4-Channel, 12-/10-/8-Bit ADC with
I
2
C-Compatible Interface in 8-Lead SOT-23
Data Sheet
AD7991/AD7995/AD7999
Rev. C Document Feedback
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FEATURES
12-/10-/8-bit ADCs with fast conversion time: 1 µs typical
4 analog input channels/3 analog input channels with
reference input
Specified for VDD of 2.7 V to 5.5 V
Sequencer operation
Temperature range: −40°C to +125°C
I2C-compatible serial interface supports standard, fast,
and high speed modes
2 versions allow 2 I2C addresses
Low power consumption
Shutdown mode: 1 µA maximum
8-lead SOT-23 package
Qualified for automotive applications
APPLICATIONS
System monitoring
Battery-powered systems
Data acquisition
Medical instruments
FUNCTIONAL BLOCK DIAGRAM
I/P
MUX
SCL
SDA
GND
AD7991/AD7995/AD7999
12-/10-/8-BIT
SAR
ADC
CONTROL
LOGIC AND
I
2
C
INTERFACE
V
IN0
V
DD
06461-001
V
IN1
V
IN2
V
IN3
/V
REF
T/H
Figure 1.
GENERAL DESCRIPTION
The AD7991/AD7995/AD7999 are 12-/10-/8-bit, low power,
successive approximation ADCs with an I2C®-compatible interface.
Each part operates from a single 2.7 V to 5.5 V power supply and
features a 1 µs conversion time. The track-and-hold amplifier
allows each part to handle input frequencies of up to 14 MHz,
and a multiplexer allows taking samples from four channels.
Each AD7991/AD7995/AD7999 provides a 2-wire serial
interface compatible with I2C interfaces. The AD7991 and
AD7995 come in two versions and each version has an
individual I2C address. This allows two of the same devices to be
connected to the same I2C bus. Both versions support standard,
fast, and high speed I2C interface modes. The AD7999 comes in
one version.
The AD7991/AD7995/AD7999 normally remain in a shutdown
state, powering up only for conversions. The conversion process
is controlled by a command mode, during which each I2C read
operation initiates a conversion and returns the result over the
I2C bus.
When four channels are used as analog inputs, the reference for
the part is taken from VDD; this allows the widest dynamic input
range to the ADC. Therefore, the analog input range to the
ADC is 0 V to VDD. An external reference, applied through the
VIN3/VREF input, can also be used with this part.
PRODUCT HIGHLIGHTS
1. Four single-ended analog input channels, or three single-
ended analog input channels and one reference input channel.
2. I2C-compatible serial interface. Standard, fast, and high
speed modes.
3. Automatic shutdown.
4. Reference derived from the power supply or external
reference.
5. 8-lead SOT-23 package.
Table 1. Related Devices
Device Resolution Input Channels
AD7998
12
8
AD7997 10 8
AD7994 12 4
AD7993 10 4
AD7992 12 2
AD7991/AD7995/AD7999 Data Sheet
Rev. C | Page 2 of 27
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications ....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description ......................................................................... 1
Product Highlights ........................................................................... 1
Revision History ............................................................................... 2
Specifications ..................................................................................... 3
AD7991 .......................................................................................... 3
AD7995 .......................................................................................... 5
AD7999 .......................................................................................... 7
I2C Timing Specifications ............................................................ 9
Absolute Maximum Ratings .......................................................... 11
ESD Caution ................................................................................ 11
Pin Configuration and Function Descriptions ........................... 12
Typical Performance Characteristics ........................................... 13
Terminology .................................................................................... 16
Theory of Operation ...................................................................... 17
Converter Operation .................................................................. 17
Typical Connection Diagram ................................................... 18
Analog Input ............................................................................... 18
Internal Register Structure ............................................................ 20
Configuration Register .............................................................. 20
Sample Delay and Bit Trial Delay ............................................. 21
Conversion Result Register ....................................................... 21
Serial Interface ................................................................................ 22
Serial Bus Address ...................................................................... 22
Writing to the AD7991/AD7995/AD7999 .................................. 23
Reading from the AD7991/AD7995/AD7999 ............................ 24
Placing the AD7991/AD7995/AD7999 into High
Speed Mode ................................................................................. 25
Mode of Operation ......................................................................... 26
Outline Dimensions ....................................................................... 27
Ordering Guide .......................................................................... 27
REVISION HISTORY
7/2018—Rev. B to Rev. C
Changes to Features Section............................................................ 1
Changes to Table 4 ............................................................................ 7
Changes to Ordering Guide .......................................................... 27
Added Automotive Products Section........................................... 27
10/2010—Rev. A to Rev. B
Changes to Max Offset Error Parameter in Table 2 ..................... 3
Changes to Max Offset Error Parameter (Y Version) in Table 3 ...... 5
Changes to Max Offset Error Parameter (Y Version) in Table 4 ...... 7
Changes to Ordering Guide ..................................................................... 27
10/2009—Rev. 0 to Rev. A
Changes to Table 3 ............................................................................ 5
Changes to Table 4 ............................................................................ 7
Updated Ordering Guide ............................................................... 27
12/2007—Revision 0: Initial Version
Data Sheet AD7991/AD7995/AD7999
Rev. C | Page 3 of 27
SPECIFICATIONS
AD79911
The temperature range of the Y version is −40°C to +125°C. Unless otherwise noted, VDD = 2.7 V to 5.5 V, VREF = 2.5 V, fSCL = 3.4 MHz,
and TA = TMIN to TMAX.
Table 2.
Y Version
Parameter Min Typ Max Unit Test Conditions/Comments
DYNAMIC PERFORMANCE
2, 3
See the Sample Delay and Bit Trial Delay
section, fIN = 10 kHz sine wave for fSCL
from 1.7 MHz to 3.4 MHz
fIN = 1 kHz sine wave for fSCL up to 400 kHz
Signal-to-Noise and Distortion (SINAD)4 69.5 70 dB
Signal-to-Noise Ratio (SNR)4 70 71 dB
Total Harmonic Distortion (THD)4 −75.5 dB
Peak Harmonic or Spurious Noise (SFDR)4 −77.5 dB
Intermodulation Distortion (IMD)4 fa = 11 kHz, fb = 9 kHz for fSCL from
1.7 MHz to 3.4 MHz
fa = 5.4 kHz, fb = 4.6 kHz for fSCL up
to 400 kHz
Second-Order Terms −92 dB
Third-Order Terms −88 dB
Channel-to-Channel Isolation4 −90 dB fIN = 10 kHz
Full-Power Bandwidth4 14 MHz @ 3 dB
1.5 MHz @ 0.1 dB
DC ACCURACY2, 5
Resolution 12 Bits
Integral Nonlinearity4 ±1 LSB
LSB
Differential Nonlinearity4 ±0.9 LSB Guaranteed no missed codes to 12 bits
±0.5 LSB
Offset Error4 ±1 ±7 LSB
Offset Error Matching ±0.5 LSB
Offset Temperature Drift
ppm/°C
Gain Error4 ±2 LSB
Gain Error Matching ±0.7 LSB
Gain Temperature Drift 0.69 ppm/°C
ANALOG INPUT
Input Voltage Range 0 VREF V VREF = VIN3/VREF or VDD
DC Leakage Current ±1 µA
Input Capacitance 34 pF Channel 0 to Channel 2—during
acquisition phase
4 pF Channel 0 to Channel 2—outside
acquisition phase
35 pF Channel 3—during acquisition phase
5 pF Channel 3—outside acquisition phase
REFERENCE INPUT
VREF Input Voltage Range 1.2 VDD V
DC Leakage Current ±1 µA
VREF Input Capacitance 5 pF Outside conversion phase
pF
During conversion phase
Input Impedance 69 kΩ
AD7991/AD7995/AD7999 Data Sheet
Rev. C | Page 4 of 27
Y Version
Parameter Min Typ Max Unit Test Conditions/Comments
LOGIC INPUTS (SDA, SCL)
Input High Voltage, VINH 0.7 (VDD) V VDD = 2.7 V to 5.5 V
0.9 (VDD) V VDD = 2.35 V to 2.7 V
Input Low Voltage, VINL 0.3 (VDD) V VDD = 2.7 V to 5.5 V
0.1 (VDD) V VDD = 2.35 V to 2.7 V
Input Leakage Current, IIN ±1 µA VIN = 0 V or VDD
Input Capacitance, CIN6 10 pF
Input Hysteresis, VHYST 0.1 (VDD) V
LOGIC OUTPUTS (OPEN DRAIN)
Output Low Voltage, VOL 0.4 V ISINK = 3 mA
0.6 V ISINK = 6 mA
Floating-State Leakage Current
±1
µA
Floating-State Output Capacitance6 10 pF
Output Coding Straight (natural) binary
THROUGHPUT RATE 18 × (1/fSCL) fSCL ≤ 1.7 MHz; see the Serial Interface
section
17.5 × (1/fSCL)
+ 2 µs
fSCL > 1.7 MHz; see the Serial Interface
section
POWER REQUIREMENTS2 VREF = VDD; for fSCL = 3.4 MHz,
clock stretching is implemented
VDD 2.7 5.5 V
IDD Digital inputs = 0 V or VDD
ADC Operating, Interface Active
(Fully Operational)
0.09/0.25
mA
V
DD
= 3.3 V/5.5 V, 400 kHz f
SCL
0.25/0.8 mA VDD = 3.3 V/5.5 V, 3.4 MHz fSCL
Power-Down, Interface Active7 0.07/0.16 mA VDD = 3.3 V/5.5 V, 400 kHz fSCL
0.26/0.85 mA VDD = 3.3 V/5.5 V, 3.4 MHz fSCL
Power-Down, Interface Inactive7 1/1.6 µA VDD = 3.3 V/5.5 V
Power Dissipation
ADC Operating, Interface Active
(Fully Operational)
0.3/1.38 mW VDD = 3.3 V/5.5 V, 400 kHz fSCL
0.83/4.4 mW VDD = 3.3 V/5.5 V, 3.4 MHz fSCL
Power-Down, Interface Active
7
0.24/0.88
mW
V
DD
= 3.3 V/5.5 V, 400 kHz f
SCL
0.86/4.68 mW VDD = 3.3 V/5.5 V, 3.4 MHz fSCL
Power-Down, Interface Inactive7 3.3/8.8 µW VDD = 3.3 V/5.5 V
1 Functional from VDD = 2.35 V.
2 Sample delay and bit trial delay enabled, t1 = t2 = 0.5/fSCL.
3 For fSCL up to 400 kHz, clock stretching is not implemented. Above fSCL = 400 kHz, clock stretching is implemented.
4 See the Terminology section.
5 For fSCL ≤ 1.7 MHz, clock stretching is not implemented; for fSCL > 1.7 MHz, clock stretching is implemented.
6 Guaranteed by initial characterization.
7 See the Reading from the AD7991/AD7995/AD7999 section.
Data Sheet AD7991/AD7995/AD7999
Rev. C | Page 5 of 27
AD79951
The temperature range for the Y version is −40°C to +125°C. Unless otherwise noted, VDD = 2.7 V to 5.5 V, VREF = 2.5 V, fSCL = 3.4 MHz,
and TA = TMIN to TMAX.
Table 3.
A Version2 Y Version
Parameter Min Typ Max Min Typ Max Unit Test Conditions/Comments
DYNAMIC PERFORMANCE3, 4See the Sample Delay and Bit Trial Delay
section, fIN = 10 kHz sine wave for fSCL from
1.7 MHz to 3.4 MHz
fIN = 1 kHz sine wave for fSCL up to 400 kHz
Signal-to-Noise and
Distortion (SINAD)5
61.5 61 dB
Total Harmonic Distortion
(THD)5
−85 −75 dB
Peak Harmonic or Spurious
Noise (SFDR)5
−85 −76 dB
Intermodulation
Distortion (IMD)5
fa = 11 kHz, fb = 9 kHz for fSCL from 1.7 MHz to
3.4 MHz
fa = 5.4 kHz, fb = 4.6 kHz for fSCL up to 400 kHz
Second-Order Terms
−90
−90
dB
Third-Order Terms
−86
−86
dB
Channel-to-Channel
Isolation5
−90
−90
dB
f
IN
= 10 kHz
Full-Power Bandwidth5 14 14 MHz @ 3 dB
1.5 1.5 MHz @ 0.1 dB
DC ACCURACY3, 6
Resolution 10 10 Bits
Integral Nonlinearity5 ±0.4 ±0.4 LSB
Differential Nonlinearity5 ±0.4 ±0.4 LSB Guaranteed no missed codes to 10 bits
Offset Error5 ±1 ±2.25 LSB
Offset Error Matching ±0.04 ±0.2 LSB
Offset Temperature Drift 4.13 4.13 ppm/°C
Gain Error5 ±0.15 ±0.5 LSB
Gain Error Matching ±0.06 ±0.25 LSB
Gain Temperature Drift 0.50 0.50 ppm/°C
ANALOG INPUT
Input Voltage Range 0 VREF 0 VREF V VREF = VIN3/VREF or VDD
DC Leakage Current ±1 ±1 µA
Input Capacitance 34 34 pF Channel 0 to Channel 2—during acquisition
phase
4 4 pF Channel 0 to Channel 2—outside acquisition
phase
35 35 pF Channel 3—during acquisition phase
5 5 pF Channel 3—outside acquisition phase
REFERENCE INPUT
VREF Input Voltage Range 1.2 VDD 1.2 VDD V
DC Leakage Current ±1 ±1 µA
VREF Input Capacitance 5 5 pF Outside conversion phase
35 35 pF During conversion phase
Input Impedance 69 69 kΩ
AD7991/AD7995/AD7999 Data Sheet
Rev. C | Page 6 of 27
A Version2 Y Version
Parameter Min Typ Max Min Typ Max Unit Test Conditions/Comments
LOGIC INPUTS (SDA, SCL)
Input High Voltage, VINH 0.7 (VDD) 0.7 (VDD) V VDD = 2.7 V to 5.5 V
0.9 (VDD) V VDD = 2.35 V to 2.7 V
Input Low Voltage, VINL 0.3 (VDD) 0.3 (VDD) V VDD = 2.7 V to 5.5 V
0.1 (VDD) V VDD = 2.35 V to 2.7 V
Input Leakage Current, IIN ±1 ±1 µA VIN = 0 V or VDD
Input Capacitance, CIN7 10 10 pF
Input Hysteresis, VHYST 0.1 (VDD) 0.1 (VDD) V
LOGIC OUTPUTS (OPEN
DRAIN)
Output Low Voltage, VOL 0.4 0.4 V ISINK = 3 mA
0.6 0.6 V ISINK = 6 mA
Floating-State Leakage
Current
±1 ±1 µA
Floating-State Output
Capacitance7
10 10 pF
Output Coding Straight (natural) binary Straight (natural) binary
THROUGHPUT RATE 18 × (1/fSCL) 18 × (1/fSCL) fSCL ≤ 1.7 MHz; see the Serial Interface section
17.5 × (1/f
SCL
) +
2 µs
17.5 × (1/f
SCL
) +
2 µs
fSCL > 1.7 MHz; see the Serial Interface section
POWER REQUIREMENTS3 VREF = VDD; for fSCL = 3.4 MHz,
clock stretching is implemented
VDD 2.7 5.5 2.7 5.5 V
IDD Digital inputs = 0 V or VDD
ADC Operating,
Interface Active
(Fully Operational)
0.09/0.25 mA VDD = 3.3 V/5.5 V, 400 kHz fSCL
0.25 0.25/0.8 mA VDD = 3.3 V/5.5 V, 3.4 MHz fSCL
Power-Down, Interface
Active8
0.07/0.16 mA VDD = 3.3 V/5.5 V, 400 kHz fSCL
0.26
0.26/0.85
mA
V
DD
= 3.3 V/5.5 V, 3.4 MHz f
SCL
Power-Down, Interface
Inactive8
1 1/1.6 µA VDD = 3.3 V/5.5 V
Power Dissipation
ADC Operating,
Interface Active
(Fully Operational)
0.3/1.38 mW VDD = 3.3 V/5.5 V, 400 kHz fSCL
0.83 0.83/4.4 mW VDD = 3.3 V/5.5 V, 3.4 MHz fSCL
Power-Down, Interface
Active8
0.24/0.88 mW VDD = 3.3 V/5.5 V, 400 kHz fSCL
0.86 0.86/4.68 mW VDD = 3.3 V/5.5 V, 3.4 MHz fSCL
Power-Down, Interface
Inactive8
3.3
3.3/8.8
µW
V
DD
= 3.3 V/5.5 V
1 Functional from VDD = 2.35 V.
2 A Version tested at VDD = 3.3 V and fSCL = 3.4 MHz. Functionality tested at fSCL = 400 kHz.
3 Sample delay and bit trial delay enabled, t1 = t2 = 0.5/fSCL.
4 For fSCL up to 400 kHz, clock stretching is not implemented. Above fSCL = 400 kHz, clock stretching is implemented.
5 See the Terminology section.
6 For fSCL ≤ 1.7 MHz, clock stretching is not implemented; for fSCL > 1.7 MHz, clock stretching is implemented.
7 Guaranteed by initial characterization.
8 See the Reading from the AD7991/AD7995/AD7999 section.
Data Sheet AD7991/AD7995/AD7999
Rev. C | Page 7 of 27
AD79991
The temperature range for the Y version is −40°C to +125°C. Unless otherwise noted, VDD = 2.7 V to 5.5 V, VREF = 2.5 V, fSCL = 3.4 MHz,
and TA = TMIN to TMAX.
Table 4.
Y Version W Version
Parameter Min Typ Max Min Typ Max Unit Test Conditions/Comments
DYNAMIC PERFORMANCE2, 3 See the Sample Delay and Bit Trial
Delay section,
fIN = 10 kHz sine wave for fSCL from 1.7 MHz
to 3.4 MHz
fIN = 1 kHz sine wave for fSCL up to 400 kHz
Signal-to-Noise and Distortion
(SINAD)4
49.5 49.5 dB
Total Harmonic Distortion (THD)5 −65 −65 dB
Peak Harmonic or Spurious Noise
(SFDR)5
−65 −65 dB
Intermodulation Distortion (IMD)5 fa = 11 kHz, fb = 9 kHz for fSCL from
1.7 MHz to 3.4 MHz
fa = 5.4 kHz, fb = 4.6 kHz for fSCL up to
400 kHz
Second-Order Terms −83 −83 dB
Third-Order Terms −75 −75 dB
Channel-to-Channel Isolation5 −90 −90 dB fIN = 10 kHz
Full-Power Bandwidth5 14 14 MHz @ 3 dB
1.5 1.5 MHz @ 0.1 dB
DC ACCURACY3, 5
Resolution 8 8 Bits
Integral Nonlinearity5 ±0.1 ±0.15 LSB
Differential Nonlinearity5 ±0.1 ±0.13 LSB Guaranteed no missed codes to eight
bits
Offset Error5 ±0.5 ±0.65 LSB
Offset Error Matching ±0.05 ±0.07 LSB
Offset Temperature Drift 4.26 4.26 ppm/°C
Gain Error5 ±0.175 ±0.175 LSB
Gain Error Matching ±0.06 ±0.07 LSB
Gain Temperature Drift 0.59 0.59 ppm/°C
ANALOG INPUT
Input Voltage Range 0 VREF 0 VREF V VREF = VIN3/VREF or VDD
DC Leakage Current ±1 ±1 µA
Input Capacitance 34 34 pF Channel 0 to Channel 2 during
acquisition phase
4 4 pF Channel 0 to Channel 2 outside
acquisition phase
35 35 pF Channel 3 during acquisition phase
5
5
pF
Channel 3 outside acquisition phase
REFERENCE INPUT
VREF Input Voltage Range 1.2 VDD 1.2 VDD V
DC Leakage Current ±1 ±1 µA
VREF Input Capacitance 5 5 pF Outside conversion phase
35 35 pF During conversion phase
Input Impedance 69 69 kΩ
AD7991/AD7995/AD7999 Data Sheet
Rev. C | Page 8 of 27
Y Version W Version
Parameter Min Typ Max Min Typ Max Unit Test Conditions/Comments
LOGIC INPUTS (SDA, SCL)
Input High Voltage, VINH 0.7 ×
VDD
0.7 ×
VDD
V VDD = 2.7 V to 5.5 V
0.9 ×
VDD
0.9 ×
VDD
V VDD = 2.35 V to 2.7 V
Input Low Voltage, VINL 0.3 × VDD 0.3 × VDD V VDD = 2.7 V to 5.5 V
0.1 × VDD 0.1 × VDD V VDD = 2.35 V to 2.7 V
Input Leakage Current, IIN ±1 ±1 µA VIN = 0 V or VDD
Input Capacitance, CIN6 10 10 pF
Input Hysteresis, VHYST 0.1 ×
VDD
0.1 ×
VDD
LOGIC OUTPUTS (OPEN DRAIN)
Output Low Voltage, VOL 0.4 0.4 V ISINK = 3 mA
0.6 0.6 V ISINK = 6 mA
Floating-State Leakage Current ±1 ±1 µA
Floating-State Output
Capacitance7
10 10 pF
Output Coding Straight (natural) binary Straight (natural) binary
THROUGHPUT RATE 18 × (1/fSCL) 18 ×
(1/fSCL)
fSCL ≤ 1.7 MHz; see the Serial Interface
section
17.5 × (1/fSCL)
+ 2 µs
17.5 ×
(1/fSCL) +
2 µs
fSCL > 1.7 MHz; see the Serial Interface
section
POWER REQUIREMENTS3 VREF = VDD; for fSCL = 3.4 MHz, clock
stretching is implemented
VDD 2.7 5.5 2.7 5.5 V
IDD Digital inputs = 0 V or VDD
ADC Operating, Interface
Active (Fully Operational)
0.09/0.25 0.1/0.25 mA VDD = 3.3 V/5.5 V, 400 kHz fSCL
0.25/0.8 0.28/0.88 mA VDD = 3.3 V/5.5 V, 3.4 MHz fSCL
Power-Down, Interface Active7 0.07/0.16 0.07/0.18 mA VDD = 3.3 V/5.5 V, 400 kHz fSCL
0.26/0.85 0.3/0.96 mA VDD = 3.3 V/5.5 V, 3.4 MHz fSCL
Power-Down, Interface
Inactive8
1/1.6 1/2 µA VDD = 3.3 V/5.5 V
Power Dissipation 0.3/1.38 0.33/1.38 mW VDD = 3.3 V/5.5 V, 400 kHz fSCL
ADC Operating Interface Active
(Fully Operational)
0.83/4.4 0.924/4.84 mW VDD = 3.3 V/5.5 V, 3.4 MHz fSCL
Power-Down, Interface Active8 0.24/0.88 0.24/0.99 mW VDD = 3.3 V/5.5 V, 400 kHz fSCL
0.86/4.68 0.99/5.28 mW VDD = 3.3 V/5.5 V, 3.4 MHz fSCL
Power-Down, Interface
Inactive8
3.3/8.8 3.3/11 µW VDD = 3.3 V/5.5 V
1 Functional from VDD = 2.35 V.
2 Sample delay and bit trial delay enabled, t1 = t2 = 0.5/fSCL.
3 For fSCL up to 400 kHz, clock stretching is not implemented. Above fSCL = 400 kHz, clock stretching is implemented.
4 See the Terminology section.
5 For fSCL ≤ 1.7 MHz, clock stretching is not implemented; for fSCL > 1.7 MHz, clock stretching is implemented.
6 Guaranteed by initial characterization.
7 See the Reading from the AD7991/AD7995/AD7999 section.
Data Sheet AD7991/AD7995/AD7999
Rev. C | Page 9 of 27
I2C TIMING SPECIFICATIONS
Guaranteed by initial characterization. All values were measured with the input filtering enabled. CB refers to the capacitive load on the bus line,
with tr and tf measured between 0.3 VDD and 0.7 VDD (see Figure 2). Unless otherwise noted, VDD = 2.7 V to 5.5 V and TA = TMIN to TMAX.
Table 5.
Limit at tMIN, tMAX
Parameter Conditions Min Typ Max Unit Description
fSCL1 Standard mode 100 kHz Serial clock frequency
Fast mode 400 kHz
High speed mode
CB = 100 pF maximum 3.4 MHz
CB = 400 pF maximum 1.7 MHz
t
11
Standard mode
4
µs
t
HIGH
, SCL high time
Fast mode 0.6 µs
High speed mode
CB = 100 pF maximum 60 ns
CB = 400 pF maximum 120 ns
t21 Standard mode 4.7 µs tLOW, SCL low time
Fast mode 1.3 µs
High speed mode
CB = 100 pF maximum 160 ns
CB = 400 pF maximum 320 ns
t31 Standard mode 250 ns tSU ;DAT, data setup time
Fast mode 100 ns
High speed mode 10 ns
t
41, 2
Standard mode
0
3.45
µs
t
HD ;DAT
, data hold time
Fast mode 0 0.9 µs
High Speed mode
CB = 100 pF maximum 0 703 ns
CB = 400 pF maximum 0 150 ns
t51 Standard mode 4.7 µs tSU;STA, setup time for a repeated start condition
Fast mode 0.6 µs
High Speed mode 160 ns
t61 Standard mode 4 µs tHD;STA, hold time for a repeated start condition
Fast mode 0.6 µs
High speed mode 160 ns
t71 Standard mode 4.7 µs tBUF, bus-free time between a stop and a start condition
Fast mode 1.3 µs
t81 Standard mode 4 µs tSU;STO, setup time for a stop condition
Fast mode 0.6 µs
High speed mode 160 ns
t9 Standard mode 1000 ns tRDA, rise time of the SDA signal
Fast mode 20 + 0.1 CB 300 ns
High speed mode
CB = 100 pF maximum 10 80 ns
CB = 400 pF maximum 20 160 ns
AD7991/AD7995/AD7999 Data Sheet
Rev. C | Page 10 of 27
Limit at tMIN, tMAX
Parameter Conditions Min Typ Max Unit Description
t10 Standard mode 300 ns tFDA, fall time of the SDA signal
Fast mode 20 + 0.1 CB 300 ns
High speed mode
CB = 100 pF maximum 10 80 ns
CB = 400 pF maximum 20 160 ns
t11 Standard mode 1000 ns tRCL, rise time of the SCL signal
Fast mode 20 + 0.1 CB 300 ns
High speed mode
CB = 100 pF maximum 10 40 ns
CB = 400 pF maximum 20 80 ns
t11A Standard mode 1000 ns tRCL1, rise time of the SCL signal after a repeated
start condition and after an acknowledge bit
Fast mode 20 + 0.1 CB 300 ns
High speed mode
CB = 100 pF maximum 10 80 ns
CB = 400 pF maximum 20 160 ns
t12 Standard mode 300 ns tFCL, fall time of the SCL signal
Fast mode 20 + 0.1 CB 300 ns
High speed mode
CB = 100 pF maximum 10 40 ns
CB = 400 pF maximum 20 80 ns
tSP1 Fast mode 0 50 ns Pulse width of the suppressed spike
High speed mode 0 10 ns
tPOWER-UP 0.6 µs Power-up and acquisition time
1 Functionality is tested during production.
2 A device must provide a data hold time for SDA in order to bridge the undefined region of the SCL falling edge.
3 For 3 V supplies, the maximum hold time with CB = 100 pF maximum is 100 ns maximum.
t6
t7
t2
t11
t4t1
t12
t10
t5
t9
t6
t3t8
06461-002
SCL
S
SDA
S = START CONDITION
P = STOP CONDITION
P PS
Figure 2. 2-Wire Serial Interface Timing Diagram
Data Sheet AD7991/AD7995/AD7999
Rev. C | Page 11 of 27
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 6.
Parameter Rating
VDD to GND −0.3 V to 7 V
Analog Input Voltage to GND −0.3 V to VDD + 0.3 V
Reference Input Voltage to GND −0.3 V to VDD + 0.3 V
Digital Input Voltage to GND −0.3 V to +7 V
Digital Output Voltage to GND −0.3 V to VDD + 0.3 V
Input Current to Any Pin Except Supplies1 ±10 mA
Operating Temperature Ranges
Industrial (Y Version) Temperature Range −40°C to +125°C
Storage Temperature Range −65°C to +150°C
Junction Temperature 150°C
8-Lead SOT-23 Package
θJA Thermal Impedance 170°C/W
θJC Thermal Impedance 90°C/W
RoHS Compliant Temperature,
Soldering Reflow
260 + 0°C
ESD 1 kV
1 Transient currents of up to 100 mA do not cause SCR latch-up.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
ESD CAUTION
AD7991/AD7995/AD7999 Data Sheet
Rev. C | Page 12 of 27
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
06461-003
SCL
1
SDA
2
V
IN0 3
V
IN1 4
V
DD
8
GND
7
V
IN3
/V
REF
6
V
IN2
5
AD7991/
AD7995/
AD7999
TOP VIEW
(No t t o Scal e)
Figure 3. SOT-23 Pin Configuration
Table 7. Pin Function Descriptions
Pin
No. Mnemonic Description
1 SCL Digital Input. Serial bus clock. External pull-up resistor required.
2 SDA Digital I/O. Serial bus bidirectional data. Open-drain output. External pull-up resistor required.
3 VIN0 Analog Input 1. Single-ended analog input channel. The input range is 0 V to VREF.
4 VIN1 Analog Input 2. Single-ended analog input channel. The input range is 0 V to VREF.
5 VIN2 Analog Input 3. Single-ended analog input channel. The input range is 0 V to VREF.
6 VIN3/VREF Analog Input 4. Single-ended analog input channel. The input range is 0 V to VREF. Can also be used to input an
external VREF signal.
7 GND Analog Ground. Ground reference point for all circuitry on the AD7991/AD7995/AD7999. All analog input signals
should be referred to this AGND voltage.
8 VDD Power Supply Input. The VDD range for the AD7991/AD7995/AD7999 is from 2.7 V to 5.5 V.
Table 8. I2C Address Selection
Part Number I2C Address
AD7991-0 010 1000
AD7991-1 010 1001
AD7995-0 010 1000
AD7995-1 010 1001
AD7999-1 010 1001
Data Sheet AD7991/AD7995/AD7999
Rev. C | Page 13 of 27
TYPICAL PERFORMANCE CHARACTERISTICS
DNL ERRO R ( LSB)
CODE
0500 1000 1500 2000 2500 3000 3500 4000
–1.0
–0.8
–0.6
–0.4
–0.2
0
0.2
0.4
0.6
0.8
1.0 V
DD
= 2.7V
V
REF
= 2.35V
f
SCL
= 1.7M Hz
06461-005
Figure 4. DNL Error, VDD = 2.7 V, VREF = 2.35 V, fSCL = 1.7 MHz
Without Clock Stretching
INL ERROR ( LSB)
CODE
0500 1000 1500 2000 2500 3000 3500 4000
–1.0
–0.8
–0.6
–0.4
–0.2
0
0.2
0.4
0.6
0.8
1.0
V
DD
= 2.7V
V
REF
= 2.35V
f
SCL
= 1.7M Hz
06461-006
Figure 5. INL Error, VDD = 2.7 V, VREF = 2.35 V, fSCL = 1.7 MHz
Without Clock Stretching
12.0
8.0 0 6
REFERENCE VOLTAGE (V)
ENOB ( Bits)
SINAD ( dB)
11.5
11.0
10.5
10.0
9.5
9.0
8.5
1 2 3 4 5 60
62
64
66
68
70
72
74
ENOB V
DD
= 3V
ENOB V
DD
= 5V
SINAD V
DD
= 5V
SINAD V
DD
= 3V
06461-036
Figure 6. ENOB/SINAD vs. Reference Voltage, fSCL = 1.7 MHz
Without Clock Stretching
1.0
–1.0
1.2
REFERENCE VOLTAGE (V)
INL E RROR (LSB)
0.8
0.6
0.4
0.2
0
–0.2
–0.4
–0.6
–0.8
1.7 2.2 2.7 3.2 3.7 4.2 4.7
NEGATIVE INL
POSITIVE INL
06461-033
Figure 7. INL Error vs. Reference Voltage , fSCL = 1.7 MHz
Without Clock Stretching
1.0
–1.0
1.2
REFERENCE VOLTAGE (V)
DNL ERROR (LSB)
0.8
0.6
0.4
0.2
0
–0.2
–0.4
–0.6
–0.8
1.7 2.2 2.7 3.2 3.7 4.2 4.7
NEGATI V E DNL
POSITI VE DNL
06461-037
Figure 8. DNL Error vs. Reference Voltage, fSCL = 1.7 MHz
Without Clock Stretching
INL ERROR ( LSB)
CODE
0500 1000 1500 2000 2500 3000 3500 4000
–1.0
–0.8
–0.6
–0.4
–0.2
0
0.2
0.4
0.6
0.8
1.0
06461-013
V
DD
= 5V
V
REF
= 2.5V
f
SCL
= 1.7M Hz
Figure 9. INL Error, VDD = 5 V, VREF = 2.5 V, fSCL = 1.7 MHz
Without Clock Stretching
AD7991/AD7995/AD7999 Data Sheet
Rev. C | Page 14 of 27
DNL ERRO R ( LSB)
CODE
0500 1000 1500 2000 2500 3000 3500 4000
–1.0
–0.8
–0.6
–0.4
–0.2
0
0.2
0.4
0.6
0.8
1.0
06461-014
V
DD
= 5V
V
REF
= 2.5V
f
SCL
= 1.7M Hz
Figure 10. DNL Error, VDD = 5 V, VREF = 2.5 V, fSCL = 1.7 MHz
Without Clock Stretching
800
02 6
VDD (V)
IDD (μA)
345
f
SCL = 1. 7M Hz
+125°C
+85°C
+25°C
–40°C
600
400
200
06461-035
Figure 11. IDD Supply Current vs. Supply Voltage, fSCL = 1.7 MHz
Without Clock Stretching, −40°C to +125°C
1000
02 6
V
DD
(V)
I
DD
(μA)
800
600
400
200
345
f
SCL
= 3.4M Hz +125°C
+85°C
+25°C
–40°C
06461-034
Figure 12. IDD Supply Current vs. Supply Voltage, f SCL = 3.4 MHz
with Clock Stretching, −40°C to +125°C
–70
–100 1100
INPUT F RE QUENCY ( kHz )
THD ( dB)
–80
–90
f
SCL
= 1.7M Hz
06461-031
10
V
DD
= 5V
V
DD
= 3V
Figure 13. THD vs. Input Frequency, VREF = 2.5 V, fSCL = 1.7 MHz
Without Clock Stretching
CHANNEL-TO-CHANNEL ISOLATION (dB)
f
NOISE (kHz)
VDD = 3V
VDD = 5V
VREF = VDD
f
SCL = 1. 7M Hz
TEMPERAT URE = TA
89
90
91
92
93
94
95
96
010 20 30 40 50 60 70 80 90 100
06461-017
Figure 14. AD7991 Channel-to-Channel Isolation , fSCL = 1.7 MHz
Without Clock Stretching
–120
–100
–80
–60
–40
–20
0
0246810
SINAD ( dB)
FREQUENCY (kHz)
06461-018
16384 POINT FFT
f
S
= 22.5kS P S
f
SCL
= 405kHz
f
IN
= 5.13kHz
SNR = 71. 83dB
SINAD = 71.39d B
THD = –81.26d B
SFDR = –93.71d B
Figure 15. Dynamic Performance, fSCL = 405 kHz
Without Clock Stretching, VDD = 5 V, Full-Scale Input,
Seven-Term Blackman-Harris Window
Data Sheet AD7991/AD7995/AD7999
Rev. C | Page 15 of 27
–120
–100
–80
–60
–40
–20
0
0 5 10 15 20 25 30 35 40 45
SINAD ( dB)
FREQUENCY (kHz)
06461-019
16384 POINT FFT
fS = 95kSPS
fSCL = 1. 71M Hz
fIN = 10.13kHz
SNR = 71. 77dB
SINAD = 71.45d B
THD = –82.43d B
SFDR = –95.02d B
Figure 16. Dynamic Performance, fSCL = 1.71 MHz
Without Clock Stretching, VDD = 5 V, Full-Scale Input,
Seven-Term Blackman-Harris Window
06461-032
3
00
SCL FREQUENCY ( kHz )
POWER (mW)
500 1000 1500
2
1
V
DD
= 5V
V
DD
= 3V
Figure 17. Power vs. SCL Frequency, VREF = 2.5 V
AD7991/AD7995/AD7999 Data Sheet
Rev. C | Page 16 of 27
TERMINOLOGY
Signal-to-Noise and Distortion (SINAD) Ratio
The measured ratio of signal-to-noise and distortion at the output
of the ADC. The signal is the rms amplitude of the fundamental.
Noise is the sum of the nonfundamental signals excluding dc,
up to half the sampling frequency (fS/2). The ratio is dependent
on the number of quantization levels in the digitization process:
the more levels, the smaller the quantization noise. The theoretical
SINAD ratio for an ideal N-bit converter with a sine wave input
is given by
Signal-to-(Noise + Distortion) = (6.02 N + 1.76) dB
Therefore, SINAD is 49.92 dB for an 8-bit converter, 61.96 dB
for a 10-bit converter, and 74 dB for a 12-bit converter.
Total Harmonic Distortion (THD)
The ratio of the rms sum of harmonics to the fundamental. For
the AD7991/AD7995/AD7999, it is defined as
1
65432
V
VVVVV
THD
22222
log20)dB(++++
=
where:
V1 is the rms amplitude of the fundamental.
V2, V3, V4, V5, and V6 are the rms amplitudes of the second
through sixth harmonics.
Peak Harmonic or Spurious Noise
The ratio of the rms value of the next largest component in the
ADC output spectrum (up to fS/2 and excluding dc) to the rms
value of the fundamental. Typically, the value of this specification
is determined by the largest harmonic in the spectrum, but for
ADCs where the harmonics are buried in the noise floor, the
largest harmonic may be a noise peak.
Intermodulation Distortion
With inputs consisting of sine waves at two frequencies, fa
and fb, any active device with nonlinearities creates distortion
products at sum and difference frequencies of mfa ± nfb, where
m, n = 0, 1, 2, 3, and so on. Intermodulation distortion terms
are those for which neither m nor n equals 0. For example,
second-order terms include (fa + fb) and (fa − fb), and
third-order terms include (2fa + fb), (2fa − fb), (fa + 2fb), and
(fa − 2fb).
The AD7991/AD7995/AD7999 are tested using the CCIF standard,
where two input frequencies near the maximum input bandwidth
are used. In this case, the second-order terms are usually distanced
in frequency from the original sine waves, and the third-order
terms are usually at a frequency close to the input frequencies. As a
result, the second- and third-order terms are specified separately.
The calculation of intermodulation distortion is, like the THD
specification, the ratio of the rms sum of the individual distortion
products to the rms amplitude of the sum of the fundamentals,
expressed in decibels.
Channel-to-Channel Isolation
Channel-to-channel isolation is a measure of the level of
crosstalk between any two channels. It is measured by applying
a full-scale sine wave signal to all unselected input channels and
then determining the degree to which the signal attenuates in
the selected channel with a 10 kHz signal. The frequency of the
signal in each of the unselected channels is increased from 2 kHz
up to 92 kHz. Figure 14 shows the worst-case across all four
channels for the AD7991.
Full-Power Bandwidth
The input frequency at which the amplitude of the reconstructed
fundamental is reduced by 0.1 dB or 3 dB for a full-scale input.
Integral Nonlinearity
The maximum deviation from a straight line passing through
the endpoints of the ADC transfer function. The endpoints are
at zero scale (a point 1 LSB below the first code transition) and
full scale (a point 1 LSB above the last code transition).
Differential Nonlinearity
The difference between the measured and the ideal 1 LSB
change between any two adjacent codes in the ADC.
Offset Error
The deviation of the first code transition (00 … 000 to
00 … 001) from the ideal—that is, AGND + 1 LSB.
Offset Error Match
The difference in offset error between any two channels.
Gain Error
The deviation of the last code transition (111 … 110 to
111 … 111) from the ideal (that is, VREF − 1 LSB) after
the offset error has been adjusted out.
Gain Error Match
The difference in gain error between any two channels.
Data Sheet AD7991/AD7995/AD7999
Rev. C | Page 17 of 27
THEORY OF OPERATION
The AD7991/AD7995/AD7999 are low power, 12-/10-/8-bit,
single-supply, 4-channel ADCs. Each part can be operated from
a single 2.35 V to 5.5 V supply.
The AD7991/AD7995/AD7999 provide the user with a 4-channel
multiplexer, an on-chip track-and-hold, an ADC, and an I2C-
compatible serial interface, all housed in an 8-lead SOT-23 package
that offers the user considerable space-saving advantages over
alternative solutions.
The AD7991/AD7995/AD7999 normally remains in a power-
down state while not converting. Therefore, when supplies are
first applied, the part is in a power-down state. Power-up is initiated
prior to a conversion, and the device returns to the power-down
state upon completion of the conversion. This automatic power-
down feature allows the device to save power between conversions.
This means any read or write operations across the I2C interface
can occur while the device is in power-down.
CONVERTER OPERATION
The AD7991/AD7995/AD7999 are successive approximation
ADCs built around a capacitive DAC. Figure 18 and Figure 19
show simplified schematics of the ADC during its acquisition
and conversion phases, respectively. Figure 18 shows the ADC
during its acquisition phase: SW2 is closed, SW1 is in Position A,
the comparator is held in a balanced condition, and the sampling
capacitor acquires the signal on VIN. The source driving the
analog input needs to settle the analog input signal to within
one LSB in 0.6 μs, which is equivalent to the duration of the
power-up and acquisition time.
06461-020
CAPACITIVE
DAC
VIN
COMPARATOR
CONTROL
LOGIC
SW1
A
BSW2
AGND
Figure 18. ADC Acquisition Phase
When the ADC starts a conversion, as shown in Figure 19, SW2
opens and SW1 moves to Position B, causing the comparator to
become unbalanced. The input is disconnected when the con-
version begins. The control logic and the capacitive DAC are used
to add and subtract fixed amounts of charge from the sampling
capacitor to bring the comparator back into a balanced condition.
When the comparator is rebalanced, the conversion is complete.
The control logic generates the ADC output code. Figure 20 shows
the ADC transfer function.
06461-021
V
IN
COMPARATOR
CONTROL
LOGIC
SW1
A
BSW2
AGND
CAPACITIVE
DAC
Figure 19. ADC Conversion Phase
ADC Transfer Function
The output coding of the AD7991/AD7995/AD7999 is straight
binary. The designed code transitions occur at successive integer
LSB values (that is, 1 LSB, 2 LSB, and so on). The LSB size for
the AD7991/AD7995/AD7999 is VREF/4096, VREF/1024, and
VREF/256, respectively. Figure 20 shows the ideal transfer
characteristics for the AD7991/AD7995/AD7999.
111 ... 111
111 ... 110
111 ... 000
ADC CODE
AGND + 1 LSB
ANALO G INPUT
0V TO REF
IN
AD7991 1 LS B = RE F
IN
/4096
AD7995 1 LS B = RE F
IN
/1024
AD7999 1 LS B = RE F
IN
/256
+REF
IN
– 1 LS B
011 ... 111
000 ... 010
000 ... 001
000 ... 000
06461-022
Figure 20. AD7991/AD7995/AD7999 Transfer Characteristics
AD7991/AD7995/AD7999 Data Sheet
Rev. C | Page 18 of 27
TYPICAL CONNECTION DIAGRAM
Figure 22 shows the typical connection diagram for the
AD7991/AD7995/AD7999.
The reference voltage can be taken from the supply voltage,
VDD. However, the AD7991/AD7995/AD7999 can be configured
to be a 3-channel device with the reference voltage applied to
the VIN3/VREF pin. In this case, a 1 F decoupling capacitor on
the VIN3/VREF pin is recommended.
SDA and SCL form the 2-wire I2C compatible interface. External
pull-up resistors are required for both the SDA and SCL lines.
The AD7991-0/AD7995-0 and the AD7991-1/AD7995-1/
AD7999-1 support standard, fast, and high speed I2C interface
modes. Both the -0 and -1 devices have independent I2C addresses,
which allows the devices to connect to the same I2C bus without
contention issues.
The part requires approximately 0.6 µs to wake up from power-
down and to acquire the analog input. Once the acquisition
phase ends, the conversion phase starts and takes approximately
1 µs to complete. The AD7991/AD7995/AD7999 enters
shutdown mode after each conversion, which is useful in
applications where power consumption is a concern.
ANALOG INPUT
Figure 21 shows an equivalent circuit of the AD7991/AD7995/
AD7999 analog input structure. The two diodes, D1 and D2,
provide ESD protection for the analog inputs. Care must be taken
to ensure that the analog input signal does not exceed the supply
rails by more than 300 mV. If the signal does exceed this level,
the diodes become forward-biased and start conducting current
into the substrate. Each diode can conduct a maximum current
of 10 mA without causing irreversible damage to the part.
06461-023
V
IN
D1
V
DD
D2
R1
C2
30pF
C1
4pF
CONVERSION PHASE—SWITCH OPEN
TRACK PHASE—SW ITCH CLOS E D
Figure 21. Equivalent Analog Input Circuit
Capacitor C1 in Figure 21 is typically about 4 pF and can
primarily be attributed to pin capacitance. Resistor R1 is a
lumped component composed of the on resistance (RON) of
both a track-and-hold switch and the input multiplexer. The
total resistor is typically about 400 Ω. Capacitor C2, the ADC
sampling capacitor, has a typical capacitance of 30 pF.
V
IN0
R
P
R
P
V
DD
5V SU PPLY
10µF 0.1µF
MICROCONTROLLER/
MICROPROCESSOR
2-WIRE SERIAL
INTERFACE
GND
AD7991/
AD7995/
AD7999
SDA
SCL
06461-024
V
IN1
V
IN2
V
IN3
/V
REF
++
Figure 22. AD7991/AD7995/AD7999 Typical Connection Diagram
Data Sheet AD7991/AD7995/AD7999
Rev. C | Page 19 of 27
For ac applications, removing high frequency components from
the analog input signal is recommended by use of an RC band-
pass filter on the relevant analog input pin. In applications
where harmonic distortion and signal-to-noise ratio are critical,
the analog input should be driven from a low impedance
source. Large source impedances significantly affect the ac
performance of the ADC. This may necessitate the use of an
input buffer amplifier. The choice of the op amp is a function
of the particular application.
When no amplifier is used to drive the analog input, the source
impedance should be limited to low values. The maximum
source impedance depends on the amount of THD that can be
tolerated. THD increases as the source impedance increases and
performance degrades. Figure 23 shows the THD vs. the analog
input signal frequency for different source impedances at a
supply voltage of 5 V.
56Ω
5.1kΩ
2kΩ
1.3kΩ
240Ω
110 100
ANALO G I NP UT FRE QUENCY ( kHz )
–100
–90
–80
–70
–60
–50
–40
–30
–20
–10
0
THD ( dB)
VDD = 5V
VREF = VDD
TEMPERATURE = TA
fSCL = 1. 7M Hz
06461-025
Figure 23. THD vs. Analog Input Frequency for Various Source Impedances
for VDD = 5 V, fSCL = 1.7 MHz Without Clock Stretching
AD7991/AD7995/AD7999 Data Sheet
Rev. C | Page 20 of 27
INTERNAL REGISTER STRUCTURE
CONFIGURATION REGISTER
The configuration register is an 8-bit write-only register that is used to set the operating modes of the AD7991/AD7995/AD7999. The bit
functions are outlined in Table 10. A single-byte write is necessary when writing to the configuration register. D7 is the MSB. When the
master writes to the AD7991/AD7995/AD7999, the first byte is written to the configuration register.
Table 9. Configuration Register Bit Map and Default Settings at Power-Up
D7
D6
D5
D4
D3
D2
D1
D0
CH3 CH2 CH1 CH0 REF_SEL FLTR Bit trial delay Sample delay
1 1 1 1 0 0 0 0
Table 10. Bit Function Descriptions
Bit Mnemonic Comment
D7 to D4 CH3 to CH0 These four channel address bits select the analog input channel(s) to be converted. If a channel address bit
(Bit D7 to Bit D4) is set to 1, a channel is selected for conversion. If more than one channel bit is set to 1, the
AD7991/AD7995/AD7999 sequence through the selected channels, starting with the lowest channel. All
unused channels should be set to 0. Table 11 shows how these four channel address bits are decoded. Prior
to the device initiating a conversion, the channel(s) must be selected in the configuration register.
D3 REF_SEL This bit allows the user to select the supply voltage as the reference or choose to use an external reference. If
this bit is 0, the supply is used as the reference, and the device acts as a 4-channel input part. If this bit is set
to 1, an external reference must be used and applied to the VIN3/VREF pin, and the device acts as a 3-channel
input part.
D2 FLTR The value written to this bit of the control register determines whether the filtering on SDA and SCL is
enabled or bypassed. If this bit is set to 0, the filtering is enabled; if it set to 1, the filtering is bypassed.
D1 Bit trial delay See the Sample Delay and Bit Trial Delay section.
D0 Sample delay See the Sample Delay and Bit Trial Delay section.
Table 11. Channel Selection
D7 D6 D5 D4 Analog Input Channel1
0 0 0 0 No channel selected
0 0 0 1 Convert on VIN0
0 0 1 0 Convert on VIN1
0 0 1 1 Sequence between VIN0 and VIN1
0 1 0 0 Convert on VIN2
0 1 0 1 Sequence between VIN0 and VIN2
0 1 1 0 Sequence between VIN1 and VIN2
0 1 1 1 Sequence among VIN0, VIN1, and VIN2
1 0 0 0 Convert on VIN3
1 0 0 1 Sequence between VIN0 and VIN3
1 0 1 0 Sequence between VIN1 and VIN3
1
0
1
1
Sequence among V
IN0
, V
IN1
, and V
IN3
1 1 0 0 Sequence between VIN2 and VIN3
1 1 0 1 Sequence among VIN0, VIN2, and VIN3
1 1 1 0 Sequence among VIN1, VIN2, and VIN3
1 1 1 1 Sequence among VIN0, VIN1, VIN2, and VIN3
1 The AD7991/AD7995/AD7999 converts on the selected channel in the sequence in ascending order, starting with the lowest channel in the sequence.
Data Sheet AD7991/AD7995/AD7999
Rev. C | Page 21 of 27
SAMPLE DELAY AND BIT TRIAL DELAY
It is recommended that no I2C bus activity occur while a
conversion is taking place (see Figure 27 and the Placing the
AD7991/AD7995/AD7999 into High Speed Mode section).
However, if this is not always possible, then in order to maintain
the performance of the ADC, Bits D0 and D1 in the configuration
register are used to delay critical sample intervals and bit trials
from occurring while there is activity on the I2C bus. This results in
a quiet period for each bit decision. However, the sample delay
protection may introduce excessive jitter, degrading the SNR for
large signals above 300 Hz. For guaranteed ac performance, use
of clock stretching is recommended.
When Bit D0 and Bit D1 are both 0, the bit trial and sample interval
delay mechanism is implemented. The default setting of D0 and D1
is 0. To turn off both delay mechanisms, set D0 and D1 to 1.
CONVERSION RESULT REGISTER
The conversion result register is a 16-bit read-only register that
stores the conversion result from the ADC in straight binary
format. A 2-byte read is necessary to read data from this
register. Table 12 shows the contents of the first byte to be read
from AD7991/AD7995/AD7999, and Table 13 shows the
contents of the second byte to be read.
Each AD7991/AD7995/AD7999 conversion result consists of
two leading 0s, two channel identifier bits, and the 12-/10-/8-bit
data result. For the AD7995, the two LSBs (D1 and D0) of the
second read contain two trailing 0s. For the AD7999, the four
LSBs (D3, D2, D1, and D0) of the second read contain four
trailing 0s.
Table 12. Conversion Value Register (First Read)
D15 D14 D13 D12 D11 D10 D9 D8
Leading 0 Leading 0 CHID1 CHID0 MSB B10 B9 B8
Table 13. Conversion Value Register (Second Read)
D7 D6 D5 D4 D3 D2 D1 D0
B7 B6 B5 B4 B3/0 B2/0 B1/0 B0/0
AD7991/AD7995/AD7999 Data Sheet
Rev. C | Page 22 of 27
SERIAL INTERFACE
Control of the AD7991/AD7995/AD7999 is accomplished via
the I2C-compatible serial bus. The AD7991/AD7995/AD7999 is
connected to this bus as a slave device under the control of a
master device, such as the processor.
SERIAL BUS ADDRESS
Like all I2C-compatible devices, the AD7991/AD7995/AD7999 has
a 7-bit serial address. The devices are available in two versions, the
AD7991-0/AD7995-0 and the AD7991-1/AD7995-1/AD7999-1.
Each version has a different address (see Table 8), which allows up
to two AD7991/AD7995 devices to be connected to a single
serial bus. AD7999 has only one version.
The serial bus protocol operates as follows:
1. The master initiates a data transfer by establishing a start
condition, defined as a high-to-low transition on the serial
data line SDA while the serial clock line, SCL, remains high.
This indicates that an address/data stream follows.
2. All slave peripherals connected to the serial bus respond to
the start condition and shift in the next eight bits, consisting of
a 7-bit address (MSB first) plus an R/W bit that determines
the direction of the data transfer—that is, whether data is
written to or read from the slave device.
3. The peripheral whose address corresponds to the transmitted
address responds by pulling the data line low during the
low period before the ninth clock pulse, known as the
acknowledge bit. All other devices on the bus remain idle
while the selected device waits for data to be read from or
written to it. If the R/W bit is set to 0, the master writes to
the slave device. If the R/W bit is set to 1, the master reads
from the slave device.
4. Data is sent over the serial bus in sequences of nine clock
pulses—eight bits of data followed by an acknowledge bit
from the receiver of data. Transitions on the data line must
occur during the low period of the clock signal and remain
stable during the high period because a low-to-high transition
when the clock is high may be interpreted as a stop signal.
5. When all data bytes have been read or written, stop conditions
are established. In write mode, the master pulls the data line
high during the 10th clock pulse to assert a stop condition.
In read mode, the master device pulls the data line high
during the low period before the ninth clock pulse. This is
known as a no acknowledge. The master takes the data line
low during the low period before the 10th clock pulse, and
then high during the 10th clock pulse to assert a stop condition.
6. Any number of bytes of data can be transferred over the serial
bus in one operation, but it is not possible to mix reads and
writes in one operation because the type of operation is
determined at the beginning and cannot subsequently be
changed without starting a new operation.
Data Sheet AD7991/AD7995/AD7999
Rev. C | Page 23 of 27
WRITING TO THE AD7991/AD7995/AD7999
By default, each part operates in read-only mode and all four chan-
nels are selected as enabled in the configuration register. To write
to the AD7991/AD7995/AD7999 configuration register, the user
must first address the device.
The configuration register is an 8-bit register; therefore, only
one byte of data can be written to this register. However, writing
a single byte of data to this register consists of writing the serial
bus write address, followed by the data byte written (see Figure 24).
SCL
SDA
START BY
MASTER ACK BY
ADC
R/W
FRAM E 1
SERI AL BUS ADDRE S S BY TE CONFIGURATION REGISTER BYTE
ACK BY
ADC STOP
1
0 0 0 0 A0 D7 D6 D5 D4 D3 D2 D1 D01 1
9 91
06461-026
Figure 24. Writing to the AD7991/AD7995/AD7999 Configuration Register
AD7991/AD7995/AD7999 Data Sheet
Rev. C | Page 24 of 27
READING FROM THE AD7991/AD7995/AD7999
Reading data from the conversion result register is a 2-byte
operation, as shown in Figure 25. Therefore, a read operation
always involves two bytes.
After the AD7991/AD7995/AD7999 have received a read
address, any number of reads can be performed from the
conversion result register.
Following a start condition, the master writes the 7-bit address
of the AD7991/AD7995/AD7999 and then sets R/W to 1. The
AD7991/AD7995/AD7999 acknowledge this by pulling the
SDA line low. They then output the conversion result over the
I2C bus, preceded by four status bits. The status bits are two
leading 0s followed by the channel identifier bits. For the
AD7995 there are two trailing 0s, and for the AD7999 there are
four trailing 0s.
After the master has addressed the AD7991/AD7995/AD7999,
the part begins to power up on the ninth SCLK rising edge. At
the same time, the acquisition phase begins. When approximately
0.6 µs have elapsed, the acquisition phase ends. The input is
sampled and a conversion begins. This is done in parallel to the
read operation and should not affect the read operation. The
master reads back two bytes of data. On the ninth SCLK rising
edge of the second byte, if the master sends an ACK, it keeps
reading conversion results and the AD7991/AD7995/AD7999
powers up and performs a second conversion. If the master sends
a NO ACK, the AD7991/AD7995/AD7999 does not power up
on the ninth SCLK rising edge of the second byte. If a further
conversion is required, the part converts on the next channel, as
selected in the configuration register. See Table 11 for information
about the channel selection.
If the master sends a NO ACK on the ninth SCLK rising edge of
the second byte, the conversion is finished and no further
conversion is performed.
To put the part into full shutdown mode, the user should issue a
stop condition to the AD7991/AD7995/AD7999. If the AD7991/
AD7995/AD7999 is not put into full shutdown mode, it will draw
a few tens of microamperes from the supply.
06461-027
SDA
1 1 99
D10 D9 D8A010 0 0 0 00
SCL
1 D11
1
D7 D6 D5 D2 D1 D0
D4 D3
SCL (CONTINUE D)
SDA (CO NTI NUE D)
CH
ID1
CH
ID0
R/W
9
START B Y
MASTER
ACK B Y
ADC
NO ACK B Y
MASTER
ACK B Y
MASTER
STOP BY
MASTER
FRAM E 1
SERIAL BUS ADDRESS BY TE FRAM E 2
MOST SIGNIFICANT DATA BYTE FROMADC
FRAM E 3
LEAST SIGNIFICANT DATA BYTE FROM ADC
Figure 25. Reading Two Bytes of Data from the AD7991Conversion Result Register
Data Sheet AD7991/AD7995/AD7999
Rev. C | Page 25 of 27
PLACING THE AD7991/AD7995/AD7999 INTO
HIGH SPEED MODE
High speed mode communication commences after the master
addresses all devices connected to the bus with the master code,
00001XXX, to indicate that a high speed mode transfer is to
begin. No device connected to the bus is allowed to acknowledge
the high speed master code; therefore, the code is followed by a
NO ACK (see Figure 26). The master must then issue a repeated
start, followed by the device address and an R/W bit. The selected
device then acknowledges its address.
All devices continue to operate in high speed mode until the
master issues a stop condition. When the stop condition is
issued, the devices return to fast mode.
To guarantee performance above fSCL = 1.7 MHz, the user must
perform clock stretching—that is, the clock must be held high—for
2 μs after the ninth clock rising edge (see Figure 27). Therefore,
the clock must be held high for 2 μs after the device starts to power
up (see the Reading from the AD7991/AD7995/AD7999 section).
0
6461-028
SDA
ACK BY
ADC
START BY
MASTER
HS MODE MASTER CO DE SERI A L BUS ADDRESS BYTE
NO ACK
19 91
01 0 0A0XX1000
SCL
001
X
Sr
FA ST MODE HIGH SPEED MODE
Figure 26. Placing the Part into High Speed Mode
06461-030
S
DA
1199
D10 D9 D8A01000 000
SCL
1D11
1
D7 D6 D5 D2 D1 D0D4 D3
SCL (CONTI NUE D)
SDA (CONTINUED)
CH
ID1
CH
ID0
R/W
9
START BY
MASTER
ACK BY
ADC
NO ACK BY
MASTER
ACK BY
MASTER
STOP BY
MASTER
FRAME 1
SERIAL BUS ADDRESS BY TE FRAM E 2
MOST SIGNIF ICANT DATA BYTE FROMADC
FRAME 3
LEAS T SI G NI FI CANT DATA BYTE F RO M ADC
CLO CK HIGH TIM E = 2µ s
Figure 27. Reading Two Bytes of Data from the Conversion Result Register in High Speed Mode for AD7991
AD7991/AD7995/AD7999 Data Sheet
Rev. C | Page 26 of 27
MODE OF OPERATION
The AD7991/AD7995/AD7999 powers up in shutdown mode.
After the master addresses the AD7991/AD7995/AD7999 with
the correct I2C address, the ADC acknowledges the address. In
response, the AD7991/AD7995/AD7999 power up.
During this wake up time, the AD7991/AD7995/AD7999 exit
shutdown mode and begin to acquire the analog input (acquisition
phase). By default, all channels are selected. Which channels
are converted depends on the status of the channel bits in the
configuration register.
When the read address is acknowledged, the ADC outputs two
bytes of conversion data. The first byte contains four status bits
and the four MSBs of the conversion result. The status bits
contain two leading 0s and two channel-identifier bits. After
this first byte, the AD7991/AD7995/AD7999 outputs the
second byte of the conversion result. For the AD7991, this
second byte contains the lower eight bits of conversion data. For
the AD7995, this second byte contains six bits of conversion
data plus two trailing 0s. For the AD7999, this second byte
contains four bits of conversion data and four trailing 0s.
The master then sends a NO ACK to the AD7991/AD7995/
AD7999, as long as no further reads are required. If the master
instead sends an ACK to the AD7991/AD7995/AD7999, the
ADC powers up and completes another conversion. When
more than one channel bit has been set in the configuration
register, this conversion is performed on the second channel in
the selected sequence. If only one channel is selected, the ADC
converts again on the selected channel.
06461-029
Sr R A ASECO ND DATA BYTE
(LSB)
FI RS T DAT A BY TE
(MSB)
7-BIT ADDRESS
SCL
SDA
A
1 1 9
9 9
Sr/P
ACK. BY
ADC ACK. BY
MASTER NO ACK. BY
MASTER
Figure 28. Mode of Operation, Single-Channel Conversion
Data Sheet AD7991/AD7995/AD7999
Rev. C | Page 27 of 27
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-178-BA
8°
4°
0°
SEATING
PLANE
1.95
BSC
0.65 BSC
0.60
BSC
7 6
1 2 3 4
5
3.00
2.90
2.80
3.00
2.80
2.60
1.70
1.60
1.50
1.30
1.15
0.90
0.15 MAX
0.05 MIN
1.45 MAX
0.95 MIN
0.22 MAX
0.08 MIN
0.38 MAX
0.22 MIN
0.60
0.45
0.30
PIN 1
INDICATOR
8
12-16-2008-A
Figure 29. 8-Lead Small Outline Transistor Package [SOT-23]
(RJ-8)
Dimensions shown in millimeters
ORDERING GUIDE
Model1 2 Temperature Range Package Description Package Option Marking Code
AD7991YRJZ-1500RL7 −40°C to +125°C 8-Lead SOT-23 RJ-8 C56
AD7991YRJZ-0RL −40°C to +125°C 8-Lead SOT-23 RJ-8 C55
AD7991YRJZ-0500RL7 −40°C to +125°C 8-Lead SOT-23 RJ-8 C55
AD7995YRJZ-1RL −40°C to +125°C 8-Lead SOT-23 RJ-8 C58
AD7995YRJZ-1500RL7 −40°C to +125°C 8-Lead SOT-23 RJ-8 C58
AD7995YRJZ-0RL −40°C to +125°C 8-Lead SOT-23 RJ-8 C57
AD7995YRJZ-0500RL7 −40°C to +125°C 8-Lead SOT-23 RJ-8 C57
AD7995ARJZ-0RL
−40°C to +125°C
8-Lead SOT-23
RJ-8
C6Y
AD7999WYRJZ-1RL −40°C to +125°C 8-Lead SOT-23 RJ-8 C9V
AD7999YRJZ-1RL −40°C to +125°C 8-Lead SOT-23 RJ-8 C5B
AD7999YRJZ-1500RL7 −40°C to +125°C 8-Lead SOT-23 RJ-8 C5B
EVAL-AD7991EBZ Evaluation Board
EVAL-AD7995EBZ Evaluation Board
1 Z = RoHS Compliant Part.
2 W = Qualified for Automotive Applications.
AUTOMOTIVE PRODUCTS
The AD7999WYRJZ model is available with controlled manufacturing to support the quality and reliability requirements of automotive
applications. Note that this automotive model may have specifications that differ from the commercial models; therefore, designers
should review the Specifications section of this data sheet carefully. Only the automotive grade products shown are available for use in
automotive applications. Contact your local Analog Devices account representative for specific product ordering information and to
obtain the specific Automotive Reliability reports for this model.
©2007–2018 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D06461-0-7/18(C)