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Model 1P610S
Rev E
Pico Xinger
10dB Directional Coupler
Description
The 1P610S Pico Xinger is a low profile, miniature 10dB directional coupler
in an easy to use surface mount package designed for MMDS and WLAN
applications. The 1P610 is for power and frequency detection as well as
power injection. The 1P610 is an ideal solution for the ever-increasing
demands of the wireless industry for smaller printed circuit boards and high
performance. Parts have been subjected to rigorous qualification testing
and units are 100% tested. They are manufactured using materials with x
and y thermal expansion coefficients compatible with common substrates.
Produced with 6 of 6 RoHS compliant tin immersion. Available in 6 of 6
RoHS compliant tin immersion (1P610S).
ELECTRICAL SPECIFICATIONS**
Features:
2300-2700 MHz
MMDS and WLAN
Very Low Loss
High Directivity
Surface Mountable
Tape and Reel
Lead Free
Frequency Mean Coupling
Insertion
Loss
VSWR
MHz dB dB Max Max : 1
2300-2700 10 ± 0.75 0.25 1.22
Directivity Freq. Sensitivity Power
Handling
Operating
Temp.
dB Min dB Max
@85°C
ºC
20
± 0.2
-55 to +150
**Specification based on performance of unit properly installed on microstrip printed circuit
boards with 50 nominal impedance. Specifications subject to change without notice.
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Asia:
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Available on Tape and
Reel For Pick and Place
Manufacturing.
Model 1P610S
Rev E
Directional Coupler Pin Configuration
The 1P610S has an orientation marker to denote Pin 1. Once port one has been identified the other ports are known
automatically. Please see the chart below for clarification:
10dB Coupler Pin Configuration
Pin 1
Pin 2
Pin 3
Pin 4
Input
Direct
Isolated
Coupled
Direct
Input
Coupled
Isolated
Note: The direct port has a DC connection to the input port and the coupled port has a DC connection to the
isolated port. For optimum performance use Pin 1 or Pin 2 as inputs.
Available on Tape
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Model 1P610S
Rev E
Insertion Loss and Power Derating Curves
Insertion Loss Derating:
The insertion loss, at a given frequency, of a group of
couplers is measured at 25°C and then averaged. The
measurements are performed under small signal
conditions (i.e. using a Vector Network Analyzer). The
process is repeated at -55°C and 85°
C. Based on
copper as well as dielectric losses, the insertion loss is
computed from -55°C to 300°C.
Power Derating:
The power handling and corresponding power derating
plots are a function of the thermal resistance, mounting
surface temperature (base plate temperature),
max
imum continuous operating temperature of the
coupler, and the thermal insertion loss. The thermal
insertion loss is defined in the Power Handling section of
the data sheet.
As the mounting interface temperature approaches the
maximum continuous operating temperature, the power
handling decreases to zero.
If mounting temperature is greater than 85°C, Xinger
coupler will perform reliably as long as the input power
Is derated to the curve above.
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Manufacturing.
Model 1P610S
Rev E
Typical Performance (-55°C, 25°C. 85°C and 95°C): 2000-3000 MHz
2000 2100 2200 2300 2400 2500 2600 2700 2800 2900 3000
-50
-40
-30
-20
-10
0
Frequency (MHz)
Return Loss (dB)
Return Loss for 1P610S (Feeding Port 1)
-55ºC
25ºC
85ºC
95ºC
2000 2100 2200 2300 2400 2500 2600 2700 2800 2900 3000
-50
-40
-30
-20
-10
0
Frequency (MHz)
Return Loss (dB)
Return Loss for 1P610S (Feeding Port 2)
-55ºC
25ºC
85ºC
95ºC
2000 2100 2200 2300 2400 2500 2600 2700 2800 2900 3000
-50
-40
-30
-20
-10
0
Frequency (MHz)
Return Loss (dB)
Return Loss for 1P610S (Feeding Port 3)
-55ºC
25ºC
85ºC
95ºC
2000 2100 2200 2300 2400 2500 2600 2700 2800 2900 3000
-50
-40
-30
-20
-10
0
Frequency (MHz)
Return Loss (dB)
Return Loss for 1P610S (Feeding Port 4)
-55ºC
25ºC
85ºC
95ºC
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USA/Canada:
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Asia:
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Model 1P610S
Rev E
Typical Performance (-55°C, 25°C , 85°C and 95°C): 2000-3000 MHz
2000 2100 2200 2300 2400 2500 2600 2700 2800 2900 3000
-10.75
-10.5
-10.25
-10
-9.75
-9.5
-9.25
Frequency (MHz)
Coupling (dB)
Coupling for 1P610S (Feeding Port 1)
-55ºC
25ºC
85ºC
95ºC
2000 2100 2200 2300 2400 2500 2600 2700 2800 2900 3000
-0.3
-0.25
-0.2
-0.15
-0.1
-0.05
0
Frequency (MHz)
Insertion Loss (dB)
Insertion Loss for 1P610S (Feeding Port 1)
-55ºC
25ºC
85ºC
95ºC
2000 2100 2200 2300 2400 2500 2600 2700 2800 2900 3000
-1
-0.9
-0.8
-0.7
-0.6
-0.5
-0.4
-0.3
-0.2
-0.1
0
0
Frequency (MHz)
Transmission Loss (dB)
Transmission Loss for 1P610S (Feeding Port 1)
-55ºC
25ºC
85ºC
95ºC
2000 2100 2200 2300 2400 2500 2600 2700 2800 2900 3000
-50
-40
-30
-20
-10
0
Frequency (MHz)
Directivity (dB)
Directivity for 1P610S (Feeding Port 1)
-55ºC
25ºC
85ºC
95ºC
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Available on Tape and
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Manufacturing.
Model 1P610S
Rev E
Definition of Measured Specifications
Parameter
Definition
Mathematical Representation
VSWR
(Voltage Standing Wave Ratio)
The impedance match of
the coupler to a 50
system. A VSWR of 1:1 is
optimal.
VSWR =
min
max
V
V
Vmax = voltage maxima of a standing wave
Vmin = voltage minima of a standing wave
Return Loss
The impedance match of
the coupler to a 50
system. Return Loss is
an alternate means to
express VSWR.
Return Loss (dB)= 20log
1
-
VSWR
1
VSWR +
Mean Coupling
At a given frequency (ωn),
coupling is the input
power divided by the
power at the coupled
port. Mean coupling is
the average value of the
coupling values in the
band. N is the number of
frequencies in the band.
Coupling (dB) =
=)(
)(
log10)(
ncpl
nin
nP
P
C
ω
ω
ω
Mean Coupling (dB) =
N
C
N
n
n
=1
)(
ω
Insertion Loss
The input power divided
by the sum of the power
at the two output ports.
10log
direct cpl
in
PP
P
+
Transmission Loss
The input power divided
by the power at the direct
port.
10log
direct
in
P
P
Directivity
The power at the
coupled port divided by
the power at the isolated
port.
10log
iso
cpl
P
P
Frequency Sensitivity
The decibel difference
between the maximum in
band coupling value and
the mean coupling, and
the decibel difference
between the minimum in
band coupling value and
the mean coupling.
Max Coupling (dB) Mean Coupling (dB)
and
Min Coupling (dB) Mean Coupling (dB)
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Model 1P610S
Rev E
Mounting
In order for Xinger surface mount couplers to work
optimally, there must be 50Ω transmission lines leading
to and from all of the RF ports. Also, there must be a
very good ground plane underneath the part to ensure
proper electrical performance. If either of these two
conditions is not satisfied, insertion loss, coupling, VSWR
and isolation may not meet published specifications.
Overall ground is improved if a dense population of
plated through holes connect the top and bottom ground
layers of the PCB. This minimizes ground inductance
and improves ground continuity. All of the Xinger hybrid
and directional couplers are constructed from ceramic
filled PTFE composites which possess excellent electrical
and mechanical stability.
When a surface mount hybrid coupler is mounted to a
printed circuit board, the primary concerns are; ensuring
the RF pads of the device are in contact with the circuit
trace of the PCB and insuring the ground plane of neither
the component nor the PCB is in contact with the RF
signal.
Mounting Footprint
1P610* Rev A Mounting Footprint
Dimensions are in Inches [Millimeters]
To ensure proper electrical and thermal performance
there must be a ground plane with 100%
solder connection underneath the part
4X .063 SQ
[1.60]
4X .034
[0.86]
.170
[4.32]
.120
[3.05]
4X 50
Transmission
Line
Multiple
plated thru holes
to ground
Coupler Mounting Process
The process for assem
bling this component is a
conventional surface mount process as shown in Figure
1. This process is conducive to both low and high volume
usage.
Figure 1: Surface Mounting Process Steps
Storage of Components: The Xinger II pr
oducts are
available in an immersion tin finish. Commonly used
storage procedures used to control oxidation should be
followed for these surface mount components. The
storage temperatures should be held between 15OC and
60OC.
Substrate: Depending upon th
e particular component,
the circuit material has a coefficient of thermal expansion
(CTE) similar to commonly used board substrates such
as RF35, RO4003, FR4, polyimide and G-10 materials.
The similarity in CTE minimizes solder joint stresses due
to simila
r expansion rates between component and
board. Mounting to “hard” substrates (alumina etc.) is
possible depending upon operational temperature
requirements. The solder surfaces of the coupler are all
copper plated with an immersion tin finish.
Solder Paste: All conventional solder paste formulations
will work well with Anaren’s Xinger II surface mount
components. Solder paste can be applied with stencils or
syringe dispensers. An example of a stenciled solder
paste deposit is shown in Figure 2. As shown in the
figure solder paste is applied to the four RF pads and the
entire ground plane underneath the body of the part.
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Model 1P610S
Rev E
Figure 2: Solder Paste Application
Coupler Positioning: The surface mount coupler can
be placed manually or with automatic pick and place
mechanisms. Couplers should be placed (see Figure 3
and 4) onto wet paste with common surface mount
techniques and parameters. Pick and place systems
must supply adequate vacuum to hold a 0.50-0.55
gram coupler.
Figure 3: Component Placement
Figure 4: Mounting Features Example
Reflow: The surface mount coupler is conducive to most of
today’s conventional reflow methods. A low and high
temperature thermal reflow profile are shown in Figures 5
and 6, respectively. Manual soldering of these components
can be done with conventional surface mount non-contact
hot air soldering tools. Board pre-
heating is highly
recommended for these selective hot air soldering
methods. Manual soldering with conventional irons should
be avoided.
Figure 5Low Temperature Solder Reflow Thermal
Profile
Figure 6 High Temperature Solder Reflow Thermal
Profile
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Model 1P610S
Rev E
PACKAGING
Packaging follows EIA-481-2. Parts are oriented in tape as shown below. Minimum order quantities are 2000
per reel .
Xinger® Tape & Reel Diagram