LM5069MMX-2/NOPB - NATIONAL SEMICONDUCTOR

LM5069

LM5069 Positive High Voltage Hot Swap / Inrush Current Controller with

Power Limiting

Literature Number: SNVS452A

March 5, 2008

LM5069

Positive High Voltage Hot Swap / Inrush Current Controller

with Power Limiting

General Description

The LM5069 positive hot swap controller provides intelligent

control of the power supply connections during insertion and

removal of circuit cards from a live system backplane or other

"hot" power sources. The LM5069 provides in-rush current

control to limit system voltage droop and transients. The cur-

rent limit and power dissipation in the external series pass N-

Channel MOSFET are programmable, ensuring operation

within the Safe Operating Area (SOA). The POWER GOOD

output indicates when the output voltage is within 1.25V of the

input voltage. The input under-voltage and over-voltage lock-

out levels and hysteresis are programmable, as well as the

initial insertion delay time and fault detection time. The

LM5069-1 latches off after a fault detection, while the

LM5069-2 automatically restarts at a fixed duty cycle. The

LM5069 is available in a 10 pin MSOP package.

Features

■Wide operating range: +9V to +80V

■In-rush current limit for safe board insertion into live power

sources

■Programmable maximum power dissipation in the external

pass device

■Adjustable current limit

■Circuit breaker function for severe over-current events

■Internal high side charge pump and gate driver for external

N-channel MOSFET

■Adjustable under-voltage lockout (UVLO) and hysteresis

■Adjustable over-voltage lockout (OVLO) and hysteresis

■Initial insertion timer allows ringing and transients to

subside after system connection

■Programmable fault timer avoids nuisance trips

■Active high open drain POWER GOOD output

■Available in latched fault and automatic restart versions

Applications

■Server Backplane Systems

■Base Station Power Distribution Systems

■Solid State Circuit Breaker

■24V/48V Industrial Systems

Package

■MSOP-10

Typical Application

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Positive Power Supply Control

LM5069 Positive High Voltage Hot Swap / Inrush Current Controller with Power Limiting

Connection Diagram

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Top View

10-Lead MSOP

Ordering Information

Order Number Fault Response Package Type NSC Package Drawing Supplied As

LM5069MM-1 Latch Off

MSOP-10 MUB10A

1000 Units on Tape and Reel

LM5069MMX-1 Latch Off 3500 Units on Tape and Reel

LM5069MM-2 Auto Restart 1000 Units on Tape and Reel

LM5069MMX-2 Auto Restart 3500 Units on Tape and Reel

Pin Descriptions

Pin # Name Description Applications Information

1 SENSE Current sense input The voltage across the current sense resistor (RS) is measured from VIN to this

pin. If the voltage across RS reaches 55mV the load current is limited and the fault

timer activates.

2 VIN Positive supply input A small ceramic bypass capacitor close to this pin is recommended to suppress

transients which occur when the load current is switched off.

3 UVLO Under-voltage lockout An external resistor divider from the system input voltage sets the under-voltage

turn-on threshold. An internal 21 µA current source provides hysteresis. The

enable threshold at the pin is 2.5V. This pin can also be used for remote shutdown

control.

4 OVLO Over-voltage lockout An external resistor divider from the system input voltage sets the over-voltage

turn-off threshold. An internal 21 µA current source provides hysteresis. The

disable threshold at the pin is 2.5V.

5 GND Circuit ground

6 TIMER Timing capacitor An external capacitor connected to this pin sets the insertion time delay and the

Fault Timeout Period. The capacitor also sets the restart timing of the LM5069-2.

7 PWR Power limit set An external resistor connected to this pin, in conjunction with the current sense

resistor (RS), sets the maximum power dissipation allowed in the external series

pass MOSFET.

8 PGD Power Good indicator An open drain output. When the external MOSFET VDS decreases below 1.25V,

the PGD indicator is active (high). When the external MOSFET VDS increases

above 2.5V the PGD indicator switches low.

9 OUT Output feedback Connect to the output rail (external MOSFET source). Internally used to determine

the MOSFET VDS voltage for power limiting, and to control the PGD indicator.

10 GATE Gate drive output Connect to the external MOSFET’s gate. This pin's voltage is typically 12V above

the OUT pin when enabled.

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LM5069

Absolute Maximum Ratings (Note 1)

If Military/Aerospace specified devices are required,

please contact the National Semiconductor Sales Office/

Distributors for availability and specifications.

VIN to GND (Note 5) -0.3V to 100V

SENSE, OUT, PGD to GND -0.3V to 100V

GATE to GND (Note 5) -0.3V to 100V

UVLO to GND -0.3V to 100V

OVLO to GND -0.3V to 7V

VIN to SENSE -0.3V to +0.3V

ESD Rating (Note 2)

Human Body Model

2kV

Storage Temperature -65°C to +150°C

Junction Temperature +150°C

Operating Ratings

VIN Supply Voltage +9.0V to 80V

PGD Off Voltage 0V to 80V

Junction Temp. Range −40°C to +125°C

Electrical Characteristics Limits in standard type are for TJ = 25°C only; limits in boldface type apply over the

junction temperature (TJ) range of -40°C to +125°C. Minimum and Maximum limits are guaranteed through test, design, or statistical

correlation. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes only.

Unless otherwise stated the following conditions apply: VIN = 48V.

Symbol Parameter Conditions Min. Typ. Max. Units

Input (VIN pin)

IIN-EN Input Current, enabled UVLO > 2.5V and OVLO < 2.5V 1.3 1.6 mA

IIN-DIS Input Current, disabled UVLO <2.5V or OVLO >2.5V 480 650 µA

PORIT Power On Reset threshold at VIN to trigger

insertion timer

VIN Increasing 7.6 8.0 V

POREN Power On Reset threshold at VIN to

enable all functions

VIN increasing 8.4 9.0 V

POREN-HYS POREN hysteresis VIN decreasing 90 mV

OUT pin

IOUT-EN OUT bias current, enabled OUT = VIN, Normal operation 11 µA

IOUT-DIS OUT bias current, disabled (Note 3) Disabled, OUT = 0V, SENSE = VIN 50

UVLO, OVLO pins

UVLOTH UVLO threshold 2.45 2.5 2.55 V

UVLOHYS UVLO hysteresis current UVLO = 1V 12 21 30 µA

UVLODEL UVLO delay Delay to GATE high 55 µs

Delay to GATE low 11

UVLOBIAS UVLO bias current UVLO = 48V 1µA

OVLOTH OVLO threshold 2.40 2.5 2.60 V

OVLOHYS OVLO hysteresis current OVLO = 2.6V 12 21 30 µA

OVLODEL OVLO delay Delay to GATE high 55 µs

Delay to GATE low 11

OVLOBIAS OVLO bias current OVLO = 2.4V 1µA

Power Limit (PWR pin)

PWRLIM-1 Power limit sense voltage (VIN-SENSE) SENSE-OUT = 48V, RPWR = 150 kΩ19 25 31 mV

PWRLIM-2 SENSE-OUT = 24V, RPWR = 75 kΩ 25 mV

IPWR PWR pin current VPWR = 2.5V 20 µA

Gate Control (GATE pin)

IGATE Source current Normal Operation, GATE-OUT = 5V 10 16 22 µA

Sink current UVLO < 2.5V 1.75 22.6 mA

VIN - SENSE = 150 mV or VIN <

PORIT, VGATE = 5V

45 110 175 mA

VGATE Gate output voltage in normal operation GATE-OUT voltage 11.4 12 12.6 V

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LM5069

Symbol Parameter Conditions Min. Typ. Max. Units

Current Limit

VCL Threshold voltage VIN-SENSE voltage 48.5 55 61.5 mV

tCL Response time VIN-SENSE stepped from 0 mV to

80 mV

45 µs

ISENSE SENSE input current Enabled, SENSE = OUT 23 µA

Disabled, OUT = 0V 60

Circuit Breaker

VCB Threshold voltage VIN - SENSE 80 105 130 mV

tCB Response time VIN - SENSE stepped from 0 mV to

150 mV, time to GATE low, no load

0.44 1.2 µs

Timer (TIMER pin)

VTMRH Upper threshold 3.76 44.16 V

VTMRL Lower threshold Restart cycles (LM5069-2) 1.187 1.25 1.313 V

End of 8th cycle (LM5069-2) 0.3 V

Re-enable Threshold (LM5069-1) 0.3 V

ITIMER Insertion time current 35.5 8µA

Sink current, end of insertion time TIMER pin = 2V 1.0 1.5 2.0 mA

Fault detection current 51 85 120 µA

Fault sink current 1.25 2.5 3.75 µA

DCFAULT Fault Restart Duty Cycle LM5069-2 only 0.5 %

tFAULT Fault to GATE low delay TIMER pin reaches 4.0V 12 µs

Power Good (PGD pin)

PGDTH Threshold measured at SENSE-OUT Decreasing 0.67 1.25 1.85 V

Increasing, relative to decreasing

threshold

0.95 1.25 1.55

PGDVOL Output low voltage ISINK = 2 mA 60 150 mV

PGDIOH Off leakage current VPGD = 80V 5µA

Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is

intended to be functional, but do not guarantee specific performance limits. For guaranteed specifications and conditions see the Electrical Characteristics.

Note 2: The human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin.

Note 3: OUT bias current (disabled) due to leakage current through an internal 1.0 MΩ resistance from SENSE to VOUT.

Note 4: For detailed information on soldering plastic MSOP packages refer to the Packaging Databook available from National Semiconductor Corporation.

Note 5: The GATE pin voltage is typically 12V above VIN when the LM5069 is enabled. Therefore the Absolute Maximum Ratings for VIN (100V) applies only

when the LM5069 is disabled, or for a momentary surge to that voltage since the Absolute Maximum Rating for the GATE pin is also 100V.

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LM5069

Typical Performance Characteristics Unless otherwise specified the following conditions apply: TJ =

25°C, VIN = 48V

VIN Pin Input Current vs. VIN

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SENSE Pin Input Current

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OUT Pin Current

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GATE Pin Voltage vs. VIN

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GATE Pin Source Current vs. VIN

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PGD Pin Low Voltage vs. Sink Current

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LM5069

MOSFET Power Dissipation Limit vs. RPWR and RS

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GATE Pull-Down Current, Circuit Breaker vs GATE Voltage

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UVLO Hysteresis Current vs. Temperature

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OVLO Hysteresis Current vs. Temperature

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UVLO, OVLO Threshold vs. Temperature

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Input Current, Enabled vs. Temperature

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LM5069

Current Limit Threshold vs. Temperature

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Circuit Breaker Threshold vs. Temperature

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Power Limit Threshold vs. Temperature

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GATE Output Voltage vs. Temperature

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GATE Source Current vs. Temperature

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GATE Pull-Down Current, Circuit Breaker vs. Temperature

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LM5069

PGD Low Voltage vs. Temperature

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Block Diagram

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LM5069

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FIGURE 1. Basic Application Circuit

Functional Description

The LM5069 is designed to control the in-rush current to the

load upon insertion of a circuit card into a live backplane or

other "hot" power source, thereby limiting the voltage sag on

the backplane’s supply voltage, and the dV/dt of the voltage

applied to the load. Effects on other circuits in the system are

minimized, preventing possible unintended resets. A con-

trolled shutdown when the circuit card is removed can also be

implemented using the LM5069. In addition to a pro-

grammable current limit, the LM5069 monitors and limits the

maximum power dissipation in the series pass device to main-

tain operation within the device Safe Operating Area (SOA).

Either current limiting or power limiting for an extended period

of time results in the shutdown of the series pass device. In

this event, the LM5069-1 latches off until the circuit is re-en-

abled by external control, while the LM5069-2 automatically

restarts with defined timing. The circuit breaker function

quickly switches off the series pass device upon detection of

a severe over-current condition. The Power Good (PGD) out-

put pin indicates when the output voltage is within 1.25V of

the system input voltage (VSYS). Programmable under-volt-

age lock-out (UVLO) and over-voltage lock-out (OVLO) cir-

cuits shut down the LM5069 when the system input voltage

is outside the desired operating range. The typical configura-

tion of a circuit card with LM5069 hot swap protection is shown

in Figure 2.

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FIGURE 2. LM5069 Application

Power Up Sequence

The VIN operating range of the LM5069 is +9V to +80V, with

a transient capability to +100V. Referring to the Block Dia-

gram and Figure 1 and Figure 3, as the voltage at VIN initially

increases, the external N-channel MOSFET (Q1) is held off

by an internal 230 mA pull-down current at the GATE pin. The

strong pull-down current at the GATE pin prevents an inad-

vertent turn-on as the MOSFET’s gate-to-drain (Miller) ca-

pacitance is charged. Additionally, the TIMER pin is initially

held at ground. When the VIN voltage reaches the PORIT

threshold (7.6V) the insertion time begins. During the inser-

tion time, the capacitor at the TIMER pin (CT) is charged by a

5.5 µA current source, and Q1 is held off by a 2 mA pull-down

current at the GATE pin regardless of the VIN voltage. The

insertion time delay allows ringing and transients at VIN to

settle before Q1 can be enabled. The insertion time ends

when the TIMER pin voltage reaches 4.0V. CT is then quickly

discharged by an internal 1.5 mA pull-down current. After the

insertion time, the LM5069 control circuitry is enabled when

VIN reaches the POREN threshold (8.4V). The GATE pin then

switches on Q1 when VSYS exceeds the UVLO threshold (UV-

LO pin >2.5V). If VSYS is above the UVLO threshold at the end

of the insertion time, Q1 switches on at that time. The GATE

pin charge pump sources 16 µA to charge Q1’s gate capaci-

tance. The maximum gate-to-source voltage of Q1 is limited

by an internal 12V zener diode.

As the voltage at the OUT pin increases, the LM5069 monitors

the drain current and power dissipation of MOSFET Q1. In-

rush current limiting and/or power limiting circuits actively

control the current delivered to the load. During the in-rush

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LM5069

limiting interval (t2 in Figure 3) an internal 85 µA fault timer

current source charges CT. If Q1’s power dissipation and the

input current reduce below their respective limiting thresholds

before the TIMER pin reaches 4.0V the 85 µA current source

is switched off, and CT is discharged by the internal 2.5 µA

current sink (t3 in Figure 3). The in-rush limiting interval is

complete when the voltage at the OUT pin increases to within

1.25V of the input voltage (VSYS), and the PGD pin switches

high.

If the TIMER pin voltage reaches 4.0V before in-rush current

limiting or power limiting ceases (during t2), a fault is declared

and Q1 is turned off. See the Fault Timer & Restart section

for a complete description of the fault mode.

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FIGURE 3. Power Up Sequence (Current Limit only)

Gate Control

A charge pump provides internal bias voltage above the out-

put voltage (OUT pin) to enhance the N-Channel MOSFET’s

gate. The gate-to-source voltage is limited by an internal 12V

zener diode. During normal operating conditions (t3 in Figure

3) the gate of Q1 is held charged by an internal 16 µA current

source to approximately 12V above OUT. If the maximum

VGS rating of Q1 is less than 12V, a lower voltage external

zener diode must be added between the GATE and OUT pins.

The external zener diode must have a forward current rating

of at least 250 mA.

When the system voltage is initially applied, the GATE pin is

held low by a 230 mA pull-down current. This helps prevent

an inadvertent turn-on of the MOSFET through its drain-gate

capacitance as the applied system voltage increases.

During the insertion time (t1 in Figure 3) the GATE pin is held

low by a 2 mA pull-down current. This maintains Q1 in the off-

state until the end of t1, regardless of the voltage at VIN or

UVLO.

Following the insertion time, during t2 in Figure 3, the gate

voltage of Q1 is modulated to keep the current or power dis-

sipation level from exceeding the programmed levels. While

in the current or power limiting mode the TIMER pin capacitor

is charging. If the current and power limiting cease before the

TIMER pin reaches 4V the TIMER pin capacitor then dis-

charges, and the circuit enters normal operation.

If the in-rush limiting condition persists such that the TIMER

pin reached 4V during t2, the GATE pin is then pulled low by

the 2 mA pull-down current. The GATE pin is then held low

until either a power up sequence is initiated (LM5069-1), or

until the end of the restart sequence (LM5069-2). See the

Fault Timer & Restart section.

If the system input voltage falls below the UVLO threshold, or

rises above the OVLO threshold, the GATE pin is pulled low

by the 2 mA pull-down current to switch off Q1.

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LM5069

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FIGURE 4. Gate Control

Current Limit

The current limit threshold is reached when the voltage across

the sense resistor RS (VIN to SENSE) reaches 55 mV. In the

current limiting condition, the GATE voltage is controlled to

limit the current in MOSFET Q1. While the current limit circuit

is active, the fault timer is active as described in the Fault

Timer & Restart section. If the load current falls below the

current limit threshold before the end of the Fault Timeout

Period, the LM5069 resumes normal operation. For proper

operation, the RS resistor value should be no larger than 100

mΩ.

Circuit Breaker

If the load current increases rapidly (e.g., the load is short-

circuited) the current in the sense resistor (RS) may exceed

the current limit threshold before the current limit control loop

is able to respond. If the current exceeds twice the current

limit threshold (105 mV/RS), Q1 is quickly switched off by the

230 mA pull-down current at the GATE pin, and a Fault Time-

out Period begins. When the voltage across RS falls below

105 mV the 230 mA pull-down current at the GATE pin is

switched off, and the gate voltage of Q1 is then determined

by the current limit or the power limit functions. If the TIMER

pin reaches 4.0V before the current limiting or power limiting

condition ceases, Q1 is switched off by the 2 mA pull-down

current at the GATE pin as described in the Fault Timer &

Restart section.

Power Limit

An important feature of the LM5069 is the MOSFET power

limiting. The Power Limit function can be used to maintain the

maximum power dissipation of MOSFET Q1 within the device

SOA rating. The LM5069 determines the power dissipation in

Q1 by monitoring its drain-source voltage (SENSE to OUT),

and the drain current through the sense resistor (VIN to

SENSE). The product of the current and voltage is compared

to the power limit threshold programmed by the resistor at the

PWR pin. If the power dissipation reaches the limiting thresh-

old, the GATE voltage is modulated to reduce the current in

Q1. While the power limiting circuit is active, the fault timer is

active as described in the Fault Timer & Restart section.

Fault Timer & Restart

When the current limit or power limit threshold is reached

during turn-on or as a result of a fault condition, the gate-to-

source voltage of Q1 is modulated to regulate the load current

and power dissipation. When either limiting function is acti-

vated, an 85 µA fault timer current source charges the exter-

nal capacitor (CT) at the TIMER pin as shown in Figure 6

(Fault Timeout Period). If the fault condition subsides during

the Fault Timeout Period before the TIMER pin reaches 4.0V,

the LM5069 returns to the normal operating mode and CT is

discharged by the 2.5 µA current sink. If the TIMER pin reach-

es 4.0V during the Fault Timeout Period, Q1 is switched off

by a 2 mA pull-down current at the GATE pin. The subsequent

restart procedure then depends on which version of the

LM5069 is in use.

The LM5069-1 latches the GATE pin low at the end of the

Fault Timeout Period. CT is then discharged to ground by the

2.5 µA fault current sink. The GATE pin is held low by the 2

mA pull-down current until a power up sequence is externally

initiated by cycling the input voltage (VSYS), or momentarily

pulling the UVLO pin below 2.5V with an open-collector or

open-drain device as shown in Figure 5. The voltage at the

TIMER pin must be <0.3V for the restart procedure to be ef-

fective.

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LM5069

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FIGURE 5. Latched Fault Restart Control

The LM5069-2 provides an automatic restart sequence which

consists of the TIMER pin cycling between 4.0V and 1.25V

seven times after the Fault Timeout Period, as shown in Fig-

ure 6. The period of each cycle is determined by the 85 µA

charging current, and the 2.5 µA discharge current, and the

value of the capacitor CT. When the TIMER pin reaches 0.3V

during the eighth high-to-low ramp, the 16 µA current source

at the GATE pin turns on Q1. If the fault condition is still

present, the Fault Timeout Period and the restart cycle repeat.

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FIGURE 6. Restart Sequence (LM5069-2)

Under-Voltage Lock-Out (UVLO)

The series pass MOSFET (Q1) is enabled when the input

supply voltage (VSYS) is within the operating range defined by

the programmable under-voltage lockout (UVLO) and over-

voltage lock-out (OVLO) levels. Typically the UVLO level at

VSYS is set with a resistor divider (R1-R3) as shown in Figure

1. When VSYS is below the UVLO level, the internal 21 µA

current source at UVLO is enabled, the current source at OV-

LO is off, and Q1 is held off by the 2 mA pull-down current at

the GATE pin. As VSYS is increased, raising the voltage at

UVLO above 2.5V, the 21 µA current source at UVLO is

switched off, increasing the voltage at UVLO, providing hys-

teresis for this threshold. With the UVLO pin above 2.5V, Q1

is switched on by the 16 µA current source at the GATE pin if

the insertion time delay has expired (Figure 3). See the Ap-

plications Section for a procedure to calculate the values of

the threshold setting resistors (R1-R3). The minimum possi-

ble UVLO level at VSYS can be set by connecting the UVLO

pin to VIN. In this case Q1 is enabled when the VIN voltage

reaches the POREN threshold.

Over-Voltage Lock-Out (OVLO)

The series pass MOSFET (Q1) is enabled when the input

supply voltage (VSYS) is within the operating range defined by

the programmable under-voltage lockout (UVLO) and over-

voltage lock-out (OVLO) levels. If VSYS raises the OVLO pin

voltage above 2.5V Q1 is switched off by the 2 mA pull-down

current at the GATE pin, denying power to the load. When the

OVLO pin is above 2.5V, the internal 21 µA current source at

OVLO is switched on, raising the voltage at OVLO to provide

threshold hysteresis. When VSYS is reduced below the OVLO

level Q1 is enabled. See the Applications Section for a pro-

cedure to calculate the threshold setting resistor values.

Shutdown Control

The load current can be remotely switched off by taking the

UVLO pin below its 2.5V threshold with an open collector or

open drain device, as shown in Figure 7. Upon releasing the

UVLO pin the LM5069 switches on the load current with in-

rush current and power limiting.

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LM5069

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FIGURE 7. Shutdown Control

Power Good Pin

The Power Good indicator pin (PGD) is connected to the drain

of an internal N-channel MOSFET capable of sustaining 80V

in the off-state, and transients up to 100V. An external pull-up

resistor is required at PGD to an appropriate voltage to indi-

cate the status to downstream circuitry. The off-state voltage

at the PGD pin can be higher or lower than the voltages at

VIN and OUT. PGD is switched high when the voltage from

SENSE to OUT (the external MOSFET’s VDS) decreases be-

low 1.25V. PGD switches low when the MOSFET’s VDS is

increased past 2.5V. If the UVLO pin is taken below 2.5V, or

the OVLO pin taken above 2.5V, to disable the LM5069, PGD

switches low within 10 µs without waiting for the voltage at

OUT to fall 2.5V below the voltage at SENSE. The PGD output

pin is high when the voltage at VIN is less than 5V.

Application Information

(Refer to Figure 1)

CURRENT LIMIT, RS

The LM5069 monitors the current in the external MOSFET

(Q1) by measuring the voltage across the sense resistor

(RS), connected from VIN to SENSE. The required resistor

value is calculated from:

(1)

where ILIM is the desired current limit threshold. If the voltage

across RS reaches 55 mV, the current limit circuit modulates

the gate of Q1 to regulate the current at ILIM. While the current

limiting circuit is active, the fault timer is active as described

in the Fault Timer & Restart section. For proper operation,

RS must be no larger than 100 mΩ.

While the maximum load current in normal operation can be

used to determine the required power rating for resistor RS,

basing it on the current limit value provides a more reliable

design since the circuit can operate near the current limit

threshold continuously. The resistor’s surge capability must

also be considered since the circuit breaker threshold is twice

the current limit threshold. Connections from RS to the

LM5069 should be made using Kelvin techniques. In the sug-

gested layout of Figure 8 the small pads at the lower corners

of the sense resistor connect only to the sense resistor ter-

minals, and not to the traces carrying the high current. With

this technique, only the voltage across the sense resistor is

applied to VIN and SENSE, eliminating the voltage drop

across the high current solder connections.

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FIGURE 8. Sense Resistor Connections

POWER LIMIT THRESHOLD

The LM5069 determines the power dissipation in the external

MOSFET (Q1) by monitoring the drain current (the current in

RS), and the VDS of Q1 (SENSE to OUT pins). The resistor at

the PWR pin (RPWR) sets the maximum power dissipation for

Q1, and is calculated from the following equation:

RPWR = 1.25 x 105 x RS x PFET(LIM) (2)

where PFET(LIM) is the desired power limit threshold for Q1,

and RS is the current sense resistor described in the Current

Limit section. For example, if RS is 10 mΩ , and the desired

power limit threshold is 60W, RPWR calculates to 75 kΩ. If Q1’s

power dissipation reaches the threshold Q1’s gate is modu-

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LM5069

lated to reduce the load current, keeping Q1’s power from

exceeding the threshold. For proper operation of the power

limiting feature, RPWR must be ≤150 kΩ. While the power lim-

iting circuit is active, the fault timer is active as described in

the Fault Timer & Restart section. Typically, power limit is

reached during startup, or if the output voltage falls due to a

severe overload or short circuit.

The programmed maximum power dissipation should have a

reasonable margin from the maximum power defined by the

FET's SOA chart if the LM5069-2 is used since the FET will

be repeatedly stressed during fault restart cycles. The FET

manufacturer should be consulted for guidelines.

If the application does not require use of the power limit func-

tion the PWR pin can be left open.

TURN-ON TIME

The output turn-on time depends on whether the LM5069 op-

erates in current limit, or in both power limit and current limit,

during turn-on.

A) Turn-on with current limit only: The current limit thresh-

old (ILIM) is determined by the current sense resistor (RS). If

the current limit threshold is less than the current defined by

the power limit threshold at maximum VDS the circuit operates

at the current limit threshold only during turn-on. Referring to

Figure 11a, as the load current reaches ILIM, the gate-to-

source voltage is controlled at VGSL to maintain the current at

ILIM. As the output voltage reaches its final value (VDS ≊ 0V)

the drain current reduces to its normal operating value, and

the gate is charged to approximately 12V (VGATE). The time

for the OUT pin voltage to transition from zero volts to VSYS is

equal to:

where CL is the load capacitance. For example, if VSYS = 48V,

CL = 1000 µF, and ILIM = 1A, tON calculates to 48 ms. The

maximum instantaneous power dissipated in the MOSFET is

48W. This calculation assumes the time from t1 to t2 in Figure

11a is small compared to tON, and the load does not draw any

current until after the output voltage has reached its final val-

ue, and PGD switches high (Figure 9). If the load draws

current during the turn-on sequence (Figure 10), the turn-on

time is longer than the above calculation, and is approximate-

ly equal to:

where RL is the load resistance. The Fault Timeout Period

must be set longer than tON to prevent a fault shutdown before

the turn-on sequence is complete.

20197222

FIGURE 9. No Load Current During Turn-On

20197223

FIGURE 10. Load Draws Current During Turn-On

B) Turn-on with power limit and current limit: The maxi-

mum allowed power dissipation in Q1 (PFET(LIM)) is defined by

the resistor at the PWR pin, and the current sense resistor

RS. See the Power Limit Threshold section. If the current limit

threshold (ILIM) is higher than the current defined by the power

limit threshold at maximum VDS (PFET(LIM)/VSYS) the circuit op-

erates initially at the power limit mode when the VDS of Q1 is

high, and then transitions to current limit mode as the current

increases to ILIM and VDS decreases. See Figure 11ab. As-

suming the load (RL) is not connected during turn-on, the time

for the output voltage to reach its final value is approximately

equal to:

For example, if VSYS = 48V, CL = 1000 µF, ILIM = 1A, and

PFET(LIM) = 20W, tON calculates to ≊68 ms, and the initial cur-

rent level (IP) is approximately 0.42A. The Fault Timeout

Period must be set longer than tON.

www.national.com 14

LM5069

20197225

FIGURE 11. MOSFET Power Up Waveforms

MOSFET SELECTION

It is recommended that the external MOSFET (Q1) selection

be based on the following criteria:

- The BVDSS rating should be greater than the maximum

system voltage (VSYS), plus ringing and transients which can

occur at VSYS when the circuit card, or adjacent cards, are

inserted or removed.

- The maximum continuous current rating should be based

on the current limit threshold (55 mV/RS), not the maximum

load current, since the circuit can operate near the current

limit threshold continuously.

- The Pulsed Drain Current spec (IDM) must be greater than

the current threshold for the circuit breaker function (105 mV/

RS).

- The SOA (Safe Operating Area) chart of the device, and

the thermal properties, should be used to determine the max-

imum power dissipation threshold set by the RPWR resistor.

The programmed maximum power dissipation should have a

reasonable margin from the maximum power defined by the

FET's SOA chart if the LM5069-2 is used since the FET will

be repeatedly stressed during fault restart cycles. The FET

manufacturer should be consulted for guidelines.

- RDS(on) should be sufficiently low that the power dissipa-

tion at maximum load current (IL(max)2 x RDS(on)) does not raise

its junction temperature above the manufacturer’s recom-

mendation.

If the device chosen for Q1 has a maximum VGS rating less

than 12V, an external zener diode must be added from its gate

to source, with the zener voltage less than the maximum

VGS rating. The zener diode’s forward current rating must be

at least 250 mA to conduct the GATE pull-down current during

startup and in the circuit breaker mode.

TIMER CAPACITOR, CT

The TIMER pin capacitor (CT) sets the timing for the insertion

time delay, fault timeout period, and restart timing of the

LM5069-2.

A) Insertion Delay - Upon applying the system voltage

(VSYS) to the circuit, the external MOSFET (Q1) is held off

during the insertion time (t1 in Figure 3) to allow ringing and

transients at VSYS to settle. Since each backplane’s response

to a circuit card plug-in is unique, the worst case settling time

must be determined for each application. The insertion time

starts when VIN reaches the PORIT threshold, at which time

the internal 5.5 µA current source charges CT from 0V to 4.0V.

The required capacitor value is calculated from:

For example, if the desired insertion delay is 250 ms, CT cal-

culates to 0.345 µF. At the end of the insertion delay, CT is

quickly discharged by a 1.5 mA current sink.

B) Fault Timeout Period - During in-rush current limiting or

upon detection of a fault condition where the current limit and/

or power limit circuits regulate the current through Q1, the

fault timer current source (85 µA) is switched on to charge

CT. The Fault Timeout Period is the time required for the

TIMER pin voltage to reach 4.0V, at which time Q1 is switched

off. The required capacitor value for the desired Fault Timeout

Period tFAULT is calculated from:

(3)

For example, if the desired Fault Timeout Period is 16 ms,

CT calculates to 0.34 µF. After the Fault Timeout Period, the

LM5069-1 latches the GATE pin low until a power up se-

quence is initiated by external circuitry. CT is discharged by

the 2.5 µA current sink at the end of the Fault Timeout Period.

See the Fault Timer and Restart section and Figure 5. When

the Fault Timeout Period of the LM5069-2 expires, a restart

sequence starts as described below (Restart Timing). Since

the LM5069 normally operates in power limit and/or current

limit during a power up sequence, the Fault Timeout Period

must be longer than the time required for the output voltage

to reach its final value. See the Turn-on Time section.

C) Restart Timing For the LM5069-2, after the Fault Timeout

Period described above, CT is discharged by the 2.5 µA cur-

rent sink to 1.25V. The TIMER pin then cycles through seven

additional charge/discharge cycles between 1.25V and 4.0V

as shown in Figure 6. The restart time ends when the TIMER

pin voltage reaches 0.3V during the final high-to-low ramp.

The restart time, after the Fault Timeout Period, is equal to:

15 www.national.com

LM5069

= CT x 9.4 x 106

For example, if CT = 0.33 µF, tRESTART = 3.1 seconds. At the

end of the restart time, Q1 is switched on. If the fault is still

present, the fault timeout and restart sequence repeats. The

on-time duty cycle of Q1 is approximately 0.5% in this mode.

UVLO, OVLO

By programming the UVLO and OVLO thresholds the

LM5069 enables the series pass device (Q1) when the input

supply voltage (VSYS) is within the desired operational range.

If VSYS is below the UVLO threshold, or above the OVLO

threshold, Q1 is switched off, denying power to the load. Hys-

teresis is provided for each threshold.

Option A: The configuration shown in Figure 12 requires

three resistors (R1-R3) to set the thresholds.

20197229

FIGURE 12. UVLO and OVLO Thresholds Set By R1-R3

The procedure to calculate the resistor values is as follows:

- Choose the upper UVLO threshold (VUVH), and the lower

UVLO threshold (VUVL).

- Choose the upper OVLO threshold (VOVH).

- The lower OVLO threshold (VOVL) cannot be chosen in

advance in this case, but is determined after the values for

R1-R3 are determined. If VOVL must be accurately defined in

addition to the other three thresholds, see Option B below.

The resistors are calculated as follows:

The lower OVLO threshold is calculated from:

As an example, assume the application requires the following

thresholds: VUVH = 36V, VUVL = 32V, VOVH = 60V.

The lower OVLO threshold calculates to 55.8V, and the OVLO

hysteresis is 4.2V. Note that the OVLO hysteresis is always

slightly greater than the UVLO hysteresis in this configuration.

When the R1-R3 resistor values are known, the threshold

voltages and hysteresis are calculated from the following:

VUV(HYS) = R1 x 21 µA

VOV(HYS) = (R1 + R2) x 21 µA

Option B: If all four thresholds must be accurately defined,

the configuration in Figure 13 can be used.

20197241

FIGURE 13. Programming the Four Thresholds

The four resistor values are calculated as follows:

www.national.com 16

LM5069

- Choose the upper and lower UVLO thresholds (VUVH) and

(VUVL).

-Choose the upper and lower OVLO threshold (VOVH) and

(VOVL).

As an example, assume the application requires the following

thresholds: VUVH = 22V, VUVL = 17V, VOVH = 60V, and VOVL =

58V. Therefore VUV(HYS) = 5V, and VOV(HYS) = 2V. The resistor

values are:

R1 = 238 kΩ, R2 = 41 kΩ

R3 = 95.2 kΩ, R4 = 4.14 kΩ

Where the R1-R4 resistor values are known, the threshold

voltages and hysteresis are calculated from the following:

VUV(HYS) = R1 x 21 µA

VOV(HYS) = R3 x 21 µA

Option C: The minimum UVLO level is obtained by connect-

ing the UVLO pin to VIN as shown in Figure 14. Q1 is switched

on when the VIN voltage reaches the POREN threshold

(≊8.4V). An external transistor can be connected to UVLO to

provide remote shutdown control, and to restart the LM5069-1

after a fault detection. The OVLO thresholds are set using R3,

R4. Their values are calculated using the procedure in Option

20197250

FIGURE 14. UVLO = POREN with Shutdown/Restart Control

Option D: The OVLO function can be disabled by grounding

the OVLO pin. The UVLO thresholds are set as described in

Option B or Option C.

POWER GOOD PIN

During turn-on, the Power Good pin (PGD) is high until the

voltage at VIN increases above ≊ 5V. PGD then switches low,

remaining low as the VIN voltage increases. When the voltage

at OUT increases to within 1.25V of the SENSE pin (VDS

<1.25V), PGD switches high. PGD switches low if the VDS of

Q1 increases above 2.5V. A pull-up resistor is required at

PGD as shown in Figure 15. The pull-up voltage (VPGD) can

be as high as 80V, with transient capability to 100V, and can

be higher or lower than the voltages at VIN and OUT.

17 www.national.com

LM5069

20197251

FIGURE 15. Power Good Output

If a delay is required at PGD, suggested circuits are shown in

Figure 16. In Figure 16a, capacitor CPG adds delay to the ris-

ing edge, but not to the falling edge. In Figure 16b, the rising

edge is delayed by RPG1 + RPG2 and CPG, while the falling

edge is delayed a lesser amount by RPG2 and CPG. Adding a

diode across RPG2 (Figure 16c) allows for equal delays at the

two edges, or a short delay at the rising edge and a long delay

at the falling edge.

20197252

FIGURE 16. Adding Delay to the Power Good Output Pin

Design-in Procedure

The recommended design-in procedure is as follows:

•Determine the current limit threshold (ILIM). This threshold

must be higher than the normal maximum load current,

allowing for tolerances in the current sense resistor value

and the LM5069 Current Limit threshold voltage. Use

equation 1 to determine the value for RS.

•Determine the maximum allowable power dissipation for

the series pass FET (Q1), using the device’s SOA

information. Use equation 2 to determine the value for

RPWR.

•Determine the value for the timing capacitor at the TIMER

pin (CT) using equation 3. The fault timeout period

(tFAULT) must be longer than the circuit’s turn-on-time. The

turn-on time can be estimated using the equations in the

TURN-ON TIME section of this data sheet, but should be

verified experimentally. Review the resulting insertion

time, and restart timing if the LM5069-2 is used.

•Choose option A, B, C, or D from the UVLO, OVLO section

of the Application Information for setting the UVLO and

OVLO thresholds and hysteresis. Use the procedure for

the appropriate option to determine the resistor values at

the UVLO and OVLO pins.

•Choose the appropriate voltage, and pull-up resistor, for

the Power Good output.

PC Board Guidelines

The following guidelines should be followed when designing

the PC board for the LM5069:

•Place the LM5069 close to the board’s input connector to

minimize trace inductance from the connector to the FET.

•Place a small capacitor (1000 pF) directly adjacent to the

VIN and GND pins of the LM5069 to help minimize

transients which may occur on the input supply line.

Transients of several volts can easily occur when the load

current is shut off.

•The sense resistor (RS) should be close to the LM5069,

and connected to it using the Kelvin techniques shown in

Figure 8.

•The high current path from the board’s input to the load

(via Q1), and the return path, should be parallel and close

to each other to minimize loop inductance.

•The ground connection for the various components

around the LM5069 should be connected directly to each

other, and to the LM5069’s GND pin, and then connected

to the system ground at one point. Do not connect the

various component grounds to each other through the high

current ground line.

•Provide adequate heat sinking for the series pass device

(Q1) to help reduce stresses during turn-on and turn-off.

www.national.com 18

LM5069

•The board’s edge connector can be designed to shut off

the LM5069 as the board is removed, before the supply

voltage is disconnected from the LM5069. In Figure 17 the

voltage at the UVLO pin goes to ground before VSYS is

removed from the LM5069 due to the shorter edge

connector pin. When the board is inserted into the edge

connector, the system voltage is applied to the LM5069’s

VIN pin before the UVLO voltage is taken high.

20197253

FIGURE 17. Recommended Board Connector Design

System Considerations

A) Continued proper operation of the LM5069 hot swap circuit

requires capacitance be present on the supply side of the

connector into which the hot swap circuit is plugged in, as

depicted in Figure 2. The capacitor in the “Live Backplane”

section is necessary to absorb the transient generated when-

ever the hot swap circuit shuts off the load current. If the

capacitance is not present, inductance in the supply lines will

generate a voltage transient at shut-off which can exceed the

absolute maximum rating of the LM5069, resulting in its de-

struction.

B) If the load powered via the LM5069 hot swap circuit has

inductive characteristics, a diode is required across the

LM5069’s output. The diode provides a recirculating path for

the load’s current when the LM5069 shuts off that current.

Adding the diode prevents possible damage to the LM5069

as the OUT pin will be taken below ground by the inductive

load at shutoff. See Figure 18.

20197254

FIGURE 18. Output Diode Required for Inductive Loads

19 www.national.com

LM5069

Physical Dimensions inches (millimeters) unless otherwise noted

NS Package Number MUB10A

www.national.com 20

LM5069

Notes

21 www.national.com

LM5069

Notes

LM5069 Positive High Voltage Hot Swap / Inrush Current Controller with Power Limiting

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