S i 3 4 0 2-C F U L LY - I N T E G RA T E D I E E E 8 0 2 . 3 - C O M P LI A N T P O E P D I N T E RFA C E A N D L O W - E M I S WI T C H I N G R E G U L A T O R Features Pin-compatible replacement for the obsolete Si3402-A IEEE 802.3 standard-compliant solution, including pre-standard (legacy) PoE support Highly-integrated IC enables compact solution footprints Minimal external components Integrated diode bridges and transient surge suppressor Integrated switching regulator controller with on-chip power FET Integrated dual current-limited hotswap switch Programmable classification circuit Incorporates switcher EMIreduction techniques. Supports non-isolated and isolated switching topologies Comprehensive protection circuitry Transient overvoltage protection Undervoltage lockout Thermal shutdown protection Foldback current limiting Allows external Schottky diode bypass of integrated diode bridges without requiring CT/SP pin connection Low-profile 5 x 5 mm 20-pin QFN RoHS-compliant Point-of-sale terminals Internet appliances Network devices High power applications Ordering Information: See page 18. Pin Assignments 5 x 5 mm QFN (Top View) Description 1 SSFT* 2 VDD 3 VSS2 SWO VSS1 VPOSS VSSA 19 18 17 16 15 14 VNEG (PAD) Copyright (c) 2016 by Silicon Laboratories Note: CT1 13 CT2 5 6 7 8 9 10 HSO RCL VNEG SP2 ISOSSFT* 4 The Si3402 integrates all power management and control functions required in a Power-over-Ethernet (PoE) powered device (PD) application. The Si3402 converts the high voltage supplied over the 10/100/1000BASE-T Ethernet connection into a regulated, low-voltage output supply. The optimized architecture of the Si3402 minimizes the solution footprint, reduces external BOM cost, and enables the use of low-cost external components while maintaining high performance. The Si3402 integrates the required diode bridges and transient surge suppressor, thus enabling direct connection of the IC to the Ethernet RJ-45 connector. The switching power FET and all associated functions are also integrated. The integrated switching regulator supports isolated (flyback) and non-isolated (buck) converter topologies. The Si3402 supports IEEE 802.3 Type 1 (Class 3 and below) Powered Device applications. Standard external resistors connected to the Si3402 provide the proper IEEE 802.3 signatures for the detection function and programming of the requested power class. Startup circuits ensure well-controlled initial operation of both the hotswap switch and the voltage regulator. The Si3402 is available in a lowprofile, 20-pin, 5 x 5 mm QFN package. The Si3402-C is a pin-compatible replacement of the obsolete Si3402-A. PCB layouts designed for Si3402-A can be reused with Si3402-C, but some component value changes are required. The Si3402-C's functionality is similar to that of the Si3402-B but without the requirement to make a connection between the Ethernet jack and CT1, CT2, SP1, or SP2 pins when bypassing the integrated diode bridge with external Schottky diodes. Further, PLOSS functionality is removed from the Si3402-C. Rev. 1.0 12/16 EROUT 20 NC Voice over IP telephones and adapters Wireless access points Security cameras RDET FB Applications 12 VPOSF 11 SP1 Original pin names shown for compatibility reasons, but SSFT, ISOSSFT, VPOSS, and VSS1 are not internally connected. Si3402-C Si3402-C Functional Block Diagram SP1 SP2 & CT2 Protection CT1 Rectification VPOSF VPOSS* VNEG RDET RCL D e te c tio n & C la s s ific a tio n H o ts w a p S w itc h & C u rre n t lim it HSO SSFT* VDD H o ts w a p C o n tro l & Com m on B ia s PLO SS VSSA IS O S S F T * P W M C o n tro l and EM I L im itin g S w itc h in g FET VSS1* VSS2 N o te : O rig in a l p in n a m e s s h o w n fo r c o m p a tib ility re a s o n s, b u t S S F T , IS O S S F T , V P O S S , a n d V S S 1 a re n o t in te rn a lly c o n n e c te d. 2 Rev. 1.0 EROUT FB SW O Si3402-C TABLE O F C ONTENTS Section Page 1. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 2. Typical Application Schematics* . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 3. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8 3.1. Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8 3.2. PD Hotswap Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 3.3. Isolated and Non-Isolated Application Topologies . . . . . . . . . . . . . . . . . . . . . . . . . . 12 3.4. Switching Regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 3.5. Output Voltage and Thermal Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 4. Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 5. Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 6. Recommended Land Pattern . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 7. Ordering Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 8. Device Marking Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Document Change List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20 Rev. 1.0 3 Si3402-C 1. Electrical Specifications Table 1. Recommended Operating Conditions Description |CT1 - CT2| or |SP1 - SP2| Ambient Operating Temperature Symbol Min Typ Max Units VPORT 2.8 -- 57 V TA -40 25 85 C Note: Unless otherwise noted, all voltages referenced to VNEG. All minimum and maximum specifications are guaranteed and apply across the recommended operating conditions. Typical values apply at nominal supply voltage and ambient temperature unless otherwise noted. Table 2. Absolute Maximum Ratings1 Type Voltage Description Rating Unit CT1 to CT22 -100 to 100 V 2 SP1 to SP2 -100 to 100 V VPOS -0.7 to 100 V HSO -0.7 to 100 V VSS1, VSS2, or VSSA -0.7 to 100 V VSS1 to VSS2 or VSSA -0.3 to 0.3 V SWO3 -0.7 to 100 V RDET -0.7 to 100 V -0.3 to 5.5 V -5 to 5 A -5 to 5 A CT1,CT2,SP1,SP2 -0.2 to 0.2 A Storage -65 to 150 C Operating -40 to 85 C VDD to VSS1, VSS2, or VSSA Peak Current DC Current 4 Ambient Temperature CT1, CT2, SP1, SP2 2 VPOS2 Notes: 1. Unless otherwise noted, all voltages referenced to VNEG. Permanent device damage may occur if the maximum ratings are exceeded. Functional operation should be restricted to those conditions specified in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for extended periods may adversely affect device reliability. 2. Si3402 provides internal protection from certain transient surge voltages on these pins. Please refer to "AN1050: Si3402-C POE PD Controller Design Guide" for details. 3. SWO is referenced to VSS2. 4. Higher dc current is possible in the application, but only utilizing external bridge diodes. Refer to "AN1050: Si3402-C POE PD Controller Design Guide" for more information. 4 Rev. 1.0 Si3402-C Table 3. Electrical Characteristics Description Min Typ Max Detection1 2.7 -- 11 Classification 14 -- 22 UVLO turn-off for rising voltages (switching regulator turns ON) -- 37 42 UVLO turn-on for falling voltages (switching regulator turns OFF) 30 32 36 Integrated Transient Surge Clamp Voltage2 -- 100 -- Input Offset Current VPORT < 10 V -- -- 10 A Diode Bridge Leakage VPORT = 57 V -- -- 25 A Class 0 0 -- 4 Class 1 9 -- 12 Class 2 17 -- 20 Class 3 26 -- 30 37 V < VPORT < 57 V -- 2 3.1 mA Inrush -- 140 -- mA Operating 470 -- 680 mA 37 V < VPORT < 57 V 1 -- 3 -- 350 -- kHz -- 50 75 % Switcher Output Transient Voltage -- -- 100 V Switching FET On-Resistance 0.3 0.5 1.3 Switching FET Peak Current -- -- 2.4 A 1.30 1.35 1.40 V Parameter VPORT IPORT Classification3 IPORT Operating Current4 Current Limit5 Hotswap FET On-Resistance Switcher Frequency Maximum Switcher Duty Cycle 6 Regulated Feedback @ Pin FB7 DC Avg. Unit V mA Notes: 1. Assumes use of internal diode bridge or external Schottky bridge. 2. Transient surge as defined in IEEE 802.3 is applied across CT1-CT2 or SP1-SP2. 3. The classification currents are guaranteed only when recommended RCLASS resistors are used, as specified in Table 7. 4. IPORT includes full operating current of switching regulator controller. 5. The PD interface includes dual-level input current limit. At turn-on, before the HSO load capacitor is charged, the current limit is set at the inrush level. After the capacitor has been charged within ~0.4 V of VNEG, the operating current limit is engaged. This higher current limit remains active until the UVLO lower limit has been tripped or until the hotswap switch is sufficiently current-limited to cause a foldback of the HSO voltage. For more information, see "3.2.5. Dual Input Current Limit and Switcher Turn-On" on page 11. 6. For switcher output transient voltage control with isolated applications, please use a voltage snubber circuit. Refer to "AN1050: Si3402-C POE PD Controller Design Guide" for additional guidance on voltage snubber circuit design. 7. Applies to non-isolated applications only. Rev. 1.0 5 Si3402-C Table 3. Electrical Characteristics (Continued) Parameter VDD Accuracy Thermal Shutdown Description Min Typ Max Unit 0-5 mA and UVLO OFF (Switching regulator ON) 4.5 -- 5.5 V Junction temperature -- 160 -- C -- 25 -- C Thermal Shutdown Hysteresis Notes: 1. Assumes use of internal diode bridge or external Schottky bridge. 2. Transient surge as defined in IEEE 802.3 is applied across CT1-CT2 or SP1-SP2. 3. The classification currents are guaranteed only when recommended RCLASS resistors are used, as specified in Table 7. 4. IPORT includes full operating current of switching regulator controller. 5. The PD interface includes dual-level input current limit. At turn-on, before the HSO load capacitor is charged, the current limit is set at the inrush level. After the capacitor has been charged within ~0.4 V of VNEG, the operating current limit is engaged. This higher current limit remains active until the UVLO lower limit has been tripped or until the hotswap switch is sufficiently current-limited to cause a foldback of the HSO voltage. For more information, see "3.2.5. Dual Input Current Limit and Switcher Turn-On" on page 11. 6. For switcher output transient voltage control with isolated applications, please use a voltage snubber circuit. Refer to "AN1050: Si3402-C POE PD Controller Design Guide" for additional guidance on voltage snubber circuit design. 7. Applies to non-isolated applications only. Table 4. Total Power Dissipation Description Test Condition Min Typ Max Unit Power Dissipation VPORT = 50 V, VOUT = 5 V, 2 A -- 1.2 -- W Power Dissipation* VPORT = 50 V, VOUT = 5 V, 2 A w/ diode bridges bypassed -- 0.7 -- W *Note: It is recommended that the on-chip diode bridges be bypassed when input power requirements are >10 W or in thermally-constrained applications. For more information, see "AN1050: Si3402-C POE PD Controller Design Guide". Table 5. Package Thermal Characteristics Parameter Thermal Resistance (Junction to Ambient) 6 Symbol Test Condition Typ Unit JA Still air; assumes a minimum of nine thermal vias are connected to a 2 in2 heat spreader plane for the package "pad" node (VNEG). 45.1 C/W Rev. 1.0 Si3402-C 2. Typical Application Schematics* *Note: These are simplified schematics. See "AN1050: Si3402-C POE PD Controller Design Guide" for more information. 1 To Ethernet PHY 2 3 RJ-45 6 + VPOSF 4 5 VOUT FB CT1 - CT2 SP1 7 8 SP2 SWO RDET Si3402C VDD HSO EROUT VSS2 VSS1 VNEG VSSA VPOSS RCL SSFT ISOSSFT Figure 1. Schematic--Non-Isolated Buck Topology* 1 2 3 To Ethernet PHY 4 5 + FB VPOSF RJ-45 6 VOUT - CT1 CT2 SP1 7 8 SP2 RDET SWO Si3402C EROUT VDD HSO VSS2 VSS1 VNEG VSSA RCL VPOSS SSFT ISOSSFT Figure 2. Schematic--Isolated Flyback Topology Rev. 1.0 7 Si3402-C 3. Functional Description The Si3402 consists of two major functions: a hotswap controller/interface and a complete pulse-width-modulated switching regulator (controller and power FET). 3.1. Overview The hotswap interface of the Si3402 provides the complete front end of an IEEE 802.3-compliant PD. The Si3402 also includes two full diode bridges, a transient voltage surge suppressor, detection circuit, classification current source, and dual-level hotswap current limiting switch. This high level of integration enables direct connection to the RJ-45 connector, simplifies system design, and provides significant advantages for reliability and protection. The Si3402 requires only four standard external components (detection resistor, optional classification resistor, load capacitor, and input capacitor) to create a fully IEEE 802.3-compliant interface. The Si3402 integrates a complete pulse-width modulated switching regulator that includes the controller and power FET. The switching regulator utilizes a constant frequency pulse-width modulated controller optimized for all possible load conditions in PoE applications. The regulator integrates a low on-resistance (Ron) switching power MOSFET that minimizes power dissipation, increases overall regulator efficiency, and simplifies system design. An integrated error amplifier, precision reference, and soft-start feature provide the flexibility of using a non-isolated buck regulator topology or an isolated flyback regulator topology. The Si3402 is designed to operate with both IEEE 802.3-compliant Power Sourcing Equipment (PSE) and prestandard (legacy) PSEs that do not adhere to the IEEE 802.3 specified inrush current limits. The Si3402 is compatible with compliant and legacy PSEs because it uses two levels for the hotswap current limits. By setting the initial inrush current limit to a low level, a PD based on the Si3402 minimizes the current drawn from either a compliant or legacy PSE during startup. After powering up, the Si3402 automatically switches to a higher-level current limit, thereby allowing the PD to consume up to 12.95 W (the max power allowed by the IEEE 802.3 specification). Excessive power cycling or short circuit faults will engage the thermal overload protection to prevent the on-chip power MOSFETs from exceeding their safe and reliable operating ranges. The switching regulator power MOSFET has been designed and sized to withstand the high peak currents created when converting a high-voltage, lowcurrent supply into a low-voltage, high-current supply. 8 Rev. 1.0 Si3402-C 3.2. PD Hotswap Controller The Si3402 hotswap controller changes its mode of operation based on the input voltage applied to the highvoltage supply inputs (CT1, CT2, SP1, SP2), the IEEE 802.3-defined modes of operation, and internal controller requirements. Table 6 defines the modes of operation for the hotswap interface. Table 6. Hotswap Interface Modes Input Voltage (|CT1-CT2| or |SP1-SP2|) Si3402 Mode 0 to 2.7 V Inactive 2.7 to 11 V Detection signature 11 to 14 V Transition region 14 to 22 V Classification signature 22 to 42 V Transition region 37 up to 57 V Switcher operating mode (hysteresis limit based on rising input voltage) 57 down to 32 V Switcher operating mode (hysteresis limit based on falling input voltage) Figure 3 provides a representation of the input lines, protection, and hotswap circuits on the Si3402. VPOS RDET DETECTION CONTROL BIAS VOLTAGES DIODE BRIDGES AND PROTECTION ~2.7V ON ~11V OFF CENTRAL BIAS BANDGAP REF HOTSWAP CONTROL CT2/SP2 CLASSIFICATION CONTROL CT1/SP1 SWITCHER STARTUP & BIAS ~14V ON ~22V OFF CURRENT LIMIT ON ~37V (rising) OFF ~32V (falling) HI/LO VNEG RCL HSO Figure 3. Input Lineside and Hotswap Block Diagram Rev. 1.0 9 Si3402-C 3.2.1. Rectification Diode Bridges and Surge Suppressor The IEEE 802.3 specification defines the input voltage at the RJ-45 connector of the PD with no reference to polarity. In other words, the PD must be able to accept power of either polarity at each of its inputs. This requirement necessitates the use of two sets of diode bridges, one for the CT1 and CT2 pins and one for the SP1 and SP2 pins to rectify the voltage. Furthermore, the standard requires that a PD withstand a high-voltage transient surge as defined in the IEEE 802.3 specification. Typically, the diode bridge and the surge suppressor have been implemented externally, adding cost and complexity to the PD system design. The diode bridge* and the surge suppressor have been integrated into the Si3402, thus reducing system cost and design complexity. *Note: It is recommended that the on-chip diode bridges be bypassed when input power requirements are >10 W or in thermally-constrained applications. For more information, see "AN1050: Si3402-C POE PD Controller Design Guide". When bypassing the on-chip, integrated diode bridges with external diodes, note that Schottky diodes with low forward voltage drop are required. Standard (e.g. "S1B") type diodes have high forward voltage drop and will interfere with proper device operation during the Detection cycle. Note further that, when the integrated diode bridges are bypassed, it is NOT required to make connections to CT1, CT2, SP1, or SP2. Integration of the surge suppressor enables optimization of the clamping voltage and guarantees protection of all connected circuitry. As an added benefit, the transient surge suppressor, when tripped, actively disables the hotswap interface and switching regulator, preventing downstream circuits from encountering the high-energy transients. 3.2.2. Detection In order to identify a device as a valid PD, a PSE will apply a voltage in the range of 2.8 to 10 V on the cable and look for a valid signature resistance. The Si3402 will react to voltages in this range by connecting the external 24.3 k detection resistor between VPOS and VNEG. This external resistor and internal low-leakage control circuitry create the proper signature to alert the PSE that a valid PD has been detected and is ready to have power applied. The internal hotswap switch is disabled during this time to prevent the switching regulator and attached load circuitry from generating errors in the detection signature. Since the Si3402 integrates the diode bridges, the IC compensates for the voltage and resistance effects of the diode bridges. 3.2.3. Classification Once the PSE has detected a valid PD, the PSE may classify the PD for one of five power levels or classes. A class is based on the expected power consumption of the powered device. An external resistor sets the nominal class current that can then be read by the PSE to determine the proper power requirements of the PD. When the PSE presents a fixed voltage between 15.5 V and 20.5 V to the PD, the Si3402 asserts the class current from VPOS through the RCL resistor. The resistor values associated with each class are shown in Table 7. Table 7. Class Resistor Values 10 Class Usage Peak Power Levels Nominal Class Current RCL Resistor (1%, 1/16 W) 0 Default 0.44 to 12.95 W < 4 mA > 681 (or open circuit) 1 Optional 0.44 to 3.84 W 10.5 mA 140 2 Optional 3.84 to 6.49 W 18.5 mA 75.0 3 Optional 6.49 to 12.95 W 28 mA 48.7 Rev. 1.0 Si3402-C 3.2.4. Under Voltage Lockout The Si3402 incorporates an undervoltage lockout (UVLO) circuit to monitor the line voltage and determine when to apply power to the integrated switching regulator. Before power is applied to the switching regulator, the hotswap switch output (HSO) pin is high-impedance and typically follows VPOS as the input is ramped (due to the discharged switcher supply capacitor). When the input voltage rises above the UVLO turn-off voltage (typicall 37 V), several things happen: 1. The Si3402 begins to turn on the internal hotswap power MOSFET (HSSW). 2. The switcher supply capacitor begins to charge up under the current limit control of the Si3402. 3. The HSO pin transitions from VPOS to VNEG. The Si3402 includes hysteretic UVLO circuits to maintain power to the load until the input voltage falls below the UVLO turn-on voltage (typically 32 V). Once the input voltage falls below that threshold, the HSSW is turned off (note that the switching regulator also turns off). Figure 4 provides a visual depiction of the UVLO feature. Regulator On Regulator Off UVLO OFF UVLO ON UVLO OFF UVLO ON Typical thresholds: 32V 37V PD Input Voltage Figure 4. UVLO Behavior and Threshold Voltages 3.2.5. Dual Input Current Limit and Switcher Turn-On The Si3402 implements dual input current limits. While the HSSW is charging the switcher supply capacitor, the Si3402 maintains a low current limit. The switching regulator is disabled until the voltage across the HSSW becomes sufficiently low, indicating the switcher supply capacitor is almost completely charged. When this threshold is reached, the switcher is activated, and the hotswap current limit is increased. The Si3402 stays in the high-level input current limit mode until the input voltage drops below the UVLO turn-on threshold or excessive power is dissipated in the hotswap switch. An additional feature of the current limit circuitry is current limiting in the event of a fault condition. When the current limit is switched to the higher level, 470 mA of current can be drawn by the PD. Should a fault cause more than this current to be consumed, the HSSW goes into a temporary 10 mA current limit mode and turns off the switcher. After 90 ms have elapsed, and if the switcher supply capacitor is recharged, the HSSW turns back on in the 470 mA limit mode, and enables the switcher. Rev. 1.0 11 Si3402-C 3.3. Isolated and Non-Isolated Application Topologies Power over Ethernet (PoE) applications fall into two broad categories, isolated and non-isolated. Non-isolated systems can be used when the powered device is self-contained and does not provide external conductors to the user or another application. Non-isolated applications include wireless access points and security cameras. In these applications, there is no explicit need for dc isolation between the switching regulator output and the hotswap interface. An isolated system must be used when the powered device interfaces with other self-powered equipment or has external conductors accessible to the user or other applications. For proper operation, the regulated output supply of the switching regulator must not have a dc electrical path to the hotswap interface or switching regulator primary side. Isolated applications include point-of-sale terminals where the user can touch the grounded metal chassis. The application determines the converter topology. An isolated application will require a flyback transformer-based switching topology while a non-isolated application can use an inductor-based buck converter topology. In the isolated case, dc isolation is achieved through a transformer in the forward path and a voltage reference plus optoisolator in the feedback path. The application circuit shown in Figure 2 is an example of such a topology. The nonisolated application in Figure 1 makes use of a single inductor as the energy conversion element, and the feedback signal is directly supplied into the internal error amplifier. As can be seen from the application circuits, the isolated topology has an increased number of components, thus increasing the bill of materials (BOM) and system footprint. To optimize cost and ease implementation, each application should be evaluated for its isolated or non-isolated requirements. 12 Rev. 1.0 Si3402-C 3.4. Switching Regulator Figure 5 gives a representation of the Switching Regulator. EROUT FB SWO ERROR AMPLIFIER PULSE WIDTH MODULATOR SWITCH DRIVE OSCILLATOR VREF SOFT START SWITCHER STARTUP & BIAS HSO VDD VSSA VSS2 Figure 5. Switching Regulator Block Diagram 3.4.1. Switcher Startup The switching regulator is disabled until the hotswap interface has both identified itself to the PSE and charged the supply capacitor needed to filter the switching regulator's high-current transients. Once the supply capacitor is charged, the hotswap controller engages the internal bias currents and supplies used by the switcher. Additionally, the soft-start current begins to charge the internal soft-start capacitor. Ramping this voltage slowly allows the switching regulator to bring up the regulated output voltage in a controlled manner. Controlling the initial startup of the regulated voltage restrains power dissipation in the switching FET and prevents overshoot and ringing in the output supply voltage and PD input current. 3.4.2. Switching Regulator Operation The switching regulator of the Si3402 is a constant-frequency, pulse-width-modulated controller (PWM) integrated with switching power FETs. The design is optimized for the output power range defined by the IEEE 802.3 specification. Once the hotswap interface has ensured proper turn-on of the switching regulator controller, the switcher is fully operational. An internal free-running oscillator and internal precision voltage reference are fed into the pulse-width modulator. The output of the error amplifier (either internal for non-isolated applications or external for isolated applications) is also routed into the PWM controller. The PWM controls the switching FET drive circuitry. A significant advantage of integrating the switching power FET onto the same monolithic IC as the switching regulator controller is the ability to precisely adjust the drive strength and timing, resulting in high regulator efficiency. Furthermore, current-limiting circuitry protects the switching FET. Thermal overload protection provides a secondary level of protection. The flexibility of the Si3402's switching regulator allows the system designer to realize either the isolated or nonisolated application circuitry using a single device. In operation, the integration of the switching FET allows tighter control and more efficient operation than a general-purpose switching regulator coupled with a general-purpose external FET. 3.4.3. Flyback Snubber Large voltage transients can be generated by the inductive kick associated with the leakage inductance of the primary side of the flyback transformer used in isolated applications. A snubber is necessary to limit these voltage transients. Refer to "AN1050: Si3402-C POE PD Controller Design Guide" for more information on the snubber. Rev. 1.0 13 Si3402-C 3.5. Output Voltage and Thermal Considerations The Si3402-C supports a wide range of output voltages for IEEE 802.3-compliant Class 0-3 designs. Because the Si3402-C integrates the switching FET and HSSW, the case temperature of the Si3402-C will depend heavily on the output power and the thermal relief provided in the PCB design. For a given output power, the integrated HSSW will dissipate more power when configured for lower output voltages because the current passing through it is higher. The user should closely follow the hardware design guidelines provided in "AN1050: Si3402-C POE PD Controller Design Guide" to ensure a robust PoE PD solution, particularly for low output voltage Class 3 designs. 14 Rev. 1.0 Si3402-C FB VSS2 SWO VSS1 VPOSS VSSA 4. Pin Descriptions 20 19 18 17 16 15 EROUT 1 14 CT1 SSFT* 2 13 CT2 VDD 3 12 VPOSF ISOSSFT* 4 7 8 RDET HSO RCL 9 10 SP2 6 VNEG 5 NC 11 SP1 Table 8. Si3402-C Pin Descriptions (Top View) Pin# Name 1 EROUT Error-amplifier output and PWM input; directly connected to opto-coupler in isolated application. 2 SSFT* The non-isolated soft-start function is internal on the Si3402-C. Therefore, this pin is not internally connected. 3 VDD 4 Description 5 V supply rail for switcher; provides drive for opto-coupler. ISOSSFT* The isolated soft-start function is internal on the Si3402-C. Therefore, this pin is not internally connected. 5 NC 6 RDET Not connected. Input pin for external precision detection resistor; also used for establishing absolute current reference. 7 HSO Hotswap switch output; connects to VNEG through hotswap switch. 8 RCL Input pin for external precision classification resistor; float if optional RCLASS is unused. 9, Pad VNEG 10 SP2 High-voltage supply input from spare pair; polarity-insensitive. 11 SP1 High-voltage supply input from spare pair; polarity-insensitive. 12 VPOSF 13 CT2 High-voltage supply input from center tap of Ethernet transformer; polarity-insensitive. 14 CT1 High-voltage supply input from center tap of Ethernet transformer; polarity-insensitive. 15 VSSA 16 VPOSS* 17 VSS1* This former negative supply rail pin is no longer implemented. Therefore, this pin is not internally connected. 18 SWO Switching transistor output; drain of switching N-FET. 19 VSS2 Negative supply rail for switcher; externally tied to HSO. 20 FB Rectified high-voltage supply, negative rail. Must be connected to thermal PAD node (VNEG) on package bottom. This thermal pad must be connected to VNEG (pin #9) as well as a 2 in2 heat spreader plane using a minimum of nine thermal vias. Rectified high-voltage supply, positive rail (force node) Analog ground. In new designs, VSSA can be left floating for easier PCB layout, and VSS2 used as analog ground. VSSA is internally connected to VSS2. The positive rail sense node function is no longer implemented. Therefore, this pin is not internally connected. Regulated feedback input in non-isolated application. Note: * Si3402-A legacy pin only, shown for compatibility and comparison purposes. Legacy components and connections for this pin are harmless and can be either retained or deleted. Rev. 1.0 15 Si3402-C 5. Package Outline Figure 6 illustrates the package details for the Si3402. Table 9 lists the values for the dimensions shown in the illustration. Figure 6. 20-Lead Quad Flat No-Lead Package (QFN) Table 9. Package Dimensions Dimension Min Nom Max A 0.80 0.85 0.90 A1 0.00 0.02 0.05 b 0.25 0.30 0.35 D D2 5.00 BSC. 2.60 2.70 e 0.80 BSC. E 5.00 BSC. 2.80 E2 2.60 2.70 2.80 L 0.50 0.55 0.60 L1 0.00 -- 0.10 aaa -- -- 0.10 bbb -- -- 0.10 ccc -- -- 0.08 ddd -- -- 0.10 Notes: 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. Dimensioning and tolerancing per ANSI Y14.5M-1994. 3. This drawing conforms to the JEDEC Solid State Outline MO-220, Variation VHHB-1. 16 Rev. 1.0 Si3402-C 6. Recommended Land Pattern Figure 7. Si3402 Recommended Land Pattern Table 10. PCB Land Pattern Dimensions Symbol Min Nom Max P1 2.70 2.75 2.80 P2 2.70 2.75 2.80 X1 0.25 0.30 0.35 Y1 0.90 0.95 1.00 C1 4.70 C2 4.70 E 0.80 Notes: General 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification. 3. This Land Pattern Design is based on the IPC-7351 guidelines. Solder Mask Design 4. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be 60 m minimum, all the way around the pad. Stencil Design 5. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release. 6. The stencil thickness should be 0.125 mm (5 mils). 7. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pins. 8. A 2x2 array of 1.2 mm square openings on 1.4 mm pitch should be used for the center ground pad. Card Assembly 9. A No-Clean, Type-3 solder paste is recommended. 10. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. Rev. 1.0 17 Si3402-C 7. Ordering Guide Part Number1,2 Package Temp Range Si3402-C-GM 20-pin QFN, Pb-free; RoHS compliant -40 to 85 C Notes: 1. "X" denotes product revision. 2. Add an "R" at the end of the part number to denote tape and reel option. 18 Rev. 1.0 Si3402-C 8. Device Marking Diagram Figure 8. Device Marking Diagram Table 11. Device Marking Table Line # Text Value Description 1 Si3402 Base part number. This is not the "Ordering Part Number" since it does not contain a specific revision. Refer to "7. Ordering Guide" on page 18 for complete ordering information. 2 C-GM C = Device Revision C G = Extended temperature range. M = QFN package. 3 TTTTTT Trace code (assigned by the assembly subcontractor). Circle = 20 mils Diameter Pin 1 identifier. (Bottom-Left Justified) 4 YY Assembly year. WW Assembly week. Rev. 1.0 19 Si3402-C DOCUMENT CHANGE LIST Revision 0.4 to Revision 1.0 Created Si3402-C data sheet using Si3402-B Rev 1.1 data sheet as the starting point. Removed references to PLOSS, which is not featured on Si3402-C. Added notes that Si3402-C does not require PCB connections to CT1, CT2, SP1, or SP2 when bypassing the internal diode bridge for high-power applications. 20 Rev. 1.0 Smart. Connected. Energy-Friendly. Products Quality Support and Community www.silabs.com/products www.silabs.com/quality community.silabs.com Disclaimer Silicon Labs intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or intending to use the Silicon Labs products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and "Typical" parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. 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