Features
nSurface Mount Device
nNo Wirebonds Required
nRugged Silicon-Glass Construction
nSilicon Nitride Passivation
nPolymer Scratch Protection
nLow Parasitic Capacitance and Inductance
nHigh Power Handling (Efficient Heatsinking)
Description
This device is a silicon-glass PIN diode chip fabricated with
M/A-COM’s patented HMIC process. This device features
two silicon pedestals embedded in a low loss glass. The diode
is formed on the top of one pedestal and connections to the
backside of the device are facilitated by making the pedestal
sidewalls conductive. Selective backside metalization is
applied producing a surface mount device. The topside is fully
encapsulated with silicon nitride and has an additional polymer
layer for scratch protection. These protective coatings prevent
damage to the junction and the anode air-bridge during
handling and assembly.
Applications
These packageless devices are suitable for usage in moderate
incident power (5 W C.W.) or higher incident peak power
(200 W) series, shunt, or series-shunt switches. Small parasitic
inductance, 0.7 nH, and excellent RC time constant, 0.20 pS,
make the devices ideal for wireless TR switch and accessory
switch circuits, where higher P1dB and IP3 values are required.
These diodes can also be used in π, T, tapered resistance, and
switched-pad attenuator control circuits for 50 or 75
systems.
Surface Mount Monolithic
PIN Diode Chip
MA4SPS552
Case Style ODS-1281
Parameter Absolute Maximum
Forward Current 100 mA
Reverse Voltage -200 V
Operating Temperature -65 °C to +150 °C
Storage Temperature -65 °C to +150 °C
Dissipated RF & DC Power 1 W
Mounting Temperature +235 °C for 10 seconds
Junction Temperature +175 °C
Absolute Maximum Ratings1
@ TA = +25°C (unless otherwise specified)
1. Exceeding these limits may cause permanent damage.
1. Backside metal: 0.1 micron thk.
2. Hatched areas indicate bond pads.
Dim Inches Millimeters
Min. Max. Min. Max.
A 0.0207 0.0226 0.525 0.575
B 0.0108 0.0128 0.275 0.325
C 0.0040 0.0080 0.102 0.203
D 0.0069 0.0089 0.175 0.225
E 0.0018 0.0037 0.045 0.095
F 0.0061 0.0081 0.155 0.205
G 0.0069 0.0089 0.175 0.225
V 1.00
A
B
C
D
E
F
G
Surface Mount PIN Diode Chip MA4SPS552 SurMount TM Series
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s)
or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
n North America: Tel. (800) 366-2266
n Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298
n Europe: Tel. +44 (1908) 574 200, Fax+44 (1908) 574 300
2
V 1.00
Electrical Specifications: @ +25 °C
Symbol Conditions Units Min. Typ. Max.
CT -40 V, 1 MHz pF 0.08 0.14
CT -40 V, 1 GHz pF 0.06
RS 100 mA, 100 MHz 1.7
RS 20 mA, 100 MHz 2.4
VF 100 mA V 1.00 1.25
VF 10 mA V 0.86 1.00
VR -10 µA V l -200 l l -275 l
IR -40 V nA l -10 l
RθJL Steady State °C/W 30
TL (50% - 90% V)
+10 mA / -6 mA µs 2.5
Parameter
Total
Capacitance
Total
Capacitance
Series
Resistance
Series
Resistance
Forward Voltage
Forward Voltage
Reverse Voltage
Reverse Leakage
Current
Thermal
Resistance
Minority Carrier
Lifetime
Handling Procedures
All semiconductor chips should be handled with care to avoid
damage or contamination from perspiration and skin oils.
The use of plastic tipped tweezers or vacuum pickups is
strongly recommended for individual components. Bulk
handling should insure that abrasion and mechanical shock
are minimized.
Bonding Techniques
Attachment to a circuit board is made simple through the use
of surface mount technology. Mounting pads are
conveniently located on the bottom surface of these diodes
and are removed from the active junction locations. These
devices are well suited for solder attachment onto hard and
soft substrates. The use of 80/20 Au/Sn and 60/40 Sn/Pb
solder is recommended, with an equal temperature profile
across the contacts. Conductive epoxy paste for attachment
may also be used.
When soldering these devices to a hard substrate, hot gas
die bonding is preferred. We recommend utilizing a
vacuum tip and a force of 60 to 100 grams applied
normal to the top surface of the device. When soldering
to soft substrates, it is recommended to use a lead-tin
interface at the circuit board mounting pads. Position
the die so that its mounting pads are aligned with the
circuit board’s mounting pads and reflow the solder by
heating the circuit trace near the mounting pad while
applying 60 to 100 grams of force perpendicular to the
top surface of the die.
Since the HMIC™ glass is transparent, the edges of the
mounting pads closest to each other can be visually
inspected through the die after attach is completed.
Surface Mount PIN Diode Chip MA4SPS552 SurMount TM Series
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s)
or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
n North America: Tel. (800) 366-2266
n Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298
n Europe: Tel. +44 (1908) 574 200, Fax+44 (1908) 574 300
3
V 1.00
Capacitance vs Frequency
0.04
0.06
0.08
0.10
0.12
0.14
0.16
0.18
0.20
0.00 0.10 0.20 0.30 0.40 0.50 0.60 0.70 0.80 0.90 1.00
Frequency ( GHz )
0V
-5V
-40V
Capacitance vs Voltage
0.04
0.06
0.08
0.10
0.12
0.14
0.16
0.18
0.20
0.0 5.0 10.0 15.0 20.0 25.0 30.0 35.0 40.0
Voltage ( V )
100 MHz
1 GHz
Surface Mount PIN Diode Chip MA4SPS552 SurMount TM Series
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s)
or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
n North America: Tel. (800) 366-2266
n Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298
n Europe: Tel. +44 (1908) 574 200, Fax+44 (1908) 574 300
4
V 1.00
1.0
10.0
100.0
0.01 0.10 1.00 10.00 100.00
I ( mA )
100MHz
1GHz
Rs vs I
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
00.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1
Frequency (GHz)
10mA
20mA
50mA
100mA
Rs vs Frequency
Surface Mount PIN Diode Chip MA4SPS552 SurMount TM Series
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s)
or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
n North America: Tel. (800) 366-2266
n Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298
n Europe: Tel. +44 (1908) 574 200, Fax+44 (1908) 574 300
5
V 1.00
1.0E+03
1.0E+04
1.0E+05
1.0E+06
-40.0-35.0-30.0-25.0-20.0-15.0-10.0-5.00.0
Reverse Bias ( -V )
100MHz
1GHz
Parallel Resistance vs V
Surface Mount PIN Diode Chip MA4SPS552 SurMount TM Series
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s)
or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
n North America: Tel. (800) 366-2266
n Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298
n Europe: Tel. +44 (1908) 574 200, Fax+44 (1908) 574 300
6
V 1.00
SURMOUNT PIN Diode Model
Rp Cp
Ls = 0.7 nH
Rvia = 0.05 Rvia = 0.05
_
+
Rs = Rp + 2 * Rvia
Ordering Information
Part Number Package
MA4SPS552 Die in Carrier
MA4SPS552-T Tape/Reel
MA4SPS552-W Wafer on Frame