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Rev E
In order for Xinger surface mount couplers to work
optimally, there must be 50Ω transmission lines leading
to and from all of the RF ports. Also, there must be a
very good ground plane underneath the part to ensure
proper electrical performance. If either of these two
conditions is not satisfied, insertion loss, coupling, VSWR
and isolation may not meet published specifications.
Overall ground is improved if a dense population of
plated through holes connect the top and bottom ground
layers of the PCB. This minimizes ground inductance
and improves ground continuity. All of the Xinger hybrid
and directional couplers are constructed from ceramic
filled PTFE composites which possess excellent electrical
and mechanical stability.
When a surface mount hybrid coupler is mounted to a
printed circuit board, the primary concerns are; ensuring
the RF pads of the device are in contact with the circuit
trace of the PCB and insuring the ground plane of neither
the component nor the PCB is in contact with the RF
signal.
Mounting Footprint
1P610* Rev A Mounting Footprint
Dimensions are in Inches [Millimeters]
To ensure proper electrical and thermal performance
there must be a ground plane with 100%
solder connection underneath the part
4X .063 SQ
[1.60]
4X .034
[0.86]
.170
[4.32]
.120
[3.05]
4X 50
Transmission
Line
Multiple
plated thru holes
to ground
Coupler Mounting Process
The process for assem
bling this component is a
conventional surface mount process as shown in Figure
1. This process is conducive to both low and high volume
usage.
Figure 1: Surface Mounting Process Steps
Storage of Components: The Xinger II pr
oducts are
available in an immersion tin finish. Commonly used
storage procedures used to control oxidation should be
followed for these surface mount components. The
storage temperatures should be held between 15OC and
60OC.
Substrate: Depending upon th
the circuit material has a coefficient of thermal expansion
(CTE) similar to commonly used board substrates such
as RF35, RO4003, FR4, polyimide and G-10 materials.
The similarity in CTE minimizes solder joint stresses due
to simila
r expansion rates between component and
board. Mounting to “hard” substrates (alumina etc.) is
possible depending upon operational temperature
requirements. The solder surfaces of the coupler are all
copper plated with an immersion tin finish.
Solder Paste: All conventional solder paste formulations
will work well with Anaren’s Xinger II surface mount
components. Solder paste can be applied with stencils or
syringe dispensers. An example of a stenciled solder
paste deposit is shown in Figure 2. As shown in the
figure solder paste is applied to the four RF pads and the
entire ground plane underneath the body of the part.