Technical Data Sheet
서식번호
: SSC- QP- 7- 07- 25 (Rev.0.0)
Rev. 02
Rev. 02
January 2012
January 2012
WWW.SEOULSEMICON.COM
WWW.SEOULSEMICON.COM
Specification
THBTGFR421
Customer
ApprovalApprovalDrawn
SSC
Pb Free
Technical Data Sheet
서식번호
: SSC- QP- 7- 07- 25 (Rev.0.0)
Rev. 02
Rev. 02
January 2012
January 2012
WWW.SEOULSEMICON.COM
WWW.SEOULSEMICON.COM
[ Contents ]
1. Description
2. Absolute maximum ratings
3. Electro-Optical characteristics
4. Characteristic diagrams
5. Reliability result
6. Rank
7. Outline Dimension
8. Material
9. Reel Structure
10. Packing
11. Soldering profile
12. Precaution for Use
서식번호
: SSC- QP- 7- 07- 25 (Rev.0.0)
Technical Data Sheet
Rev. 02
Rev. 02
January 2012
January 2012
WWW.SEOULSEMICON.COM
WWW.SEOULSEMICON.COM
THBTGFR421
Cellular phone’s keypad
lightning
Information Boards
Features
Applications
- Small size suitable for compact
appliances.
- Surface-mounted chip LED
device.
- Pb-free and RoHS complaint
component.
- High brightness, High efficiency
- Tape and Reel packing.
- Increases the life time of battery.
1. Description
THBTGFR421
• 1.6 X 1.5 X 0.5 mm
• Untinted, Diffused flat
mold
• Add Zener Diode
• Wavelength :
-. Red : 625 nm
-. Green : 525 nm
-. Blue: 465nm
Technical Data Sheet
서식번호
: SSC- QP- 7- 07- 25 (Rev.0.0)
Rev. 02
Rev. 02
January 2012
January 2012
WWW.SEOULSEMICON.COM
WWW.SEOULSEMICON.COM
[Note] All measurements were made under the standardized environment of SSC.
(Tolerance : I
v
±10 %,
λ
d
±2 nm, V
F
±0.1 V)
2. Absolute maximum ratings
3. Electro-Optical Characteristics
*1 I
FM
conditions: Pulse width Tw
≤
1ms and Duty ratio
≤
1/10
(Ta=25
℃
℃℃
℃
)
50
20
66
Blue
50
20
66
GreenRed
℃
-40 ~ 100T
stg.
Storage Temperature
mW69P
d
Power Dissipation
℃
-40 ~ 85T
opr.
Operation
Temperature
mA100I
FM *1
Peak Forward
Current
mA30I
F
Forward Current
Unit
Value
SymbolParameter
㎂
10--V
R
=5VI
R
RedReverse Current
1.50.860.7
I
R
=10mA
Green
-20-
Δ
λ
Blue
-30-Green
472465460Blue
855530Blue
290220150Green
V
R
3.33.12.7
V
F
Blue
3.33.12.7Green
R,G,B
Red
Green
Red
Red
Blue
Red
color
mcd
1007050
I
F
=10
㎃
I
V
Luminous
Intensity
*2
635625615
I
F
=10
㎃
-
-
515
0.7
1.7
Min
-
-
535
1.5
2.3
Max
120
15
525
0.86
1.9
Typ
˚
I
F
=30
㎃
(total)
2
θ
1/2
Viewing Angle
*3
nm
λ
d
Wavelength
VI
F
=10
㎃
Forward Voltage
nmI
F
=10
㎃
Spectral
Bandwidth
mAReverse Voltage
UnitConditionSymbolParameter
(Ta=25
℃
℃℃
℃
)
*2 The luminous intensity IV is measured at the peak of the spatial pattern which may not be aligned with the
mechanical axis of the LED package.
*3
θ
1/2
is the off-axis where the luminous intensity is 1/2 the peak intensity.
Technical Data Sheet
서식번호
: SSC- QP- 7- 07- 25 (Rev.0.0)
Rev. 02
Rev. 02
January 2012
January 2012
WWW.SEOULSEMICON.COM
WWW.SEOULSEMICON.COM
Forward Current vs.
Forward Voltage
Relative Luminous Intensity vs.
Forward Current
Ta = 25
o
Spectrum
4. Characteristic Diagrams
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
0.1
1
10
100
Forward Voltage V
F
[V]
Forward Current I
F
[mA]
RED
GREEN
BLUE
0 5 10 15 20 25 30 35 40
0
20
40
60
80
100
120
140
160
180
Relative Intensity I
V
[%]
Forward Current I
F
[mA]
RED
GREEN
BLUE
300 400 500 600 700 800
0.0
0.2
0.4
0.6
0.8
1.0
Intensity[a.u.]
Wavelength [nm]
-25 0 25 50 75 100
0
10
20
30
40
Red
Blue / Green
Forward current I
F
(mA)
Ambient temperature Ta(
o
C)
Forward Current vs.
Ambient Temperature (per die)
Technical Data Sheet
서식번호
: SSC- QP- 7- 07- 25 (Rev.0.0)
Rev. 02
Rev. 02
January 2012
January 2012
WWW.SEOULSEMICON.COM
WWW.SEOULSEMICON.COM
Radiation Diagram Ta = 25
o
0
30
60
90
120
150
180
Technical Data Sheet
서식번호
: SSC- QP- 7- 07- 25 (Rev.0.0)
Rev. 02
Rev. 02
January 2012
January 2012
WWW.SEOULSEMICON.COM
WWW.SEOULSEMICON.COM
5. Reliability Test
0/221 time
85
℃
, 85% 24hrs Reflow 3 times
(Max 260
℃
10sec) Thermal shock
30 cycle
Thermal
resistance
Test
0/22500 hrs10mA, @60
℃
,90%
Operating at High
temperature
/ High humidity
0/22500 hrs10mA, @85
℃
Operating at High
temperature
0/22100 cycle-40~85
℃
Shift (2hr/cycle)
Thermal shock
test
0/22500 hrs10mA, @25
℃
Operating at
Room
temperature
Number Of
Damaged
Duration
/ Cycle
Test ConditionsItem
*Criterion
Initial value ±0.1VV
F
> Initial value * 0.5Iv
OK
MSL : 2a (30
℃
, 60% : 4 weeks)
Technical Data Sheet
서식번호
: SSC- QP- 7- 07- 25 (Rev.0.0)
Rev. 02
Rev. 02
January 2012
January 2012
WWW.SEOULSEMICON.COM
WWW.SEOULSEMICON.COM
6. Rank
I
F
= 10mA
3.1~3.3
2.9~3.1
465~472
460~465
465~472
460~465
465~472
460~465
465~472
460~465
465~472
460~465
465~472
460~465
465~472
460~465
465~472
460~465
465~472
460~465
BLUE
515~535
GREEN
615~635
RED
W
d
[nm]
2.7~2.9
1.7~2.3
2.9~3.1
2.7~2.9
Q
O
M
3.1~3.3
K
2.9~3.1
J
2.7~2.9
H
3.1~3.3
F
2.9~3.1
D
2.7~2.9
B
3.1~3.3
BLUEGREENRED
V
F
[V]
R
P
N
L
I
G
E
C
A
RANK
30~85150~29050~100
BLUEGREENRED
I
V
[mcd]
Technical Data Sheet
서식번호
: SSC- QP- 7- 07- 25 (Rev.0.0)
Rev. 02
Rev. 02
January 2012
January 2012
WWW.SEOULSEMICON.COM
WWW.SEOULSEMICON.COM
7. Outline Dimension
Tolerance ±0.1, Unit :
㎜
± 0.05
[ Inner Circuit Diagram]
Common
Red
Anode
[ Recommended Solder Pattern]
Blue
Green
8. Material
Si
Zener
InGaN
G/BRed
Au
Electrode
EpoxyGoldAlInGaPBT-ResinMaterial
Encapsulatewire
chip
PackageItem
Technical Data Sheet
서식번호
: SSC- QP- 7- 07- 25 (Rev.0.0)
Rev. 02
Rev. 02
January 2012
January 2012
WWW.SEOULSEMICON.COM
WWW.SEOULSEMICON.COM
(1) Quantity : 4000pcs/Reel
(2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm
(3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the
cover tape is turned off from the carrier tape at 10
℃
angle to be the carrier tape
(4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a
damp proof Package
9. Reel Structure
± 0.05
(2.75)
4.0
Label
- 3
+0
2
180
13
± 0.2
60
-0
+0.2
22
± 0.2
9
11.4
± 0.3
± 0.1
2.0
± 0.05
4.0
1.5
0.5
± 0.1
+0.1
- 0
1.75
0.2
8.0
3.5
± 0.05
±0.05
±0.2
±0.05
± 0.05
±0.1
± 0.05
1.73
1.75
0.7
Tolerance:
±
0.2, Unit:
㎜
Technical Data Sheet
서식번호
: SSC- QP- 7- 07- 25 (Rev.0.0)
Rev. 02
Rev. 02
January 2012
January 2012
WWW.SEOULSEMICON.COM
WWW.SEOULSEMICON.COM
10. Packing
Outer Box Structure
ca b
7inch 245 220 142
SIZE (mm)
Material : Paper(SW3B(B))
TYPE
Aluminum Vinyl Bag
Reel
DESI PAK
RANK:
PART NUMBER :
LOT NUMBER : XXXXXXXXXX
QUANTITY : XXXX
XXX
SEOUL SEMICONDUCTOR CO., LTD.
RANK:
PART NUMBER :
LOT NUMBER : XXXXXXXXXX
QUANTITY : XXXX
XXX
SEOUL SEMICONDUCTOR CO., LTD.
XXXXXX
XXXXXX
1SIDE RANK:
PART NUMBER :
LOT NUMBER : XXXXXXXXXX
QUANTITY : XXXX
SEOUL SEMICONDUCTOR CO., LTD.
XXXXXX
a
b
c
1
RoHS
2
2SIDE
LOT NUMBER Rank QTY
SEOUL SEMICONDUCTOR CO., LTD.
####
###
###
###
#######
HUMIDITY INDICATOR
Technical Data Sheet
서식번호
: SSC- QP- 7- 07- 25 (Rev.0.0)
Rev. 02
Rev. 02
January 2012
January 2012
WWW.SEOULSEMICON.COM
WWW.SEOULSEMICON.COM
10 sec. Max.
Soldering time
Condition
240
℃
℃℃
℃
Max.Peak-Temperature
120 sec. Max.Pre-heat time
120~150
℃
℃℃
℃
Pre-heat
Lead Solder
10 sec. Max.
Soldering time
Condition
260
℃
℃℃
℃
Max.Peak-Temperature
120 sec. Max.Pre-heat time
150~200
℃
℃℃
℃
Pre-heat
Lead Free Solder
Lead Solder
2.5~5 C / sec.
o
oo
Pre-heating
120~150 C
120sec. Max.
60sec. Max.
Above 200 C
o
240 C Max.
10 sec. Max.
2.5~5 C / sec.
260 C Max.
10 sec. Max.
o
60sec. Max.
Above 220 C
120sec. Max.
Pre-heating
150~200 C
1~5 C / sec. o
o
o
o
1~5 C / sec.
Lead-frame Solder
(1) Lead Solder
(2) Lead-Free Solder
(3) Hand Soldering conditions
Do not exceed 3 seconds at maximum 280ºC under soldering iron.
Note : In case that the soldered products are reused in soldering process,
we don’t guarantee the products.
11. Soldering profile
Technical Data Sheet
서식번호
: SSC- QP- 7- 07- 25 (Rev.0.0)
Rev. 02
Rev. 02
January 2012
January 2012
WWW.SEOULSEMICON.COM
WWW.SEOULSEMICON.COM
12. Precaution for Use
(1) Storage
LEDs must be stored at clean atmosphere. If the LEDs are stored for 3 months or more
after shipment from SSC, storage in a sealed container with a nitrogen atmosphere is
recommended. To avoid absorption of moisture, it is recommended to store in a dry box
(or a desiccator) with a desiccant.
* Shelf Life : 12 months at < 40ºC and 90%RH
(2) Attention after open.
LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect
the light transmission efficiency, causing the light intensity to drop. After opened and
mounted the soldering shall be quickly.
* Within 672 hours at factory conditions of equal to or less than 30ºC/60%RH, or
Stored at < 10% RH
(3) Repack unused products with anti-moisture packing, fold to close any opening and
then store in a dry place.
(4) In the case of change color of indicator on desiccant, components shall be dried
10-12hr at 60±5ºC.
(5) When the LED is operating, the driving current should be determined after considering
the maximum ambient temperature requirements.
(6) When using multiple LEDs, It is recommended to connect a resistor on each LED.
Otherwise, LEDs may vary due to variation in forward voltage of the LEDs.
(7) The driving circuit must be designed to allow forward voltage only when it is ON or
OFF. If the reverse voltage is applied to LED, migration can be generated resulting
in LED damage
(8) Any mechanical force or excessive vibration should be avoided during temperature
cooling process to normal temperature after reflow.
(9) Rapid cooling shall be avoided.
(10) LED should not be placed on a flexible area on the PCB.
(11) This device should not be used in any type of fluid such as water, oil, organic solvent
etc. When washing is required, IPA should be used.
(12) Anti radioactive ray design is not considered for the products.
(13) Damage prevention from ESD or Surge.
It is highly recommended to use the wrist-band or anti electrostatic gloves when handling
the LED’s All devices, equipments and machines mush be properly grounded
(14) The appearance and specifications of the product may be modified for improvement
without notice.
