BGA615L7
Silicon Germanium GPS Low Noise Amplifier
Data Sheet, Rev.1.3, February 2007
RF & Protection Devices
Edition 2007-02-12
Published by
Infineon Technologies AG
81726 München, Germany
© Infineon Technologies AG 2009.
All Rights Reserved.
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BGA615L7
Data Sheet 3 Rev.1.3, 2007-02-12
BGA615L7
Revision History: 2007-02-12, Rev.1.3
Previous Version: BGA615L7 V1.2
Page Subjects (major changes since last revision)
4added moisture sensitivity level
5added thermal resistance
6adjusted power gain settling times
adjusted inband and out of band compression points
12 updated recommended land pattern (added solder mask defined layout)
13 added reel diameter and pcs / reel information
Data Sheet 4 Rev.1.3, 2007-02-12
Silicon Germanium GPS Low Noise Amplifier
BGA615L7
Silicon Germanium GPS Low Noise Amplifier
Figure 1 Blockdiagram
Description
The BGA615L7 is a front-end low noise amplifier for Global Positioning System (GPS) applications. The LNA
provides 18 dB gain, 0.9 dB noise figure and high linearity performance, allowing it to be used as a first-stage LNA.
Current consumption is as low as 5.6 mA. The BGA615L7 is based upon Infineon Technologies‘ B7HF Silicon
Germanium technology. It operates over a 2.4 V to 3.2 V supply range.
Features
High gain: 18 dB
Low Noise Figure: 0.9 dB
Power off function
Operating frequency 1575 MHz
Supply voltage: 2.4 V to 3.2 V
Tiny PG-TSLP-7-1 leadless package
B7HF Silicon Germanium technology
RF output internally matched to 50
Low external component count
1 kV HBM ESD protection (including AI-pin)
Moisture sensitivity level: MSL 1
TSLP-7-1
Application
1575 MHz GPS
Type Package Marking Chip
BGA615L7 PG-TSLP-7-1 BS T0595
123
65
4
7
BIAS
AI
BIAS
AO
GND
PONVCC
ESD
VSS
BGA615L7
Silicon Germanium GPS Low Noise Amplifier
Data Sheet 5 Rev.1.3, 2007-02-12
Pin Definition and Function
Maximum Ratings
Table 1 Pin Definition and Function
Pin No. Symbol Function
1AI LNA input
2BIAS DC bias
3GND RF ground
4PON Power on control
5VCC Supply control
6AO LNA output
7VSS DC ground
Table 2 Maximum Ratings
Parameter1)
1) All voltages refer to GND-Node.
Symbol Value Unit
Voltage at pin VCC VCC -0.3 ... 3.6 V
Voltage at pin AI VAI -0.3 ... 0.9 V
Voltage at pin BIAS VBIAS -0.3 ... 0.9 V
Voltage at pin AO VAO -0.3 ... VCC+ 0.3 V
Voltage at pin PON VPON -0.3 ... VCC+ 0.3 V
Voltage at pin VSS VSS -0.3 ... 0.3 V
Current into pin VCC ICC 10 mA
RF input power PIN 10 dBm
Total power dissipation Ptot 36 mW
Junction temperature TJ150 °C
Ambient temperature range TA-30 ... 85 °C
Storage temperature range TSTG -65 ... 150 °C
Thermal resistance junction soldering point Rth JS 240 K/W
ESD capability all pins (HBM: JESD22A-114) VESD 1000 V
Data Sheet 6 Rev.1.3, 2007-02-12
BGA615L7
Silicon Germanium GPS Low Noise Amplifier
Electrical Characteristics
Table 3 Electrical Characteristics1): TA = 25 °C, VCC = 2.8 V, VPON,ON = 2.8 V, VPON,OFF = 0 V, f = 1575 MHz
1) Measured on BGA615L7 application board including PCB losses (unless noted otherwise)
Parameter Symbol Values Unit Note / Test Condition
Min. Typ. Max.
Supply voltage VCC 2.4 2.8 3.2 V
Supply current ICC -5.6 -mA ON-mode
-0.2 3µAOFF-mode
Gain switch control voltage Vpon 1.5 -3.2 VON-mode
0 - 0.5 VOFF-mode
Gain switch control current Ipon -1.5 3µAON-mode
- 01µAOFF-mode
Insertion power gain |S21|2-18 -dB High-gain Mode
Noise figure2)
2) PCB losses subtracted
NF -0.9 -dB ZS = 50
Input return loss RLin -13 -dB
Output return loss RLout ->15 -dB
Reverse isolation 1/|S12|2-35 -dB
Power gain settling time3)
3) To within 1 dB of the final gain OFF- to ON-mode; to within 3 dB of the final gain ON- to OFF-mode
tS-20 -µsOFF- to ON-mode
-50 -µsON- to OFF-mode
Inband input 3rd order intercept
point
IIP3--1 -dBm f1 = 1575 MHz
f2 = f1 +/-1 MHz
Inband input 1 dB compression
point
IP1dB --14 -dBm
Out of band input 1 dB
compression point
IP1dB,900M --9 -dBm f = 806 MHz ... 928 MHz
Out of band input 1 dB
compression point
IP1dB,1650M --12 -dBm f = 1612 MHz ... 1710
MHz
Out of band input 1 dB
compression point
IP1dB,1900M --6 -dBm f = 1710 MHz ...1785
MHz
f =1850 MHz ...1909
MHz
Stability k-> 1.5 -f = 20 MHz ... 10 GHz
BGA615L7
Silicon Germanium GPS Low Noise Amplifier
Data Sheet 7 Rev.1.3, 2007-02-12
Typical Measurement Results ON Mode; TA = 25 °C
Gain |S21|2 = f( f )
VCC = 2.8 V
Noise Figure1) NF = f( f )
VCC = 2.8 V
1) PCB losses subtraced
Reverse Isolation 1/|S12|2 = f( f )
VCC = 2.8 V
Matching |S11|, |S22| = f( f )
VCC = 2.8 V
1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2
10
11
12
13
14
15
16
17
18
19
20
Frequency [GHz]
|S21|2 [dB]
−30°C
25°C
85°C
1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2
0.5
0.6
0.7
0.8
0.9
1
1.1
1.2
1.3
1.4
1.5
Frequency [GHz]
NF [dB]
1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2
−50
−48
−46
−44
−42
−40
−38
−36
−34
−32
−30
Frequency [GHz]
1/|S12|2 [dB]
1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2
−45
−40
−35
−30
−25
−20
−15
−10
−5
0
Frequency [GHz]
|S11|, |S22| [dB]
S11
S22
Data Sheet 8 Rev.1.3, 2007-02-12
BGA615L7
Silicon Germanium GPS Low Noise Amplifier
Typical Measurement Results ON Mode vs. Temperature
Power Gain |S21|2 = f(TA)
VCC = 2.8 V
Noise Figure1) NF = f(TA)
VCC = 2.8 V
1) PCB losses subtracted
Supply current ICC = f(TA)
VCC = 2.8 V
Third Order Input Intercept Point IIP3 = f(TA)
VCC = 2.8 V
−40 −20 0 20 40 60 80 100
15
15.5
16
16.5
17
17.5
18
18.5
19
19.5
20
TA [°C]
|S21|2 [dB]
−40 −20 0 20 40 60 80 100
0.5
0.6
0.7
0.8
0.9
1
1.1
1.2
1.3
1.4
1.5
TA [°C]
NF [dB]
−40 −20 0 20 40 60 80 100
4.5
4.7
4.9
5.1
5.3
5.5
5.7
5.9
6.1
6.3
6.5
TA [°C]
ICC [mA]
−40 −20 0 20 40 60 80 100
−10
−7.5
−5
−2.5
0
2.5
5
TA [°C]
IIP3 [dBm]
BGA615L7
Silicon Germanium GPS Low Noise Amplifier
Data Sheet 9 Rev.1.3, 2007-02-12
Typical Measurement Results ON Mode vs. Supply Voltage
Power Gain |S21| = f(VCC)
TA = 25 °C
Noise Figure1) NF = f(VCC)
TA = 25 °C
1) PCB losses subtracted
Supply current ICC = f(VCC)
TA = 25 °C
Third Order Input Intercept Point IIP3 = f(VCC)
TA = 25 °C
2.2 2.4 2.6 2.8 3 3.2 3.4
15
15.5
16
16.5
17
17.5
18
18.5
19
19.5
20
VCC [V]
|S21|2 [dB]
2.2 2.4 2.6 2.8 3 3.2 3.4
0.5
0.6
0.7
0.8
0.9
1
1.1
1.2
1.3
1.4
1.5
VCC [V]
NF [dB]
2.2 2.4 2.6 2.8 3 3.2 3.4
4.5
4.7
4.9
5.1
5.3
5.5
5.7
5.9
6.1
6.3
6.5
VCC [V]
ICC [mA]
2.2 2.4 2.6 2.8 3 3.2 3.4
−10
−7.5
−5
−2.5
0
2.5
5
VCC [V]
IIP3 [dBm]
Data Sheet 10 Rev.1.3, 2007-02-12
BGA615L7
Silicon Germanium GPS Low Noise Amplifier
PCB Configuration
Figure 2 Schematic of BGA615L7
Table 4 Bill of Materials
Name Value Package Manufacturer Function
C1 10 nF 0402 Various LF trap
C2 5 pF 0402 Various DC block
C3 10 pF 0402 Various Control voltage filtering
optional
C4 100 pF 0402 Various Supply filtering optional
C5 2.2 nF 0402 Various Supply filtering
L1 3.3 nH 0402 Various LF trap & input matching
L2 100 nH 0402 Various Biasing
N1 BGA615L7 PG-TSLP-7-1 Infineon SiGe LNA
RFin RFout
C1
VCC
PON
C3
L2
C2
L1
C5C4
N1 BGA615L7
AI, 1
BIAS, 2
GND, 3
AO, 6
VCC, 5
PON, 4
VSS, 7
BGA615L7
Silicon Germanium GPS Low Noise Amplifier
Data Sheet 11 Rev.1.3, 2007-02-12
Application Board
Figure 3 Photograph of Application Board
Figure 4 Top View of Application Board
Figure 5 Detailed View of Application Board
Please note that RF-ground is connected via pin 3 only. In order to achieve the same performance as given in this
data sheet, it is necessary to provide good RF-grounding on this pin. Furthermore, the LF trap consisting of
inductor L1 and capacitor C1 should be placed as close as possible to pin 3.
Data Sheet 12 Rev.1.3, 2007-02-12
BGA615L7
Silicon Germanium GPS Low Noise Amplifier
Figure 6 Cross-Section View of Application Board
Figure 7 Recommended Land Pattern
A list of all application notes is available at http://goto.infineon.com/smallsignaldiscretes-appnotes.
Table 5 Application Notes
No. Description
AN091 The BGA615L7 Silicon-Germanium Low Noise Amplifier in GPS Applications
AN093 The BGA615L7 Silicon-Germanium Low Noise Amplifier with 0201 chip components
AN094 The BGA615L7 Silicon-Germanium Low Noise Amplifier for Low-Current GPS Applications
0.017 mm Copper
0.100 mm Prepreg FR4
0.100 mm Prepreg FR4
0.035 mm Copper
0.460 mm FR4
0.100 mm Prepreg FR4
0.100 mm Prepreg FR4
0.017 mm Copper
SMD
0.25
1.4
1.9
0.25
0.20.25
0.250.2
1.4
1.9
0.3 0.3
0.3
0.20.2
0.20.2
0.2
Stencil apertures
Copper Solder mask
R0.1
NSMD
0.25
1.4
1.9
0.25
0.20.25
0.250.2
1.4
1.9
0.3 0.3
0.3
0.20.2
0.20.2
0.2
Stencil apertures
Copper Solder mask
R0.1
BGA615L7
Silicon Germanium GPS Low Noise Amplifier
Data Sheet 13 Rev.1.3, 2007-02-12
Package Information
Figure 8 Package Dimensions
Figure 9 Tape & Reel Dimensions
Figure 10 Marking Layout
123
65
4
7
0.05 MAX.
+0.1
0.4
1) Dimension applies to plated terminal
±0.035
1.2
±0.05
1
±0.05
1.3
±0.05
1.7
±0.05
2
6x0.2
±0.0351)
6x0.2±0.035 1)
±0.035
1.1 1)
456
123
7
1)
Top view Bottom view
Pin 1 marking
1.45
4
8
2.18
0.5
Pin 1
marking
Reel diameter = 180 mm
7500 pcs / reel
BS
0525
BGA615
Type code
2005, CW 25
Date code (YYWW)
Pin 1 marking
Laser marking