July 2016
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This is information on a product in full production.
www.st.com
BALF-CC26-05D3
50 Ω nominal input / conjugate match balun CC2610, CC2620,
CC2630, CC2640, CC2650 MHz, with integrated harmonic filter
Datasheet - production data
Features
2.45 GHz balun with integrated matching
network
Matching optimized for CC26 series 5×5
external differential
Low insertion loss
Low amplitude imbalance
Low phase imbalance
Coated Flip-Chip on glass
Small footprint < 1.5 mm²
Benefits
Very low profile
High RF performance
PCB space saving versus discrete solution
RF BOM and size reduction
Efficient manufacturability
Description
STMicroelectronics' BALF-CC26-05D3 is an
ultra-miniature balun, integrating both matching
network and harmonics filter.
Matching impedance has been customized for
the TI CC26xx series 5x5 SimpleLink™
multistandard wireless MCU.
The device uses STMicroelectronics' IPD
technology on a non-conductive glass substrate,
which optimizes RF performance.
Figure 1: Pin configuration
Figure 2: Block diagram
Pin 2_RFN
Pin 1_RFP
Pin 3/4_RX/TX
Not necessary if internal bias is used
BALF-CC26-05
Antenna (50 Ω)
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1 Characteristics
Table 1: Absolute maximum ratings (limiting values)
Symbol
Parameter
Value
Unit
PIN
Input power RFIN
20
dBm
VESD
ESD ratings MIL STD883C (HBM: C = 100 pF, R = 1.5 Ω,
air discharge)
900
V
ESD ratings machine model (MM: C = 200 pF, R = 25 W, L = 500 nH)
100
TOP
Operating temperature
-40 to +105
°C
Table 2: Electrical characteristics (Tamb = 25 °C)
Symbol
Parameter
Value
Unit
Min.
Typ.
Max.
ZOUT
Nominal differential output impedance
Match to 5x5 CC26xx series
Ω
ZIN
Nominal input impedance
50
Ω
f
Frequency range (bandwidth)
2400
2500
MHz
IL
Insertion loss in bandwidth
1.2
1.5
dB
RL SE
Single Ended Return loss in bandwidth
-27
-18
dB
RL DIFF
Differential Return loss in bandwidth
-23
-20
dB
Phase_imbal
Phase imbalance
-16
16
°
Ampl_imbal
Amplitude imbalance
-0.3
0.3
dB
H2
Second harmonic rejection
-18
-17
H3
Third harmonic rejection
-37
-35
BALF-CC26-05D3
Characteristics
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1.2 RF measurement
Figure 3: Transmission
Figure 4: Insertion loss
Figure 5: Return loss SE
Figure 6: Return loss DIFF
Figure 7: Amplitude imbalance
Figure 8: Phase imbalance
(dB)
-10
0
f (GHz)
01 2 3
-20
-40
45 6 78
-30
(dB)
-0.8
-0.6
-0.4
0.0
f (GHz)
2.0 2.1 2.2 2.3
-1.0
-1.2
-0.2
-2.0
2.4 2.5 2.6 2.7 2.8
-1.4
-1.6
-1.8
2.9
(dB)
-20
-15
-10
0
f (GHz)
01 2 3
-25
-30
-5
-35
45 6 78
(dB)
-5
0
f (GHz)
01 2 3
-10
-25
45 6 78
-15
-20
(dB)
4
-1
0
1
3
f (GHz)
2.3 2.4 2.5 2.6
-2
-3
2
-4
(deg)
20
-5
0
5
15
f (GHz)
2.3 2.4 2.5 2.6
-10
-15
10
-20
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2 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
2.1 Flip-Chip CSPG 0.4 package information
Figure 9: Flip-Chip CSPG 0.4 package outline
Figure 10: PCB layout recommendation
224 µm 224 µm
433 µm 604 µm 630 +/- 60 µm
260 µm
250 µm
250 µm
260 µm
SE
VCC
GND
DIFF2
DIFF1
Bump side view
500µm
1300 µm
160 µm
160 µm
200 µm
200 µm 130 µm
125 µm
100 µm
100 µm
Differential line = 100 Ω
Single ended line = 50 Ω
100 µm
100 µm
Vcc access = 50 Ω
130 µm
125 µm
BALF-CC26-05D3
Package information
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Figure 11: Footprint -non solder mask defined
Figure 12: Footprint - solder mask defined
2.2 Flip-chip CSPG 0.4 packing information
Figure 13: Flip-chip CSPG 0.4 tape outline
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Figure 14: Flip-chip CSPG 0.4 tape outline
BALF-CC26-05D3
Ordering information
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3 Ordering information
Table 3: Ordering information
Order code
Marking
Package
Weight
Base qty.
Delivery mode
BALF-CC26-05D3
TH
Flip-Chip CSPG 0.4
1.724 mg
5000
Tape and reel (7")
4 Revision history
Table 4: Document revision history
Date
Revision
Changes
27-Jul-2016
1
First issue.
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