LMX9830SMX/NOPB - NATIONAL SEMICONDUCTOR

Product

Folder

Sample &

Buy

Technical

Documents

Tools &

Software

Support &

Community

LMX9830

SNOSAU0C –MAY 2008–REVISED JUNE 2015

LMX9830 Bluetooth® Serial Port Module

1 Features 3 Description

The Texas Instruments LMX9830 Bluetooth Serial

1• Compliant With the Bluetooth®2.0 Core Port module is a highly integrated Bluetooth 2.0

Specification baseband controller and 2.4-GHz radio, combined to

– Qualified Design ID (PRD 2.0): B012364 form a complete small form factor (6.1 mm × 9.1 mm

• Input Sensitivity Better than –80 dBm × 1.2 mm) Bluetooth node.

• Class 2 Operation All hardware and firmware is included to provide a

complete solution from antenna through the complete

• Low Power Consumption lower and upper layers of the Bluetooth stack, up to

• High Integration: the application including the Generic Access Profile

– Implemented in 0.18-μm CMOS Technology (GAP), the Service Discovery Application Profile

– RF Includes Antenna Filter and Switch On- (SDAP), and the Serial Port Profile (SPP). The

module includes a configurable service database to

Chip fulfill service requests for additional profiles on the

host. Moreover, the LMX9830 is prequalified as a

2 Applications Bluetooth Integrated Component. Conformance

• Personal Digital Assistants testing through the Bluetooth qualification program.

• POS Terminals The LMX9830 enables a short time to market after

system integration by ensuring a high probability of

• Data Logging Systems compliance and interoperability.

• Audio Gateway Applications Based on TI's CompactRISC 16-bit processor

• Telemedicine/Medical, Industrial and Scientific architecture and Digital Smart Radio technology, the

LMX9830 is optimized to handle the data and link

management processing requirements of a Bluetooth

node.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)

LMX9830 NFBGA (60) 9.00 mm × 6.00 mm

(1) For all available packages, see the orderable addendum at

the end of the data sheet.

4 Block Diagram

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

LMX9830

SNOSAU0C –MAY 2008–REVISED JUNE 2015

www.ti.com

Table of Contents

1 Features.................................................................. 19 Detailed Description............................................ 10

9.1 Overview................................................................. 10

2 Applications ........................................................... 19.2 Functional Block Diagram....................................... 10

3 Description............................................................. 19.3 Feature Description................................................. 10

4 Block Diagram........................................................ 19.4 Device Functional Modes........................................ 36

5 Revision History..................................................... 210 Application and Implementation........................ 41

6 Pin Configuration and Functions......................... 310.1 Typical Application................................................ 41

7 Specifications......................................................... 510.2 System Examples ................................................. 44

7.1 Absolute Maximum Ratings ...................................... 511 Power Supply Recommendations ..................... 47

7.2 ESD Ratings.............................................................. 511.1 Filtered Power Supply........................................... 47

7.3 Recommended Operating Conditions....................... 512 Device and Documentation Support................. 50

7.4 Thermal Information.................................................. 612.1 Device Support...................................................... 50

7.5 Power Supply Requirements .................................... 612.2 Documentation Support ........................................ 50

7.6 Digital DC Characteristics......................................... 612.3 Community Resources.......................................... 50

7.7 RF Receiver Performance Characteristics................ 712.4 Trademarks........................................................... 50

7.8 RF Transmitter Performance Characteristics............ 712.5 Electrostatic Discharge Caution............................ 50

7.9 RF Synthesizer Performance Characteristics........... 812.6 Glossary................................................................ 50

7.10 Typical Characteristics............................................ 813 Mechanical, Packaging, and Orderable

8 Parameter Measurement Information .................. 9Information ........................................................... 50

5 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision B (April 2013) to Revision C Page

• Added ESD Ratings table, Feature Description section, Device Functional Modes,Application and Implementation

section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and

Mechanical, Packaging, and Orderable Information section.................................................................................................. 1

Changes from Revision A (April 2013) to Revision B Page

• Changed layout of National Data Sheet to TI format ............................................................................................................. 1

Product Folder Links: LMX9830

LMX9830

www.ti.com

SNOSAU0C –MAY 2008–REVISED JUNE 2015

6 Pin Configuration and Functions

NZB Package

60-Pin NFBGA

Top View

Pin Functions

PAD NAME PAD LOCATION TYPE DEFAULT LAYOUT DESCRIPTION

ANT D10 I/O — RF Antenna 50 ΩNominal Impedance

B_RESET_RA# B6 O NC Buffered Reset Radio Output (active low)

CTS#(1) C2 I GND (if not used) Host Serial Port Clear To Send (active low)

ENV1# ENV1: Environment Select (active low) used for

C6 I NC manufacturing test only

GND B2,E2 — — Ground

GND_IF D7 — — Ground

GND_RF B9, C10, E10 — — Ground

GND_VCO E9 — — Ground

MDODI(2) D1 I/O — SPI Master Out Slave In

NC A1,A2,A3 — NC Treat as no connect. Place pad for mechanical stability

OP3/MWCS# OP3: Pin checked during Start-up Sequence for

See Table 8 and

D3 I configuration option

Table 9 MWCS#: SPI Slave Select Input (active low)

OP4/PG4 OP4: Pin checked during Start-up Sequence for

OP4: I See Table 8 and

D6 configuration option

PG4: I/O Table 9 PG4: GPIO

OP5 See Table 8 and OP5: Pin checked during Start-up Sequence for

F4 I/O Table 9 configuration option

OP6/SCL/MSK OP6: Pin checked during Start-up Sequence for

OP6: I configuration option

C1 See Table 8

SCL/MSK: I/O SCL: ACCESS.Bus Clock

MSK: SPI Shift

OP7/SDA/MDIDO OP7: Pin checked during Start-up Sequence for

OP7: I configuration option

D4 See Table 8

SDA/MDIDO: I/O SDA: ACCESS.Bus Serial Data

MDIDO: SPI Master In Slave Out

PG6 A7 I/O — GPIO

PG7 D2 I/O — GPIO - Default setup RF traffic LED indication

(1) Connect to GND if CTS is not use.

(2) Must use 1-kΩpullup.

Product Folder Links: LMX9830

LMX9830

SNOSAU0C –MAY 2008–REVISED JUNE 2015

www.ti.com

Pin Functions (continued)

PAD NAME PAD LOCATION TYPE DEFAULT LAYOUT DESCRIPTION

RDY# A4 O NC JTAG Ready Output (active low)

RESET_BB# B7 I Baseband Reset (active low)

RESET_RA# B8 I Radio Reset (active low)

RTS#(3) B1 O NC (if not used) Host Serial Port Request To Send (active low)

RXD B3 I — Host Serial Port Receive Data

SCLK F1 I/O — Audio PCM Interface Clock

SFS F2 I/O — Audio PCM Interface Frame Synchronization

SRD F3 I — Audio PCM Interface Receive Data Input

STD E3 O — Audio PCM Interface Transmit Data Output

TCK B4 I NC JTAG Test Clock Input

TDI B5 I NC JTAG Test Data Input

TDO D5 O NC JTAG Test Data Output

TE A9 I GND Test Enable - Used for manufacturing test only

TMS A5 I NC JTAG Test Mode Select Input

TST1/DIV2# TST1: Test Mode. Leave not connected to permit use

B10 I NC with VTune automatic tuning algorithm

DIV2#: No longer supported

TST2 C7 I GND Test Mode, Connect to GND

TST3 C8 I GND Test Mode, Connect to GND

TST4 C9 I GND Test Mode, Connect to GND

TST5 D8 I GND Test Mode, Connect to GND

TST6 Test Input,

D9 I VCO_OUT Connect to VCO_OUT via 0-Ωresistor to permit use

with VTune automatic tuning algorithm

TXD C3 O — Host Serial Port Transmit Data

X1_CKI E7 I — Crystal or External Clock 10-20 MHz

X1_CKO F7 O — Crystal 10-20 MHz

X2_CKI GND

F5 I 32.768-kHz Crystal Oscillator

(if not used)

X2_CKO NC

E5 O 32.768-kHz Crystal Oscillator

(if not used)

XOSCEN Clock Request. Toggles with X2 (LP0) crystal

A6 O — enable/disable

VCC E1 I — Voltage Regulator Input

VCC_CORE C5 O — 1.8-V Voltage Regulator Output

VCC_IO C4 I — Power Supply I/O

VCC_IOP E4 I — Power Supply Audio Interface

VCC_PLL F6 O — 1.8-V Core Logic Power Supply Output

VCO_IN F9 I — VCO Tuning Input, feedback from Loop filter

VCO_OUT F8 O — Charge Pump Output, connect to Loop filter

VDD_IF A8 I — Power Supply IF

VDD_IOR E6 I — Power Supply I/O Radio/BB

VDD_RF A10 I — Power Supply RF

VDD_VCO F10 I — Power Supply VCO

VDD_X1 E8 I — Power Supply Crystal Oscillator

(3) Treat as No Connect if RTS is not used. Pad required for mechanical stability.

Product Folder Links: LMX9830

LMX9830

www.ti.com

SNOSAU0C –MAY 2008–REVISED JUNE 2015

7 Specifications

7.1 Absolute Maximum Ratings(1)

The following conditions are true unless otherwise stated in the tables: TA= -40°C to +85°C, VCC = 3.3 V, and RF system

performance specifications are ensured on Texas Instruments Mesa board rev 1.1 reference design platform.

MIN MAX UNIT

VCC Digital Voltage Regulator input –0.2 4 V

VIVoltage on any pad with GND = 0 V –0.2 VCC + 0.2 V

VDD_RF

VDD_IF Supply Voltage Radio 0.2 3.3 V

VDD_X1

VDD_VCO

PINRF RF Input Power 0 dBm

VANT Applied Voltage to ANT pad 1.95 V

TLLead Temperature(2)(solder 4 sec.) 225 °C

TLNOPB Lead Temperature NOPB(2)(3)(solder 40 sec.) 260 °C

Tstg Storage temperature –65 150 °C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) Reference IPC/JDEC J-STD-20C spec.

(3) NOPB = No Pb (No Lead)

7.2 ESD Ratings VALUE UNIT

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000

Charged device model (CDM), per JEDEC specification JESD22- ±1000

V(ESD) Electrostatic discharge V

C101(2)

Machine model (MM) ±200(3)

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

(3) A 200-V ESD rating applies to all pins except OP3, OP6, OP7, MDODI, SCLK, SFS, STD, TDO, and ANT pins = 150 V.

7.3 Recommended Operating Conditions

The following conditions are true unless otherwise stated in the tables: TA= –40°C to 85°C, VCC = 3.3 V, and RF system

performance specifications are ensured on Texas Instruments Mesa board rev 1.1 reference design platform.

MIN TYP MAX UNIT

VCC Digital Voltage Regulator input 2.5 2.75 3.6 V

TRDigital Voltage Regulator Rise Time 10 μs

TAAmbient Operating Temperature Range –40 25 125 °C

Fully Functional Bluetooth Node

VCC_IO Supply Voltage Digital I/O 1.6 3.3 3.6 V

VCC_PLL Internally connected to VCC_Core

VDD_RF

VDD_IF Supply Voltage Radio 2.5 2.75 3 V

VDD_X1

VDD_VCO

VDD_IOR Supply Voltage Radio I/O 1.6 2.75 VDD_RF V

VCC_IOP Supply Voltage PCM Interface 1.6 3.3 3.6 V

VCC_CORE Supply Voltage Output 1.8 V

VCC_COREMAX Supply Voltage Output Max Load 5 mA

VCC_CORESHORT When used as Supply Input (VCC grounded) 1.6 1.8 2 V

Product Folder Links: LMX9830

LMX9830

SNOSAU0C –MAY 2008–REVISED JUNE 2015

www.ti.com

7.4 Thermal Information LMX9830

THERMAL METRIC(1) NZB [NFBGA] UNIT

60 PINS

RθJA Junction-to-ambient thermal resistance 51.0 °C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

7.5 Power Supply Requirements(1)(2)

The following conditions are true unless otherwise stated in the tables: TA= –40°C to 85°C, VCC = 3.3 V, and RF system

performance specifications are ensured on Texas Instruments Mesa board rev 1.1 reference design platform.

PARAMETER MIN TYP(3) MAX UNIT

ICC-TX Power supply current for continuous transmit 65 mA

ICC-RX Power supply current for continuous receive 65 mA

IRXSL Receive Data in SPP Link, Slave(4) 26 mA

IRXM Receive Data in SPP Link, Master(4) 23 mA

ISnM Sniff Mode, Sniff interval 1 second(4) 5.6 mA

ISC-TLDIS Scanning, No Active Link, TL Disabled(4) 0.43 mA

IIdle Idle, Scanning Disabled, TL Disabled(4) 100 µA

(1) Power supply requirements based on Class II output power.

(2) Based on UART Baudrate 921.6 kbit/s.

(3) VCC = 3.3 V, VCC_IO = 3.3 V, Ambient Temperature = 25°C.

(4) Average values excluding IO.

7.6 Digital DC Characteristics

The following conditions are true unless otherwise stated in the tables: TA= –40°C to 85°C, VCC = 3.3 V, and RF system

performance specifications are ensured on Texas Instruments Mesa board rev 1.1 reference design platform.

PARAMETER TEST CONDITIONS MIN MAX UNIT

VIH Logical 1 Input Voltage high 1.6 V ≤VCC_IO ≤3.0 V 0.7 x VCC_IO VCC_IO + 0.2 V

(except oscillator I/O) 3.0 V ≤VCC_IO ≤3.6 V 2 VCC_IO + 0.2

VIL Logical 0 Input Voltage low 1.6 V ≤VCC_IO ≤3.0 V –0.2 0.25 x VCC_IO V

(except oscillator I/O) 3.0 V ≤VCC_IO ≤3.6 V –0.2 0.8

VHYS Hysteresis Loop Width(1) 0.1 x VCC_IO V

IOH Logical 1 Output Current VOH = 2.4 V, VCC_IO = 3.0 V –10 mA

IOL Logical 0 Output Current VOH = 0.4 V, VCC_IO = 3.0 V 10 mA

(1) Specified by design.

Product Folder Links: LMX9830

LMX9830

www.ti.com

SNOSAU0C –MAY 2008–REVISED JUNE 2015

7.7 RF Receiver Performance Characteristics

In the performance characteristics tables the following applies: All tests performed are based on Bluetooth Test Specification

revision 2.0. All tests are measured at antenna port unless otherwise specified. TA= –40°C to 85°C, VDD_RF = 2.8 V unless

otherwise specified. RF system performance specifications are ensured on Texas Instruments Mesa Board rev 1.1 reference

design platform. PARAMETER TEST CONDITIONS MIN TYP(1) MAX UNIT

RXsense 2.402 GHz –80 –76 dBm

Receive Sensitivity BER < 0.001 2.441 GHz –80 –76 dBm

2.480 GHz –80 –76 dBm

PinRF Maximum Input Level –10 0 dBm

IMP(2)(3) F1= + 3 MHz,

Intermodulation Performance F2= + 6 MHz, –38 –36 dBm

PinRF = –64 dBm

RSSI RSSI Dynamic Range at LNA Input –72 –52 dBm

ZRFIN(3) Single input impedance

Input Impedance of RF Port (RF_inout) 32 Ω

Fin = 2.5 GHz

Return Return Loss –8 dB

Loss(3)

OOB(2)(3) PinRF = –10 dBm,

Out Of Band Blocking Performance –10 dBm

30 MHz < FCWI < 2 GHz, BER < 0.001

PinRF = –27 dBm,

2000 MHz < FCWI < 2399 MHz, BER < –27 dBm

0.001

PinRF = –27 dBm,

2498 MHz < FCWI < 3000 MHz, BER < –27 dBm

0.001

PinRF = –10 dBm,

3000 MHz < FCWI < 12.75 GHz, BER < –10 dBm

0.001

(1) Typical operating conditions are at 2.75 V operating voltage and 25°C ambient temperature.

(2) The f0= –64 dBm Bluetooth modulated signal, f1= –39 dbm sine wave, f2= –39 dBm Bluetooth modulated signal, f0= 2f1- f2, and |f2-

f1| = n * 1 MHz, where n is 3, 4, or 5. For the typical case, n = 3.

(3) Not tested in production.

7.8 RF Transmitter Performance Characteristics

In the performance characteristics tables the following applies: All tests performed are based on Bluetooth Test Specification

revision 2.0. All tests are measured at antenna port unless otherwise specified. TA= –40°C to 85°C, VDD_RF = 2.8 V unless

otherwise specified. RF system performance specifications are ensured on Texas Instruments Mesa Board rev 1.1 reference

design platform. PARAMETER TEST CONDITIONS MIN TYP(1) MAX UNIT

POUTRF 2.402 GHz −4 0 +3 dBm

Transmit Output Power 2.441 GHz −4 0 +3 dBm

2.480 GHz −4 0 +3 dBm

MOD ΔF1AVG Modulation Characteristics Data = 00001111 140 165 175 kHz

MOD ΔF2MAX(2) Modulation Characteristics Data = 10101010 115 125 kHz

ΔF2AVG/DF1AVG(3) Modulation Characteristics 0.8 kHz

20 dB Bandwidth 1000 kHz

POUT2*fo(4) Maximum gain setting:

PA 2nd Harmonic Suppression f0= 2402 MHz, -30 dBm

Pout = 4804 MHz

ZRFOUT(5) RF Output Impedance/Input Pout @ 2.5 GHz 47 Ω

Impedance of RF Port (RF_inout)

(1) Typical operating conditions are at 2.75 V operating voltage and 25°C ambient temperature.

(2) ΔF2max ≥115 kHz for at least 99.9% of all Δf2max.

(3) Modulation index set between 0.28 and 0.35.

(4) Out-of-Band spurs only exist at 2nd and 3rd harmonics of the CW frequency for each channel.

(5) Not tested in production.

Product Folder Links: LMX9830

LMX9830

SNOSAU0C –MAY 2008–REVISED JUNE 2015

www.ti.com

7.9 RF Synthesizer Performance Characteristics

In the performance characteristics tables the following applies: All tests performed are based on Bluetooth Test Specification

revision 2.0. All tests are measured at antenna port unless otherwise specified. TA= –40°C to 85°C, VDD_RF = 2.8 V unless

otherwise specified. RF system performance specifications are ensured on Texas Instruments Mesa Board rev 1.1 reference

design platform. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

fVCO VCO Frequency Range 2402 2480 MHz

tLOCK Lock Time f0± 20 kHz 120 µs

Δf0offset(1) Initial Carrier Frequency Tolerance During preamble -75 0 75 kHz

Δf0drift(1) DH1 data packet -25 0 25 kHz

DH3 data packet -40 0 40 kHz

Initial Carrier Frequency Drift DH5 data packet -40 0 40 kHz

Drift Rate -20 0 20 kHz/50µs

tD- TX Transmitter Delay Time From TX data to antenna 4 µs

(1) Frequency accuracy is dependent on crystal oscillator chosen. The crystal must have a cumulative accuracy of < ±20 ppm to meet

Bluetooth specifications.

7.10 Typical Characteristics

Figure 1. Modulation Figure 2. Transmit Spectrum

Figure 3. Corresponding Eye Diagram Figure 4. Synthesizer Phase Noise

Product Folder Links: LMX9830

LMX9830

www.ti.com

SNOSAU0C –MAY 2008–REVISED JUNE 2015

8 Parameter Measurement Information

Figure 5. Front-End Bandpass Filter Response

Figure 6. TX and RX Pin 50-ΩImpedance Characteristics

Figure 7. Transceiver Return Loss

Product Folder Links: LMX9830

LMX9830

SNOSAU0C –MAY 2008–REVISED JUNE 2015

www.ti.com

9 Detailed Description

9.1 Overview

LMX9830 is a highly compact Bluetooth 2.0 module solution, with integrated radio, controller, and processor. The

built-in Bluetooth stacks up to the application layer allows users to communicate directly with SPP commands,

and develop additional SPP-based Bluetooth profiles on Host through UART interface.

9.2 Functional Block Diagram

9.3 Feature Description

9.3.1 Feature Overview

The firmware supplied in the on-chip ROM memory offers a complete Bluetooth (v2.0) stack including profiles

and command interface. This firmware features point-to-point and point-to-multipoint link management supporting

data rates up to the theoretical maximum over RFComm of 704 kbps (Best in Class in the industry). The internal

memory supports up to 7 active Bluetooth data links and one active SCO link.

The on-chip Patch RAM provided for lowest cost and risk, allows the flexibility of a firmware upgrade.

The LMX9830 module is lead free and RoHS (Restriction of Hazardous Substances) compliant. For more

information on those quality standards, visit TI's green compliance website at

http://focus.ti.com/quality/docs/qualityhome.tsp

Product Folder Links: LMX9830

LMX9830

www.ti.com

SNOSAU0C –MAY 2008–REVISED JUNE 2015

Feature Description (continued)

9.3.1.1 Hardware

• Baseband and Link Management Processors

• CompactRISC Core

• Embedded ROM and Patch RAM Memory

• UART Command/Data Port:

– Support for up to 921.6 k Baud Rate

• Auxiliary Host Interface Ports:

– Link Status

– Transceiver Status (TX or RX)

– Three General Purpose I/Os, Available through the API

– Alternative IO Functions:

– Link Status

– Transport Layer Activity

• Advanced Power Management (APM) Features:

– Advanced Power Management functions

• Advanced Audio Interface for External PCM Codec

• ACCESS.Bus and SPI/Microwire for Interfacing with External Nonvolatile Memory

9.3.1.2 Firmware

• Complete Bluetooth Stack including:

– Baseband and Link Manager

– L2CAP, RFCOMM, SDP

– Profiles:

– GAP

– SDAP

– SPP

• Additional Profile support on Host, for example:

– Dial Up Networking (DUN)

– Facsimile Profile (FAX)

– File Transfer Protocol (FTP)

– Object Push Profile (OPP)

– Synchronization Profile (SYNC)

– Headset (HSP)

– Handsfree Profile (HFP)

– Basic Imaging Profile (BIP)

– Basic Printing Profile (BPP)

• On-Chip application including:

– Default connections

– Command Interface:

– Link setup and configuration (also Multipoint)

– Configuration of the module

– Service database modifications

– UART Transparent mode

– Optimized cable replacement :

– Automatic transparent mode

– Event filter

Product Folder Links: LMX9830

LMX9830

SNOSAU0C –MAY 2008–REVISED JUNE 2015

www.ti.com

Feature Description (continued)

9.3.1.3 Highly Integrated Digital Technology

• Accepts external clock or crystal input:

– 13 MHz Typical

– Supports 10 - 20 MHz

– Secondary 32.768-kHz oscillator for low-power modes

– 20 ppm cumulative clock error required for Bluetooth

• Synthesizer:

– Integrated VCO

– Provides all clocking for radio and baseband functions

• Antenna Port (50 Ωnominal impedance):

– Embedded front-end filter for enhanced out of band performance

• Integrated transmit/receive switch (full duplex operation via antenna port)

• Better than –80 dBm input sensitivity

• 0 dBm typical output power

9.3.1.4 Physical

• Compact size - 6.1 mm × 9.1 mm × 1.2 mm

• Complete system interface provided in Ball Grid Array on underside for surface mount assembly

9.3.2 Baseband and Link Management Processors

Baseband and Lower Link control functions are implemented using a combination of TI's CompactRISC 16-bit

processor and the Bluetooth Lower Link Controller. These processors operate from integrated ROM memory and

RAM and execute on-board firmware implementing all Bluetooth functions.

9.3.2.1 Bluetooth Lower Link Controller

The integrated Bluetooth Lower Link Controller (LLC) complies with the Bluetooth Specification version 2.0 and

implements the following functions:

• Adaptive Frequency Hopping

• Interlaced Scanning

• Fast Connect

• Support for 1, 3, and 5 slot packet types

• 79 Channel hop frequency generation circuitry

• Fast frequency hopping at 1600 hops per second

• Power management control

• Access code correlation and slot timing recovery

9.3.2.2 Bluetooth Upper Layer Stack

The integrated upper layer stack is prequalified and includes the following protocol layers:

• L2CAP

• RFComm

• SDP

9.3.2.3 Profile Support

The on-chip application of the LMX9830 allows full stand-alone operation, without any Bluetooth protocol layer

necessary outside the module. It supports the Generic Access Profile (GAP), the Service Discovery Application

Profile (SDAP), and the Serial Port Profile (SPP).

The on-chip profiles can be used as interfaces to additional profiles executed on the host. The LMX9830 includes

a configurable service database to answer requests with the profiles supported.

Product Folder Links: LMX9830

LMX9830

www.ti.com

SNOSAU0C –MAY 2008–REVISED JUNE 2015

Feature Description (continued)

9.3.2.4 Application With Command Interface

The module supports automatic slave operation eliminating the need for an external control unit. The

implemented transparent option enables the chip to handle incoming data raw, without the need for packaging in

a special format. The device uses a pin to block unallowed connections. This pincode can be fixed or

dynamically set.

Acting as master, the application offers a simple but versatile command interface for standard Bluetooth

operation-like inquiry, service discovery, or serial port connection. The firmware supports up to seven slaves.

Default Link Policy settings and a specific master mode allow optimized configuration for the application specific

requirements. See also Integrated Firmware.

9.3.2.5 Memory

The LMX9830 introduces 16 kB of combined system and Patch RAM memory that can be used for data and/or

code upgrades of the ROM based firmware. Due to the flexible start-up used for the LMX9830 operating

parameters like the Bluetooth Device Address (BD_ADDR) are defined during boot time. This allows reading out

the parameters of an external EEPROM or programming them directly over UART.

9.3.2.6 External Memory Interfaces

As the LMX9830 is a ROM based device with no on-chip non volatile storage, the operation parameters will be

lost after a power cycle or hardware reset. In order to prevent re initializing such parameters, patches or even

user data, the LMX9830 offers two interfaces to connect an external EEPROM to the device:

•μ-wire/SPI

• Access.bus (I2C compatible)

The selection of the interface is done during start-up based on the option pins. See Table 8 for the option pin

descriptions.

9.3.2.7 µ-wire/SPI Interface

In case the firmware is configured by the option pins to use a µ-wire/SPI EEPROM, the LMX9830 will activate

that interface and try to read out data from the EEPROM. The external memory must be compatible to the

reference listed in Table 1. The largest size EEPROM supported is limited by the addressing format of the

selected NVM.

The device must have a page size equal to N x 32 bytes.

The firmware requires that the EEPROM supports Page write. Clock must be HIGH when idle.

Table 1. M95640-S EEPROM 8k x 8

PARAMETER VALUE

Supplier ST Microelectronics

Supply Voltage(1) 1.8 - 3.6 V

Interface SPI compatible (positive clock SPI Modes)

Memory Size 8k x 8, 64 kbit

Clock Rate(1) 2 MHz

Access Byte and Page Write (up to 32 bytes)

(1) Parameter range reduced to requirements of TI reference design.

9.3.2.8 Access.bus Interface

In case the firmware is configured by the option pins to use an access.bus or I2C compatible EEPROM, the

LMX9830 will activate that interface and try to read out data from the EEPROM. The external memory must be

compatible to the reference listed in Table 2.

The largest size EEPROM supported is limited by the addressing format of the selected NVM. The device must

have a page size equal to N x 32 bytes.

Product Folder Links: LMX9830

LMX9830

SNOSAU0C –MAY 2008–REVISED JUNE 2015

www.ti.com

The device uses a 16 bit address format. The device address must be “000”.

Table 2. 24C64 EEPROM 8kx8

PARAMETER VALUE

Supplier Atmel

Supply Voltage(1) 2.7 - 5.5 V

Interface 2 wire serial interface

Memory Size 8K x 8, 64 kbit

Clock Rate(1) 100 kHz

Access 32 Byte Page Write Mode

(1) Parameter range reduced to requirements of TI reference design.

9.3.3 Transport Port - UART

The LMX9830 provides one Universal Asynchronous Receiver Transmitter (UART). The UART interface consists

out of Receive (RX), Transmit (TX), Ready-to-Send (RTS) and Clear-to-Send signals. RTS and CTS are used for

hardware handshaking between the host and the LMX9830. Because the LMX9830 acts as gateway between the

Bluetooth and the UART interface, TI recommends to use the handshaking signals especially for transparent

operation. In case two signals are used CTS must be pulled to GND. Also see the LMX9830 Software User’s

Guide for detailed information on 2-wire operation.

The UART interface supports formats of 8-bit data with or without parity, with one or two stop bits. It can operate

at standard baud rates from 2400 bits/s up to a maximum baud rate of 921.6 kbits/s. DMA transfers are

supported to allow for fast processor independent receive and transmit operation.

The UART baudrate is configured during start-up by checking option pins OP3, OP4 and OP5 for reference clock

and baudrate. In case Auto baud rate detect is chosen, the firmware check the NVS area if a valid UART

baudrate has been stored in a previous session. In case, no useful value can be found the device will switch to

auto baud rate detection and wait for an incoming reference signal.

The UART offers wakeup from the power save modes via the multi-input wakeup module. When the LMX9830 is

in low power mode, RTS# and CTS# can function as Host_WakeUp and Bluetooth_WakeUp respectively.

Table 3 represents the operational modes supported by the firmware for implementing the transport via the

UART.

Table 3. UART Operation Modes

ITEM RANGE DEFAULT AT POWER UP WITH AUTO-DETECT

Baud Rate Either configured by option pins, NVS

2.4 to 921.6 kbits/s 2.4 to 921.6 kbits/s

parameter or auto baud rate detection

Flow Control RTS#/CTS# or None RTS#/CTS# RTS#/CTS#

Parity Odd, Even, None None None

Stop Bits 1,2 1 1

Data Bits 8 8 8

9.3.4 Audio Port

9.3.4.1 Advanced Audio Interface

The Advanced Audio Interface (AAI) is an advanced version of the Synchronous Serial Interface (SSI) that

provides a full-duplex communications port to a variety of industry-standard 13/14/15/16-bit linear or 8-bit log

PCM codecs, DSPs, and other serial audio devices.

The interface allows the support one codec or interface. The firmware selects the desired audio path and

interface configuration by a parameter that is located in RAM (imported from nonvolatile storage or programmed

during boot-up). The audio path options include the Motorola MC145483 codec, the OKI MSM7717 codec, the

Winbond W681360/W681310 codecs and the PCM slave through the AAI.

In case an external codec or DSP is used the LMX9830 audio interface generates the necessary bit and frame

clock driving the interface.

Product Folder Links: LMX9830

LMX9830

www.ti.com

SNOSAU0C –MAY 2008–REVISED JUNE 2015

Table 4 summarizes the audio path selection and the configuration of the audio interface at the specific modes.

The LMX9830 supports one SCO link.

Table 4. Audio Path Configuration

AAI FRAME

AAI BIT AAI FRAME

AUDIO SETTING INTERFACE FREQ FORMAT SYNC PULSE

CLOCK CLOCK LENGTH

Advanced audio 8-bit log PCM

OKI MSM7717 480 kHz 8 kHz 14 Bits

interface (a-law only)

ANY(1)

Advanced audio

Motorola MC145483(2) 13-bit linear 480 kHz 8 kHz 13 Bits

interface

Advanced audio 8-bit log PCM

OKI MSM7717 520 kHz 8 kHz 14 Bits

interface (a-law only)

13 MHz

Advanced audio

Motorola MC145483(2) 13-bit linear 520 kHz 8 kHz 13 Bits

interface

Advanced audio 8 bit log PCM

Winbond W681310 13 MHz 520 kHz 8 kHz 14 Bits

interface A-law and μ-law

Advanced audio

Winbond W681360 13 MHz 13-bit linear 520 kHz 8 kHz 13 Bits

interface

Advanced audio

PCM slave(3) ANY(1) 8/16 bits 128 - 1024 kHz 8 kHz 8/16 Bits

interface

(1) For supported frequencies see Table 12.

(2) Due to internal clock divider limitations the optimum of 512 kHz, 8 kHz can not be reached. The values are set to the best possible

values. The clock mismatch does not result in any discernible loss in audio quality.

(3) In PCM slave mode, parameters are stored in NVS. Bit clock and frame clock must be generated by the host interface.

PCM slave configuration example: PCM slave uses the slot 0, 1 slot per frame, 16 bit linear mode, long frame

sync, normal frame sync. In this case, 0x03E0 should be stored in NVS. See “LMX9830 Software Users Guide”

for more details.

9.3.5 Auxiliary Ports

9.3.5.1 RESET#

There are two reset inputs: RESET_RA# for the radio and RESET_BB# for the baseband. Both are active low.

There is also a reset output, B_RESET_RA# (Buffered Radio Reset) active low. This output follows input

RESET_RA#.

When RESET_RA# is released, going high, B_RESET_RA# stays low until the clock has started.

See System Power-Up for details.

9.3.5.2 General Purpose I/Os

The LMX9830 offers 3 pins which either can be used as indication and configuration pins or can be used for

General Purpose functionality. The selection is made out of settings derived out of the power-up sequence.

In General Purpose configuration the pins are controlled hardware specific commands giving the ability to set the

direction, set them to high or low or enable a weak pullup.

In alternate function the pins have predefined indication functionality. See Table 5 for a description on the

alternate indication functionality.

Table 5. Alternate GPIO Pin Configuration

PIN DESCRIPTION

OP4/PG4 Operation Mode pin to configure Transport Layer settings during boot-up

PG6 GPIO

PG7 RF Traffic indication

Product Folder Links: LMX9830

LMX9830

SNOSAU0C –MAY 2008–REVISED JUNE 2015

www.ti.com

9.3.6 System Power Up

In order to correctly power up the LMX9830, the following sequence is recommended to be performed:

Apply VCC_IO and VCC to the LMX9830.

The RESET_RA# should be driven high. Then RESET_BB# should be driven high at a recommended time of 1

ms after the LMX9830 voltage rails are high. The LMX9830 is properly reset.

See Figure 8.

ESR of the crystal also has impact on the start-up time of the crystal oscillator circuit of the LMX9830 (See

Table 6 and Table 7).

Figure 8. LMX9830 Power-On Reset Timing

Table 6. LMX9830 Power to Reset Timing

SYMBOL PARAMETER CONDITION MIN TYP MAX UNIT

tPTORRA VCC and VCC_IO at operating voltage

Power to Reset _RA# <500(1) µs

level to valid reset

tPTORBB VCC and VCC_IO at operating voltage

Reset_RA# to Reset_BB# 1(2) ms

level to valid reset

(1) Rise time on power must switch on fast, rise time <500 µs.

(2) Recommended value.

Table 7. ESR vs Start-up Time

ESR (Ω) TYPICAL(1)(2) UNIT

10 12 ms

25 13 ms

40 16 ms

50 24 ms

80 30 ms

(1) Frequency, loading caps and ESR all must be considered for determining start-up time.

(2) For reference only, must be tested on each system to accurately design POR and correctly start up system.

Product Folder Links: LMX9830

LMX9830

www.ti.com

SNOSAU0C –MAY 2008–REVISED JUNE 2015

9.3.7 Start-up Sequence

During start-up, the LMX9830 checks the options register pins OP3 to OP7 for configuration on operation mode,

external clock source, transport layer and available nonvolatile storage PROM.

The different options for start-up are described in Table 8.

9.3.7.1 Options Register

External pads in Table 8 are latched in this register at the end of Reset. The Options register can be read by

firmware at any time.

All pads are inputs with weak on-chip pullup/down resistors during Reset. Resistors are disconnected at the end

of RESET_BB#.

1 = Pullup resistor connected in application

0 = Pulldown resistor connected in application

x = Don’t care

9.3.7.2 Start-up With External PROM Available

To be able to read out information from an external PROM the option pins must be set according to Table 8.

Start-up sequence activities:

1. From the Options registers OP6 and OP7, the LMX9830 checks if a serial PROM is available to use

(ACCESS.bus or Microwire).

2. If serial PROM is available, the permanent parameter block, patch block, and nonvolatile storage (NVS) are

read from it. If the BD Address is not present, enter the BD address to be saved in the NVS. For more

information see Configuring the LMX9830 Through Transport Layer.

3. From the Options register OP3, OP4 and OP5, the LMX9830 checks for clocking information and transport

layer settings. If the NVS information are not sufficient, the LMX9830 will send the “Await Initialization” event

on the TL (Transport Layer) and wait for additional information (see Start-up Without External PROM

Available.)

4. The LMX9830 compensates the UART for new BBCLK information from the NVS.

5. The LMX9830 starts up the Bluetooth core.

9.3.7.3 Start-up Without External PROM Available

The following sequence will take place if OP6 and OP7 have been set to “No external memory” as described in

Table 8.

Start-up sequence activities:

1. From the Options registers OP6 and OP7, the LMX9830 checks if a serial PROM is available to use.

2. From the Options register OP3, OP4 and OP5, the LMX9830 checks for clocking mode and transport layer.

3. The LMX9830 sends the “Await Initialization” Event on the TL (Transport Layer) and waits for NVS

configuration commands. The configuration is finalized by sending the “Enter Bluetooth Mode” command.

4. The LMX9830 compensates the UART for new BBCLK information from the NVS.

5. The LMX9830 starts up the Bluetooth core.

Product Folder Links: LMX9830

LMX9830

SNOSAU0C –MAY 2008–REVISED JUNE 2015

www.ti.com

Table 8. Start-up Sequence Options(1)

PACKAGE PAD COMMENT

OP3 OP4 OP5 OP6(2) OP7(3) ENV1#

PD = Internal Pulldown during Reset

PD PD PD PD PD PU PU = Internal Pullup during Reset

Open (1)

x x x Open (0) Open (0) No serial memory

BBCLK

Open (1)

x x x 1 Open (0) Reserved

BBCLK

Open (1)

x x x Open (0) 1 Microwire serial memory

BBCLK

Open (1)

x x x 1 1 ACCESS.bus serial memory

BBCLK

T_SCLK x x T_RFDATA T_RFCE 0 BBCLK Test mode

(1) 1/0 pullup/down resistor connected in application.

(2) If OP6 is 1, must use 1-kΩpullup, If OP6 is 0, must use 10-kΩpulldown.

(3) If OP7 is 1, must use 1-kΩpullup.

Figure 9. Flow Diagram for the Start-Up Sequence

Product Folder Links: LMX9830

LMX9830

www.ti.com

SNOSAU0C –MAY 2008–REVISED JUNE 2015

Table 9. Fixed Frequencies

OSC FREQ. BBCLK (MHz) PLL (48 MHz) OP3(1) OP4(2) OP5(3) FUNCTION

(MHz)

12 12 OFF 0 0 0 UART speed read from NVS

Clock and UART baudrate

10-20(4) 10-20(1) ON 0 1 0 detection

13 13 OFF 1 0 0 UART speed read from NVS

13 13 OFF 1 0 1 UART speed 9.6 kbps

13 13 OFF 1 1 0 UART speed 115.2 kbps

13 13 OFF 1 1 1 UART speed 921.6 kbps

(1) If OP3 is 1, must use 1-kΩpullup.

(2) If OP4 is 1, must use 1-kΩpullup.

(3) If OP5 is 1, must use 1-kΩpullup.

(4) Supported frequencies see Table 13.

9.3.7.4 Configuring the LMX9830 Through Transport Layer

As described in System Power-Up, the LMX9830 will check during start-up the Options Registers if an external

PROM is available. If the information on the PROM are incomplete or no PROM is installed the LMX9830 will

boot into the “initialization Mode”.

The mode is confirmed by the “Await Initialization” Event.

The following information are needed to enter Bluetooth Mode:

•Bluetooth Device Address (BD_Addr)

• External clock source (only if 10 - 20 MHz has been selected)

• UART Baudrate (only if Auto baudrate detection has been selected)

In general the following procedure will initialize the LMX9830:

1. Wait for “Await initialization” Event

– Event will only appear if transport layer speed is set or after successful baudrate detection.

2. Send “Set Clock and Baudrate” Command only if the clock speed is not known through hardware

configuration (i.e only if OP3, OP4, OP5 = 0 1 0).

3. Send “Write BD_Addr” to Configure Local Bluetooth Device Address.

4. Send “Enter Bluetooth Mode”

– LMX9830 will use configured clock and UART speed and start the command interface.

Note: In case no EEPROM is used, BDAddr, clock source and Baudrate are only valid until the next power-cycle

or hardware reset.

9.3.7.5 Auto Baud Rate Detection

The LMX9830 supports an Automatic Baudrate Detection in case the external clock is different to 12, 13 MHz or

the range 10-20 MHz or the baudrate is different to 9.6 kbps, 115.2 or 921.6 kbit/s.

The baudrate detection is based on the measurement of one character. The following issues need to be

considered:

• The flow control pin CTS must be low or else the host is in flow stop.

• The Auto Baudrate Detector measures the length of the 0x01 character from the positive edge of bit 0 to the

positive edge of stop bit.

• Therefore the very first received character must always be a 0x01.

• The host can restrict itself to send only a 0x01 character or also can send a command.

• The host must flush the TX buffer within 50-100 milliseconds depend on clock frequency on the host

controller.

• After 50-100 milliseconds the UART is about to be initialized and short after the host should receive a “Await

Initialization” Event or an “Command Status” Event.

Product Folder Links: LMX9830

LMX9830

SNOSAU0C –MAY 2008–REVISED JUNE 2015

www.ti.com

Figure 10. Auto Baudrate Detection Timing Diagram

9.3.8 Using an External EEPROM for Nonvolatile Data

The LMX9830 offers two interfaces to connect to external memory. Depending on the EEPROM used, the

interface is activated by setting the correct option pins during start-up. See Table 8 for the option pin settings.

The external memory is used to store mandatory parameters like the BD_Address as well as many optional

parameters like Link Keys or even User data.

The NVM is organized with fixed addresses for the parameters. Because of that the EEPROM can be

preprogrammed with default parameters in manufacturing. Refer to Table 36 for the organization of the NVS

map.

In case the external memory is empty on first start-up, the LMX9830 will behave as like no memory is connected.

(See Start-up Without External PROM Available). During the start-up process, parameters can be written directly

to the EEPROM to be available after next bootup. On first bootup, the EEPROM will be automatically

programmed to default values, including the UART speed of 9600 BPS. Patches supplied over the TL will be

stored automatically into the EEPROM.

9.3.9 Integrated Firmware

The LMX9830 includes the full Bluetooth stack up to RFComm to support the following profiles:

• GAP (Generic Access Profile)

• SDAP (Service Discovery Application Profile)

• SPP (Serial Port Profile)

Figure 11 shows the Bluetooth protocol stack with command interpreter interface. The command interpreter

offers a number of different commands to support the functionality given by the different profiles. Execution and

interface timing is handled by the control application.

The chip has an internal data area in RAM that includes the parameters shown in Table 36.

Figure 11. LMX9830 Software Implementation

Product Folder Links: LMX9830

LMX9830

www.ti.com

SNOSAU0C –MAY 2008–REVISED JUNE 2015

9.3.10 Digital Smart Radio

9.3.10.1 Functional Description

The integrated Digital Smart Radio uses a heterodyne receiver architecture with a low intermediate frequency (2

MHz) such that the intermediate frequency filters can be integrated on chip. The receiver consists of a low-noise

amplifier (LNA) followed by two mixers. The intermediate frequency signal processing blocks consist of a poly-

phase bandpass filter (BPF), two hard-limiters (LIM), a frequency discriminator (DET), and a post-detection filter

(PDF). The received signal level is detected by a received signal strength indicator (RSSI).

The received frequency equals the local oscillator frequency (fLO) plus the intermediate frequency (fIF):

fRF = fLO + fIF (supradyne).

The radio includes a synthesizer consisting of a phase detector, a charge pump, an (off-chip) loop-filter, an RF-

frequency divider, and a voltage controlled oscillator (VCO).

The transmitter uses IQ-modulation with bit-stream data that is gaussian filtered. Other blocks included in the

transmitter are a VCO buffer and a power amplifier (PA).

9.3.10.2 Receiver Front-End

The receiver front-end consists of a low-noise amplifier (LNA) followed by two mixers and two low-pass filters for

the I- and Q-channels.

The intermediate frequency (IF) part of the receiver front-end consists of two IF amplifiers that receive input

signals from the mixers, delivering balanced I- and Q-signals to the poly-phase bandpass filter. The poly-phase

bandpass filter is directly followed by two hard-limiters that together generate an AD-converted RSSI signal.

9.3.10.2.1 Poly-Phase Bandpass Filter

The purpose of the IF bandpass filter is to reject noise and spurious (mainly adjacent channel) interference that

would otherwise enter the hard limiting stage. In addition, it takes care of the image rejection.

The bandpass filter uses both the I- and Q-signals from the mixers. The out-of-band suppression should be

higher than 40 dB (f<1 MHz, f>3 MHz). The bandpass filter is tuned over process spread and temperature

variations by the autotuner circuitry. A 5th order Butterworth filter is used.

9.3.10.2.2 Hard-Limiter and RSSI

The I- and Q-outputs of the bandpass filter are each followed by a hard-limiter. The hard-limiter has its own

reference current. The RSSI (Received Signal Strength Indicator) measures the level of the RF input signal.

The RSSI is generated by piece-wise linear approximation of the level of the RF signal. The RSSI has a mV/dB

scale, and an analog-to-digital converter for processing by the baseband circuit. The input RF power is converted

to a 5-bit value. The RSSI value is then proportional to the input power (in dBm).

The digital output from the ADC is sampled on the BPKTCTL signal low-to-high transition.

9.3.10.3 Receiver Back-End

The hard-limiters are followed by a two frequency discriminators. The I-frequency discriminator uses the 90×

phase-shifted signal from the Q-path, while the Q-discriminator uses the 90× phase-shifted signal from the I-path.

A poly-phase bandpass filter performs the required phase shifting. The output signals of the I- and Q-

discriminator are substracted and filtered by a low-pass filter. An equalizer is added to improve the eye-pattern

for 101010 patterns.

After equalization, a dynamic AFC (automatic frequency offset compensation) circuit and slicer extract the

RX_DATA from the analog data pattern. It is expected that the Eb/No of the demodulator is approximately 17 dB.

9.3.10.3.1 Frequency Discriminator

The frequency discriminator gets its input signals from the limiter. A defined signal level (independent of the

power supply voltage) is needed to obtain the input signal. Both inputs of the frequency discriminator have

limiting circuits to optimize performance. The bandpass filter in the frequency discriminator is tuned by the

autotuning circuitry.

Product Folder Links: LMX9830

LMX9830

SNOSAU0C –MAY 2008–REVISED JUNE 2015

www.ti.com

9.3.10.3.2 Post-Detection Filter and Equalizer

The output signals of the FM discriminator first go through a post-detection filter and then through an equalizer.

Both the post-detection filter and equalizer are tuned to the proper frequency by the autotuning circuitry. The

post-detection filter is a low-pass filter intended to suppress all remaining spurious signals, such as the second

harmonic (4 MHz) from the FM detector and noise generated after the limiter.

The post-detection filter also helps for attenuating the first adjacent channel signal. The equalizer improves the

eye-opening for 101010 patterns. The post-detection filter is a third order Butterworth filter.

9.3.10.4 Autotuning Circuitry

The autotuning circuitry is used for tuning the bandpass filter, the detector, the post-detection filter, the equalizer,

and the transmit filters for process and temperature variations. The circuit also includes an offset compensation

for the FM detector.

9.3.10.5 Synthesizer

The synthesizer consists of a phase-frequency detector, a charge pump, a low-pass loop filter, a programmable

frequency divider, a voltage-controlled oscillator (VCO), a delta-sigma modulator, and a lookup table.

The frequency divider consists of a divide-by-2 circuit (divides the 5 GHz signal from the VCO down to 2.5 GHz),

a divide-by-8-or-9 divider, and a digital modulus control. The delta-sigma modulator controls the division ratio and

also generates an input channel value to the lookup table.

9.3.10.5.1 Phase-Frequency Detector

The phase-frequency detector is a 5-state phase-detector. It responds only to transitions, hence phase-error is

independent of input waveform duty cycle or amplitude variations. Loop lockup occurs when all the negative

transitions on the inputs, F_REF and F_MOD, coincide. Both outputs (that is, Up and Down) then remain high.

This is equal to the zero error mode. The phase-frequency detector input frequency range operates at 12 MHz.

9.3.10.6 Transmitter Circuitry

The transmitter consists of ROM tables, two Digital to Analog (DA) converters, two low-pass filters, IQ mixers,

and a power amplifier (PA).

The ROM tables generate a digital IQ signal based on the transmit data. The output of the ROM tables is

inserted into IQ-DA converters and filtered through two low-pass filters. The two signal components are mixed up

to 2.5 GHz by the TX mixers and added together before being inserted into the transmit PA.

9.3.10.6.1 IQ-DA Converters and TX Mixers

The ROM output signals drive an I- and a Q-DA converter. Two Butterworth low-pass filters filter the DA output

signals. The 6-MHz clock for the DA converters and the logic circuitry around the ROM tables are derived from

the autotuner.

The TX mixers mix the balanced I- and Q-signals up to 2.4-2.5 GHz. The output signals of the I- and Q-mixers

are summed.

9.3.10.7 Crystal Requirements

The LMX9830 contains a crystal driver circuit. This circuit operates with an external crystal and capacitors to

form an oscillator. shows the recommended crystal circuit. Table 13 specifies system clock requirements.

The RF local oscillator and internal digital clocks for the LMX9830 is derived from the reference clock at the

CLK+ input. This reference may either come from an external clock or a dedicated crystal oscillator. The crystal

oscillator connections require an Xtal and two grounded capacitors.

It is also important to consider board and design dependant capacitance in tuning crystal circuit. Equations that

follow allow a close approximation of crystal tuning capacitance required, but actual values on board will vary

with capacitive properties of the board. As a result, some fine tuning of crystal circuit that must be done that

cannot be calculated; tuning must be done by testing different values of load capacitance.

Product Folder Links: LMX9830

LMX9830

www.ti.com

SNOSAU0C –MAY 2008–REVISED JUNE 2015

Many different crystals can be used with the LMX9830. Key requirements from Bluetooth specification is + 20

ppm. Additionally, ESR (Equivalent Series Resistance) must be carefully considered. LMX9830 can support

maximum of 230 ΩESR, but it is recommended to stay <100 ΩESR for best performance over voltage and

temperature. Reference Figure 17 for ESR as part of crystal circuit for more information.

9.3.10.7.1 Crystal

The crystal appears inductive near its resonant frequency. It forms a resonant circuit with its load capacitors. The

resonant frequency may be trimmed with the crystal load capacitance.

1. Load Capacitance: For resonance at the correct frequency, the crystal should be loaded with its specified

load capacitance, which is the value of capacitance used in conjunction with the crystal unit. Load

capacitance is a parameter specified by the crystal, typically expressed in pF. The crystal circuit shown in

Figure 13 is composed of:

– C1 (motional capacitance)

– R1 (motional resistance)

– L1 (motional inductance)

– C0 (static or shunt capacitance)

The LMX9830 provides some of the load with internal capacitors Cint. The remainder must come from the

external capacitors and tuning capacitors labeled Ct1 and Ct2 as shown in Figure 12. Ct1 and Ct2 should

have the same the value for best noise performance. The LMX9830 has an additional internal capacitance

CTUNE of 2.6 pF. Crystal load capacitance (CL) is calculated as the following:

CL= Cint + CTUNE + Ct1//Ct2 (1)

The CLabove does not include the crystal internal self-capacitance C0as shown in Figure 13, so the total

capacitance is:

Ctotal = CL+ C0(2)

Based on crystal spec and equation:

CL= Cint + CTUNE + Ct1//Ct2 (3)

CL= 8 pF + 2.6 pF + 6 pF = 16.6 pF (4)

16.6 pF is very close to the TEW crystal requirement of 16 pF load capacitance. With the internal shunt

capacitance Ctotal:

Ctotal = 16.6 pF + 5 pF = 21.6 pF (5)

2. Crystal Pullability: Pullability is another important parameter for a crystal, which is the change in frequency of

a crystal with units of ppm/pF, either from the natural resonant frequency to a load resonant frequency, or

from one load resonant frequency to another. The frequency can be pulled in a parallel resonant circuit by

changing the value of load capacitance. A decrease in load capacitance causes an increase in frequency,

and an increase in load capacitance causes a decrease in frequency.

3. Frequency Tuning: Frequency Tuning is achieved by adjusting the crystal load capacitance with external

capacitors. It is a Bluetooth requirement that the frequency is always within ±20 ppm. Crystal/oscillator must

have cumulative accuracy specifications of ±15 ppm to provide margin for frequency drift with aging and

temperature.

TEW Crystal: The LMX9830 has been tested with the TEW TAS-4025A crystal, reference Table 10 for

specification. Because the internal capacitance of the crystal circuit is 8 pF and the load capacitance is 16

pF, 12 pF is a good starting point for both Ct1 and Ct2. The 2480-MHz RF frequency offset is then tested.

Figure 14 shows the RF frequency offset test results.

Figure 14 shows the results are –20 kHz off the center frequency, which is –1 ppm. The pullability of the

crystal is 2 ppm/pF, so the load capacitance must be decreased by about 1.0 pF. By changing Ct1 or Ct2 to

10 pF, the total load capacitance is decreased by 1.0 pF. Figure 15 shows the frequency offset test results.

The frequency offset is now zero with Ct1 = 10 pF, Ct2 = 10 pF.

Reference Table 11 for crystal tuning values used on Mesa Development Board with TEW crystal.

Product Folder Links: LMX9830

LMX9830

SNOSAU0C –MAY 2008–REVISED JUNE 2015

www.ti.com

Figure 12. LMX9830 Crystal Recommended Circuit

Figure 13. Crystal Equivalent Circuit

Table 10. TEW TAS-4025A

SPECIFICATION VALUE

Package 4.0 × 2.5 × 0.65 mm - 4 pads

Frequency 13.000 MHz

Mode Fundamental

Stability > ±15 ppm @ –40 to +85°C

CLLoad Capacitance 16 pF

ESR 80 Ωmax.

C0Shunt Capacitance 5 pF

Drive Level 50 ±10 µV

Pullability 2 ppm/pF min

Storage Temperature –40 to 85°C

Table 11. TEW on LMX9830 DONGLE

REFERENCE LMX9830

Ct1 12 pF

Ct2 12 pF

Product Folder Links: LMX9830

LMX9830

www.ti.com

SNOSAU0C –MAY 2008–REVISED JUNE 2015

Figure 14. Frequency Offset with 12 pF//12 pF Capacitors Figure 15. Frequency Offset with 10 pF//10 pF Capacitors

9.3.10.7.2 TCXO (Temperature Compensated Crystal Oscillator)

The LMX9830 also can operate with an external TCXO (Temperature Compensated Crystal Oscillator). The

TCXO signal is directly connected to the CLK+.

• Input Impedance: The LMX9830 CLK+ pin has in input impedance of 2 pF capacitance in parallel with >400

kW resistance.

9.3.10.7.3 Optional 32-kHz Oscillator

A second oscillator is provided (see Figure 16) that is tuned to provide optimum performance and low-power

consumption while operating with a 32.768-kHz crystal. An external crystal clock network is required between the

X2_CKI clock input and the X2_CKO clock output signals. The oscillator is built in a Pierce configuration and

uses two external capacitors. Table 12 provides the oscillator’s specifications.

In case the 32 kHz is not used, it is recommended to leave X2_CKO open and connect X2_CKI to GND.

Figure 16. 32.768-kHz Oscillator

Table 12. 32.768-kHz Oscillator Specifications

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

VDD Supply Voltage 1.62 1.8 1.98 V

IDDACT Supply Current (Active) 2 µA

f Nominal Output Frequency 32.768 kHz

VPPOSC Oscillating Amplitude 1.8 V

Duty Cycle 40% 60% —

Product Folder Links: LMX9830

LMX9830

SNOSAU0C –MAY 2008–REVISED JUNE 2015

www.ti.com

9.3.10.7.4 ESR (Equivalent Series Resistance)

LMX9830 can operate with a wide range of crystals with different ESR ratings. Reference Table 13 and

Figure 17 for more details.

Table 13. System Clock Requirements

PARAMETER MIN TYP MAX UNIT

External Reference Clock Frequency(1) 10 13 20 MHz

Frequency Tolerance (over full operating temperature and aging) -20 ±15 20 ppm

Crystal Serial Resistance 230 Ω

External Reference Clock Power Swing, pk to pk 100 200 400 mV

Aging ±1 ppm per year

(1) Supported frequencies from external oscillator (in MHz): 10.00, 10.368, 12.00, 12.60, 12.80, 13.00, 13.824, 14.40, 15.36, 16.00, 16.20,

16.80, 19.20, 19.68, 19.80

Figure 17. ESR vs Load Capacitance for the Crystal Circuit

9.3.10.7.5 Antenna Matching and Front-End Filtering

Figure 18 shows the recommended component layout to be used between RF output and antenna input. Allows

for versatility in the design such that the match to the antenna maybe improved and/or the blocking margin

increased by addition of a LC filter. Refer to antenna application note for further details.

Figure 18. Front End Layout

Product Folder Links: LMX9830

1 + ZC2 À T22

(1 + ZC2 À T12)(1 + ZC2 À T32)

ZC2 À N

A0 = À

KIÀ KVCO

A1 = A0 À (T1 + T3)

A2 = A0 À T1 À T3

T3 = T31 u T1 T2 = ZC2 À (T1 + T3)

I = tan-1 ZC À T1 À T1 + T31

§tan-1(ZC À T1)tan-1(ZC À T1 À T31)

and ZC = 2SFC

N = Fout

Fcomp

LMX9830

www.ti.com

SNOSAU0C –MAY 2008–REVISED JUNE 2015

9.3.10.7.6 Loop Filter Design

The LMX9830 has an external loop filter which must be designed for best performance by the end customer.

This section therefore gives some foresight into its design. Refer also to Loop Filter application note and TI's

Webench on-line design tool for more information.

9.3.10.7.6.1 Component Calculations

The following parameters are required for component value calculation of a third order passive loop filter.

ΦPhase Margin: Phase of the open loop transfer function

FcLoop Bandwidth

Fcomp Comparison Frequency: Phase detector frequency

KVOC VCO gain: Sensitivity of the VCO to control volts

KΦCharge Pump gain: Magnitude of the alternating current during lock

FOUT Maximum RF output frequency

T31 Ratio of the poles T3 to T1 in a 3rd order filter

γGamma optimization parameter

The third order loop filter being defined has the following topology. shown in Figure 19.

Figure 19. Third Order Loop Filter

(6)

Calculate the poles and zeros. Use exact method to solve for T1 using numerical methods,

(7)

(8)

Calculate the loop filter coefficients,

(9)

Product Folder Links: LMX9830

R2 = T2

C2 R3 = A2

C1 À C3 À T2

C2 = A0  C1  C3

C3 = T22 À C1  A2

1 À T22 À C12 + T2 À A1 À C1  A2 À A0

T2 À A0  T2 À A1

T22¸

C1 = À (1 + 1 +

LMX9830

SNOSAU0C –MAY 2008–REVISED JUNE 2015

www.ti.com

Summary:

SYMBOL DESCRIPTION UNIT

n N counter value None

Loop Bandwidth rad/s

T1 Loop filter pole S

T2 Loop filter zero S

T3 Loop filter zero S

A0 Total capacitance nF

A1 First order loop filter coefficient nFs

A2 Second order loop filter coefficient nFs2

Components can then be calculated from loop filter coefficients

(10)

(11)

(12)

Some typical values for the LMX9830 are:

Table 14. Typical Values

DESCRIPTION VALUE UNIT

Comparison Frequency 13 MHz

Phase Margin 48 Pl rad

Loop bandwidth 100 kHz

T3 over T1 ratio 40%

Gamma 1.0

VCO gain 120 MHz per V

Charge pump gain 0.6 mA

Fout 2441 MHz

Which give the following component values:

Table 15. Component Values

DESCRIPTION VALUE UNIT

C1 0.17 nF

C2 2.38 nF

C3 0.04 nF

R2 1737 Ω

R3 7025 Ω

9.3.10.7.6.2 Phase Noise and Lock-Time Calculations

Phase noise has three sources, the VCO, crystal oscillator and the rest of the PLL consisting of the phase

detector, dividers, charge pump and loop filter. Assuming the VCO and crystal are very low noise, it is possible to

put down approximate equations that govern the phase noise of the PLL.

Phase noise (in-band) = PN1Hz + 20Log[N] + 10Log[Fcomp]

where

Product Folder Links: LMX9830

LT = 400

FCWhere 'F = Frequency  tolerance

(1  log10'F) Frequency  jump

LMX9830

www.ti.com

SNOSAU0C –MAY 2008–REVISED JUNE 2015

• PH1Hz is the PLL normalized noise floor in 1 Hz resolution bandwidth (13)

Further out from the carrier, the phase noise will be affected by the loop filter roll-off and hence its bandwidth.

As a rule-of-thumb;

ΔPhase noise = 40Log[ΔFc]

where

• Fc is the relative change in loop BW expressed as a fraction (14)

For example if the loop bandwidth is reduced from 100 kHz to 50 kHz or by one half, then the change in phase

noise will be -12dB. Loop BW in reality should be selected to meet the lower limit of the modulation deviation,

this will yield the best possible phase noise.

Even further out from the carrier, the phase noise will be mainly dominated by the VCO noise assuming the

crystal is relatively clean.

Lock-time is dependent on three factors, the loop bandwidth, the maximum frequency jump that the PLL must

make and the final tolerance to which the frequency must settle. As a rule-of-thumb it is given by:

(15)

These equations are approximations of the ones used by Webench to calculate phase noise and lock-time.

9.3.10.7.6.3 Practical Optimization

In an example where frequency drift and drift rate can be improved though loop filter tweaks, consider the results

taken below. The drift rate is 26.1 kHz per 50 μs and the maximum drift is 25 kHz for DH1 packets, both of which

are exceeding or touching the Bluetooth pass limits. These measurements are taken with component values

shown in Table 15.

Table 16. Loop Filter Optimization Example – Before Optimization

TRM/CA/09/C (CARRIER DRIFT

HOPPONG ON- LOW CHANNEL

DH1 DH3 DH5 LIMITS

Drift Rate/50 μs 26.1 kHz N/A −30.5 kHz ±20 kHz

Max Drift 25 kHz N/A 36 kHz DHI: ±25 kHz

Average Drift −1 kHz N/A 12 kHz DH3: ±40 kHz

Packets Tested 10 N/A 10 D5I: ±40 kHz

Packets Failed 2 N/A 10

Overall Result Failed N/A Failed

Results in Table 17 were taken on the same board with three loop filter values changed. C2 and R2 have been

increased in value and C1 has been reduced. The drift rate has improved by 13 kHz per 50 µs and the maximum

drift has improved by 10 kHz.

Table 17. Loop Filter Optimization Example – After Optimization

TRM/CA/09/C (CARRIER DRIFT

HOPPONG ON- LOW CHANNEL

DH1 DH3 DH5 LIMITS

Drift Rate/50 μs−13.6 kHz N/A −15.6 kHz ±20 kHz

Max Drift 15 kHz N/A 21 kHz DHI: ±25 kHz

Average Drift 3 kHz N/A 1 kHz DH3: ±40 kHz

Packets Tested 10 N/A 10 D5I: ±40 kHz

Packets Failed 0 N/A 0

Overall Result Passed N/A Passed

Product Folder Links: LMX9830

LMX9830

SNOSAU0C –MAY 2008–REVISED JUNE 2015

www.ti.com

The effect of changing these three components is to reduce the loop bandwidth which reduces the phase noise.

The reduction in this noise level corresponds directly to the reduction of noise in the payload area where drift is

measured. This noise reduction comes at the expense of lock-time which can be increased to 120 µs without

suffering any ill effects, however if we continue to reduce the loop BW further the lock-time will increase such that

the PLL does not have time to lock before data transmission and the drift will again increase. Before the lock-

time goes out of spec, the modulation index will start to fall because it is being cut by the reducing loop BW.

Therefore, a compromise must be found between lock-time, phase noise and modulation, which yields best

performance.

Note: The values shown in the LMX9830 data sheet, are the best case optimized values that have been shown

to produce the best overall results and are recommended as a starting point for this design.

Another example of how the loop filter values can affect frequency drift rate, these results below show the DUT

with maximum drift on mid and high channels failing. Adjusting the loop bandwidth as shown provides the

improvement required to pass qualification.

Table 18. Original Results

HOPPONG ON- LOW CHANNEL

DH1 DH3 DH5 LIMITS

Drift Rate/50 μs15.00 15.00 kHz −28.10 kHz −19.10 kHz ±20 kHz

Maximum Drift 19 kHz −37 kHz −20 kHz DHI: ±25 kHz

Average Drift 11 kHz −32 kHz −10 kHz DH3: ±40 kHz

Packets Tested 10 10 10 D5I: ±40 kHz

Packets Failed 0 1 0

Result Pass Fail Pass

HOPPONG ON- MED CHANNEL

DH1 DH3 DH5 LIMITS

Drift Rate/50 μs 15.00 kHz −28.10 kHz −19.10 kHz ±20 kHz

Max Drift 19 kHz −37 kHz −20kHz DHI: ±25 kHz

Average Drift 11 kHz −32 kHz −10 kHz DH3: ±40 kHz

Packets Tested 10 10 10 D5I: ±40 kHz

Packets Failed 0 1 0

Overall Result Pass Fail Pass

HOPPONG ON- HIGH CHANNEL

DH1 DH3 DH5 LIMITS

Drift Rate/50 μs 15.00 kHz −28.10 kHz −19.10 kHz ±20 kHz

Max Drift 19 kHz −37 kHz −20kHz DHI: ±25 kHz

Average Drift 11 kHz −32 kHz −10 kHz DH3: ±40 kHz

Packets Tested 10 10 10 D5I: ±40 kHz

Packets Failed 0 1 0

Overall Result Pass Fail Pass

Product Folder Links: LMX9830

LMX9830

www.ti.com

SNOSAU0C –MAY 2008–REVISED JUNE 2015

Table 19. New Results

HOPPONG ON- LOW CHANNEL

DH1 DH3 DH5 LIMITS

Drift Rate/50 μs−12.00 kHz −15.10 kHz 18.8 kHz ±20 kHz

Max Drift −15 kHz −35 kHz −19 kHz DHI: ±25 kHz

Average Drift −6 kHz −25 kHz −9 kHz DH3: ±40 kHz

Packets Tested 10 10 10 D5I: ±40 kHz

Packets Failed 0 0 0

Overall Result Pass Pass Pass

HOPPONG ON- MED CHANNEL

DH1 DH3 DH5 LIMITS

Drift Rate/50 μs−14.20 kHz −16.10kHz 17.20 kHz ±20 kHz

Max Drift −16 kHz −354 kHz −22 kHz DHI: ±25 kHz

Average Drift −11kHz −27 kHz −9 kHz DH3: ±40 kHz

Packets Tested 10 10 10 D5I: ±40 kHz

Packets Failed 0 0 0

Overall Result Pass Pass Pass

HOPPONG ON- HIGH CHANNEL

DH1 DH3 DH5 LIMITS

Drift Rate/50 μs−12.70 kHz −17.40 kHz 16.50 kHz ±20 kHz

Max Drift −23 kHz −29 kHz −25 kHz DHI: ±25 kHz

Average Drift −12 kHz −25 kHz −16 kHz DH3: ±40 kHz

Packets Tested 10 10 10 D5I: ±40 kHz

Packets Failed 0 0 0

Overall Result Pass Pass Pass

9.3.10.7.6.4 Component Values for NSC Reference Designs

Table 20 shows a list of components for the loop filter values used on TI's reference design, (Serial Dongle) they

have been tweaked and optimized in each case to yield optimum performance for each case. The values differ

slightly from one platform to another due to board paracitics caused by layout differences.

Table 20. Components for Loop Filter Values

PLATFORM C8 C7 C9 R23 R14

LMX9830 Dongle 220 pF 2200 pF 39 pF 3.3 k 10 k

9.3.11 Command Interface

The LMX9830 offers Bluetooth functionality in either a self contained slave functionality or over a simple

command interface. The interface is listening on the UART interface.

The following sections describe the protocol transported on the UART interface between the LMX9830 and the

host in command mode (see Figure 20). In Transparent mode, no data framing is necessary and the device does

not listen for commands.

9.3.11.1 Framing

The connection is considered “Error free”. But for packet recognition and synchronization, some framing is used.

All packets sent in both directions are constructed per the model shown in Table 21.

9.3.11.1.1 Start and End Delimiter

The “STX” char is used as start delimiter: STX = 0x02. ETX = 0x03 is used as end delimiter.

Product Folder Links: LMX9830

LMX9830

SNOSAU0C –MAY 2008–REVISED JUNE 2015

www.ti.com

9.3.11.1.2 Packet Type ID

This byte identifies the type of packet. See Table 22 for details.

9.3.11.1.3 Opcode

The opcode identifies the command to execute. The opcode values can be found within the “LMX9830 Software

User’s Guide” included within the LMX9830 Evaluation Board.

9.3.11.1.4 Data Length

Number of bytes in the Packet Data field. The maximum size is defined with 333 data bytes per packet.

9.3.11.1.5 Checksum:

This is a simple Block Check Character (BCC) checksum of the bytes “Packet type”, “Opcode” and “Data

Length”. The BCC checksum is calculated as low byte of the sum of all bytes (, if the sum of all bytes is 0x3724,

the checksum is 0x24).

Figure 20. Bluetooth Functionality

Table 21. Package Framing

START PACKET END

OPCODE DATA LENGTH CHECK SUM PACKET DATA

DELIMITER TYPE ID DELIMITER

1 Byte 1 Byte 1 Byte 2 Bytes 1 Byte <Data Length> Bytes 1 Byte

-------------Checksum-------------

Table 22. Packet Type Identification

ID DIRECTION DESCRIPTION

0x52 REQUEST A request sent to the Bluetooth module.

'R' (REQ) All requests are answered by exactly one confirm.

0x43 Confirm The Bluetooth modules confirm to a request.

'C' (CFM) All requests are answered by exactly one confirm.

0x69 Indication Information sent from the Bluetooth module that is not a direct confirm to a request.

'i' (IND) Indicating status changes, incoming links, or unrequested events.

0x72 Response An optional response to an indication.

'r' (RES) This is used to respond to some type of indication message.

9.3.11.2 Command Set Overview

The LMX9830 has a well defined command set to:

• Configure the device:

– Hardware settings

– Local Bluetooth parameters

– Service database

• Set up and handle links

Table 23 through Table 33 show the actual command set and the events coming back from the device. A full

documented description of the commands can be found in the “LMX9830 Software User’s Guide”.

Note: For standard Bluetooth operation only commands from Table 23 through Table 25 will be used. Most of the

remaining commands are for configuration purposes only.

Product Folder Links: LMX9830

LMX9830

www.ti.com

SNOSAU0C –MAY 2008–REVISED JUNE 2015

Table 23. Device Discovery

COMMAND EVENT DESCRIPTION

Inquiry Inquiry Complete Search for devices

Device Found Lists BDADDR and class of device

Remote Device Name Remote Device Name Confirm Get name of remote device

Table 24. SDAP Client Commands

COMMAND EVENT DESCRIPTION

SDAP Connect SDAP Connect Confirm Create an SDP connection to remote device

SDAP Disconnect SDAP Disconnect Confirm Disconnect an active SDAP link

Connection Lost Notification for lost SDAP link

SDAP Service Browse Service Browse Confirm Get the services of the remote device

SDAP Service Search SDAP Service Search Confirm Search a specific service on a remote device

SDAP Attribute Request SDAP Attribute Request Confirm Searches for services with specific attributes

Table 25. SPP Link Establishment

COMMAND EVENT DESCRIPTION

Establish SPP Link Establishing SPP Link Confirm Initiates link establishment to a remote device

Link Established Link successfully established

Incoming Link A remote device established a link to the local device

Set Link Timeout Set Link Timeout Confirm Confirms the Supervision Timeout for the existing Link

Get Link Timeout Get Link Timeout Confirm Get the Supervision Timeout for the existing Link

Release SPP Link Release SPP Link Confirm Initiate release of SPP link

SPP Send Data SPP Send Data Confirm Send data to specific SPP port

Incoming Data Incoming data from remote device

Transparent Mode Transparent Mode Confirm Switch to Transparent mode on the UART

Table 26. Storing Default Connections

COMMAND EVENT DESCRIPTION

Connect Default Connection Connect Default Connection Confirm Connects to either one or all stored default connections

Store Default Connection Store Default Connection Confirm Store device as default connection

Get list of Default Connections List of Default Devices

Delete Default Connections Delete Default Connections Confirm

Table 27. Bluetooth Low Power Modes

COMMAND EVENT DESCRIPTION

Set Default Link Policy Defines the link policy used for any incoming or outgoing

Set Default Link Policy Confirm link

Get Default Link Policy Get Default Link Policy Confirm Returns the stored default link policy

Set Link Policy Set Link Policy Confirm Defines the modes allowed for a specific link

Get Link Policy Get Link Policy Confirm Returns the actual link policy for the link

Enter Sniff Mode Enter Sniff Mode Confirm

Exit Sniff Mode Exit Sniff Mode Confirm

Enter Hold Mode Enter Hold Mode Confirm

Power Save Mode Changed Remote device changed power save mode on the link

Product Folder Links: LMX9830

LMX9830

SNOSAU0C –MAY 2008–REVISED JUNE 2015

www.ti.com

Table 28. Audio Control Commands

COMMAND EVENT DESCRIPTION

Establish SCO Link Establish SCO Link Confirm Establish SCO Link on existing RFComm Link

A remote device has established a SCO link to the local

SCO Link Established Indicator device

Release SCO Link Release SCO Link Confirm Release SCO Link Audio Control

SCO Link Released Indicator SCO Link has been released

Change SCO Packet Type Change SCO Packet Type Confirm Changes Packet Type for existing SCO link

SCO Packet Type changed indicator SCO Packet Type has been changed

Set Audio Settings Set Audio Settings Confirm Set Audio Settings for existing Link

Get Audio Settings Get Audio Settings Confirm Get Audio Settings for existing Link

Set Volume Set Volume Confirm Configure the volume

Get Volume Get Volume Confirm Get current volume setting

Mute Mute Confirm Mutes the microphone input

Table 29. Wakeup Functionality

COMMAND EVENT DESCRIPTION

Disable Transport Layer Disabling the UART Transport Layer and activates the

Transport Layer Enabled Hardware Wakeup function

Table 30. SPP Port Configuration and Status

COMMAND EVENT DESCRIPTION

Set Port Config Set Port Config Confirm Set port setting for the virtual serial port link over the air

Get Port Config Get Port Config Confirm Read the actual port settings for a virtual serial port

Notification if port settings were changed from remote

Port Config Changed device

SPP Get Port Status SPP Get Port Status Confirm Returns status of DTR, RTS (for the active RFComm link)

SPP Port Set DTR SPP Port Set DTR Confirm Sets the DTR bit on the specified link

SPP Port Set RTS SPP Port Set RTS Confirm Sets the RTS bit on the specified link

SPP Port BREAK SPP Port BREAK Indicates that the host has detected a break

SPP Port Overrun Error SPP Port Overrun Error Confirm Used to indicate that the host has detected an overrun error

SPP Port Parity Error SPP Port Parity Error Confirm Host has detected a parity error

SPP Port Framing Error SPP Port Framing Error Confirm Host has detected a framing error

Indicates that remote device has changed one of the port

SPP Port Status Changed status bits

Table 31. Local Bluetooth Settings

COMMAND EVENT DESCRIPTION

Read Local Name Read Local Name Confirm Read actual friendly name of the device

Write Local Name Write Local Name Confirm Set the friendly name of the device

Read Local BDADDR Read Local BDADDR Confirm

Change Local BDADDR Note: The BDADDR must be obtained from the IEEE

Change Local BDADDR Confirm organization. See http://standarts.ieee.org/regauth/oui/

Store Class of Device Store Class of Device Confirm

Set Scan Mode Set Scan Mode Confirm Change mode for discoverability and connectability

Set Scan Mode Indication Reports end of Automatic limited discoverable mode

Get Fixed Pin Get Fixed Pin Confirm Reads current PinCode stored within the device

Set Fixed Pin Set Fixed Pin Confirm Set the local PinCode

A PIN code is requested during authentication of an ACL

PIN request link

Get Security Mode Get Security Mode Confirm Get actual Security mode

Product Folder Links: LMX9830

LMX9830

www.ti.com

SNOSAU0C –MAY 2008–REVISED JUNE 2015

Table 31. Local Bluetooth Settings (continued)

COMMAND EVENT DESCRIPTION

Set Security Mode Set Security Mode Confirm Configure Security mode for local device (default 2)

Remove Pairing Remove Pairing Confirm Remove pairing with a remote device

List Paired Devices Get list of paired devices stored in the LMX9830 data

List of Paired Devices memory

Set Default Link Timeout Set Default Link Timeout Confirm Store default link supervision timeout

Get Default Link Timeout Get Default Link Timeout Confirm Get stored default link supervision timeout

Force Master Role Enables/Disables the request for master role at incoming

Force Master Role Confirm connections

Table 32. Local Service Database Configuration

COMMAND EVENT DESCRIPTION

Store generic SDP Record Store SDP Record Confirm Create a new service record within the service database

Enable SDP Record Enable SDP Record Confirm Enable or disable SDP records

Delete All SDP Records Delete All SDP Records Confirm

Ports to Open Ports to Open Confirmed Specify the RFComm Ports to open on start-up

Table 33. Local Hardware Commands

COMMAND EVENT DESCRIPTION

Get Default Audio Settings Get Default Audio Settings Confirm Get stored Default Audio Settings

Set Default Audio Settings Configure Default Settings for Audio Codec and Air Format,

Set Default Audio Settings Confirm stored in NVS

Set Event Filter Set Event Filter Confirm Configures the reporting level of the command interface

Get Event Filter Get Event Filter Confirm Get the status of the reporting level

Read RSSI Read RSSI Confirm Returns an indicator for the incoming signal strength

Change UART Speed Change UART Speed Confirm Set specific UART speed; needs proper ISEL pin setting

Change UART Settings Change UART Settings Confirm Change configuration for parity and stop bits

Test Mode Test Mode Confirm Enable Bluetooth, EMI test, or local loopback

Restore Factory Settings Restore Factory Settings Confirm

Reset Dongle Ready Soft reset

Firmware Upgrade Stops the Bluetooth firmware and executes the In-system-

programming code

Set Clock Frequency Set Clock Frequency Confirm Write Clock Frequency setting in the NVS

Get Clock Frequency Get Clock Frequency Confirm Read Clock Frequency setting from the NVS

Set PCM Slave Configuration Set PCM Slave Configuration Confirm Write the PCM Slave Configuration in the NVS

Write ROM Patch Write ROM Patch Confirm Store ROM Patch in the SimplyBlue module

Read Memory Read Memory Confirm Read from the internal RAM

Write Memory Write Memory Confirm Write to the internal RAM

Read NVS Read NVS Confirm Read from the NVS (EEPROM)

Write NVS Write NVS Confirm Write to the NVS (EEPROM)

Table 34. Initialization Commands

COMMAND EVENT DESCRIPTION

Set Clock and Baudrate Set Clock and Baudrate Confirm Write Baseband frequency and Baudrate used

Enter Bluetooth Mode Enter Bluetooth Mode Confirm Request SimplyBlue module to enter BT mode

Set Clock and Baudrate Set Clock and Baudrate Confirm Write Baseband frequency and Baudrate used

Product Folder Links: LMX9830

LMX9830

SNOSAU0C –MAY 2008–REVISED JUNE 2015

www.ti.com

Table 35. GPIO Control Commands

COMMAND EVENT DESCRIPTION

Set GPIO WPU Set GPIO WPU Confirm Enable/Disable weak pullup resistor on GPIOs

Get GPIO Input State Get GPIO Input States Confirm Read the status of the GPIOs

Set GPIO Direction Set GPIO Direction Confirm Set the GPIOs direction (Input, Ouput)

Set GPIO Output High Set GPIO Output High Confirm Set GPIOs Output to logical High

Set GPIO Output Low Set GPIO Output Low Confirm Set GPIOs Output to logical Low

9.4 Device Functional Modes

9.4.1 Operation Modes

On boot-up, the application configures the module following the parameters in the data area.

9.4.1.1 Automatic Operation

9.4.1.1.1 No Default Connections Stored

In Automatic Operation the module is connectable and discoverable and automatically answers to service

requests. The command interpreter listens to commands and links can be set up. The full command list is

supported.

If connected by another device, the module sends an event back to the host, where the RFComm port has been

connected, and switches to transparent mode.

9.4.1.1.2 Default Connections Stored

If default connections were stored on a previous session, once the LMX9830 is reset, it will attempt to connect

each device stored within the data RAM three times. The host will be notified about the success of the link setup

via a link status event.

9.4.1.1.3 Nonautomatic Operation

In Nonautomatic Operation, the LMX9830 does not check the default connections section within the Data RAM. If

connected by another device, it will NOT switch to transparent mode and continue to interpret data sent on the

UART.

9.4.1.1.4 Transparent Mode

The LMX9830 supports transparent data communication from the UART interface to a Bluetooth link.

If activated, the module does not interpret the commands on the UART which normally are used to configure and

control the module. The packages don’t need to be formatted as described in Table 21. Instead all data are

directly passed through the firmware to the active Bluetooth link and the remote device.

Transparent mode can only be supported on a point-to-point connection. To leave Transparent mode, the host

must send a UART_BREAK signal to the module.

9.4.1.1.5 Force Master Mode

In Force Master mode tries to act like an Accesspoint for multiple connections. For this it will only accept the link

if a Master/slave role switch is accepted by the connecting device. After successful link establishment the

LMX9830 will be Master and available for additional incoming links. On the first incoming link the LMX9830 will

switch to transparent depending on the setting for automatic or command mode. Additional links will only be

possible if the device is not in transparent mode.

9.4.2 Default Connections

The LMX9830 supports the storage of up to 3 devices within its NVS. Those connections can either be

connected after reset or on demand using a specific command.

Product Folder Links: LMX9830

LMX9830

www.ti.com

SNOSAU0C –MAY 2008–REVISED JUNE 2015

Device Functional Modes (continued)

9.4.3 Event Filter

The LMX9830 uses events or indicators to notify the host about successful commands or changes at the

Bluetooth interface. Depending on the application the LMX9830 can be configured. The following levels are

defined:

• No Events:

– The LMX9830 is not reporting any events. Optimized for passive cable replacement solutions.

• Standard LMX9830 events:

– Only necessary events will be reported

• All events:

– Additional to the standard all changes at the physical layer will be reported.

9.4.4 Default Link Policy

Each Bluetooth Link can be configured to support M/S role switch, Hold Mode, Sniff Mode and Park Mode. The

default link policy defines the standard setting for incoming and outgoing connections.

9.4.5 Audio Support

The LMX9830 offers commands to establish and release synchronous connections (SCO) to support Headset or

Handsfree applications. The firmware supports one active link with all available package types (HV1, HV2, HV3),

routing the audio data between the Bluetooth link and the advanced audio interface. In order to provide the

analog data interface, an external audio codec is required. The LMX9830 includes a list of codecs which can be

used.

Table 36. Operation Parameters Stored in LMX9830

PARAMETER DEFAULT VALUE DESCRIPTION

BDADDR (To be requested from IEEE) Bluetooth device address

Local Name Serial port device Friendly Name

PinCode 0000 Bluetooth PinCode

Operation Mode Automatic ON Automatic mode ON or OFF

Default Connections 0 Up to seven default devices to connect to

SDP Database 1 SPP entry:

Name: COM1 Service discovery database, control for supported profiles

Authentication and encryption enabled

UART Speed 9600 Sets the speed of the physical UART interface to the host

UART Settings 1 Stop bit, parity disabled Parity and stop bits on the hardware UART interface

Ports to Open 0000 0001 Defines the RFComm ports to open

Link Keys No link keys Link keys for paired devices

Security Mode 2 Security mode

Page Scan Mode Connectable Connectable/Not connectable for other devices

Inquiry Scan Mode Discoverable/Not Discoverable/Limited Discoverable for other

Discoverable devices

Default Link Policy Configures modes allowed for incoming or outgoing connections

All modes allowed (Role switch, Hold mode, Sniff mode...)

Default Link Timeout The Default Link Timeout configures the timeout, after which the link

20 seconds is assumed lost, if no packages have been received from the remote

device.

Event Filter Defines the level of reporting on the UART

―no events

Standard LMX9830 events reported ―standard events

―standard including ACL link events

Product Folder Links: LMX9830

LMX9830

SNOSAU0C –MAY 2008–REVISED JUNE 2015

www.ti.com

Device Functional Modes (continued)

Table 36. Operation Parameters Stored in LMX9830 (continued)

PARAMETER DEFAULT VALUE DESCRIPTION

Default Audio Settings Configures the settings for the external codec and the air format.

• Codecs:

Motorola MC145483 / Winbond W681360

OKI MSM7717 / Winbond W681310

non PCM Slave

• Airformat:

CVSD

µ-Law

A-Law

9.4.6 Low Power Modes

The LMX9830 supports different Low Power Modes to reduce power in different operating situations. The

modular structure of the LMX9830 allows the firmware to power down unused modules.

The Low Power Modes have influence on:

• UART transport layer

– enabling or disabling the interface

•Bluetooth Baseband activity

– firmware disables LLC and Radio if possible

9.4.7 Power Modes

The following LMX9830 power modes, which depend on the activity level of the UART transport layer and the

radio activity are defined:

The radio activity level mainly depends on application requirements and is defined by standard Bluetooth

operations like inquiry/page scanning or an active link.

A remote device establishing or disconnecting a link may also indirectly change the radio activity level.

The UART transport layer by default is enabled on device power up. In order to disable the transport layer the

command “Disable Transport Layer” is used. Thus only the Host side command interface can disable the

transport layer. Enabling the transport layer is controlled by the HW Wakeup signalling. This can be done from

either the Host or the LMX9830. See also “LMX9830 Software User’s Guide” for detailed information on timing

and implementation requirements.

Table 37. Power Mode Activity

POWER MODE UART ACTIVITY RADIO ACTIVITY REFERENCE CLOCK

PM0 OFF OFF none

PM1 ON OFF Main Clock

PM2 OFF Scanning Main Clock / 32.768 kHz

PM3 ON Scanning Main Clock

PM4 OFF SPP Link Main Clock

PM5 ON SPP Link Main Clock

Product Folder Links: LMX9830

LMX9830

www.ti.com

SNOSAU0C –MAY 2008–REVISED JUNE 2015

Figure 21. Transition Between Different Hardware Power Modes

9.4.8 Enabling and Disabling UART Transport

9.4.8.1 Hardware Wake-Up Functionality

In certain usage scenarios, the host can switch off the transport layer of the LMX9830 in order to reduce power

consumption. Afterwards both devices, host and LMX9830 are able to shut down their UART interfaces.

In order to save system connections the UART interface is reconfigured to hardware wake-up functionality. For a

detailed timing and command functionality, also see the LMX9830 Software User’s Guide.

The interface between host and LMX9830 is defined as described in Figure 22.

Figure 22. UART NULL Modem Connection

9.4.8.2 Disabling the UART Transport Layer

The Host can disable the UART transport layer by sending the “Disable Transport Layer” Command. The

LMX9830 will empty its buffers, send the confirmation event and disable its UART interface. Afterwards the

UART interface will be reconfigured to wake up on a falling edge of the CTS pin.

Product Folder Links: LMX9830

LMX9830

SNOSAU0C –MAY 2008–REVISED JUNE 2015

www.ti.com

9.4.8.3 LMX9830 Enabling the UART Interface

As the Transport Layer can be disabled in any situation the LMX9830 must first make sure the transport layer is

enabled before sending data to the host. Possible scenarios can be incoming data or incoming link indicators. If

the UART is not enabled the LMX9830 assumes that the Host is sleeping and waking it up by activating RTS. To

be able to react on that Wakeup, the host must monitor the CTS pin.

As soon as the host activates its RTS pin, the LMX9830 will first send a confirmation event and then start to

transmit the events.

9.4.8.4 Enabling the UART Transport Layer from the Host

If the host must send data or commands to the LMX9830 while the UART Transport Layer is disabled, it must

first assume that the LMX9830 is sleeping and wake it up using its RTS signal.

When the LMX9830 detects the Wake-Up signal it activates the UART HW and acknowledges the Wake-Up

signal by settings its RTS. Additionally the Wakeup will be confirmed by a confirmation event. When the Host has

received this “Transport Layer Enabled” event, the LMX9830 is ready to receive commands.

Product Folder Links: LMX9830

LMX9830

www.ti.com

SNOSAU0C –MAY 2008–REVISED JUNE 2015

10 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component

specification, and TI does not warrant its accuracy or completeness. TI’s customers are

responsible for determining suitability of components for their purposes. Customers should

validate and test their design implementation to confirm system functionality.

10.1 Typical Application

Figure 23. Reference Design

Product Folder Links: LMX9830

LMX9830

SNOSAU0C –MAY 2008–REVISED JUNE 2015

www.ti.com

Typical Application (continued)

10.1.1 Design Requirements

10.1.1.1 Evaluation Design

Recommended that a 4-component T-PI pad be used between RF out and antenna input. Allows for versatility in

the design such that the match to the antenna maybe improved and/or blocking margin increased by adding a LC

filter.

For a schematic including an RS232 communication with the host, see the LMX9830DONGLE designer guide,

SNOA518.

10.1.2 Detailed Design Procedure

10.1.2.1 Antenna Matching Network

The antenna matching network may or may not be required, depending upon the impedance of the antenna

chosen and the trace impedance on the PCB. A 6.8-pF blocking capacitor is recommended.

NOTE

Additional L network placement is recommended for tuning the trace impedance if needed.

10.1.2.2 Host Interface

To set the logic thresholds of the LMX9830 to match the host system, IOVCC (pin C4) must be connected to the

logic power supply of the host system. It is highly recommended that a 10-pF bypass capacitor be placed as

close as possible to the IOVCC pad on the LMX9830.

10.1.2.3 Frequency and Baud Rate Selections

OP3, OP4, OP5 can be strapped to the host logic 0 and 1 levels to set the host interface boot-up configuration.

Alternatively all OP3, OP4, OP5 can be hardwired over 1-kW pullup/pulldown resistors. See Table 10.

10.1.2.4 Start-Up Sequence Options

OP6, OP7, and Env1 can be left unconnected (both OP6 and OP7 are pulled low and ENV1 is pulled high

internally), These can be hardwired over 1-kW pullup/pulldown resistors. See Table 9.

10.1.2.5 Clock Input

The clock source must be placed as close as possible to the LMX9830. The quality of the radio performance is

directly related to the quality of the clock source connected to the oscillator port on the LMX9830. Careful

attention must be paid to the crystal/oscillator parameters or radio performance could be drastically reduced.

10.1.2.6 Soldering

The LMX9830 bumps are designed to melt as part of the Surface Mount Assembly (SMA) process. In order to

ensure reflow of all solder bumps and maximum solder joint reliability while minimizing damage to the package,

recommended reflow profiles should be used.

Table 38,Table 39 and Figure 24 provide the soldering details required to properly solder the LMX9830 to

standard PCBs. The illustration serves only as a guide and TI's is not liable if a selected profile does not work.

See IPC/JEDEC J-STD-020C, July 2004 for more information.

Product Folder Links: LMX9830

LMX9830

www.ti.com

SNOSAU0C –MAY 2008–REVISED JUNE 2015

Typical Application (continued)

Table 38. Soldering Details

PARAMETER VALUE

PCB Land Pad Diameter 13 mil

PCB Solder Mask Opening 19 mil

PCB Finish (HASL details) Defined by customer or manufacturing facility

Stencil Aperture 17 mil

Stencil Thickness 5 mil

Solder Paste Used Defined by customer or manufacturing facility

Flux Cleaning Process Defined by customer or manufacturing facility

Reflow Profiles See Figure 24

Table 39. Classification Reflow Profiles(1)(2)

PROFILE FEATURE NOPB ASSEMBLY

Average Ramp-Up Rate (TsMAX to Tp) 3°C/second maximum

Preheat:

Temperature Min (TsMIN) 150°C

Temperature Max (TsMAX) 200°C

Time (tsMIN to tsMAX) 60180 seconds

Time maintained above:

Temperature (TL) 217°C

Time (tL) 60150 seconds

Peak/Classification Temperature (Tp) 260 + 0°C

Time within 5°C of actual Peak Temperature (tp) 20 – 40 seconds

Ramp-Down Rate 6°C/second maximum

Time 25 °C to Peak Temperature 8 minutes maximum

Reflow Profiles See Figure 24

(1) See IPC/JEDEC J-STD-020C, July 2004.

(2) All temperatures refer to the top side of the package, measured on the package body surface.

10.1.3 Application Curves

Figure 24. Typical Reflow Profiles

Product Folder Links: LMX9830

LMX9830

SNOSAU0C –MAY 2008–REVISED JUNE 2015

www.ti.com

10.2 System Examples

10.2.1 Usage Scenarios

10.2.1.1 Scenario 1: Point-to-Point Connection

LMX9830 acts only as slave, no further configuration is required.

Example: Sensor with LMX9830; hand-held device with standard Bluetooth option.

The SPP conformance of the LMX9830 allows any device using the SPP to connect to the LMX9830.

Because of switching to Transparent automatically, the controller has no need for an additional protocol layer;

data is sent raw to the other Bluetooth device.

On default, a PinCode is requested to block unallowed targeting.

Figure 25. Point-to-Point Connection

10.2.1.2 Scenario 2: Automatic Point-to-Point Connection

LMX9830 at both sides.

Example: Serial Cable Replacement.

Device #1 controls the link setup with a few commands as described.

If step 5 is executed, the stored default device is connected (step 4) after reset (in Automatic mode only) or by

sending the command “Connect to Default Device”. The command can be sent to the device at any time.

If step 6 is left out, the microcontroller must use the command “Send Data” instead of sending data directly to the

module.

Product Folder Links: LMX9830

LMX9830

www.ti.com

SNOSAU0C –MAY 2008–REVISED JUNE 2015

System Examples (continued)

Figure 26. Automatic Point-to-Point Connection

10.2.1.3 Scenario 3: Point-to-Multipoint Connection

LMX9830 acts as master for several slaves.

Example: Two sensors with LMX9830; one hand-held device with implemented LMX9830.

Serial Devices #2 and #3 establish the link automatically as soon as they are contacted by another device. No

controller interaction is necessary for setting up the Bluetooth link. Both switch automatically into Transparent

mode. The host sends raw data over the UART.

Serial Device #1 is acting as master for both devices. As the host must decide to or from which device data is

coming from, data must be sent using the “Send data command”. If the device receives data from the other

devices, it is packaged into an event called “Incoming data event”. The event includes the device related port

number.

If necessary, a link configuration can be stored as default in the master Serial Device #1 to enable the automatic

reconnect after reset, power up, or by sending the “connect default connection” command.

Product Folder Links: LMX9830

LMX9830

SNOSAU0C –MAY 2008–REVISED JUNE 2015

www.ti.com

System Examples (continued)

Figure 27. Automatic Point-to-Point Connection

Product Folder Links: LMX9830

LMX9830

www.ti.com

SNOSAU0C –MAY 2008–REVISED JUNE 2015

11 Power Supply Recommendations

11.1 Filtered Power Supply

It is important to provide the LMX9830 with adequate ground planes and a filtered power supply. TI highly

recommends placing a 0.1-µF and a 10-pF bypass capacitor as close as possible to VCC (pin E1) on the

LMX9830 for 2.5-V and 3.3-V operations.

NOTE

For 1.8-V operations, VCC filtering is not required and VCC should be tied directly to

ground.

Figure 28 represents a typical system functional schematic for the LMX9830 in its normal 3.0-V or 3.3-V system

interface operation.

Figure 29 represents a typical system functional schematic for the LMX9830 in its 1.8-V system interface

operation.

Product Folder Links: LMX9830

LMX9830

SNOSAU0C –MAY 2008–REVISED JUNE 2015

www.ti.com

Filtered Power Supply (continued)

Capacitor values, Ct1 and Ct2 may vary depending on board design crystal manufacturer specification.

Note: (CL= crystal capacitance load rating) of 12 pF or greater rating is required from the crystal vendor of choice to

best match module impedance and give a viable tuning range for the system.

For grounding, one ground plane is used for both RF and Digital Grounding.

For Antenna it is recommend that a 3 component L type pad with series 6.8pF blocker cap be used between RF

output and antenna matching L network. This allows for versatility in the design such that the match to the antenna

maybe improved and/or the blocking margin increased by use a LC filter.

Figure 28. 2.5-V to 3.3-V Example Functional System Schematic

Product Folder Links: LMX9830

LMX9830

www.ti.com

SNOSAU0C –MAY 2008–REVISED JUNE 2015

Filtered Power Supply (continued)

Capacitor values, Ct1 and Ct2 may vary depending on board design crystal manufacturer specification.

Note: (CL= crystal capacitance load rating) of 12 pF or greater rating is required from the crystal vendor of choice to

best match module impedance and give a viable tuning range for the system.

For grounding, one ground plane is used for both RF and Digital Grounding.

For Antenna, TI recommends that a 3-component L type pad with series 6.8-pF blocker cap be used between RF

output and antenna matching L network as shown above. This allows for versatility in the design such that the match

to the antenna maybe improved and/or the blocking margin increased by use a LC filter.

Figure 29. 1.8-V Example Functional System Schematic

Product Folder Links: LMX9830

LMX9830

SNOSAU0C –MAY 2008–REVISED JUNE 2015

www.ti.com

12 Device and Documentation Support

12.1 Device Support

LMX9830 Software User’s Guide,SNWC001

LMX9830DONGLE Evaluation Module, http://www.ti.com/tool/lmx9830dongle

12.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT

CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES

OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER

ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

12.2 Documentation Support

12.2.1 Related Documentation

AN-1810 LMX9830 Design Checklist,SNOA518

12.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective

contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of

Use.

TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration

among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help

solve problems with fellow engineers.

Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and

contact information for technical support.

12.4 Trademarks

E2E is a trademark of Texas Instruments.

Bluetooth is a registered trademark of Bluetooth SIG, Inc..

All other trademarks are the property of their respective owners.

12.5 Electrostatic Discharge Caution

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

12.6 Glossary

SLYZ022 —TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.

13 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

Product Folder Links: LMX9830

PACKAGE OPTION ADDENDUM

www.ti.com 10-Dec-2020

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead finish/

Ball material

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

LMX9830SM/NOPB NRND NFBGA NZB 60 320 RoHS & Green SNAGCU Level-4-260C-72 HR -40 to 125 9830SM

LMX9830SMX/NOPB NRND NFBGA NZB 60 2500 RoHS & Green SNAGCU Level-4-260C-72 HR -40 to 125 9830SM

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two

lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

LMX9830SMX/NOPB NFBGA NZB 60 2500 330.0 16.4 6.4 9.4 2.3 8.0 16.0 Q2

PACKAGE MATERIALS INFORMATION

www.ti.com 21-Nov-2016

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

LMX9830SMX/NOPB NFBGA NZB 60 2500 367.0 367.0 38.0

PACKAGE MATERIALS INFORMATION

www.ti.com 21-Nov-2016

Pack Materials-Page 2

MECHANICAL DATA

NZB0060A

www.ti.com

SLF60A (Rev A)

IMPORTANT NOTICE AND DISCLAIMER

TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE

DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”

AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY

IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD

PARTY INTELLECTUAL PROPERTY RIGHTS.

These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate

TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable

standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you

permission to use these resources only for development of an application that uses the TI products described in the resource. Other

reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third

party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims,

damages, costs, losses, and liabilities arising out of your use of these resources.

TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on

ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable

warranties or warranty disclaimers for TI products.

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265