(0,635mm) .025"
MEC6-DV SERIES
Mates with (1,60mm)
.062" thick card
Variety of
lead counts
(0,635mm)
.025"
pitch
Alignment Pin
MEC6–140–02–L–DV–A
MEC6–130–02–L–DV–A
MEC6–160–02–L–DV–A–K
WWW.SAMTEC.COM
MEC6 POSITIONS
PER ROW
PLATING
OPTION
1
10, 20, 30, 40, 50, 60, 70
DV
F-210
Mates with:
(1,60mm) .062" thick cards
02 OPTION
01
02
(8,50)
.335
(3,60)
.142
(0,635) .025 (0,25)
.010
(8,80) .346
(8,65)
.341
(1,78)
.070
(7,00)
.276
(4,40)
.173
(1,50)
.059
(1,40)
.055
DIA
(1,40)
.055
DIA
(1,00)
.039
No. of Positions x (0,635) .025 + (4,77) .188
No. of Positions x (0,635) .025
+ (1,565) .062
No. of Positions x (0,635) .025
+ (2,37) .094
(3,81) .150
No. of Positions x (0,635) .025 + (7,94) .313
B
A
Note: Some sizes, styles and
options are non-standard,
non-returnable.
For complete specifi cations and
recommended PCB layouts see
www.samtec.com?MEC6-DV
Insulator Material:
Black LCP
Contact Material:
Phosphor Bronze
Plating:
Au or Sn over 50µ" (1,27µm) Ni
Operating Temp Range:
-55°C to +125°C
Insertion Depth:
(4,22mm) .166" to
(5,66mm) .223"
Current Rating:
Testing Now!
Voltage Rating:
Testing Now!
RoHS Compliant:
Ye s
Processing:
Max Processing Temp:
230°C for 60 seconds, or
260°C for 20 seconds 3x
Lead–Free Solderable:
Ye s
SMT Lead Coplanarity:
(0,10mm) .004" max (10-50)
(0,15mm) .006" max (60-70)
–A
POSITIONS
PER ROW
50
60
70
A
(22,96)
.904
(24,87)
.979
(28,68)
1.129
B
(36,49)
1.437
(42,84)
1.687
(49,19)
1.937
A
–K
= (5,50) .217" DIA
Polyimide Pick &
Place Pad
–TR
= Tape & Reel
APPLICATION
SPECIFIC OPTION
• Locking Clip
Call Samtec.
SPECIFICATIONS
–L
= 10µ" (0,25µm) Gold on contact,
Matte Tin on tail
Note: Other Gold plating
options available.
Contact Samtec.
0,635mm MEC6-DV Rated @ -3dB Insertion Loss
8,65mm Stack Height
Single-Ended Signaling 7.5 GHz / 15 Gbps
Differential Pair Signaling 7.0 GHz / 14 Gbps
Performance data for other stack heights and complete
test data available at www.samtec.com?MEC6-DV
or contact sig@samtec.com
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