www.bergquistcompany.com
All statements, technical information and recommendations herein are based on tests we believe to be reliable, and
THE FOLLOWING IS MADE IN LIEU OF ALL WARRANTIES, EXPRESSED OR IMPLIED,INCLUDING THE IMPLIED
WARRANTIES OF MARKETABILITY AND FITNESS FOR PURPOSE.Sellers’ and manufacturer s’ only obligation shall be to
replace such quantity of the product proved to be defective. Before using, user shall determine the suitability of the product
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MANUFACTURER SHALL BE LIABLE EITHER IN TORT OR IN CONTRACT FOR ANY LOSS OR DAMAGE,DIRECT,
INCIDENTAL, OR CONSEQUENTIAL,INCLUDING LOSS OF PROFITS OR REVENUE ARISING OUT OF THE USE OR
THE INABILITY TO USE A PRODUCT. No statement, purchase order or recommendations by seller or purchaser not
contained herein shall have any force or effect unless in an agreement signed by the officers of the seller and manufacturer.
PDS_GF_2000_12.08
The Bergquist Company -
North American Headquarters
18930 West 78th Street
Chanhassen, MN 55317
Phone: 800-347-4572
Fax: 952-835-0430
The Bergquist Company -
European Headquarters
Bramenber g 9a, 3755 BT Eemnes
Netherlands
Phone: 31-35-5380684
Fax: 31-35-5380295
The Bergquist Company - Asia
Room 15,8/F W ah Wai Industrial Centre
No.38-40,Au Pui Wan Street
Fotan, Shatin, N.T. Hong Kong
Ph: 852.2690.9296
Fax: 852.2690.2344
Gap Filler2000 (Two-Part)
Ther mally Conductive, Liquid Gap Filling Mater ial
Gap Pad ®: U.S.Patent 5,679,457 and others
TYPICAL PROPERTIES OF GAP FILLER 2000
PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD
Color / Part A Pink Pink Visual
Color / Part B White White —
Viscosity as Mixed (cps)(1) 300,000 300,000 ASTM D2196
Density (g/cc) 2.9 2.9 ASTM D792
Mix Ratio 1:1 1:1 —
Shelf Life @ 25°C (months) 6 6 —
PR OPER TY AS CURED
Color Pink Pink Visual
Hardness (Shore 00)(2) 70 70 ASTM D2240
Heat Capacity (J/g-K) 1.0 1.0 ASTM D1269
Continuous Use Temp (°F) / (°C) -76 to 392 -60 to 200 —
ELECTRICAL AS CURED
Dielectric Strength (V/ml) 500 500 ASTM D149
Dielectric Constant (1000 Hz) 7 7 ASTM D150
Volume Resistivity (Ohm-meter) 1011 1011 ASTM D257
Flame Rating V-O V-O U.L. 94
THERMAL AS CURED
Thermal Conductivity (W/m-K) 2.0 2.0 ASTM D5470
CURE SCHEDULE SCHEDULE 1 SCHEDULE 2 SCHEDULE 3
Pot Life @ 25°C (3) 15 min 60 min 600 min (10 hr)
Cure @ 25°C(4) 1-2 hours 3-4 hour s 3 days
Cure @ 100°C (4) 5 min 15 min 1 hour
1) Brookfield RV, Heli-Path,Spindle TF @ 20 rpm, 25°C.
2) Thirty second delay value Shore 00 hardness scale .
3) Time for viscosity to double.
4) Cure schedule (rheometer - time to read 90% cure)
Features and Benefits
• Thermal conductivity: 2.0 W/m-K
• Ultra-confor ming, designed for fragile and
low-stress applications
• Ambient and acceler ated cure schedules
• 100% solids – no cure by-products
• Excellent low and high temperature
mechanical and chemical stability
Gap Filler 2000 is a high performance,thermally
conductive, liquid gap filling mater ial supplied
as a two-component, room or elevated
temperature curing system.The mater ial
provides a balance of cured material properties
and good compression set (memory).The
result is a soft,form-in-place elastomer ideal
for coupling “hot” electronic components
mounted on PC boards with an adjacent
metal case or heat sink.Before cure , it flows
under pressure like grease.After cure,it won't
pump from the interface as a result of thermal
cycling and is dry to the touch.
Unlike cured Gap Filling materials, the liquid
approach offers infinite thickness with little or no
stress during displacement and assembly.It also
eliminates the need for specific pad thickness
and die-cut shapes for individual applications.
Gap Filler 2000 is intended for use in thermal
interface applications when a strong structural
bond is not required.
Note: Resultant thickness is defined as the final gap
thickness of the application.
Typical Applications Include:
• Automotive electronics • Telecommunications
• Computer and per ipher als • Thermally conductive vibration dampening
• Between any heat-generating semiconductor and a heat sink
Configurations Available:
• Supplied in cartr idge or kit for m
Building a Part Number Standard Options
01 32465
300
250
200
150
50
0
Thickness vs. Thermal Resistance
Gap Filler 2000
Thermal Resistance (C-in2/W)
Resultant Thickness (mils)
Section A
Section B
Section C
Section D
Section E
NA = Selected standard option. If not selecting a standard
option, insert company name, drawing number, and
revision level.
GF2000 = Gap Filler 2000 Material
GF2000 00 60 10G NA
Note: To build a part number, visit our website at www.bergquistcompany.com.
00 = No spacer beads
07 = 0.007" spacer beads
Pot Life: 15 = 15 minutes, 60 = 60 minutes
600 = 600 minutes
Cartridges: 50cc = 50.0cc, 400cc = 400.0cc
Kits: 1200cc = 1200.0cc, or 10G = 10 gallon
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