MA4SPS552-W - Tyco Electronics

Features

nSurface Mount Device

nNo Wirebonds Required

nRugged Silicon-Glass Construction

nSilicon Nitride Passivation

nPolymer Scratch Protection

nLow Parasitic Capacitance and Inductance

nHigh Power Handling (Efficient Heatsinking)

Description

This device is a silicon-glass PIN diode chip fabricated with

M/A-COM’s patented HMIC process. This device features

two silicon pedestals embedded in a low loss glass. The diode

is formed on the top of one pedestal and connections to the

backside of the device are facilitated by making the pedestal

sidewalls conductive. Selective backside metalization is

applied producing a surface mount device. The topside is fully

encapsulated with silicon nitride and has an additional polymer

layer for scratch protection. These protective coatings prevent

damage to the junction and the anode air-bridge during

handling and assembly.

Applications

These packageless devices are suitable for usage in moderate

incident power (5 W C.W.) or higher incident peak power

(200 W) series, shunt, or series-shunt switches. Small parasitic

inductance, 0.7 nH, and excellent RC time constant, 0.20 pS,

make the devices ideal for wireless TR switch and accessory

switch circuits, where higher P1dB and IP3 values are required.

These diodes can also be used in π, T, tapered resistance, and

switched-pad attenuator control circuits for 50Ω or 75Ω

systems.

Surface Mount Monolithic

PIN Diode Chip

MA4SPS552

Case Style ODS-1281

Parameter Absolute Maximum

Forward Current 100 mA

Reverse Voltage -200 V

Operating Temperature -65 °C to +150 °C

Storage Temperature -65 °C to +150 °C

Dissipated RF & DC Power 1 W

Mounting Temperature +235 °C for 10 seconds

Junction Temperature +175 °C

Absolute Maximum Ratings1

@ TA = +25°C (unless otherwise specified)

1. Exceeding these limits may cause permanent damage.

1. Backside metal: 0.1 micron thk.

2. Hatched areas indicate bond pads.

Dim Inches Millimeters

Min. Max. Min. Max.

A 0.0207 0.0226 0.525 0.575

B 0.0108 0.0128 0.275 0.325

C 0.0040 0.0080 0.102 0.203

D 0.0069 0.0089 0.175 0.225

E 0.0018 0.0037 0.045 0.095

F 0.0061 0.0081 0.155 0.205

G 0.0069 0.0089 0.175 0.225

V 1.00

Surface Mount PIN Diode Chip MA4SPS552 SurMount TM Series

M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s)

or information contained herein without notice.

Visit www.macom.com for additional data sheets and product information.

n North America: Tel. (800) 366-2266

n Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298

n Europe: Tel. +44 (1908) 574 200, Fax+44 (1908) 574 300

V 1.00

Electrical Specifications: @ +25 °C

Symbol Conditions Units Min. Typ. Max.

CT -40 V, 1 MHz pF 0.08 0.14

CT -40 V, 1 GHz pF 0.06

RS 100 mA, 100 MHz Ω 1.7

RS 20 mA, 100 MHz Ω 2.4

VF 100 mA V 1.00 1.25

VF 10 mA V 0.86 1.00

VR -10 µA V l -200 l l -275 l

IR -40 V nA l -10 l

RθJL Steady State °C/W 30

TL (50% - 90% V)

+10 mA / -6 mA µs 2.5

Parameter

Total

Capacitance

Total

Capacitance

Series

Resistance

Series

Resistance

Forward Voltage

Reverse Voltage

Reverse Leakage

Current

Thermal

Resistance

Minority Carrier

Lifetime

Handling Procedures

All semiconductor chips should be handled with care to avoid

damage or contamination from perspiration and skin oils.

The use of plastic tipped tweezers or vacuum pickups is

strongly recommended for individual components. Bulk

handling should insure that abrasion and mechanical shock

are minimized.

Bonding Techniques

Attachment to a circuit board is made simple through the use

of surface mount technology. Mounting pads are

conveniently located on the bottom surface of these diodes

and are removed from the active junction locations. These

devices are well suited for solder attachment onto hard and

soft substrates. The use of 80/20 Au/Sn and 60/40 Sn/Pb

solder is recommended, with an equal temperature profile

across the contacts. Conductive epoxy paste for attachment

may also be used.

When soldering these devices to a hard substrate, hot gas

die bonding is preferred. We recommend utilizing a

vacuum tip and a force of 60 to 100 grams applied

normal to the top surface of the device. When soldering

to soft substrates, it is recommended to use a lead-tin

interface at the circuit board mounting pads. Position

the die so that its mounting pads are aligned with the

circuit board’s mounting pads and reflow the solder by

heating the circuit trace near the mounting pad while

applying 60 to 100 grams of force perpendicular to the

top surface of the die.

Since the HMIC™ glass is transparent, the edges of the

mounting pads closest to each other can be visually

inspected through the die after attach is completed.

Surface Mount PIN Diode Chip MA4SPS552 SurMount TM Series

M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s)

or information contained herein without notice.

Visit www.macom.com for additional data sheets and product information.

n North America: Tel. (800) 366-2266

n Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298

n Europe: Tel. +44 (1908) 574 200, Fax+44 (1908) 574 300

V 1.00

Capacitance vs Frequency

0.04

0.06

0.08

0.10

0.12

0.14

0.16

0.18

0.20

0.00 0.10 0.20 0.30 0.40 0.50 0.60 0.70 0.80 0.90 1.00

Frequency ( GHz )

-5V

-40V

Capacitance vs Voltage

0.04

0.06

0.08

0.10

0.12

0.14

0.16

0.18

0.20

0.0 5.0 10.0 15.0 20.0 25.0 30.0 35.0 40.0

Voltage ( V )

100 MHz

1 GHz

Surface Mount PIN Diode Chip MA4SPS552 SurMount TM Series

M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s)

or information contained herein without notice.

Visit www.macom.com for additional data sheets and product information.

n North America: Tel. (800) 366-2266

n Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298

n Europe: Tel. +44 (1908) 574 200, Fax+44 (1908) 574 300

V 1.00

1.0

10.0

100.0

0.01 0.10 1.00 10.00 100.00

I ( mA )

100MHz

1GHz

Rs vs I

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

00.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1

Frequency (GHz)

10mA

20mA

50mA

100mA

Rs vs Frequency

Surface Mount PIN Diode Chip MA4SPS552 SurMount TM Series

M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s)

or information contained herein without notice.

Visit www.macom.com for additional data sheets and product information.

n North America: Tel. (800) 366-2266

n Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298

n Europe: Tel. +44 (1908) 574 200, Fax+44 (1908) 574 300

V 1.00

1.0E+03

1.0E+04

1.0E+05

1.0E+06

-40.0-35.0-30.0-25.0-20.0-15.0-10.0-5.00.0

Reverse Bias ( -V )

100MHz

1GHz

Parallel Resistance vs V

Surface Mount PIN Diode Chip MA4SPS552 SurMount TM Series

M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s)

or information contained herein without notice.

Visit www.macom.com for additional data sheets and product information.

n North America: Tel. (800) 366-2266

n Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298

n Europe: Tel. +44 (1908) 574 200, Fax+44 (1908) 574 300

V 1.00

SURMOUNT PIN Diode Model

Rp Cp

Ls = 0.7 nH

Rvia = 0.05 Ω Rvia = 0.05 Ω

Rs = Rp + 2 * Rvia

Ordering Information

Part Number Package

MA4SPS552 Die in Carrier

MA4SPS552-T Tape/Reel

MA4SPS552-W Wafer on Frame