©2011 Littelfuse, Inc.
Gas Discharge Tube (GDT) Products
23
Revised: September 26, 2011
Specifications are subject to change without notice.
Please refer to www.littelfuse.com for current information.
Customer should verify actual device performance in their specific applications.
CG/CG2 Series
CG/CG2 Series
Reflow Condition 1Co'SFFBTTFNCMZ
Pre Heat
- Temperature Min (Ts(min))150°C
- Temperature Max (Ts(max))200°C
- Time (Min to Max) (ts)oTFDT
Average ramp up rate (Liquidus Temp
(TL) to peak ¡$TFDPOENBY
TS(max) to TL - Ramp-up Rate 5°C/second max
Reflow - Temperature (TL) (Liquidus) 217°C
- Temperature (tL)oTFDPOET
Peak Temperature (TP)+0/-5 °C
Time within 5°C of actual peak
Temperature (tp)oTFDPOET
Ramp-down Rate ¡$TFDPOENBY
Time 25°C to peak Temperature (TP)NJOVUFT.BY
Do not exceed ¡$
Soldering Parameters - Reflow Soldering (Surface Mount Devices)
Time
Temperature
TP
TL
TS(max)
TS(min)
25
tP
tL
tS
time to peak temperature
(t 25ºC to peak)
Ramp-down
Ramp-up
Preheat
Critical Zone
TL to TP
Soldering Parameters - Wave Soldering (Thru-Hole Devices)
Soldering Parameters - Hand Soldering
Dwell Time
0
20
40
60
80
100
120
140
160
180
200
220
240
260
280
300
0
10
20
30
40
50
60
70
80
90
100
110
120
130
140
150
160
170
180
190
200
210
220
230
240
Time (Seconds)
Temperature (°C) - Measured on bottom side of board
Cooling Time
Preheat Time
Wave Parameter Lead-Free Recommendation
Preheat:
%FQFOETPO'MVY"DUJWBUJPO5FNQFSBUVSF 5ZQJDBM*OEVTUSZ3FDPNNFOEBUJPO
5FNQFSBUVSF.JOJNVN 100° C
5FNQFSBUVSF.BYJNVN 150° C
1SFIFBU5JNF TFDPOET
Solder Pot Temperature: ° $.BYJNVN
Solder Dwell Time: 2-5 seconds
Recommended Process Parameters:
4PMEFS*SPO5FNQFSBUVSF¡$¡$
)FBUJOH5JNFTFDPOETNBY