14 Micro Battery 2007-2008
XH-HG Capacitor Pb-free refl owable
The XH-HG is a capacitor with an excellent large current
discharge characteristic at least 3 V, compared to its
predecessor (XH414H). It is an environmentally friendly
product that is reflow mounted by Pb-free soldering. It
features high capacity, and long-term reliability, as well
as a wide operating voltage range. It is thus suitable for
backup power supply of clock and memory functions of
mobile and information devices.
• Pb-free re owable:
Superior heat resistance (260ºC peak) allows reflow
soldering by Pb-free solder
• Wide operating voltage range from 0V to 3.3V
• High capacity: 0.08F with “414” size
• Long Cycle Life:
At least 10,000 times of charge/discharge
• Simple charging circuit (constant voltage charging)
• Wide operating temperature range:
Operating temperature range: 20ºC to +60ºC
Backup power supply for memory and clock functions of
cellphone, PHS, cordless phone, digital still camera, PDA,
MD player, game machine, and printer, etc.
*1. Normal temperature: 23°C ± 3°C. Electrical characteristics and aging degradation of the products depend on temperature.
*2. Value measured using AC (Alternating Current) method at the fully charged state.
XH414HG/ XH409HG (Under development)
XH414HG
Charge/discharge characteristics
FEATURES
APPLICATIONS
SPECIFICATIONS
CHARACTERISTICS
3.3
3.3
4.8 1.4
0.08
(0.05)
0.06
4.8 0.9 0.05
100
(100)
XH414HG
XH409HG (under development)
Weight
(g)
Height
(mm)
Diameter
(mm)
Type Maximum Use
Voltage (V) Capacitance (F)
Electrical Specifications (Normal Temperature)*1 Size
Internal Impedance*2
(Ω)
<APPLICATION NOTES>
• Prohibition ripple charging
A ripple (high frequency fluctuation of
voltage) in the charge voltage extremely
lowers the capacitor performance.
Be sure to charge capacitors with a
stable voltage.
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0 20 40 60 80 100
Voltage (V)
Capacity (μAh)
Charge
Discharge
Charge: Constant current/constant voltage
max. 500μA/3.3V/5 hours/RT
Discharge: Constant current 20μA/c.o.v. = 0V
• Charge voltage
The age deterioration of the capacitor
depends on the charge voltage.
The age deterioration is accelerated as
charge voltage goes higher.
• Usage environment
Aging degradation of the capacitor varies
depending on the usage environment
(temperature and humidity).
Contact us for further details.
15
XH-HG Capacitor Pb-free refl owable
Micro Battery 2007-2008
Temperature (ºC)
Capacity retention ratio (%)
Temperature Characteristics Charge/discharge Cycle Characteristics
Discharge Current Characteristics Floating Characteristics (70ºC, 50%RH)
0
20
40
60
80
100
120
–40 –20 0 20 40 60 80 100
0
20
40
60
80
100
120
0 2,000 4,000 6,000 8,000 10,000 12,000
0
20
40
60
80
100
120
0 50 100 150 200
0
20
40
60
80
100
120
0 7 14 21 28 35 42
Discharge current (μA)
Capacity retention ratio (%)
Number of cycles/10,000 times
Capacity retention ratio (%)
Charge period (day)
Capacity retention ratio (%)
Applied voltage 3.3V
[Capacity measurement conditions]
Charge: max. 500μA/3.3V/5 hours/RT
Discharge: 20μA/c.o.v. = 2.0V
[Capacity measurement condition]
Charge: max. 500μA/3.3V/5 hours/RT
Discharge: 10μA/c.o.v. = 2.0V
[Capacity measurement condition]
Charge: max. 500μA/3.3V/5 hours/RT
Discharge: c.o.v. = 2.0V
[Cycle conditions]
Charge: 3.3V, 100Ω, 9 minute
Discharge: 100Ω, 1 minute
[Capacity measurement conditions]
Charge: max. 500μA/3.3V/5 hours/RT
Discharge: 20μA/c.o.v. = 2.0V
XH414HG
Storage and other characteristics
0
50
100
150
200
250
0 50 100 300150 250200
Time above 200°C
Time (seconds)
Reflow Profile Example
Temperature (°C)
220
230
240
250
260
270
01020 607030 5040
Time above 200°C (seconds)
Recommended Reflow Condition
Peak temperature (°C)
The peak temperature is within five seconds.
The times of repeated reflow soldering must be two times or less.
The Temperature must be measured at top of the cell.
Peak Temperature
Max.260°C (within 5 seconds)
CHARACTERISTICS
REFLOW SOLDERING CONDITIONS
16 Micro Battery 2007-2008
XH-HG Capacitor Pb-free refl owable
- Contact Seiko Instruments Inc. for batteries with terminals other than the above shapes.
- Units: mm
- The hatched parts are tin plated (Sn: 100%).
STANDARD TERMINALS
XH414HG II02E
1.5
±
0.2
3
±0.1
1
±
0.2
2
±0.1
1.1
±
0.5
(Sn plated portion) (Sn plated portion)
(Sn plated
portion)
(Sn plated portion)
(Sn plated portion)
7.6
max.
0.5
±
0.5
0.1
±
0.02
1.1
±0.1
1.3
±
0.2
0.1
±
0.02
1.75
max.
1.1
±
0.2
φ
4.8
max.
3.5
2.5
3.95
1.61.9
7.7
Recommended board layout
(Tolerance
±
0.05)
(Sn plated portion)
(Sn plated portion)
(Sn plated
portion)
Recommended board layout
(Tolerance
±
0.05)
Recommended board layout
(Tolerance
±
0.05)
Recommended board layout
(Tolerance
±
0.05)
1.67
±0.1
2.4
2.4
2.7
2.7
1.7
4.1
5.4
φ
4.8
max.
2.6
0.8
±
0.5
0.1
±
0.02
1
±0.1
0.2
+0.1
0
2.4
±
0.2
3.5
±0.1
2.4
±
0.2
2.4
±
0.2
1.24
1.24
2.4
±
0.2
45˚
1.85
max.
1
±
0.5
1.67
±0.1
45˚
2.6
φ
4.8
max.
1.85
max.
0.8
±
0.5
0.1
±
0.02
1
±0.1
0.2
+0.1
0
2.4
±
0.2
2.4
±
0.2
3.5
±0.1
1.24
1.24
2.9
±
0.2
2.9
±
0.2
1.67
±0.1
1
±
0.5
1.7
4.1
2.4
2.4
2.7
5.9
2.7
5.9
XH414HG IV01E XH414HG IV02E
7.1
±
0.2
1.5
±
0.2
3
±0.1
1
±
0.2
2
±0.1
0.2
+0.1
0
1.85
max.
φ
4.8
max.
1.1
±
0.5
1.67
±0.1
0.5
±
0.5
1.1
±0.1
0.5
±
0.2
0.1
±
0.02
1.5
7.4
1.5
2.5
3.5
4.35
XH414HG II06E
1.1
±0.1