TVR2B,TVR2G,TVR2J
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TOSHIBA Fast Recovery Diode Silicon Diffused Type
TVR2B,TVR2G,TVR2J
TV Applications (fast recovery)
• Average Forward Current: IF (AV) = 0.5 A (Ta = 50°C)
• Repetitive Peak Reverse Voltage: VRRM = 100 to 600 V
• Reverse Recovery Time: trr = 5 to 20 µs
• Plastic Mold Type.
Absolute Maximum Ratings (Ta = 25°C)
Characteristics Symbol Rating Unit
TVR2B 100
TVR2G 400
Repetitive peak
reverse voltage
TVR2J
VRRM
600
V
TVR2B 50
TVR2G 300
Reverse voltage
(DC)
TVR2J
VR
500
V
Average forward current (Ta = 50°C) IF (AV) 0.5 A
30 (50 Hz)
Peak one cycle surge forward current
(non repetitive) IFSM
33 (60 Hz)
A
Junction temperature Tj −40 to 125 °C
Storage temperature range Tstg −40 to 125 °C
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test report
and estimated failure rate, etc).
Electrical Characteristics (Ta = 25°C)
Characteristics Symbol Test Condition Min Typ. Max Unit
Peak forward voltage VFM IFM = 1.0 A ⎯ ⎯ 1.4 V
Repetitive peak reverse current IRRM VRRM = Rated ⎯ ⎯ 10 µA
Reverse recovery time trr IF = 20 mA, IR = 1 mA 5 ⎯ 20 µs
Forward recovery voltage Vfr IF = 0.1 A, tr = 100 ns, tw = 5 µs ⎯ ⎯ 6 V
Note1: Soldering: 5 mm is the minimum to be kept between case and soldering part.
Note2: Lead bending: 5 mm is the minimum to be kept from the case when bend the lead wire.
Unit: mm
JEDEC DO-41
JEITA ―
TOSHIBA 3-3C1A
Weight: 0.3 g (typ.)
TVR2B,TVR2G,TVR2J
2006-11-07
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Marking
Abbreviation Code Part No.
VR2B TVR2B
VR2G TVR2G
VR2J TVR2J
Handling Precaution
The absolute maximum ratings denote the absolute maximum ratings, which are rated values and must not be
exceeded during operation, even for an instant. The following are the general derating methods that we recommend
when you design a circuit with a device.
VRRM: We recommend that the worst case voltage, including surge voltage, be no greater than 80% of the
absolute maximum rating of VRRM for a DC circuit and be no greater than 50% of that of VRRM for
an AC circuit. VRRM has a temperature coefficient of 0.1%/°C. Take this temperature coefficient into
account designing a device at low temperature.
IF(AV): We recommend that the worst case current be no greater than 80% of the absolute maximum rating
of IF(AV). Carry out adequate heat design. If you can’t design a circuit with excellent heat radiation,
set the margin by using an allowable Tamax-IF(AV) curve.
This rating specifies the non-repetitive peak current in one cycle of a 50-Hz sine wave, condition angle 180.
Therefore, this is only applied for an abnormal operation, which seldom occurs during the lifespan of the device.
We recommend that a device be used at a Tj of below 100°C under the worst load and heat radiation conditions.
Thermal resistance between junction and ambient fluctuates depending on the device’s mounting condition. When
using a device, design a circuit board and a soldering land size to match the appropriate thermal resistance value.
Please refer to the Rectifiers databook for further information.
Lot No.
A line indicates
lead (Pb)-free package or
lead (Pb)-free finish.
VR
2J
Part No. (or abbreviation code)
TVR2B,TVR2G,TVR2J
2006-11-07
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Average forward current IF (AV) (A)
Ta m ax – I F (AV)
Maximum allowable temperature
Ta m a x ( ° C)
Peak surge forward current IFSM (A)
Number of cycles
Surge forward current (non-repetitive)
200
0
0
160
120
80
40
0.1 0.2 0.3 0.4 0.5 0.6
Resistive and inductive load
Capacitive load
Tj = 25°C
50
0
1
40
30
20
10
3 10 30 100
60 Hz
50 Hz
TVR2B,TVR2G,TVR2J
2006-11-07
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• The information contained herein is subject to change without notice.
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of
TOSHIBA or others.
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc..
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk.
• TOSHIBA products should not be embedded to the downstream products which are prohibited to be produced
and sold, under any law and regulations.
030619EAA
RESTRICTIONS ON PRODUCT USE
