F-210 MEC6-130-02-L-DV-A MEC6-160-02-L-DV-A-K (0,635mm) .025" MEC6-140-02-L-DV-A MEC6-DV SERIES VERTICAL MICRO EDGE CARD SOCKET SPECIFICATIONS Mates with (1,60mm) .062" thick card Mates with: (1,60mm) .062" thick cards Variety of lead counts For complete specifications and recommended PCB layouts see www.samtec.com?MEC6-DV Insulator Material: Black LCP Contact Material: Phosphor Bronze Plating: Au or Sn over 50" (1,27m) Ni Operating Temp Range: -55C to +125C Insertion Depth: (4,22mm) .166" to (5,66mm) .223" Current Rating: Testing Now! Voltage Rating: Testing Now! RoHS Compliant: Yes Processing: Max Processing Temp: 230C for 60 seconds, or 260C for 20 seconds 3x Lead-Free Solderable: Yes SMT Lead Coplanarity: (0,10mm) .004" max (10-50) (0,15mm) .006" max (60-70) APPLICATION SPECIFIC OPTION * Locking Clip Call Samtec. 0,635mm MEC6-DV 8,65mm Stack Height Single-Ended Signaling Differential Pair Signaling Rated @ -3dB Insertion Loss 7.5 GHz / 15 Gbps 7.0 GHz / 14 Gbps (0,635mm) .025" pitch Performance data for other stack heights and complete test data available at www.samtec.com?MEC6-DV or contact sig@samtec.com MEC6 1 POSITIONS PER ROW Alignment Pin PLATING OPTION 02 DV A OPTION -L -K = 10" (0,25m) Gold on contact, Matte Tin on tail = (5,50) .217" DIA Polyimide Pick & Place Pad 10, 20, 30, 40, 50, 60, 70 No. of Positions x (0,635) .025 + (7,94) .313 B -TR A = Tape & Reel POSITIONS PER ROW (3,81) .150 No. of Positions x (0,635) .025 + (4,77) .188 No. of Positions x (0,635) .025 (1,78) + (1,565) .062 .070 (22,96) (36,49) .904 1.437 60 (24,87) (42,84) .979 1.687 70 (28,68) (49,19) 1.129 1.937 (7,00) .276 01 (1,00) .039 (8,50) .335 Note: Other Gold plating options available. Contact Samtec. Note: Some sizes, styles and options are non-standard, non-returnable. (8,65) .341 (3,60) .142 (0,635) .025 No. of Positions x (0,635) .025 + (2,37) .094 (0,25) .010 (8,80) .346 WWW.SAMTEC.COM B 50 02 (4,40) .173 A (1,50) .059 (1,40) .055 DIA (1,40) .055 DIA -A