Ceramic Resonators, Chip Type Ceramic Resonators, Chip Type (2 Array Type) Type: EFOP Type: EFOD Type: EFOPS Type: EFOPM Type: EFODM Type: EFOLM Features Recommended Applications Encased in a ceramic package High reliability against soldering heat and mechanical stress Moisture-proof sealing 1.2 mm maximum in thickness (PS/PM/DM/LM) Designed for reflow soldering Flat-bottom plate for better mounting RoHS compliant Clock generator for microprocessors Carrier circuit between telecommunication equipment (Telephone to telephone, personal computer to printer) Handling Precautions (See Page 175 to 176) Packaging Specifications See Page 174, 177 Explanation of Part Numbers 1 2 3 E F O 4 5 6 7 8 3 5 8 4 9 10 11 12 Design No. Product Code Ceramic EFO Resonators Nominal Oscillation Frequency 3584 3.58 MHz 1695 16.93 MHz (Example) Type Chip Type with 2-terminals 2 to 13 MHz P 13.1 to 20 MHz D 1 2 3 E F O 4 5 Frequency Tolerance 1.0 % 0 0.3 % 3 0.5 % 5 Packaging Style B Bulk Pack Embossed E Taping 6 7 8 9 4 0 0 4 10 11 12 Design No. Product Code Ceramic Resonators EFO Part Number EFOP EFOD EFOPS EFOPM EFODM EFOLM Type Chip Type with 2-terminals 4 to 13 MHz PM 16 to 20 MHz LM 30 to 50 MHz 4 to 13 MHz PS 12 to 20 MHz DM Frequency range (MHz) 2.00 to 8.39 8.40 to 13.0 13.1 to 20.0 4.00 to 8.39 8.40 to 13.0 4.00 to 8.39 8.40 to 13.0 12.0 to 20.0 16.0 to 20.0 30.0 to 50.0 Nominal Oscillation Frequency 4004 4.00 MHz 1695 16.93 MHz 4005 40.0 MHz Packaging Style B Bulk Pack Embossed E Taping Frequency Tolerance 1.0 % 0 0.3 % 3 0.5 % 5 (Example) Frequency Temperature Characteristics (-20 to +80 C) 0.3 % 1.0 % 1.0 % 0.6 % 1.0 % 0.3 % 1.0 % 1.0 % 1.0 % 0.3 % Attached Capacitors (Reference) 33 pF 33 pF 21 pF 33 pF 18 pF 10 pF Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. - EC171 - 00 Sep. 2008 Ceramic Resonators, Chip Type Dimensions in mm (not to scale) Recommended Land Dimensions [Type EFOP, EFOPM] [Type EFOP]*****2.0 to 13.0 MHz Oscillating Frequency Serial No. 1.600.20 2.5 (2.70) 4.2 (7.30) Terminal Electrodes 2.5 +0.30 3.20 -0.20 4-(1.30) 7.80 +0.50 -0.20 2-0.9 to 1.2 6-R(0.20) 4-(1.00) 2.500.20 2.500.20 [Type EFOPM]*****4.0 to 13.0 MHz 1.20 max. Oscillating Frequency Serial No. (7.30) Terminal Electrodes (2.70) 3.20 +0.30 - 0.20 7.80+0.50 -0.20 6-R(0.20) 2-(1.00) 2.500.20 2.500.20 [Type EFOPS]*****4.0 to 13.0 MHz [Type EFOPS] 1.20 max. Oscillating Frequency Serial No. 1.5 4.500.20 2.6 (1.60) 1.6 Terminal Electrodes 1.5 (0.15) 2.000.30 2-0.55 6-(0.60) 2-(0.55) 2-1.500.20 2-0.8 [Type EFOD]*****13.1 to 20.0 MHz [Type EFOD] Oscillating Frequency 1.9 (2.70) 3.20 +0.25 -0.15 5.50 +0.50 -0.20 4-(1.20) 1.9 4.2 (5.00) Terminal Electrodes 1.600.20 Serial No. 2-1.2 6-R(0.20) 4-(1.20) 1.900.20 1.900.20 Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. - EC172 - 00 Sep. 2008 Ceramic Resonators, Chip Type Dimensions in mm (not to scale) Recommended Land Dimensions [Type EFODM] [Type EFODM]*****12.0 to 20.0MHz 1.351.35 Oscillating Frequency (3.70) Terminal Electrodes 3.9 1.20 max. Serial No. (2.40) 4.100.20 2-0.8 2.900.30 6-R(0.20) 2-(0.80) 2-1.350.20 [Type EFOLM]*****16.0 to 20.0, 30.0 to 50.0 MHz [Type EFOLM] Oscillating Frequency (3.90) Terminal Electrodes 1.6 1.6 4.6 1.20 max. Serial No. (3.10) 3.60+0.30 -0.20 4.40 +0.50 -0.20 2-0.7 to 1.0 6-R(0.20) 2-(0.80) 2-1.600.20 Test Circuits Diagram For Oscillation Circuit For Loop Gain +5 V +5 V 14 13 11 9 14 13 11 9 Frequency 1 Ceramic Resonator 2 3 4 5 7 1 0.01 IN 1 M 3 2 1 M V1 Frequency Counter T.G. Output =-20 dBm 4 5 IC 7 Ceramic Resonator G=20 log (V0/V1) OUT PD4069UBC, TC4069UBP or similar PD74HCU, TC74HCU04AP or similar 2.00 to 8.39 MHz 8.40 to 50.0 MHz V0 FET probe 10 M min. 2 pF max. Typical Characteristics ***** Temperature Characteristics 0.8 0.6 0.4 0.2 0.0 -0.2 -0.4 -0.6 -0.8 2.0 to 8.39 MHz 8.4 to 13 MHz -20 0 20 40 60 80 Temperature (C) Oscillation Frequency Drift(%) Type EFOPS 0.8 0.6 0.4 0.2 0.0 -0.2 -0.4 -0.6 -0.8 Oscillation Frequency Drift(%) Type EFOD 0.8 0.6 0.4 0.2 0.0 -0.2 -0.4 -0.6 -0.8 Oscillation Frequency Drift(%) Type EFOP -20 0 20 40 60 80 Temperature (C) 4.0 to 8.39 MHz 8.4 to 13 MHz -20 0 20 40 60 80 Temperature (C) Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. - EC173 - 00 Sep. 2008 Ceramic Resonators, Chip Type Typical Characteristics ***** Temperature Characteristics Type EFODM 2.0 to 8.39 MHz 8.4 to 13 MHz -20 0 20 40 60 80 Temperature (C) 0.8 0.6 0.4 0.2 0.0 -0.2 -0.4 -0.6 -0.8 Type EFOLM Oscillation Frequency Drift(%) 0.8 0.6 0.4 0.2 0.0 -0.2 -0.4 -0.6 -0.8 Oscillation Frequency Drift(%) Oscillation Frequency Drift(%) Type EFOPM -20 0 20 40 60 80 Temperature (C) 0.8 0.6 0.4 0.2 0.0 -0.2 -0.4 -0.6 -0.8 30 to 50 MHz 16 to 20 MHz -20 0 20 40 60 80 Temperature (C) Packaging Specifications Supplied in bulk or taped & reel packing style Standard Packing Quantity Type Embossed Taping EFOP, EFOPM 2500 pcs./reel EFOPS 2000 pcs./reel EFOD, EFODM, EFOLM 1000 pcs./reel Bulk 500 pcs./bag Dimensions for Reel in mm (not to scale) T [Type EFOP, EFOPM] E A B C D E 3305 80 min. 13.00.5 21.00.8 2.00.5 Dim. (mm) W T t r 16.4+2.0 0 22.4 max. 3 max. 1.0 B C Dim. (mm) [Type EFOPS, EFOD, EDODM, EFOLM] D r A W t Embossed Taping [Type EFOP, EFOPM] B C D E 60 min. 13.00.5 21.00.8 2.00.5 Dim. (mm) W T t r 12.4+2.0 0 18.4 max. 3 max. 1.0 [Type EFOPS] F E Feeding hole P0 P1 A B A Tape running direction W F D0 t2 E P1 Dim. (mm) 3.70.2 Dim. (mm) P2 P0 D 0 t1 t2 2.00.1 4.00.1 1.5+0.1 0 0.3 3.5 max. Chip pocket P2 B 7.80 W P0 P2 Chip Component t1 3.20 8.30.2 16.00.3 7.50.1 1.750.10 8.00.1 2.00 4.50 Chip pocket B A t2 A 1805 F E W t1 Feeding hole D0 Dim. (mm) P1 Tape running direction Chip Component A B W Dim. (mm) 2.60.2 Dim. (mm) P2 P0 D 0 2.00.1 4.00.1 1.5+0.1 0 F E P1 5.10.2 12.00.3 5.50.1 1.750.10 4.00.1 t1 t2 0.6 max. 3.0 max. [Type EFOD, EFODM, EFOLM] t1 Feeding hole D0 Chip pocket P0 Type EFOLM (Example) P2 Tape running direction Chip Component A t2 Dim. (mm) Dim. (mm) 4.40 B F E W 3.60 P1 A B 1 2 P2 2.00.1 P0 4.00.1 W F E Dim. (mm) P1 12.00.3 5.50.1 1.750.10 8.00.1 D 0 1.5 +0.1 0 t1 t2 0.6 max. 3.0 max. A B 1 2 6.00.2 Type EFOD 3.70.2 Type EFODM 3.40.2 4.60.2 Type EFOLM 4.10.2 4.90.2 Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. - EC174 - 00 Sep. 2008