater
D.F.
Class1:
NP0: ≤ 2 x specified value
Rins
Class1:
NP0: ≥ 4,000 MΩ or Rins x Cr ≥ 40s
whichever is less
Volta
ge proof
IEC 60384-1
4.6 Specified stress voltage applied for 1 minute
Ur ≤ 100 V: series applied 2.5 Ur
100 V < Ur ≤ 200 V series applied (1.5 Ur + 100)
200 V < Ur ≤ 500 V series applied (1.3 Ur + 100)
Ur > 500 V: 1.3 Ur
I: 7.5 mA
No breakdown or flashover
Jan. 9, 2015 V. 11
Surface-Moun t Ce r amic M u ltilayer Cap acitor s
Product spe c ific ation
HiQ
16 V to 250 V
NP0
12
12
REVISION HISTORY
REVISION
DATE
CHANGE NOTIFICATION
DESCRIPTION
Version 1
1
Mar 19
, 2014
-
-
Size update
Version 10
Mar 19
, 2014
-
-
Tests and requirements
Version 9
Feb. 27, 20
14
-
-
Tolerance update
Version 8
Oct. 28, 2013
-
-
Rated voltage update
Version 7
Oct. 09
, 2013
-
-
Rated voltage update
Version 6
Jun. 24, 2013
-
-
Tolerance update
Version 5
Apr. 15, 2013
-
-
Tolerance update
Version 4
Mar. 28, 2013
-
-
Capacitance range & thickness update
Version 3
Feb. 07, 2013
-
-
Capacitance range & thickness update
Version 2
Dec. 25, 2012
-
-
Capacitance range & thickness update
Version 1
Dec. 03, 2012
-
-
Capacitance range & thickness update
Version 0
Nov. 23, 2012
-
-
New datasheet for HiQ NP0 series with RoHS compliant
Mouser Electronics
Authorized Distributor
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CQ0201ARNPO8BN1R0 CQ0402ARNPO9BN2R0 CQ0402BRNPO9BN1R2 CQ0201BRNPO8BN2R0
CQ0402JRNPO9BN120 CQ0201BRNPO8BN3R9 CQ0402ARNPO9BNR20 CQ0402BRNPO9BN2R2
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