C3D16060D VRRM Silicon Carbide Schottky Diode Z-Rec Rectifier (R) Features * * * * * * * 600 V IF (TC=135C) = 22 A** Qc 40 nC** = Package 600-Volt Schottky Rectifier Zero Reverse Recovery Current Zero Forward Recovery Voltage High-Frequency Operation Temperature-Independent Switching Behavior Extremely Fast Switching Positive Temperature Coefficient on VF TO-247-3 Benefits * * * * * = Replace Bipolar with Unipolar Rectifiers Essentially No Switching Losses Higher Efficiency Reduction of Heat Sink Requirements Parallel Devices Without Thermal Runaway Applications * * * * Switch Mode Power Supplies (SMPS) Boost diodes in PFC or DC/DC stages Free Wheeling Diodes in Inverter stages AC/DC converters Part Number Package Marking C3D16060D TO-247-3 C3D16060 Maximum Ratings (TC=25C unless otherwise specified) Symbol Parameter Unit Test Conditions VRRM Repetitive Peak Reverse Voltage 600 V VRSM Surge Peak Reverse Voltage 600 V VDC DC Blocking Voltage 600 V 23/46 11/22 8/16 A TC=25C TC=135C TC=150C 37.5/75 25.5/51 A TC=25C, tP = 10 ms, Half Sine Wave TC=110C, tP = 10 ms, Half Sine Wave IF Continuous Forward Current (Per Leg/Device) Repetitive Peak Forward Surge Current (Per Leg/Device) IFRM Note Fig. 3 IFSM Non-Repetitive Peak Forward Surge Current (Per Leg/Device) 71/142 60/120 A TC=25C, tp = 10 ms, Half Sine Wave TC=110C, tp = 10 ms, Half Sine Wave Fig. 8 IFSM Non-Repetitive Peak Forward Surge Current (Per Leg/Device) 650/1300 530/1080 A TC=25C, tP = 10 s, Pulse TC=110C, tP = 10 s, Pulse Fig. 8 Ptot Power Dissipation (Per Leg) 100* 43.5* W TC=25C TC=110C Fig. 4 200 V/ns VR=0-600V 25 18 A2s -55 to +175 C 1 8.8 Nm lbf-in dV/dt Diode dV/dt ruggedness i2dt i2t value (Per Leg) TJ , Tstg Operating Junction and Storage Temperature TO-247 Mounting Torque * 1 Value Per Leg, ** Per Device C3D16060D Rev. C, 6-2016 TC=25C, tP=10 ms TC=110C, tP=10 ms M3 Screw 6-32 Screw Electrical Characteristics (Per Leg) Symbol Parameter Typ. Max. Unit Test Conditions Note VF Forward Voltage 1.5 2.1 1.8 2.4 V IF = 8 A TJ=25C IF = 8 A TJ=175C Fig. 1 IR Reverse Current 8.5 17 42.5 170 A VR = 600 V TJ=25C VR = 600 V TJ=175C Fig. 2 QC Total Capacitive Charge 20 nC VR = 600 V, IF = 8A di/dt = 500 A/s TJ = 25C Fig. 5 C Total Capacitance 395 37 32 pF VR = 0 V, TJ = 25C, f = 1 MHz VR = 200 V, TJ = 25C, f = 1 MHz VR = 400 V, TJ = 25C, f = 1 MHz Fig. 6 EC Capacitance Stored Energy 3.0 J VR = 400 V Fig. 7 Note: This is a majority carrier diode, so there is no reverse recovery charge. Thermal Characteristics Symbol RJC * Parameter Thermal Resistance from Junction to Case Per Leg, ** Typ. Unit Note 1.5 * 0.75 ** C/W Fig. 9 Per Device Typical Performance (Per Leg) 20 30 18 TJ = -55 C 25 14 Reverse Leakage Current, IRR (mA) TJ = 25 C TJ = 75 C 12 10 IR (mA) TJ = 125 C TJ = 175 C F FowardICurrent, (A) IF (A) 16 8 6 4 2 TJ = 175 C TJ = 125 C 15 TJ = 75 C 10 TJ = 25 C TJ = -55 C 5 0 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 Foward Voltage, VF (V) Figure 1. Forward Characteristics 2 20 C3D16060D Rev. C, 6-2016 3.5 4.0 0 100 200 300 400 500 600 700 800 900 1000 Reverse Voltage, VR (V) Figure 2. Reverse Characteristics Typical Performance (Per Leg) 80 120 10% Duty 20% Duty 30% Duty 50% Duty 70% Duty DC 70 50 80 PTot (W) IF(peak) (A) 60 100 40 30 60 40 20 20 10 0 25 50 75 100 125 150 0 175 25 50 75 TC C 450 175 Conditions: TJ = 25 C Ftest = 1 MHz Vtest = 25 mV 400 350 20 Capacitance C (pF)(pF) CapacitiveQCharge, (nC) QC (nC) C 150 Figure 4. Power Derating Conditions: TJ = 25 C 25 125 TC C Figure 3. Current Derating 30 100 15 10 300 250 200 150 100 5 50 0 0 100 200 300 400 500 600 700 ReverseVVoltage, (V) VR (V) R Figure 5. Total Capacitance Charge vs. Reverse Voltage 3 C3D16060D Rev. C, 6-2016 0 0 1 10 100 (V) VR (V) ReverseVVoltage, R Figure 6. Capacitance vs. Reverse Voltage 1000 Typical Performance (Per Leg) 1,000 8 6 IIFSM (A) (A) 5 FSM 4 C Capacitance StoredE Energy, J) (mJ) EC ( 7 3 100 TJ_initial = 25 C TJ_initial = 110 C 2 1 0 0 100 200 300 400 500 600 10 10E-6 700 ReverseVVoltage, (V) VR (V) 0.5 0.3 0.1 100E-3 0.05 0.02 SinglePulse 10E-3 0.01 1E-3 1E-6 10E-6 100E-6 1E-3 T (Sec) 10E-3 Figure 9. Transient Thermal Impedance 4 C3D16060D Rev. C, 6-2016 10E-3 Figure 8. Non-repetitive peak forward surge current versus pulse duration (sinusoidal waveform) Figure 7. Capacitance Stored Energy Thermal Resistance (C/W) 1E-3 tp (s) Time, tp (s) R 1 100E-6 100E-3 1 Package Dimensions Package TO-247-3 POS A e Inches Max Min Max .190 .205 4.83 5.21 A1 .090 .100 2.29 2.54 A2 .075 .085 1.91 2.16 b .042 .052 1.07 1.33 b1 .075 .095 1.91 2.41 b2 .075 .085 1.91 2.16 b3 .113 .133 2.87 3.38 b4 .113 .123 2.87 3.13 c .022 .027 0.55 0.68 D .819 .831 20.80 21.10 D1 .640 .695 16.25 17.65 D2 .037 .049 0.95 1.25 E .620 .635 15.75 16.13 E1 .516 .557 13.10 14.15 E2 .145 .201 3.68 5.10 E3 .039 .075 1.00 1.90 E4 .487 .529 12.38 13.43 e .214 BSC N T V U W Millimeters Min 5.44 BSC 3 3 L .780 .800 19.81 20.32 4.40 L1 .161 .173 4.10 OP .138 .144 3.51 3.65 Q .216 .236 5.49 6.00 S .238 .248 6.04 6.30 T 9 11 9 11 U 9 11 9 11 V 2 8 2 8 W 2 8 2 8 Recommended Solder Pad Layout Part Number Package Marking C3D16060D TO-247-3 C3D16060 all units are in inches TO-247-3 Note: Recommended soldering profiles can be found in the applications note here: http://www.wolfspeed.com/power_app_notes/soldering 5 C3D16060D Rev. C, 6-2016 Diode Model (Per Leg) Diode Model CSD04060 Vf T = VT + If*RT VT= 0.965 + (Tj * -1.3*10-3) RT= 0.096 + (Tj * 1.06*10-3) VfT = VT + If * RT VT = 0.95 + (TJ * -1.2*10-3) RT = 0.054 + (TJ * 5.5*10-4) VT RT Note: Tj = Diode Junction Temperature In Degrees Celsius, valid from 25C to 175C Notes * RoHS Compliance The levels of RoHS restricted materials in this product are below the maximum concentration values (also referred to as the threshold limits) permitted for such substances, or are used in an exempted application, in accordance with EU Directive 2011/65/EC (RoHS2), as implemented January 2, 2013. RoHS Declarations for this product can be obtained from your Wolfpseed representative or from the Product Ecology section of our website at http:// www.wolfspeed.com/Power/Tools-and-Support/Product-Ecology. * REACh Compliance REACh substances of high concern (SVHCs) information is available for this product. Since the European Chemical Agency (ECHA) has published notice of their intent to frequently revise the SVHC listing for the foreseeable future,please contact a Cree representative to insure you get the most up-to-date REACh SVHC Declaration. REACh banned substance information (REACh Article 67) is also available upon request. * This product has not been designed or tested for use in, and is not intended for use in, applications implanted into the human body nor in applications in which failure of the product could lead to death, personal injury or property damage, including but not limited to equipment used in the operation of nuclear facilities, life-support machines, cardiac defibrillators or similar emergency medical equipment, aircraft navigation or communication or control systems, or air traffic control systems. Related Links * * * Cree SiC Schottky diode portfolio: http://www.wolfspeed.com/Power/Products#SiCSchottkyDiodes Schottky diode Spice models: http://www.wolfspeed.com/power/tools-and-support/DIODE-model-request2 SiC MOSFET and diode reference designs: http://go.pardot.com/l/101562/2015-07-31/349i Copyright (c) 2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo, and Zero Recovery are registered trademarks of Cree, Inc. 6 C3D20065D Rev. A, 04-2016 Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300 Fax: +1.919.313.5451 www.cree.com/power