TDA2270
TV VERTICALDEFLECTION OUTPUT CIRCUIT
September 1992
.DRIVES VERTICAL DEFLECTION WIND-
INGS DIRECTLY
.HIGHEFFICIENCY
.INTERNAL FLYBACKGENERATOR
.THERMAL PROTECTION
.ON-CHIP VOLTAGE REFERENCE
.HIGHOUTPUTCURRENT (2.2 Apeak)
.16-LEADPOWERDIP PLASTIC PACKAGE
DIP16
(Plastic package)
ORDER CODE : TDA2270
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
SUPPLY VOLTAGE
FLYBACK
GENERATOR
NC
GND
OUTPUT
OUTPUT STAGE
SUPPLY
NC
GND
NON-INVERTING
INPUT
INVERTING INPUT
NC
GND
REFERENCE
VOLTAGE
GND
GND
NC
2270-01.EPS
PIN CONNECTIONS
DESCRIPTION
The TDA2270is ahighefficiencymonolithicoutput
stage for vertical deflection circuits in TVs and
monitors. Driving the vertical windings directly, the
device contains a power amplifier, flyback gener-
ator, voltagereference and thermal protectioncir-
cuit.
The TDA2270 is supplied in a 16-pin DIP with the
four center pins connected together and used for
heatsinking.
281
15
16 7
YOKE
+VS
FLYBACK
GENERATOR
THERMAL
PROTECTION
POWER
AMP.
REFERENCE
VOLTAGE
945
12 13 10
2270-02.EPS
BLOCK DIAGRAM
1/7
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
VsSupply Voltage (pin 1) 35 V
V7,V
8Flyback Peak Voltage 60 V
V2Voltage at Pin2 + Vs
V15,V
16 Amplifier Input Voltage + Vs, – 0.5 V
IoOutput Peak Current (non repetitive, t = 2 ms) 2 A
IoOutput Peak Current at f = 50 Hz, t ≤10 µs 2.2 A
IoOutput Peak Current at f = 50 Hz, t > 10 µs 1.2 A
I2Pin 2 DC Current at V7<V
150 mA
I2Pin 2 Peak to Peak Flyback Current at f = 50 Hz, tfly ≤1.5 ms 2 A
Ptot Total Power Dissipation at Tpins ≤90 °C
Tamb =70°C4.3
1W
W
Tstg,T
jStorage and Junction Temperature – 40 to 150 °C
2270-01.TBL
THERMAL DATA
Symbol Parameter Value Unit
Rth j–case Thermal Resistance Junction-case Max 14 °C/W
Rth j–amb Thermal Resistance Junction–ambient Max 80 °C/W
* Obtainedwith the GND pins soldered toprinted circuitwith minimized copper area.
2270-02.TBL
ELECTRICALCHARACTERISTICS
(refer to the test circuits, VS=35V, T
amb =25o
C unless otherwisespecified)
Symbol Parameter Test Conditions Min. Typ. Max. Unit Fig.
I1Pin 1 Quiescent Current I2=o,I
7=0,V
16 = 3 V 8 16 mA 1a
I8Pin 8 Quiescent Current I2=0,I
7=0,V
16 =3V 16 36 mA 1a
I
15 AmplifierInput Bias Current V15 = 1 V – 0.1 – 1 µA1a
I
16 AmplifierInput Bias Current V16 = 1 V – 0.1 – 1 µA1a
V
2L Pin 2 Saturation Voltage to GND I2=20mA 1 V 1c
V
7Quiescent Output Voltage Vs=35V,R
a=39kΩ
V
s=15V,R
a=13kΩ18
7.5 V
V1d
1d
V7L Output Saturation Voltage to GND I7= 0.7 A 0.7 1 V 1c
V7H Output Saturation Voltage to Supply – I7= 0.7 A 1.3 1.8 V 1b
V9Reference Voltage I9= 0 2.2 V 1a
∆V9
∆VS
Reference Voltage Drift versus Supply
Voltage Vs= 15 to 30 V 1 2 mV/V 1a
R9Reference Voltage Output Resistance 2.1 kΩ
TjJunction Temperature for Thermal Shut
Down 140 °C
2270-03.TBL
TDA2270
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Figure 1 : DCTest Circuits
2270-03.EPS
S1 :(a) I15 ;(b) I16,I
7and I8.
S2 :(a) I7and I8; (b) I16, (c) I15.
S3 :(a) I15,I
16,I
7
,I
8
,I
9and V9; (b) R9
Figure 1a : Measurementof I1;I
8;I
15 ;I
16 ;V
9;
∆V
9
/∆V
S;R
9
2270-04.EPS
Figure 1b : Measurementof V7H
2270-05.EPS
S1 : (a) V2L ; (b) V7L
Figure 1c : Measurementof V2L ;V
7L
2270-06.EPS
Figure 1d : Measurementof V7
TDA2270
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2270-07.EPS
Figure 2 : Application Circuit
2270-08.TIF
Figure 3 : PC Board and Component Layout (1 : 1 scale)
TDA2270
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COMPONENTS LIST FOR TYPICALAPPLICATIONS (refer to the fig. 2)
Component B/W TV
10 Ω/ 20 mH / 1 App 90°TVC
15 Ω/ 30 mH / 0.82 App Unit
RT1 10 10 kΩ
R1 10 12 kΩ
R2 5.6 5.6 kΩ
R3 15 18 kΩ
R4 6.8 5.6 kΩ
R5 1 1 Ω
R6 330 330 Ω
R7 1.5 1.5 Ω
D1 1N 4001 1N 4001 –
C1 0.1 0.1 µF
C2 el. 470/25 V 470/25 V µF
C3 el. 220/25 V 220/25 V µF
C4 0.22 0.22 µF
C5 el. 1000/25 V 1000/16 V µF
C6 el. 10/16 V 10/16 V µF
2270-04.TBL
TYPICAL PERFORMANCE
Parameter B/W TV
10 Ω/ 20 mH / 1 App 90°TVC
15 Ω/30mH Unit
Vs– SupplyVoltage 20 25 V
Is– Current 145 125 mA
tfly –Flyback Time 0.75 0.7 ms
*P
tot – Power Dissipation 1.8 2.05 W
*R
th c–a – Heatsink 14 12 °C/W
Tamb 60 60 °C
Tj max 130 130 °C
to20 20 ms
Vi2.5 2.5 Vpp
V7– Flyback Voltage 42 52 Vp
2270-05.TBL
TDA2270
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2270-09.EPS
Figure 4 : Example of P.C. Board Copper Area
which is Used as Heatsink
2270-10.EPS
Figure 5 : ExternalHeatsink Mounting Example
MOUNTING INSTRUCTIONS
The Rth j-amb of the TDA 2270 can be reduced by
soldering the GND pins to a suitable copper area
of the printed circuit board (fig. 4) or to an external
heatsink(fig. 5).
The diagramof figure6 shows the maximum dissi-
pable power Ptot and the Rth j-amb as a function of
the side”l” oftwoequalsquarecopperareashaving
a thicknessof 35 µ(1.4 mils).
During soldering the pins temperature must not
exceed260 °Cand the soldering time must not be
longer than12 seconds.
Theexternalheatsinkorprintedcircuit copperarea
must be connectedto electrical ground.
2270-11.EPS
Figure 6 : Maximum Dissipable Power and Junc-
tion to AmbientThermalResistance
versus Side ”l”
2270-12.EPS
Figure 7 : Maximum AllowablePower Dissipa-
tion versus AmbientTemperature
TDA2270
6/7
Information furnishedis believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility
for the consequences of use of such information nor for any infringement of patents or other rights of third partieswhich may result
from its use. No licence is granted by implication or otherwise under any patent or patentrights of SGS-THOMSON Microelectronics.
Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all
information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components inlife
support devices or systems without express written approval of SGS-THOMSON Microelectronics.
1994 SGS-THOMSON Microelectronics - All RightsReserved
Purchase of I2C Components of SGS-THOMSON Microelectronics, conveys a license under the Philips
I2C Patent. Rights to use these components in a I2C system, is granted provided that the system conformsto
the I2C Standard Specifications as defined by Philips.
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16
18
I
a1
L
Be
D
b
Z
e3
F
b1
E
9
PM-DIP16.EPS
PACKAGE MECHANICAL DATA
16 PINS- PLASTICDIP
Dimensions Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
a1 0.51 0.020
B 0.77 1.65 0.030 0.065
b 0.5 0.020
b1 0.25 0.010
D 20 0.787
E 8.5 0.335
e 2.54 0.100
e3 17.78 0.700
F 7.1 0.280
i 5.1 0.201
L 3.3 0.130
Z 1.27 0.050
DIP16.TBL
TDA2270
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