UPC2771TB
FEATURES
• HIGH GAIN: 21 dB at 900 to 1500 MHz Typical
• HIGH OUTPUT POWER: PSAT = +12.5 dBm at 900 MHz
+11 dBm at 1500 MHz
• LOW BIAS VOLTAGE: 3.0 V Typical, 2.7 V Minimum
• SUPER SMALL PACKAGE: SOT-363
• TAPE AND REEL PACKAGING OPTION AVAILABLE
The UPC2771TB is a Silicon Monolithic integrated circuit
which is manufactured using the NESAT™ III process. The
NESAT III process produces transistors with fT approaching 20
GHz. The UPC2771TB is pin compatible and has comparable
performance as the larger UPC2771T, so it is suitable for use
as a replacement to help reduce system size. The IC is housed
in a 6 pin super minimold or SOT-363 package. Operating on
a 3 volt supply, this IC is ideally suited for hand-held, portable
designs.
NEC's stringent quality assurance and test procedures ensure
the highest reliability and performance.
ELECTRICAL CHARACTERISTICS (TA = 25°C, ZL = ZS = 50 Ω, VCC = 3.0 V)
0.1 0.3 1.0 3.0
24
22
20
18
16
14
T
A
= -40˚ C
T
A
= +25˚ C T
A
= +85˚ C
V
CC
= 3.0 V
+85˚ C
+25˚ C
-40˚ C
GAIN vs. FREQUENCY AND TEMPERATURE
Frequency, f (GHz)
Gain, GS (dB)
PART NUMBER UPC2771TB
PACKAGE OUTLINE S06
SYMBOLS PARAMETERS AND CONDITIONS UNITS MIN TYP MAX
ICC Circuit Current (no signal) mA 36 45
GSSmall Signal Gain, f = 900 MHz dB 19 21 24
f = 1500 MHz dB 18 21 24
fUUpper Limit Operating Frequency (The gain at fU is 3 dB down from the gain at 100 MHz) GHz 1.8 2.2
P1dB 1 dB Compressed Output Power, f = 900 MHz dBm +9 +11.5
f = 1500 MHz dBm +7 +9.5
PSAT Saturated Output Power, f = 900 MHz dBm +12.5
f = 1500 MHz dBm +11
NF Noise Figure, f = 900 MHz dB 6 7.5
f = 1500 MHz dB 6 7.5
RLIN Input Return Loss, f = 900 MHz dB 10 14
f = 1500 MHz dB 10 14
RLOUT Output Return Loss, f = 900 MHz dB 6.5 9.0
f = 1500 MHz dB 5.5 8.5
ISOL Isolation, f = 900 MHz dB 25 30
f = 1500 MHz dB 25 30
OIP3 SSB OutputThird Order Intercept Point f = 900, 902 MHz, POUT = +4 dBm dBm +13
f = 1500, 1502 MHz, POUT = +4 dBm dBm +10
PADJ1 Adjacent Channel Power 1, f = 900 mHz, π/4 QPSK wave1, POUT = +7 dBm
∆f = ± 50 kHz dBc -61
∆f = ± 100 kHz dBc -72
PADJ2 Adjacent Channel Power 2, f = 1.5 GHz, π/4 QPSK wave1, POUT = +7 dBm
∆f = ± 50 kHz dBc
∆f = ± 100 kHz dBc -59
-71
Note:
1.π/4 QPSK modulated wave input, data rate 42 kbps, Filter roll off α = 0.5
DESCRIPTION
BIPOLAR ANALOG INTEGRATED CIRCUIT
3 V, SUPER MINIMOLD
MEDIUM POWER SI MMIC AMPLIFIER
PHASE-OUT
CIRCUIT CURRENT vs. VOLTAGE
0.1 0.3 1.0 3.0
24
22
20
18
16
14
12
10
8
6
VCC = 2.7 V
VCC = 3.0 V
VCC = 3.3 V
NF
GS
VCC = 2.7V VCC = 3.0V VCC = 3.3V
VCC = 3.3V VCC = 3.0 V
VCC = 2.7 V
7
5
3
Supply Voltage, VCC (V)
Circuit Current, ICC (mA)
CIRCUIT CURRENT vs. TEMPERATURE
-60 -40 -20 0 20 40 60 80 100
50
40
30
20
10
0
Circuit Current, ICC (mA)
Temperature (°C)
Frequency, f (GHz) Frequency, f (GHz)
Gain, GS (dB)
Return Loss (dB)
Noise Figure, NF (dB)
GAIN AND NOISE FIGURE
vs. FREQUENCY AND VOLTAGE
0.1 0.3 1.0 3.0
0
-10
-20
-30
-40
V
CC
= 3.0V
RL
out
RL
in
INPUT RETURN LOSS AND
OUTPUT RETURN LOSS vs. FREQUENCY
TYPICAL PERFORMANCE CURVES (TA = 25 °C)
UPC2771TB
ABSOLUTE MAXIMUM RATINGS1 (TA = 25°C)
SYMBOLS PARAMETERS UNITS RATINGS
VCC Supply Voltage V 3.6
ICC Total Supply Current mA 77.7
PIN Input Power dBm +13
PTTotal Power Dissipation2mW 270
TOP Operating Temperature °C -40 to +85
TSTG Storage Temperature °C -55 to +150
Notes:
1. Operation in excess of any one of these parameters may result
in permanent damage.
2. Mounted on a 50 X 50 X 1.6 mm epoxy glass PWB (TA = 85°C).
RECOMMENDED
OPERATING CONDITIONS
SYMBOLS PARAMETERS UNITS MIN TYP MAX
VCC Supply Voltage V 2.7 3 3.3
TOP Operating Temperature °C -40 +25 +85
TEST CIRCUIT
1000 pF V
CC
50 ΩOUT
IN
L=1000 nH
2, 3, 5
1
6
4
50 Ω
1000 pF1000 pF
0 1 2 3 4
50
40
30
20
10
0
PHASE-OUT
TYPICAL PERFORMANCE CURVES (TA = 25°)
0.1 0.3 1.0 3.0
17
15
13
11
9
7
5
VCC = 3.0 V
Pin = -3 dBm
VCC = 3.3 V
VCC = 2.7 V
SATURATED OUTPUT POWER vs.
FREQUENCY AND TEMPERATURE
Saturated Output Power, PO(SAT), (dBm)
Frequency, f (GHz) Frequency, f (GHz)
Saturated Output Power, PO(SAT), (dBm)
SATURATED OUTPUT POWER vs.
FREQUENCY AND VOLTAGE
0.1 0.3 1.0 3.0
0
-10
-20
-30
-40
-50
V
CC
= 3.0V
Frequency, f (GHz)
Isolation, ISOL (dB)
ISOLATION vs. FREQUENCY
Output Power, POUT (dBm)
-25 -20 -15 -10 -5 0
15
10
5
0
-5
f = 900 MHz
V
CC
= 3.0 V
V
CC
= 3.3 V
V
CC
= 2.7 V
OUTPUT POWER vs.
INPUT POWER AND VOLTAGE
Input Power, PIN (dBm)
0.1 0.3 1.0 3.0
17
15
11
9
7
5
13
Pi
n
= -3 dBm
T
A
= +25˚C
T
A
= +85˚C
T
A
= -40˚C
UPC2771TB
PHASE-OUT
OUTLINE DIMENSIONS (Units in mm)
UPC2771TB
PACKAGE OUTLINE S06
LEAD CONNECTIONS
2
1
4
5
6
2
1
4
5
6
33
C2H
1. INPUT
2. GND
3. GND
4. OUTPUT
5. GND
6. VCC
(Top View) (Bottom View)
PART NUMBER QTY
UPC2771TB-E3-A 3K/Reel
ORDERING INFORMATION
Note: Embossed Tape, 8 mm wide. Pins 1, 2 and 3 face perforated
side of tape.
+0.1
-0
DOT ON
BACK SIDE
+0.1
-0.5
0~0.1
0.2
0.15
1
2
34
5
6
0.65
1.3
2.0±0.2
0.65
2.1±0.1
1.25±0.1
0.9 ± 0.1
0.7
Pin Pin Applied Description Internal
No. Name Voltage Equivalent
(V) Circuit
1 Input — Signal input pin. An internal matching circuit, configured
with resistors, enables 50 Ω connection over a wide
bandwidth. A multi-feedback circuit is designed to cancel
the deviations of hFE and resistance. This pin must be
coupled to the signal source with a blocking capacitor.
4 Output Signal output pin. Connect an inductor between this pin
and VCC to supply current to the internal output transistors.
6 VCC 2.7 to 3.3 Power supply pin. This pin should be externally equipped
with a bypass capacitor to minimize ground impedance.
2 GND 0 Ground pins. These pins should be connected to system
ground with minimum inductance. Ground pattern on the
board should be formed as wide as possible. All the ground
pins must be connected together with wide ground pattern
to minimize impedance difference.
1
325
4
6
PIN DESCRIPTION
UPC2771TB
PHASE-OUT
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PHASE-OUT
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Authorized Distributor
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UPC2771TB-A UPC2771TB-EVAL